JP7151339B2 - head module, head unit, Device for ejecting liquid - Google Patents

Description

The present invention relates to a head module, a head unit, and a device for ejecting liquid.

For example, in a head that ejects liquid, the ejection characteristics fluctuate due to temperature rise caused by heat generated during driving.

Conventionally, as an ink discharge device, a circuit section mounted with a driving element to which a heat dissipation member is attached is housed inside a case. A device is known in which a circuit portion arranged in a passage is cooled by air supplied from a gas supply port (Patent Document 1).

JP 2010-105377 A

When using a heat radiating member as disclosed in the above-mentioned Patent Literature 1, it is required to be able to radiate heat with higher heat radiation efficiency.

The present invention has been made in view of the above problems, and an object of the present invention is to improve heat radiation efficiency.

In order to solve the above problems, the head module according to claim 1 of the present invention comprises:
a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet ;
A relay board to which the wiring member is connected is held on a surface of the heat dissipation member opposite to the gas path side.
It was configured.

According to the present invention, heat dissipation efficiency can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is external perspective explanatory drawing of the head module which concerns on 1st Embodiment of this invention. FIG. 2 is an external perspective explanatory view similarly seen from the opposite side to FIG. 1; It is similarly an exploded perspective explanatory view. It is similarly typical cross-sectional explanatory drawing. It is a typical cross-sectional explanatory drawing of the head module which concerns on 2nd Embodiment of this invention. It is a schematic cross-sectional explanatory view of a head module according to a third embodiment of the present invention. It is typical cross-sectional explanatory drawing of the head module which concerns on 4th Embodiment of this invention. It is typical cross-sectional explanatory drawing of the head module which concerns on 5th Embodiment of this invention. It is typical cross-sectional explanatory drawing of the head module which concerns on 6th Embodiment of this invention. It is typical cross-sectional explanatory drawing of the head module which concerns on 7th Embodiment of this invention. It is typical cross-sectional explanatory drawing of the head module which concerns on 8th Embodiment of this invention. 1 is a schematic illustration of an example of a device for ejecting liquid according to the present invention; FIG. It is a plane explanatory view of an example of the head unit of the apparatus.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. A first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. FIG. 1 is an external perspective explanatory view of the head module according to the same embodiment, FIG. 2 is an external perspective explanatory view similarly seen from the opposite side to FIG. 1, FIG. 3 is an exploded perspective explanatory view of the same, and FIG. It is a diagram.

The head module 100 includes a head 1, a wiring member 2 such as an FPC connected to the head 1, and a plurality of sub-head modules 101 (here, four pieces).

In this embodiment, the head 1 is a liquid ejection head having a nozzle surface 1a on which a plurality of nozzles for ejecting liquid are arranged, but it is not limited to this.

A base member 102 holding the sub-head module 101, a heat dissipation member 104 thermally coupled to the element 3 mounted on the wiring member 2 of the sub-head module 101, and a cover member 105 surrounding at least the heat dissipation member 104 are provided. I have it.

In addition, "bonding" means a configuration in which the element 3 and the heat dissipation member 104 are connected via a member having thermal conductivity (eg, heat conductive tape), and the element 3 is attached to the heat dissipation member 104 by an elastic member such as a spring. A configuration in which they are directly contacted and coupled by being pressed can be cited. Alternatively, the base material of the wiring member 2 on which the element 3 is mounted may be coupled to the heat radiating member 104 via a member having thermal conductivity.

A nozzle cover member 107 of the sub-head module 101 is attached to the liquid discharge side surface of the base member 102 . A rigid board 108 as a relay board to which the wiring member 2 is connected is attached to the heat dissipation member 104 .

Here, the heat radiation member 104 is preferably made of a metal material (metal member) having high thermal conductivity, and metals including aluminum, silver, copper, and gold can be mentioned.

The heat dissipation member 104 has a first plate-like portion 141 having a main surface along the direction of gravity and a second plate-like portion 142 having a main surface along the horizontal direction. Here, the first plate-like portion 141 is a plate-like portion extending in a direction perpendicular to the nozzle surface 1, and the second plate-like portion 142 is a plate-like portion extending in the in-plane direction of the nozzle surface 1a. be. The heat radiating member 104 is a member having a substantially L shape with the first plate-like portion 141 and the second plate-like portion 143 .

The second plate-shaped portion 142 of the heat radiating member 104 is provided with a through-hole portion 142a through which the wiring member 2 is passed, and the wall surface of the through-hole portion 142a and the element 3 on the wiring member 2 are coupled.

One main surface of the first plate-shaped portion 141 of the heat radiating member 104 and the cover member 105 form a gas passage 121 along the direction of gravity. In this embodiment, one main surface of the first plate-shaped portion 141 of the heat radiating member 104, which is a metal member, and the cover member 105 form the gas path 121 along the direction perpendicular to the nozzle surface 1a. There will be

In this specification, the gas path 121 "along the direction of gravity" or "along the direction perpendicular to the surface" is not limited to a straight path, and may , the inlet side of the gas path 121 is below and the outlet side is above the inlet side.

A gas intake port 122 leading to a gas path 121 is provided below the cover member 105 . In this embodiment, the gas intake port 122 is a groove-shaped opening formed along the longitudinal direction of the head 1, as shown in FIG.

The upper part of the gas path 121 communicates with the gas discharge port 123 . In this embodiment, part of the opening 153 provided in the upper portion of the cover member 105 forms the gas discharge port 123 . The opening 153 of the cover member 105 is an opening through which the connector 181 and the like provided on the rigid board 108 can be accessed from the outside.

A rigid substrate 108 is fixed to the other main surface of the second plate-shaped portion 142 of the heat radiating member 104 .

With this configuration, when the element 3 generates heat as the head 1 is driven, the heat of the element 3 is transmitted to the second plate-like portion 142 of the heat dissipation member 104 and radiated from the first plate-like portion 141 .

At this time, the air in the gas path 121 between the second plate-shaped portion 142 of the heat radiating member 104 and the cover member 105 is warmed, and the warmed air rises in the gas path 121 as indicated by the arrow. It is discharged from the upper gas discharge port 123 . At the same time, outside unwarmed air is drawn into the gas passage 121 through the lower gas intake 122 and replaced with warmed air.

By cooling the heat radiating member 104 with the air taken in from the outside in this way, the heat transferred to the heat radiating member 104 is radiated to the gas passage 121, so that heat radiation efficiency can be improved.

Furthermore, in the present embodiment, the heat-generating element 3 is not arranged in the gas path 121, so heat can be released more efficiently.

Next, a second embodiment of the invention will be described with reference to FIG. FIG. 5 is a schematic cross-sectional explanatory view of the head module according to the embodiment.

In this embodiment, the cover member 105 is provided with a plurality of (here, two) gas intake ports 122 .

Next, a third embodiment of the invention will be described with reference to FIG. FIG. 6 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, the cover member 105 is provided with many small gas intakes 122 . By providing many small gas intakes 122 , it functions as a filter and can reduce the entry of foreign matter into the gas path 121 .

Next, a fourth embodiment of the invention will be described with reference to FIG. FIG. 7 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, one head 1 is held on the base member 102 . The present invention can also be applied to a sub-head module 101 in which a plurality of heads 1 are not mounted.

Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, the cover member 105 covers the first cover member 151 that forms the gas path 121 with the first plate-like portion 141 of the heat dissipation member 104, and the portion other than the portion surrounded by the first cover member 151. It is configured with a second cover member 152 for covering. The first cover member 151 can be separated from and attached to the second cover member 152 .

This makes it easy to remove the first cover member 151 and clean and remove foreign matter such as mist and dust adhering to the wall surfaces of the first cover member 151 and the heat radiating member 104 .

Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, the cap member 110 that covers the opening 153 of the cover member 105 is detachably provided. The cap member 110 has an extending portion 110 a extending to the side surface of the cover member 105 . The extending portion 110 a of the cap member 110 can prevent the liquid attached to the cap member 110 from entering the opening 153 through the cap member 110 .

A wiring member 111 that connects the rigid substrate 108 and an external circuit is routed through the gap between the cover member 105 and the cap member 110 .

A gas discharge port 123 communicating with the gas path 121 is formed between the cap member 110 and the cover member 105 . However, the gas exhaust port 123 can also be provided in the cover member 105 .

By providing the cap member 110, it is possible to prevent mist from entering from the opening 153 of the cover member 105 and prevent the mist from adhering to the connector 181 and the like.

Next, a seventh embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, the cap member 110 is provided with a partition wall portion 110b that partitions the gas path 121 side and the rigid substrate 108 side.

As a result, it is possible to reduce the entry of warm air discharged through the gas path 121 into the rigid substrate 108 side.

Next, an eighth embodiment of the present invention will be described with reference to FIG. FIG. 11 is a schematic cross-sectional explanatory view of the head module according to the same embodiment.

In this embodiment, the cover member 105 is divided into a first cover member 151 and a second cover member 152 , and the first cover member 151 is integrally provided with a cap member 110 that covers the opening 153 .

Accordingly, when the cap member 110 is removed, the first cover member 151 is also removed.

Next, an example of an apparatus for ejecting liquid according to the present invention will be described with reference to FIGS. 12 and 13. FIG. FIG. 12 is a schematic diagram of the apparatus, and FIG. 13 is a plan view of an example of a head unit of the apparatus.

A printing apparatus 500, which is a device for ejecting liquid, includes loading means 501 for loading a continuous body 510; It includes printing means 505 for printing to form an image by ejecting liquid onto 510 , drying means 507 for drying the continuous body 510 , carrying out means 509 for carrying out the continuous body 510 , and the like.

The continuous body 510 is sent out from the main winding roller 511 of the carrying-in means 501, guided and carried by rollers of the carrying-in means 501, the guide-conveying means 503, the drying means 507, and the carrying-out means 509. is taken up by

The continuum 510 is conveyed in the printing means 505 so as to face the head unit 550 , and an image is printed by the liquid ejected from the head unit 550 .

Here, the head unit 550 includes three head modules 100A, 100B, and 100C according to the present invention on a common base member 552, as shown in FIG.

In the present application, when the head is a liquid ejection head, the liquid to be ejected is not particularly limited as long as it has a viscosity and surface tension that can be ejected from the head. It is preferable that the viscosity is 30 mPa·s or less. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, functional-imparting materials such as polymerizable compounds, resins, and surfactants, biocompatible materials such as DNA, amino acids, proteins, and calcium. , Edible materials such as natural pigments, etc., including solutions, suspensions, emulsions, etc. These are, for example, inkjet inks, surface treatment liquids, components of electronic elements and light emitting elements, and formation of electronic circuit resist patterns It can be used for applications such as liquids for liquids and material liquids for three-dimensional modeling.

Further, the device for ejecting liquid includes a device that includes a head module, a head unit, or the like, and drives a head to eject liquid. Devices that eject liquid include not only devices that can eject liquid onto an object to which liquid can adhere, but also devices that eject liquid into air or liquid.

The "liquid ejecting device" can include means for feeding, transporting, and discharging an object to which liquid can adhere, as well as a pre-processing device, a post-processing device, and the like.

For example, as a "device that ejects liquid", an image forming device that ejects ink to form an image on paper, and powder is formed in layers to form a three-dimensional object (three-dimensional object). There is a three-dimensional modeling apparatus (three-dimensional modeling apparatus) that ejects a modeling liquid onto a formed powder layer.

Further, the "apparatus for ejecting liquid" is not limited to one that visualizes significant images such as letters and figures with the ejected liquid. For example, it includes those that form patterns that have no meaning per se, and those that form three-dimensional images.

The above-mentioned "substance to which a liquid can adhere" means a substance to which a liquid can adhere at least temporarily, such as a substance to which a liquid adheres and adheres, a substance which adheres and permeates, and the like. Specific examples include media such as recording media such as paper, recording paper, recording paper, film, and cloth, electronic components such as electronic substrates and piezoelectric elements, powder layers (powder layers), organ models, and test cells. Yes, and unless otherwise specified, includes anything that has liquid on it.

The material of the above-mentioned "thing to which a liquid can adhere" may be paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc., as long as the liquid can adhere even temporarily.

Further, the ``device for ejecting liquid'' includes a device in which a liquid ejection head and an object to which liquid can be adhered move relatively, but is not limited to this. Specific examples include a serial type apparatus in which the liquid ejection head is moved and a line type apparatus in which the liquid ejection head is not moved.

In addition, the "apparatus for ejecting liquid" also includes a treatment liquid coating device that ejects a treatment liquid onto the paper for the purpose of modifying the surface of the paper. There is an injection granulator that granulates fine particles of the raw material by injecting a composition liquid in which raw materials are dispersed in a solution through a nozzle.

The terms used in the present application, such as image formation, recording, printing, copying, printing, and molding, are synonymous.

REFERENCE SIGNS LIST 1 head 2 wiring member 3 element 100 head module 101 sub head module 102 base member 104 heat dissipation member (metal member)
105 cover member 108 rigid substrate 110 cap member 121 gas path 122 gas intake port 123 gas discharge port 141 first plate-like portion 142 second plate-like portion 151 first cover member 152 second cover member 153 opening 500 printer (liquid device)
550 head unit

Claims (14)

a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet ;
A relay board to which the wiring member is connected is held on a surface of the heat dissipation member opposite to the gas path side.
A head module characterized by: an opening is provided in an upper portion of the cover member, and a connector provided on the relay board can be accessed from the outside through the opening;
2. A head module according to claim 1 , wherein said opening communicates with said gas passage. An opening is provided in the upper part of the cover member,
2. The head module according to claim 1, wherein said opening is said gas outlet. a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet;
An opening is provided in the upper part of the cover member,
Having a detachable cap member covering the opening,
A head module, wherein the gas outlet through which the gas path communicates is formed between the cap member and the cover member. a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet;
The heat dissipation member has a first plate-shaped portion having a main surface along the direction of gravity and a second plate-shaped portion having a main surface along the horizontal direction,
an element of the wiring member is coupled to the second plate-shaped portion,
the main surface of the first plate-shaped portion forms the gas path;
The second plate-shaped portion has a through-hole through which the wiring member passes,
A head module, wherein the element is coupled to a wall surface of the through-hole. a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet;
The cover member includes a first cover member forming a wall surface of the gas passage, and a second cover member surrounding a portion other than the portion surrounded by the first cover member,
The head module, wherein the first cover member is detachable separately from the second cover member. a head;
a base member holding the head;
a wiring member connected to the head;
a heat dissipation member coupled to the element mounted on the wiring member;
a cover member surrounding at least the heat dissipation member,
forming a gas path along the direction of gravity with the heat radiating member and the cover member;
The cover member is provided with a gas intake port communicating with the gas path,
the gas path leads to a gas outlet above the gas inlet;
The cover member includes a first cover member forming a wall surface of the gas passage, and a second cover member surrounding a portion other than the portion surrounded by the first cover member,
The first cover member is detachable separately from the second cover member,
A head module, wherein the first cover member is integrally provided with a cap portion that covers an opening between the second cover member and the heat radiating member. A relay board to which the wiring member is connected is held on a surface of the heat radiating member opposite to the gas path side.
8. The head module according to any one of claims 4 to 7, characterized in that: The cover member includes a first cover member forming a wall surface of the gas passage, and a second cover member surrounding a portion other than the portion surrounded by the first cover member,
The first cover member is detachable separately from the second cover member.
6. The head module according to any one of claims 1 to 5, characterized in that: The cover member includes a first cover member forming a wall surface of the gas passage, and a second cover member surrounding a portion other than the portion surrounded by the first cover member,
The first cover member is detachable separately from the second cover member,
The first cover member is integrally provided with a cap portion that covers an opening between the second cover member and the heat radiating member.
6. The head module according to any one of claims 1 to 5, characterized in that: 11. The head module according to any one of claims 1 to 10 , wherein a plurality of said gas intake ports are provided. 12. The head module according to claim 1 , wherein said base member holds a plurality of said heads. A head unit comprising a plurality of head modules according to any one of claims 1 to 12 on a common base member. A device for ejecting liquid, comprising the head module according to any one of claims 1 to 12 or the head unit according to claim 13.

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