JP7166714B2 - Cutting blade, method for manufacturing cutting blade, and method for processing workpiece - Google Patents

Description

The present invention relates to a cutting blade for cutting a workpiece, a method for manufacturing the cutting blade, and a method for machining the workpiece using the cutting blade.

2. Description of the Related Art In the process of manufacturing semiconductor device chips, a semiconductor wafer having devices such as ICs and LSIs in regions partitioned by dividing lines (streets) is used. A plurality of semiconductor device chips each having a device is obtained by dividing the semiconductor wafer along the dividing lines. Similarly, optical device chips are manufactured by dividing an optical device wafer on which optical devices such as LEDs are formed.

A cutting apparatus is used for dividing a workpiece represented by the above semiconductor wafer and optical device wafer. A cutting device includes a chuck table that holds a workpiece, and a spindle that has a cutting blade attached to its tip for cutting the workpiece. This cutting blade is formed by bonding abrasive grains made of diamond or the like with a bonding material made of metal or the like (see Patent Documents 1 and 2, for example).

When a cutting blade is attached to the tip of the spindle and the spindle is rotated, the cutting blade rotates around the axis of the spindle as a rotation axis. When the cutting blade is caused to cut into the workpiece in this state, the abrasive grains exposed from the bonding material of the cutting blade come into contact with the workpiece, thereby cutting the workpiece. By cutting the workpiece along all the dividing lines, the workpiece is divided into a plurality of chips.

When cutting with a cutting blade is continued, processing debris (cutting debris) generated by cutting accumulates in the gap between the bond material and the abrasive grains, and some of the abrasive grains may be buried (clogging). When this clogging occurs, the processing load increases and processing defects tend to occur in the workpiece. Therefore, during cutting, the cutting blade is cut into a dresser board to dress the cutting blade, thereby exposing the abrasive grains (dressing).

Also, instead of using a dresser board, a method of dressing by irradiating a cutting blade with a laser beam has been proposed. Patent Literature 3 discloses a cutting device that performs dressing by irradiating a cutting blade with a laser beam while cutting a workpiece with the cutting blade.

JP-A-4-193974 JP 2012-135833 A Japanese Patent Application Laid-Open No. 2009-18368

In the dressing using the dresser board described above, it is necessary to interrupt the cutting of the workpiece with the cutting blade in order to perform the dressing, and the dressing operation takes time. Therefore, the reduction in processing efficiency due to the implementation of dressing poses a problem.

On the other hand, in the above-described dressing using a laser beam, the dressing can be performed while the workpiece is being cut, so a decrease in machining efficiency can be avoided. However, there are cases where abrasive grains fall off from the bond material due to ablation caused by laser beam irradiation, and the cutting blade is not properly dressed. When a workpiece is cut using such a cutting blade, machining defects tend to occur in the workpiece.

The present invention has been made in view of such problems, a cutting blade capable of suppressing the occurrence of processing defects without reducing processing efficiency, a method for manufacturing the cutting blade, and a workpiece using the cutting blade An object of the present invention is to provide a method for processing a workpiece.

According to one aspect of the present invention, there is provided a cutting blade having a cutting edge portion including abrasive grains and a bond material that bonds the abrasive grains, wherein the surface of the bond material has a width of the abrasive grains Provided is a cutting blade having a concave-convex structure formed by linear protrusions having a grain size or smaller. In one aspect of the present invention, the grain size of the abrasive grains may be 200 μm or less.

Further, according to one aspect of the present invention, there is provided a method for manufacturing a cutting blade having a cutting edge portion containing abrasive grains and a bonding material that bonds the abrasive grains, wherein a laser beam having a pulse width of 10 ps or less is applied. Manufacture of a cutting blade that forms an uneven structure on the surface of the bond material by irradiating the cutting edge, the protrusions having a width equal to or less than the grain size of the abrasive grains and less than the wavelength of the laser beam. A method is provided. Note that in one embodiment of the present invention, the linear protrusion may be formed.

Further, according to one aspect of the present invention, there is provided a method for machining a workpiece using the above-described cutting blade, wherein the workpiece is cut along a planned cutting line by causing the cutting blade to cut into the workpiece. A method of machining a workpiece is provided for cutting along a.

On the surface of the bonding material of the cutting blade according to one aspect of the present invention, an uneven structure having a size equal to or smaller than the grain size of the abrasive grains is formed. If the surface of the bond material has an uneven structure, the contact area between the bond material and foreign matter (cutting waste) produced by cutting is reduced, making it difficult for cutting waste to adhere to the bond material and clogging. Suppressed. As a result, it is possible to maintain the state in which the abrasive grains are exposed without frequently performing dressing of the cutting blade, and it is possible to suppress the occurrence of defective processing while suppressing a decrease in processing efficiency.

FIG. 1(A) is a perspective view showing a cutting blade provided with a base and a cutting edge portion, and FIG. 1(B) is a perspective view showing a cutting blade comprising a cutting edge portion. FIG. 2(A) is an enlarged view showing an example of a cutting edge portion having an uneven structure formed on the surface of the bond material, and FIG. 2(B) is an enlarged view of the cutting edge portion having an uneven structure formed on the surface of the bond material. It is an SEM image of an example. It is a partial cross-sectional front view which shows a laser irradiation apparatus. FIGS. 4A, 4B, and 4C are plan views showing examples of the scanning direction of the laser beam with respect to the cutting edge. It is a perspective view which shows a processing apparatus. 7 is a graph showing measurement results of chipping size.

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, a cutting blade according to this embodiment will be described. 1(A) and 1(B) show configuration examples of the cutting blade.

FIG. 1(A) is a perspective view showing a cutting blade 1 having a base 3 and a cutting edge portion 5. FIG. The cutting blade 1 is composed of an annular base 3 having an opening 3 a in the center and an annular cutting edge 5 formed on the outer edge of the base 3 . The cutting edge portion 5 is formed by bonding abrasive grains made of diamond or the like with a bonding material. As the bonding material, for example, metal bond, resin bond, vitrified bond, or the like is used. A cutting blade 1 having a cutting edge portion 5 formed on the outer edge of a base 3 is called a hub type (hub blade).

Further, the base 3 has an annular grip portion 3b projecting in the width direction. When a workpiece is processed using a cutting device, a user (operator) of the cutting device can hold the grip portion 3b and attach the cutting blade 1 to the cutting device.

FIG. 1(B) is a perspective view showing a cutting blade 7 comprising a cutting edge portion 9. FIG. The cutting blade 7 is composed of an annular cutting edge portion 9 having an opening 9a in its central portion. The material of the cutting edge portion 9 is the same as that of the cutting edge portion 5 of the cutting blade 1 shown in FIG. 1(A). A cutting blade 7 constituted by an annular cutting edge portion 9 is called a washer type (washer blade).

A cutting blade as shown in FIGS. 1(A) and 1(B) is attached to the tip of a spindle provided in a cutting device, and is rotatably supported by the spindle. When the spindle is rotated while the cutting blade is attached to the spindle, the cutting blade rotates around the axis of the spindle. The workpiece is cut by causing the rotating cutting blade to cut into the workpiece.

Cutting of the workpiece is performed by contacting the workpiece with abrasive grains exposed from the bond material of the cutting edge portion of the cutting blade. However, if cutting with the cutting blade is continued, foreign matter (cutting dust) generated by cutting may adhere to the tip of the cutting blade, and some or all of the abrasive grains may be buried (clogging). When this clogging occurs, the processing load increases and processing defects tend to occur in the workpiece.

Clogging can be eliminated by performing dressing for cutting the cutting blade into the dresser board to expose the abrasive grains (dressing). However, in order to perform dressing using a dresser board, it is necessary to interrupt the cutting of the workpiece with the cutting blade, and the dressing operation takes time, which poses a problem of reduced processing efficiency.

On the other hand, there has also been proposed a method of performing dressing by irradiating a cutting blade with a laser beam while processing a workpiece. However, when a laser beam is applied to a cutting blade during cutting, abrasive grains may fall off from the bond material due to ablation, resulting in improper dressing. When a workpiece is cut using such a cutting blade, machining defects tend to occur in the workpiece.

In this embodiment, a workpiece is machined using a cutting blade in which an uneven structure having a size equal to or smaller than the grain size of abrasive grains is formed on a bond material. When the surface of the bonding material has an uneven structure, the contact area between the bonding material and cutting debris is reduced, making it difficult for cutting debris to adhere to the bonding material, thereby suppressing the occurrence of clogging. As a result, it is possible to maintain the state in which the abrasive grains are exposed without frequently performing dressing of the cutting blade, and it is possible to suppress the occurrence of defective processing while suppressing a decrease in processing efficiency.

The uneven structure can be formed by fine processing using a laser beam. Specifically, when a solid material is irradiated with an ultrashort pulse laser beam with an extremely short pulse width (e.g., 10 ps or less), an uneven structure (ripple structure) with a size similar to the wavelength of the laser beam is formed on the surface of the solid material. be done. This ripple structure is thought to be formed by the interference between the incident light of the laser beam and the surface plasma wave generated on the surface of the solid material.

Furthermore, when a solid material is irradiated with an ultrashort pulse laser beam at a low fluence (e.g., 10 times or less, preferably 5 times or less than the ablation threshold), the surface of the solid material has an uneven structure with a size smaller than the wavelength of the laser beam. It is formed. The ablation threshold is the minimum laser beam energy required for ablation processing of a solid material by laser beam irradiation, and its value mainly depends on the melting point of the solid material.

Therefore, in the present embodiment, the bonding material is processed by irradiating the cutting edge of the cutting blade with an ultrashort pulse laser beam. As a result, a fine concave-convex structure having a size equal to or smaller than the grain size of the abrasive grains can be formed on the surface of the bond material.

The shape of the concave-convex structure formed by the irradiation of the ultrashort pulse laser beam depends on the polarization direction of the laser beam. Therefore, by controlling the polarization direction of the laser beam, it is possible to form uneven structures having various shapes on the bonding material. For example, when a linearly polarized laser beam is irradiated, linear projections are formed on the bonding material along a direction perpendicular to the polarization direction. Further, when a circularly polarized or elliptically polarized laser beam is irradiated, a granular projection is formed on the bonding material.

FIG. 2(A) is an enlarged view showing an example of the cutting edge portion 5 in which an uneven structure is formed on the surface of the bonding material. The cutting edge portion 5 shown in FIG. 2A is configured by bonding abrasive grains 13 with a bonding material 11 . A metal bond, a resin bond, a vitrified bond, or the like is used as the bonding material 11 . As the abrasive grains 13, diamond having a grain size of 200 μm or less is used.

For example, when the cutting edge portion 5 is irradiated with a linearly polarized ultrashort pulse laser beam, a plurality of linear projections 11a projecting from the surface of the bonding material 11 are aligned with the polarization direction of the laser beam (the direction indicated by arrow A). It is formed with a predetermined period along the vertical direction. At this time, when the laser beam is irradiated at a low fluence (for example, 10 times or less, preferably 5 times or less than the ablation threshold), the surface of the bonding material 11 is formed with a plurality of protrusions 11a having a width equal to or less than the wavelength of the laser beam. A concavo-convex structure is formed.

The wavelength of the laser beam is appropriately selected so that the width of the protrusion 11a is equal to or less than the grain size of the abrasive grains 13. FIG. For example, when the grain size of the abrasive grains 13 is 1 μm or more, the protrusions 11a with a width of less than 1 μm can be formed on the surface of the bonding material 11 by irradiating a laser beam with a wavelength of about 1 μm or less at a low fluence.

FIG. 2B is an SEM (Scanning Electron Microscope) image of an example of the cutting edge portion 5 in which an uneven structure is formed on the surface of the bonding material 11 . As shown in FIG. 2(B), the surface of the bond material 11 is formed with a fine concave-convex structure composed of a plurality of protrusions 11a each having a width equal to or smaller than the grain size of the abrasive grains 13. As shown in FIG. This concave-convex structure makes it difficult for cutting chips to adhere to the bonding material 11, and clogging of the abrasive grains 13 is suppressed.

In the above description, the case where the linear protrusions 11a are formed by irradiation with a linearly polarized laser beam has been described. Granular protrusions may be formed. Moreover, although the case where the uneven structure was formed in the cutting edge part 5 shown in FIG. 1(A) was demonstrated above, uneven structure can be similarly formed in the cutting edge part 9 shown in FIG.

Next, a configuration example of a laser irradiation apparatus used for manufacturing a cutting blade having a concavo-convex structure will be described. FIG. 3 is a partial cross-sectional front view showing the laser irradiation device 2. As shown in FIG. The laser irradiation device 2 includes a support table 4 that supports a cutting blade having a cutting edge, and a laser processing unit 6 that irradiates the cutting edge of the cutting blade supported by the support table 4 with a laser beam.

Here, a method of manufacturing the cutting blade 1 shown in FIG. 1(A) by processing the cutting blade 15 having the base 17 and the cutting edge portion 19 will be described. The cutting blade 15 is configured in the same manner as the cutting blade 1 except that the cutting edge portion 19 does not have a concave-convex structure.

The upper surface of the support table 4 constitutes a support surface 4a that supports the cutting blade 15. As shown in FIG. The cutting blade 15 is supported by the support surface 4a so that its radial direction is parallel to the support surface 4a. The support table 4 is also connected to a moving mechanism (not shown) and a rotating mechanism (not shown) provided below the support table 4 . The moving mechanism moves the support table 4 in the horizontal direction, and the rotating mechanism rotates the support table 4 around a rotation axis substantially parallel to the vertical direction.

A laser processing unit 6 is arranged above the support table 4 . The laser processing unit 6 is configured to focus a laser beam on a predetermined position on the support table 4 .

The laser processing unit 6 includes a laser oscillator 8 that pulse-oscillates a laser beam with a pulse width of 10 ps or less. The wavelength of the laser beam is not limited. A laser beam pulse-oscillated by a laser oscillator 8 is reflected by a mirror 10 and enters a wavelength plate 12 , and the polarization of the laser beam is controlled by the wavelength plate 12 .

For example, when a linearly polarized laser beam is pulse-oscillated from the laser oscillator 8, by using a λ/2 plate as the wave plate 12, the polarization direction of the linearly polarized laser beam can be controlled. Further, by using a λ/4 plate as the wavelength plate 12, a linearly polarized laser beam can be converted into a circularly polarized or elliptically polarized laser beam. The laser beam that passes through the wavelength plate 12 and whose polarization is controlled is condensed at a predetermined position by the condensing lens 14 .

With the support table 4 and laser processing unit 6 positioned so that the cutting edge 19 of the cutting blade 15 is positioned below the center of the condenser lens 14 , a laser beam is pulse-oscillated from the laser oscillator 8 . As a result, the cutting edge portion 19 of the cutting blade 15 is irradiated with the laser beam.

The irradiation conditions of the laser beam (pulse width, wavelength, energy, numerical aperture (NA) of the condenser lens, etc.) are appropriately adjusted according to the dimensions and shape of the concave-convex structure to be formed on the cutting edge 19. . However, when forming an uneven structure with a size smaller than the wavelength of the laser beam on the bond material, it is preferable to irradiate the laser beam with a low fluence (for example, 10 times or less, preferably 5 times or less than the ablation threshold).

Then, the laser beam is scanned by moving or rotating the support table 4 in a predetermined direction while irradiating the cutting edge portion 19 with the laser beam. Thereby, the laser beam is irradiated over the entire cutting edge portion 19 . Note that the laser beam may be scanned by moving the laser processing unit 6 .

FIGS. 4A, 4B, and 4C are plan views showing examples of the scanning direction of the laser beam with respect to the cutting edge. The laser beam may be scanned circularly along the annular cutting edge portion 19 (FIG. 4A), or may be scanned radially along the radial direction of the cutting edge portion 19 (FIG. 4 (B)). Alternatively, the laser beam may be scanned in parallel at predetermined intervals (FIG. 4(C)).

A cutting blade 1 (see FIG. 1(A)) in which an uneven structure is formed on the surface of the bond material is manufactured by the above-described laser beam irradiation. Although the method of manufacturing the cutting blade 1 has been described here, a cutting blade 7 (FIG. 1(B)) having an uneven structure on the surface of the bond material can also be manufactured by a similar method.

A cutting blade having a concavo-convex structure formed on the surface of the bonding material is attached to a processing apparatus. FIG. 5 is a perspective view showing the processing device 20. As shown in FIG. The machining apparatus 20 includes a chuck table 22 that holds a workpiece 21 and a machining unit (machining means) 24 that performs cutting on the workpiece 21 supported by the chuck table 22 .

The workpiece 21 is formed, for example, in a disc shape and has a front surface 21a and a back surface 21b. The workpiece 21 is partitioned into a plurality of regions by a plurality of lines to be cut (streets) 23 arranged in a grid pattern so as to intersect with each other. etc. is formed. A circular dicing tape 27 having a diameter larger than that of the workpiece 21 is attached to the back surface 21 b side of the workpiece 21 .

The material, shape, structure, size, etc. of the workpiece 21 are not limited. For example, the workpiece 21 can be a wafer made of a material such as semiconductor (silicon, GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, or the like. Moreover, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the device 25 .

The chuck table 22 sucks and holds the workpiece 21 through the dicing tape 27 . The upper surface of the chuck table 22 constitutes a holding surface that holds the workpiece 21, and this holding surface is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 22. ing.

The chuck table 22 is also connected to a moving mechanism (not shown) and a rotating mechanism (not shown) provided below the chuck table 22 . The moving mechanism moves the chuck table 22 in the X-axis direction (processing feed direction) and the Y-axis direction (indexing feed direction), and the rotation mechanism rotates the chuck table 22 around a rotation axis substantially parallel to the vertical direction.

The back surface 21 b side of the workpiece 21 is supported by the holding surface of the chuck table 22 via the dicing tape 27 . In this state, when a negative pressure from a suction source is applied to the holding surface of the chuck table 22 , the workpiece 21 is held by the chuck table 22 by suction.

A processing unit 24 is arranged above the chuck table 22 . The machining unit 24 has a spindle (not shown) whose axis is substantially parallel to the holding surface of the chuck table 22, and a cutting blade 26 is attached to the tip of the spindle. As the cutting blade 26, a cutting blade having a concavo-convex structure according to the present embodiment is used. The spindle is connected to a rotational drive source (not shown) such as a motor, and the cutting blade 26 attached to the spindle is rotated by force transmitted from the rotational drive source.

Further, the processing unit 24 is equipped with an imaging unit 28 for imaging the workpiece 21 and the like sucked and held by the chuck table 22 . The alignment between the chuck table 22 and the processing unit 24 is performed based on the image acquired by the imaging unit 28 .

With the lower end of the cutting blade 26 positioned below the back surface 21b of the workpiece 21, the chuck table 22 is moved in the processing feed direction. As a result, the cutting blade 26 cuts into the workpiece 21 to form a linear cutting groove 21c along the planned cutting line 23 in the workpiece 21 . When the workpiece 21 is cut along all the planned cutting lines 23 , the workpiece 21 is divided into a plurality of device chips each having a device 25 .

The depth of cutting into the workpiece 21 by the cutting blade 26 may be less than the thickness of the workpiece 21 . In this case, after forming the cutting grooves 21c along all the planned cutting lines 23, the workpiece 21 is cut by grinding the back surface 21b side of the workpiece 21 to expose the cutting grooves 21c on the back surface 21b. can be divided into device chips.

As the cutting blade 26, a cutting blade having an uneven structure formed on the surface of the above-described bonding material is used. Therefore, the contact area between the cutting chips generated when cutting the workpiece 21 and the bonding material is reduced, and the cutting chips are less likely to adhere to the bonding material. Therefore, clogging of the cutting blade 26 is prevented, and defective machining of the workpiece 21 is suppressed.

In the above description, an example of forming an uneven structure on the surface of the bond material by irradiating an ultrashort pulse laser beam with a pulse width of about 10 ps or less at a low fluence was mainly described, but this is the method for forming the uneven structure. is not limited to For example, depending on the size of the concavo-convex structure, a laser beam with a pulse width greater than 10 ps (for example, a nanosecond pulse laser) is condensed by a high-NA condensing lens (for example, NA = 0.8 or more) to condense the bond. The concave-convex structure can also be formed by ablating the material.

Next, evaluation results of the workpiece cut by the cutting blade according to this embodiment will be described. In this evaluation, the workpiece was cut using a cutting blade having an uneven structure formed on the surface of the bonding material, and the size of the chipping generated in the workpiece by cutting was measured.

For the evaluation, a silicon wafer having a diameter of 6 inches and a thickness of 0.2 mm was used as a workpiece, and this silicon wafer was cut using the processing apparatus 20 shown in FIG. Specifically, the silicon wafer was sucked and held by the chuck table 22, and the cutting groove was formed in the silicon wafer by cutting the silicon wafer along the planned cutting line from the surface side of the silicon wafer with the cutting blade. The depth of cutting into the silicon wafer by the cutting blade was set to 20 μm.

For cutting, three types of cutting blades A, B, and C having abrasive grains made of diamond bonded with a bond material made of nickel were used. The cutting blade A is a cutting blade that has no uneven structure on the surface of the bonding material and is sharpened by dressing using a dresser board. Cutting blade B is a cutting blade that does not have an uneven structure on the surface of the bonding material and is not dressed using a dresser board. The cutting blade C is a cutting blade according to the present embodiment, in which a concavo-convex structure having a size equal to or smaller than the grain size of abrasive grains is formed on the bond material (see FIG. 2(B)).

The uneven structure of the cutting blade C was formed by laser beam irradiation. The laser beam irradiation conditions were set as follows. The inter-spot distance below corresponds to the distance between the centers of adjacent beam spots when the laser beam is scanned.
Pulse width: 10ps
Wavelength: 1064nm
Energy per pulse: 10 μJ
Spot diameter: 60 μm
Distance between spots: 0.5 μm

Cutting grooves were formed in silicon wafers using the above cutting blades A, B, and C, respectively. Then, the size of chipping caused by cutting (chipping size) was measured in each area on the surface side of the silicon wafer that was partitioned by the cutting grooves. The chipping size is the maximum distance from the cutting surface to the tip of the chipping in the direction parallel to the surface of the silicon wafer. The chipping size was measured at 62 points on each of the silicon wafers cut by the cutting blades A, B, and C.

FIG. 6 is a graph showing the measurement results of the chipping size. As can be seen from FIG. 6, the cutting blade C having the uneven structure formed on the surface of the bonding material suppresses the occurrence of large chipping compared to the cutting blades A and B. Also, the average value of the chipping size when the cutting blade C was used was about 4 μm smaller than when the cutting blade A was used. From this, it can be seen that the cutting blade C is more effective in preventing chipping than the dressing cutting blade A.

From the above results, it was found that forming an uneven structure on the surface of the bonding material of the cutting blade is effective in suppressing the occurrence of large-sized chipping. The suppression of the chipping size is considered to be caused by the uneven structure formed on the bond material, which suppresses clogging and makes it easier to maintain the state in which the abrasive grains are exposed.

As described above, in the present embodiment, a workpiece is machined using a cutting blade in which a concavo-convex structure having a size equal to or smaller than the grain size of abrasive grains is formed on the bond material. When the surface of the bonding material has an uneven structure, the contact area between the bonding material and cutting debris is reduced, making it difficult for cutting debris to adhere to the bonding material, thereby suppressing the occurrence of clogging. As a result, it is possible to maintain the state in which the abrasive grains are exposed without frequently performing dressing of the cutting blade, and it is possible to suppress the occurrence of defective processing while suppressing a decrease in processing efficiency.

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

Reference Signs List 1 cutting blade 3 base 3a opening 3b grip portion 5 cutting edge portion 7 cutting blade 9 cutting edge portion 9a opening 11 bond material 11a protrusion 13 abrasive grain 15 cutting blade 17 base 19 cutting edge portion 21 workpiece 21a surface 21b Back surface 21c Cutting groove 23 Division planned line 25 Device 27 Dicing tape 2 Laser irradiation device 4 Support table 4a Support surface 6 Laser processing unit 8 Laser oscillator 10 Mirror 12 Wave plate 14 Collecting lens 20 Processing device 22 Chuck table 24 Processing unit 26 Cutting blade 28 imaging unit

Claims (5)

A cutting blade having a cutting edge portion containing abrasive grains and a bond material that bonds the abrasive grains,
A cutting blade, wherein the surface of the bonding material is formed with an uneven structure composed of linear projections having a width equal to or smaller than the grain size of the abrasive grains. 2. The cutting blade according to claim 1, wherein the abrasive grains have a grain size of 200 [mu]m or less. A method for manufacturing a cutting blade having a cutting edge portion containing abrasive grains and a bond material that bonds the abrasive grains,
By irradiating the cutting edge with a laser beam having a pulse width of 10 ps or less, the surface of the bonding material is constituted by protrusions having a width equal to or less than the grain size of the abrasive grains and less than the wavelength of the laser beam. A method of manufacturing a cutting blade, comprising forming an uneven structure. A method for manufacturing the cutting blade according to claim 3,
A method for manufacturing a cutting blade, characterized by forming the linear protrusion. A method for machining a workpiece using the cutting blade according to claim 1 or 2,
A method of machining a workpiece, comprising cutting the workpiece along a planned cutting line by causing the cutting blade to cut into the workpiece.

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