JP7103142B2 - Head module, head unit, liquid discharge device - Google Patents

Description

The present invention relates to a head module, a head unit, and a device for discharging a liquid.

The liquid discharge head is attached to the base member to form a head module.

Conventionally, the head is supported by a resin holder, a reinforcing member is arranged above the head with the holder sandwiched between the holders, and the reinforcing member is formed by forming a metal plate into a U-shape in cross section. There is a structure that functions as a heat sink, and the holder and the reinforcing member are in point contact with each other at a plurality of protrusions formed on the holder (Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-139157

In the head module in which the head is arranged on the base member, heat generated by the driver IC increases as the head is driven, and heat dissipation is required.

Here, in the configuration disclosed in Patent Document 1, a reinforcing member serving as a heat radiating member is arranged on the opposite side of the head via a resin holder corresponding to the base member, and the reinforcing member and the holder are in point contact with each other. Since it is held by, there is a problem that the holding structure of the heat radiating member becomes complicated.

The present invention has been made in view of the above problems, and an object of the present invention is to simplify the holding structure of the heat radiating member.

In order to solve the above problems, the head module according to the present invention is
With the base member
With a plurality of heads attached to the base member,
A plurality of wiring members connected to each of the plurality of heads and equipped with a drive circuit, and
A heat radiating member thermally coupled to the drive circuit is provided.
The heat radiating member is arranged so as to face the head and the base member.
The heat radiating member and the base member are in contact with each other between the adjacent heads.

According to the present invention, the holding structure of the heat radiating member can be simplified.

It is sectional drawing which follows the head short side direction of the head module which concerns on 1st Embodiment of this invention. Similarly, it is a side view of the state where the module case is removed. Similarly, it is a plan explanatory view of the head side from the heat radiation member. Similarly, it is an enlarged explanatory view of the joint portion of a heat radiation member and a flexible wiring member. It is an exploded perspective explanatory view of the head module. Similarly, it is an exploded perspective explanatory view seen from the nozzle surface side. Similarly, it is a perspective explanatory view of the head side from the heat radiation member. Similarly, it is an exploded perspective explanatory view seen from the heat radiation member side of the head side from the heat radiation member. Similarly, it is an exploded perspective explanatory view seen from the nozzle surface side on the head side from the heat radiation member. Similarly, it is explanatory drawing of the joint part of a module case and a heat dissipation member. It is explanatory drawing which provides the explanation of the contact point of the base member and the heat radiation member in the 2nd Embodiment of this invention. It is explanatory drawing which provides for the explanation of the contact point of the base member and the heat radiation member in the 3rd Embodiment of this invention. FIG. 5 is an enlarged explanatory view of a coupling portion between a heat radiating member and a drive circuit (driver IC) according to a fourth embodiment of the present invention. FIG. 5 is an enlarged explanatory view of a coupling portion between a heat radiating member and a drive circuit (driver IC) according to a fifth embodiment of the present invention. It is the schematic explanatory drawing of an example of the apparatus which discharges a liquid which concerns on this invention. It is a plane explanatory view of an example of the head unit of the same apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The first embodiment of the present invention will be described with reference to FIGS. 1 to 10. FIG. 1 is an explanatory cross-sectional view of the head module according to the same embodiment along the short side direction of the head, FIG. 2 is a side explanatory view of a state in which the module case is also removed, and FIG. be. FIG. 4 is an enlarged explanatory view of a joint portion between the heat radiating member and the flexible wiring member. FIG. 5 is an explanatory view of an exploded perspective of the head module, FIG. 6 is an explanatory view of an exploded perspective seen from the nozzle surface side, FIG. 7 is an explanatory view of a perspective of the head side of the heat radiating member, and FIG. FIG. 9 is an explanatory view of an exploded perspective view seen from the heat radiation member side, FIG. 9 is an explanatory view of an exploded perspective view seen from the nozzle surface side of the head side of the heat radiation member, and FIG. 10 is an explanatory view of a joint portion between the module case and the heat radiation member. .. Note that FIG. 1 shows only one head portion.

The head module 100 includes a plurality of heads 1 which are liquid discharge heads for discharging liquid, a base member 102, a cover member 103, a heat radiating member 104, a manifold 105, a printed circuit board (PCB) 106, and a module case 107. And have.

The plurality of heads 1 are laminated on the nozzle plate 10 on which the nozzle 11 is formed, the individual flow path plate 20 on which the individual liquid chamber 21 leading to the nozzle 11 is formed, the diaphragm 30 including the piezoelectric element 40, and the diaphragm 30. The intermediate flow path plate 50 and the common flow path member 70 laminated on the intermediate flow path plate 50 are provided.

The individual flow path plate 20 forms, together with the individual liquid chamber 21, a supply-side individual flow path 22 leading to the individual liquid chamber 21 and a recovery-side individual flow path 24 leading to the individual liquid chamber 21.

The intermediate flow path plate 50 communicates with the supply side individual flow path 22 through the opening 31 of the diaphragm 30 through the supply side intermediate flow path 51 and the recovery side individual flow path 24 through the opening 32 of the diaphragm 30. It forms an intermediate individual flow path 52 on the recovery side.

The common flow path member 70 forms a supply side common flow path 71 leading to the supply side intermediate individual flow path 51 and a recovery side common flow path 72 leading to the recovery side intermediate individual flow path 52.

The supply-side common flow path 71 leads to the flow path 151 of the manifold 105 via the supply port 81. The manifold 105 includes a supply port 181 that leads to an internal flow path 151. The recovery-side common flow path 72 leads to the flow path 152 of the manifold 105 via the recovery port 82. The manifold 105 includes a recovery port 182 leading to an internal flow path 152.

The printed circuit board 106 and the piezoelectric element 40 of the head 1 are connected via a flexible wiring member 90, and a driver IC (drive circuit) 91 is mounted on the flexible wiring member 90.

In this embodiment, a plurality of heads 1 are attached to the base member 102 at intervals. Specifically, for example, as shown in FIG. 6, two heads 1 and 1 arranged side by side in the lateral direction are set as one set, four sets are arranged in a staggered manner in the longitudinal direction, and eight heads 1 are used as heads. It constitutes module 100.

To attach the head 1 to the base member 102, the head 1 is inserted into the opening 121 provided in the base member 102, and the peripheral edge of the nozzle plate 10 of the head 1 is joined to the cover member 103 which is joined and fixed to the base member 102. And fixed. Further, a flange portion 70a provided outside the common flow path member 70 of the head 1 is joined to and fixed to the base member 102.

The fixing structure of the head 1 and the base member 102 is not limited, and can be fixed by adhesion, caulking, screw fixing, or the like.

Here, the base member 102 is preferably made of a material having a low coefficient of linear expansion. For example, 42alloy (alloy) in which nickel is added to iron, Invar material, and the like can be mentioned. In this embodiment, an Invar material is used. As a result, even if the head 1 generates heat and the temperature of the base member 102 rises, the amount of expansion of the base member 102 is small, so that the nozzle is less likely to shift from a predetermined nozzle position, and the landing position shift is suppressed. can.

The heat radiating member 104 is arranged so as to face a plurality of (here, four) head 1 and base member 102. Therefore, as shown in FIG. 3, the heat radiating member 104 is arranged so as to overlap with at least one head 1 in a plan view. The heat radiating member 104 is a metal member, preferably a material having a high thermal conductivity, and examples thereof include metals containing aluminum, silver, copper, and gold.

Then, as shown in FIGS. 2 and 7, the heat radiating member 104 is provided with a convex holding portion 141 between two heads 1 and 1 adjacent to each other in the longitudinal direction of the head 1, and the holding portion 141 is used as a base. It is held in surface contact with the member 102.

Specifically, as shown in FIGS. 8 and 9, a convex portion 142 provided on the tip surface of the holding portion 141 of the heat radiating member 104 is fitted and fixed in the concave portion 122 provided on the base member 102.

In this way, the heat radiating member 104 and the base member 102 arranged to face the head 1 and the base member 102 are in contact with each other between the adjacent heads 1 and 1, so that the heat radiating member can be held. The structure is simple and can be miniaturized.

Further, since the heat radiating member 104 and the base member 102 are held in surface contact with each other, the posture of the heat radiating member 104 is stabilized.

In this case, as shown in FIGS. 8 and 9, the heat radiating member 104 and the base member 102 are fixed at one location (convex portion 142 and concave portion 122) near the center in the arrangement direction in the longitudinal direction of the head.

As a result, when the heat radiating member 104 is thermally expanded, the heat radiating member 104 can be extended in the longitudinal direction, so that the base member 102 can be prevented from being deformed due to the thermal expansion of the heat radiating member 104.

On the other hand, when the heat radiating member 104 is fixed to the base member 102 at a plurality of places, the force that the heat radiating member 104 tries to expand due to heat acts on the base member 102, and the base member 102 may be deformed.

Next, the connection between the driver IC (drive circuit) 91 and the heat radiating member 104 will be described with reference to FIG.

First, as shown in FIG. 4A, the flexible wiring member 90 on which the driver IC (drive circuit) 91 is mounted (mounted) and the heat radiating member 104 are fixed with a heat conductive tape 108, and the driver IC 91 and the heat radiating member 104 are fixed. Is thermally coupled via the flexible wiring member 90 and the heat conductive tape 108. The thermal coupling means that, in the present embodiment, the heat generated by the driver IC 91 is thermally conducted to the heat radiating member 104.

Further, in the present embodiment, as described above, since the two heads 1 and 1 are arranged side by side in the lateral direction of the head 1, the heat radiating member 104 has two flexible wirings of the adjacent heads 1 and 1. A through hole 104a through which the members 90 and 90 pass is provided (see FIGS. 7, 8 and the like).

Then, as shown in FIG. 4B, adjacent flexible wiring members 90 and 90 are fixed to the wall surface of the through hole 104a with a heat conductive tape 108, respectively, in the through hole 104a, and each of the flexible wiring members 90 and 90 is fixed. The drivers 91 and 91 and the heat radiating member 104 are coupled.

In this embodiment, the module case 107 is attached to the base member 102. The module case 107 internally houses a part of the flexible wiring member 90 including the printed wiring board 106, the manifold 105, the heat radiating member 104, and the driver IC 91.

Then, as shown in FIG. 10, the heat radiating member 104 and the module case 107 are fixed by a heat conductive member, for example, a heat conductive tape 108 or the like and thermally coupled, and the heat of the heat radiating member 104 is transferred through the module case 107. It dissipates heat to the outside.

Further, the port portion 80 forming the supply port 81 and the recovery port 82 of the head 1 is arranged outside the heat radiating member 104 in the longitudinal direction and is arranged through the through hole 104b provided in the heat radiating member 104.

Here, the through hole 104b of the heat radiating member 104 is larger than the port portion 80, and the port portion 80 and the radiating member 104 are not in contact with each other.

As a result, the heat of the heat radiating member 104 can be directly conducted to the supply port 81 and the recovery port 82 to suppress the rise in the temperature of the liquid, and the variation in characteristics due to the temperature can be suppressed.

Further, the port portion 80 projects from the upper surface of the heat radiating member 104, and by arranging the manifold 105 on the port portion 80, the manifold 105 is arranged with a gap from the upper surface of the radiating member 104.

The manifold 105 is held on the heat radiating member 104 by a partial contact portion 113 (see FIG. 2) such as an adhesive or packing.

As a result, the heat of the heat radiating member 104 can be suppressed from being conducted to the manifold 105 to raise the temperature of the liquid, and the variation in characteristics due to the temperature can be suppressed.

Next, the second embodiment of the present invention will be described with reference to FIG. 11A and 11B are explanatory views provided for explaining the contact points between the base member and the heat radiating member in the same embodiment, where FIG. 11A is a plan explanatory view and FIG. 11B is a cross-sectional explanatory view taken along line X1-X1 of FIG. be.

In the present embodiment, since the four heads 1 are arranged side by side in the longitudinal direction on the base member 102, three gaps between the heads 1 and 1 are generated.

At this time, the holding portion 141 of the heat radiating member 104 is provided only at one place near the center in the arrangement direction in the longitudinal direction of the head, as in the first embodiment, and one holding portion 141 comes into contact with the base member 102. Is retained.

In this way, when an even number of heads 1 are arranged in the longitudinal direction of the heads, the heat radiating member 104 is provided with one holding portion 141 corresponding to the central gap of the gap between the odd number of heads, and the base is provided. It is held in contact with the member 102.

As a result, when the heat radiating member 104 is thermally expanded, the heat radiating member 104 can be extended in the longitudinal direction, so that the base member 102 can be prevented from being deformed due to the thermal expansion of the heat radiating member 104.

Next, a third embodiment of the present invention will be described with reference to FIG. 12A and 12B are explanatory views provided for explaining the contact points between the base member and the heat radiating member in the same embodiment, FIG. 12A is a plan explanatory view, and FIG. 12B is a cross-sectional explanatory view taken along line X2-X2 of FIG. be.

Also in this embodiment, since the four heads 1 are arranged side by side in the longitudinal direction on the base member 102, three gaps between the heads 1 and 1 are generated.

In the present embodiment, the heat radiating member 104 is provided with holding portions 141 corresponding to the three gaps between the heads 1 in the arrangement direction in the longitudinal direction of the heads. Then, these three holding portions 141 are held in contact with the base member 102.

In the case of the configuration as in this embodiment, it is preferable that the base member 102 is formed of a member having rigidity that does not deform when the heat radiation member 104 thermally expands.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 13 is an enlarged explanatory view of a coupling portion between the heat radiating member and the drive circuit (driver IC) in the same embodiment.

In the present embodiment, the driver IC 91 and the heat radiating member 104 are fixed by the heat conductive tape 108, and the driver IC 91 and the heat radiating member 104 are thermally coupled.

Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 14 is an enlarged explanatory view of a coupling portion between the heat radiating member and the drive circuit (driver IC) in the same embodiment.

In the present embodiment, the driver IC 91 is pressed against the heat radiating member 104 by an elastic member 109 such as a spring from the flexible wiring member 90 side, and the driver IC 91 and the heat radiating member 104 are thermally coupled. In this case, it is preferable to apply silicon grease or the like having high thermal conductivity between the driver IC 91 and the heat radiating member 104.

Next, an example of the device for discharging the liquid according to the present invention will be described with reference to FIGS. 15 and 16. FIG. 15 is a schematic explanatory view of the device, and FIG. 16 is a plan explanatory view of an example of the head unit of the device.

The printing device 500, which is a device for discharging this liquid, includes a carry-in means 501 for carrying in the continuum 510, a guide transport means 503 for guiding and transporting the continuum 510 carried in from the carry-in means 501 to the printing means 505, and a continuous body. It is provided with a printing means 505 that discharges a liquid to 510 to form an image, a drying means 507 that dries the continuum 510, and a unloading means 509 that carries out the continuum 510.

The continuum 510 is sent out from the original winding roller 511 of the carrying-in means 501, guided and conveyed by the rollers of the carrying-in means 501, the guiding and conveying means 503, the drying means 507, and the carrying-out means 509, and is guided and conveyed by the winding roller 591 of the carrying-out means 509. It is wound up at.

The continuum 510 is conveyed by the printing means 505 on the transfer guide member 559 facing the head unit 550, and an image is printed by the liquid discharged from the head unit 550.

Here, as shown in FIG. 16, the head unit 550 includes two head modules 100A and 100B according to the present invention in the common base member 552.

Then, when the alignment direction of the heads 1 in the direction orthogonal to the transport direction of the head module 100 is the head arrangement direction, the liquids of the same color are discharged in the head rows 1A1 and 1A2 of the head module 100A. Similarly, the head rows 1B1 and 1B2 of the head module 100A are set, the head rows 1C1 and 1C2 of the head module 100B are set as a set, and the head rows 1D1 and 1D2 are set as a set, and the liquids of the required colors are discharged respectively.

The head module according to the present invention can be integrated with a functional component and a mechanism to form a liquid discharge unit. For example, the head module can be combined with at least one of a head tank, a carriage, a supply mechanism, a maintenance / recovery mechanism, a main scanning moving mechanism, and a liquid circulation device.

Here, the term "integration" includes, for example, one in which a head module, a functional component, and a mechanism are fixed to each other by fastening, bonding, engaging, or the like, and one in which one is movably held with respect to the other. .. Further, the head module, the functional component, and the mechanism may be configured to be detachable from each other.

Further, the "device for discharging a liquid" in the present invention includes a device provided with a head module or a liquid discharge unit and driving the liquid discharge head to discharge the liquid. The device for discharging the liquid includes not only a device capable of discharging the liquid to a device to which the liquid can adhere, but also a device for discharging the liquid into the air or the liquid.

The "device for discharging the liquid" can also include means for feeding, transporting, and discharging paper to which the liquid can adhere, as well as a pretreatment device, a posttreatment device, and the like.

For example, as a "device that ejects a liquid", an image forming apparatus that ejects ink to form an image on paper, and a powder is formed in layers in order to form a three-dimensional model (three-dimensional model). There is a three-dimensional modeling device (three-dimensional modeling device) that discharges the modeling liquid into the powder layer.

Further, the "device for discharging a liquid" is not limited to a device in which a significant image such as characters and figures is visualized by the discharged liquid. For example, those that form patterns that have no meaning in themselves and those that form a three-dimensional image are also included.

The above-mentioned "material to which a liquid can adhere" means a material to which a liquid can adhere at least temporarily, such as one that adheres and adheres, and one that adheres and permeates. Specific examples include paper, recording paper, recording paper, film, recording media such as cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers (powder layers), organ models, and media such as inspection cells. Yes, including anything to which the liquid adheres, unless otherwise specified.

The material of the above-mentioned "material to which a liquid can be attached" may be paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics, or the like as long as the liquid can be attached even temporarily.

Further, the "device for discharging the liquid" includes, but is not limited to, a device in which the liquid discharge head and the device to which the liquid can adhere move relatively. Specific examples include a serial type device that moves the liquid discharge head, a line type device that does not move the liquid discharge head, and the like.

In addition, as a "device for ejecting a liquid", a treatment liquid coating device for ejecting a treatment liquid to a paper in order to apply the treatment liquid to the surface of the paper for the purpose of modifying the surface of the paper, etc. There is an injection granulator that injects a composition liquid in which a raw material is dispersed in a solution through a nozzle to granulate fine particles of the raw material.

The liquid to be discharged may have a viscosity and surface tension that can be discharged from the head, and is not particularly limited, but has a viscosity of 30 mPa · s or less at room temperature, under normal pressure, or by heating or cooling. Is preferable. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functionalizing materials such as surfactants, biocompatible materials such as DNA, amino acids and proteins, and calcium. , Solvents, suspensions, emulsions, etc. containing edible materials such as natural pigments, etc., for example, inks for inkjets, surface treatment liquids, components of electronic elements and light emitting elements, and formation of electronic circuit resist patterns. It can be used for applications such as a liquid for use and a material liquid for three-dimensional modeling.

Piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heat-generating resistors, and electrostatic actuators that consist of a vibrating plate and counter electrodes are used as energy sources for discharging liquid. Includes what to do.

In addition, image formation, recording, printing, printing, printing, modeling, etc. in the terms of the present application are all synonymous.

1 Head 10 Nozzle plate 11 Nozzle 70 Common flow path member 90 Flexible wiring member 91 Driver IC
100 Head module 102 Base member 103 Cover member 104 Heat dissipation member 141 Convex part 105 Manifold 106 Printed circuit board 108 Module case 500 Liquid discharge device (printing device)
550 head unit

Claims (18)

With the base member
With a plurality of heads attached to the base member,
A plurality of wiring members connected to each of the plurality of heads and equipped with a drive circuit, and
A heat radiating member thermally coupled to the drive circuit is provided.
The heat radiating member is arranged so as to face the head and the base member.
A head module characterized in that the heat radiating member and the base member are in contact with each other between adjacent heads. The head module according to claim 1, wherein the heat radiating member and the base member are in surface contact with each other. The head module according to claim 1 or 2, wherein the coefficient of linear expansion of the base member is smaller than the coefficient of linear expansion of the heat radiating member. A case for accommodating at least the heat radiation member is attached to the base member.
The head module according to any one of claims 1 to 3, wherein the heat radiating member and the case are thermally coupled. The heat radiating member is provided with a through hole through which the wiring member passes.
The head module according to any one of claims 1 to 4, wherein the drive circuit of the wiring member and the heat radiating member are thermally coupled inside the through hole. Two heads are arranged in the base member in the lateral direction of the head.
The wiring member connected to each of the two heads is passed through the through hole of the heat radiation member.
The head module according to claim 5, wherein the drive circuit mounted on each of the wiring members of the two heads is coupled to the heat radiation member inside the through hole. The heat radiating member has a convex holding portion and a convex portion formed on the tip surface of the holding portion.
The base member is formed with a recess into which the convex portion of the heat radiation member is fitted between the adjacent heads.
The head module according to any one of claims 1 to 6, wherein the convex portion of the heat radiating member is fitted into the concave portion of the base member, and the holding portion of the heat radiating member is held by the base member. .. A plurality of the heads are arranged on the base member along the longitudinal direction of the head, and the heat radiating member faces the plurality of heads and is in non-contact with the plurality of heads on the base member. Have been placed.
The head module according to any one of claims 1 to 7. The head module according to any one of claims 1 to 8, wherein the heat radiating member is in contact with the center of the base member in the longitudinal direction of the head. The head module according to any one of claims 1 to 9, wherein the base member is made of an alloy containing at least iron and nickel. The head module according to any one of claims 1 to 10, wherein the heat radiating member contains at least any one of aluminum, copper, silver, and gold. The head module according to any one of claims 1 to 11, wherein the head is a liquid discharge head that discharges a liquid. Above the heat radiating member, a manifold having a flow path leading to the flow path of the head is arranged.
The head module according to claim 12, wherein the manifold is arranged with a gap from the upper surface of the heat radiating member. A head unit according to any one of claims 1 to 11, wherein a plurality of head modules are arranged on a common base member. With the base member
A plurality of heads attached to the base member,
A plurality of wiring members connected to each of the plurality of heads and equipped with a drive circuit, and
A metal member thermally coupled to the drive circuit.
The metal member is arranged so as to face the head and the base member.
A head module characterized in that the metal member and the base member are in contact with each other between adjacent heads. A head unit according to claim 15, wherein a plurality of head modules are arranged on a common base member. A device for discharging a liquid, which comprises the head module according to claim 12 or 13. The head module according to claim 15 or the head unit according to claim 16 is provided.
The head is a liquid discharge head that discharges a liquid.
A device that discharges a liquid.

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