JP7154820B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device having a cooling structure using a cooling fan, and more particularly to an imaging device having a cooling structure.

2. Description of the Related Art In recent years, in an imaging apparatus, which is one type of electronic equipment, the amount of heat generated has increased due to an increase in the amount of processing due to an increase in the number of pixels and frame rate during moving image shooting. Therefore, it is necessary to suppress the temperature rise of the housing of the imaging device.

Conventionally, in order to suppress the temperature rise of the imaging device housing, for example, an imaging device having a forced cooling structure using a cooling fan and a heat sink is known. It suppresses the temperature rise of the housing (Patent Document 1).

JP 2014-45345 A

However, in an electronic device such as an imaging device, when the cooling structure itself is downsized in order to downsize the electronic device, the cooling effect is inevitably reduced. Furthermore, miniaturization of the electronic equipment requires space saving for the location of the cooling fan and the airflow path of the cooling fan. As a result, not only is the position of the cooling fan restricted, but it may be difficult to arrange the air passage.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electronic device in which cooling fans and air passages can be easily arranged without reducing the cooling effect.

In order to achieve the above object, an electronic device according to the present invention has a circuit portion serving as a heat source, and exhausts heat from the circuit portion to the outside by blowing air from a cooling fan, wherein the cooling fan A heat exchanging portion for receiving air and a heat conducting portion for conducting heat from the circuit portion to the heat exchanging portion, and the exterior of the electronic device exhausts the air that has passed through the heat exchanging portion to the outside. The heat exchanging portion is provided with a heat radiating plate, and the heat radiating plate has a rectifying surface for rectifying the airflow direction of the cooling fan and a heat coupling surface that contacts the heat conducting portion. and a heat dissipation surface that intersects with the rectifying surface and the heat coupling surface, the electronic device has a display monitor for displaying various information, and the housing is formed with a storage section for storing the display monitor. The exhaust hole is formed in the housing portion, the heat exchange portion has a heat coupling member covering one end of the heat coupling surface, the heat coupling member includes the heat coupling surface and the heat It is characterized in that it is urged against the conducting part and comes into contact with the thermal coupling surface and the thermal conducting part .

According to the present invention, it is possible to easily arrange the cooling fan and the air passage without impairing the cooling effect.

1 is a perspective view showing an example of an imaging device which is one of electronic devices according to an embodiment of the present invention; FIG. 2 is an exploded perspective view for explaining the arrangement of cooling fans provided in the camera shown in FIG. 1; FIG. FIG. 2 is a diagram for explaining a rear cover shown in FIG. 1; 2 is a diagram for explaining a cooling mechanism provided in the camera shown in FIG. 1; FIG. 5 is a diagram for explaining the cooling fan shown in FIG. 4; FIG. FIG. 5 is a diagram for explaining an example of the structure of the heat exchange part shown in FIG. 4; 5 is a diagram for explaining another example of the structure of the heat exchange section shown in FIG. 4; FIG.

An example of an electronic device according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an example of an imaging device which is one of electronic devices according to an embodiment of the present invention. FIG. 1(a) is a perspective view showing the liquid crystal monitor, which is a display unit, from the back side in a closed state, and FIG. 1(b) is a perspective view showing the liquid crystal monitor from the back side in an open state.

The illustrated imaging device is, for example, a digital camera (hereinafter simply referred to as a camera) 10, and a lens barrel (not shown) for forming an image of a subject (optical image) on an imaging device is arranged on the front side. there is Then, the user can confirm the subject image by the image displayed on the liquid crystal monitor (display monitor) 11 arranged on the back side. Various information related to the camera 10 is displayed on the liquid crystal monitor 11 in addition to the image.

In FIG. 1A, the liquid crystal monitor 11 is in a closed state housed in the rear cover 15 of the camera 10. In FIG. On the other hand, in FIG. 1(b), the liquid crystal monitor 11 is in an open state separated from the rear cover 15. As shown in FIG. The liquid crystal monitor 11 is attached to the camera 10 by a movable hinge portion 17 so as to be rotatable about two axes. When the liquid crystal monitor 11 is rotated around the rotation axis Z, the liquid crystal monitor 11 is positioned outside the projection of the rear cover 15 . Furthermore, the liquid crystal monitor 11 is rotatable around the rotation axis ZZ.

The rear cover 15 is formed with a liquid crystal monitor accommodating portion (accommodating portion) 19 in which the liquid crystal monitor 11 is accommodated. That is, in the closed state, the liquid crystal monitor 11 is housed in the liquid crystal monitor housing portion 19 . A grip portion 20 is formed beside the liquid crystal monitor accommodating portion 19 , and the user holds the grip portion 20 to hold the camera 10 when using the camera 10 .

The grip portion 20 has a resin portion and an elastic portion, and the resin portion and the elastic portion are integrally molded. The elastic portion is defined as an external surface, thereby making the grip portion 20 less slippery and easier for the user to hold. Each operation button 21 is provided on the grip portion 20 .

2 is an exploded perspective view for explaining the arrangement of cooling fans provided in the camera shown in FIG. 1. FIG.

The grip part 20 is fixed to the back cover 15 with fixing screws (not shown) and integrated with the back cover 15 . The printed wiring board 29 is fixed to the base 28 via an adhesive sheet (not shown). A sheet switch 23b is fixed to the printed wiring board 29 to integrally hold a plurality of metal dome switches 23a.

When each operation button 21 provided on the grip portion 20 is pressed, the metal dome switch 23a is pressed down, and the printed wiring board 29 detects the pressing operation. A base 28 to which a printed wiring board 29 is fixed is fixed to the back cover 15 with base fixing screws 26 .

The cooling fan 25 is fixed by a screw 27 to a fixing portion provided on the grip portion 20 . In this manner, a plurality of members are attached to the back cover 15 to form a unit.

Main chassis 22 is the main structure of camera 10 . The control IC 31 is a heat-generating circuit element and is electrically connected to the main board (circuit section) 32 . The main board 32 is fastened to the main chassis 22 with fixing screws (not shown).

FIG. 3 is a diagram for explaining the rear cover shown in FIG. 1. FIG. FIG. 3(a) is a view showing the appearance of the rear cover, and FIG. 3(b) is a view showing an enlarged view of the grip section cut along line AA shown in FIG. 3(a). .

A part of the liquid crystal monitor housing portion 19 is provided with an exhaust hole 24 for exhausting the air that has passed through the heat exchange portion 30 . The exhaust hole 24 is not exposed to the outside when the liquid crystal monitor 11 is housed in the liquid crystal monitor housing portion 19 .

The width of the cooling fan 25 is substantially the same as the width of the base 28 . That is, the cooling fan 25 is arranged within the projection of the grip portion 20 on the rear cover 15 . The cooling fan 25 is located within the projection of the main board 32 and faces the main board 32 .

The thickness UA of the cooling fan 25 and the grip portion 20 including the base 28 to which the printed wiring board 29 is fixed is the depth of the liquid crystal monitor accommodating portion 19 which is a part of the back cover 15 and accommodates the liquid crystal monitor 11. It is substantially the same as UB. Thereby, the cooling fan 25 housed in the camera 10 can be arranged in a space-saving manner.

FIG. 4 is a diagram for explaining a cooling mechanism (cooling structure) provided in the camera shown in FIG. 4(a) is a perspective view showing heat transfer in the cooling structure, and FIG. 4(b) is a cross-sectional view taken along line AA shown in FIG. 4(a).

First, referring to FIG. 4A, one end of the heat conducting portion 33 is thermally coupled to the upper surface of the package of the control IC 31 serving as a heat source, and the other end is thermally coupled to the heat exchanging portion 30 . The cooling fan 25 has rotatable blades 57 , and the rotation of the blades 57 blows air to the outlet 41 . The center of the outlet 41 of the cooling fan 25 is arranged to substantially coincide with the center of the short side 331 of the heat conducting portion 33 . That is, the heat exchange unit 30 is arranged between the control IC 31 and the cooling fan 25 which are heat sources. A long side 332 of the heat conducting portion 33 coincides with an extension line of the discharge port 41 of the cooling fan 25 in the discharge direction (blowing direction).

The arrow X indicates the direction of heat transfer, and the heat generated in the control IC 31 is transmitted from the upper surface of the package of the control IC 31 to the heat conducting portion 33 . Since the temperature on the heat source side is high, the heat is transmitted in the direction of arrow X due to the temperature gradient, and the heat generated in the control IC 31 reaches the heat exchange section 30 . The heat exchange section 30 is cooled by air blown from the cooling fan 25 .

A notch portion 321 is formed in the main substrate 32 . A notch portion 321 is formed in the main substrate 32 in a portion of the projection of the cooling fan 25 for intake of the cooling fan 25 . The notch 321 allows the cooling fan 25 to draw air from the surface of the main substrate 32 opposite to the surface on which the cooling fan 25 is arranged. An opening hole for air intake may be formed instead of the notch 321 .

The main board 32 is provided with an external interface connector 35 . The external interface connector 35 is covered with a movable terminal cover 14 arranged on the side of the camera 10 shown in FIG. That is, the camera 10 has a terminal for connecting with an external device.

In this way, in the illustrated camera, air can be drawn by the cooling fan without forming a special air inlet in the camera 10 .

Next, referring to FIG. 4B, an arrow Y indicates a flow path through which the air discharged by the cooling fan 25 flows. The cooling fan 25 draws air from the side of the main substrate 32 and sends exhaust air to the heat exchange section 30 . The air that has passed through the heat exchange section 30 must be immediately exhausted to the outside of the camera 10 in order to raise the internal temperature of the camera 10 .

A slight gap 13 exists between the liquid crystal monitor accommodating portion 19 and the liquid crystal monitor 11 . The exhaust hole 24 communicates with the gap 13 . Therefore, even when the liquid crystal monitor 11 is housed in the liquid crystal monitor housing portion 19 , air can be exhausted through the exhaust hole 24 and the gap 13 . That is, the air that has passed through the heat exchange section 30 is exhausted to the outside of the camera 10 through the exhaust hole 24 .

5 is a diagram for explaining the cooling fan shown in FIG. 4. FIG. 5A is a perspective view of the cooling fan viewed from the printed wiring board side, and FIG. 5B is a perspective view of the cooling fan 25 viewed from the main board side.

The cooling fan 25 has a first case 37 and a second case 38 . A wiring member 36 for driving the motor provided in the cooling fan 25 is pulled out from the opening of the first case 37 . A notch portion 39 is formed in the first case 37 to accommodate a connection portion for connecting the printed wiring board 29 to the main substrate 32 .

The second case 38 is provided with a fastening portion 40 for fastening the cooling fan 25 to the rear cover 15 . Further, the second case 38 is provided with an intake portion 34 . As described with reference to FIG. 3B, the air intake portion 34 of the cooling fan 25 is within the projection of the main board 32 and faces the main board 32 . A dedicated air intake hole corresponding to the air intake section 34 is not formed in the exterior portion of the camera 10 . As a result, it is possible to prevent dust and the like from entering the camera 10 from the outside due to the suction of the cooling fan 25 .

6 is a diagram for explaining an example of the structure of the heat exchange part shown in FIG. 4. FIG. FIG. 6(a) is a perspective view showing the shape of a radiator plate provided in the heat exchange section, and FIG. 6(b) is a diagram showing cooling by the radiator plate.

As shown in FIG. 6A, the radiator plate 50 is provided with a rectifying surface 51 for rectifying the exhaust direction (blowing direction). The rectifying surface 51 has an acute angle with respect to the main surface 191 of the liquid crystal monitor accommodating portion 19 shown in FIG. 6(b). In other words, the extending direction of the rectifying surface 51 and the extending direction of the main surface 191 of the liquid crystal monitor accommodating portion 19 intersect.

The heat sink 50 has a heat coupling surface 53 that contacts the heat conducting portion 33 . The heat dissipation plate 50 has a heat dissipation surface 55 orthogonal (crossing) to the rectifying surface 51 and the heat coupling surface 53 . The heat transmitted from the upper surface of the package of the control IC 31 to the heat conducting portion 33 is transmitted to the heat coupling surface 53 via the heat conducting portion 33 . The air sent from the cooling fan 25 takes heat from the straightening surface 51 and the heat radiation surface 55 . In the heat exchange section 30, a plurality of radiator plates 50 are arranged at predetermined intervals.

As shown in FIG. 6B, the air sent from the cooling fan 25 is guided by the rectifying surface 51 to the exhaust hole 24 provided in the liquid crystal monitor housing portion 19 . The thermal coupling surface 53 is in contact with the thermal conduction portion 33 , and the tip portion of the thermal coupling surface 53 is covered with the thermal coupling member 52 , and the portion protruding from the tip portion of the thermal coupling surface 53 contacts the thermal conduction portion 33 . in contact with

The heat coupling member 52 is biased against both the heat coupling surface 53 and the heat conducting portion 33 by the heat shielding resin member 56 . The thermal coupling member 52 promotes heat transfer from the thermal conduction portion 33 to the thermal coupling surface 53 .

If the heat coupling member 52 is arranged close to the rear cover 15 side, there is a concern that the exterior temperature of the camera 10 may become high in a part of the rear cover 15 . The heat shielding resin member 56 makes it difficult for the heat of the heat coupling member 52 to be transferred to the rear cover 15 side. In the heat-insulating resin member 56 , the end surface near the exhaust hole 24 is formed as an inclined surface 561 inclined with respect to the main surface 191 of the liquid crystal monitor accommodating portion 19 .

As a result, the air from the cooling fan 25 is reliably guided to the exhaust hole 24 provided in the liquid crystal monitor accommodating portion 19 by the inclined surface 561 of the heat insulating resin member 56 in addition to the rectifying surface 51 .

In the heat conducting portion 33, the surface in contact with the upper surface of the package of the control IC 31 and the portion in contact with the heat coupling surface 53 have different heights. By defining an air layer from the surface of the control IC 31 in contact with the upper surface of the package to the back cover 15 , the heat conducting portion 33 can obtain a heat insulating effect for the back cover 15 .

7 is a diagram for explaining another example of the structure of the heat exchange section shown in FIG. 4. FIG. FIG. 7(a) is a perspective view showing the shape of the radiator plate provided in the heat exchange section, and FIG. 7(b) is a diagram showing the relationship between the cooling fan and the radiator plate.

The heat sink 501 has a straightening surface 51 for straightening the exhaust direction, a heat coupling surface 53, and a heat dissipation surface 55, similar to the heat sink 50 shown in FIG. 6(a). Further, the heat dissipation plate 501 has a second rectifying shape portion 59 on the side opposite to the heat coupling surface 53 with respect to the heat dissipation surface 55 .

Blades 57 provided on cooling fan 25 rotate in the direction of arrow W. As shown in FIG. Here, in the S portion of the cooling fan 25 near the blades 57 , air stagnation occurs due to blade flow path resistance and interference of wind inside the cooling fan 25 .

The second rectifying shape portion 59 has an arc shape concentric with the rotation axis of the blade 57 with a predetermined gap from the tip of the blade 57 . The second rectifying shape portion 59 rectifies the flow of air inside the cooling fan 25 to make the flow to the outlet more efficient. Note that at least one of the radiator plates constituting the heat exchanging portion 30 may be the radiator plate 501 having the second rectifying shape portion 59 .

As described above, in the present embodiment, the heat exchanging portion 30 includes a portion that rectifies the exhaust direction, a contact portion that abuts on a portion of the heat conducting member thermally coupled to the control IC, and a portion that rectifies the exhaust direction. A plurality of heat sinks 50 having a surface perpendicular to the portion where the heat is applied are provided. Furthermore, at least one radiator plate 501 having a portion (second rectifying shape portion 59) for rectifying may be provided inside the cooling fan 25 .

In this way, according to the embodiment of the present invention, it is possible to easily arrange the cooling fan and the air passage without reducing the cooling effect.

Although the present invention has been described above based on the embodiments, the present invention is not limited to these embodiments, and various forms within the scope of the present invention are also included in the present invention. . In other words, the material, shape, size, form, number, location, etc. can be changed as appropriate without departing from the gist of the present invention.

19 Liquid crystal monitor accommodating part 24 Exhaust hole 25 Cooling fan 28 Base 30 Heat exchange part 31 Control IC
32 main board 33 heat conduction part 34 intake part 50, 501 radiator plate

Claims (8)

An electronic device that has a circuit portion that serves as a heat source and exhausts heat from the circuit portion to the outside by blowing air from a cooling fan,
a heat exchange unit that receives air blown by the cooling fan;
a heat conducting portion that conducts heat from the circuit portion to the heat exchanging portion;
An exhaust hole is formed in the exterior of the electronic device for exhausting the air that has passed through the heat exchange unit to the outside,
The heat exchanging part is provided with a heat radiating plate, and the heat radiating plate has a rectifying surface for rectifying the blowing direction of the cooling fan, a heat coupling surface that contacts the heat conducting part, and the rectifying surface and the heat coupling surface. and a crossing heat dissipation surface ,
The electronic device has a display monitor that displays various information,
The exterior is formed with a storage portion for storing the display monitor,
The exhaust hole is formed in the storage portion,
The heat exchange part has a heat coupling member covering one end of the heat coupling surface,
The electronic device according to claim 1, wherein the thermal coupling member is biased against the thermal coupling surface and the thermal conduction portion to abut on the thermal coupling surface and the thermal conduction portion. a predetermined gap exists between the storage portion and the display monitor when the display monitor is stored in the storage portion;
2. The electronic device according to claim 1 , wherein said exhaust hole is formed corresponding to said gap. 3. The electronic device according to claim 1 , wherein the extending direction of the rectifying surface and the extending direction of the main surface of the storage section intersect. 4. The electronic device according to claim 1 , further comprising a heat shielding resin member that biases the heat coupling member against the heat coupling surface and the heat conducting portion. 5. The electronic device according to claim 4 , wherein the heat-shielding resin member has a surface that guides air toward the exhaust hole. The electronic device according to any one of claims 1 to 5 , wherein the heat exchanging portion is provided with a plurality of the heat sinks. 7. The electronic device according to claim 6 , wherein at least one of said heat sinks is provided with a rectifying shape portion having a predetermined angle with respect to said heat sink surface. An electronic device that has a circuit portion that serves as a heat source and exhausts heat from the circuit portion to the outside by blowing air from a cooling fan,
a heat exchange unit that receives air blown by the cooling fan;
a heat conducting portion that conducts heat from the circuit portion to the heat exchanging portion;
An exhaust hole is formed in the exterior of the electronic device for exhausting the air that has passed through the heat exchange unit to the outside,
The heat exchanging part is provided with a heat radiating plate, and the heat radiating plate has a rectifying surface for rectifying the blowing direction of the cooling fan, a heat coupling surface that contacts the heat conducting part, and the rectifying surface and the heat coupling surface. and a crossing heat dissipation surface,
The heat conducting portion has a first portion that abuts on the circuit portion and a second portion that abuts on the thermal coupling surface, and the first portion and the second portion are different in height. An electronic device characterized by:

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