JP7194667B2 - Method for producing thermally conductive silicone composite sheet containing reinforcing layer - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet.

Semiconductors such as transistors and diodes used in electronic devices such as converters and power supplies, and LED elements used as light sources for lighting and displays are becoming more sophisticated, faster, smaller, and more highly integrated. Heat is generated, and the temperature rise of the equipment due to the heat causes malfunction and destruction. Therefore, many heat dissipation methods and heat dissipation members used therefor have been proposed to suppress the temperature rise of semiconductors during operation.

Conventionally, in electronic equipment, etc., in order to suppress the temperature rise of the heating element during operation, thermally conductive materials are used for cooling members such as heat sinks and housings that use metal plates with high thermal conductivity such as aluminum and copper. The heat generated from the semiconductor is transmitted through the semiconductor, and the heat is dissipated to the outside due to the temperature difference with the atmosphere. A thermally conductive sheet is often used as the thermally conductive material.

A thermally conductive sheet is obtained by curing and molding a thermally conductive composition obtained by filling a polymer with a thermally conductive filler. Examples of resins used for thermally conductive sheets include acrylic, silicone, and polyolefin. Among them, thermally conductive silicone sheets are often made of silicone from the viewpoint of heat resistance, cold resistance, and long-term reliability.

The reinforcing layer-containing thermally conductive silicone composite sheet consists of a reinforcing layer-containing high hardness thermally conductive silicone layer and a low hardness thermally conductive silicone layer. A generally known manufacturing method is to laminate a low-hardness thermally conductive silicone layer after treating the surface of the silicone layer with a primer or the like (Patent Document 1).

The reinforcing layer-containing high-hardness thermally conductive silicone layer is produced by laminating high-hardness thermally conductive silicone layers on both sides of a reinforcing layer such as a cloth. This is sufficient when the reinforcing layer is a resin film or a metal foil, but in the case of a cloth such as a glass cloth, a filling step is further required to fill the cloth.

As can be seen from this, three steps are required to prepare the reinforcing layer-containing high-hardness thermally conductive silicone layer, including a primer treatment step for improving adhesion and a low-hardness thermally conductive silicone layer lamination step. and 5 steps are required, which is very complicated.

It should be noted that the process shown in this specification refers to the molding process, and does not include detailed work processes that are required during actual manufacturing.

Therefore, a manufacturing method is known in which one side of the high-hardness thermally conductive silicone layer is left uncured and cured at the same time as the low-hardness thermally conductive silicone layer is laminated, thereby ensuring adhesion and omitting the primer treatment step. (Patent Document 2).

However, the production of the reinforcing layer-containing thermally conductive silicone layer still requires at least two steps, and there has been a problem of further shortening the steps.

JP-A-06-155517 Japanese Patent Application No. 2017-197557

As described above, the production of the reinforcing layer-containing thermally conductive silicone composite sheet involves a large number of steps and is extremely complicated.

The present invention has been made to solve the above problems, and while reducing the number of manufacturing steps of a reinforcing layer-containing thermally conductive silicone layer, it is possible to easily and stably combine a reinforcing layer-containing thermally conductive silicone layer with a thermally conductive silicone layer. An object of the present invention is to provide a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet in which conductive silicone layers are laminated in a good adhesion state.

In order to achieve the above objects, the present invention provides a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet, comprising: (1) coating a substrate with a first thermally conductive silicone composition to achieve tack strength; (2 ) On the reinforcing layer-containing thermally conductive silicone layer, a second thermally conductive silicone composition is laminated to form an uncured second thermally conductive silicone layer, and the reinforcing layer-containing thermally conductive silicone layer is formed. and simultaneously curing the second thermally conductive silicone layer.

With such a manufacturing method, the number of steps for manufacturing the reinforcing layer-containing thermally conductive silicone composite sheet can be reduced.

At this time, the thickness of the reinforcing layer-containing thermally conductive silicone layer is 0.05 mm or more and 0.5 mm or less, the hardness of the second thermally conductive silicone layer after curing is 50 or less in Asker C, and the reinforcing layer is The thickness of the contained thermally conductive silicone composite sheet can be 0.2 mm or more and 20 mm or less.

At this time, the first thermally conductive silicone layer after curing of the reinforcing layer-containing thermally conductive composite sheet has a Shore A hardness of 50 or more and 97 or less, and a thickness of 0.05 mm or more and 0.5 mm or less. be able to.

In the present invention, for example, such a reinforcing layer-containing thermally conductive silicone composite sheet can be produced easily and stably.

As described above, according to the method for producing a reinforcing layer-containing thermally conductive silicone composite sheet according to the present invention, the number of steps required for molding can be reduced compared to conventional methods by omitting the primer treatment step and the sealing step. It is possible to provide a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet that can laminate a reinforcing layer-containing thermally conductive silicone layer and a thermally conductive silicone layer in a good adhesion state.

As described above, there has been a demand for manufacturing a reinforcing layer-containing thermally conductive silicone composite sheet with fewer steps.

As a result of extensive studies on the above problem, the present inventors formed a first thermally conductive silicone layer on the film base material, and in an uncured state, crimped and laminated a cloth as a reinforcing layer to reinforce the silicone layer. A layer-containing high-hardness thermally conductive silicone layer is formed, and a low-hardness second thermally conductive silicone layer is laminated on this reinforcing layer, and cured at the same time, resulting in two steps: a cloth filling step and a single-sided coating step. The present inventors have found a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet that eliminates the above, and completed the present invention.

That is, the present invention provides a method for producing a reinforcing layer-containing thermally conductive silicone composite sheet, comprising: (1) applying a first thermally conductive silicone composition to a substrate and obtaining a tack force of 150 gf or more; forming a cured first thermally conductive silicone layer, pressing a cloth against the first thermally conductive silicone layer to form a reinforcing layer-containing thermally conductive silicone layer; (2) reinforcing layer-containing thermally conductive A second thermally conductive silicone composition is laminated on the thermally conductive silicone layer to form an uncured second thermally conductive silicone layer, and a reinforcing layer-containing thermally conductive silicone layer and the second thermally conductive silicone are formed. and curing the layers simultaneously.

The method for producing the reinforcing layer-containing thermally conductive silicone composite sheet of the present invention will be described in detail below, but the present invention is not limited thereto.

<Step (1)>
In the step (1), a first thermally conductive silicone composition is applied onto a substrate to form an uncured first thermally conductive silicone layer having a tack force of 150 gf or more, and the first thermally conductive silicone layer is In this step, a cloth is pressed against the conductive silicone layer to mold the reinforcing layer-containing thermally conductive silicone layer. Details are described below.

[Base material]
The base material for forming the uncured first thermally conductive silicone layer will be described. The base material is not particularly specified, but is preferably heat-resistant to 100° C. or more because heat is applied during the process, and a rigid resin film such as a PET film is preferable. Moreover, the thickness of the base material is preferably 10 μm or more and 100 μm or less in consideration of formability. Within this range, handling becomes easy.

In addition, since the substrate is to be removed at the time of mounting, it must be peeled off from the first thermally conductive silicone layer after curing. It is preferable to add a release agent to the silicone layer. Furthermore, substrates that are as inexpensive as possible are desirable.

[First Thermally Conductive Silicone Layer]
The first thermally conductive silicone composition used for forming the first thermally conductive silicone layer will be described. The first thermally conductive silicone composition is prepared by mixing an organopolysiloxane containing two or more alkenyl groups in one molecule, which is the main component, and components necessary for the curing reaction with, for example, a thermally conductive filler, followed by stirring. obtained by doing The stirring method is not particularly specified, and examples thereof include a kneader and a planetary mixer.

In the case of the addition reaction, the components necessary for the curing reaction are an organohydrogenpolysiloxane having two or more hydrogen atoms directly bonded to silicon in one molecule and a platinum-based catalyst. Moreover, in the case of the curing reaction with an organic peroxide, it is an organic peroxide. The components required for the curing reaction may be used separately or in combination as required.

Additives such as silane coupling agents that improve compatibility with the silicone component may also be added when the thermally conductive filler is added.

The method of applying the first thermally conductive silicone composition to the substrate is not particularly limited. For example, by using a comma coater with a lamination function, it is possible to continuously apply the uncured first thermally conductive silicone layer and laminate (press) the cloth in one step. Alternatively, if necessary, the first thermally conductive silicone composition may be diluted with a solvent and the solvent may be evaporated after coating.

Since the uncured first thermally conductive silicone layer needs to be continuously adhered to the cloth using a laminator, the uncured first thermally conductive silicone layer requires tack strength. . If the tack force is less than 150 gf, sufficient adhesion to the cloth cannot be obtained. Therefore, a tack force of 150 gf or more is required, preferably 300 gf or more. If heat is applied during lamination of the uncured first thermally conductive silicone layer and the cloth, better adhesion can be achieved.

[cross]
The cloth, which is a reinforcing material to be pressed against the uncured first thermally conductive silicone layer, will be described. The cloth is not particularly limited, and examples thereof include nylon cloth and glass cloth, but glass cloth is preferable in consideration of heat resistance. Although there is no particular specification for the opening of the cloth or the weaving method, it is preferable to use yarns of 5 Tex or more and a density of 50 threads/25 mm or more. A sufficient reinforcing effect can be obtained by using such a cloth.

[Reinforcing Layer-Containing Thermally Conductive Silicone Layer]
The reinforcing layer-containing thermally conductive silicone layer is molded by pressing a cloth against the first thermally conductive silicone layer. The form of the reinforcing layer-containing thermally conductive silicone layer is not particularly limited as long as the cloth is in close contact with the first thermally conductive silicone layer.

Examples of the above aspect include (1) a state in which the cloth is not embedded in the first thermally conductive silicone layer at all and is laminated on the surface of the first thermally conductive silicone layer; (3) the cloth is partially embedded in the thermally conductive silicone layer of the first thermally conductive silicone layer, and a portion of the cloth is exposed above the surface of the first thermally conductive silicone layer; It may either be completely embedded and no portion of the cloth is exposed above the surface of the first thermally conductive silicone layer.

No matter which of the above embodiments the reinforcing layer-containing thermally conductive silicone layer is used, the cloth filling step is unnecessary. In the case of the above aspect (1), the cross-streaks are filled with the second thermally conductive silicone composition described later. In the case of the above aspect (3), the first thermally conductive silicone layer fills the crossed lines. In the aspect (2) above, the cross stitches are filled by the actions of both aspects (1) and (3).

In the present invention, in the case of the above aspects (1) and (2), the thickness of the reinforcing layer-containing thermally conductive silicone layer is the thickness of the first thermally conductive silicone layer and the thickness of the laminated cloth or cloth. It is the sum of the thicknesses of the exposed portions, and in the case of mode (3) above, the thickness of the reinforcing layer-containing thermally conductive silicone layer is the same as the thickness of the first thermally conductive silicone layer.

<Step (2)>
In the step (2), a second thermally conductive silicone composition is laminated on the reinforcing layer-containing thermally conductive silicone layer to form an uncured second thermally conductive silicone layer, and the reinforcing layer-containing thermally conductive silicone layer is formed. A step of simultaneously curing the thermally conductive silicone layer and the second thermally conductive silicone layer. Details are described below.

[Second Thermally Conductive Silicone Layer]
The second thermally conductive silicone composition used for forming the second thermally conductive silicone layer will be described. The second thermally conductive silicone composition is prepared by mixing an organopolysiloxane containing two or more alkenyl groups in one molecule, which is the main component, and components necessary for the curing reaction with, for example, a thermally conductive filler, Obtained by stirring. The stirring method is not particularly specified, and examples thereof include a kneader and a planetary mixer.

In the case of the addition reaction, the components necessary for the curing reaction are an organohydrogenpolysiloxane having two or more hydrogen atoms directly bonded to silicon in one molecule and a platinum-based catalyst. Moreover, in the case of the curing reaction with an organic peroxide, it is an organic peroxide. The components required for the curing reaction may be used separately or in combination as required.

Additives such as silane coupling agents that improve compatibility with the silicone component may also be added when the thermally conductive filler is added.

The method for laminating the second thermally conductive silicone layer on the reinforcing layer-containing thermally conductive silicone layer is not particularly specified, but may be coating or press molding. Since the first thermally conductive silicone layer is uncured, the second thermally conductive silicone layer can ensure good adhesion without using a primer treatment.

The method for curing the reinforcing layer-containing thermally conductive silicone layer and the second thermally conductive silicone layer at the same time is not particularly limited. When the silicone layer is laminated, the reinforcing layer-containing thermally conductive silicone layer and the second thermally conductive silicone layer can be cured simultaneously with the lamination. Moreover, when laminating|stacking by coating, it can harden|cure by heating separately.

<Reinforcing Layer-Containing Thermally Conductive Silicone Composite Sheet>
Further, in the present invention, the thickness of the reinforcing layer-containing thermally conductive silicone layer is set to 0.05 mm or more and 0.5 mm or less, the hardness after curing of the second thermally conductive silicone layer is set to 50 or less in Asker C, and the The thickness of the reinforcing layer-containing thermally conductive silicone composite sheet can be 0.2 mm or more and 20 mm or less.

Further, in the present invention, the first thermally conductive silicone layer after curing of the reinforcing layer-containing thermally conductive composite sheet has a Shore A hardness of 50 or more and 97 or less, and a thickness of 0.05 mm or more and 0.5 mm or less. can be

In the present invention, for example, such a reinforcing layer-containing thermally conductive silicone composite sheet can be produced easily and stably.

As described above, according to the method for producing a reinforcing layer-containing thermally conductive silicone composite sheet of the present invention, the number of production steps is reduced, and the reinforcing layer-containing thermally conductive silicone layer and the thermally conductive silicone layer are in good adhesion. It becomes possible to stack them.

EXAMPLES The present invention will be specifically described below using Examples and Comparative Examples, but the present invention is not limited to these.

A method for producing a reinforcing layer-containing thermally conductive silicone composite sheet will be described below for carrying out Examples and Comparative Examples.

<Preparation of Compositions 1-A to 1-E and 2-A to 2-C>
The first thermally conductive silicone composition and the second thermally conductive silicone composition were prepared using the following components a to f and component a according to the formulations shown in Tables 1 and 2, respectively. Furthermore, Tables 1 and 2 also show the physical properties of the resulting thermally conductive silicone composition.

[component a]
Component (a-1): A dimethylpolysiloxane having an average degree of polymerization of 8000 and having both ends blocked with dimethylvinyl groups, represented by formula (1).
Component (a-2): A dimethylpolysiloxane having an average degree of polymerization of 1000 and having both ends blocked with dimethylvinyl groups, represented by formula (1).

[Component b]
Organohydrogenpolysiloxane represented by formula (2).

[Component c]
A dimethylpolysiloxane having an average degree of polymerization of 30 represented by the formula (3) and having one end blocked with a trimethylsilyl group.

[d component]
5% chloroplatinic acid 2-ethylhexanol solution.

[Component e]
Ethynylmethylidene carbinol as an addition reaction control agent.

[f component]
2-methyldibenzoyl peroxide as peroxide.

[Component A]: Thermally conductive filler (A-1) Component: Aluminum hydroxide with an average particle size of 1 μm.
(a-2) Component: Aluminum hydroxide with an average particle size of 10 µm.
(a-3) Component: Alumina with an average particle size of 1 μm.
(a-4) Component: Alumina with an average particle size of 10 μm.
(a-5) Component: Alumina with an average particle size of 40 μm.

[Tack force]
It was measured using a tackiness tester.

[Thermal conductivity]
The resulting composition was molded into a size of 60 mm×60 mm×6 mmt and measured using a TPA manufactured by Kyoto Denshi Co., Ltd.

Compositions 1-A, 1-B, 1-D, 1-E and 2-C were kneaded using a kneader. Compositions 1-C, 2-A and 2-B were kneaded using a planetary mixer.

<Examples 1 to 5, Comparative Examples 1 to 3>
A reinforcing layer-containing thermally conductive silicone composite sheet was prepared as described below.

[cross]
The cloth for molding the reinforcing layer-containing thermally conductive silicone layer was a glass cloth having a thickness of 40 μm, 5.6 Tex threads, and 50 vertical and horizontal threads/25 mm.

The reinforcing layer-containing thermally conductive silicone layer obtained by press-bonding the glass cloth and the first thermally conductive silicone layer was molded using a comma meter with a laminating function. The comma coater with a laminating function was manufactured by Technosmart, and had an effective coating width of 500 mm, an oven length of 2 m×4 zones, and a laminator attached to the latter stage of the oven.

[Number of processes]
It should be noted that the number of processes evaluated in the present examples and comparative examples is the molding process, and does not include detailed processes involved in actual manufacturing.

(Example 1)
30% xylene was added to composition 1-A and further kneaded to obtain a coating liquid. Using a 50 μm thick fluorine-treated PET film FL1-01 (manufactured by Takaline Corporation) as a base material, the coating solution is continuously applied using a comma coater with a laminating function, and the xylene is volatilized through an oven. A glass cloth was adhered to the obtained uncured first thermally conductive silicone layer using a laminator at a pressure of 0.1 MPa to obtain a reinforcing layer-containing thermally conductive silicone layer in one step. The coating conditions are a coating speed of 1 m/min, an oven temperature of 80° C., and a lamination pressure of 0.1 MPa. Composition 2-A was laminated on the obtained reinforcing layer-containing thermally conductive silicone layer using press molding at 120° C./10 min to form a reinforcing layer-containing thermally conductive silicone layer and a second thermally conductive silicone. A thermally conductive silicone composite sheet containing a reinforcing layer was obtained by simultaneously curing the layers. Two molding steps were required to obtain this reinforcing layer-containing thermally conductive silicone composite sheet.

(Example 2)
A reinforcing layer-containing thermally conductive silicone layer was obtained in one step in the same manner as in Example 1, and composition 2-C was press-molded at 120° C./10 min on the obtained reinforcing layer-containing thermally conductive silicone layer. was used to simultaneously cure the reinforcing layer-containing thermally conductive silicone layer and the second thermally conductive silicone layer to obtain a reinforcing layer-containing thermally conductive silicone composite sheet. There are two molding steps involved in obtaining this reinforcing layer-containing thermally conductive silicone composite sheet.

(Example 3)
40% of xylene was added to composition 1-B and further kneaded to obtain a coating liquid. Using a 50 μm fluorine-treated PET film FL1-01 (manufactured by Takaline Corporation) as a base material, the coating solution is continuously applied using a comma coater with a laminating function, and the xylene is passed through an oven to evaporate. A glass cloth was adhered to the uncured first thermally conductive silicone layer obtained using a laminator at a pressure of 0.1 MPa to obtain a reinforcing layer-containing thermally conductive silicone layer in one step. The coating conditions were a coating speed of 1 m/min, an oven temperature of 80° C., and a lamination pressure of 0.1 MPa. Composition 2-B was laminated on the obtained reinforcing layer-containing thermally conductive silicone layer using press molding at 120° C./10 min to form a reinforcing layer-containing thermally conductive silicone layer and a second thermally conductive silicone. A thermally conductive silicone composite sheet containing a reinforcing layer was obtained by simultaneously curing the layers. Two molding steps were required to obtain this reinforcing layer-containing thermally conductive silicone composite sheet.

(Example 4)
5% xylene was added to composition 1-C and further kneaded to obtain a coating liquid. Using a 50 μm thick fluorine-treated PET film FL1-01 (manufactured by Takaline Corporation) as a base material, the coating liquid is continuously applied using a comma coater with a laminating function, and the xylene is volatilized through an oven. A glass cloth was adhered to the uncured first thermally conductive silicone layer using a laminator to obtain a reinforcing layer-containing thermally conductive silicone layer in one step. The coating conditions are a coating speed of 1 m/min, an oven temperature of 80° C., and a lamination pressure of 0.05 MPa. The composition 2-A is laminated on the obtained thermally conductive silicone layer containing the reinforcing layer by press molding, and the thermally conductive silicone layer containing the reinforcing layer and the second thermally conductive silicone layer are simultaneously cured. A thermally conductive silicone composite sheet containing a reinforcing layer was obtained. Two molding steps were required to obtain this reinforcing layer-containing thermally conductive silicone composite sheet.

(Example 5)
30% xylene was added to composition 1-D and further kneaded to obtain a coating liquid. Using a 50 μm thick fluorine-treated PET film FL1-01 (manufactured by Takaline Corporation) as a base material, the coating liquid is continuously applied using a comma coater with a laminating function, and the xylene is volatilized through an oven. A glass cloth was adhered to the uncured first thermally conductive silicone layer using a laminator at a pressure of 0.1 MPa to obtain a reinforcing layer-containing thermally conductive silicone layer in one step. The coating conditions were a coating speed of 1 m/min, an oven temperature of 80° C., and a lamination pressure of 0.1 MPa. The composition 2-A was laminated on the obtained reinforcing layer-containing thermally conductive silicone layer using press molding, and the reinforcing layer-containing thermally conductive silicone layer and the second thermally conductive silicone layer 2 were formed at the same time. By curing, a thermally conductive silicone composite sheet containing a reinforcing layer was obtained. Two molding steps were required to obtain this reinforcing layer-containing thermally conductive silicone composite sheet.

Table 3 summarizes the results of Examples 1-5.

(Comparative example 1)
A glass cloth filling solution was obtained by adding 80% xylene to composition 1-A. The filling solution is transferred to a container, and the glass cloth is immersed therein to impregnate the glass cloth with the filling solution. After the cloth was sufficiently impregnated, the glass cloth was continuously pulled up to remove the excess sealing liquid adhering to the cloth, and then put into an oven, dried and cured to obtain a sealing glass cloth of 0.09 mm. A filling glass cloth was used as a base material, and a coating solution containing 30% xylene of Composition 1-A was continuously coated using a comma coater with a lamination function. The oven temperature was 80°C/80°C/150°C/150°C and the coating speed was 0.5 m/min. Further, the opposite side of the sealing glass cloth was coated, dried and cured under the same conditions to obtain a reinforcing layer-containing thermally conductive silicone composite sheet corresponding to Example 2 with a total thickness of 0.2 mm. Three molding steps were required to obtain this reinforcing layer-containing thermally conductive silicone composite sheet.

(Comparative example 2)
30% xylene was added to composition 1-E and further kneaded to obtain a coating liquid. Using a 50 μm thick fluorine-treated PET film FL1-01 (manufactured by Takaline Corporation) as a base material, the coating liquid is continuously applied using a comma coater with a laminating function, and the xylene is volatilized through an oven. An attempt was made to adhere a glass cloth to the resulting uncured first thermally conductive silicone layer using a laminator at a pressure of 0.1 MPa, but the uncured first thermally conductive silicone layer failed to adhere. Due to insufficient tack strength, the glass cloth did not adhere well and molding was not possible.

(Comparative Example 3)
A 1% toluene solution of the component (b) organohydrogenpolysiloxane (o=0, p=38) was applied to one side of the reinforcing layer-containing thermally conductive silicone composite sheet obtained in Comparative Example 1 using a gravure coater. and dried to obtain a reinforcing layer-containing thermally conductive silicone layer treated with organohydrogenpolysiloxane, composition 2-A was laminated to a thickness of 0.8 mm on the treated surface, press-molded, A reinforcing layer-containing thermally conductive silicone composite sheet corresponding to Example 1 with a total thickness of 2.0 mm was obtained. There are five molding steps involved in obtaining this reinforcing layer-containing thermally conductive silicone composite sheet.

Table 4 summarizes the total thickness and the number of steps, which are the results of Comparative Examples 1 to 3.

As can be seen from Tables 3 and 4, in Examples 1 to 5 using the method for producing a reinforcing layer-containing thermally conductive silicone composite sheet according to the present invention, a reinforcing layer-containing thermally conductive silicone composite sheet with good adhesion was obtained in two steps. A silicone composite sheet is obtained, and the filling process and the primer treatment process are unnecessary, so the number of processes is greatly reduced compared to Comparative Examples 1 to 3, which are conventional manufacturing methods.

On the other hand, in Comparative Example 1, three steps were required because a filling step was required. In Comparative Example 2, the tackiness of the first thermally conductive silicone composition was insufficient, so that it could not be brought into close contact with the glass cloth, and the reinforcing layer-containing thermally conductive silicone layer could not be formed. In Comparative Example 3, in addition to Comparative Example 1, an organohydrogenpolysiloxane treatment step and a press molding step were added, and the number of steps was five.

As described above, according to the method for producing a reinforcing layer-containing thermally conductive silicone composite sheet of the present invention, the reinforcing layer-containing thermally conductive silicone composite sheet can be produced easily and stably while greatly reducing the number of steps. can be manufactured.

It should be noted that the present invention is not limited to the above embodiments. The above-described embodiment is an example, and any device having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect is the present invention. included in the technical scope of

Claims (3)

A method for producing a reinforcing layer-containing thermally conductive silicone composite sheet, comprising:
(1) Coating a first thermally conductive silicone composition on a substrate to form an uncured first thermally conductive silicone layer having a tack force of 150 gf or more, and forming the first thermally conductive silicone layer. A step of crimping a cloth to mold a reinforcing layer-containing thermally conductive silicone layer;
(2) laminating a second thermally conductive silicone composition on the reinforcing layer-containing thermally conductive silicone layer to form an uncured second thermally conductive silicone layer; simultaneously curing the silicone layer and the second thermally conductive silicone layer;
A method for producing a reinforcing layer-containing thermally conductive silicone composite sheet, comprising: The thickness of the reinforcing layer-containing thermally conductive silicone layer is 0.05 mm or more and 0.5 mm or less, the hardness of the second thermally conductive silicone layer after curing is 50 or less in Asker C, and the reinforcing layer-containing thermally conductive 2. The method for producing a thermally conductive silicone composite sheet according to claim 1, wherein the thickness of the thermally conductive silicone composite sheet is 0.2 mm or more and 20 mm or less. The hardness of the first thermally conductive silicone layer after curing of the reinforcing layer-containing thermally conductive silicone composite sheet is 50 or more and 97 or less Shore A, and the thickness is 0.05 mm or more and 0.5 mm or less. 3. The method for producing a reinforcing layer-containing thermally conductive silicone composite sheet according to claim 1 or 2.