JP7183526B2 - 静電チャック及び半導体製造装置 - Google Patents

静電チャック及び半導体製造装置 Download PDF

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Publication number
JP7183526B2
JP7183526B2 JP2021050164A JP2021050164A JP7183526B2 JP 7183526 B2 JP7183526 B2 JP 7183526B2 JP 2021050164 A JP2021050164 A JP 2021050164A JP 2021050164 A JP2021050164 A JP 2021050164A JP 7183526 B2 JP7183526 B2 JP 7183526B2
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Japan
Prior art keywords
sub
heater element
heater
main
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021050164A
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English (en)
Japanese (ja)
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JP2022055292A (ja
Inventor
瑛人 小野
淳平 上藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to US17/469,159 priority Critical patent/US11756820B2/en
Priority to TW110134825A priority patent/TWI813021B/zh
Priority to CN202111108532.3A priority patent/CN114284197A/zh
Priority to KR1020210126909A priority patent/KR102559429B1/ko
Publication of JP2022055292A publication Critical patent/JP2022055292A/ja
Priority to JP2022185416A priority patent/JP7720024B2/ja
Application granted granted Critical
Publication of JP7183526B2 publication Critical patent/JP7183526B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/008—Heaters using a particular layout for the resistive material or resistive elements with layout including a portion free of resistive material, e.g. communication window
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2021050164A 2020-09-28 2021-03-24 静電チャック及び半導体製造装置 Active JP7183526B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US17/469,159 US11756820B2 (en) 2020-09-28 2021-09-08 Electrostatic chuck and semiconductor manufacturing apparatus
TW110134825A TWI813021B (zh) 2020-09-28 2021-09-17 靜電吸盤及半導體製造裝置
CN202111108532.3A CN114284197A (zh) 2020-09-28 2021-09-22 静电吸盘以及半导体制造装置
KR1020210126909A KR102559429B1 (ko) 2020-09-28 2021-09-27 정전척 및 반도체 제조 장치
JP2022185416A JP7720024B2 (ja) 2020-09-28 2022-11-21 静電チャック及び半導体製造装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020162186 2020-09-28
JP2020162186 2020-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022185416A Division JP7720024B2 (ja) 2020-09-28 2022-11-21 静電チャック及び半導体製造装置

Publications (2)

Publication Number Publication Date
JP2022055292A JP2022055292A (ja) 2022-04-07
JP7183526B2 true JP7183526B2 (ja) 2022-12-06

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JP2021050164A Active JP7183526B2 (ja) 2020-09-28 2021-03-24 静電チャック及び半導体製造装置
JP2022185416A Active JP7720024B2 (ja) 2020-09-28 2022-11-21 静電チャック及び半導体製造装置

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250118541A1 (en) * 2022-06-23 2025-04-10 Hitachi High-Tech Corporation Plasma processing apparatus
JP7845145B2 (ja) * 2022-11-07 2026-04-14 東京エレクトロン株式会社 基板を処理する装置、及び基板を処理する方法
US20250232962A1 (en) * 2023-03-27 2025-07-17 Hitachi High-Tech Corporation Plasma processing apparatus
JP2026001281A (ja) 2024-06-19 2026-01-07 Toto株式会社 静電チャック
JP2026026648A (ja) * 2024-08-05 2026-02-18 Toto株式会社 静電チャック

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329567A (ja) 2001-05-02 2002-11-15 Ibiden Co Ltd セラミック基板および接合体の製造方法
JP2016207777A (ja) 2015-04-20 2016-12-08 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
JP2017201669A (ja) 2016-05-06 2017-11-09 日本特殊陶業株式会社 加熱部材及び静電チャック
JP2018022871A (ja) 2016-07-20 2018-02-08 Toto株式会社 静電チャック
JP2018120910A (ja) 2017-01-24 2018-08-02 日本特殊陶業株式会社 保持装置
JP2018142488A (ja) 2017-02-28 2018-09-13 日本特殊陶業株式会社 セラミックヒータ
JP2018170508A (ja) 2017-03-29 2018-11-01 Toto株式会社 静電チャック

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016005A (ja) * 2000-06-29 2002-01-18 Sumitomo Electric Ind Ltd 半導体製造装置用電極端子接合セラミックス部材及びその製造方法
JP4877742B2 (ja) * 2006-02-27 2012-02-15 日本碍子株式会社 加熱処理装置
JP2011054838A (ja) * 2009-09-03 2011-03-17 Tokyo Electron Ltd 載置台構造及び処理装置
JP6059512B2 (ja) * 2012-11-14 2017-01-11 株式会社ブリヂストン ヒータユニット
JP2018056333A (ja) * 2016-09-29 2018-04-05 日本発條株式会社 基板載置台、および基板載置台の作製方法
KR102557006B1 (ko) * 2019-01-16 2023-07-19 주식회사 미코세라믹스 세라믹 히터

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329567A (ja) 2001-05-02 2002-11-15 Ibiden Co Ltd セラミック基板および接合体の製造方法
JP2016207777A (ja) 2015-04-20 2016-12-08 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
JP2017201669A (ja) 2016-05-06 2017-11-09 日本特殊陶業株式会社 加熱部材及び静電チャック
JP2018022871A (ja) 2016-07-20 2018-02-08 Toto株式会社 静電チャック
JP2018120910A (ja) 2017-01-24 2018-08-02 日本特殊陶業株式会社 保持装置
JP2018142488A (ja) 2017-02-28 2018-09-13 日本特殊陶業株式会社 セラミックヒータ
JP2018170508A (ja) 2017-03-29 2018-11-01 Toto株式会社 静電チャック

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JP7720024B2 (ja) 2025-08-07
JP2023024443A (ja) 2023-02-16
JP2022055292A (ja) 2022-04-07

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