JP7191282B1 - レーザ加工装置、制御装置、レーザ加工システム、およびレーザ加工方法 - Google Patents

レーザ加工装置、制御装置、レーザ加工システム、およびレーザ加工方法 Download PDF

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Publication number
JP7191282B1
JP7191282B1 JP2022560068A JP2022560068A JP7191282B1 JP 7191282 B1 JP7191282 B1 JP 7191282B1 JP 2022560068 A JP2022560068 A JP 2022560068A JP 2022560068 A JP2022560068 A JP 2022560068A JP 7191282 B1 JP7191282 B1 JP 7191282B1
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Prior art keywords
processing
temperature
laser
optical component
unit
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JP2022560068A
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Japanese (ja)
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JPWO2023199409A1 (https=
JPWO2023199409A5 (https=
Inventor
恭平 石川
健太 藤井
宏樹 村岡
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2022560068A 2022-04-12 2022-04-12 レーザ加工装置、制御装置、レーザ加工システム、およびレーザ加工方法 Active JP7191282B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017619 WO2023199409A1 (ja) 2022-04-12 2022-04-12 レーザ加工装置、制御装置、レーザ加工システム、およびレーザ加工方法

Publications (3)

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JP7191282B1 true JP7191282B1 (ja) 2022-12-16
JPWO2023199409A1 JPWO2023199409A1 (https=) 2023-10-19
JPWO2023199409A5 JPWO2023199409A5 (https=) 2024-03-22

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JP2022560068A Active JP7191282B1 (ja) 2022-04-12 2022-04-12 レーザ加工装置、制御装置、レーザ加工システム、およびレーザ加工方法

Country Status (5)

Country Link
US (1) US20250326049A1 (https=)
JP (1) JP7191282B1 (https=)
CN (1) CN118984752A (https=)
DE (1) DE112022007031T5 (https=)
WO (1) WO2023199409A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024176594A1 (ja) * 2023-02-24 2024-08-29 株式会社Ｓｃｒｅｅｎホールディングス 推定方法、制御方法および制御装置
WO2024240414A1 (de) * 2023-05-22 2024-11-28 Precitec Gmbh & Co. Kg Laserbearbeitungssystem und verfahren zum betreiben eines laserbearbeitungssystems

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119009633B (zh) * 2024-10-18 2025-01-10 河北大学 一种激光功率密度调节装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006088163A (ja) * 2004-09-21 2006-04-06 Fanuc Ltd レーザ装置
JP2020175425A (ja) * 2019-04-19 2020-10-29 ファナック株式会社 レーザ加工機の焦点位置ずれを学習する機械学習装置及び機械学習方法、並びに焦点位置ずれを補正するレーザ加工システム
WO2022044209A1 (ja) * 2020-08-27 2022-03-03 三菱電機株式会社 レーザ加工装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094173A (ja) 1998-09-18 2000-04-04 Nippei Toyama Corp レーザ加工機におけるレーザビームの焦点位置調節装置及び調節方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006088163A (ja) * 2004-09-21 2006-04-06 Fanuc Ltd レーザ装置
JP2020175425A (ja) * 2019-04-19 2020-10-29 ファナック株式会社 レーザ加工機の焦点位置ずれを学習する機械学習装置及び機械学習方法、並びに焦点位置ずれを補正するレーザ加工システム
WO2022044209A1 (ja) * 2020-08-27 2022-03-03 三菱電機株式会社 レーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024176594A1 (ja) * 2023-02-24 2024-08-29 株式会社Ｓｃｒｅｅｎホールディングス 推定方法、制御方法および制御装置
WO2024240414A1 (de) * 2023-05-22 2024-11-28 Precitec Gmbh & Co. Kg Laserbearbeitungssystem und verfahren zum betreiben eines laserbearbeitungssystems

Also Published As

Publication number Publication date
DE112022007031T5 (de) 2025-02-20
JPWO2023199409A1 (https=) 2023-10-19
WO2023199409A1 (ja) 2023-10-19
CN118984752A (zh) 2024-11-19
US20250326049A1 (en) 2025-10-23

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