JP7199149B2 - Processing device, anomaly detection method and storage medium - Google Patents

Description

The disclosed embodiments relate to a processing device, an anomaly detection method, and a storage medium.

2. Description of the Related Art One of the steps of a semiconductor manufacturing process is a liquid processing step of processing a substrate such as a semiconductor wafer or a glass substrate by supplying a processing liquid to the substrate.

The liquid processing step is performed by arranging a nozzle connected to a processing liquid supply source through a supply path above the substrate and ejecting the processing liquid supplied from the processing liquid supply source from the nozzle. A valve is provided in the supply path, and the ejection state of the treatment liquid from the nozzle is switched by opening and closing the valve.

An air-operated valve that opens and closes a valve element by the pressure of air supplied from an air supply pipe may be used as the valve provided in the supply passage. The air operated valve can adjust the opening and closing speed of the valve body by adjusting the speed controller provided in the air supply pipe (see Patent Document 1).

Japanese Patent Application Laid-Open No. 2003-218022

However, if the valve fails or is contaminated with foreign matter, the processing liquid may leak from the valve and drip from the nozzle. Moreover, even if the valve itself is normal, there is a possibility that an abnormality such as interruption of the processing liquid in the supply path may occur due to deviation in the adjustment of the speed controller.

This problem is not limited to the substrate processing apparatus, but is common to all processing apparatuses that process the object by supplying a processing liquid to the object.

An object of one aspect of the embodiments is to provide a processing device, an abnormality detection method, and a storage medium that can detect an abnormality in a flow path opening/closing unit such as a valve or a speed controller.

A processing apparatus according to an aspect of an embodiment includes a chamber, a nozzle, a flow rate measurement section, a channel opening/closing section, and a control section. The chamber accommodates an object to be processed. A nozzle is provided in the chamber and supplies the processing liquid toward the object to be processed. The flow rate measurement unit measures the flow rate of the treatment liquid supplied to the nozzle. The channel opening/closing unit opens and closes the supply channel of the treatment liquid to the nozzle. The control unit outputs a closing signal for causing the channel opening/closing unit to perform a closing operation for closing the supply channel. Further, the control unit detects an operational abnormality of the channel opening/closing unit based on the integrated amount of the flow rate measured by the flow measurement unit after the closing signal is output.

According to one aspect of the embodiment, it is possible to detect an abnormality in the channel opening/closing unit.

FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to this embodiment. FIG. 2 is a diagram showing a schematic configuration of a processing unit. FIG. 3 is a diagram showing an example of the configuration of the processing fluid supply section. FIG. 4 is a diagram showing the relationship between the closing speed of the second opening and closing portion and the processing liquid in the nozzle. FIG. 5 is a block diagram showing an example of the configuration of the control device. FIG. 6 is a diagram for explaining execution timings of the first monitoring process and the second monitoring process. FIG. 7A is a diagram showing temporal changes in the measurement result of the flow rate measuring unit. FIG. 7B is a diagram showing temporal changes in the measurement result of the flow rate measuring unit. FIG. 8 is a flow chart showing the procedure of the first monitoring process. FIG. 9 is a flow chart showing the procedure of the second monitoring process. FIG. 10 is a diagram showing an example of the configuration of a processing fluid supply section according to the second embodiment. FIG. 11A is a diagram showing a modification of the liquid surface position after the suckback process. FIG. 11B is a diagram showing a modification of the liquid surface position after the suckback process. FIG. 12A is a diagram showing temporal changes in flow rate when leakage actually occurs. FIG. 12B is a diagram showing changes in flow rate over time when an erroneous leak detection occurs. FIG. 13 is a diagram showing a flowchart showing the procedure of the second monitoring process in the third embodiment. FIG. 14A is a diagram for explaining the contents of the comparison waveform shape generation processing and the comparison processing between the generated shape and the leak waveform. FIG. 14B is a diagram for explaining the contents of the comparison waveform shape generation processing and the comparison processing between the generated shape and the leak waveform. FIG. 15A is a diagram showing the integration result of the comparison waveform and the leakage waveform when leakage actually occurs. FIG. 15B is a diagram showing the integration result of the comparison waveform and the leak waveform when erroneous detection of leak occurs. FIG. 16 is a flow chart showing the procedure of automatic adjustment processing according to the fourth embodiment. FIG. 17 is a diagram showing an example of the configuration of a processing fluid supply section according to the fifth embodiment.

Hereinafter, embodiments of a processing apparatus, an abnormality detection method, and a storage medium disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below. In the following description, the object to be processed is a substrate, and the processing apparatus is a substrate processing system.

(First embodiment)
First, a first embodiment will be described with reference to FIGS. 1 to 9. FIG.

FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to this embodiment. Hereinafter, in order to clarify the positional relationship, the X-axis, Y-axis and Z-axis are defined to be orthogonal to each other, and the positive direction of the Z-axis is defined as the vertically upward direction.

As shown in FIG. 1, the substrate processing system 1 includes a loading/unloading station 2 and a processing station 3 . The loading/unloading station 2 and the processing station 3 are provided adjacently.

The loading/unloading station 2 includes a carrier placement section 11 and a transport section 12 . A plurality of carriers C for accommodating a plurality of substrates, in this embodiment, semiconductor wafers (hereinafter referred to as wafers W) in a horizontal state are mounted on the carrier mounting portion 11 .

The transfer section 12 is provided adjacent to the carrier mounting section 11 and includes a substrate transfer device 13 and a transfer section 14 therein. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. As shown in FIG. Further, the substrate transfer device 13 can move in the horizontal direction and the vertical direction and can rotate about the vertical axis. conduct.

The processing station 3 is provided adjacent to the transport section 12 . The processing station 3 comprises a transport section 15 and a plurality of processing units 16 . A plurality of processing units 16 are arranged side by side on both sides of the transport section 15 .

The transport unit 15 includes a substrate transport device 17 inside. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. As shown in FIG. In addition, the substrate transfer device 17 can move in the horizontal direction and the vertical direction and can rotate about the vertical axis, and transfers the wafer W between the delivery section 14 and the processing unit 16 using a wafer holding mechanism. I do.

The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17 .

The substrate processing system 1 also includes a control device 4 . Control device 4 is, for example, a computer, and includes control unit 18 and storage unit 19 . The storage unit 19 stores programs for controlling various processes executed in the substrate processing system 1 . The control unit 18 controls the operation of the substrate processing system 1 by reading and executing programs stored in the storage unit 19 .

The program may be recorded in a computer-readable storage medium and installed in the storage unit 19 of the control device 4 from the storage medium. Examples of computer-readable storage media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 of the loading/unloading station 2 takes out the wafer W from the carrier C placed on the carrier platform 11, and receives the taken out wafer W. It is placed on the transfer section 14 . The wafer W placed on the transfer section 14 is taken out from the transfer section 14 by the substrate transfer device 17 of the processing station 3 and carried into the processing unit 16 .

The wafer W loaded into the processing unit 16 is processed by the processing unit 16 , then unloaded from the processing unit 16 by the substrate transfer device 17 and placed on the transfer section 14 . Then, the processed wafer W placed on the transfer section 14 is returned to the carrier C on the carrier placement section 11 by the substrate transfer device 13 .

Next, the processing unit 16 will be described with reference to FIG. FIG. 2 is a diagram showing a schematic configuration of the processing unit 16. As shown in FIG.

As shown in FIG. 2 , the processing unit 16 includes a chamber 20 , a substrate holding mechanism 30 , a processing fluid supply section 40 and a collection cup 50 .

The chamber 20 accommodates a substrate holding mechanism 30 , a processing fluid supply section 40 and a collection cup 50 . An FFU (Fan Filter Unit) 21 is provided on the ceiling of the chamber 20 . FFU 21 forms a downflow in chamber 20 .

The substrate holding mechanism 30 includes a holding portion 31 , a support portion 32 and a driving portion 33 . The holding part 31 holds the wafer W horizontally. The column portion 32 is a member extending in the vertical direction, the base end portion of which is rotatably supported by the drive portion 33, and the tip portion of which supports the holding portion 31 horizontally. The drive section 33 rotates the support section 32 around the vertical axis. The substrate holding mechanism 30 rotates the holding part 31 supported by the supporting part 32 by rotating the supporting part 32 using the driving part 33, thereby rotating the wafer W held by the holding part 31. .

The processing fluid supply unit 40 supplies the wafer W with processing fluid. The processing fluid supply 40 is connected to a processing fluid supply 70 .

The collection cup 50 is arranged to surround the holding portion 31 and collects the processing liquid scattered from the wafer W due to the rotation of the holding portion 31 . A drain port 51 is formed at the bottom of the recovery cup 50 , and the processing liquid collected by the recovery cup 50 is discharged to the outside of the processing unit 16 through the drain port 51 . An exhaust port 52 is formed at the bottom of the collection cup 50 to discharge the gas supplied from the FFU 21 to the outside of the processing unit 16 .

Next, the configuration of the processing fluid supply section 40 provided in the processing unit 16 will be described with reference to FIG. FIG. 3 is a diagram showing an example of the configuration of the processing fluid supply section 40. As shown in FIG.

As shown in FIG. 3, the processing fluid supply unit 40 connects the nozzle 41 that supplies the processing liquid toward the wafer W, and the nozzle 41 and the processing fluid supply source 70, and supplies the processing liquid from the processing fluid supply source 70. is provided to the nozzle 41 . Although illustration is omitted here, the processing fluid supply unit 40 may include an arm that horizontally supports the nozzle 41 and an elevating mechanism that rotates and elevates the arm.

The supply channel 42 is a tubular member, and is made of a highly chemical-resistant material such as fluororesin. The supply channel 42 is provided with a first opening/closing portion 61, a flow rate measuring portion 81, and a second opening/closing portion 62 in this order from the upstream side.

The first opening/closing part 61 and the second opening/closing part 62 are examples of channel opening/closing parts, and open/close the supply channel 42 according to the open signal and the close signal output from the control device 4 .

The first opening/closing part 61 is, for example, an electromagnetic valve, and opens and closes the supply flow path 42 by moving the valve body using the magnetic force of the solenoid.

The second opening/closing unit 62 includes an air operated valve 62a, an air supply pipe 62b, and a speed controller 62c. The air operated valve 62a opens and closes the supply channel 42 by moving the valve element using the pressure of the air supplied from the air supply pipe 62b. The speed controller 62c is provided in the air supply pipe 62b and adjusts the flow rate of air supplied to the air operated valve 62a. Specifically, the speed controller 62c adjusts the amount of air supplied to the air operated valve 62a, thereby controlling the valve of the air operated valve 62a to open and close at a preset speed.

When the speed controller 62c receives an open signal from the control device 4, the open/closed state of the air operated valve 62a is changed from the "closed" state to the "open" state at a preset opening speed. As a result, the air operated valve 62a opens at a preset set opening speed (set opening time). Further, when the speed controller 62c receives a closing signal from the control device 4, the opening/closing state of the air operated valve 62a is changed from the "open" state to the "closed" state at a preset closing speed. As a result, the air operated valve 62a is closed at a preset set closing speed (set closing time).

Thus, the second opening/closing part 62 can adjust the opening/closing speed of the supply channel 42 by the speed controller 62c. Therefore, the second opening/closing part 62 can open and close the supply channel 42 at a slower speed than the first opening/closing part 61, which is an electromagnetic valve.

The flow rate measuring section 81 is provided between the first opening/closing section 61 and the second opening/closing section 62 and measures the flow rate of the treatment liquid flowing through the supply channel 42 . A measurement result of the flow rate measurement unit 81 is output to the control device 4 . Note that the flow rate measurement unit 81 may be provided downstream of the second opening/closing unit 62 .

A drain channel 43 is connected to the supply channel 42 downstream of the second opening/closing portion 62 . The drain channel 43 is a tubular member and is made of a highly chemical-resistant material such as fluororesin. The drain channel 43 is provided with a third opening/closing portion 63 and an orifice 90 .

Like the second opening/closing part 62, the third opening/closing part 63 includes an air operated valve 63a, an air supply pipe 63b, and a speed controller 63c. The third opening/closing part 63 can adjust the opening/closing speed of the drain channel 43 using a speed controller 63c. The orifice 90 is provided on the downstream side of the air operated valve 63 a and restricts the flow rate of the processing liquid flowing through the drain flow path 43 by narrowing the flow path diameter of the drain flow path 43 to suppress the flow of the processing liquid.

In the processing unit 16 , after stopping the ejection of the processing liquid from the nozzles 41 , the liquid surface position of the processing liquid in the supply channel 42 is retreated to prevent the processing liquid from dripping from the nozzles 41 . processing takes place.

Specifically, after outputting a close signal to the second opening/closing portion 62 to close the second opening/closing portion 62 , the control device 4 outputs an open signal to the third opening/closing portion 63 . The third opening/closing portion 63 is opened. The third opening/closing portion 63 may be opened at the same time that the second opening/closing portion 62 is closed. Since the supply channel 42 has an ascending portion 42a downstream of the connection position of the drain channel 43, the processing liquid remaining in the supply channel 42 is lifted by its own weight when the third opening/closing portion 63 is opened. It is drawn into the drain channel 43 and discharged from the drain channel 43 to the outside. As a result, the liquid surface position of the processing liquid retreats, thereby preventing the processing liquid from dripping from the nozzles 41 .

Here, if the supply channel 42 is suddenly closed when stopping the ejection of the treatment liquid from the nozzles 41, there is a possibility that "liquid depletion" in which the treatment liquid is interrupted occurs. When the liquid runs out, even if the suck-back process is performed, the interrupted processing liquid cannot be retracted, making it difficult to prevent the liquid from dripping.

Therefore, in the processing unit 16, the speed controller 62c adjusts the speed at which the air operated valve 62a closes, thereby preventing liquid shortage.

The speed controller 62c is adjusted in advance so as to close the second opening/closing portion 62 at an appropriate speed. Otherwise, the liquid may run out or drip.

The relationship between the closing speed (closing speed) of the second opening/closing portion 62 and the processing liquid in the nozzle 41 will be described with reference to FIG. FIG. 4 is a diagram showing the relationship between the closing speed (closing speed) of the second opening/closing portion 62 and the processing liquid in the nozzle 41. As shown in FIG.

As shown in FIG. 4, when the closing speed of the second opening/closing part 62 is appropriate, the occurrence of liquid depletion of the treatment liquid is prevented. Moreover, by preventing the liquid from running out, the suck-back process can be properly performed, and the dripping of the processing liquid can be prevented.

On the other hand, if the closing speed of the second opening/closing portion 62 is slower than the appropriate speed, the processing liquid may leak from the nozzle 41 as shown in the left diagram of FIG. Further, if the closing speed of the second opening/closing portion 62 is faster than the appropriate speed, the processing liquid may run out as shown in the right diagram of FIG.

Furthermore, even if the closing speed of the second opening/closing part 62 is appropriate, if the air-operated valve 62a malfunctions or gets mixed with foreign matter, the processing liquid leaks from the air-operated valve 62a, and the left side of FIG. , the processing liquid may leak.

Therefore, in the substrate processing system 1 according to the first embodiment, the presence or absence of an abnormality in the second opening/closing portion 62 is determined based on the measurement result of the flow rate measurement portion 81 after outputting the closing signal to the second opening/closing portion 62. decided to monitor. This point will be specifically described below.

First, the configuration of the control device 4 will be described with reference to FIG. FIG. 5 is a block diagram showing an example of the configuration of the control device 4. As shown in FIG. In FIG. 5, constituent elements necessary for explaining the features of the first embodiment are represented by functional blocks, and general constituent elements are omitted. That is, each component illustrated in FIG. 5 is functionally conceptual and does not necessarily need to be physically configured as illustrated. For example, the specific forms of distribution and integration of each functional block are not limited to those shown in the figure, and all or part of them can be functionally or physically distributed in arbitrary units according to various loads and usage conditions.・It is possible to integrate and configure.

Further, each processing function performed by each functional block of the control device 4 is realized in whole or in part by a processor such as a CPU (Central Processing Unit) and a program that is analyzed and executed by the processor. Alternatively, it can be implemented as hardware by wired logic.

As shown in FIG. 5, the control device 4 includes a control section 18 and a storage section 19 (see FIG. 1). The storage unit 19 is realized by, for example, a semiconductor memory device such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk. The storage unit 19 stores recipe information 19a.

The recipe information 19a is information indicating the content of substrate processing. Specifically, it is information in which the contents of each process to be executed by the processing unit 16 during substrate processing are registered in advance in order of the processing sequence.

The control unit 18 is, for example, a CPU, and functions as functional blocks 18a to 18c shown in FIG. 5 by reading out and executing a program (not shown) stored in the storage unit 19, for example. The program may be recorded in a computer-readable recording medium and installed in the storage unit 19 of the control device 4 from the recording medium. Examples of computer-readable recording media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

Next, each functional block 18a to 18c will be described. The control unit 18 includes a substrate processing execution unit 18a, a monitoring unit 18b, and an abnormality handling processing unit 18c.

When functioning as the substrate processing execution unit 18a, the control unit 18 controls the processing unit 16 according to the recipe information 19a stored in the storage unit 19 to execute a series of substrate processing. For example, the control unit 18 includes chemical liquid processing for supplying a chemical liquid to the wafer W, rinsing processing for supplying a rinsing liquid to the wafer W, and drying processing for drying the wafer W by increasing the rotation speed of the wafer W. Execute a series of substrate treatments.

The control unit 18 outputs an open signal and a close signal to the first to third opening/closing units 61 to 63 of the processing fluid supply unit 40 at the timing according to the recipe information 19a, thereby controlling the contents of the substrate processing. The treated liquid is discharged from the nozzle 41 . At this time, the flow rate of the processing liquid flowing through the supply channel 42 is measured by the flow rate measurement section 81 and the measurement result is output to the control section 18 .

When functioning as the monitoring unit 18 b , the control unit 18 executes “first monitoring processing” and “second monitoring processing” based on the measurement result of the flow rate measurement unit 81 . The "first monitoring process" is a process of monitoring whether or not the adjustment of the speed controller 62c of the second opening/closing unit 62 is normal. The "second monitoring process" is a process of monitoring whether or not dripping of the treatment liquid has occurred.

Here, the contents of the first monitoring process and the second monitoring process will be described with reference to FIG. FIG. 6 is a diagram for explaining execution timings of the first monitoring process and the second monitoring process.

As shown in FIG. 6, the control unit 18 first outputs an open signal to the first opening/closing unit 61 at the timing of starting a series of substrate processing on the wafer W (time t1). As a result, the first opening/closing portion 61 is opened, but the second opening/closing portion 62 is closed, so the discharge of the processing liquid from the nozzle 41 does not start at time t1.

Subsequently, the control section 18 outputs an open signal to the second opening/closing section 62 (time t2). As a result, the second opening/closing part 62 opens at a preset opening speed, and the flow rate of the processing liquid flowing through the supply channel 42 gradually increases from 0 toward the target flow rate.

Subsequently, the control section 18 outputs a close signal to the second opening/closing section 62 (time t3). As a result, the second opening/closing part 62 is closed at a preset closing speed, and the flow rate of the processing liquid flowing through the supply channel 42 gradually decreases toward zero.

The first monitoring process is executed in the first period T1 from the point in time when the close signal is output to the second opening/closing section 62 . The length of the first period T1 is set to a length exceeding the expected time from when the close signal is output until the second opening/closing part 62 is completely closed and the flow rate becomes zero. For example, the length of the first period T1 is set to 2 seconds.

In the first monitoring process, the control unit 18 monitors whether or not the second opening/closing unit 62 operates abnormally, based on the integrated amount of flow measured by the flow measurement unit 81 after the close signal is output.

That is, after the first period T1 has elapsed, the control unit 18 integrates the measurement results of the flow rate measuring unit 81 during the first period T1, and determines whether or not the integrated amount is within a predetermined normal range. Then, if the integrated amount is out of the normal range, an operational abnormality of the speed controller 62c is detected.

Specifically, the control unit 18 detects dripping of the treatment liquid when the integrated amount exceeds the normal range. Further, when the integrated amount falls below the normal range, the control unit 18 detects lack of the processing liquid in the supply channel 42 .

In the first monitoring process, "detecting the dripping of the processing liquid" means detecting that the dripping of the processing liquid has occurred or that the dripping of the processing liquid may occur. Further, "to detect the lack of the treatment liquid" means to detect the occurrence of the lack of the treatment liquid or the possibility of the occurrence of the lack of the treatment liquid.

Note that the control unit 18 determines whether the liquid dripping or the liquid shortage is likely to occur, or whether the liquid dripping or the liquid shortage actually occurs, depending on the amount of deviation of the integrated amount from the normal range. You may make it discriminate|determine whether it is a state. For example, the control unit 18 detects that there is a possibility that liquid dripping or liquid depletion may occur when the amount of deviation from the normal range of the integrated amount does not exceed the threshold, and if the threshold is exceeded, Detects that dripping or running out of liquid is actually occurring.

Here, the controller 18 integrates the flow rate measured by the flow rate measurement section 81, but the flow rate measurement section 81 may perform the flow rate integration process. In this case, the control unit 18 may obtain information on the integrated amount from the flow rate measurement unit 81 .

Subsequently, the control unit 18 starts the second monitoring process after the first period T1 has passed (time t4).

In the second monitoring process, the control unit 18 monitors whether or not the first opening/closing unit 61 or the second opening/closing unit 62 operates abnormally based on the flow rate measured by the flow rate measurement unit 81 .

Here, for example, if a minute foreign substance enters the first opening/closing portion 61 or the second opening/closing portion 62, the amount of processing liquid leaking from the first opening/closing portion 61 or the second opening/closing portion 62 is extremely small. In such a case, simply monitoring the measurement result of the flow rate measuring section 81 will not determine whether the change in the flow rate is due to leakage from the first opening/closing section 61 or the second opening/closing section 62, or due to noise. It is difficult to determine whether

Therefore, the control unit 18 monitors whether there is an operational abnormality in the first opening/closing unit 61 or the second opening/closing unit 62 based on a value obtained by performing a Fast Fourier Transform (FFT) on the flow rate measured by the flow rate measurement unit 81. It was decided to.

This point will be described with reference to FIGS. 7A and 7B. FIG. 7A is a diagram showing actual data and post-FFT data of the measurement result of the flow rate measuring unit 81 when the treatment liquid does not drip. FIG. 7B is a diagram showing actual data and data after FFT of the measurement result of the flow rate measurement unit 81 when dripping of the treatment liquid occurs.

As shown in the upper diagram of FIG. 7A, when the treatment liquid does not drip, that is, even when the treatment liquid is almost stationary in the supply channel 42, the measurement result of the flow rate measuring unit 81 is shows a change in flow rate. This change in flow rate is caused by noise included in the measurement results of the flow rate measurement unit 81 .

Further, as shown in the upper diagram of FIG. 7B, when liquid dripping occurs, the measurement result of the flow rate measuring unit 81 shows a large change in the flow rate compared to when liquid dripping does not occur. However, since the measurement results contain noise, it is difficult to accurately detect the occurrence of liquid dripping.

On the other hand, looking at the data after FFT shown in the lower diagrams of FIGS. 7A and 7B, it can be seen that the maximum value of amplitude changes significantly when liquid dripping occurs compared to when liquid dripping does not occur ( See H in FIG. 7B). For example, in the examples shown in FIGS. 7A and 7B, the maximum value of the amplitude of the data after FFT when dripping occurs is about 10 times larger than when dripping does not occur.

Therefore, the control unit 18 fast Fourier transforms the measurement result of the flow measurement unit 81, compares the value (maximum value) after the fast Fourier transform with a predetermined threshold value, and when the threshold value is exceeded, the liquid dripping to detect the occurrence of

By subjecting the measurement result of the flow rate measuring unit 81 to the fast Fourier transform in this manner, the change point of the flow rate when liquid dripping occurs can be captured, and the occurrence of liquid dripping can be detected with high accuracy.

Note that although the fast Fourier transform is performed here, a normal Fourier transform (FT) may be performed.

As shown in FIG. 6, the second monitoring process is executed after the first monitoring process ends, that is, after the first period T1 has elapsed. The first period T1 includes a period during which the flow rate of the processing liquid in the supply channel 42 gradually decreases, that is, a period during which the flow rate changes. Therefore, by setting the second period T2 excluding the first period T1 as the monitoring period of the second monitoring process, the change in the flow rate by the second opening/closing unit 62 is erroneously detected as the change in the flow rate due to dripping. can be prevented.

Also, the second period T2 is set to a period after the first period T1 has passed and a predetermined time has passed. By setting in this way, it is possible to more reliably prevent erroneous detection of a change in the flow rate by the second opening/closing part 62 as a change in the flow rate due to dripping.

The second monitoring process is continued until the substrate process for the next wafer W is started and the open signal is output to the second opening/closing part 62 again. In other words, in the second period T2, the reopening signal is output to the second opening/closing section 62 from the point in time (time t4) after the first period T1 has passed and a predetermined time has passed. It is set to a period up to time (time t7).

By the way, the cause of the liquid dripping is considered to be the leakage of the processing liquid from the first opening/closing part 61 or the air operated valve 62a. In the second monitoring process, when the control unit 18 detects the occurrence of liquid dripping, the control unit 18 further determines whether the leakage of the treatment liquid that is the cause of the liquid dripping is caused by either the first opening/closing unit 61 or the air operated valve 62a. You can identify what is happening.

For example, during the period from time t4 to time t5, the first opening/closing portion 61 is open and the air operated valve 62a is closed. Therefore, when the liquid leakage is detected during this period, the control unit 18 can detect the occurrence of the processing liquid leakage from the air operated valve 62a.

On the other hand, during the period from time t5 to time t6, both the first opening/closing portion 61 and the air operated valve 62a are closed. Therefore, when liquid leakage is not detected during the period from time t4 to time t5, but liquid leakage is detected during the period from time t5 to time t6, the control section 18 controls the flow of the treatment liquid from the first opening/closing section 61. The occurrence of leaks can be detected.

Returning to FIG. 5, the abnormality handling processing unit 18c will be described. When an abnormality is detected in the first monitoring process or the second monitoring process, the control section 18 functions as an abnormality handling section 18c and executes a predetermined abnormality handling process.

For example, the control unit 18 causes the output device 200 such as a display unit or an audio output unit to output warning information such as a warning screen or warning sound. This makes it possible for the operator to recognize that an abnormality has occurred. Note that the control unit 18 may change the content of the warning information output by the output device 200 according to the content of the abnormality detected in the first monitoring process or the second monitoring process.

In addition, the control unit 18 suspends the substrate processing that is currently being performed. As a result, it is possible to prevent product defects caused by leakage of the processing liquid in the next substrate processing or the like and adhesion of the leaked processing liquid to the wafer W, for example.

Next, procedures of the first monitoring process and the second monitoring process described above will be described with reference to FIGS. 8 and 9. FIG. FIG. 8 is a flow chart showing the procedure of the first monitoring process, and FIG. 9 is a flow chart showing the procedure of the second monitoring process.

First, the procedure of the first monitoring process will be described with reference to FIG. As shown in FIG. 8, when the first period T1 (see FIG. 6) is started, the control unit 18 acquires the measurement result of the flow rate measurement unit 81 (step S101), and stores the acquired measurement result in the storage unit 19. memorize to Subsequently, the control unit 18 determines whether or not the first period T1 has ended (step S102), and if the first period T1 has not ended (step S102, No), the first period T1 The process of step S101 is repeated until it ends. On the other hand, when the first period T1 ends (step S102, Yes), the control unit 18 integrates the measurement results obtained in step S101 (step S103).

Subsequently, the control unit 18 determines whether or not the integrated amount of the measurement results exceeds the upper limit of the normal range (step S104). In this process, when it is determined that the integrated amount has exceeded the upper limit of the normal range (step S104, Yes), the control unit 18 detects liquid dripping (step S105), and executes an abnormality handling process (step S106). ). For example, the control unit 18 interrupts substrate processing and outputs warning information to the output device 200 .

On the other hand, if the integrated amount does not exceed the upper limit of the normal range in step S104 (step S104, No), the control unit 18 determines whether the integrated amount is below the lower limit of the normal range (step S107). ). In this process, if it is determined that the integrated amount has fallen below the lower limit of the normal range (step S107, Yes), the control unit 18 detects the lack of liquid (step S108), and executes the abnormality handling process (step S109). ). For example, the control unit 18 interrupts substrate processing and outputs warning information to the output device 200 .

In step S107, if the integrated amount is not below the lower limit of the normal range (step S107, No), it is determined that there is no abnormality in the processing fluid supply unit 40 (step S110). After finishing the process of step S106, step S109 or step S110, the control unit 18 finishes the first monitoring process.

Next, the procedure of the second monitoring process will be described with reference to FIG. As shown in FIG. 9, when the second period T2 (see FIG. 6) starts, the control unit 18 acquires the measurement result of the flow measurement unit 81 (step S201), Fourier transform is performed (step S202).

Subsequently, the control unit 18 determines whether or not the value after the fast Fourier transform exceeds a predetermined threshold (step S203). In this process, when it is determined that the value after the fast Fourier transform exceeds the predetermined threshold (step S203, Yes), the control unit 18 detects liquid dripping (step S204), and executes the abnormality handling process. (step S205). For example, the control unit 18 interrupts substrate processing and outputs warning information to the output device 200 .

When the value after the fast Fourier transform does not exceed the threshold in step S203 (step S203, No), the control unit 18 determines whether or not the second period T2 has ended (step S206). Then, if the second period T2 has not ended (step S206, No), the control unit 18 returns the process to step S201, and repeats the processes of steps S201 to S203 and step S206.

On the other hand, if it is determined in step S206 that the second period T2 has ended (step S206, Yes), the control section 18 determines that the processing fluid supply section 40 is normal (step S207). After finishing the process of step S205 or step S207, the control unit 18 finishes the second monitoring process.

As described above, the substrate processing system 1 (an example of the processing apparatus) according to the first embodiment includes the chamber 20, the nozzle 41, the flow rate measuring section 81, and the second opening/closing section 62 (flow path opening/closing section). example) and a control unit 18 . The chamber 20 accommodates a wafer W (an example of an object to be processed). Nozzle 41 is provided in chamber 20 and supplies processing liquid toward wafer W. As shown in FIG. The flow rate measurement unit 81 measures the flow rate of the treatment liquid supplied to the nozzle 41 . The second opening/closing part 62 opens and closes the supply channel 42 of the treatment liquid to the nozzle 41 . The control unit 18 outputs a close signal to the second opening/closing unit 62 to cause the supply channel 42 to close. In addition, the control unit 18 detects malfunction of the second opening/closing unit 62 based on the integrated amount of the flow rate measured by the flow rate measurement unit 81 after the close signal is output.

Therefore, according to the substrate processing system 1 according to the first embodiment, an abnormality of the second opening/closing part 62 can be detected.

(Second embodiment)
Next, the configuration of the processing fluid supply unit according to the second embodiment will be described with reference to FIG. FIG. 10 is a diagram showing an example of the configuration of a processing fluid supply section according to the second embodiment. In the following description, the same reference numerals as those already described are given to the same parts as those already described, and overlapping descriptions will be omitted.

As shown in FIG. 10 , the processing fluid supply section 40A according to the second embodiment further includes a pressure measurement section 82 . The pressure measuring unit 82 is provided at the rising portion 42a of the supply channel 42 on the downstream side of the second opening/closing portion 62 via the branch channel 44, and measures the hydraulic head pressure of the treatment liquid at the rising portion 42a. A measurement result of the pressure measurement unit 82 is output to the control device 4 .

When functioning as the monitoring unit 18b, the control unit 18 of the control device 4, based on the amount of change in the hydraulic head pressure measured by the pressure measuring unit 82 during the above-described second period T2 (see FIG. 6), 3 Detect an operational abnormality of the opening/closing unit 63 .

When a leak occurs in the first opening/closing portion 61 or the second opening/closing portion 62, the processing liquid flows into the rising portion 42a, so that the liquid level of the processing liquid rises (see S01 in FIG. 10), and the water head of the processing liquid rises. pressure increases. The control unit 18 can detect malfunction of the first opening/closing unit 61 or the second opening/closing unit 62 based on the increase in water head pressure. Specifically, the control unit 18 detects leakage of the treatment liquid from the first opening/closing unit 61 or the second opening/closing unit 62 when the amount of increase in the hydraulic head pressure in the second period T2 exceeds the threshold.

On the other hand, when a leak occurs in the third opening/closing portion 63, the processing liquid in the rising portion 42a flows out from the drain channel 43, so that the liquid level of the processing liquid drops (see S02 in FIG. 10), and the processing liquid head pressure decreases. The control unit 18 can detect malfunction of the third opening/closing unit 63 based on the reduction in the water head pressure. Specifically, the control unit 18 detects the leakage of the treatment liquid from the third opening/closing unit 63 when the amount of decrease in the hydraulic head pressure in the second period T2 exceeds the threshold.

As described above, the substrate processing system 1 according to the second embodiment includes the pressure measuring section 82 . The pressure measuring unit 82 is provided in the ascending portion 42a that raises the treatment liquid in the supply channel 42 on the downstream side of the second opening/closing portion 62, and measures the head pressure of the treatment liquid in the ascending portion 42a. Then, the control unit 18 detects abnormal operation of the first to third opening/closing units 61 to 63 based on the amount of change in the hydraulic head pressure measured by the pressure measuring unit 82 after the close signal is output to the second opening/closing unit 62. do.

Abnormality detection based on a change in water head pressure detects the presence or absence of an abnormality based on the accumulated amount of leaked treatment liquid. Therefore, it is possible to detect the occurrence of minute leaks that are difficult to detect in the second monitoring process described above.

Note that FIG. 10 shows an example in which the suck-back process is performed so that the liquid surface of the processing liquid is positioned at the rising portion 42a extending along the vertical direction. is not limited to the position shown in FIG. 11A and 11B are diagrams showing modified examples of the liquid surface position after the suckback process.

For example, as shown in FIG. 11A, the supply channel 42 is provided with a horizontal portion 42b downstream of the rising portion 42a, and a curved portion 42c between the rising portion 42a and the horizontal portion 42b.

The height position of the treatment liquid can also change in the curved portion 42c. For this reason, the control unit 18 may perform the suck-back process so that the surface of the treatment liquid is positioned at the curved portion 42c.

Alternatively, as shown in FIG. 11B, a slope portion 42d rising toward the downstream side may be provided in the horizontal portion 42b, and the suckback process may be performed so that the liquid surface of the processing liquid is positioned on the slope portion 42d.

In this way, by setting the liquid surface position after the suckback process to the ascending portion (the curved portion 42c or the slope portion 42d) on the downstream side of the ascending portion 42a, the distance from the liquid surface of the processing liquid to the discharge port of the nozzle 41 is increased. distance can be shortened. Therefore, it is possible to shorten the time lag from outputting an open signal to the second opening/closing part 62 to ejection of the treatment liquid from the nozzle 41, for example. In addition, it is possible to prevent the atmosphere of the processing liquid from entering the supply channel 42 from the ejection port of the nozzle 41 .

(Third embodiment)
When the FFT described in the first embodiment is used to monitor whether there is an operational abnormality in the first opening/closing portion 61 or the second opening/closing portion 62, erroneous detection of leakage may occur. This point will be described with reference to FIGS. 12A and 12B.

FIG. 12A is a diagram showing temporal changes in flow rate when leakage actually occurs. As shown in FIG. 12A, when a leak actually occurs, it can be seen that a rapid flow rate change occurs (see part I in FIG. 12A).

On the other hand, FIG. 12B is a diagram showing changes in the flow rate over time when an erroneous leak detection occurs. As shown in FIG. 12B, when there is no leak, there is no abrupt change in flow rate. However, when this data is subjected to FFT, a distribution with peaks appearing in the low frequency region may be obtained as shown in the lower diagram of FIG. 7B. There is a risk that

Therefore, in the third embodiment, the following determination processing is performed in order to prevent such erroneous detection of leakage.

FIG. 13 is a diagram showing a flowchart showing the procedure of the second monitoring process in the third embodiment. Note that the processing of steps S201 to S207 shown in FIG. 13 is the same as the processing of steps S201 to S207 shown in FIG. 9, and thus description thereof will be omitted here.

In the third embodiment, when it is determined in step S203 that the value after FFT exceeds a predetermined threshold value (step S203, Yes), shape generation processing of a comparison waveform is performed (step S301).

Specifically, an averaging process is performed on the measurement results before execution of the FFT (for example, the data shown in the upper diagrams of FIGS. 7A and 7B). For example, regarding the value of one sampling time, the average value of 12 points before and after that time (total of 25 points) is taken as the average value at that time. Graphs after such calculations are shown in the upper diagrams of FIGS. 14A and 14B. 14A is a graph after averaging the data in FIG. 12A, and FIG. 14B is a graph after averaging the data in FIG. 12B.

Note that in the upper diagrams of FIGS. 14A and 14B, scale conversion is performed on the obtained average values. That is, the maximum value of the average value is 1000 and the minimum value is -1000, and conversion is performed so that all average values take values between them.

Next, comparison processing is performed between the generated shape and the leak waveform (step S302).

The leak waveform is a waveform of a pattern indicating an ideal leak measurement result stored in advance. As shown in the lower diagrams of FIGS. It changes from -1000 to 1000. This changing time (sampling number) may be obtained experimentally using an actual device.

In the third embodiment, as shown in the lower diagrams of FIGS. 14A and 14B, the time of the change point of the waveform is adjusted to the timing when the generated shape exceeds the value of 500, and the generated shapes and Obtain the integrated value with the leak waveform. As shown in FIG. 15A, in the waveform when a leak actually occurs, most of the integrated values take values between 0.5 and 1.0 over the entire interval, and the degree of agreement with the leak waveform is high. I understand. On the other hand, as shown in FIG. 15B, in the waveform where no leak occurs, that is, in the case where only the FFT calculation results in an erroneous detection, the integrated value fluctuates greatly over the entire interval, indicating that the degree of agreement with the leak waveform is low. .

In the third embodiment, the average value of integrated values in all sections is calculated, and if the calculated average value is larger than a threshold value (for example, 0.5), it is determined that the leak waveform has a shape close to that of a leak waveform. Judgment is made (step S302, Yes), and liquid dripping is detected (step S204). On the other hand, if the calculated average value is smaller than the threshold value, it is determined that the shape does not resemble the leak waveform (step S302, No), and it is determined that there is no abnormality in the processing fluid supply unit 40 ( step S207).

As described above, in the third embodiment, in addition to determination using FFT processing, based on both the comparison result of comparing the waveform of the measured flow rate before FFT and a predetermined leak waveform and the value after FFT, The dripping of the first opening/closing part 61 or the second opening/closing part 62 is detected. In this way, by performing detection processing by both FFT and waveform comparison, there is an effect that highly reliable abnormality detection with less erroneous detection is possible.

(Fourth embodiment)
FIG. 16 is a flow chart showing the procedure of automatic adjustment processing according to the fourth embodiment. As shown in FIG. 16, the control unit 18 determines whether or not the integrated amount in the first period T1 (see FIG. 6) is within the normal range (step S401). Then, if the integrated amount is out of the normal range (step S401, No), the control unit 18 controls the speed controller 62c so that the integrated amount in the next first period T1 is within the normal range. The set closing speed of the operate valve 62a may be adjusted (step S402). If the integrated amount is within the normal range (step S401, Yes), the control unit 18 ends the automatic adjustment process without adjusting the set closing speed.

The speed controller 62c has, for example, a needle valve that adjusts the flow rate of air supplied to the air operated valve 62a by changing the cross-sectional area of the air supply pipe 62b, and a drive section that drives the needle valve. The amount of protrusion of the needle valve is set in advance so that the closing speed of the air operated valve 62a becomes a set closing speed set in advance. When the integrated amount is out of the normal range, the control section 18 changes the set closing speed by controlling the drive section to change the projection amount of the needle valve.

Specifically, the storage unit 19 (see FIG. 1) stores adjustment information that associates the deviation amount of the integrated amount from the reference value with the adjustment amount of the speed controller 62c. Here, the amount of deviation of the integrated amount from the reference value represents the difference between the median value of the normal range (value obtained by adding the upper limit value and the lower limit value and dividing by 2, an example of the reference value) and the integrated amount. For example, if the upper limit of the normal range is 20 mL and the lower limit is 10 mL, the median is 15 mL. In this case, when the integrated amount is 25 mL, the deviation amount of the integrated amount is +10 mL. Also, when the integrated amount is 5 mL, the deviation amount of the integrated amount is −10 mL.

Further, the adjustment amount of the speed controller 62c is, for example, the needle valve drive amount required to match the integrated amount with the median value of the normal range. For example, the adjustment information associates the integrated amount deviation amount "+10 mL" with the needle valve driving amount "+1 rotation", and associates the integrated amount deviation amount "-10 mL" with the needle valve driving amount "-1 rotation". Associate. A "+" of the deviation amount indicates that the integrated amount is larger than the median value, and a "-" of the deviation amount indicates that the integrated amount is smaller than the median value. "+" and "-" of the drive amount of the needle valve represent the rotation direction of the needle valve.

In step S402, the control unit 18 first calculates the deviation amount of the integrated amount. Subsequently, the control unit 18 refers to the adjustment information stored in the storage unit 19 to determine the amount of adjustment of the speed controller 62c corresponding to the calculated amount of deviation, ie, the amount of driving the needle valve. Then, the control unit 18 rotates the needle valve of the speed controller 62c by the determined number of rotations to change the projection amount of the needle valve. As a result, the flow passage cross-sectional area of the air supply pipe 62b changes, and accordingly the supply speed (flow speed) of the air to the air operated valve 62a changes. As a result, the closing speed of the air operated valve 62a is changed. That is, the set closing speed is changed.

For example, when the deviation amount of the integrated amount is "+10 mL", the control unit 18 rotates the needle valve once in the direction in which the flow passage cross-sectional area of the air supply pipe 62b becomes smaller. This prevents dripping. Further, when the deviation amount of the integrated amount is "-10 mL", the control unit 18 rotates the needle valve once in the direction in which the flow passage cross-sectional area of the air supply pipe 62b increases. This prevents the liquid from running out.

In this manner, the control unit 18 controls the speed controller 62c to set the closed state when the integrated amount of flow measured by the flow measurement unit 81 after outputting the close signal to the second opening/closing unit 62 is out of the normal range. You can change the speed. Specifically, the control unit 18 may change the set closing speed by controlling the driving unit based on the adjustment information and driving the needle valve with a driving amount corresponding to the amount of deviation from the reference value. . As a result, for example, the closing speed of the air operated valve 62a can be adjusted to an appropriate closing speed that does not cause dripping or running out of liquid without manual adjustment by an operator.

Here, the amount of deviation of the integrated amount is the amount of deviation when the median value of the normal range is used as the standard. Doesn't have to be a value.

Also, the control unit 18 does not necessarily need to use the adjustment information described above in the automatic adjustment process. For example, when the integrated amount is out of the normal range, the controller 18 may adjust the speed controller 62c by a predetermined constant adjustment amount regardless of the amount of deviation of the integrated amount. In this case, if the integrated amount in the next first period T1 is also out of the normal range, the control unit 18 again adjusts the speed controller 62c by a predetermined constant adjustment amount. By repeating this process, the integrated amount can be kept within the normal range.

(Fifth embodiment)
In the above-described fourth embodiment, the speed controller 62c is used as an example of an adjusting unit that adjusts the closing speed of the air operated valve 62a to a preset closing speed. Not limited. For example, the regulator may be an electropneumatic regulator. An example in which the adjustment unit is an electropneumatic regulator will be described below with reference to FIG. FIG. 17 is a diagram showing an example of the configuration of a processing fluid supply section according to the fifth embodiment.

As shown in FIG. 17, the processing fluid supply section 40B according to the fifth embodiment includes a second opening/closing section 62B. The second opening/closing unit 62B includes an air operated valve 62a, an air supply pipe 62b, and an electropneumatic regulator 62d.

The electropneumatic regulator 62d is provided on the air supply pipe 62b. The electro-pneumatic regulator 62 d is a device that adjusts the air pressure using an electrical signal, and adjusts the pressure of the air supplied to the air operated valve 62 a according to the electrical signal input from the control section 18 . By controlling the electropneumatic regulator 62d, the control unit 18 adjusts the supply pressure to the air operated valve 62a so that the closing speed of the air operated valve 62a reaches a preset closing speed.

When the integrated amount of the flow measured by the flow measurement unit 81 after outputting the closing signal to the second opening/closing unit 62B is out of the normal range, the control unit 18 controls the electropneumatic regulator 62d so that the air operated valve 62a is Adjust supply pressure. As a result, the set closing speed of the air operated valve 62a is changed.

For example, the storage unit 19 stores adjustment information that associates the amount of deviation of the integrated amount with the amount of change in the decompression speed. When the controller 18 determines in step S401 that the integrated amount is out of the normal range (step S401, No), first, in step S402, it calculates the deviation amount of the integrated amount. Subsequently, the control unit 18 refers to the adjustment information stored in the storage unit 19 to determine the amount of adjustment of the electro-pneumatic regulator 62d corresponding to the calculated amount of deviation, that is, the amount of change in the supply pressure. Then, the control unit 18 controls the electro-pneumatic regulator 62d so that the pressure of the air supplied from the electro-pneumatic regulator 62d to the air operated valve 62a decreases from the original supply pressure by the amount of change determined above. do.

Thus, when the adjustment unit is the electropneumatic regulator 62d, the control unit 18 controls the electropneumatic regulator 62d to change the supply pressure to the air operated valve 62a, thereby setting the air operated valve 62a. It is possible to change the closing speed.

In the above-described embodiments, an example in which the object to be processed is the wafer W was given, but the above-described embodiments are applied to general processing apparatuses that process the object to be processed by supplying a processing fluid to the object to be processed. You may

Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspects of the invention are not limited to the specific details and representative embodiments so shown and described. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and equivalents thereof.

W Wafer 1 Substrate processing system 4 Control device 16 Processing unit 18 Control unit 20 Chamber 40 Processing fluid supply unit 41 Nozzle 61 First opening/closing unit 62 Second opening/closing unit 62a Air operated valve 62b Air supply pipe 62c Speed controller 63 Third opening/closing unit

Claims (12)

a chamber containing an object to be processed;
a nozzle provided in the chamber for supplying a processing liquid toward the object to be processed;
a flow rate measurement unit that measures the flow rate of the treatment liquid supplied to the nozzle;
a channel opening/closing unit that opens and closes a channel for supplying the processing liquid to the nozzle;
A close signal is output to the flow channel opening/closing unit to perform a closing operation to close the supply flow channel, and the flow channel is measured based on the integrated amount of the flow rate measured by the flow measurement unit after the close signal is output. Equipped with a control unit that detects abnormal operation of the opening and closing unit,
The flow path opening/closing part is
a first opening/closing part;
a second opening/closing part provided downstream of the first opening/closing part, opened after the first opening/closing part, and closed before the first opening/closing part;
The control unit
A processing device, wherein an operational abnormality of the second opening/closing section is detected based on the integrated amount of the flow rate measured by the flow rate measuring section after the closing signal is output to the second opening/closing section. The second opening/closing part is
an air operated valve that opens and closes the valve body by air pressure;
a speed controller that adjusts the flow rate of air supplied to the air operated valve;
The control unit
Detecting malfunction of the speed controller when the integrated amount of the flow rate measured by the flow rate measuring section after outputting the closing signal to the second opening/closing section is out of a normal range. 2. The processing apparatus according to 1 . The control unit
Abnormal operation of the first opening/closing unit or the second opening/closing unit is detected based on a value obtained by Fourier transforming the flow rate measured by the flow rate measurement unit after outputting the closing signal to the second opening/closing unit. 3. The processing apparatus according to claim 1 or 2 , wherein The control unit
After outputting the closing signal to the second switching section and before outputting the closing signal to the first switching section, when a value obtained by Fourier transforming the flow rate measured by the flow measurement section exceeds a threshold value, the Fourier transform of the flow rate measured by the flow rate measurement unit after detecting an operation abnormality of the second opening/closing part and before outputting the open signal to the first opening/closing part after outputting the closing signal to the first opening/closing part 4. The processing apparatus according to claim 3 , wherein an operational abnormality of said first opening/closing unit is detected when the value exceeds a threshold. The control unit
During a first period from the time when the closing signal is output to the second opening/closing part, based on the integrated amount of the flow rate, the presence or absence of malfunction of the second opening/closing part is monitored, and after the first period has elapsed 5. The processing apparatus according to claim 4 , wherein during the second period of , whether or not there is an operational abnormality in the first opening/closing unit or the second opening/closing unit is monitored based on a value obtained by Fourier transforming the flow rate. The second period is
6. The processing apparatus according to claim 5 , wherein the period is after the first period has elapsed and a predetermined period of time has elapsed. The control unit
The waveform of the flow rate measured by the flow rate measuring unit before the Fourier transform is compared with the flow rate waveform at the time of a predetermined operation abnormality, and based on both the Fourier-transformed value and the waveform comparison result, the first The processing apparatus according to any one of claims 3 to 6 , wherein an operation abnormality of the opening/closing part or the second opening/closing part is detected. a chamber containing an object to be processed;
a nozzle provided in the chamber for supplying a processing liquid toward the object to be processed;
a flow rate measurement unit that measures the flow rate of the treatment liquid supplied to the nozzle;
a channel opening/closing unit that opens and closes a channel for supplying the processing liquid to the nozzle;
A close signal is output to the flow channel opening/closing unit to perform a closing operation to close the supply flow channel, and the flow channel is measured based on the integrated amount of the flow rate measured by the flow measurement unit after the close signal is output. a control unit that detects an operational abnormality of the opening/closing unit;
a pressure measuring unit provided in an ascending portion of the supply channel downstream of the channel opening/closing unit where the treatment liquid is raised and measuring the hydraulic head pressure of the treatment liquid,
The control unit
A processing apparatus, wherein an operational abnormality of the channel opening/closing unit is detected based on the amount of change in the hydraulic head pressure measured by the pressure measuring unit after outputting the closing signal. The second opening/closing part is
an air operated valve that opens and closes the valve body by air pressure;
an adjusting unit that adjusts the closing speed of the air operated valve to a preset set closing speed,
The control unit
controlling the adjustment unit to change the set closing speed when the integrated amount of the flow rate measured by the flow measurement unit after outputting the closing signal to the second opening/closing unit is out of the normal range. 2. A processing apparatus according to claim 1 . The adjustment unit
a needle valve for adjusting the flow rate of air supplied to the air operated valve;
a drive unit that drives the needle valve,
a storage unit that stores adjustment information that associates an amount of deviation of the integrated amount from a reference value within the normal range with a driving amount of the needle valve,
The control unit
10. The processing apparatus according to claim 9 , wherein the closing speed is changed by controlling the driving unit based on the adjustment information and driving the needle valve by a driving amount corresponding to the deviation amount. . a chamber containing an object to be processed, a nozzle provided in the chamber for supplying a processing liquid toward the object to be processed, a flow rate measuring unit for measuring the flow rate of the processing liquid supplied to the nozzle; A processing apparatus including a channel opening/closing unit for opening/closing a supply channel of the processing liquid to the nozzle is used, and a closing signal is output to the channel opening/closing unit to cause the channel opening/closing unit to perform a closing operation to close the supply channel. and
a step of detecting an operational abnormality of the channel opening/closing unit based on the integrated amount of the flow rate measured by the flow rate measuring unit after outputting the closing signal;
including
The flow path opening/closing part is
a first opening/closing part;
a second opening/closing part provided downstream of the first opening/closing part, opened after the first opening/closing part, and closed before the first opening/closing part;
including
The detecting step includes:
An abnormality detection method , comprising: detecting an operational abnormality of the second opening/closing section based on the integrated amount of the flow rate measured by the flow rate measuring section after outputting the closing signal to the second opening/closing section . A computer-readable storage medium storing a program that operates on a computer and controls a processing device,
A storage medium, wherein the program, when executed, causes a computer to control the processing device so that the anomaly detection method according to claim 11 is performed.

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