JP7174374B2 - Repair method for floating parts of walls, etc., and reinforcement pin fixing method - Google Patents

Description

The present invention provides a method of repairing a floating portion by injecting an adhesive into the floating portion for the purpose of preventing the floating portion from peeling off or peeling off when the floating portion occurs on the inner wall or the floor of a building, The present invention relates to a method of fixing reinforcing pins to inner and outer walls or floors of a building. In particular, in repairing structures, etc., a new curable composition is used that has appropriate strength, flexibility, and workability, and that after curing, has both strength and flexibility corresponding to the expansion and contraction of the building concrete. The present invention relates to a floating part repair method and a reinforcing pin fixing method.

Floating portions may occur on the inner and outer walls or floors of buildings over the course of construction years, and if left unattended, problems such as peeling and peeling of the floating portions may occur.

For example, a tiled exterior wall, in which multiple tiles are attached to the exterior wall of a building with an adhesive or the like, and joints are formed in the gaps between adjacent tiles, may float over time after construction. may occur.

In the case of a tiled exterior wall in which tiles are attached to finish the exterior wall of an architectural/civil engineering structure, the tiles are mostly attached using polymer cement mortar as an adhesive. After finishing such tiling, peeling (floating) of the tiles may occur due to factors such as the materials used, construction, environment, and aging.

If such a floating (peeling) state is left unattended, the pasted tiles may fall off the wall, sometimes leading to an accident.

As a method for repairing floating portions such as walls, an anchor pinning portion epoxy resin injection method (Non-Patent Document 1) is known. This anchor pinning portion epoxy resin injection method is a method of fixing the floating portion to the structural concrete with a fully threaded anchor pin and epoxy resin. Anchor pins should be stainless steel SUS304, round bars with a nominal diameter of 4 mm and fully threaded, and epoxy resin should be a hard/high viscosity injection epoxy resin (JIS A6024) for building repair and building reinforcement. It has become. The applicant of the present application has also proposed a construction method for repairing a floating portion of a wall or the like and a reinforcing pin fixing method (Patent Documents 1 and 2).

The method of repairing floating parts such as walls and the method of fixing reinforcing pins proposed by the applicant of the present application prevent the risk of joint failure due to the swelling pressure at the time of epoxy resin injection, and suppress the swelling due to the injection pressure. It is possible to spread the resin from one place to a large area, and it can be applied to all direct tiles, and the epoxy resin can be reliably applied without changing the design of the tiled outer wall finished by the direct tile pressure bonding method. It is a reinforcing pin fixing method that can be repaired by injection and that can prevent the epoxy resin from leaking out from the pin insertion hole.

JP 2012-184554 A JP 2016-199950 A JP-A-5-10039

Ministry of Land, Infrastructure, Transport and Tourism, Ministry of Land, Infrastructure, Transport and Tourism, Ministry of Land, Infrastructure, Transport and Tourism, Ministry of Land, Infrastructure, Transport and Tourism Public Building Renovation Work Standard Specifications (Architectural Work) 2010 Edition Building Conservation Center

Conventionally, the repair site is treated with epoxy resin (a), ketimine (b) having a functional group represented by R ¹ R ² (C=N)-, modified silicone resin (c), modified silicone resin catalyst (d), and a silane compound (e), having a viscosity of 50 to 20,000 poise (20° C.) and an elongation after curing of 20 to 400%, and a float to be repaired using an anchor pin. A repair method is known (see Patent Document 3, for example). However, R ¹ and R ² are each independently selected from a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and a phenyl group. According to the construction method described in Patent Literature 3, since the epoxy resin composition is a one-liquid type, working efficiency can be improved.

Concrete structures such as walls and pillars, and mortar and tiles adhered to the surface of the building frame are exposed to severe external environments such as temperature differences, rainwater, and sunlight, so damage (for example, cracks, floats, etc.) ), it is desired to use a curable composition that not only can be easily injected into the concrete, but also has strength and flexibility corresponding to the expansion and contraction of concrete after curing. However, in the construction method described in Patent Document 3, although a resin composition with a specified viscosity at 20 ° C. is disclosed, the strength and flexibility of the cured product obtained by curing the curable composition are compatible. is not always possible, and further studies may be required for practical use.

The purpose of the present invention is to propose an improved method for repairing floating portions of walls and the like, and a method for fixing reinforcing pins, proposed by the applicant of the present application. We propose a floating part repair method and a reinforcement pin fixing method using a new hardening composition that has both flexibility and workability, and has both strength and flexibility to cope with the expansion and contraction of the concrete after hardening. The purpose is to

[1]
A method for repairing a floating portion of a wall, etc., which is a tile that is a floating portion of a tiled outer wall finished by a tile direct adhesion pressure bonding method,
drilling a pin insertion hole for inserting a pin in the joint between the adjacent tiles in the floating portion;
filling the pin insertion holes with a curable composition while pressing the tiles in the floating portion from the outside toward the inside of the outer wall using a holding jig;
A reinforcing pin driving step of driving a metal reinforcing pin into the pin insertion hole after the curable composition is filled, with the tip of the reinforcing pin leading;
curing until the curable composition is cured, wherein the curable composition is
A two-component curable resin composition that cures by mixing component A and component B, wherein component A contains an epoxy resin, component B contains a tertiary amine, and a crosslinkable silicon group-containing organic A polymer, a filler, a diluent, a silane coupling agent, and a catalyst are contained in either or both of the liquid A and the liquid B, and an epoxy resin is added to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. , 10 parts by weight or more and 100 parts by weight or less, and a tertiary amine of 0.2 parts by weight or more and 30 parts by weight or less per 100 parts by weight of the epoxy resin. Floating part repair method.

[2]
The reinforcing pin driving process is
The reinforcing pin has a large-diameter portion on the head opposite to the tip, and the outer diameter (D) of the large-diameter portion is larger than the inner diameter of the pin insertion hole, and the pin insertion hole is formed. smaller than the width between the adjacent tiles of the joint,
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
The length (H) of the reinforcing pin from the top of the head to the tip is shorter than the depth of the pin insertion hole,
A step of driving the reinforcing pin into the pin insertion hole after filling the curable composition with the tip as the top until the apex of the head is embedded in the joint between the adjacent tiles [1]. A repair method for floating parts such as walls.

[3]
A pin insertion hole for inserting a pin was bored in the joint between the adjacent tiles in the tiled outer wall finished by the direct bonding method of tiles, and the pin insertion hole was filled with a curable composition. After that, a metal reinforcing pin is driven into the joint between the adjacent tiles until the apex of the head opposite to the tip of the reinforcing pin is embedded in the hardening A reinforcing pin fixing method for fixing the reinforcing pin by curing a composition,
The curable composition is
A two-part curable resin composition that cures by mixing A and B liquids, wherein A liquid contains an epoxy resin, B liquid contains a tertiary amine, and a crosslinkable silicon group-containing organic A polymer, a filler, a diluent, a silane coupling agent, and a catalyst are contained in either or both of the liquid A and the liquid B, and an epoxy resin is added to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. , 10 parts by weight or more and 100 parts by weight or less, and a tertiary amine of 0.2 parts by weight or more and 30 parts by weight or less per 100 parts by weight of the epoxy resin. Construction method.

[4]
The reinforcing pin has a large diameter portion in the head portion, the outer diameter (D) of the large diameter portion being larger than the inner diameter of the pin insertion hole, and the joint portion having the pin insertion hole. less than the width between adjacent said tiles;
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
The reinforcing pin fixing method according to [3], wherein the length (H) of the reinforcing pin from the top of the head to the tip is shorter than the depth of the pin insertion hole.

According to this invention, in repairing structures, etc., a novel curable composition that has appropriate strength, flexibility, and workability, and that after curing has both strength and flexibility corresponding to the expansion and contraction of the concrete structure. It is possible to provide a floating portion repair method using an object and a reinforcing pin fixing method.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view for explaining an example of a holding jig used in a method for repairing a floating portion such as a wall proposed by the present invention; FIG. 2 is a plan view of the jig shown in FIG. 1; 2A is a sectional view taken along line AA of FIG. 2, FIG. 2B is a sectional view taken along line BB, and FIG. 4C is a sectional view taken along line CC. FIG. 4 is a perspective view illustrating another example of a holding jig used in the method of repairing floating portions such as walls proposed by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially omitted perspective view for explaining an example of a tiled outer wall to which the method of repairing a floating portion of a wall or the like proposed by the present invention and the method of fixing reinforcing pins are applied. The top view of the tiled outer wall of FIG. 5 illustration. FIG. 7 is a plan view showing a state in which two jig holding anchor holes and one pin insertion hole are bored in the tiled outer wall shown in FIGS. 5 and 6 ; FIG. 8 is a partially omitted plan view for explaining a state in which a pressing jig is brought into contact with the tiled outer wall in the state shown in FIG. 7 ; Next to the state shown in FIG. 8, the jig holding anchor is screwed into the tiled outer wall through the jig holding anchor insertion hole provided in the holding jig and fixed, and the holding jig is fixed to the tiled outer wall. Plan view for explanation. FIG. 9 is a view for explaining the state of filling the curable composition into the pin insertion holes formed in the tiled outer wall in the state shown in FIG. 7 after the state shown in FIG. 9; FIG. 11 is a plan view for explaining a state in which reinforcing pins are driven into pin insertion holes in a pinning step subsequent to the state shown in FIG. 10 ; After the process shown in FIG. 11, one of the jig holding anchors was removed, the jig was rotated 180 degrees with the position of the other jig holding anchor as a fulcrum, and the holding jig was moved to the next adjacent repair position. The top view explaining a state. The top view of the tiled outer wall which completed the repair process and the reinforcement pin fixing process. FIG. 2 is a conceptual diagram illustrating an example of a reinforcing pin used in the floating portion repairing method and the reinforcing pin fixing method of the present invention, where (a) is a side view and (b) is a perspective view from above. FIG. 8 is a view corresponding to FIG. 7 and a cross-sectional view with a part of the state in which a pin insertion hole is formed; FIG. 11 is a view corresponding to FIG. 10 and a cross-sectional view with a part omitted showing a state in which the pin insertion hole is filled with the curable composition; FIG. 12 is a view corresponding to FIG. 11 and is a partially omitted cross-sectional view showing a state in which the reinforcing pin shown in FIG. 14 is driven into the pin insertion hole in the pinning process; FIG. 14 is a view corresponding to FIG. 13, and is a partially omitted cross-sectional view showing a state in which the step of repairing the floating portion using the reinforcing pin shown in FIG. 14 and the step of fixing the reinforcing pin are completed; FIG. 10 is a flow chart explaining the process when the method of the present invention is applied to the anchor pinning part epoxy resin injection method applied to repair the float on the tiled outer wall.

<Embodiment of curable composition>
The curable composition used in this embodiment will be described.

Concrete structures such as walls and pillars, as well as mortar and tiles adhered to the building frame, are subject to deterioration and damage due to various external factors (e.g. temperature difference, rainwater, sunlight irradiation, etc.). . Therefore, it is required to repair the deterioration and damage. Examples of such repair methods include a method of injecting liquid epoxy resin using a special injection tool for cracks, and an anchor method for floating tiles. A method such as driving a pin into the building concrete and fixing it with epoxy resin is adopted. However, since the hardness of epoxy resin is usually high, it may not be able to follow the expansion and contraction of concrete due to the temperature difference, etc., and it is required that the curable composition used for repair exhibits flexibility.

Therefore, the inventors of the present invention have investigated to make the cured product of the curable composition have both a predetermined strength and a predetermined flexibility. By setting the ratio to a predetermined ratio, adopting a tertiary amine as the amine contained in the B liquid, and setting the ratio of the tertiary amine to the epoxy resin to a predetermined ratio, the cured product has a predetermined strength and a predetermined flexibility. I found out that it can be combined. The specified strength is the strength in accordance with the JIS standard for tiles (organic adhesive for exterior tiling: JIS A5557), and the specified flexibility is the JIS standard for repair by injection (epoxy for building repair and building reinforcement). Resin: Flexibility conforming to JIS A6024).

Specifically, the two-component curable resin composition according to the present invention is a two-component curable resin composition that cures by mixing A liquid and B liquid. Liquid A contains an epoxy resin, and liquid B contains a tertiary amine. The crosslinkable silicon group-containing organic polymer, filler, diluent, silane coupling agent, and catalyst are contained in either or both of liquid A and liquid B. That is, as long as the liquid containing the epoxy resin and the liquid containing the tertiary amine are separate, the other materials may be contained in either the A liquid or the B liquid. Here, the epoxy resin is preferably 10 parts by weight or more and 100 parts by weight or less with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. Moreover, the tertiary amine is preferably 0.2 parts by weight or more and 30 parts by weight or less with respect to 100 parts by weight of the epoxy resin.

[Crosslinkable Silicon Group-Containing Organic Polymer]
The crosslinkable silicon group (reactive silicon group) of the crosslinkable silicon group-containing organic polymer is a group that has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and can be crosslinked by forming a siloxane bond. As the crosslinkable silicon group, for example, a group represented by general formula (1) is preferable.

In formula (1), R ¹ represents an organic group. R ¹ is preferably a hydrocarbon group having 1 to 20 carbon atoms. Among these, R ¹ is preferably a methyl group. R ¹ may have a substituent. When there are two or more R ¹ 's, the plurality of R ¹ 's may be the same or different. X represents a hydroxyl group or a hydrolyzable group, and when there are two or more X's, the plurality of X's may be the same or different. a is any integer of 0, 1, 2 or 3; Considering curability, a is preferably 2 or more, more preferably 3, in formula (1) in order to obtain a composition having a sufficient curing rate. In order to obtain a composition having sufficient flexibility, a is preferably 2.

1 to 3 hydrolyzable groups or hydroxyl groups can be bonded to one silicon atom. When two or more hydrolyzable groups or hydroxyl groups are bonded to a crosslinkable silicon group, they may be the same or different.

The hydrolyzable group represented by X is not particularly limited. Examples thereof include alkoxy groups, acyloxy groups, ketoximate groups, aminooxy groups, alkenyloxy groups and the like. Among these, an alkoxy group is preferable from the viewpoint of being moderately hydrolyzable and easy to handle. Among alkoxy groups, a group with a smaller number of carbon atoms has higher reactivity, and the reactivity becomes lower as the number of carbon atoms increases, such as in the order of methoxy group > ethoxy group > propoxy group. A methoxy group or an ethoxy group is usually used, although it can be selected according to the purpose and application.

Examples of crosslinkable silicon groups include trialkoxysilyl groups such as trimethoxysilyl group and triethoxysilyl group; dialkoxysilyl groups such as —Si(OR) ₃ , methyldimethoxysilyl group and methyldiethoxysilyl group; SiR ¹ (OR) ₂ may be mentioned. Here, R is an alkyl group such as a methyl group or an ethyl group. The crosslinkable silicon groups may be used singly or in combination of two or more. The crosslinkable silicon groups may be attached to the main chain or side chains, or both. From the viewpoint of excellent physical properties of the cured product such as tensile properties of the composition, it is preferable that the crosslinkable silicon group is present at the terminal of the molecular chain. In the crosslinkable silicon group-containing organic polymer, the number of crosslinkable silicon groups present in one molecule of the organic polymer is preferably 1.0 or more and 5 or less, preferably 1.1 to 3. more preferred.

Specific examples of the main chain skeleton of the crosslinkable silicon group-containing organic polymer include polyoxyalkylene polymers such as polyoxypropylene, polyoxytetramethylene, and polyoxyethylene-polyoxypropylene copolymers; Hydrocarbon polymers such as propylene copolymers, polyisobutylene, polyisoprene, polybutadiene, and hydrogenated polyolefin polymers obtained by hydrogenating these polyolefin polymers; Dibasic acids such as adipic acid and glycol or polyester polymer obtained by ring-opening polymerization of lactones; ethyl (meth) acrylate, butyl (meth) acrylate (meth) acrylic ester polymer obtained by radical polymerization of monomers; Vinyl polymers obtained by radical polymerization of monomers such as (meth)acrylic acid ester monomers, vinyl acetate, acrylonitrile, and styrene; graft polymers obtained by polymerizing vinyl monomers in organic polymers; polysulfides Polymers; polyamide-based polymers; polycarbonate-based polymers; diallyl phthalate-based polymers, and the like. These skeletons may be contained singly in the crosslinkable silicon group-containing organic polymer, or two or more of them may be contained in blocks or at random.

Furthermore, saturated hydrocarbon polymers such as polyisobutylene, hydrogenated polyisoprene, and hydrogenated polybutadiene, polyoxyalkylene polymers, and (meth)acrylic acid ester polymers have relatively low glass transition temperatures and can be obtained. It is preferable because the cured product has excellent cold resistance. Polyoxyalkylene polymers and (meth)acrylic acid ester polymers are particularly preferred because of their high moisture permeability and excellent deep-part curability.

From the viewpoint of exhibiting the flexibility (high elongation property) and predetermined strength required for the cured product of the two-component curable resin composition, among these, oxyalkylene-based polymers and (meth) acrylic acid ester-based polymers A combination or a mixture thereof is preferred as the main chain skeleton.

A polyoxyalkylene polymer is essentially a polymer having repeating units represented by the general formula (2).

-R ² -O- (2)

In general formula (2), R ² is a linear or branched alkylene group having 1 to 14 carbon atoms, preferably a linear or branched alkylene group having 1 to 14 carbon atoms, and 2 to 4 carbon atoms. A linear or branched alkylene group of is more preferred.

Specific examples of the repeating unit represented by formula (2) include -CH ₂ O-, -CH ₂ CH ₂ O-, -CH ₂ CH(CH ₃ )O-, -CH ₂ CH(C ₂ H ₅ )O—, —CH ₂ C(CH ₃ ) ₂ O—, —CH ₂ CH ₂ CH ₂ CH ₂ O—, and the like. The main chain skeleton of the polyoxyalkylene polymer may consist of one type of repeating unit, or may consist of two or more types of repeating units. A main chain skeleton composed of a polymer containing oxypropylene as a main component is particularly preferred.

The molecular weight of the oxyalkylene polymer having a crosslinkable silicon group is preferably high in order to reduce the tensile modulus, which is the initial tensile property of the cured product, and to increase the elongation at break. In the present invention, the lower limit of the number average molecular weight of the oxyalkylene polymer is preferably 15,000, more preferably 18,000 or more, and even more preferably 20,000 or more. As the molecular weight increases, the viscosity of the polymer increases and the viscosity of the composition also increases. Also, the upper limit of the number average molecular weight is preferably 50,000, more preferably 40,000. In addition, the number average molecular weight according to the present invention is the polystyrene equivalent molecular weight obtained by gel permeation chromatography. If the number average molecular weight is less than 15,000, the tensile modulus and elongation at break may not be sufficient, and if it exceeds 50,000, the viscosity of the composition may increase and the workability may deteriorate.

Moderately reducing the content of crosslinkable silicon groups in the polyoxyalkylene polymer lowers the crosslink density in the cured product, resulting in a more flexible cured product in the initial stage, resulting in lower modulus properties and elongation at break. characteristics increase. In the polyoxyalkylene polymer, the crosslinkable silicon groups are preferably present in an average of 1.2 or more and 2.8 or less in one molecule of the polymer, and are present in an average of 1.3 or more and 2.6 or less. more preferably, and more preferably 1.4 or more and 2.4 or less. If the number of crosslinkable silicon groups contained in the molecule is less than 1, the curability will be insufficient. In the case of a bifunctional polymer having a straight main chain skeleton, the number of crosslinkable silicon groups of the polymer should be 1.2 or more and less than 1.9 on average per molecule of the polymer. is preferred, more preferably 1.25 or more and 1.8 or less, and even more preferably 1.3 or more and less than 1.7.

An oxyalkylene polymer having a crosslinkable silicon group may be linear or branched. From the viewpoint of reducing the tensile modulus, the oxyalkylene polymer having a crosslinkable silicon group is preferably a linear polymer. In particular, when producing a non-plasticized composition, it is preferably linear. Further, the molecular weight distribution (Mw/Mn) of the oxyalkylene polymer having a crosslinkable silicon group is preferably 2 or less, particularly 1.6 or less.

Examples of the method for synthesizing the polyoxyalkylene polymer include, but are not particularly limited to, a polymerization method using an alkali catalyst such as KOH, and a polymerization method using a double metal cyanide complex catalyst. According to the polymerization method using a double metal cyanide complex catalyst, a polyoxyalkylene polymer having a number average molecular weight of 6,000 or more and a Mw/Mn of 1.6 or less and having a narrow molecular weight distribution can be obtained.

The main chain skeleton of the polyoxyalkylene polymer may contain other components such as a urethane bond component. Examples of the urethane bond component include aromatic polyisocyanates such as toluene (toluene) diisocyanate and diphenylmethane diisocyanate; and aliphatic polyisocyanates such as isophorone diisocyanate obtained from the reaction of polyoxyalkylene polymers having hydroxyl groups. Ingredients can be mentioned.

A polyoxyalkylene polymer having a functional group such as an unsaturated group, a hydroxyl group, an epoxy group, or an isocyanate group in the molecule is reacted with a functional group reactive to the functional group and a crosslinkable silicon group. Thus, a crosslinkable silicon group can be introduced into the polyoxyalkylene polymer (hereinafter referred to as polymer reaction method).

As an example of a polymer reaction method, a polyoxyalkylene polymer containing an unsaturated group is reacted with a hydrosilane having a crosslinkable silicon group or a mercapto compound having a crosslinkable silicon group to hydrosilylate or mercaptate, and the crosslinkable silicon group A method for obtaining a polyoxyalkylene polymer having An unsaturated group-containing polyoxyalkylene polymer is obtained by reacting an organic polymer having a functional group such as a hydroxyl group with an organic compound having an active group and an unsaturated group that are reactive with this functional group, and obtaining an unsaturated group. A polyoxyalkylene polymer containing can be obtained.

Further, as other examples of the polymer reaction method, a method of reacting a polyoxyalkylene polymer having a terminal hydroxyl group with an isocyanate group and a crosslinkable silicon group, and a method of reacting a polyoxyalkylene polymer having a terminal isocyanate group. A method of reacting the coalescence with an active hydrogen group such as a hydroxyl group or an amino group, or a crosslinkable silicon group can be mentioned. By using an isocyanate compound, a polyoxyalkylene polymer having a crosslinkable silicon group can be easily obtained.

The polyoxyalkylene polymer having a crosslinkable silicon group may be used alone or in combination of two or more.

Various monomers can be used as the (meth)acrylic acid ester-based monomer that constitutes the main chain of the (meth)acrylic acid ester-based polymer. For example, (meth) acrylic acid-based monomers such as acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic (meth) acrylic acid alkyl ester monomers such as stearyl acid; alicyclic (meth) acrylic acid ester monomers; aromatic (meth) acrylic acid ester monomers; ) acrylic acid ester-based monomers; silyl group-containing (meth)acrylic acid ester-based monomers such as γ-(methacryloyloxypropyl)trimethoxysilane and γ-(methacryloyloxypropyl)dimethoxymethylsilane; (meth)acrylic acid derivatives; Fluorine-containing (meth)acrylic acid ester-based monomers and the like are included.

In the (meth)acrylate polymer, the following vinyl monomers can be copolymerized together with the (meth)acrylate monomer. Examples of vinyl monomers include styrene, maleic anhydride, and vinyl acetate. In addition, acrylic acid and glycidyl acrylate may be contained as monomer units (hereinafter also referred to as other monomer units).

These may be used alone or may be copolymerized. From the viewpoint of physical properties of the product, a polymer composed of a (meth)acrylic acid-based monomer is preferable. Further, a (meth)acrylic acid ester-based polymer using one or two or more (meth)acrylic acid alkyl ester monomers in combination with other (meth)acrylic acid monomers as necessary is more preferable. Furthermore, by using a silyl group-containing (meth)acrylic acid ester monomer together, the number of silicon groups in the (meth)acrylic acid ester polymer can be controlled. A methacrylic acid ester-based polymer composed of a methacrylic acid ester monomer is particularly preferable because of its good adhesiveness. Further, when the viscosity is lowered, flexibility is imparted, and tackiness is imparted, it is preferable to appropriately use an acrylic acid ester monomer. In the present invention, (meth)acrylic acid represents acrylic acid and/or methacrylic acid.

A method for producing a (meth)acrylic acid ester-based polymer can use, for example, a radical polymerization method using a radical polymerization reaction. The radical polymerization method includes a radical polymerization method (free radical polymerization method) in which predetermined monomer units are copolymerized using a polymerization initiator, and a controlled radical polymerization method that can introduce a reactive silyl group at a controlled position such as a terminal. polymerization method. However, a polymer obtained by a free radical polymerization method using an azo compound, a peroxide, or the like as a polymerization initiator generally has a large molecular weight distribution value of 2 or more and a high viscosity. Therefore, in the case of obtaining a (meth)acrylic acid ester polymer having a narrow molecular weight distribution, a low viscosity, and a crosslinkable functional group at the molecular chain end in a high proportion, , it is preferred to use a controlled radical polymerization method.

The controlled radical polymerization method includes a free radical polymerization method and a living radical polymerization method using a chain transfer agent having a specific functional group. Addition-fragmentation transfer reaction (Reversible Addition-Fragmentation chain Transfer; RAFT) polymerization method, radical polymerization method using a transition metal complex (Transition-Metal-MediatedLivingRadicalPolymerization), atom transfer radical polymerization method (Atom-Transfer-Radical-Polymerization; ATRP), etc. It is preferable to adopt a living radical polymerization method such as Also preferred are reactions using a thiol compound having a reactive silyl group and reactions using a thiol compound having a reactive silyl group and a metallocene compound.

These organic polymers having a crosslinkable silicon group may be used alone or in combination of two or more. Specifically, a group consisting of a polyoxyalkylene polymer having a crosslinkable silicon group, a saturated hydrocarbon polymer having a crosslinkable silicon group, and a (meth)acrylic acid ester polymer having a crosslinkable silicon group An organic polymer in which two or more selected from are blended can also be used. In particular, an organic polymer obtained by blending a polyoxyalkylene polymer having a crosslinkable silicon group and a (meth)acrylate polymer having a crosslinkable silicon group has excellent properties. When applied to the two-component curable resin composition according to the present invention, elongation at maximum load and adhesive strength can be increased. In addition, when two or more organic polymers having crosslinkable silicon groups with different viscosities are used in combination, it functions as a diluent for adjusting the viscosity of the mixed composition obtained by mixing liquid A and liquid B and improving injectability. Therefore, at least one of them can be treated as a diluent, which will be described later.

There are various methods for producing an organic polymer obtained by blending a polyoxyalkylene polymer having a crosslinkable silicon group and a (meth)acrylic acid ester polymer having a crosslinkable silicon group. For example, having a crosslinkable silicon group, the molecular chain substantially has the general formula (3):
—CH ₂ —C(R ³ )(COOR ⁴ )— (3)
(Wherein, R ³ is a hydrogen atom or a methyl group, R ⁴ is an alkyl group having 1 to 5 carbon atoms) and a (meth)acrylic acid ester monomer unit represented by the general formula (4):
—CH ₂ —C(R ³ )(COOR ⁵ )— (4)
(Wherein, R ³ is the same as described above, R ⁵ represents an alkyl group having 6 or more carbon atoms) to a copolymer consisting of a (meth) acrylic acid ester monomer unit, a crosslinkable silicon group A method of producing by blending a polyoxyalkylene polymer having

R ⁴ in general formula (3) includes, for example, a methyl group, an ethyl group, a propyl group, an n-butyl group, a t-butyl group, etc., having 1 to 5 carbon atoms, preferably 1 to 4 carbon atoms, and further An alkyl group having 1 to 2 carbon atoms is preferred. The alkyl group for ^R4 may be used alone or in combination of two or more.

R ⁵ in the general formula (4) is, for example, a 2-ethylhexyl group, a lauryl group, a stearyl group, etc. having 6 or more carbon atoms, usually 7 to 30 carbon atoms, preferably 8 to 20 carbon atoms. Chain alkyl groups are included. As in the case of ^R4 , the alkyl groups for R5 may be used singly or in combination of ^two or more.

The molecular chain of the (meth)acrylic acid ester copolymer substantially consists of the monomer units of the formulas (3) and (4). Here, "substantially" means that the total amount of the monomer units of formulas (3) and (4) present in the copolymer exceeds 50% by mass. The total amount of the monomer units of formulas (3) and (4) is preferably 70% by mass or more. The mass ratio of the monomer units of formula (3) to the monomer units of formula (4) is preferably 95:5 to 40:60, more preferably 90:10 to 60:40.

(Meth) having a crosslinkable silicon group used in a method for producing an organic polymer obtained by blending a polyoxyalkylene polymer having a crosslinkable silicon group and a (meth)acrylic acid ester polymer having a crosslinkable silicon group Examples of the acrylic acid ester-based polymer include (meth)acrylic acid alkyl ester monomer units having a crosslinkable silicon group and having a molecular chain substantially (1) having an alkyl group having 1 to 8 carbon atoms; , (2) a (meth)acrylic ester-based copolymer such as a (meth)acrylic ester-based copolymer containing a (meth)acrylic acid alkyl ester monomer unit having an alkyl group having 10 or more carbon atoms Coalescing can also be used.

When the glass transition temperature (Tg) of the (meth)acrylic acid ester polymer is less than 0° C., the number average molecular weight of the (meth)acrylic acid ester polymer is, for example, acrylic When mainly composed of butyl acid monomer units, it is preferably 20,000 or more, more preferably 30,000 or more, even more preferably 35,000 or more, and particularly preferably 40,000 or more. Further, when the glass transition temperature (Tg) of the (meth)acrylic acid ester polymer is 0° C. or higher, for example, when the (meth)acrylic acid ester polymer is mainly composed of methyl methacrylate monomer units, The number average molecular weight is preferably 600 or more and 10,000 or less, more preferably 600 or more and 5,000 or less, and even more preferably 1,000 or more and 4,500 or less. By setting the number average molecular weight within this range, the compatibility with the polyoxyalkylene polymer having a crosslinkable silicon group is improved. The (meth)acrylate polymers may be used alone or in combination of two or more. There is no particular limitation on the blending ratio of the polyoxyalkylene polymer having a crosslinkable silicon group and the (meth)acrylic acid ester polymer having a crosslinkable silicon group, but the (meth)acrylic acid ester polymer When the glass transition temperature (Tg) is less than 0° C., for example when the (meth)acrylic acid ester polymer is mainly composed of butyl acrylate monomer units, the (meth)acrylic acid ester polymer and the polyoxy It is preferable that the (meth)acrylic acid ester polymer is in the range of 30 parts by mass or more and 90 parts by mass or less, and 40 parts by mass or more and 80 parts by mass or less. It is more preferably in the range of 50 parts by mass or more and 70 parts by mass or less. If the (meth)acrylic acid ester-based polymer is more than 90 parts by mass, the viscosity increases and the workability deteriorates, which is not preferable. Further, when the glass transition temperature (Tg) of the (meth)acrylic acid ester polymer is 0° C. or higher, for example, when the (meth)acrylic acid ester polymer is mainly composed of methyl methacrylate monomer units, The (meth)acrylic acid ester polymer is in the range of 10 parts by mass or more and 60 parts by mass or less with respect to a total of 100 parts by mass of the (meth)acrylic acid ester polymer and the polyoxyalkylene polymer. , more preferably 20 to 50 parts by mass, and even more preferably 25 to 45 parts by mass. If the (meth)acrylic acid ester-based polymer is more than 60 parts by mass, the viscosity increases and the workability deteriorates, which is not preferable.

Furthermore, in the present invention, an organic polymer obtained by blending a saturated hydrocarbon polymer having a crosslinkable silicon group and a (meth)acrylic acid ester copolymer having a crosslinkable silicon group can also be used. As another method for producing an organic polymer obtained by blending a (meth)acrylic acid ester copolymer having a crosslinkable silicon group, in the presence of an organic polymer having a crosslinkable silicon group (meth ) A method of polymerizing acrylic acid ester-based monomers can be used.

[Epoxy resin]
Epoxy resins include various compounds containing an epoxy group. Specific examples of compounds containing epoxy groups include bisphenol A epoxy resins, hydrogenated bisphenol A epoxy resins, bisphenol F epoxy resins, novolac epoxy resins, aliphatic cyclic epoxy resins, and brominated epoxy resins. Examples thereof include resins, rubber-modified epoxy resins, urethane-modified epoxy resins, glycidyl ester compounds, epoxidized polybutadiene, and epoxidized SBS (SBS stands for styrene-butadiene-styrene copolymer).

In the present invention, the epoxy resin is preferably contained in an amount of 10 parts by weight or more, more preferably 20 parts by weight or more, and more preferably 30 parts by weight or more with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. More preferred. Also, the epoxy resin is preferably 100 parts by weight or less with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer.

[Filling material]
Fillers include reinforcing fillers such as fumed silica, precipitated silica, silicic anhydride, and carbon black; calcium carbonate, magnesium carbonate, diatomaceous earth, calcined clay, clay, talc, hardened titanium, bentonite, organic bentonite. , ferric oxide, zinc oxide, activated zinc oxide, hollow balloons, etc.; fibrous fillers, such as asbestos, glass fibers, and filaments;

When producing a cured product with high strength by adding these fillers, it is preferable to use fillers selected mainly from fumed silica, carbon black, surface-treated fine calcium carbonate, surface-treated colloidal calcium carbonate, and the like. . When producing a cured product with low strength and high elongation, it is preferable to use a filler mainly selected from titanium oxide, calcium carbonate, magnesium carbonate, shirasu balloon, and the like. These fillers may be used alone or in combination of two or more.

When a filler is used, it can be used in the range of 1 to 300 parts by weight, and in the range of 5 to 250 parts by weight, based on 100 parts by weight of the crosslinkable silicon group-containing organic polymer. More preferably, it is used in the range of 5 parts by weight or more and 100 parts by weight or less.

[Diluent]
The diluent can improve the injectability of the mixed composition of the A liquid and the B liquid. As the diluent, conventionally known diluents can be used. Reactive diluents such as polymers and epoxy-based reactive diluents such as glycidyl ether can be used. Examples of non-reactive diluents include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene and xylene; alcohols such as methanol, isopropanol and cyclohexanol; Hydrogens, petroleum ether, petroleum solvents such as petroleum naphtha, cellosolves such as cellosolve and butyl cellosolve, carbitol, carbitols such as butyl carbitol, ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate , butyl carbitol acetate, ethyl diglycol acetate, and diethylene glycol monoethyl ether acetate. These may be used alone or in combination of two or more. From the viewpoint of maintaining the performance of the cured product obtained by mixing the A liquid and the B liquid, it is preferable to use a reactive diluent. As the reactive diluent, it is preferable to use the above-mentioned crosslinkable silicon group-containing organic polymer from the viewpoint of excellent adhesiveness. As the diluent, it is preferable to use an organic compound having a boiling point of 100° C. or higher at room temperature (23° C.) from the viewpoint of suppressing volatilization during curing of the two-component curable resin composition.

The mixing ratio of the diluent is preferably 1 part by weight or more and 300 parts by weight or less, more preferably 5 parts by weight or more and 100 parts by weight or less, relative to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. These diluents can be used alone or in combination of two or more.

[Silane coupling agent]
Silane coupling agents include, for example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, β-(3,4-epoxycyclohexyl)ethyl Epoxy group-containing silanes such as trimethoxysilane; γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane Amino group-containing silanes, N-(β-aminoethyl)-γ-aminopropyltriethoxysilane, N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, 1,3-diaminoisopropyltrimethoxysilane, etc. Silanes; N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine, N-(1,3-dimethylbutylidene)-3-(trimethoxysilyl)-1- Ketimine-type silanes such as propaneamine; mercapto group-containing silanes such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropylmethyldimethoxysilane; vinylmethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloyloxy vinyl type unsaturated group-containing silanes such as propyltrimethoxysilane and γ-acryloyloxypropylmethyldimethoxysilane; chlorine atom-containing silanes such as γ-chloropropyltrimethoxysilane; γ-isocyanatopropyltriethoxysilane and γ-isocyanate isocyanate-containing silanes such as propylmethyldimethoxysilane; alkylsilanes such as hexyltrimethoxysilane, hexyltriethoxysilane and decyltrimethoxysilane; phenyltrimethoxysilane, phenyltriethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, etc. and phenyl group-containing silanes. In addition, modified amino group-containing silanes obtained by modifying amino groups by reacting amino group-containing silanes with epoxy group-containing compounds containing silanes, isocyanate group-containing compounds, and (meth)acryloyl group-containing compounds can also be used. can. In particular, amino group-containing silanes and modified amino group-containing silanes are preferable because they are effective in further improving adhesiveness.

The mixing ratio of the silane coupling agent is preferably 0.2 parts by weight or more and 20 parts by weight or less, more preferably 0.5 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer. , more preferably 1.0 parts by weight or more and 5 parts by weight or less. These silane coupling agents can be used alone or in combination of two or more.

[catalyst]
The catalyst according to the present invention acts as a curing catalyst for the crosslinkable silicon group-containing organic polymer. As the curing catalyst, conventionally known compounds can be used, and are not particularly limited. carboxylic acid metal salts such as tin carboxylate, bismuth carboxylate, and iron carboxylate; aliphatic amines, aromatic amines; carboxylic acids such as versatic acid; diisopropoxytitanium bis(ethyl Alkoxy metals such as titanium compounds such as acetoacetate) and aluminum compounds; inorganic acids; boron trifluoride complexes such as boron trifluoride ethylamine complex; metal chelate compounds such as aluminum monoacetylacetonate bis(ethylacetoacetate) a silicon compound or the like having a Si—F bond can be used.

The curing catalyst is preferably used in an amount of 0.1 to 20 parts by weight with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer.

[Tertiary amine]
Tertiary amines include triethylamine, tripropylamine, triisopropylamine, tributylamine, triisobutylamine, tritertiarybutylamine, triamylamine, trihexylamine, trioctylamine, tri-2-ethylhexylamine, methyldi-2- monoamines such as ethylhexylamine, dibutyl-2-ethylhexylamine, trihexadecylamine and tribenzylamine; Polyamine; triethylenediamine; N-ethylmorpholine, bis(morpholinoethyl) ether, 2,2′-dimorpholinodiethyl ether, bis(2,6-dimethylmorpholinoethyl) ether, bis(3,5-dimethylmorpholinoethyl) Morpholine compounds such as ether, bis(3,6-dimethylmorpholinoethyl)ether, 4-(3,5-dimethylmorpholino)-4'-(3,6-dimethylmorpholino)diethyl ether, benzyldimethylamine, 2,4 , 6-tris(dimethylaminomethyl)phenol and the like.

In the present invention, the tertiary amine is preferably contained in an amount of 0.2 parts by weight or more, more preferably 1 part by weight or more, and even more preferably 2 parts by weight or more with respect to 100 parts by weight of the epoxy resin. The tertiary amine content is preferably 30 parts by weight or less, more preferably 20 parts by weight or less, relative to 100 parts by weight of the epoxy resin.

[Other additives]
In the two-component curable resin composition according to the present invention, a filler contained in a tackifying resin, liquid A or liquid B is optionally added to the extent that the physical properties of the two-component curable resin composition are not impaired. A filler different from, a silane coupling agent different from the silane coupling agent contained in liquid A or liquid B, an extender, a plasticizer, a moisture absorbent, a curing catalyst, a physical property modifier that improves tensile properties, etc. Various additives such as reinforcing agents, coloring agents, flame retardants, anti-sagging agents, antioxidants, anti-aging agents, UV absorbers, solvents, fragrances, pigments, dyes, fillers and diluents may be added.

[Method for preparing solution A and solution B]
Liquid A and liquid B of the two-component curable resin composition of the present invention can be prepared by weighing predetermined amounts of predetermined compounding substances and blending them. The preparation method is not particularly limited. For example, the above ingredients are blended and kneaded using a mixer, roll, kneader, etc., or the ingredients are dissolved using a small amount of a suitable solvent and mixed. method can be used.

For example, liquid A is selected from the group consisting of epoxy resins, crosslinkable silicon group-containing organic polymers, fillers, diluents, silane coupling agents, catalysts, and other optional additives. It is adjusted by blending the compounding substance. However, other compounding substances other than the epoxy resin may be compounded in the B liquid. Similarly, liquid B is selected from the group consisting of tertiary amines, crosslinkable silicon group-containing organic polymers, fillers, diluents, silane coupling agents, catalysts, and other optional additives. It is adjusted by blending the compounding substance that is used. However, other compounding substances other than the tertiary amine may be compounded in the A liquid. Here, the crosslinkable silicon group-containing organic polymer, filler, diluent, silane coupling agent, and catalyst must be blended with at least either liquid A or liquid B. That is, for example, when the crosslinkable silicon group-containing organic polymer is not blended with liquid A, the crosslinkable silicon group-containing organic polymer must be blended with liquid B, and the crosslinkable silicon group-containing organic polymer must be blended with liquid B. If it is not blended in , it must be blended in A liquid. Also, the crosslinkable silicon group-containing organic polymer may be blended in both the A and B solutions. Fillers, diluents, silane coupling agents, and catalysts are also blended with the A and/or B liquids.

As an example, liquid A can be prepared by blending a crosslinkable silicon group-containing organic polymer, an epoxy resin, and a filler, and liquid B can be prepared by blending a diluent, a silane coupling agent, It can be prepared by blending a catalyst and a tertiary amine compound, but the combination of compounding substances constituting liquid A and the combination of compounding substances constituting liquid B are not limited to this.

[Properties of two-component curable resin composition]
The two-component curable resin composition of the present invention is obtained by adjusting at least the ratio of the epoxy resin to the crosslinkable silicon group-containing organic polymer and/or the ratio of the tertiary amine to the epoxy resin to a predetermined ratio. At least one of the initial viscosity, viscosity increase rate, maximum tensile strength, elongation at break, adhesive strength, and planar tensile strength of the curable resin composition can be set within a predetermined range, and as a result, It is possible to make the cured product have a predetermined strength, a predetermined flexibility, and workability.

(initial viscosity)
A cured product of the two-component curable resin composition of the present invention is obtained by mixing and curing the A liquid and the B liquid. Here, the viscosity (initial viscosity) at the time of mixing (at the time of mixing) liquid A and liquid B at room temperature (23 ° C.) is preferably 10 Pa s or more, and is 20 Pa s or more. The upper limit is preferably 200 Pa·s or less, more preferably 150 Pa·s or less, and even more preferably 80 Pa·s or less. In the present invention, the term "at the time of mixing" refers to the point in time when liquid A and liquid B are mixed and mixed for 1 minute with a spatula or the like until the total amount becomes substantially homogeneous. In the present invention, the viscosity is a value measured using a BH viscometer according to JIS K6833-1.

(Viscosity increase rate)
After mixing liquid A and liquid B, the viscosity after 30 minutes and the viscosity after 60 minutes from the time when liquid A and liquid B were mixed for 1 minute with a spatula or the like until homogeneous was divided by the initial viscosity. The viscosity increase rate (viscosity increase rate) to be used is preferably within the following ranges. Do not use immediately after mixing liquid A and liquid B, such as when moving to multiple places and using it when the viscosity increase rate is within the following range, or when there is time between mixing and use. Good field workability can be maintained even in the case of
Thickening rate after 30 minutes: 1.0 times or more and less than 2.0 times Thickening rate after 60 minutes: 1.0 times or more and less than 2.5 times The viscosity increasing rate can be calculated from the following formula. However, x=30 or 60.
Thickening rate (times) = (viscosity after x minutes) / (initial viscosity)

(maximum tensile strength, elongation at break)
The maximum tensile strength of the cured product obtained by mixing and curing the A liquid and the B liquid is preferably 1.0 MPa or more, more preferably 2.0 MPa or more. Moreover, the elongation at break of the cured product is preferably 50% or more, more preferably 100% or more. The maximum tensile strength and elongation at break can be measured according to JIS A6024, for example.

(adhesion strength)
The adhesive strength according to JIS A6024 of the cured product obtained by mixing and curing liquid A and B is 3.0 MPa or more when the cured product is cured for 1 week at 23 ° C. and 50% RH. is preferred, and 6.0 MPa or more is more preferred. In addition, when the cured product was cured for 2 weeks at 5°C, when a mortar test piece immersed in water at 23°C for 1 day was cured at 23°C and 85% RH for 1 week, and under the conditions of 23°C and 50% RH. After curing for 1 day, a cycle of 60°C hot water for 6 hours and 60°C constant temperature bath (drying) for 18 hours was performed for 3 days, and then cured for 1 day at 23°C and 50% RH. , preferably 1.5 MPa or more, more preferably 3.0 MPa or more.

(Plane tensile strength)
The planar tensile strength according to JIS A5557 of the cured product obtained by mixing and curing the A solution and the B solution is 0.6 N / mm when the cured product is cured at 23 ° C. 50% RH for 4 weeks. ² or more is preferable. In addition, when cured at 5°C for 4 weeks, when immersed in a saturated calcium hydroxide aqueous solution at 60°C for 7 days after curing at 23°C and 50% RH for 4 weeks, 80% after curing at 23°C and 50% RH for 4 weeks. 200 cycles of 2 hours of air freezing (-20°C) and 1 hour of thawing in water (20°C) after curing for 2 weeks in a constant temperature bath at 23°C and 4 weeks at 23°C and 50% RH. If so, it is preferably 0.4 N/mm ² or more.

[Repair method]
The two-liquid type curable resin composition of the present invention is injected into a damaged portion of a concrete structure, such as cracks occurring on the concrete surface, using a predetermined injection tool. As a result, the two-liquid type curable resin composition penetrates deep into the cracks and cures, thereby repairing the damaged portion. In addition, if the mortar, tiles, or other adhesives provided on the surface of the structure are floating from the surface of the structure (the floating part is called the “floating part”), place the anchor pin in the area where the floating part exists. The float part is formed by driving up to the skeleton of the structure and applying and fixing the 2-part curable resin composition of the present invention, or by injecting or applying the 2-part curable resin composition to the float part and curing it. is repaired.

[Effect of Embodiment of Curable Composition]
The two-component curable resin composition of this embodiment has appropriate strength, flexibility, and workability in repairing structures, etc., and after curing, it has strength and flexibility corresponding to expansion and contraction of the building frame concrete. It is a two-liquid type curable resin composition having both. The two-component curable resin composition of this embodiment has a predetermined ratio of the epoxy resin to the crosslinkable silicon group-containing organic polymer and/or the ratio of the tertiary amine to the epoxy resin. The resulting cured product can exhibit a given strength and a given flexibility.

<Embodiment of method for repairing floating portion of wall or the like>
The method of repairing a floating portion of a wall or the like in this embodiment is a method of repairing a floating portion of a wall or the like, which is a floating portion of a tiled outer wall finished by a tile direct adhesion pressure bonding method. A repair method using the curable composition of the embodiment described above.

This method of repairing a floating portion of a wall or the like includes the following steps.

drilling a pin insertion hole for inserting a pin in the joint between the adjacent tiles in the floating portion;
filling the pin insertion holes with a curable composition while pressing the tiles in the floating portion from the outside toward the inside of the outer wall using a holding jig;
A metal reinforcing pin is placed in the pin insertion hole after the curable composition is filled, with the tip of the reinforcing pin leading, and the apex of the head on the opposite side of the tip is the adjacent tile. Reinforcement pin driving process to drive until it is buried in the joint between them,
A step of curing the curable composition until it is cured.

According to the floating part repairing method of this embodiment, a pin insertion hole for inserting a pin is drilled in the joint between adjacent tiles in the floating part, and a metal reinforcing pin is driven into the pin insertion hole. The pin insertion holes were previously filled with the curable composition, and at this time, the tiles were pressed with a pressing jig from the outside to the inside of the outer wall. As a result, in the step of filling the pin insertion hole with the curable composition, the peeling area is enlarged, the tile is pushed out of the outer wall, and furthermore, such extrusion causes breakage. , etc., can be reliably prevented from occurring.

In addition, in the pinning step after the pin insertion hole is filled with the curable composition, the reinforcing pin is driven into the pin insertion hole until the head thereof is embedded in the joint, thereby curing the pin insertion hole filled with the hardening composition. It is possible to prevent the curable composition from floating up due to the residual pressure of the curable composition and prevent the curable composition from leaking out from the pin insertion hole and contaminating the tile.

The curable composition of the embodiment described above is used in the floating portion repair method of this embodiment. This curable composition has appropriate strength, flexibility and workability in repairing structures and the like. Therefore, according to the floating portion repairing method of this embodiment, the pin insertion hole can be simply and easily filled with the curable composition, and workability can be improved.

In the method for repairing the floating portion of this embodiment, the pin insertion hole is filled with the curable composition while pressing the tile with the floating portion in the outer wall from the outside toward the inside using a holding jig. This curable composition can exhibit good dischargeability and pourability. Therefore, it is possible to sufficiently fill and spread the curable composition having high performance as will be described later by eliminating the extrusion failure due to the injection pressure.

In addition, after the curable composition is cured and the reinforcing pins are fixed, there is a mechanical fixing force by the reinforcing pins made of metal as concrete screws and a fixing force due to curing and adhesion of the curable composition. can be exhibited to exhibit a more reliable anchor effect.

Furthermore, the curable composition used in this embodiment has a predetermined strength in accordance with JIS standards for tiles (organic adhesive for exterior tiling: JIS A5557) and JIS standards for repair by injection (for architectural repair and Epoxy resin for building reinforcement: It has a predetermined flexibility conforming to JIS A6024), and can exhibit good adhesive strength, deep curing, surface curing, tensile strength, planar tensile strength, etc. .

Therefore, the cured product obtained by curing the curable composition used in this embodiment can exhibit strength corresponding to the expansion and contraction of the building concrete constituting the walls and the like, and can exhibit flexibility.

As a result, it becomes possible to maintain the soundness and stability of the repaired portion subjected to the method of repairing the floating portion of the wall or the like in this embodiment.

In the embodiment described above, the reinforcement pin driving step includes:
The reinforcing pin has a large-diameter portion on the head opposite to the tip, and the outer diameter (D) of the large-diameter portion is larger than the inner diameter of the pin insertion hole, and the pin insertion hole is formed. smaller than the width between the adjacent tiles of the joint,
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
The length (H) of the reinforcing pin from the top of the head to the tip is shorter than the depth of the pin insertion hole,
The step of driving the reinforcing pin into the pin insertion hole after filling the curable composition with the tip as the head until the apex of the head is embedded in the joint between the adjacent tiles. .

In this way, the reinforcing pin has a large diameter portion at the head opposite to the tip, and the reinforcing pin is attached to the head in the step of driving (pinning) after the curable composition is filled into the pin insertion hole. is driven into the pin insertion hole until it is embedded in the joint, thereby more reliably preventing the reinforcing pin from rising due to the residual pressure of the curable composition filled in the pin insertion hole, and the curable composition is applied to the pin. It is possible to more reliably prevent the tile from being contaminated by leakage from the insertion hole.

<Embodiment of Reinforcement Pin Fixing Method>
In the reinforcement pin fixing method of this embodiment, a pin insertion hole for inserting a pin is drilled in a joint between the adjacent tiles in the tiled outer wall finished by the direct tile pressure bonding method, and the pin After the insertion hole is filled with the curable composition, a metal reinforcing pin is placed at the joint between the adjacent tiles so that the tip of the reinforcing pin is at the top and the apex of the head on the opposite side of the tip is at the joint. It is a reinforcing pin fixing construction method in which the reinforcing pin is fixed by driving the curable composition until it is embedded in the curable composition and fixing the reinforcing pin, and the curable composition of the above-described embodiment is used.

According to the reinforcing pin fixing method of this embodiment, in the pinning step after filling the curable composition into the pin insertion hole, the reinforcing pin is driven into the pin insertion hole until its head is embedded in the joint. It is possible to prevent the reinforcing pin from rising due to the residual pressure of the curable composition filled in the pin insertion hole, and to prevent the possibility that the curable composition leaks out from the pin insertion hole and contaminates the tile. .

In addition, after the curable composition is cured and the reinforcing pins are fixed, there is a mechanical fixing force by the reinforcing pins made of metal as concrete screws and a fixing force due to curing and adhesion of the curable composition. can be exhibited to exhibit a more reliable anchor effect.

Furthermore, the curable composition of the embodiment described above is used in the reinforcement pin fixing method of this embodiment. This curable composition has appropriate strength, flexibility and workability in repairing structures and the like. Therefore, according to the floating portion repairing method of this embodiment, the pin insertion hole can be simply and easily filled with the curable composition, and workability can be improved.

The curable composition used in this embodiment has a predetermined strength in accordance with JIS standards for tiles (organic adhesive for exterior tiling: JIS A5557) and JIS standards for repair by injection (construction repair and reinforcement Epoxy resin for use: It has a predetermined flexibility conforming to JIS A6024), and can exhibit good adhesive strength, deep-curing property, surface-curing property, tensile strength, plane tensile strength, and the like.

Therefore, the cured product obtained by curing the curable composition used in this embodiment can exhibit strength corresponding to the expansion and contraction of the building concrete constituting the walls and the like, and can exhibit flexibility.

As a result, it is possible to maintain the soundness and stability of the portion where the reinforcing pin fixing method of this embodiment is applied.

In the embodiment of the reinforcing pin fixing method described above,
The reinforcing pin has a large diameter portion in the head portion, the outer diameter (D) of the large diameter portion being larger than the inner diameter of the pin insertion hole, and the joint portion having the pin insertion hole. less than the width between adjacent said tiles;
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
The length (H) of the reinforcing pin from the top of the head to the tip may be shorter than the depth of the pin insertion hole.

Since the reinforcing pin has a large diameter portion on the head opposite to the tip, the reinforcing pin is more reliably prevented from rising due to residual pressure of the curable composition filled in the pin insertion hole, It is possible to more reliably prevent the curable composition from leaking out from the pin insertion hole and contaminating the tile.

<Example of curable composition>

The present invention will be described more specifically with reference to examples below. In addition, it cannot be overemphasized that these examples are illustrations and should not be interpreted restrictively.

(A liquid)
In 100 parts by weight of polyoxypropylene (number average molecular weight 16,000, trade name: Silyl EST280 (manufactured by Kaneka Corporation)) having a reactive silicon group in the molecule, which is a modified silicone resin, surface-treated colloidal calcium carbonate (average Particle size: 80 nm, trade name: Shiraenka CCR-S (manufactured by Shiraishi Calcium Co., Ltd.)) 100 parts by weight, bisphenol A-epichlorohydrin type epoxy resin (trade name: jER828 (manufactured by Mitsubishi Chemical Corporation)) are shown in Tables 1 to 3. was added in the amount shown in , and after sufficiently kneading, vacuum stirring was performed to prepare liquid A of the two-component curable resin composition of each of Examples 1 to 8 and Comparative Examples 1 to 8.

(B liquid)
Polyoxypropylene having a reactive silicon group in the molecule (number average molecular weight 5,000, trade name: Silyl SAT115 (manufactured by Kaneka Corporation)) 50 parts by weight, a silane coupling agent N-2- (amino Ethyl)-3-aminopropyltrimethoxysilane (trade name: KBM603 (manufactured by Shin-Etsu Chemical Co., Ltd.)) 1 part by weight, tin catalyst (trade name: Neostan U-700ES (Nitto Kasei Co., Ltd.)) 0.5 parts by weight , 2,4,6-Tris (dimethylaminomethyl) phenol (trade name: TMA EH30 (manufactured by Tsuno Foods Industry Co., Ltd.)) in the amount shown in Tables 1 to 3, and in the same manner as solution A. Liquid B of each of the two-component curable resin compositions of Examples 1 to 8 was obtained. However, in Example 8, 25 parts by weight of polyoxypropylene (number average molecular weight: 5,000, product name: Silyl SAT115 (manufactured by Kaneka Corporation)) having a reactive silicon group in the molecule was used.

Liquid B according to Comparative Examples 1 and 3 was carried out except that 2,4,6-tris(dimethylaminomethyl)phenol (trade name: TMA EH30 (manufactured by Tsuno Foods Industry Co., Ltd.)) was not added. It was prepared in the same manner as the B liquid according to Example 1. The B liquid according to Comparative Example 2 is the same as the B liquid according to Example 2, and the B liquid according to Comparative Example 4 is the same as the B liquid according to Example 5. In addition, the B liquid according to Comparative Example 5 does not add polyoxypropylene having a reactive silicon group in the molecule (number average molecular weight 5,000, trade name: Silyl SAT115 (manufactured by Kaneka Corporation)). , prepared in the same manner as the B solution according to Example 2. Furthermore, in liquid B according to Comparative Example 6, polyoxypropylene having a reactive silicon group in the molecule (number average molecular weight 5,000, trade name: Silyl SAT115 (manufactured by Kaneka Corporation)) was added in an amount of 200 wt. It was prepared in the same manner as the B solution according to Example 2, except that the part was used.

Liquid B according to Comparative Example 7 was a curing agent for epoxy resin other than a tertiary amine compound (trade name: Tomide TXA-529 (T&K TOKA Co., Ltd.) instead of 2,4,6-tris(dimethylaminomethyl)phenol. ) was used in the same manner as liquid B according to Example 1. Liquid B according to Comparative Example 8 was 2,4,6-tris(dimethylaminomethyl)phenol. Instead, 50 parts by weight of Fujicure FXJ-8027-H (manufactured by T&K TOKA Co., Ltd.), which is a curing agent for epoxy resins other than tertiary amine compounds, was used in the same manner as liquid B according to Example 1. prepared. Incidentally, trade name: Tomide TXA-529 (manufactured by T&K TOKA Co., Ltd.) and trade name: Fujicure FXJ-8027-H (manufactured by T&K TOKA Co., Ltd.) are mixtures of primary and secondary amines.

(Evaluation: viscosity increase rate)
Mix the total amount of A and B liquids prepared in Examples 1 to 7 and Comparative Examples 1 to 4 with a spatula for 1 minute until homogenous, and immediately, in accordance with JIS K6833-1, BH type viscometer ( Using a No. 6 rotor, the viscosity was measured at a temperature of 23° C. and a rotation speed of 20 rpm, and this was taken as the initial viscosity. Furthermore, the A solution and the B solution prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were mixed for 1 minute with a spatula until homogeneous, and the viscosity 30 minutes after mixing, and 60 minutes after mixing Viscosity was measured by the same method as the initial viscosity. The thickening rate was calculated by dividing the viscosity at each time by the initial viscosity. Table 1 shows the results.

The evaluation criteria for the rate of increase in viscosity are as follows.
(30 minutes after mixing)
“◎”: 1.0 times or more and less than 1.2 times “○”: 1.2 times or more and less than 1.4 times “△”: 1.4 times or more but less than 2.0 times “×”: 2.0 times Above (60 minutes after mixing)
“◎”: 1.0 to 1.5 times “○”: 1.5 to 2.0 times “△”: 2.0 to 2.5 times “×”: 2.5 times that's all

(Evaluation: Deep Curability)
Liquids A and B prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were mixed with a spatula for 1 minute until homogeneous, and added to a bottomed metal cylindrical container (diameter 35 mm, height 10 mm). It filled so that thickness might be set to 10 mm. After curing under each curing condition (1 day at 23°C, 7 days at 5°C), the cured product was taken out from the container and the cured thickness of the adhesive was confirmed.

The evaluation was made as "⊚" when the adhesive thickness was 5 mm or more at 23°C for one day, "∘" when it was 2 mm or more and less than 5 mm, and "Δ" when it was less than 2 mm. In addition, when the thickness of the adhesive was 5 mm or more at 5°C for 7 days, it was evaluated as "⊚"; Table 1 shows the results.

(Evaluation: surface curability)
Liquids A and B prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were mixed with a spatula for 1 minute until homogeneous, filled in a cylindrical cylindrical container made of metal with a bottom, and placed in a 5°C environment. After leaving for 12 hours, the surface was checked by touching with a finger. The case where the surface was sufficiently cured was evaluated as "good", and the case where the adhesive adhered to the finger when the surface was touched with a finger or the case where the adhesive was not cured was evaluated as "bad". Table 1 shows the results.

(Evaluation: tensile strength, tensile property B method)
The maximum tensile strength and elongation at break of the cured products of the compositions prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were measured according to JIS A6024. The details of the measurement method are as follows.

First, liquids A and B prepared in Examples 1 to 7 and Comparative Examples 1 to 4 were mixed with a spatula for 1 minute until homogeneous and stirred under vacuum. Each sample was uniformly filled in a mold with a depth of 2 mm, cured for 7 days under conditions of 23° C. and 50% RH, and then a dumbbell-shaped No. 5 test piece specified in JIS K6251 was taken. Under heat deterioration conditions, the collected dumbbell test pieces were aged for 14 days in a constant temperature bath at 80°C. The obtained test piece was set at a tensile speed of 20 mm / min under conditions of 23 ° C. and 50% RH, and the maximum tensile strength (MPa) and rupture when applying force to the test piece until the test piece broke Elongation (%) at time was measured.

The elongation at break (%) was calculated from the following formula.
Elongation at break (%) = ((length of test piece at break) - (length of test piece before test)) / (length of test piece before test) x 100

The physical properties of the cured product were evaluated based on the measurement results obtained above. The evaluation criteria were "⊚" when the maximum tensile strength was 2.0 MPa or more, "◯" when the maximum tensile strength was 1.0 MPa or more and less than 2.0 MPa, and "X" when it was less than 1.0 MPa. In addition, when the elongation at break was 100% or more, it was evaluated as "⊚", when it was 50% or more and less than 100%, it was evaluated as "◯", and when it was less than 50%, it was evaluated as "x". Table 1 shows the results.

(Evaluation: Injectability)
The total amount of the liquids A and B prepared in Examples 1 to 8 and Comparative Examples 5 to 6 was mixed with a spatula for 1 minute until homogeneous, and the mixed composition was filled into a 330 ml cartridge. A concrete base material having a cylindrical depression of 5 cm depth × 2 mm diameter was prepared, and a cartridge gun was used with a nozzle opening of 2 mm to confirm the injectability of the mixed composition filled in the cartridge into the depression. The evaluation criteria were "O" when the mixed composition was easy to dispense and the injection workability was good, and "X" when the injection workability was difficult such as high resistance to the injection of the mixed composition. Table 2 shows the results.

(Evaluation: Adhesion strength)
The adhesive strength of the cured products of the compositions prepared in Examples 1-7 and Comparative Examples 7-8 was measured according to JIS A6024. The details of the measurement method are as follows.

First, the total amount of A solution and B solution prepared in Examples 1 to 7 and Comparative Examples 7 to 8 were mixed with a spatula for 1 minute until they became homogeneous, and standard mortar test pieces of 40 mm × 40 mm × 80 mm were separated by 1 mm. They were laminated together so as to have a thickness, and cured under the following conditions. After each curing, the bonding strength was measured by a four-point bending test.

Standard curing: curing for 1 week under conditions of 23°C and 50% RH.
Low temperature curing: Curing at 5°C for 2 weeks.
Wet curing: Using a mortar test piece immersed in water at 23°C for 1 day, curing at 23°C and 85% RH for 1 week.
Wet and dry cycle: After curing for 1 day under conditions of 23°C and 50% RH, a cycle of 60°C warm water for 6 hours and 60°C constant temperature bath (drying) for 18 hours was performed for 3 days, and then 1 cycle under 23°C and 50% RH conditions. Day care.

The evaluation was made as "⊚" when the adhesive strength was 6.0 MPa or more under standard curing conditions, "◯" when 3.0 MPa or more and less than 6.0 MPa, and "×" when less than 3.0 MPa. For other curing conditions, the adhesive strength was evaluated as "⊚" when it was 3.0 MPa or more, "∘" when it was 1.5 MPa or more and less than 3.0 MPa, and "x" when it was less than 1.5 MPa. Table 3 shows the results.

(Evaluation: plane tensile strength)
The planar tensile strength of the cured products of the compositions prepared in Examples 1-7 and Comparative Examples 7-8 was measured according to JIS A5557. The details of the measurement method are as follows.

First, the total amount of the A solution and the B solution prepared in Examples 1 to 7 and Comparative Examples 7 to 8 were mixed with a spatula for 1 minute until homogeneous, and the mosaic tiles were attached to a standard mortar test piece. was cured under the conditions of After each curing, the bond strength was measured by a plane tensile test.

Standard curing: curing for 4 weeks at 23°C and 50% RH.
Low temperature curing: Curing at 5°C for 4 weeks.
Alkaline warm water immersion: After standard curing, immerse in saturated calcium hydroxide aqueous solution at 60°C for 7 days.
Thermal deterioration: After standard curing, cure in a constant temperature bath at 80°C for 2 weeks.
Freezing and thawing: After standard curing, 200 cycles of freezing in air (-20°C) for 2 hours and thawing in water (20°C) for 1 hour were defined as one cycle.

The evaluation was made as "○" when the adhesive strength was 0.6 N/mm ² or more under the standard curing conditions, and as "×" when it was less than 0.6 N/mm ² . Under the other curing conditions, the adhesive strength of 0.4 N/mm ² or more was evaluated as "○", and the case of less than 0.4 N/mm ² was evaluated as "X". Table 3 shows the results.

(Evaluation: Storage stability (canned storage))
Liquids A and B prepared in Examples 1 to 7 and Comparative Examples 7 to 8 were each filled and sealed in separate metal cans under an air environment, and opened after 2 weeks to confirm the surface of the adhesive. . A case where both the A liquid and the B liquid had no film on the surface was evaluated as "○", and a case where both the A liquid and B liquid or either one of the liquids had a film on the surface was evaluated as "X". Table 3 shows the results.

Tables 1 to 3 show the materials used for the A and B liquids of Examples and Comparative Examples. In addition, evaluation results are shown. In addition, in the materials in Tables 1 to 3, the unit of numerical values in the column of materials is parts by weight.

As can be seen from Tables 1 to 3, all of the two-component curable resin compositions according to Examples 1 to 7 have appropriate initial viscosities and can suppress the viscosity increase rate to a predetermined rate. , depth curability, and surface curability were also shown to be good. Moreover, in Examples 1 to 7, it was shown that the maximum tensile strength and the elongation at break were also good values. Furthermore, injectability was also good in Examples 1 to 8, and in Examples 1 to 7, all of adhesive strength, flat tensile strength and storage stability were shown to be good.

<Embodiment (1) of Repair Method for Floating Portions of Walls and Reinforcement Pin Fixing Method>
Using the curable composition of Example 1 described in the curable composition described above, a method for repairing floating portions such as walls and a method for fixing reinforcing pins were carried out as follows. FIG. 19 shows a schematic flow of the method for repairing floating portions such as walls in this embodiment (1). The reinforcement pin fixing method implemented in the method for repairing the floating portion of the wall or the like described below is the first embodiment of the reinforcement pin fixing method.

<Confirmation of repair range>
As with the conventional epoxy resin injection method for the anchor pinning part, the repair range is confirmed, the state of the float in the float is confirmed, and the repair range is determined.

For example, in the tiled outer wall 12 shown in FIGS. 5 and 6, a hammer test was conducted to confirm floating portions that might peel off, and it was confirmed that the tiles 13a and 13b had floating portions.

Just to make sure, when the tile at the position indicated by the reference numeral 13c was used as a reference point for measurement, the difference in height between the tiles 13d and 13e and the tile 13c was 0 mm, but the tiles 13a and 13b both differed from the tile 13c. was 0.3 mm higher.

<Marking>
Next, as in the conventional anchor pinning part epoxy resin injection method, the number of anchor pins to be used for the floating portion and the positions to be used are determined, and the joint portion 14 is marked.

<Perforation>
Next, the pin insertion hole 20 and the jig holding anchor holes 24a and 24b are formed at right angles to the joint 14 of the outer wall 12 to be repaired using a concrete drill (Figs. 7 and 15). ). Here, a pin insertion hole 20 with a depth of 35 mm and a diameter of φ3.5 mm, and jig holding anchor holes 24a and 24b are formed.

The jig holding anchor holes 24a and 24b are formed for fasteners (anchor pins 23a and 23b) used for removably attaching and fixing the holding jig 1 (FIGS. 1 to 3) to the outer wall 12. It is. As shown in FIG. 8, the center-side frame contact surface 5 (FIG. 3) and the outer frame contact surface 7 (FIG. 3) of the holding jig 1 are brought into contact with the outer wall 12 to be repaired, and the jig 1 is mounted on the outer wall 12 to be repaired. In the outer wall 12, jig holding anchor holes 24a and 24b are formed at positions corresponding to the fixing tool insertion holes 8a and 8b provided in the outer frame 4, respectively.

The pin insertion hole 20 is a hole used for filling the curable composition 21 therein and then driving and fixing the metal reinforcing pin 22 .

When the repair method of the present invention is applied to the peeling (floating) of the tiles on the tiled outer wall finished by the direct pressure bonding method, the pin insertion hole 20 and the jig holding anchor holes 24a and 24b are Both are formed in the joint portion 14 as shown in FIG. Therefore, in this case, the jig 1 (FIGS. 1 to 3) whose size and size are set in consideration of the size of the tiles 13a used is used.

That is, as shown in FIGS. 8 and 9, when the holding jig 1 is attached and fixed to the outer wall of the portion to be repaired, an intermediate support extending radially outward from the central frame 2 surrounding the pin insertion hole 20 is provided. The fixing tool insertion holes 8a and 8b, whose arrangement positions are defined by the frame 3 supporting the outer frame 4, are positioned so as to correspond to the jig holding anchor holes 24a and 24b formed in the joint portion 14. First, the holding jig 1 whose size and size are determined corresponding to the size of the tiles 13a on the tiled outer wall is selected and used.

<Cleaning inside the hole>
Thereafter, the inside of the pin insertion hole 20 is cleaned using compressed air or the like in a normal manner.

<Fixing the jig to the tiled outer wall>
Next, the positions of the jig holding anchor holes 24a and 24b are made to correspond to the positions of the fixture insertion holes 8a and 8b, and the central frame contact surface 5 and the outer frame contact surface 7 are brought into contact with the outer wall 12. to bring the pressing jig 1 into contact with the outer wall 12 (FIG. 8).

Subsequently, using anchor pins 23a and 23b, the central frame contact surface 5 and the outer frame contact surface 7 are separated through jig holding anchor holes 24a and 24b and fixture insertion holes 8a and 8b. The holding jig 1 is attached to and fixed to the outer wall 12 by bringing it into contact with the outer wall 12 (FIG. 9).

As a result, the tiles 13a and 13b, which are the tiles in the floating portion of the repair target portion, and the tiles in the sound portion adjacent to the floating portion where no floating occurs, are moved from the outside to the inside of the outer wall 12 by the holding jig 1. Make sure to press in the direction.

<Injection of curable composition>
After that, the curable composition 21 of Example 1 described in the curable composition example described above is gradually filled from the deepest portion of the pin insertion hole 20 (FIGS. 10 and 16). This curable composition 21 is used for fixing the reinforcing pin 22 . In the studies conducted in the above-described examples of the curable composition, the curable composition 21 of Example 1 was confirmed to have good ejection easiness and injection workability, and the curable composition of Example 1 21 could be easily filled into the pin insertion hole 20 with good workability.

In addition, when filling the curable composition 21, for example, a manual injector is used, the nozzle of the manual injector is inserted into the pin insertion hole 20, and the curable composition 21 is gradually filled from the deepest part of the pin insertion hole 20. (Figs. 10 and 16).

At this time, when using the holding jig 1 illustrated in FIGS. The curable composition is filled into the pin insertion hole 20 while visually confirming the extent of spread of the curable composition.

Even when the holding jig shown in FIGS. 1 to 3 is not used, the tiles in the floating portion are pressed inwardly from the outside of the outer wall, or the tiles in the floating portion and the float adjacent to the floating portion are pressed. The pin insertion hole 20 is filled with the curable composition 21 while confirming an appropriate spread by percussion while pressing the tiles in the non-healthy portion from the outside toward the inside of the outer wall.

<Pinning>
After the curable composition 21 is filled, the reinforcing pin 22 is driven into the pin insertion hole 20 using an impact driver or the like until the head of the reinforcing pin 22 is embedded in the joint portion 14 (Fig. 11). Then, the curable composition 21 is cured. That is, in the illustrated embodiment, the impact driver is used to drive the reinforcing pin 22 into the joint mortar 14a disposed in the joint portion 14 until the head of the reinforcing pin 22 is embedded, thereby curing the curable composition 21.

After filling the pin insertion hole 20 with the curable composition 21, for the purpose of preventing the curable composition 21 from returning due to the internal pressure, after removing the nozzle of the manual injector from the pin insertion hole 20, Immediately, a member such as a nail may be inserted to plug the hole, and after the curable composition 21 has returned slowly, the plug (nail) may be removed and the reinforcing pin 22 may be driven.

In the pinning step described above after the pin insertion hole 20 is filled with the curable composition, the reinforcing pin 22 is driven into the pin insertion hole 20 until its head is embedded in the joint mortar 14 a of the joint portion 14 .

Therefore, it is possible to prevent the reinforcing pin 22 from rising due to the residual pressure of the curable composition 21 filled in the pin insertion hole 20, and prevent the curable composition 21 from leaking out from the pin insertion hole 20 and contaminating the tile. .

<Removing the jig>
The anchor pins 23a and 23b are extracted from the jig holding anchor holes 24a and 24b through the fixture insertion holes 8a and 8b, and the holding jig 1 is removed.

<Putty finish>
The head of the reinforcing pin 22 is touched up with a joint mortar 43 matching the color of the joint mortar 14a of the existing joint part 14.例文帳に追加

Also, the jig holding anchor holes 24a and 24b are finished by using putty-like epoxy resin or the like.

<Curing>
Appropriate curing is performed until the curable composition 21 for fixing the reinforcing pin 22 is cured.

<Cleaning>
Any material adhering to areas other than the curable composition injection section is removed by an appropriate method and cleaned (FIG. 13).

In the above-described embodiment (1), after the pin insertion hole 21 is drilled, the opening of the pin insertion hole 21 may be counterbored before the reinforcing pin 22 is driven. In this case, the head portion of the reinforcing pin 22 is accommodated in the large-diameter opening formed by the counterbore.

During the curable composition filling process, as described above, the jig 1 is attached to the outer wall 12 to be repaired by the anchor pins 23a, 23b, so that the jig is always on the surface side of the tiles 13a, 13b. 1, there is a region in contact with any one of the center side frame contact surface 5, the intermediate support frame contact surface 9, or the outer frame contact surface 7. As shown in FIG.

As a result, the outer surfaces of the tiles 13a and 13b to be repaired are always pressed at at least one point during the above-described curable composition filling step.

As a result, in the process of injecting and filling the curable composition 21 into the anchor pin insertion hole 20, the peeling area may increase, the tiles 13a and 13b may be pushed out of the outer wall 12, and further such It is possible to safely and reliably prevent the occurrence of failures such as destruction due to excessive extrusion. The outer surfaces of the tiles 13a, 13b to be repaired are always pressed down at least one point or more during the curable composition filling process described above. In addition, the curable composition 21 of Example 1, which has been confirmed to have good ejection easiness and injection workability in the studies conducted in the above-described examples of the curable composition, is used, so that the injection pressure It is possible to sufficiently fill and spread the curable composition having high performance when it is cured by eliminating the extrusion failure due to.

Furthermore, in the case of the jig 1 described above, the surfaces of the tiles 13a and 13b can be visually confirmed through the through holes 6b to 6i during the curable composition filling process. Therefore, in the process of filling the pin insertion hole 20 with the curable composition 21, the peeling area may increase, the tiles 13a and 13b may be pushed out of the outer wall 12, and furthermore, such extrusion may cause breakage. It is possible to more reliably prevent the occurrence of troubles such as the occurrence of , and to visually grasp the degree of spread of the injected and filled curable composition.

In addition, by exhibiting the mechanical fixing force of the metal reinforcing pin 22 as a concrete screw and the fixing force of the hardening/bonding of the curable composition 21, the required strength and a more reliable anchor effect can be exhibited. can.

The curable composition 21 used in this example has a predetermined strength conforming to the JIS standard for tiles (organic adhesive for exterior tiling: JIS A5557) and a JIS standard for repair by injection (construction repair and construction adhesives). Epoxy resin for reinforcement: It has a predetermined flexibility conforming to JIS A6024). In the studies conducted in the examples of the curable composition described above, the curable composition 21 of Example 1 was found to have good adhesive strength, deep curability, surface curability, tensile strength, planar tensile strength, It is confirmed that etc. can be demonstrated.

Therefore, the method of repairing the floating portion of the wall or the like and the method of fixing the reinforcing pin in this embodiment are performed, and the cured product obtained by curing the used curable composition 21 constitutes the wall or the like. Flexibility can be exhibited while exhibiting strength corresponding to the expansion and contraction of the frame concrete.

As a result, it is possible to maintain the soundness and stability of the portion to be repaired by the method of repairing the floating portion of the wall or the like in this embodiment, and to maintain the soundness and stability of the portion to which the reinforcement pin fixing method of this embodiment is applied. Soundness and stability can be maintained.

In the anchor pinning part epoxy resin injection method (Non-Patent Document 1), as the curable composition (epoxy resin) to be used, a hard type and high viscosity type of injected epoxy resin (JIS A6024) for building repair and building reinforcement is specified. ing.

The curable composition used in this example is in a soft form, as confirmed by the examination conducted in the above-described examples of the curable composition, that it has good dischargeability and pouring workability. , Predetermined strength based on JIS standards for tiles (organic adhesive for exterior tiling: JIS A5557) and JIS standards for repair by injection (epoxy resin for building repair and building reinforcement: JIS A6024) flexibility. And when it hardens, it can demonstrate the strength and flexibility corresponding to the expansion and contraction of the frame concrete that constitutes the walls and the like.

Therefore, compared with the case where a hard curable composition (epoxy resin) specified in the anchor pinning part epoxy resin injection method (Non-Patent Document 1) is used, the function of absorbing and relaxing various stresses is superior, It is possible to propose a new construction method that can demonstrate the function of keeping the finishing material from falling apart.

<Embodiment (2) of Repair Method for Floating Portions of Walls and Reinforcement Pin Fixing Method>
In the embodiment (1) of the method of repairing the floating portion of the wall and the method of fixing the reinforcing pins, an embodiment using the metal reinforcing pins 40 shown in FIG. 14 will be described. FIG. 14(a) is a side view, and FIG. 14(b) is a perspective view from above. Except for using the metal reinforcing pin 40 shown in FIG. ), the explanation of the common matters is omitted.

The reinforcing pin 40 is made of stainless steel and is a fully threaded anchor pin of a round bar with a nominal diameter of 4 mm. is set to a length shorter than the depth of the For example, when the pin insertion hole 20 is formed with a depth of 35 mm and a diameter of φ3.5 mm, a reinforcing pin 40 having a diameter of d=4 mm and a length of H=32 mm is used.

The reinforcing pin 40 has a large diameter portion 40a on its head. The diameter D of the large diameter portion 40a is smaller than the width between adjacent tiles of the joint portion 14 in which the pin insertion hole 20 is bored. In this way, the reinforcing pin 40 has the structure of an anchor pin specified in the anchor pinning part epoxy resin injection method (Non-Patent Document 1) (a round bar with a nominal diameter of 4 mm is fully threaded). ), the head portion has a large-diameter portion 40a.

In the tiled outer wall finished by the direct tile bonding method, the mosaic tile joint of the exterior wall is 5 mm, such as 50 squares, 50 squares, and so on. Further, as will be described later, in order to prevent the epoxy resin filled in the pin insertion hole 20 from leaking from the pin insertion hole 20, it is desirable to set D=4.5 mm to 4.8 mm.

Even when using the metal reinforcing pin 40 shown in FIG. 20 (Fig. 17). Then, the curable composition 21 is cured. That is, in the illustrated embodiment, an impact driver is used to drive the reinforcing pin 40 until the head 40a of the reinforcing pin 40 is embedded in the joint mortar 14a disposed in the joint 14, thereby curing the curable composition 21. .

As described above, the diameter d of the reinforcing pin 40 is set larger than the inner diameter of the pin insertion hole 20 and the length H of the reinforcing pin 40 is set shorter than the depth of the pin insertion hole 20 . The head portion 40a of the reinforcing pin 40 is a large-diameter portion, and the diameter D of the large-diameter head portion 40a is the width between adjacent tiles of the joint portion 14 in which the pin insertion hole 20 is bored. less than

Further, in the pinning step after filling the pin insertion hole 20 with the curable composition, the reinforcing pin 40 is driven into the pin insertion hole 20 until the head 40a thereof is embedded in the joint mortar 14a of the joint portion 14 .

Therefore, according to this embodiment (2), in addition to the effects and functions exhibited by the method of repairing floating portions such as walls and the method of fixing reinforcing pins in the above-described embodiment (1), the pin insertion hole 20 To more reliably prevent the reinforcing pin 40 from rising due to the residual pressure of the curable composition 21 filled into the tile, and to more reliably prevent the curable composition 21 from leaking out from the pin insertion hole 20 and contaminating the tile. becomes possible.

In addition, since the head has a large diameter portion 40a, and the curable composition 21 is hardened after being driven until the large diameter portion 40a is embedded in the joint mortar 14a, a mechanical fixing force is exhibited. become a thing.

Also in this embodiment (2), the opening of the pin insertion hole 21 may be counterbored after the pin insertion hole 21 is drilled and before the reinforcing pin 40 is driven. In this case, the large-diameter head portion 40a of the reinforcing pin 40 is accommodated in the large-diameter opening formed by countersinking.

In the examples (1) and (2) of the method of repairing a floating portion of a wall and the method of fixing reinforcing pins, the tile 13e adjacent to the tile to be repaired (floating tile) is next to the tiles 13a and 13b. , 13f, as shown in FIG. 12, one of the jig holding anchors 23a is removed, and the jig 1 is rotated 180 degrees around the position of the other jig holding anchor 23b as a fulcrum so that the next adjacent repair can be performed. By moving the holding jig 1 to the position, the tiles 13e and 13f can be subsequently repaired.

As described above, during the curable composition filling step, the jig 1 presses the outer surfaces of the tiles 13a and 13b to be repaired at at least one point. It is necessary to prepare the outer wall 12 with a strength that suppresses the pressure directed toward the outside of the outer wall 12 at that time. For example, it can be made of metal, synthetic resin, or wood having such strength.

In addition, it is desirable that the anchor pins 23a and 23b are also made of a material having strength to suppress the outward pressure of the outer wall 12 when the curable composition is injected and filled. For example, concrete screws, mechanical anchors, etc. can be employed.

It should be noted that the holding jig 1, when filling the curable composition 21 into the pin insertion hole 20 formed in the outer wall 12 to repair the floating portion of the repair target location, The tiles, or the tiles in the floating portion and the tiles in the healthy portion adjacent to the floating portion where no floating occurs, are pressed toward the inside of the outer wall 12. If this is realized, the pressing member Attachment and fixing of the jig 1 to the outer wall 12 may be performed using a single fixing portion.

For example, in the above example, the anchor pins 23a and 23b are used to contact the center side frame through the jig holding anchor holes 24a and 24b and the fixture insertion holes 8a and 8b, which are two fixing portions. The holding jig 1 was attached and fixed to the outer wall 12 by bringing the surface 5 and the outer frame contact surface 7 into contact with the outer wall 12 (FIG. 9). Using only one anchor pin 23a, this is attached to the center side frame contact surface 5 and the outer frame through the jig holding anchor hole 24a and the fixing tool insertion hole 8a, which are fixed portions at one location. The jig 1 may be attached to the outer wall 12 and fixed by bringing the contact surface 7 into contact with the outer wall 12 .

In addition, the fixing part is attached with a suction tool for fixing the holding jig 1 to the outer wall 12 by suction, and is provided in the jig 1 as a detachable structural part. 12 by suction, and thereby, when the pin insertion hole 20 formed in the outer wall 12 is filled with the epoxy resin 21 to repair the floating portion of the repair target portion by the pressing jig 1, the repair target is fixed. It is also possible to press at least one or more of the floating portions of the location by the pressing jig 1 toward the inside of the outer wall 12 .

During the repair process described above, the holding jig 1 can be used while being connected to a fall prevention rope or the like.

FIG. 4 shows the jig 1 shown in FIGS. 1 to 3 with a handle 11 attached using a fixture 12. FIG. The presence of the handle 11 can improve usability.

In the pressing jig 1 described in the above embodiment, the outer frame 4 is supported by the support arms 3a to 3h radially extending from the central frame 2 toward the outside in the radial direction, and the adjacent support arms 3a and 3b. , etc., were through holes 6a to 6h. Therefore, the weight of the holding jig 1 can be reduced, and the handling on the scaffolding is easy.

Although preferred embodiments and examples of the present invention have been described above, the present invention is not limited to such embodiments and examples, and various modifications can be made within the technical scope grasped from the description of the claims. It is possible.

1 holding jig 2 central frame 3 intermediate support frames 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h support arm 4 outer frame 5 central frame contact surfaces 6a, 6b, 6c, 6d, 6e, 6f, 6g, 6h, 6i Through hole 7 Outer frame contact surface 8a, 8b, 8c, 8d Fixing tool insertion hole (fixing part)
35a, 35b, 35c, 35d, 35e, 35f Fixing tool insertion hole (fixing part)
9 Intermediate support frame contact surface 11 Handle 12 External wall 13a, 13b, 13c to be repaired, tile 13d, 13e, 13e, 13f Tile 14 Joint part 14a Joint mortar 20 Pin insertion hole 21 Hardening composition 22 Reinforcement pin 23a, 23b Fixture (anchor pin)
24a, 24b jig holding anchor hole 40 reinforcing pin 40a large diameter head 41 of reinforcing pin concrete frame 42 finishing material

Claims (4)

A method for repairing a floating portion of a wall, etc., which is a tile that is a floating portion of a tiled outer wall finished by a tile direct adhesion pressure bonding method,
drilling a pin insertion hole for inserting a pin in the joint between the adjacent tiles in the floating portion;
filling the pin insertion holes with a curable composition while pressing the tiles in the floating portion from the outside toward the inside of the outer wall using a holding jig;
A reinforcing pin driving step of driving a metal reinforcing pin into the pin insertion hole after the curable composition is filled, with the tip of the reinforcing pin leading;
curing until the curable composition is cured, wherein the curable composition is
A two-component curable resin composition that cures by mixing liquid A and liquid B,
The A liquid contains a crosslinkable silicon group-containing organic polymer having a number average molecular weight of 16,000 and an epoxy resin,
The B liquid contains a crosslinkable silicon group-containing organic polymer and a tertiary amine as a diluent,
A filler, a silane coupling agent, and a crosslinkable silicon group-containing organic polymer catalyst are contained in either or both of the liquid A and the liquid B,
10 parts by weight or more and 100 parts by weight or less of the epoxy resin with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer of the liquid A,
A method for repairing floating parts such as walls, which is a two-liquid type curable resin composition containing 0.2 parts by weight or more and 30 parts by weight or less of the tertiary amine with respect to 100 parts by weight of the epoxy resin. The reinforcing pin driving process is
The reinforcing pin has a large-diameter portion on the head opposite to the tip, and the outer diameter (D) of the large-diameter portion is larger than the inner diameter of the pin insertion hole, and the pin insertion hole is formed. smaller than the width between the adjacent tiles of the joint,
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
The length (H) of the reinforcing pin from the top of the head to the tip is shorter than the depth of the pin insertion hole,
2. The step of driving the reinforcing pin into the pin insertion hole after the curable composition has been filled with the front end of the reinforcing pin until the apex of the head portion is embedded in the joint between the adjacent tiles. Repair method for floating parts such as walls described. A pin insertion hole for inserting a pin was bored in the joint between the adjacent tiles in the tiled outer wall finished by the direct bonding method of tiles, and the pin insertion hole was filled with a curable composition. After that, a metal reinforcing pin is driven into the joint between the adjacent tiles until the apex of the head opposite to the tip of the reinforcing pin is embedded in the curable composition. A reinforcing pin fixing method for fixing the reinforcing pin by curing an object,
The curable composition is
A two-component curable resin composition that cures by mixing liquid A and liquid B,
The A liquid contains a crosslinkable silicon group-containing organic polymer having a number average molecular weight of 16,000 and an epoxy resin,
The B liquid contains a crosslinkable silicon group-containing organic polymer and a tertiary amine as a diluent,
A filler, a silane coupling agent, and a crosslinkable silicon group-containing organic polymer catalyst are contained in either or both of the liquid A and the liquid B,
10 parts by weight or more and 100 parts by weight or less of the epoxy resin with respect to 100 parts by weight of the crosslinkable silicon group-containing organic polymer of the liquid A,
A two-liquid type curable resin composition containing 0.2 parts by weight or more and 30 parts by weight or less of the tertiary amine with respect to 100 parts by weight of the epoxy resin. The reinforcing pin has a large diameter portion in the head portion, the outer diameter (D) of the large diameter portion being larger than the inner diameter of the pin insertion hole, and the joint portion having the pin insertion hole. less than the width between adjacent said tiles;
The maximum outer diameter (d) of the portion of the reinforcing pin extending from the large diameter portion toward the tip is smaller than the outer diameter (D) of the large diameter portion and larger than the inner diameter of the pin insertion hole,
4. The reinforcing pin fixing method according to claim 3, wherein the length (H) from the apex of the head portion to the tip end of the reinforcing pin is shorter than the depth of the pin insertion hole.

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