JP7138967B2 - Endoscope camera device - Google Patents

Description

The present invention relates to an endoscope camera device and an endoscope camera system. More specifically, it relates to an 8K level endoscope camera device and endoscope camera system with a cooling function.

The inventors of the present application developed an 8K endoscope camera (Non-Patent Document 1), and further developed an ultra-compact, ultra-lightweight 8K endoscope device (Japanese Patent Application No. 2016-123049) (unpublished). Such ultra-miniaturization and ultra-lightweight simplifies the operation of the endoscopic device, and by combining it with a high-resolution large-screen monitor, the reliability and certainty of endoscopic surgery has increased dramatically. .

JP-A-04-241830 JP-A-04-102435

Hiromasa Yamashita, "Application of 8K TV Technology to Endoscopic Surgery," 2015 1st Photonics Technology Trends Research Committee, (published May 25, 2015)

An 8K endoscope camera is provided with an ultra-compact, airtight camera tube housing so as not to release exhaust gas into the operating space, and an 8K solid-state image pickup device is provided inside it. At 8K, the amount of heat generated increases due to an increase in the number of imaging elements and signal processing circuit elements. Therefore, it is necessary to increase the cooling capacity of the cooling mechanism. On the other hand, in the operating space, in order to secure the degree of freedom in operability of the endoscope camera, lightening and downsizing are required. In a miniaturized 8K endoscope camera, the internal space of the housing is small, so the cooling mechanism in the housing needs to be as lightweight and compact as possible without a rotating mechanism or a Peltier element. . The invention of the present application has earnestly considered means for solving such problems.

Non-Patent Document 1 describes an example of surgery using an 8K endoscope device by the inventors. Patent Documents 1 and 2 describe an example in which a Peltier element is provided to cool a solid-state imaging device provided in a camera head portion of an endoscope camera device, although there is no rotation mechanism such as a fan. However, if a Peltier element is used as a cooling mechanism, a power source for the Peltier element is required, and cannot be accommodated in the housing of an 8K ultra-compact, airtight imaging device.

In addition, in conventional endoscope camera devices of 4K or less, only the solid-state imaging device is cooled, and cooling of circuit elements for signal processing such as FPGA (Field Programmable Gate Array), power supply IC, etc. is not considered. However, in 8K, the amount of heat generated by the FPGA for signal processing may be greater than the amount of heat generated by the solid-state imaging device. Therefore, it is necessary to consider not only the heat generated by the solid-state imaging device but also the heat generated by the circuit elements for signal processing.

An object of the present invention is to provide an endoscope camera device and an endoscope camera system having a cooling mechanism suitable for an 8K endoscope camera that has a very small sealed space and generates a large amount of heat.
Another object of the present invention is to provide an endoscope camera device and an endoscope camera system having a cooling mechanism that does not include a rotation mechanism and a Peltier element.

The endoscope camera device 100 according to the present invention includes, for example, as shown in FIGS. 1 and 2, an endoscope 110; An air supply pipe 164A and an air discharge pipe 164B; an air supply/exhaust pipe that forcibly supplies air into the housing 131 via the air supply pipe 164A and forcibly exhausts air from the housing 131 via the air discharge pipe 164B. an air cooling device 162 for cooling the air flowing through the air supply pipe 164A;
The housing 131, the air supply pipe 164A and the air discharge pipe 164B are connected to form one sealed space,
The imaging device 130 includes a solid-state imaging device 1311 provided at an end of a housing 131, a first heat sink 1316 provided in the solid-state imaging device 1311, and an FPGA 1331 for signal processing provided within the housing 131. , a second heat sink provided on the FPGA 1331, and a cover member 1338 that covers the second heat sink 1336 and is connected to the air discharge pipe 164B,
A first air flow for cooling the first heat sink 1316 and a second air flow for cooling the second heat sink 1336 are generated within the housing 131, the first air flow being supplied from the air supply pipe 164A. The cooled air is directed against the first heat sink 1316 and is configured to pass between the fins 1316B (see FIG. 3A) of the first heat sink 1316 and diverge around the first heat sink 1316 to generate a second air. The flow is configured to flow from the periphery of the second heat sink 1336, through the fins 1336B (see FIG. 3A) of the second heat sink 1336, through the cover member 1338, and to the air exhaust tube 164B. good. With this configuration, it is possible to provide an endoscope camera device and an endoscope camera system having a cooling mechanism suitable for an 8K endoscope camera that has a very small sealed space and generates a large amount of heat.

In the endoscope camera device 100 according to the present invention,
The solid-state imaging device 1311 may be composed of a CMOS image sensor having 7680×4320 pixels, and the power consumption of the FPGA 1331 may be greater than that of the solid-state imaging device 1311 .

In the endoscope camera device 100 according to the present invention, for example, as shown in FIG. 4A,
The air cooling device 162 may have a heat radiating pipe 1621 provided in a portion of the air supply pipe 164A and a heat sink 1623 attached to the outer surface of the heat radiating pipe 1621 .

In the endoscope camera device 100 according to the present invention, for example, as shown in FIG. 4B,
The air cooling device 162 may have a heat dissipation pipe 1621 provided in a portion of the air supply pipe 164A and a Peltier element 1627 attached to the outer surface of the heat dissipation pipe 1621 .

In the endoscope camera device 100 according to the present invention, for example, as shown in FIG. 4C,
The air cooling device 162 has a heat radiating pipe 1621 provided in a part of the air supply pipe 164A, a thin tube 1629 provided inside the heat radiating pipe 1621, and a refrigerant flowing in the thin tube 1629. may be arranged outside the heat sink tube 1621 .

In the endoscope camera device 100 according to the present invention, for example, as shown in FIG.
A duct 166 A may be provided within the housing 131 , one end of the duct 166 A may be connected to the air supply pipe 164 A, and the other end of the duct 166 A may face the first heat sink 1316 .

In the endoscope camera device 100 according to the present invention, for example, as shown in FIGS. 2 and 3B,
The cover member 1338 has a lid-shaped portion 1338A having a shape corresponding to the outer shape of the second heat sink 1336, and a duct portion 1338B connected to the air discharge pipe 164B. It may be assumed that it has an opening in the center.

In the endoscope camera device 100 according to the present invention,
The air supply/exhaust device 160 may be configured by a pump device (not shown) that combines a vacuum pump that generates a vacuum pressure of -5 to -20 kPa and a compressor that generates an air pressure of +5 to +20 kPa.

Endoscopic camera apparatus 100 according to the present invention may not have a rotating mechanism or Peltier element within housing 131 .

The endoscopic camera device 100 according to the present invention may not have a rotating mechanism or Peltier element within the housing 131, as shown for example in FIG. With this configuration, it is possible to provide an endoscope camera device having a compact and lightweight cooling mechanism.

In an endoscope camera system comprising: an endoscope 110 according to the present invention; an imaging device 130 having a housing 131 forming a closed space; a control device 140; to the
Furthermore, an air supply pipe 164A and an air discharge pipe 164B connected to the housing 131; supply air into the housing 131 via the air supply pipe 164A and inside the housing 131 via the air discharge pipe 164B; an air supply/exhaust device 160 for exhausting air from; an air cooling device 162 for cooling the air flowing through the air supply pipe 164A;
The housing 131, the air supply pipe 164A and the air discharge pipe 164B are connected to form one sealed space,
The air supply/exhaust device 160 may be configured by a pump device (not shown) that combines a vacuum pump that generates a vacuum pressure of -5 to -20 kPa and a compressor that generates an air pressure of +5 to +20 kPa.

In the endoscope camera system according to the present invention, for example, as shown in FIG.
The imaging device 130 includes a solid-state imaging device 1311 provided at an end of a housing 131, a first heat sink 1316 provided in the solid-state imaging device 1311, and an FPGA 1331 for signal processing provided within the housing 131. , a second heat sink 1336 provided on the FPGA 1331, and a cover member 1338 that covers the second heat sink 1336 and is connected to the air discharge pipe 164B,
A first air flow for cooling the first heat sink 1316 and a second air flow for cooling the second heat sink 1336 are generated within the housing 131, the first air flow being supplied from the air supply pipe 164A. The cooled air is directed against the first heat sink 1316 and is configured to pass between the fins 1316B (see FIG. 3A) of the first heat sink 1316 and diverge around the first heat sink 1316 to generate a second air. The flow is configured to flow from the periphery of the second heat sink 1336, through the fins 1316B (see FIG. 3A) of the second heat sink 1336, through the cover member 1338, and to the air exhaust tube 164B. good.

According to the present invention, in an endoscopic camera system,
The solid-state imaging device 1311 may be composed of a CMOS image sensor having 7680×4320 pixels, and the power consumption of the FPGA 1331 may be greater than that of the solid-state imaging device 1311 .

According to the present invention, it is possible to provide an endoscope camera device and an endoscope camera system having a cooling mechanism suitable for an 8K endoscope camera that has a very small sealed space and generates a large amount of heat.
Also, it is possible to provide an endoscope camera device and an endoscope camera system having a cooling mechanism that does not include a rotation mechanism and a Peltier element.

1 is a schematic diagram showing an example of the overall configuration of an endoscope camera device and an endoscope camera system according to the present invention; FIG. FIG. 4 is an explanatory diagram illustrating the flow of cooling air in the endoscope camera device according to the present invention; It is a figure for demonstrating the cooling mechanism of the solid-state image sensor of the endoscope camera apparatus which concerns on this invention. It is a figure for demonstrating the example of the cooling mechanism of FPGA of the endoscope camera apparatus which concerns on this invention. 1 is a diagram for explaining a first example of an air cooling device for an endoscope camera device according to the present invention; FIG. FIG. 5 is a diagram for explaining a second example of an air cooling device for an endoscope camera device according to the present invention; FIG. 10 is a diagram for explaining a third example of the air cooling device for the endoscope camera device according to the present invention; It is a schematic diagram which shows the example of a structure of the control apparatus of the endoscope camera apparatus which concerns on this invention. FIG. 10 is a diagram for explaining the results of temperature measurement of a CMOS image sensor when no cooling air supply mechanism is provided; FIG. 10 is a diagram for explaining the results of temperature measurement of a CMOS image sensor when no cooling air supply mechanism is provided; FIG. 5 is a diagram for explaining temperature measurement results of an FPGA, a bias power supply, and a CMOS image sensor when a cooling air supply mechanism is provided in the endoscope camera device according to the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same or similar reference numerals are given to the same or corresponding members in each drawing, and redundant description is omitted.

An example of an endoscope camera device and an endoscope camera system according to the present invention will be described with reference to FIG. The endoscope camera system of this example has an 8K endoscope camera device 100 and a display device 150 . 8K means a super high-definition video system, which provides an image of 7680 (8K) horizontal pixels and 4320 vertical lines. The number of pixels in one frame is approximately 33 million pixels (33 megapixels). On the other hand, a conventional high-definition system provides an image of horizontal 1920 (2K) pixels and vertical 1080 lines. Therefore, the number of pixels in one frame is approximately 2 million pixels (2 megapixels). In the case of Super Hi-Vision, 16 times as many pixel data (per frame) as in conventional Hi-Vision are processed at high speed in parallel. Furthermore, Super Hi-Vision processes pixel data at a frame rate of 60 to 120 frames per second (fps).

In general, a device of about 6K may be displayed or referred to as an 8K level or 8K equivalent. Therefore, in this specification, 8K means 6K or more and 12K or less.

The endoscope camera device 100 includes an endoscope 110, a lens mount 116 having an imaging lens 114, an illumination device 120, an imaging device 130, a control device 140, an air supply/exhaust device 160, and an air cooling device. 162. The air supply/exhaust device 160 is connected to the imaging device 130 via an air supply pipe 164A and an air discharge pipe 164B. An air cooling device 162 is provided in the air supply pipe 164A. The display device 150 displays frame images of 8K level or higher. By using a large screen monitor of, for example, 30 inches or more as the display device 150, many people can observe a natural image at the same time.

Details of the imaging device 130, the control device 140, the ventilation device 160 and the air cooling device 162 are described in detail below. Here, as an example of the endoscope 110, a rigid endoscope having a rigid insertion section 111 will be described as an example, but a flexible endoscope having a flexible insertion section may be used.

Illumination device 120 includes a suitable light source, such as a xenon lamp or LED (Light Emitting
Diode). An optical fiber 121 is connected to the illumination device 120 . The optical fiber 121 is connected to a connection portion 112 provided on the endoscope 110 and extends along the outer surface of the rigid insertion portion 111 to the distal end portion 110A. Light from illumination device 120 is guided to distal end portion 110A of endoscope 110 via optical fiber 121 . The illumination light emitted from the tip portion 110A irradiates the object to be imaged.

An inner end 110B, or eyepiece, of endoscope 110 is mounted in lens mount 116 . The lens mount 116 is attached to the mount section 130A of the imaging device 130 .

The configuration, cooling function, and flow of cooling air of the endoscope camera device 100 of this example will be described with reference to FIG. In this example, the imaging device 130 generates an image with a high resolution of 8K level or higher, that is, an image with excellent spatial resolution. The imaging device 130 has a housing 131 . A lens mount 116 having an imaging lens 114 is attached to the front end of the housing 131 . A solid-state imaging device 1311 is provided behind the imaging lens 114 . An antireflection glass 1315 is attached to the front surface of the solid-state imaging device 1311 . A solid-state imaging device 1311 is mounted on a substrate 1312 . A first heat sink 1316 is attached to the back surface of the solid-state imaging device 1311 . As the solid-state imaging device 1311, a CMOS (complementary metal oxide semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor can be used. In this example, a CMOS image sensor is used as the solid-state imaging device 1311 .

Behind the first heat sink 1316 is a duct 166A. The outlet of the duct 166A faces the first heat sink 1316, and the inlet of the duct 166A is connected to the air supply pipe 164A. Arrows in duct 166A and air supply tube 164A indicate the direction of airflow.

At the bottom of the closed space inside the housing 131, there is a field programmable FPGA (FPGA) for signal processing.
Gate Array) 1331 is provided. FPGA 1331 is mounted on substrate 1332 . A second heat sink 1336 is attached to the surface of the FPGA 1331 .

A cover member 1338 is provided above the second heat sink 1336 . The outlet of cover member 1338 is connected to duct 166B. The opposite end of duct 166B is connected to air exhaust tube 164B. Arrows in duct 166B and air discharge tube 164B indicate the direction of airflow. The air discharge pipe 164B may be directly connected to the outlet of the cover member 1338 without providing the duct 166B.

In the sealed space inside the housing 131, various electronic components and electronic elements are arranged in addition to the solid-state imaging device 1311 and the FPGA 1331. FIG. For example, a bias power supply (solid-state imaging device power supply board) and an FPGA power supply board are arranged in the upper part of the inside of the housing 131 . An optical module for optical transmission is arranged adjacent to the FPGA 1331 near the exit at the bottom inside the housing 131 . In this example, signal transmission between the imaging device 130 and the control device 140 is performed using optical transmission. These substrates and optical modules are connected to each other by flexible cables. The FPGA 1331 converts the raw data (voltage value for each pixel by photoelectric conversion) obtained from the solid-state imaging device 1311 into a digital signal for imaging. The optical module converts electrical signals into optical signals for transmission of 24 Gbps high-capacity signals from the camera to a camera control unit (CCU). The cable that connects the camera and the CCU is more than 3 meters long, but if you try to send such a high-capacity signal at ultra-high speed with a metal electric cable, it will be attenuated on the way and it won't reach you. Therefore, it is converted into an optical signal and transmitted through an optical fiber.

In the endoscope camera device of this example, the power consumption of the FPGA 1331 is larger than the power consumption of the solid-state imaging device 1311 . Therefore, the amount of heat generated by the FPGA 1331 is greater than the amount of heat generated by the solid-state imaging device 1311 . In the endoscope camera device of this example, the sum of the power consumption of the FPGA and the FPGA power supply is 10-15W, and the sum of the power consumption of the CMOS image sensor and the bias power supply is 4-9W. In the example of the endoscope camera device manufactured by the inventor of the present application, the sum of the power consumption of the FPGA and FPGA power supply was about 11.5W. The total power consumption of the CMOS image sensor and bias power supply was about 5.5W.

In the endoscope camera device of this example, an air supply/exhaust device 160 and an air cooling device 162 are provided separately from the imaging device 130 . The housing 131 of the imaging device 130 and the air supply/exhaust device 160 are connected by an air supply pipe 164A and an air discharge pipe 164B. The air cooling device 162 is provided on the air supply pipe 164A. The air supply pipe 164A and the air discharge pipe 164B may be made of silicone resin.

The air supply/exhaust device 160 may be any device as long as it has a function of forcibly supplying air and a function of forcibly exhausting or sucking air. For example, a single device that performs forced exhaust and forced suction at the same time may be used, or a combination of an air supply device and an air discharge device may be used. In this example, the air supply/exhaust device 160 is of a type in which an air supply device 160A and an air discharge device 160B are combined. The air supply device 160A includes an air pump, an air blower, an air fan, and the like. The air discharge device 160B includes a vacuum pump or the like. The inventors of the present application used a type of compressor and vacuum pump. An air supply pipe 164A is connected to the air supply device 160A. An air discharge pipe 164B is connected to the air discharge device 160B.

According to this embodiment, the air pressure generated by the air supply/exhaust device 160, ie, the air supply device 160A, is +5 to +20 kPa, preferably +10 to +20 kPa. The vacuum pressure generated by the air exhaust device 160, ie, the air exhaust device 160B, is -5 to -20 kPa, preferably -10 to -20 kPa.

The sealing structure of the endoscope camera device of this example will be described. According to this embodiment, the housing 131 of the imaging device 130, the air supply pipe 164A, and the air discharge pipe 164B each have a sealed structure and are connected to each other by a sealed structure. Therefore, one sealed space is formed by the housing 131 of the imaging device 130, the air supply pipe 164A, and the air discharge pipe 164B. The air pressure and vacuum pressure from the air supply/exhaust device 160 are supplied to the closed space of the housing 131 with little change by the air supply pipe 164A, the duct 166B and the air discharge pipe 164B.

The air flow inside the housing 131 will be described. Hereinafter, for convenience of explanation, the airflow that cools the first heat sink 1316 is referred to as the first airflow, and the airflow that cools the second heatsink 1336 is referred to as the second airflow. First, the first airflow will be described. Airflow generated by air supply 160 is cooled by air cooler 162 as it passes through air supply tube 164A. Cooling air is directed into duct 166A via air supply tube 164A. Cooling air is radiated from duct 166 A to first heat sink 1316 . As mentioned above, the pressure of the cooling air discharged from duct 166A is relatively high. Cooling air passes between the fins 1316 B of the first heat sink 1316 and exits the sides of the first heat sink 1316 . This air circulates within the closed space within the housing 131 .

Next, the second airflow will be described. The upper end of cover member 1338 is connected to air discharge pipe 164B via duct 166B. As described above, the air exhaust tube 164B draws with a relatively high degree of vacuum. Accordingly, the space below cover member 1338 is at relatively low pressure. On the other hand, the space on the side of the second heat sink 1336 is relatively high pressure. Therefore, air flows from the space on the side surface of the second heat sink 1336 to the space below the cover member 1338 . The airflow collected by the cover member 1338 is led through the air exhaust pipe 164B to the air supply/exhaust device 160, that is, the air exhaust device 160B, and is discharged to the outside air therefrom.

In the endoscope camera device of this example, the cooling mechanism provided in the sealed space inside the housing 131 of the imaging device 130 consists only of two heat sinks 1316 and 1336, a cover member 1338, and two ducts 166A and 166B. Yes, it can be made smaller. Furthermore, the cooling mechanism of this example has neither a rotating mechanism nor a movable mechanism in the closed space inside the housing 131 . Therefore, the imaging device 130 can be freely used in the surgical space.

The first heat sink 1316 provided in the solid-state imaging device 1311 will be described in detail with reference to FIG. 3A. An antireflection glass 1315 is attached to the front surface of the solid-state imaging device 1311 . A solid-state imaging device 1311 is mounted on a substrate 1312 . Terminals of the solid-state imaging device 1311 and terminals of the substrate 1312 are electrically connected by a ball grid 1313 . A first heat sink 1316 is attached to the rear surface of the solid-state imaging device 1311 via a thermally conductive adhesive 1314 . A first heat sink 1316 has a flat plate 1316A and a plurality of fins 1316B. The flat plate 1316A may be square, for example, but may also be rectangular. The shape of the fins 1316B may be a thin plate, a corrugated plate, a flat plate with holes, a needle shape, etc. Here, the needle shape is used.

A first air flow is described. The cooling air supplied from the duct 166A is blown parallel to the fins 1316B of the first heat sink 1316, hits the flat plate 1316A, changes course, and travels in a direction orthogonal to the fins 1316B, as indicated by the arrows. . That is, the cooling air diverges around the fins 1316B. As the cooling air passes through the first heat sink 1316 , it draws heat from the first heat sink 1316 . The solid-state imaging device 1311 is in contact with the flat plate 1316A of the first heat sink 1316. As shown in FIG. Therefore, the heat generated by the solid-state imaging device 1311 is radiated to the outside air via the first heat sink 1316 . Therefore, the temperature of the solid-state imaging device 1311 is prevented from rising.

The second heat sink 1336 provided on the FPGA 1331 will be described in detail with reference to FIG. 3B. FPGA 1331 is mounted on substrate 1332 . FPGA 1331 and substrate 1332 are electrically connected by ball grid 1333 . A second heat sink 1336 is attached to the upper surface of the FPGA 1331 via a thermally conductive adhesive 1334 . A second heat sink 1336 has a flat plate 1336A and a plurality of fins 1336B. As the shape of the fin 1336B, a thin plate shape, a needle shape, or the like is known, but here, the shape is assumed to be a needle shape.

A cover member 1338 is provided to cover the fins 1336B. The cover member 1338 has a lid portion 1338A and a duct portion 1338B. The lid-like portion 1338A is formed to cover the upper ends of the fins 1336B. The lid portion 1338A is in the form of a box lid having a shape corresponding to the outer shape of the second heat sink 1336 and the flat plate 1336A. In this example, FPGA 1331 is square and plate 1336A of second heat sink 1336 is square. Accordingly, the lid portion 1338A has the shape of a square box lid. Duct portion 1338B has the shape of a bent pipe with a circular cross section. An entrance of the duct portion 1338B is opened at the center of the lid-like portion 1338A.

A second air flow is described. The duct portion 1338B of the cover member 1338 is connected to the air discharge pipe 164B. Therefore, the space below cover member 1338 has a relatively low pressure. On the other hand, the area around the second heat sink 1336 is at a relatively high pressure. Therefore, air flows from the periphery of the second heat sink 1336 toward the cover member 1338 through the fins 1336B of the second heat sink 1336 . FPGA 1331 is in contact with plate 1336 A of second heat sink 1336 . Therefore, heat generated by the FPGA 1331 is dissipated into the airflow through the second heat sink 1336 . Therefore, the FPGA 1331 is prevented from becoming hot.

A first example of the air cooling device 162 is described with reference to FIG. 4A. As illustrated, a heat sink tube 1621 is provided in a portion of the air supply tube 164A. Both ends of the heat radiating tube 1621 are fitted to the ends of the air supply tube 164A. The air supply pipe 164A may be made of silicone resin. The radiator tube 1621 is made of a metal with high thermal conductivity such as iron or copper, but may be made of a material other than metal as long as it has a high thermal conductivity. The outer diameter of the heat radiating tube 1621 is slightly larger than the inner diameter of the air supply tube 164A. The ends of the air supply pipe 164A are elastically deformed to cover both ends of the heat dissipation pipe 1621 . In this embodiment, even if the air cooling device 162 is provided, the sealed structure of the air supply pipe 164A is maintained.

The air cooling device 162 of this example has a heat sink 1623 attached to the outer surface of the heat radiation tube 1621 and an air cooling fan 1625 provided further outside thereof. Since the heat sink 1623 is exposed to the external space, it does not become hot. In particular, the heat sink 1623 is cooled by the air cooling fan 1625 . Since the heat sink 1623 absorbs heat from the heat sink 1621, the temperature of the heat sink 1621 is always maintained at a low temperature. The air moving inside the air supply pipe 164A contacts the inner surface of the heat radiating pipe 1621 while passing through the heat radiating pipe 1621 . The air is thereby cooled. In this example, the air cooling fan 1625 is provided, but the air cooling fan 1625 may be omitted.

A second example of the air cooling device 162 is described with reference to FIG. 4B. As in the example of FIG. 4A, a heat sink tube 1621 is provided in a portion of the air supply tube 164A. The air cooling device 162 of this example has a Peltier element 1627 . The Peltier element 1627 has a heat absorption portion and a heat dissipation portion. The heat absorbing portion of the Peltier element 1627 is attached to the outer surface of the heat radiating tube 1621, and the heat radiating portion of the Peltier element 1627 is exposed to the external space. Since the heat radiation tube 1621 is deprived of heat by the Peltier element 1627, the temperature of the radiation tube 1621 is always maintained at a low temperature without being elevated. The air moving inside the air supply pipe 164A contacts the inner surface of the heat radiating pipe 1621 while passing through the heat radiating pipe 1621 . The air is thereby cooled.

A third example of the air cooling device 162 is described with reference to FIG. 4C. A heat sink tube 1621 is provided in a portion of the air supply tube 164A as in the example of FIG. 4A. The air cooler 162 in this example has capillaries 1629 . The narrow tube 1629 extends in a meandering manner inside the heat radiating tube 1621 , and both ends of the thin tube 1629 are arranged outside the heat radiating tube 1621 . Refrigerant flows in the narrow tube 1629 . Cold water may be used as the coolant, but liquid nitrogen or liquid air may also be used. The air moving inside the air supply pipe 164A contacts the outer surface of the thin tube 1629 while passing through the heat dissipation tube 1621 . The air is thereby cooled.

As examples of the air cooling device 162, the heat sink 1623, the air cooling fan 1625, the Peltier element 1627, and the thin tube 1629 through which the coolant flows have been described with reference to FIGS. 4A to 4C. These air cooling device 162 examples can be used in combination as appropriate. For example, the example of FIG. 4A and the example of FIG. 4B or the example of FIG. 4C may be combined, or the example of FIG. 4B and the example of FIG. 4C may be combined.

The configuration of the control device 140 will be described with reference to FIG. The control device 140 is called a camera control unit (CCU), converts an imaging signal (brightness data) from the imaging device 130 into a video signal (frame data), and transmits the video signal (frame data) to the display device 150 . The control device 140 has a control section 141 , an image processing section 142 , a storage section 143 , an input/output IF 144 and an input device 145 . The control unit 141 controls the entire endoscope camera device and each unit. The control unit 141 sequentially receives the image data transmitted from the imaging device 130 and sequentially stores the image data in the storage unit 143 . The image processing unit 142 processes the image data stored in the storage unit 143, such as enlargement/reduction (magnification adjustment), noise removal, sharpening, and image conversion. Digital zoom is used to adjust the magnification of frame data.

The storage unit 143 stores an operation program of the control unit 141, an operation program of the image processing unit 142, image data received from the imaging device 130, frame data reproduced by the image processing unit 142, processed frame data, and the like.

The miniaturization of the endoscope camera device of this example will be described. In the endoscope camera device of this example, the elements provided in the conventional camera body are transferred to the control device 140 as much as possible, and the lighting device 120 is provided outside the imaging device 130 . Furthermore, a cooling fan and the like are removed from the imaging device 130 . Therefore, structural weight reduction of the imaging device 130 is realized. Further, the weight of the housing 131 of the camera body can be reduced by using light metal such as aluminum alloy, fiber reinforced plastic (FRP), carbon fiber and the like.

6A and 6B show the results of experiments conducted by the inventors of the present application. In this experiment, the temperature of the CMOS image sensor was measured without providing the cooling air supply mechanism. The cover member 1338 and the two ducts 166A and 166B are removed from the housing 131. FIG. The ambient temperature was 26°C. Turn on the power and start measuring. As shown in FIG. 6A, the temperature reached 90° C. after 8 minutes and 13 seconds (493 seconds) from the start of measurement. As shown in FIG. 6B, the temperature exceeded 110° C. after 20 minutes from the start of measurement.

FIG. 7 shows the results of experiments conducted by the inventors of the present application. In this experiment, an endoscope camera device provided with a cooling air supply mechanism according to the present invention was used. The sum of the power consumption of the FPGA and the power consumption of the FPGA power supply was about 11.5W. The sum of the power consumption of the CMOS image sensor and the power consumption of the bias power supply was about 5.5W. The power consumption of the optical module was about 2.5W. A combined vacuum pump and compressor pump was used as the air supply/exhaust device 160 . The suction flow rate of this pump was about 32 L/M (maximum suction pressure = -80 kPa).

First, the air pump was turned on, then the camera power was turned on, and temperature measurement of the FPGA, bias power supply, and CMOS image sensor was started. The temperature of the outside air was 26°C. The camera was switched off 33 minutes after the start of measurement. Of the three curves in FIG. 7, the uppermost one-dot chain line curve is the temperature of the FPGA, the lower dashed line curve is the temperature of the bias power supply, and the lowermost solid line curve is the temperature of the CMOS image sensor.

After starting the measurement, the temperature of the FPGA was about 52°C, the temperature of the bias power supply was 38°C, and the temperature of the CMOS image sensor was 32°C. That is, the temperature of the FPGA is higher than the temperature of the CMOS image sensor. Thirty minutes after the start of measurement, the temperature of the FPGA was 63°C, the temperature of the bias power supply was 59°C, and the temperature of the CMOS image sensor was 48°C. The FPGA temperature is 37° C. higher than the ambient temperature. However, at this temperature, the functional degradation of the FPGA does not occur.

Comparing the graphs of FIGS. 6A and 6B with the graph of FIG. 7 shows that the temperature of the CMOS image sensor can be significantly lowered by providing the cooling air supply mechanism of this example. Therefore, by providing the cooling air supply mechanism of this example, it can be said that the temperature of not only the CMOS image sensor but also the FPGA and the bias power supply can be lowered.

As described above, according to the embodiments of the present invention, an endoscope camera device and an endoscope camera system having a cooling mechanism suitable for an 8K endoscope camera that has a very small sealed space and generates a large amount of heat are provided. be able to. Also, it is possible to provide an endoscope camera device and an endoscope camera system having a cooling mechanism that does not include a rotation mechanism and a Peltier element.

Although the present embodiment has been described above, the present invention is not limited to the above embodiment, and it is obvious that various modifications can be made to the embodiment without departing from the scope of the present invention. be.

For example, the shape of the housing is not limited to the example in FIG. The installation position of the FPGA in the housing is not limited to the example shown in FIG. For example, if it is possible to distribute the FPGAs, a cover member may be arranged for each FPGA. Additionally, the FPGA may be installed vertically on the bottom surface of the housing. Also, the arrangement of the ducts can be changed as appropriate.

INDUSTRIAL APPLICABILITY The present invention can be used for endoscope cameras.

DESCRIPTION OF SYMBOLS 100... Endoscope camera apparatus, 110... Endoscope, 110A... Tip part, 110B... Inner end part, 111... Hard insertion part, 112... Connection part, 114... Imaging lens, 116... Lens mount, 120... Illumination Apparatus 121 Optical fiber 130 Imaging device 130A Mount unit 131 Housing 140 Control device 141 Control unit 142 Image processing unit 143 Storage unit 150 Display device 160 Supply Exhaust device 160A Air supply device 160B Air exhaust device 162 Air cooling device 164A Air supply pipe 164B Air exhaust pipe 166A, 166B Duct 1311 Solid-state imaging device 1312 Substrate 1313 Ball grid 1314 Thermally conductive adhesive 1315 Antireflection glass 1316 Heat sink 1316A Flat plate 1316B Fin 1621 Radiator tube 1623 Heat sink 1625 Cooling fan 1627 Peltier element 1629 1331: FPGA 1332: Substrate 1333: Ball grid 1334: Thermally conductive adhesive 1336: Heat sink 1336A: Flat plate 1336B: Fin 1338: Cover member 1338A: Lid-shaped part 1338B: Duct Department

Claims (9)

an endoscope; a camera body having a housing that forms an enclosed space; an air supply pipe and an air discharge pipe connected to the housing; and forcibly supplying air into the housing via the air supply pipe and an air supply/exhaust device that forcibly exhausts air from the housing via the air discharge pipe; and an air cooling device that cools the air flowing through the air supply pipe;
the housing, the air supply pipe and the air discharge pipe are connected to form one sealed space;
The camera body includes an 8K-level solid-state imaging device provided at the end of the housing, a first heat sink provided in the solid-state imaging device, and a signal processing FPGA provided in the housing. , a second heat sink provided on the FPGA, and a cover member covering the second heat sink and connected to the air exhaust pipe,
A first air flow for cooling the first heat sink and a second air flow for cooling the second heat sink are generated within the housing, the first air flow being supplied from the air supply pipe. cooled air is directed against the first heat sink and is configured to pass between the fins of the first heat sink and diverge around the first heat sink; from the periphery of the second heat sink, through the fins of the second heat sink, through the cover member, and to the air discharge pipe;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The solid-state imaging device is composed of a CMOS image sensor having 7680 × 4320 pixels, and the power consumption of the FPGA is greater than the power consumption of the solid-state imaging device;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The air cooling device is characterized in that it has a heat radiating pipe provided in a part of the air supply pipe and a heat sink attached to the outer surface of the heat radiating pipe;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The air cooling device is characterized by having a heat radiating pipe provided in a part of the air supply pipe and a Peltier element mounted on the outer surface of the heat radiating pipe;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The air cooling device has a heat radiating pipe provided in a part of the air supply pipe, a thin tube provided inside the heat radiating tube, and a refrigerant flowing in the thin tube, and both ends of the thin tube are characterized in that it is arranged outside the heat sink;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
A duct is provided in the housing, one end of the duct is connected to the air supply pipe, and the other end of the duct is directed to the first heat sink;
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The cover member has a lid-shaped portion having a shape corresponding to the outer shape of the second heat sink, and a duct portion connected to the air discharge pipe, and the duct portion opens at the center of the lid-shaped portion. characterized in that
Endoscope camera device. The endoscope camera device according to claim 1, wherein
The air supply/exhaust device is characterized by being constituted by a pumping device that combines a vacuum pump that generates a vacuum pressure of -5 to -20 kPa and a compressor that generates an air pressure of +5 to +20 kPa;
Endoscope camera device. 2. The endoscopic camera device according to claim 1, wherein said housing does not have a rotating mechanism or a Peltier element;
Endoscope camera device.

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