JP7162191B2 - Implementation method and data generator - Google Patents

Description

The present disclosure relates to, for example, a mounting method for mounting a component or the like on a substrate, a data generation device for generating mounting data for mounting the component or the like, and the like.

Conventionally, there has been proposed an electronic component mounting method (hereinafter referred to as a mounting method) in which a plurality of electronic components are picked up from a plurality of parts feeders and mounted on a substrate (see, for example, Patent Document 1). In addition, hereinafter, the electronic component is also simply referred to as a component.

In the mounting method of Patent Document 1, when a plurality of components of the same type are mounted on the same board to produce a mounting board, components with different electrical characteristics are prevented from being mixed on the board. process. In this process, before mounting on the board, the number of parts remaining in the parts feeder is compared with the target number of parts to be mounted on the board. , to deactivate the placement head. When the operation of the mounting head is stopped, for example, by replacing the parts feeder with a parts feeder having more parts than the target number of mounted parts, mixed loading of parts with different electrical characteristics as described above can be achieved. can be prevented.

WO2012/035703

However, the mounting method of Patent Document 1 may produce a large number of mounting boards that are likely to cause defects. For example, in order to shorten the takt time for mounting components on a board, a component mounter may be equipped with a plurality of parts feeders that store components of the same type. Note that the tact is the time required to produce one mounting board. In such a case, even with the mounting method of Patent Document 1, when components supplied from these parts feeders are mounted on a board, there is a possibility that components with different electrical characteristics will be mixed on the board. In addition, there are cases where the defect rate of parts differs among a plurality of parts feeders that store the same type of parts. As a result, when parts supplied from a parts feeder containing parts with a high defect rate are mounted on many boards, there is a possibility that all of the many boards must be collected. In other words, many products with those substrates may all have to be recalled.

Therefore, the present disclosure provides a mounting method and the like capable of suppressing the production of mounting substrates that are likely to cause defects.

A mounting method according to an aspect of the present disclosure is a mounting method for mounting a plurality of components on a substrate using a head, and comprises: for each component to be mounted on the substrate, the component and a component housing for storing the component; a data generation step of generating mounting data indicating the mounting data in association with the head; a mounting step of acquiring the component and mounting it on the board using the above; and a management step of acquiring the defect rate of each type of component mounted on the board, wherein In the step, when a plurality of components to be mounted on the board includes a component whose defect rate is equal to or higher than a threshold value, the mounting data for the component whose defect rate is equal to or higher than the threshold value according to a constraint condition. is generated, and the constraint condition is, for each of all the components of the same type, when there are a plurality of components of the same type whose defect rate is equal to or greater than the threshold among the plurality of components mounted on the board. is a condition for associating the same component container.

A data generation device according to one aspect of the present disclosure is a data generation device that generates mounting data for mounting a plurality of components on a board using a head, wherein for each component to be mounted on the board, the component and a component container that stores the component, a generation unit that generates mounting data indicating the component storage body that stores the component, an output unit that outputs the mounting data , and a management unit that acquires a defect rate of a component, and the generating unit, when a plurality of components mounted on the board includes a type of component with the defect rate equal to or greater than a threshold, the defect rate is equal to or greater than the threshold. The mounting data is generated according to a constraint condition for the type of component, and the constraint condition is that the plurality of components mounted on the board include a plurality of components of the same type whose defect rate is equal to or greater than a threshold value . In the case, the condition is to associate the same parts container with each of all the parts of the same type.

In addition, these general or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media. Also, the recording medium may be a non-temporary recording medium.

The mounting method of the present disclosure can reduce the production of mounting substrates that are likely to cause defects.

FIG. 1 is an external view of a component mounting system according to an embodiment. FIG. 2 is an external view of the component mounter according to the embodiment. FIG. 3 is a plan view showing the main configuration of the component mounter according to the embodiment. FIG. 4 is a schematic diagram showing the positional relationship between the head and the component supply device in the embodiment. FIG. 5 is an external view showing an external appearance of an electronic component to be mounted in the embodiment. FIG. 6 is a diagram showing an example of a component tape and a component reel containing electronic components in the embodiment. FIG. 7 is a schematic diagram showing the positional relationship between the rotary head and the component supply device in the embodiment. FIG. 8 is a block diagram showing the functional configuration of the data generation device according to the embodiment. FIG. 9 is a diagram showing an example of a board on which components are mounted by the component mounter according to the embodiment. 10A is a diagram illustrating an example of mounting data generated by a generation unit in the embodiment; FIG. 10B is a diagram illustrating an example of optimized mounting data according to the embodiment; FIG. FIG. 11 is a diagram showing the relationship between a component mounted on a board and a component container containing the component in the embodiment. FIG. 12A is a flowchart illustrating an example of mounting data optimization processing in the embodiment. FIG. 12B is a flowchart illustrating another example of mounting data optimization processing in the embodiment. FIG. 13 is a flowchart showing in more detail the process of optimizing mounting data of FIG. 12A. 14A and 14B are diagrams showing an example of division of the component storage body according to the embodiment. FIG. FIG. 15 is a flowchart illustrating an example of processing for selecting a component pickup method according to the embodiment. FIG. 16 is a flow chart showing an implementation method according to the embodiment.

In order to solve the above problems, a mounting method according to one aspect of the present disclosure is a mounting method for mounting a plurality of components on a substrate using a head, wherein each component mounted on the substrate is , a data generation step of generating mounting data indicating a component container that stores the component in association with the component according to the constraint; a mounting step of obtaining the component from the component storage body associated with the head using the head and mounting the component on the board, wherein the constraint conditions are the same for a plurality of components to be mounted on the board. When there are a plurality of parts of the same type, it is a condition for associating the same parts container with each of all the parts of the same type. For example, a component storage body consists of a component tape for storing components and a component reel around which the component tape is wound.

As a result, mounting data indicating the association between the component and the component container is generated according to the constraint conditions, and for each component to be mounted, the component is obtained from the component container associated with the component in the mounting data. mounted on the board. Therefore, even if a plurality of component storage bodies that store the same type of components are attached to the component mounting machine in order to shorten the takt time, the mounting data generated according to the constraint conditions will not be the same for the board. The same component container is associated with all mounting target components of a type. As a result, all components to be mounted of the same type are obtained from the same component container and mounted on the board without being obtained from different component containers.

Further, as described above, there is a case where the defective rate of parts differs among a plurality of component storage bodies that store the same type of parts. In the mounting method according to one aspect of the present disclosure, even if all the components to be mounted on the board of the same type are obtained from the component storage body with the high defect rate and mounted on the board, the components are generated using those components. It is possible to reduce the number of mounting boards that are mounted. For example, when a component container contains N components, and the number of components to be mounted on a substrate of the same type is k, and the k components are supplied from two component containers, they are The number of mounting boards produced using the components from the component storage body is (2N/k). Note that N and k are each integers of 2 or more. In other words, if the defect rate of at least one of the two component storage bodies is high, (2N/k) mounting boards that are likely to cause defects will be produced. On the other hand, in the mounting method according to one aspect of the present disclosure, since all the k components are supplied from the same component storage body, the number of mounted boards generated using the components from the component storage body is (N/k) sheets. In other words, when the defect rate of the component storage body is high, the number of production boards that are likely to cause defects can be suppressed to (N/k). As a result, even if a product having a mounting substrate is recalled, the number of recalled products can be suppressed.

For example, the substrate may be any one of a plurality of individual substrates included in a multi-panel substrate.

As a result, even if a product having an individual board on which a plurality of components are mounted is recalled, the number of recalled products can be suppressed.

Further, the mounting method further includes mounting the same component storage body such that each of the plurality of components stored in the same component storage body is stored in one of the plurality of component storage bodies. a dividing step of dividing into a plurality of component storage bodies, and in the data generation step, by associating each of all the components of the same type with one of the plurality of component storage bodies, Data may be generated according to the constraints. Here, the head includes a plurality of nozzles, and in the mounting step, the plurality of supplied components, which are components supplied from the plurality of component storage bodies, are simultaneously picked up by the plurality of nozzles of the head. By doing so, the plurality of supply components may be obtained and mounted on the board.

Merely mounting components based on mounting data generated according to the constraints described above may increase the takt time. However, as described above, when the same component storage body is divided into a plurality of component storage bodies and the supplied components supplied from the plurality of component storage bodies are simultaneously sucked and mounted on the board, the An increase in takt time can be suppressed.

Further, a data generation device according to one aspect of the present disclosure is a data generation device that generates mounting data for mounting a plurality of components on a board using a head, wherein for each component to be mounted on the board, a generation unit for generating mounting data indicating the association between the component and a component container for containing the component according to a constraint; and an output unit for outputting the mounting data, wherein the constraint is the board. When there are a plurality of components of the same type among the plurality of components to be mounted on the same type, the condition is to associate the same component container with each of all the components of the same type.

As a result, mounting data showing the components and component containers in association with each other is generated and output according to the constraint conditions. Then, in the component mounter, each of the components to be mounted is acquired from the component container associated with the component in the mounting data and mounted on the board. As a result, the same effect as the mounting method according to one aspect of the present disclosure described above can be obtained.

For example, the substrate may be any one of a plurality of individual substrates included in a multi-panel substrate.

As a result, even if a product having an individual board on which a plurality of components are mounted is recalled, the number of recalled products can be suppressed.

Further, the same parts storage body is divided into the plurality of parts storage bodies so that each of the plurality of parts stored in the same parts storage body is stored in one of the plurality of parts storage bodies. the generation unit generates the mounting data according to the constraint conditions by associating each of the components of the same type with one of the plurality of component storage bodies. You may Here, the head includes a plurality of nozzles, and the generation unit further employs a suction method in which components supplied from the plurality of component storage bodies are simultaneously picked up by the plurality of nozzles of the head. may generate information to indicate

Merely mounting components based on mounting data generated according to the constraints described above may increase the takt time. However, when the same component storage body is divided into a plurality of component storage bodies, by outputting information indicating a pickup method according to the division to the component mounter, the pickup method indicated by the information is output. , the component can be picked up by the component mounter. In other words, the components supplied from each of the plurality of divided component storage bodies can be simultaneously picked up by the plurality of nozzles of the head. As a result, an increase in the takt time can be suppressed.

In addition, the data generation device further includes a management unit that acquires a defect rate for each type of component mounted on the board, and the generation unit is configured to obtain a defect rate for each type of component mounted on the board. When there are types of components with the defective rate equal to or higher than the threshold, the mounting data may be generated according to the constraint conditions for the types of components with the defective rate equal to or higher than the threshold.

As a result, the mounting data is generated according to the constraint conditions for the types of parts with a high defect rate, so the mounting data is generated according to the constraint conditions even for the types of parts with a low defect rate. can be suppressed. That is, it is possible to generate mounting data so that the takt time is shortened for a type of component with a low defect rate.

In addition, these general or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. Or it may be realized by any combination of recording media. Also, the recording medium may be a non-temporary recording medium.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are examples and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept will be described as arbitrary constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component.

(Embodiment)
[System configuration]
FIG. 1 is an external view of a component mounting system according to an embodiment.

A component mounting system 1000 according to the present embodiment includes a plurality of component mounters 100 (six component mounters 100 in the example shown in FIG. 1) and a data generation device 200 .

A plurality of component mounters 100 are configured as a production line that mounts components such as electronic components while sending circuit boards (hereinafter simply referred to as boards) 20 from upstream to downstream. That is, each component mounter 100 receives the board 20 from the upstream side, mounts the component on the board 20, and sends out the board 20 on which the component is mounted to the downstream side. Note that the board 20 on which components are mounted by such a production line composed of a plurality of component mounters 100 is hereinafter referred to as a mounted board.

The data generation device 200 generates mounting data for mounting components on a production line composed of a plurality of component mounters 100 . Then, the data generation device 200 instructs an operator who uses, manages, or operates the component mounting system 1000 or each component mounter 100 to mount the component on the board 20 according to the mounting data. do. For example, the data generation device 200 outputs the mounting data to each mounter 100 .

[Mounting machine]
FIG. 2 is an external view of the component mounter 100. As shown in FIG.

The mounter 100 includes, for example, two sub-equipments (front sub-equipment 110 and rear sub-equipment 120) that mount components simultaneously and independently. Each sub-equipment 110, 120 is an orthogonal robot type mounting stage, and includes a component supply unit 115, a multi-mounting head 112, an XY robot 113, a component recognition camera 116, and the like. In addition, the rear sub-equipment 120 includes a tray supply section 117 . The component supply unit 115 is composed of an array of a plurality of component supply devices (feeders) 114 each accommodating a component tape.

The multi-mounting head 112 (hereinafter simply referred to as head) can be provided with, for example, up to 10 suction nozzles (hereinafter simply referred to as nozzles), and can pick up, for example, up to 10 components from the component supply device 114 described above. It can be attached to the substrate 20 . The XY robot 113 is for moving the head 112 . The component recognition camera 116 is used for two-dimensionally or three-dimensionally inspecting the pickup state of the component picked up by the head 112 . The tray supply unit 117 supplies tray components. Each of these sub-equipment implements component mounting on the board 20 for which it is in charge independently (in parallel) with other sub-equipment.

Note that the component tape is, for example, a tape (carrier tape) in which a plurality of components of the same component type are arranged and supplied in a state of being wound around a component reel or the like.

Specifically, this component mounter 100 is a mounter having both functions of a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed placement machine is equipment characterized by high productivity that places electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. It is a facility for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

In other words, the mounter 100 is designed to be able to mount almost all types of electronic components (components to be mounted, from chip resistors of 0.25 mm×0.125 mm to connectors of 200 mm).

FIG. 3 is a plan view showing the main configuration of the mounter 100. As shown in FIG.

If the tray supply unit 117 is attached to the sub-equipment, the tray transfer unit (not shown) places the component taken out from the tray supply unit 117 and transports the component to a position where the head 112 can pick up the component. It is a moving table for transportation. The nozzle station 119 is a table on which replacement nozzles corresponding to component types of various shapes are placed.

The component recognition camera 116 is arranged near the center of the component supply section 115 along the arrangement direction of the component supply devices 114 . After picking up the components from the component supply unit 115, the head 112 moves to the mounting point of the substrate 20 after passing the component recognition camera 116, and repeats the operation of sequentially mounting all the picked up components. Note that the mounting point is a position on the substrate where the component is to be mounted.

FIG. 4 is a schematic diagram showing the positional relationship between the head 112 and the component supply device 114. As shown in FIG.

For example, a maximum of ten nozzles 112a can be attached to this head 112 . The head 112 to which ten nozzles 112a are attached can simultaneously pick up components from each of up to ten component supply devices 114 (in one up-and-down motion).

Note that the position of the component supply device 114 (component tape) in the component supply unit 115 is referred to as "the position on the Z axis (Z number)". "Z-axis" is a coordinate axis for specifying the position of the component supply device 114 set for each component mounter (sub-equipment). Also, the arrangement of the component supply device 114 or the component tape along the Z-axis direction is called a component arrangement, and the arrangement of the nozzles 112a attached to the head 112 is called a nozzle arrangement.

FIG. 5 is an external view showing an external appearance of an electronic component to be mounted. FIG. 6 is a diagram showing an example of a component tape containing electronic components and a component reel.

Various chip-type electronic components 423a to 423d as shown in FIGS. 5(a) to 5(d) are stored in a plurality of storage recesses 424a which are continuously formed at regular intervals in a carrier tape 424 shown in FIG. , and a cover tape 425 is attached to the upper surface thereof for packaging. Then, the carrier tape 424 to which the cover tape 425 is attached in this way is supplied to the user in a taping form in which a predetermined number of tapes are wound around the component reel 426 . A component tape is configured by such carrier tape 424 and cover tape 425 . Note that the configuration of the component tape may be a configuration other than the configuration shown in FIG.

Further, in the present embodiment, the component consisting of the component tape and the component reel 426 is referred to as a component container. Components of the same type having substantially the same properties are stored in the individual component storage bodies. Further, even among the component storage bodies storing the same type of components, the characteristics of the stored components may differ. The characteristics may include a defect rate or a recall rate, which will be described later.

In addition, in the present embodiment, the component reel 426 is attached with a bar code 427 indicating the reel ID, for example. The reel ID is information for identifying the component reel 426 or a component container containing the component reel 426 . When a component storage including the component reel 426 is placed in the component supply unit 115 of the component mounter 100, the reel ID of the component reel 426 is read by, for example, a barcode reader, and sent to the component mounter 100. is entered. In the component mounter 100, the Z number of the component supply device 114 corresponding to the component container and the reel ID are associated and managed.

Such a component mounter 100 moves the head 112 to the component supply section 115 and causes the head 112 to pick up the component. Then, the mounter 100 moves the head 112 over the component recognition camera 116 at a constant speed, captures images of all the components picked up by the head 112 into the component recognition camera 116, and accurately locates the picked-up position of the component. Let it be detected. Further, the component mounter 100 moves the head 112 to the board 20 and sequentially mounts all the sucked components on the mounting points. The component mounter 100 mounts all the predetermined components on the substrate 20 by repeatedly executing such operations of picking up, moving, and mounting by the head 112 .

In addition, although the component mounter 100 described above includes a head 112 having a plurality of nozzles 112a arranged in series, a head having a plurality of nozzles arranged in a ring (hereinafter referred to as a rotary head) may also be provided. good.

FIG. 7 is a schematic diagram showing the positional relationship between the rotary head and the component supply device 114. As shown in FIG.

The rotary head 191 has, for example, 18 child heads 192 arranged in a circle, as shown in the upper part of FIG. Further, these child heads 192 are mounted movably in the height direction on a rotary base 193 that rotates without moving in the height direction, and have, for example, six nozzles capable of holding components by vacuum suction. (not shown).

In the component supply unit 115, as shown in the lower part of FIG. 7, the component supply devices 114 capable of sequentially supplying the same components to the child heads 192 are arranged in a horizontal row. Then, the component mounter 100 moves and positions the component supply unit 115 with respect to the rotary head 191 in the Z-axis direction in FIG. As a result, the nozzles of the child head 192 can pick up the component to be mounted from the component supply device 114 that stores the component.

[Data generator]
FIG. 8 is a block diagram showing the functional configuration of data generation device 200 in this embodiment.

The data generation device 200 includes an input unit 201 , a display unit 202 , a generation unit 203 , a storage unit 204 and a management unit 206 .

The input unit 201 is composed of, for example, a keyboard, a mouse, or a touch panel, receives an operation from an operator, and notifies the generation unit 203 or the like of the operation result.

The display unit 202 is configured by, for example, a liquid crystal display, and displays the operating state of the generation unit 203 and the like, and displays data stored in the storage unit 204 .

The generation unit 203 generates mounting data Dt and stores the generated mounting data Dt in the storage unit 204 . The generation unit 203 also causes the display unit 202 to display the mounting data Dt, and transmits the mounting data Dt to each mounter 100 via the communication unit 205 .

The storage unit 204 is a recording medium for storing mounting data Dt and the like. This recording medium may be volatile or non-volatile. Specifically, the storage unit 204 may be, for example, a hard disk or a semiconductor device memory.

The communication unit 205 communicates with each mounter 100 . For example, the communication unit 205 transmits the mounting data Dt stored in the storage unit 204 to the component mounter 100 to cause the component mounter 100 to mount components according to the mounting data Dt. .

In this embodiment, at least one of the display unit 202 and the communication unit 205 is configured as an output unit that outputs the mounting data Dt.

The management unit 206 manages each information. For example, the management unit 206 acquires, for each type of component mounted on the board 20 or the individual board 21, the defect rate of the type of component from outside the data generation device 200 via the communication unit 205, for example. Alternatively, the management unit 206 acquires the defect rate based on the operation of the input unit 201 by the operator. The management unit 206 may manage the defect rate by storing the acquired defect rate in the storage unit 204 .

[Multiple substrate]
FIG. 9 is a diagram showing an example of the board 20 on which components are mounted by the component mounter 100 according to this embodiment.

The substrate 20 is configured as a multi-panel substrate including a plurality of individual substrates 21, for example. In addition, the individual board 21 may be called a child board or a pattern. Specifically, the substrate 20 includes, for example, 8,000 to 50,000 individual piece substrates 21, and 100,000 to 200,000 components are mounted on the substrate 20. FIG. The individual substrate 21 has, for example, a rectangular shape, and the length of one side is, for example, several millimeters.

The component mounter 100 mounts a plurality of components P on each of a plurality of individual boards 21 included in such a board 20 . As a result, each of the plurality of individual substrates 21 on which the plurality of components P are mounted is produced as a mounting substrate.

[Mounting data]
FIG. 10A is a diagram showing an example of mounting data Dt generated by the generation unit 203. As shown in FIG.

The mounting data Dt associates, for example, a board ID, an individual piece ID, a component type ID, an X coordinate, a Y coordinate, a mounting angle, and a reel ID.

The board ID is information for identifying the board 20 on which components are mounted by the component mounter 100 . The individual piece ID is information for identifying the individual piece board 21 included in the board 20 indicated by the board ID. The component type ID is information for identifying the type of component mounted on the individual piece board 21 indicated by the piece ID. The X-coordinate and Y-coordinate are the coordinate position of the mounting point of the component of the type indicated by the component type ID, that is, the coordinate position at which the component is mounted on board 20 or individual board 21 . The mounting angle is the angle by which the nozzle 112a picking up the component of the type indicated by the component type ID should rotate, that is, the angle by which the component is rotated on the XY plane.

The reel ID is information for identifying a component storage body (specifically, the component reel 426) that stores components. The component is of the type indicated by the above-described component type ID and is mounted at the mounting point indicated by the above-described X and Y coordinates. Note that different reel IDs are assigned to a plurality of component storage bodies that store components of the same type (that is, the same component type ID).

For example, the mounting data Dt shown in FIG. This indicates that the individual substrate 21 of "SP003" is included. Further, the mounting data Dt indicates that the component with the component type ID “P001”, the component with the component type ID “P002”, and the component with the component type ID “P003” are mounted on the individual chip board 21 with the individual chip ID “SP001”. indicates that Further, the mounting data Dt indicates that the component with the component type ID “P001” is mounted at the mounting point with the X coordinate “X11” and the Y coordinate “Y11” while being rotated at the mounting angle “θ11”.

Further, the mounting data Dt indicates that a component whose component type ID is “P001” and which is to be mounted at a mounting point with X coordinate “X11” and Y coordinate “Y11” is supplied from the component container with reel ID “R11”. indicates that Similarly, in the mounting data Dt, a component whose component type ID is “P002” and is mounted at a mounting point with X coordinate “X12” and Y coordinate “Y12” is Indicates supplied. Similarly, the mounting data Dt indicates that a component whose component type ID is “P003” and which is mounted at a mounting point with an X coordinate of “X15” and a Y coordinate of “Y15” is from a component container with a reel ID of “R15”. Indicates supplied.

The generation unit 203 may generate such mounting data Dt according to a predetermined rule, or may acquire the mounting data Dt from outside the data generation device 200 via the communication unit 205 . For example, when generating the mounting data Dt according to the rule, the generation unit 203 may generate the mounting data Dt by associating the reel ID with each component so as to minimize the takt time. . Note that the tact is the time required to produce one mounting board. Specifically, the generation unit 203 associates different reel IDs with each component having the same component type ID. For example, the generation unit 203 generates the same component type ID “P001” to be mounted at the mounting point with the X coordinate “X11” and the Y coordinate “Y11” and the mounting point with the X coordinate “X13” and the Y coordinate “Y13”. ” are associated with different reel IDs “R11” and “R13”. As a result, the mounting data Dt shown in FIG. 10A is generated.

Here, in the present embodiment, the generating unit 203 optimizes such mounting data Dt according to the constraint conditions, for example, according to the operation of the input unit 201 by the operator.

FIG. 10B is a diagram showing an example of optimized mounting data Dt.

The above-mentioned constraint is a condition that, when there are multiple components of the same type among the multiple components mounted on the board, the same component container is associated with each of all the components of the same type. be. The substrate may be any one of a plurality of individual substrates included in the multi-panel substrate. In this case, if the plurality of components to be mounted on the individual circuit board 21 includes a plurality of components of the same type, the same component is required for all the components of the same type. This is a condition for associating containers.

For example, as shown in the mounting data Dt of FIG. 10A , a plurality of components with the same component type ID “P001” are included in the components mounted on the individual circuit board 21 with the individual chip ID “SP001”. be. That is, the two components mounted at the mounting point of X coordinate "X11" and Y coordinate "Y11" and the mounting point of X coordinate "X13" and Y coordinate "Y13" are of the same type.

Therefore, in such a case, the generation unit 203 associates the same component container with each of all the components of the same type. Specifically, as shown in FIG. 10B, the generating unit 203 generates a mounting point with an X coordinate of “X11” and a Y coordinate of “Y11” and a mounting point with an X coordinate of “X13” and a Y coordinate of “Y13”. The same reel ID "R11" is associated with the component with the same component type ID "P001" mounted on the reel. Similarly, the generation unit 203 generates the same part type ID " P002” is associated with the same reel ID “R12”. As a result, the mounting data Dt shown in FIG. 10A is optimized to the mounting data Dt shown in FIG. 10B.

In this embodiment, the mounting data Dt is generated and the generated mounting data Dt is optimized according to the constraints. may That is, instead of generating the temporary mounting data Dt and optimizing the temporary mounting data Dt to generate the final mounting data Dt, the final mounting data Dt is directly adjusted according to the constraint conditions. may be generated.

As described above, the mounting method according to the present embodiment generates, for each component to be mounted on the board, the mounting data Dt indicating the association between the component and the component container that stores the component, according to the constraint conditions. Includes a data generation step. Further, in this mounting method, for each of the plurality of components indicated by the mounting data Dt, the component is obtained from the component container associated with the component in the mounting data Dt using the head 112. It includes a mounting step of mounting on a substrate by In this mounting process, for example, the generation unit 203 of the data generation device 200 outputs the generated mounting data Dt to the component mounter 100 via the communication unit 205, thereby mounting components based on the mounting data Dt. The component mounter 100 is made to carry out. In other words, the data generation device 200 according to the present embodiment generates, for each component mounted on the board, the mounting data Dt indicating the association between the component and the component container that stores the component, according to the constraint conditions. It includes a generation unit 203 and a communication unit 205 that is an output unit that outputs the mounting data Dt.

[Example of mounting board]
FIG. 11 is a diagram showing the relationship between the components mounted on the substrate 20 and the component storage body (that is, the reel ID) in which the components were stored. Specifically, FIG. 11(a) shows an example of a mounting board generated according to the mounting data Dt shown in FIG. 10A, and FIG. 11(b) shows an example of a mounting board generated according to the mounting data Dt shown in FIG. 10B. 1 shows an example of a mounted board with a printed circuit board.

For example, the component mounter 100 mounts each component on the board 20 according to the mounting data Dt shown in FIG. 10A. In this case, as shown in FIG. 11(a), the components of the same type (i.e., component type ID "P001") supplied from the component storage body with the reel ID "R11" and the component storage body with the reel ID "R13" are respectively supplied. are mounted on each individual board 21 of the board 20 .

In other words, a plurality of components supplied from the same component container are distributed and mounted on each individual substrate 21 substantially evenly.

On the other hand, the component mounter 100 mounts each component on the board 20 according to the mounting data Dt shown in FIG. 10B. In this case, as shown in FIG. 11(b), some of the plurality of individual boards 21 included in the board 20 have all the parts of the same type (that is, the part type ID "P001"). The components are supplied and mounted only from the component container with the same reel ID “R11”. Moreover, all the components of the same type (i.e., component type ID “P001”) are stored in the component storage bodies with the same reel ID “R13” on some of the plurality of individual substrates 21 included in the substrate 20 . Only sourced from and implemented.

In other words, a plurality of components supplied from the same component container are biased and mounted on any one of the individual substrates 21 .

As described above, in the present embodiment, the mounting data Dt indicating the association between the component and the component container is generated according to the constraint conditions, and each of the components to be mounted is associated with the component in the mounting data Dt. The component is obtained from the component container and mounted on the individual board 21 . Therefore, even if a plurality of component storage bodies storing components of the same type are attached to the component mounter 100 in order to shorten the takt time, the mounting data Dt generated according to the constraint conditions cannot The same component container is associated with all components of the same type to be mounted on the single substrate 21 . As a result, all components to be mounted of the same type are obtained from the same component storage body and mounted on the individual circuit board 21 without being obtained from different component storage bodies.

In addition, there is a case where the defective rate of parts differs among a plurality of parts storage bodies that store parts of the same type. In the mounting method according to the present embodiment, even if all components of the same type to be mounted on the individual circuit board 21 are obtained from component storage bodies with a high defect rate and mounted on the individual circuit board 21, these components It is possible to reduce the number of mounting substrates generated by mounting. For example, when the defect rate of the component storage body with the reel ID "R11" is high, in the present embodiment, as shown in FIGS. The number of mounting boards produced by mounting the components on the individual board 21 can be greatly reduced. As a result, even if a product having a mounting substrate is recalled, the number of recalled products can be suppressed.

[Processing flow]
FIG. 12A is a flowchart illustrating an example of optimization processing for mounting data Dt.

The generation unit 203 acquires the mounting data Dt (step S101). Note that the generating unit 203 may acquire the mounting data Dt by generating the mounting data Dt according to a predetermined rule as described above, and the mounting data Dt may be obtained from the outside of the data generation device 200. may be obtained.

Next, based on the mounting data Dt, the generation unit 203 determines whether or not to mount a plurality of components of the same type on one individual board 21 (step S102). Here, when it is determined that a plurality of components of the same type are to be mounted (Yes in step S102), the generation unit 203 fixes the reel ID of the component container that supplies the plurality of components of the same type (step S104). In other words, the generation unit 203 determines only one component container that supplies a plurality of components of the same type to the individual circuit board 21, and specifies the reel ID of that component container.

Then, the generation unit 203 optimizes the mounting data Dt by re-associating the same reel ID with each of the plurality of components of the same type (step S105).

Note that when it is determined in step S102 that a plurality of components of the same type are not to be mounted (No in step S102), the generation unit 203 does not execute the process of step S104, and the components in the mounting data Dt are Maintain the associated reel ID. Thereby, the generation unit 203 optimizes the mounting data Dt (step S105).

Final mounting data Dt is generated by such optimization processing.

FIG. 12B is a flow chart showing another example of the optimization processing of the mounting data Dt.

The generation unit 203 acquires the mounting data Dt as described above (step S101). Next, based on the mounting data Dt, the generation unit 203 determines whether or not to mount a plurality of components of the same type on one individual board 21 (step S102). Here, when it is determined that a plurality of components of the same type are to be mounted (Yes in step S102), the generation unit 203 further determines whether the recall rate of the components of the same type is equal to or higher than a threshold (step S103). Note that the recall rate may be a defect rate managed by the management unit 206 . This defect rate may be the ratio of the number of defective parts to the number of all the same type of parts mounted on the board (board 20 or individual board 21). Alternatively, the defect rate may be the ratio of the number of defective parts to the number of similar parts incorporated in all shipped products, or other ratios.

Here, if it is determined that the recall rate is equal to or higher than the threshold (Yes in step S103), the reel ID of the component container that supplies a plurality of components of the same type is fixed (step S104), as in the example shown in FIG. 12A.

Then, the generation unit 203 optimizes the mounting data Dt by re-associating the same reel ID with each of the plurality of components of the same type (step S105).

Note that when it is determined in step S102 that a plurality of components of the same type are not mounted (No in step S102), or when it is determined in step S103 that the recall rate is not equal to or greater than the threshold (No in step S103) , the process of step S104 is not executed. In this case, the generation unit 203 maintains the reel ID associated with each component in the mounting data Dt without executing the process of step S104. Thereby, the generation unit 203 optimizes the mounting data Dt (step S105).

Final mounting data Dt is generated by such optimization processing.

As in the example shown in FIG. 12B , in the present embodiment, the generation unit 203 determines that among the plurality of components to be mounted on the individual circuit board 21, there is a component whose recall rate (or defect rate) is equal to or greater than a threshold. In this case, the mounting data Dt is generated according to the constraint conditions for the types of parts whose recall rate is equal to or higher than the threshold. As a result, the mounting data Dt is generated according to the constraint conditions for the types of parts with a high recall rate, so that the mounting data Dt are generated according to the constraint conditions even for the types of parts with a low defect rate. can be suppressed. That is, the mounting data Dt can be generated so as to shorten the takt time for a type of component with a low defect rate.

FIG. 13 is a flow chart showing in more detail the process of optimizing the mounting data Dt of FIG. 12A.

The generation unit 203 acquires the mounting data Dt (step S101). Next, the generation unit 203 selects one individual substrate 21 from a plurality of individual substrates 21 included in the substrate 20 (step S111). In other words, the generation unit 203 selects any one piece ID from among a plurality of piece IDs associated with the board ID in the mounting data Dt. Then, the generation unit 203 selects one component type ID from among a plurality of component type IDs associated with the piece ID in the mounting data Dt (step S112).

Next, based on the mounting data Dt, the generation unit 203 determines whether or not to mount a plurality of components having the component type ID (that is, the same type) selected in step S112 on the individual board 21 selected in step S111. (step S113). That is, the generation unit 203 determines whether or not the piece ID selected in step S111 is associated with a plurality of components having the component type ID selected in step S112 in the mounting data Dt.

Here, when it is determined that a plurality of components of the selected component type ID (that is, of the same type) are to be mounted (Yes in step S113), the generation unit 203 further assigns the same reel ID to the plurality of components of the same type. is possible (step S114). If it is determined that it can be assigned (Yes in step S114), the generation unit 203 changes the reel ID associated with each of the plurality of components of the same type in the mounting data Dt to the same reel ID (step S115).

Next, the generation unit 203 determines whether or not all types of components to be mounted on the individual board 21 selected in step S111 have been selected (step S116). That is, the generation unit 203 determines whether or not all component type IDs associated with the piece ID selected in step S111 have been selected in the mounting data Dt. If it is determined in step S113 that a plurality of components of the same type are not to be mounted (No in step S113), or if it is determined in step S114 that the same reel ID cannot be assigned (No in step S114). ), the process of step S115 is not executed. That is, in these cases, the process of step S116 is executed without executing the process of step S115.

Here, if it is determined that all types have not been selected (No in step S116), the generation unit 203 repeats the processing from step S112. On the other hand, when determining that all types have been selected (Yes in step S116), the generation unit 203 determines whether or not all individual substrates 21 included in the substrate 20 have been selected (step S117). Here, if it is determined that all the individual substrates 21 have not been selected (No in step S117), the generation unit 203 repeats the processing from step S111. On the other hand, if it is determined that all the individual circuit boards 21 have been selected (Yes in step S117), the generation unit 203 ends the processing of the mounting data Dt.

[Selection of adsorption method]
Here, generation unit 203 selects a component pickup method and transmits information indicating the selected pickup method to component mounter 100 so that component mounter 100 can pick up a component according to the pickup method. can be executed. For example, the generation unit 203 may select a suction method that involves division of the component storage body.

FIG. 14 is a diagram showing an example of division of the component storage body.

In dividing the component storage body, first, part of the component tape wound around the component reel 426 with reel ID "R11" is unwound. The component tape is then divided into a portion wound on the component reel 426 and a portion unwound from the component reel 426 . Then, the unwound portion of the component tape is wound around a new component reel 426 different from the original component reel 426 . Here, the same reel ID “R11” as the original component reel 426 is set to the new component reel 426 .

The component tapes wound around the component reels 426 are stored in the corresponding component supply devices 114 and provided to the component supply section 115 of the component mounter 100 .

As described above, the mounting method according to the present embodiment is further configured such that each of the plurality of components stored in the same component storage body is stored in one of the plurality of component storage bodies. A dividing step of dividing the component storage body into a plurality of component storage bodies may be included. In this case, in the data generation step, the generation unit 203 generates the mounting data Dt according to the constraint conditions by associating all the components of the same type with one of the plurality of component containers. do.

As a result, even when the component storage body is divided, all the components of the same type to be mounted on the individual printed circuit board 21 are supplied from each of the plurality of component storage bodies after the division. Characteristics (eg, defect rate, etc.) can be the same.

FIG. 15 is a flow chart showing an example of processing for selecting a component pickup method.

The generation unit 203 acquires the mounting data Dt (step S121). Next, the generation unit 203 determines whether or not to select the adsorption method that gives priority to takt time, for example, according to the operation of the input unit 201 by the operator (step S122). Here, if it is determined that the pick-up method giving priority to takt time is not selected (No in step S112), the generation unit 203 selects the pick-up method as the first method of picking up components from one component storage body in a predetermined order. (step S125). For example, in the mounting data Dt, when the same reel ID is associated with a plurality of components of the same component type ID, in the first method, from the component storage body of the reel ID, A plurality of parts are picked up in a predetermined order.

On the other hand, if it is determined to select the adsorption method that prioritizes takt time (Yes in step S112), the generation unit 203 further determines whether or not a plurality of nozzles in the head are arranged in series (step S123). Here, if it is determined that the plurality of nozzles are not arranged in series, that is, are arranged in a ring (No in step S123), the second method of continuously picking up components from one component container is changed to the picking method. (step S126). In other words, in this case, the head of the mounter 100 is a rotary head 191, and a plurality of nozzles of the rotary head 191 are supplied from one component container as the rotary base 193 rotates. Pick up the parts in order.

When determining that the plurality of nozzles 112a are arranged in series (Yes in step S123), the generating unit 203 further determines whether or not the component storage can be divided (step S124). Here, if it is determined that the division is possible (Yes in step S124), the generation unit 203 divides the component storage body, and performs a third process for simultaneously picking up a plurality of components of the same type from the divided plurality of component storage bodies. A method is selected as an adsorption method (step S127).

On the other hand, if it is determined that division is not possible (No in step S124), the generating unit 203 selects the fourth method of simultaneously picking up a plurality of different types of components as the picking method (step S128).

The generation unit 203 generates information indicating the suction method selected or adopted in this way. For example, when the generation unit 203 selects the third method, the generation unit 203 selects a suction method in which the components supplied from each of the plurality of divided component storage bodies are simultaneously suctioned by the plurality of nozzles 112a of the head 112. generate the information shown. Generation unit 203 then transmits the information to component mounter 100 via communication unit 205 . As a result, in the mounting process of the mounting method according to the present embodiment, mounter 100 uses a plurality of nozzles of head 112 to supply a plurality of supplied components, which are components supplied from each of the plurality of divided component storage bodies. The plurality of supply components are acquired and mounted on the individual board 21 by simultaneously sucking them with the 112a.

Merely mounting a component based on the mounting data Dt generated according to the constraints described above may increase the takt time. However, as described above, when the same component storage body is divided into a plurality of component storage bodies, and the supplied components supplied from the plurality of component storage bodies are simultaneously sucked and mounted on the board, the An increase in takt time can be suppressed.

[summary]
As described above, according to the mounting method of the present embodiment, it is possible to suppress the production of mounting substrates that are likely to cause defects. Here, in the above example, by generating the mounting data Dt as shown in FIG. 10A and optimizing the mounting data Dt according to the constraint conditions, the final mounting data Dt as shown in FIG. 10B is obtained. Generate. However, the final mounting data Dt as shown in FIG. 10B may be directly generated without generating the mounting data Dt as shown in FIG. 10A.

FIG. 16 is a flow chart showing a mounting method according to this embodiment.

The mounting method according to the present embodiment is a mounting method for mounting a plurality of components on a substrate using the head 112, and includes a data generation step S11 and a mounting step S12. In the data generation step S11, for each component to be mounted on the board, mounting data Dt indicating the association between the component and the component container that stores the component is generated according to the constraint conditions. In the mounting step S12, for each of the plurality of components indicated by the mounting data Dt, the component is acquired from the component container associated with the component in the mounting data Dt using the head 112 and placed on the board. Implement. Here, if there are multiple components of the same type among the multiple components mounted on the board, the constraint conditions used in the data generation step S11 are the same for all components of the same type. is a condition for associating the component storage bodies.

As a result, as in the example shown in FIG. 11, it is possible to reduce the number of mounting boards that are likely to cause defects. Therefore, after the product including the mounting substrate has been shipped, the number of recalled products can be suppressed.

Although the same component storage body is associated with each of all components of the same type in the above-described constraint, any one of a plurality of component storage bodies may be associated. In other words, if the same type of components stored in a plurality of component storage bodies have substantially the same characteristics, any one of the plurality of component storage bodies can be used instead of the same component storage body. may be associated. For example, the plurality of component storage bodies can be obtained by dividing one component storage body as in the example shown in FIG. In other words, in the constraint condition, it is sufficient that a component storage body containing components having substantially the same characteristics is associated with each of all components of the same type, and the number of component storage bodies is one. There may be one or two or more. It should be noted that the characteristics may include the defect rate or recall rate of parts.

Although the implementation method and the data generation device according to one or more aspects have been described above based on the embodiments, the present disclosure is not limited to these embodiments. As long as they do not deviate from the gist of the present disclosure, various modifications conceived by those skilled in the art may also be included within the scope of the present disclosure.

In the above-described embodiment, each component included in data generation device 200 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component is, for example, a generation unit 203, a communication unit 205, a management unit 206, and the like. Each component may be realized by reading and executing a software program recorded in a recording medium such as a hard disk or a semiconductor memory by a program execution unit such as a CPU or processor. Here, the software that implements the data generation device 200 and the like of the above embodiment causes a computer to execute each step included in the flowcharts shown in FIGS. 12A, 12B, 13, 15, or 16. FIG.

The mounting method of the present disclosure has the effect of suppressing the production of mounting boards that are likely to cause defects. can be applied to a computer or the like that generates implementation data of

100 component mounter 112 head (multi-mounting head)
112a nozzle 200 data generator 201 input unit 202 display unit 203 generation unit 204 storage unit 205 communication unit (output unit)
426 parts reel

Claims (8)

A mounting method for mounting a plurality of components on a board using a head,
a data generation step of generating mounting data indicating, for each component mounted on the substrate, the component and a component container that stores the component in association with each other;
A mounting step of acquiring each of a plurality of components indicated by the mounting data, using the head, from a component container associated with the component in the mounting data, and mounting the component on the board. When,
a management step of acquiring a defect rate for each type of component mounted on the board ,
In the data generation step,
When a plurality of components to be mounted on the board includes a component whose defect rate is equal to or higher than a threshold, the mounting data is generated according to a constraint condition for the component whose defect rate is equal to or higher than the threshold. ,
When the plurality of components mounted on the substrate include a plurality of components of the same type whose defect rate is equal to or greater than the threshold value , the constraint conditions are set so that all the components of the same type have the same It is a condition for associating the parts storage body,
How to implement. The mounting method according to claim 1, wherein the substrate is any one of a plurality of individual substrates included in a multi-panel substrate. The implementation method further comprises:
Division for dividing the same parts storage body into the plurality of parts storage bodies so that each of the plurality of parts stored in the same parts storage body is stored in one of the plurality of parts storage bodies including the process,
In the data generation step,
3. The mounting method according to claim 1, wherein the mounting data is generated according to the constraint conditions by associating each of the components of the same type with one of the plurality of component storage bodies. . the head comprises a plurality of nozzles,
In the mounting process,
A plurality of supply components, which are components supplied from each of the plurality of component storage bodies, are simultaneously sucked by the plurality of nozzles of the head to obtain the plurality of supply components and mount them on the substrate. The mounting method according to Item 3. A data generation device for generating mounting data for mounting a plurality of components on a substrate using a head,
a generation unit for generating mounting data indicating, for each component mounted on the board, the component and a component container that stores the component in association with each other;
an output unit that outputs the mounting data;
A management unit that acquires a defect rate of each type of component mounted on the board ,
The generating unit
When a plurality of components to be mounted on the board includes a component whose defect rate is equal to or higher than a threshold, the mounting data is generated according to a constraint condition for the component whose defect rate is equal to or higher than the threshold. ,
When the plurality of components mounted on the substrate include a plurality of components of the same type whose defect rate is equal to or greater than the threshold value , the constraint conditions are set so that all the components of the same type have the same It is a condition for associating the parts storage body,
Data generator. 6. The data generation device according to claim 5, wherein the substrate is any one of a plurality of individual substrates included in a multi-panel substrate. The same parts storage body is divided into the plurality of parts storage bodies so that each of the plurality of parts stored in the same parts storage body is stored in one of the plurality of parts storage bodies. in case of,
The generating unit
7. The data generation according to claim 5 or 6, wherein the mounting data is generated according to the constraint conditions by associating one of the plurality of component storage bodies with each of all the components of the same type. Device. the head comprises a plurality of nozzles,
The generating unit
8. The data generation device according to claim 7, further comprising generating information indicating a pickup method in which the components supplied from each of the plurality of component storage bodies are simultaneously picked up by the plurality of nozzles of the head.

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