JP7162328B2 - IC tag, integrated IC tag resin molded product, and manufacturing method thereof - Google Patents

Description

An embodiment of the present invention relates to an IC tag used for individual identification management of tableware used in restaurants, an IC tag-integrated resin molded product, and a method for manufacturing the same.

2. Description of the Related Art Conventionally, IC tags are attached to tableware for food served at conveyor belt sushi restaurants and restaurants, and individual identification management of the tableware is performed using information such as freshness management and price information possessed by the IC tag. The IC tag is attached to the back side of a resin molded product such as tableware, or is enclosed in the resin molded product by simultaneous molding.

JP-A-2007-65461 JP 2013-215367 A

However, when attaching an IC tag to the back surface of a molded resin product after molding, a step of bonding the IC tag to the attached resin molded product is required, which complicates the manufacturing process. Moreover, in order to protect the attached IC tag, it is necessary to cover the IC tag with a protective sheet or the like. Furthermore, there is a possibility that the attached IC tag may come off when the resin molding is washed.

When enclosing an IC tag inside a resin molded product, the existing mold cannot be used, and a new mold must be created to enclose the IC tag, increasing the manufacturing cost. . In addition, in order to sandwich the IC tag between the resins, it is necessary to perform primary molding twice, in which the molding material is placed in a mold and pressurized and heated, which complicates the manufacturing process. Furthermore, since a space for enclosing the IC tag is generated inside the resin molded product, there is a possibility that the strength of the resin molded product is lowered.

The present invention has been proposed to solve the above problems. An object of the present invention is to provide an IC tag that has high strength when integrated with a resin molded product. Another object of the present invention is to provide an IC tag-integrated resin molded article having high strength and a method for producing the same.

The IC tag of the present invention has the following configuration.
(1) An IC chip, an antenna connected to the IC chip, and resin-impregnated paper impregnated with a thermosetting resin sandwiching the IC chip and the antenna.

(2) The resin-impregnated paper includes a welded portion formed so as to surround the antenna. good.

Further, the resin molded product of the present invention is a resin molded product in which the IC tag of (1) or (2) above is integrated, and has the following configuration.
(3) The resin molded product contains a thermosetting resin, and the surface of the IC tag is flush with the surface of the resin molded product.

(4) The thermosetting resin impregnated in the resin-impregnated paper of the IC tag may be the same as the thermosetting resin contained in the resin molding.
(5) Both the thermosetting resin impregnated in the resin-impregnated paper of the IC tag and the thermosetting resin contained in the resin molding may be melamine resin.

A method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product integrated with the IC tag according to (1) or (2) above, and includes the following steps.
(6) A primary molding step in which the molding material for the resin molded product is placed in a mold and heated.
(7) An IC tag integration step of placing the IC tag on the molding material during the primary molding step.

(8) In the IC tag integration step, the IC tag may be placed on the molding material immediately before the molding material is solidified.

(9) The method may further include a preheating step of heating the molding material of the resin molded product before the primary molding step.

According to the present invention, it is possible to provide an IC tag that can be integrated with a resin molded product in a small number of manufacturing processes. Also, it is possible to provide an IC tag-integrated resin molded article having high strength and a method for producing the same.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the IC tag which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is sectional drawing. FIG. 2 is a bottom view of a resin molded product integrated with an IC tag according to the first embodiment of the present invention; 4 is a photograph of the bottom surface of a resin molded product integrated with an IC tag according to the first embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the manufacturing method of the resin molded product with which the IC tag which concerns on the 1st Embodiment of this invention was integrated, (a) and (b) are primary molding processes, (c) and (d) ) indicates the IC tag integration step.

[1. Constitution]
(IC tag)
Hereinafter, IC tags according to embodiments of the present invention will be described with reference to the drawings. 1(a) and 1(b) are a top view and a cross-sectional view showing the configuration of an IC tag 100 of this embodiment. IC tag 100 includes IC chip 1 , antenna 2 , and resin-impregnated paper 3 . The IC tag 100 is configured so that information can be read and written wirelessly by a reader/writer (not shown).

The IC chip 1 is an integrated circuit formed on a semiconductor, and has, for example, a storage section, transmission section, and reception section (not shown). The receiving section of the IC chip 1 is configured to be able to receive data transmitted by the reader/writer using power supplied via the antenna 2 . The received data can be saved in the storage unit. Also, the transmission unit of the IC chip 1 is configured to be able to transmit the information stored in the storage unit to the reader/writer. Since the IC tag 100 of the present embodiment is assumed to be integrated with a resin molded product as described later, from the viewpoint of miniaturization, the IC chip 1 is, for example, 1 mm square and 0.16 mm thick. is preferred. However, the size and shape of the IC chip 1 are not limited to these.

Antenna 2 is an antenna for transmitting and receiving data by wireless communication with a reader/writer. An arbitrary frequency may be used as the radio frequency used for communication. The antenna 2 is, for example, a coil wound with a 0.085 mm metal wire. Aluminum or copper wires can be used as metal wires. When a coiled antenna or the like of a reader/writer is brought close to the antenna 2 , electromagnetic waves or radio waves from the reader/writer generate power to drive the IC chip 2 .

Since the IC tag 100 of the present embodiment is assumed to be integrated with a resin molded product as described later, it is preferable to use an antenna 2 with a diameter of about 22.5 mm from the viewpoint of miniaturization. However, the size of the antenna 2 is not limited to this, and it is preferable to select an antenna of an appropriate size in consideration of the communication distance and the like. In the example of FIG. 1, the antenna 2 in which the wire is wound in a perfect circle is used, but an antenna 2 having other shapes such as an ellipse or a rectangle may be used.

The IC tag 100 of this embodiment has resin-impregnated paper 3 provided so as to sandwich the IC chip 1 and the antenna 2 therebetween. That is, IC chip 1 and antenna 2 are enclosed in resin-impregnated paper 3 . The resin-impregnated paper 3 is paper impregnated with resin. Paper can be applied as long as it has high water absorbency, and for example, cellulose fibers, synthetic fabrics, non-woven fabrics, microfibers, nanofibers, cellulose, etc. are preferably used. In particular, an overlay base paper made from, for example, natural pulp fibers is suitable because of its excellent impregnability with resin.

The resin is a thermosetting resin such as melamine resin, urea resin, phenol resin, unsaturated polyester resin, and epoxy resin. The resin-impregnated paper 3 can be prepared by impregnating the paper with an aqueous melamine solution having a concentration of 40 to 60 wt % for about 20 to 40 minutes and then drying it for about 1 to 2 minutes.

In the example of FIG. 1, a rectangular resin-impregnated paper 3 is illustrated, but the shape of the resin-impregnated paper 3 is not limited to this. The resin-impregnated paper 3 may have an area larger than the outline of the antenna 2 so that the IC chip 1 and the antenna 2 can be enclosed. The resin-impregnated paper 3 may be formed with a welded portion 4 so as to surround the antenna 2 as described below. Therefore, it is preferable to have a predetermined space on the outer peripheral side of the antenna 2 so that the welded portion 4 can be formed.

For example, the IC tag 100 may have the IC chip 1 and the antenna 2 enclosed between two sheets of resin impregnated paper 3 . Specifically, as shown in FIG. 1(b), the IC chip 1 and the antenna 2 are placed on the lower resin-impregnated paper 3a, and the upper resin-impregnated paper 3b is placed thereon. ing. After arranging each member in this way, a hot iron or the like is pressed around the antenna 2 and heated, thereby forming a welded portion 4 in the facing resin-impregnated papers 3a and 3b.

The thermosetting resin contained in the resin-impregnated papers 3a and 3b is partially dissolved by being heated, and then the thermosetting resin of the resin-impregnated paper 3a and the thermosetting resin of the resin-impregnated paper 3b are dissolved. The welded portion 4 is formed by hardening in a mixed state. The portions of the resin-impregnated papers 3a and 3b heated by a hot iron or the like in this manner are fused together. It should be noted that the temperature and pressing time of the hot iron are preferably set to a temperature and a time at which sufficient welding can be achieved by the welded portion 4 and discoloration does not occur in the welded portion 4 .

The example of FIG. 1(a) shows an example in which a rectangular resin-impregnated paper 3 is pressed along each of the four sides with a linear hot iron. One welded portion along each side has a length such that it can intersect with two welded portions extending in the orthogonal direction at both ends thereof. Therefore, a rectangular welded portion 4 is formed by the welded portion on four sides. However, the shape of the welded portion 4 is not limited to this, and may be a circular shape that matches the shape of the antenna 2 . Alternatively, the welded portion 4 may be formed at once by pressing a circular or rectangular hot iron onto the resin-impregnated paper 3 .

Moreover, a certain amount of space is required between the welded portion 4 and the outer circumference of the antenna 2 so that the antenna 2 is not damaged by the heat of the iron that is pressed to form the welded portion 4 . However, the space between the welded portion 4 and the outer circumference of the antenna 2 is preferably 6 to 7 mm or less. This is because if the space exceeds 10 mm, the IC chip 1 and the antenna 2 move more than necessary in the space defined by the welded portion 4, which may cause damage.

(Resin molded product)
A resin molded product 200 in which the IC tag 100 as described above is integrated will be described with reference to FIG. The resin molded product 200 is a molded product such as tableware molded using a thermosetting resin. As the thermosetting resin, for example, melamine resin, urea resin, phenol resin, unsaturated polyester resin, and epoxy resin may be used.

Moreover, the thermosetting resin contained in the resin molded product 200 is preferably the same as the thermosetting resin impregnated in the resin-impregnated paper 3 of the IC tag 100 . This is because if the same thermosetting resin is used for the IC tag 100 and the resin molded article 200, compatibility during integral molding is improved. In addition to the thermosetting resin, the resin molded product 200 can contain other materials such as pulp material and curing agent.

In the following example, the resin molded product 200 will be described as tableware used in restaurants, conveyor belt sushi restaurants, and the like. The resin molded product 200 is integrated with the IC tag 100 at the central position of the back surface of the tableware. At the time of integral molding, the resin-impregnated paper 3 melts as the thermosetting resin contained in the resin-impregnated paper 3 is heated, and then hardens while being mixed with the thermosetting resin of the resin molded product 200 . becomes the hardened portion 5. Since the welded portion 4 of the IC tag 100 is melted again and then cured, the welded portion 4 disappears in the IC tag 100 integrated with the resin molded product 200 .

FIG. 3 shows an enlarged photograph of the back surface of the tableware that is the resin molded product 200. As shown in FIG. As is clear from FIG. 3, the boundary between the back surface of the tableware and the front surface of the IC tag 100 is flush with the front surface, and is flat without steps. In other words, the IC tag 100 is not embedded inside the resin molded product 200 but is integrated on the surface of the resin molded product 200 . Therefore, the IC chip 1 and the antenna 2 included in the IC tag 100 are visible.

However, since the IC chip 1 and the antenna 2 are enclosed in the resin-impregnated paper 3, the surface of the resin-impregnated paper 3 that has become the cured portion 5 is flush with the surface of the back surface of the tableware. , the IC chip 1 and the antenna 2 do not appear on the back surface of the tableware. That is, the IC chip 1 and the antenna 2 are embedded in the resin molding 200 by the thickness of the resin-impregnated paper 3 .

[2. Method for manufacturing resin molded product]
The manufacturing method of the resin molded product 200 of the present embodiment as described above includes the following steps.
(1) A preheating process for heating the molding material for the resin molded product (2) A primary molding process for heating the molding material for the resin molded product in the mold (3) During the primary molding process, the IC tag is IC tag integration process placed on molding material

In the example described below, the IC tag of the present embodiment is used to manufacture the resin molded product 200 integrated with the IC tag by the existing metal mold 21 . Also, the resin molded product 200 to be manufactured will be described as tableware.

(1) Preheating Step In the preheating step, the molding material 22 of the resin molded product 200 is heated. By heating the molding material 22 to a high temperature by preheating, the speed at which the molding material 22 expands within the mold 21 can be increased. In order to integrate the IC tag 100 at the desired position of the resin molded product 200, it is necessary to appropriately set the preheating temperature, the molding pressure of the mold 21, and the mold temperature. Therefore, the preheating temperature must be appropriately determined in consideration of not only the properties of the molding material 22 but also the conditions of the mold 21 .

As an example, when the pressure of the mold 21 is 140 kg/cm ² , the temperature of the mold 21 is 165° C. for the upper mold and 170° C. for the lower mold, and if melamine resin is used as the molding material 22, preheating is Preferably, the temperature of the molding material 22 reaches 108.degree. C. to 131.degree. If the temperature of the molding material 22 is less than 108° C., the elongation of the molding material 22 inside the mold 21 is poor, resulting in breakage of the IC tag 100 . Moreover, when the temperature of the molding material 22 exceeds 131° C., preheating progresses too much, so surface defects of the resin molded product 200 occur.

(2) Primary Molding Step As shown in FIG. 4A , in the primary molding step, a molding material 22 containing a thermosetting resin is put into a mold 21 for forming a resin molded product 200 . Although one molding material 22 is illustrated in the figure, the molding material 22 may be in the form of powder or tablet. After charging the molding material 22 into the mold 21, the mold 21 is closed and heated.

The heating temperature can be appropriately set according to the molding material 22 to be used, but is preferably 150 to 180.degree. By this heating, as shown in FIG. 4B, the molding material 22 melts into a liquid state and spreads in the space inside the mold 21 . Then, the molding material 22 spread in the space inside the mold 21 starts to solidify due to a chemical reaction caused by heating.

(2) IC Tag Integration Process In the primary molding process, the mold 21 is opened immediately before the molding material 22 solidifies. "Just before the molding material 22 solidifies" means about 3 seconds before the time when the molding material 22 completely solidifies. However, depending on the size, thickness, etc. of the resin molded product 200 to be formed, the time corresponding to immediately before the molding material 22 is solidified slightly differs.

Then, as shown in FIGS. 4(c) and 4(d), after the IC tag 100 is placed at a desired position on the molding material 22, the mold 21 is closed again and heating is performed. At this time, it is preferable to keep the initial pressure of the mold 21 for less than 5 seconds. The heating temperature may be the same as the heating temperature in the primary molding process. By completely solidifying the molding material 22 with the IC tag 100 placed thereon, a resin molded product 200 with the IC tag 100 integrated on the surface is manufactured.

It should be noted that the resin molded product 200 manufactured as described above can be subjected to a secondary molding step of applying a pattern to the resin molded product 200 as in the conventional art. Further, after the secondary molding process, a tertiary molding process of coating the periphery of the resin molded product 200 may be performed.

[3. Action effect]
The effects of the IC tag, IC tag-integrated resin molded product, and method of manufacturing the same according to the present embodiment having the above configuration will be described below.
(1) The IC tag 100 has an IC chip 1, an antenna 2 connected to the IC chip 1, and resin-impregnated paper 3 impregnated with a thermosetting resin, sandwiching the IC chip 1 and the antenna 2. .

Although the IC tag 100 as described above has a very simple structure consisting of the IC chip 1, the antenna 2, and the resin-impregnated paper 3, it can be completely integrated with the resin molding 200 containing thermosetting resin. be. Therefore, it can have high strength when integrated with the resin molded product 200 . In addition, since the IC tag 100 is thin, an existing mold can be used when it is integrated with a resin molded product.

(2) The resin-impregnated paper 3 includes a welded portion 4 formed so as to surround the antenna 2. At the welded portion 4, the thermosetting resin contained in the facing resin-impregnated paper 3 is welded. .

By forming the welding portion 4 so as to surround the periphery of the antenna 2 , movement of the IC chip 1 and the antenna 2 inside the resin-impregnated paper 3 is restricted. Therefore, IC chip 1 and antenna 2 are prevented from being damaged. In addition, it is possible to fix the IC chip 1 and the antenna 2 inside the resin-impregnated paper 3 by the welding part 4 , so that the IC chip 1 and the antenna 2 are prevented from deviating from the resin-impregnated paper 3 when integrated with the resin molded product 200 .

(3) A resin molded product 200 in which the IC tag 100 is integrated, the resin molded product 200 containing a thermosetting resin, and the surface of the IC tag 100 and the surface of the resin molded product 200 being flush with each other. is.

Since the resin molded product 200 is completely integrated with the IC tag 100, the surface of the resin molded product 200 and the surface of the IC tag 100 are flat with no step. Therefore, the IC tag 100 will not come off during cleaning of the resin molded product. Also, the IC tag 100 is integrated with the surface of the resin molded product 200 rather than inside it. Therefore, unlike the case where the IC tag 100 is embedded inside the resin molded product 200, the strength of the resin molded product 200 is not lowered. As described above, the resin molded product 200 having high strength can be provided.

(4) The thermosetting resin impregnated in the resin-impregnated paper 3 of the IC tag 100 and the thermosetting resin contained in the resin molding 200 are the same.

Since both the IC tag 100 and the resin molded product 200 contain the same thermosetting resin, compatibility during integral molding is improved, and both thermosetting resins are mixed and solidified. Therefore, it is possible to provide a resin molded product 200 having higher strength.

(5) Both the thermosetting resin impregnated in the resin-impregnated paper 3 of the IC tag 100 and the thermosetting resin contained in the resin molding 200 are melamine resin.

The molding material for the resin molded product 200 containing melamine resin generally contains pulp material in addition to melamine resin. The IC tag 100 is composed of resin-impregnated paper 3 and melamine resin. Therefore, both the IC tag 100 and the resin molded product 200 are configured to contain paper and melamine resin. Therefore, the compatibility during integral molding is improved, and the strength of the resin molded product 200 can be increased.

(6) A method for manufacturing the resin molded product 200 integrated with the IC tag 100, comprising a primary molding step of putting the molding material 22 of the resin molded product 200 into a mold 21 and heating, and a primary molding step. An IC tag integration step of placing the IC tag 100 on the molding material 22 is included in the middle.

By inserting the IC tag 100 in the middle of the primary formation process, the IC tag 100 and the resin molded product 200 can be completely integrated. Therefore, it is possible to increase the strength of the manufactured IC tag-integrated resin molded product.

(7) In the IC tag integration step, the IC tag 100 is placed on the molding material 22 immediately before the molding material 22 solidifies.

By inserting the IC tag 100 just before the molding material 22 solidifies, the surface of the IC tag 100 and the surface of the resin molded product 200 can be made flush with each other. By integrating the IC tag 100 on the surface of the resin molded product 200, it is possible to visually confirm whether or not the IC tag 100 is at a desired position. Compared to the conventional case of embedding inside, the quality inspection is easier, and the quality of the resin molded product 200 can be improved.

(8) It further includes a preheating step of heating the molding material 22 of the resin molded product 200 before the primary molding step.

In the IC tag integration process, when the metal mold 21 is closed after the IC tag 100 is placed, the IC tag 100 is also pulled in the horizontal direction by the molding material 22 extending in the metal mold 21 . Therefore, in the IC tag integration process, there is a possibility that the IC tag 100 may be displaced from the placed position, or damage such as breakage of the IC tag 100 or breakage of the antenna 2 may occur. However, when the molding material 22 is preheated, the temperature of the molding material 22 rises and the elongation in the mold 21 improves. Therefore, the stretching direction of the molding material 22 becomes uniform, and uniform tension is generated around the IC tag 100 . Therefore, for example, as shown in FIG. 2, the IC tag 100 is integrated so as to be accurately positioned in the center of the back surface of the tableware. That is, the IC tag 100 can be integrated with the resin molded product 200 at the placed position.

[4. Example]
The present invention will be described in more detail below based on examples. In addition, the present invention is not limited to the following examples.

(Comparative example 1)
Using melamine resin as a molding material, a plate was molded in which two sheets of resin-impregnated paper were heat-sealed to form a single foil. The melamine resin was heated using a preheater for 22 seconds, and the primary molding process and the IC tag integration process were performed. The mold pressure was 140 kg/cm ² , and the mold temperature was 165° C. for the upper mold and 170° C. for the lower mold.

(Comparative example 2)
This is the same as Comparative Example 1 except that the melamine resin is heated using a preheater for 37 seconds.

(Comparative Example 3)
This is the same as Comparative Example 1 except that the melamine resin is heated for 42 seconds using a preheater.

(Example 1)
This is the same as Comparative Example 1 except that the melamine resin is heated for 47 seconds using a preheater.

(Example 2)
This is the same as Comparative Example 1 except that the melamine resin is heated for 52 seconds using a preheater.

In Examples 1 and 2 and Comparative Examples 1 to 3, the state of the foil in the molded dish and the state of the surface texture of the dish were visually confirmed. The results are shown in Table 1. The tablet temperature in Table 1 is the temperature of the molding material measured immediately after heating with the preheater.

As is clear from Table 1, in Comparative Examples 1-3, the foil was broken. This is probably because the tablet temperature was low due to the short heating time, and the elongation of the molding material in the mold was poor. In other words, it is thought that the foil was pulled toward the side of the molding material that stretched with a stronger force because the direction of stretching of the molding material was not uniform in the mold, and the foil was broken. On the other hand, in Examples 1 and 2, the foil did not break. In Examples 1 and 2, the tablet temperature was high due to the long heating time, so that the elongation of the molding material in the mold was improved, and the elongation direction of the molding material was uniform. However, in Example 2, the temperature of the molding material 22 became high and the preheating progressed too much, so there was a defect that the resin flow appeared on the surface of the molded product.

Next, with respect to Comparative Example 3, the initial pressure was maintained during the IC tag integration process, and the state of the foil in the molded dish and the state of the surface texture of the dish were visually confirmed. The results are shown in Table 2.

As is clear from Table 2, when the initial pressure was maintained, the foil did not break even if the heating time was 42 seconds. The reason for this is considered to be that the elongation of the resin improved due to the rise in the resin temperature due to the holding of the initial pressure, and the state of the resin approached the state of the resin with the heating time of 47 seconds in Table 1. However, when the initial pressure was maintained for 5 seconds, defects occurred in the surface texture of the resin molded product. The reason for this is thought to be that the resin temperature rose too much due to the longer initial pressure holding time, and approached the state of the resin with the heating time of 52 seconds in Table 1. On the other hand, when the initial pressure was maintained for 2 seconds, the surface texture of the resin molded product was good, and favorable results were obtained. From the above, it has been clarified that even when the preheating temperature is low, the foil can be prevented from breaking by maintaining the initial pressure.

[4. Other embodiments]
In the above embodiment, the IC chip 1 and the antenna 2 are enclosed in two resin-impregnated papers 3a and 3b. However, it is also possible to use resin-impregnated paper having two facing surfaces with one common side by folding one sheet of resin-impregnated paper in half. In this case, the welded portion 4 formed by using a straight hot iron may be three sides, and the manufacturing process can be simplified. Of course, the welding parts 4 may be formed on three sides at once by pressing a U-shaped hot iron.

In the above embodiment, the IC tag 100 in which the IC chip 1 is located on the inner peripheral side of the antenna 2 is illustrated. However, the IC chip 1 may be arranged on the outer peripheral side of the antenna 2 . In that case, the welded portion 4 may be formed so as to surround the outer periphery of the IC chip 1 and the antenna 2 .

In the above embodiment, the resin molded product 200 in which the IC tag 100 is integrated is manufactured by taking tableware as an example. However, the resin molded product 200 integrated with the IC tag 100 is not limited to tableware. For example, the resin molded product 200 can be used as a decorative item such as a brooch, and the IC chip 1 can be used to store the name and contact information.

DESCRIPTION OF SYMBOLS 100... IC tag 1... IC chip 2... Antenna 3... Resin-impregnated paper 4... Welding part 5... Hardening part 200... Resin molded product 21... Mold 22... Molding material

Claims (7)

an IC chip;
an antenna connected to the IC chip;
a resin-impregnated paper impregnated with a thermosetting resin that sandwiches the IC chip and the antenna;death,
The resin-impregnated paper includes a welded portion formed to surround the antenna,
The thermosetting resin contained in the facing resin-impregnated paper is welded to the welded portion. IC tag. A resin molded product in which the IC tag according to claim 1 is integrated,
The resin molded product contains a thermosetting resin,
An IC tag-integrated resin-molded article, wherein the surface of the IC tag and the surface of the resin-molded article are flush with each other. 3. The IC tag-integrated resin molded product according to claim 2 , wherein the thermosetting resin impregnated in the resin impregnated paper of said IC tag and the thermosetting resin contained in said resin molded product are the same. 4. The IC tag integrated resin molded article according to claim 3 , wherein the thermosetting resin impregnated in the resin-impregnated paper of the IC tag and the thermosetting resin contained in the resin molded article are both melamine resin. A method for manufacturing a resin molded product in which the IC tag according to claim 1 is integrated,
A primary molding step of putting the molding material of the resin molded product into a mold and heating it;
and an IC tag integrating step of placing the IC tag on the molding material during the primary molding step. 6. The resin molded product integrated with an IC tag according to claim 5 , wherein in said IC tag integrating step, said IC tag is placed on said molding material immediately before said molding material is solidified. 7. The method of manufacturing a resin molded product integrated with an IC tag according to claim 5 , further comprising a preheating step of heating the molding material of said resin molded product before said primary molding step.

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