JP7150304B2 - SOLDER FEEDER, CONTROL METHOD FOR SOLDER FEEDER - Google Patents

Description

The present invention relates to a solder feeder for feeding wire solder during soldering work and a control method for this solder feeder.

The demand for reliability of electronic control parts is increasing, and the reliability of soldering required therefor is also increasing. As one of the means for improving reliability, there is a method of conducting lectures and examinations for soldering workers to maintain their skills.

In addition, when soldering, soldering technicians can prevent variations in soldering quality and achieve highly reliable soldering by repeatedly feeding the necessary amount of wire solder to the soldering point based on their experience. is doing.

However, due to the recent decline in the working population, there has been a shortage of workers with soldering skills, and there has been the problem that it is difficult to ensure soldering reliability that depends on the skills of soldering workers.

In order to realize quantification of the solder feeding amount that does not depend on soldering skill, a solder feeding method has been proposed in which the wire solder wound on the supply reel is fed out and supplied to the soldering iron in fixed amounts (for example, Patent Document 1 reference).

In addition, the wire solder of the supply reel is arranged at the rear part of the soldering iron, and the wire solder guided from there to the feeding device inside the soldering iron is gripped by the feeding device and intermittently fed to the tip of the soldering iron through the guide pipe. Also known is an electromagnetic wire solder feeding device configured to be fed to a wire (see, for example, Patent Document 2).

JP-A-7-009127 JP-A-5-245628

However, in the invention described in the above-mentioned Patent Document 1, although the wire solder can be supplied efficiently, if a dimensional error occurs in the diameter of the solder feed roller, or if a blade is added to the feed roller, the solder will not be fed. Due to the elongation phenomenon of solder when processing (for example, processing a V-groove in solder) and the slight difference in circumference when changing the solder wire diameter, the feed amount of wire solder set in advance and the actual feed amount of wire solder There is a problem that an error is likely to occur between the amount of feed and the amount of wire solder supplied, either too much or too little, making it difficult to perform quantitative soldering.

In addition, in the invention described in Patent Document 2, although the wire solder can be supplied efficiently, if the distance between the supply reel and the tip of the soldering iron becomes long, the previously set wire solder cannot be supplied. Errors tend to occur between the amount of feed and the amount of wire solder that is actually fed, and the amount of wire solder supplied is either too large or too small, making it difficult to perform stable soldering. There was an issue.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems. It is an object of the present invention to provide a solder feeder and a control method for the solder feeder.

A solder feeder of the present invention has the following configuration.
wire solder feeding means for feeding wire solder, a nozzle for exposing the tip of the fed wire solder, a wire solder conveying pipe connecting the nozzle and the wire solder feeding means, and a control for controlling the wire solder feeding means an input section for inputting control conditions to the control unit; a display section for displaying the control conditions for the control unit; and a gripping section for supporting the nozzle . Notification means for notifying the elapse of the melting time of the wire solder input in advance from the input unit is formed, and the control unit receives a preset feeding amount of the wire solder input from the input unit and the input A corrected feed amount is calculated by comparing the actually measured feed amount of the wire solder input from the unit and matching the set feed amount with the actually measured feed amount.

According to the solder feeder of the present invention, before the soldering work using the solder feeder, a desired feed amount of wire solder is input from the input section of the solder feeder, and then the actually fed wire is input. By inputting the actually measured solder feed amount and calculating the correction feed amount, based on the obtained correction feed amount, controlling the line solder feed amount during soldering work, Even if there is a discrepancy in the actually measured feed amount, it is possible to correct the deviation and accurately feed the wire solder by a desired feed amount, thereby performing the soldering work with high precision.

Further, in the present invention, the wire solder feeding means includes a stepping motor and a feeding roller connected to the stepping motor, and the control unit includes a calculation section for calculating the correction feed amount and a memory for the correction feed amount. and a driver for controlling the stepping motor.

Further, in the present invention, it is preferable that the inner diameter of the wire solder conveying pipe is 1.1 times or more and 2.5 times or less the diameter of the wire solder.

Further, in the present invention, it is preferable that the gripping section includes a feed switch for transmitting a feed signal for the wire solder to the control unit.

Moreover, in the present invention, it is preferable that the holding portion can be attached with a soldering iron.

A control method for a solder dispenser according to the present invention has the following configuration.
wire solder feeding means for feeding wire solder, a nozzle for exposing the tip of the fed wire solder, a wire solder conveying pipe connecting the nozzle and the wire solder feeding means, and a control for controlling the wire solder feeding means unit, an input section capable of inputting control conditions to the control unit, and a display section for displaying the control conditions of the control unit, wherein the control unit receives input from the input section and is set in advance. Solder for calculating a correction feed amount that matches the set feed amount and the measured feed amount by comparing the set feed amount of the wire solder and the actually measured feed amount of the wire solder input from the input unit. A method for controlling a feeder, comprising: a set feed amount input step of inputting the set feed amount from the input unit to the control unit; and feeding the wire solder from the wire solder feeding means based on the set feed amount. a preliminary feeding step; a measured feed amount input step of inputting the measured feed amount from the input section to the control unit; and a correction coefficient calculation step of calculating a correction coefficient from the set feed amount and the measured feed amount by the control unit. and a feed control step in which the control unit controls the wire solder feed amount of the wire solder feed means based on the corrected feed amount obtained by multiplying the set feed amount by the correction coefficient. .

According to the present invention, a solder feeder capable of accurately supplying wire solder in consideration of an error between a preset feed amount of wire solder and an actually fed feed amount of wire solder, And it becomes possible to provide a control method for this solder feeder.

1 is an external perspective view showing a solder feeder according to a first embodiment of the present invention; FIG. FIG. 4 is an enlarged perspective view of a main part showing a gripping portion that constitutes the solder feeder; 1 is a block diagram showing an electrical configuration of a solder feeder according to a first embodiment of the present invention; FIG. 4 is a flow chart showing a method of controlling a solder feeder step by step. FIG. 4 is a schematic diagram showing a state of soldering work using a solder feeder; FIG. 4 is a schematic diagram showing a display example of a touch panel;

A solder feeder and a method for controlling the solder feeder according to an embodiment of the present invention will be described below with reference to the drawings. It should be noted that each embodiment shown below is specifically described for better understanding of the gist of the invention, and does not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make it easier to understand the features of the present invention, there are cases where the main parts are enlarged for convenience, and the dimensional ratio of each component is the same as the actual one. not necessarily.

(Solder feeder)
FIG. 1 is an external perspective view showing a solder dispenser according to one embodiment of the present invention. FIG. 2 is an enlarged perspective view of a main part showing a grip part constituting the solder feeder. 3 is a block diagram showing the electrical configuration of the solder dispenser shown in FIG. 1. As shown in FIG.
A solder feeder 10 according to one embodiment of the present invention includes a wire solder delivery portion (wire solder delivery means) 11, a grip portion 12 having a nozzle 13, a wire solder conveying pipe 14, an input portion 15, and a display portion. 16 and a control unit 17 .

The wire solder delivery unit (wire solder delivery means) 11 includes a transport roller pair (delivery roller) 21 that sandwiches and transports the wire solder H, and a stepping motor 22 that rotates the transport roller pair 21 . The stepping motor 22 intermittently operates based on a control signal from a motor driver (driver) 44, which will be described later. The conveying roller pair 21 is preferably made of, for example, metal rollers, and is preferably formed with a blade or the like for processing a V-groove on the peripheral surface of the wire solder H to prevent solder from scattering. In this embodiment, the wire solder delivery section 11 is installed on the upper portion of the housing 33 of the control unit 17 .

The grip part 12 is an elliptical cylinder-shaped grip for a soldering operator to guide the tip of the nozzle 13 to a soldering position, and a delivery switch 24 is formed at one end. The delivery switch 24 is, for example, a push button switch, and sends out a solder delivery signal to the control unit 17 when pressed. The feed-out switch 24 and the control unit 17 may be connected by a wired cable or configured to transmit a solder feed-out signal wirelessly.

In addition, it is also preferable that such a delivery switch 24 can be selectively attached to one surface and the opposite surface of the grip portion 12, for example. Thereby, the delivery switch 24 can be arranged according to the operator's dominant hand.

The nozzle 13 is fixed to one end of the grip portion 12, and the wire solder H passes through it. The nozzle 13 has a tapered shape toward the tip portion, and the wire solder H is drawn out by a predetermined length from the tip portion.
In addition, it is also preferable that the nozzle 13 is detachable from the grip part 12 and can be attached in a plurality of directions according to the operator's dominant hand.

An LED (notification means) 25 that can be visually recognized by the operator is formed on the grip portion 12 . The LED 25 lights up for a certain period of time after the solder melting time input from the input section 15 to the control unit 17 has passed. The solder melting time may be, for example, the time from when the operator feeds out the wire solder H, applies the soldering iron, and melts the wire solder H to the optimum state for soldering.

Such a grip portion 12 may be configured to be able to attach a soldering iron. By attaching the soldering iron to the gripping part 12 and integrating it, the operator holds the workpiece with one hand and holds the gripping part 12 equipped with the soldering iron with the other hand while sending out wire solder. It can be melted and soldered.

Alternatively, the nozzle 13 may be provided in the vicinity of the soldering iron tip of an automatic soldering machine or the like without providing such a grip portion 12 . In this case, in place of the feed switch 24 provided on the grip part 12, a configuration may be adopted in which a solder feed signal is sent from an automatic soldering machine.

The wire solder conveying pipe 14 is composed of, for example, a flexible, low-friction resin tube, and has one end connected to the wire solder feeding section 11 and the other end connected to the nozzle 13 . The wire solder conveying pipe 14 passes the wire solder H inside and conveys the wire solder H delivered from the wire solder delivery unit 11 toward the nozzle 13 .

The inner diameter of the wire solder conveying pipe 14 may be, for example, 1.1 times or more and 2.5 times or less the diameter of the wire solder H to be conveyed. If the inner diameter of the wire solder conveying pipe 14 is less than 1.1 times the diameter of the wire solder H, friction with the wire solder conveying pipe 14 becomes excessive when the wire solder H is delivered, and there is a risk that the wire solder H will be difficult to convey. There is Further, if the inner diameter of the wire solder conveying pipe 14 exceeds 2.5 times the diameter of the wire solder H, the wire solder H is greatly meandered or twisted within the wire solder conveying pipe 14 when the wire solder H is delivered. , it may be difficult to maintain an accurate feeding amount of the wire solder H.

In addition, in this embodiment, a protective tube 26 is further formed outside the wire solder conveying tube 14 . That is, it has a double pipe structure of the wire solder conveying pipe 14 and the protective pipe 26 . Lead wires (not shown) for electrically connecting the feed switch 24 and the LED 25 to the control unit 17 are accommodated between the wire solder conveying tube 14 and the protective tube 26 . The protective tube 26 protects the outer surface of the solder wire conveying pipe 14 and maintains the rigidity of the solder wire conveying pipe 14, and along the outside of the solder wire conveying pipe 14, the above-described lead wires and the like can be wired. becomes possible.

In this embodiment, the input unit 15 is configured by a touch panel (input unit) 31 formed on the display unit 16 . Input information on the touch panel 31 is input to the control unit 17 . Such input information includes, for example, the type of wire solder (diameter, etc.), the set feed amount of wire solder, the actually measured feed amount of wire solder, setting confirmation information, and the like.

Although the input unit 15 uses the touch panel (input unit) 31 in this embodiment, it can also be configured by an operation panel having a numeric keypad, for example.

The display unit 16 is composed of a liquid crystal display (display unit) 32 . A touch panel 31 is integrally formed with the liquid crystal display 32 . The liquid crystal display 32 performs display based on image signals output from the control unit 17 . The information displayed on the liquid crystal display 32 includes, for example, a set feed amount of wire solder, an actually measured feed amount of wire solder, a correction coefficient, a corrected feed amount of wire solder, and the like.

Although the liquid crystal display 32 is used as the display unit 16 in this embodiment, various display panels such as an organic EL display can be used in addition to this.

The control unit 17 includes a rectangular parallelepiped housing 33 and a control board 34 housed in the housing 33 .
A wire solder delivery unit (wire solder delivery means) 11 is fixed to the upper surface of the housing 33 . A reel holder 36 is formed at one end of the upper portion of the housing 33 to rotatably support a solder reel Hr around which the wire solder H is wound. The wire solder H is pulled out from the solder reel Hr by the wire solder delivery part 11, passes through the nozzle 13 of the grip part 12 via the wire solder conveying pipe 14, and is exposed to the outside by a predetermined length from the tip of the nozzle 13. .

The control board 34 includes a microcomputer (CPU) 41 , a memory IC (memory) 42 , a buzzer (notification means) 43 and a motor driver (driver) 44 .

The microcomputer (CPU) 41 calculates a correction coefficient and a correction feed amount of the wire solder based on the set feed amount and the actually measured feed amount of the wire solder input from the touch panel (input unit) 31 . A microcomputer (CPU) 41 controls a buzzer (notification means) 43 , an LED (notification means) 25 provided on the grip portion 12 , and a motor driver (driver) 44 .

A storage IC (memory) 42 stores the correction coefficient calculated by the microcomputer (CPU) 41, the correction feeding amount of wire solder, and the like.
A motor driver (driver) 44 outputs a control signal for the stepping motor 22 based on the set feed amount and the corrected feed amount of the wire solder output from the microcomputer (CPU) 41 .

A buzzer (notifying means) 43 sounds for a certain period of time when the solder melting time input from the input section 15 to the control unit 17 has passed. The solder melting time may be, for example, the time from when the operator feeds out the wire solder H, applies the soldering iron, and melts the wire solder H to the optimum state for soldering.

(Control method for solder feeder)
A method of controlling the solder dispenser configured as above will be described with reference to FIGS.
FIG. 4 is a flow chart showing step by step the control method of the solder dispenser having the configuration shown in FIGS. FIG. 5 is a schematic diagram showing how soldering work is performed using the solder feeder 10. As shown in FIG.

When performing a soldering operation using the solder feeder 10 and the soldering iron 50, first, the wire solder H is fed out from the solder reel Hr, and is delivered from the wire solder delivery portion 11 through the wire solder transfer pipe 14 to the grip portion 12. The wire solder H is passed up to the nozzle 13 of . At this time, the tip of the wire solder H is aligned with the tip of the nozzle 13 .

Then, after the power supply of the solder feeder 10 is turned on, the set feed amount L1 of the wire solder H is input from the touch panel (input unit) 31 according to the type (diameter, etc.) of the wire solder H (set feed amount input step S1). . FIG. 6A shows an input example of the touch panel 31 at this time. In this input example, the set feed amount L1 is set to 50 mm.

Next, the operator operates the touch panel 31 or presses the delivery switch 24 of the grip part 12 once. Then, the microcomputer (CPU) 41 calculates the number of operation pulses of the stepping motor 22 corresponding to the set feed amount L1 input in the set feed amount input step S1, and drives the stepping motor 22 through the motor driver (driver) 44. Rotate for a predetermined number of revolutions. As a result, the conveying roller pair (sending rollers) 21 rotates a predetermined number of times, and the wire solder H is exposed for a predetermined length from the tip of the nozzle 13 (preliminary sending step S2).

In the preliminary sending step S2, the meandering of the wire solder H in the wire solder transfer pipe 14 due to the inner diameter of the wire solder transfer pipe 14 being larger than the diameter of the wire solder H, and the diameter change of the transfer roller pair (delivery roller) 21 If there is a dimensional error, solder elongation phenomenon when adding a blade to the feed roller to process the solder (for example, processing a V-groove in the solder), a slight circumferential difference when changing the solder wire diameter, etc. As a result, an error occurs between the preset feed amount of wire solder and the actually fed feed amount of wire solder, and the set feed amount L1 may differ from the actually measured feed amount L2 described below.

Next, the delivery length of the wire solder H delivered in the preliminary delivery step S2, that is, the length from the tip of the nozzle 13 to the tip of the wire H (actually measured feed amount L2) is measured using a ruler, vernier caliper, or the like. do. At this time, it is preferable to actually measure after cutting the wire solder H for the amount sent out.

Then, the measured feed amount L2 of the wire solder H is input from the touch panel (input unit) 31 (measured feed amount input step S3). FIG. 6B shows an input example of the touch panel 31 at this time. This input example indicates that the measured feed amount L2 is 48 mm. It is preferable to measure the actually measured feed amount several times until the feed amount of the wire solder H stabilizes, and then input the actually measured feed amount after stabilization.

A microcomputer (CPU) 41 of the control unit 17 calculates a correction coefficient R from the set feed amount L1 and the measured feed amount L2 input from the touch panel (input section) 31 (correction coefficient calculation step S4). Specifically, correction coefficient R=set feed amount L1/measured feed amount L2 is calculated. FIG. 6(c) shows a display example of the touch panel 31 at this time. This display example indicates that the correction coefficient R (displayed as a correction value on the screen) is 1.04. If the correction coefficient R is correct, the operator performs confirmation input from the touch panel (input unit) 31 .

Then, the microcomputer (CPU) 41 calculates the correction feed amount L3 of the wire solder H during the soldering work from the correction coefficient R (correction feed amount calculation step S5). Specifically, correction feed amount L3=set feed amount L1×correction coefficient R is calculated. Then, the microcomputer (CPU) 41 causes the storage IC (memory) 42 to store the obtained corrected feed amount L3.

The soldering operator uses the solder feeder 10 and the soldering iron 50 to perform the actual soldering work based on the corrected feed amount L3 thus set. Every time the operator presses the feed switch 24 of the gripper 12, the control unit 17 calculates the number of operation pulses of the stepping motor 22 corresponding to the correction feed amount L3 stored in the memory IC (memory) 42, and the motor driver ( The stepping motor 22 is rotated by a predetermined number of revolutions via the driver) 44 . As a result, the wire solder H having the length equal to the set feed amount L1 is accurately fed from the tip portion of the nozzle 13 .

Examples of calculation formulas used when controlling the stepping motor 22 by the control method described above are as follows.
・The number of gear teeth on the stepping motor 22 side: Gm
・The number of pulses required for one rotation of the stepping motor 22: Pm
・Diameter of each transport roller pair (delivery roller) 21: Dr
The number of gear teeth on the conveying roller pair (delivery roller) 21 side: Gr
The number of pulses required for one rotation of the conveying roller pair (delivery roller) 21: Pr
・Feed amount of wire solder H per rotation of stepping motor 22: Lm
・Set feed amount: L1
・Correction coefficient: R
・The number of operation pulses of the stepping motor 22 corresponding to the correction feed amount L3: Pc
Pr=Gr/Gm×Pm
Lm=Dr×π
Pc=L1/(Lm・Pr)×R

In addition, the control unit 17 operates the LED (notification means) 25 and the buzzer (notification means) 43 every time the pre-input solder melting time elapses after the feed switch 24 is pressed, so that the operator can Notifies the timing of solder melting.

As described above, according to the solder dispenser 10 and the control method of the solder dispenser 10 of the embodiment of the present invention, before the soldering operation using the solder dispenser 10, the touch panel (input Part) 31 inputs the set feed amount of the desired wire solder H, then inputs the measured feed amount of the actually fed wire solder H, calculates the correction feed amount, and calculates the correction feed amount based on the obtained correction feed amount. By controlling the feed amount of the wire solder H, even if there is a deviation in the actually measured feed amount from the initially set feed amount, the deviation is corrected and the wire solder H is accurately fed by the desired feed amount. It is possible to send out and perform soldering work with high precision.

Although embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof.

10... Solder feeder 11... Wire solder delivery unit (wire solder delivery means)
DESCRIPTION OF SYMBOLS 12... Grip part 13... Nozzle 14... Wire solder conveyance pipe 15... Input part 16... Display part 17... Control unit

Claims (6)

wire solder feeding means for feeding wire solder, a nozzle for exposing the tip of the fed wire solder, a wire solder conveying pipe connecting the nozzle and the wire solder feeding means, and a control for controlling the wire solder feeding means a unit, an input section capable of inputting control conditions to the control unit, a display section for displaying the control conditions of the control unit, and a grip section for supporting the nozzle ,
Notification means for notifying elapse of the melting time of the wire solder input in advance from the input unit is formed in the grip unit,
The control unit compares a preset feed amount of the wire solder input from the input section with an actually measured feed amount of the wire solder input from the input section, and determines the set feed amount. and a solder feeder that calculates a correction feed amount that matches the actually measured feed amount. The wire solder delivery means comprises a stepping motor and a delivery roller connected to the stepping motor,
2. The solder supply according to claim 1, wherein said control unit comprises a calculation section for calculating said correction feed amount, a storage section for storing said correction feed amount, and a driver for controlling said stepping motor. machine. 3. The solder feeder according to claim 1, wherein the inner diameter of said wire solder conveying pipe is 1.1 times or more and 2.5 times or less as large as the diameter of said wire solder. 4. The solder feeder according to claim 1 , wherein the gripping portion includes a feed switch for sending a feed signal for the wire solder to the control unit. The solder feeder according to any one of claims 1 to 4, wherein a soldering iron can be attached to the grip portion. wire solder feeding means for feeding wire solder, a nozzle for exposing the tip of the fed wire solder, a wire solder conveying pipe connecting the nozzle and the wire solder feeding means, and a control for controlling the wire solder feeding means unit, an input section capable of inputting control conditions to the control unit, and a display section for displaying the control conditions of the control unit, wherein the control unit receives input from the input section and is set in advance. Solder for calculating a correction feed amount that matches the set feed amount and the measured feed amount by comparing the set feed amount of the wire solder and the actually measured feed amount of the wire solder input from the input unit. A control method for a feeder,
a set feed amount input step of inputting the set feed amount from the input unit to the control unit;
a preliminary feeding step of feeding the wire solder from the wire solder feeding means based on the set feeding amount;
a measured feed amount input step of inputting the measured feed amount from the input unit to the control unit;
a correction coefficient calculation step in which the control unit calculates a correction coefficient from the set feed amount and the measured feed amount;
a feed control step in which the control unit controls the wire solder feed amount of the wire solder feed means based on the corrected feed amount obtained by multiplying the set feed amount by the correction coefficient;
A control method for a solder feeder, comprising:

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