JP7134122B2 - Wood board manufacturing method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for manufacturing a wooden board containing a latent heat storage material.

This type of wooden board is produced by mixing a wooden material, an adhesive for bonding the wooden materials together, and heat storage particles containing a latent heat storage material to prepare a mixture, and hot-pressing the prepared mixture into a board shape. , is manufactured.

For example, in Patent Document 1, a mixture obtained by mixing microcapsules containing a latent heat storage material, wood pieces, and an adhesive as heat storage particles is heat-pressed at a temperature higher than the phase change temperature of the latent heat storage material. A wooden board is manufactured by molding.

Japanese Patent Application Laid-Open No. 2003-260705

However, as shown in Patent Document 1, even if the latent heat storage material is enclosed in the microcapsules, the latent heat storage material leaks because the microcapsules are pressurized in a state where the latent heat storage material is melted by the heat during thermocompression molding. It could come out and evaporate. In view of these points, it may be possible to shorten the heat-pressing time, but in this case, there is a risk of adhesion failure of the adhesive.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and its object is to provide a wooden board that can suppress leakage of the latent heat storage material without causing adhesion failure due to adhesive during thermocompression molding. It is to provide a manufacturing method of

In view of the above problems, a method for manufacturing a wooden board according to a first aspect of the present invention provides a mixture obtained by mixing a granular wooden material, an adhesive that bonds at least the wooden materials together, and heat storage particles containing a latent heat storage material. On the other hand, in a manufacturing method for manufacturing a wooden board by hot-pressing into a board shape, the mixture has a boiling point higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material. A mixture is prepared by mixing the heat storage particles, the wooden material, and the adhesive with the treatment liquid having a boiling point lower than the heating temperature for thermocompression molding into a board shape. and forming the mixture into a board while evaporating the treatment liquid during the thermocompression molding.

According to the first invention, a mixture in which the wood material, the adhesive, and the heat storage particles are mixed and the treatment liquid adheres to the surfaces of the heat storage particles is prepared. This processing liquid is a processing liquid that acts during the thermocompression molding process, has a boiling point that is higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material, and is used for thermocompression molding into a board shape. The processing liquid has a boiling point lower than the temperature.

By attaching such a treatment liquid to the heat storage particles, the treatment liquid reaches a boiling point and evaporates when the mixture is thermocompressed into a board. On the other hand, when the processing liquid reaches the boiling point, the latent heat storage material contained in the heat storage particles is in a molten state (liquefied state). latent heat), the temperature rise of the latent heat storage material can be suppressed. As a result, even if the latent heat particles are further heated during thermocompression molding, it is possible to suppress the evaporation of a part of the latent heat storage material in a liquefied state.

The configuration of the heat storage particles is not particularly limited as long as the heat storage particles contain the latent heat storage material. These are particles in which capsules are dispersed in resin.

According to this aspect, the heat storage particles are obtained by dispersing the microcapsules containing the latent heat storage material in the resin. Leakage of the latent heat storage material can be suppressed.

Furthermore, as another aspect of the first invention, the heat storage particles are particles in which the latent heat storage material is attached to at least the surface of wood particles. According to this aspect, the heat storage particles in which the latent heat storage material is impregnated into the wood particles can be easily produced, and the surface of the heat storage particles can easily retain the treatment liquid. In addition, if the wood particles are applied with a holding material, which will be described later, and the holding material is wood flour, wood fiber, or paper, the holding material has good compatibility with the heat storage particles. Can be easily adhered.

In a preferred embodiment of the first invention, a wooden board in which the heat storage particles are uniformly dispersed in the wooden material is manufactured as the wood board, and the mixture is an average of the wood board excluding the heat storage particles The mixture is prepared so that the density is in the range of 200 to 380 kg/m ³ and the ratio of the mass of the heat storage particles to the mass of the woody material and the heat storage particles is in the range of 20 to 44%.

According to this aspect, the ratio of the wooden material and the heat storage particles in the mixture satisfies such a range, thereby securing a path for the steam to escape inside the wooden board where the treatment liquid has evaporated, and allowing the steam to escape inside the wooden board. is easily released to the outside. The reasons for these numerical ranges will be explained in detail in the following embodiments.

Further, as another preferable aspect of the first invention, the wooden board includes a core layer composed of the wooden material, the heat storage particles, and the adhesive, and a core layer formed on both sides of the core layer, and the wooden material and a surface layer composed of the adhesive, wherein the mixture includes a surface layer mixture of the wood material and the adhesive, the wood material, the heat storage particles, A core layer mixture containing the adhesive and the treatment liquid is prepared, and the average density of the core layer excluding the heat storage particles is in the range of 200 to 380 kg/m ³ . A mixture of the core layer is prepared so that the ratio of the mass of the heat storage particles of the core layer to the mass of the wood material and the heat storage particles of the core layer is in the range of 20 to 44%.

According to this aspect, the ratio of the wood material and the heat storage particles in the mixture that forms the core layer satisfies such a range, thereby ensuring a path through which steam generated by evaporation of the treatment liquid escapes in the core layer of the wood board. However, steam is likely to be released from the core layer of the wooden board to the outside. The reasons for these numerical ranges will be explained in detail in the following embodiments.

Here, the type and amount of the treatment liquid are not particularly limited as long as the treatment liquid can adhere to the surface of the wooden material. In a preferred embodiment of the first invention, the treatment liquid is water. and, when preparing the mixture, a mass of water equal to or greater than the total mass of the heat storage particles multiplied by the moisture content of the woody material is adhered to the surface of the heat storage particles. As used herein, "the treatment liquid is water" means that water evaporates during thermocompression molding, and this water contains additives having a high affinity for the adhesive, Alternatively, an additive or the like for adjusting the melting point may be further added.

The wood board according to the present invention is a board in which a portion of the wood material is replaced with heat storage particles in contrast to a normal wood board having no heat storage particles. Therefore, if the treatment liquid having a mass larger than the water content (mass) contained in the wood material to be replaced with the heat storage particles is adhered to the surface of the heat storage particles, the temperature rise of the latent heat storage material can be suppressed more reliably. can.

Since the density of the heat storage particles is higher than the density of the wood material, if the amount of treatment liquid equal to or greater than the total mass of the heat storage particles multiplied by the moisture content of the wood material is adhered to the surface of the wood material, A sufficient amount of processing liquid can be secured to evaporate during hot pressing. Here, the water content of the wooden material is the mass water content contained in the granular wood material. The moisture content of the wooden material can be adjusted by controlling the temperature and humidity. When the treatment liquid is attached to the surfaces of the heat storage particles, a holding material, which will be described later, may be attached to the surfaces of the heat storage particles, and water may be held in the holding material.

A method for manufacturing a wooden board according to a second aspect of the present invention provides a mixture obtained by mixing heat storage particles in which a latent heat storage material is attached to at least the surface of a granular wood material, and an adhesive that bonds the heat storage particles together, and is applied to the board. A manufacturing method for manufacturing a wooden board by hot-pressing into a shape, wherein the treatment liquid having a boiling point higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material as the mixture and a heat storage particle having a boiling point lower than the heating temperature for thermocompression molding into a board shape is prepared by mixing the heat storage particles with the treatment liquid attached to the surface, and the adhesive, and during the thermocompression molding, the The mixture is shaped into a board while evaporating the treatment liquid.

According to the second invention, a mixture in which the heat storage particles and the adhesive are mixed and the treatment liquid adheres to the surfaces of the heat storage particles is prepared. This processing liquid is a processing liquid that acts during the thermocompression molding process, has a boiling point that is higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material, and is used for thermocompression molding into a board shape. The processing liquid has a boiling point lower than the temperature.

By attaching such a treatment liquid to the heat storage particles, the treatment liquid reaches a boiling point and evaporates when the mixture is thermocompressed into a board. On the other hand, when the processing liquid reaches the boiling point, the latent heat storage material contained in the heat storage particles is in a molten state (liquefied state). latent heat), the temperature rise of the latent heat storage material can be suppressed. As a result, even if the latent heat particles are further heated during thermocompression molding, it is possible to suppress the evaporation of a part of the latent heat storage material in a liquefied state.

In a preferred embodiment of the second invention, the wood board is formed by bonding the heat storage particles together with an adhesive, and the mixture has an average density of 400 to 900 kg/m ³ . The mixture is prepared as follows.

According to this aspect, when the average density of the wooden board satisfies such a range, a path is secured in the wooden board for the steam generated by the evaporation of the treatment liquid to escape, and the steam is released from the inside of the wooden board to the outside. easy to be The reasons for these numerical ranges will be explained in detail in the following embodiments.

In a preferred embodiment of the second invention, the wooden board includes a core layer composed of the heat storage particles and the adhesive, and surface layers formed on both sides of the core layer and composed of the wooden material and the adhesive. , wherein the mixture includes a surface layer mixture of the wood material and the adhesive, the wood material, the heat storage particles, the adhesive, and the treatment liquid. A mixture of the core layers prepared above is prepared, and the mixture of the core layers is prepared so that the average density of the core layers of the wood board is in the range of 400 to 900 kg/m ³ . .

According to this aspect, since the average density of the core layer of the wooden board satisfies such a range, a path is secured in the core layer of the wooden board for the vapor generated by the evaporation of the treatment liquid to escape, and the vapor is released into the wooden board. It is easy to release from the inside of the core layer to the outside. The reasons for these numerical ranges will be explained in detail in the following embodiments.

Here, the state of the surface of the heat storage particles is not particularly limited as long as the state in which the treatment liquid is adhered to the heat storage particles can be maintained during hot compression molding. However, as a preferred aspect of the first and second inventions, a holding material for holding the treatment liquid is adhered to the surface of the heat storage particles.

According to this aspect, the treatment liquid can be retained on the surfaces of the heat storage particles by the retaining material attached to the surfaces of the heat storage particles. As a result, the heat of vaporization of the treatment liquid can more reliably suppress the temperature rise of the latent heat storage material. Further, by selecting the material of the holding material and adjusting the adhesion amount of the holding material, the amount of the treatment liquid held on the surface of the heat storage particles can be set to a desired amount. More preferably, the holding material covers the surfaces of the heat storage particles. As a result, the processing liquid evaporates uniformly from the surfaces of the heat storage particles, so that the temperature of the heat storage particles does not increase locally.

Further, the material of the holding material is not particularly limited as long as it can hold the treatment liquid. In preferred aspects of the first and second inventions, the holding material is wood flour, wood fiber, or paper. These holding materials have high holding properties for the treatment liquid and easily adhere to the wooden material. When the treatment liquid is water, the holding material may be silica gel powder.

Furthermore, the type of adhesive is not particularly limited as long as it can at least bond wood materials together. It is a resin adhesive, and the boiling point of the treatment liquid is equal to or higher than the thermosetting starting temperature of the thermosetting resin.

According to this aspect, the thermosetting of the thermosetting resin starts before the treatment liquid reaches the boiling point during thermocompression molding, so that the deterioration of the adhesiveness of the adhesive due to the evaporation of the treatment liquid can be suppressed. be able to.

Furthermore, the type of adhesive is not particularly limited as long as it can bond wood materials together, but in preferred embodiments of the first and second inventions, the adhesive is an isocyanate adhesive. and the treatment liquid is water. Since the adhesive is an isocyanate-based adhesive, it reacts with water, which is the treatment liquid, during hot-press molding, thereby accelerating curing of the adhesive. This makes it possible to enhance the adhesiveness between the wooden materials with the adhesive.

According to the method for manufacturing a heat storage board according to the present invention, it is possible to prevent the latent heat storage material from leaking out during thermocompression molding.

1 is a partially enlarged cross-sectional view for explaining a wooden board according to a first embodiment of the first invention; FIG. (a) to (d) are cross-sectional views of heat storage particles according to the first embodiment of the first invention. FIG. 2 is a partially enlarged cross-sectional view for explaining the state of the mixture before being hot-pressed into the wooden board shown in FIG. 1; FIG. 5 is a graph showing the temperature relationship between the treatment liquid, the latent heat storage material, and the adhesive according to the first embodiment of the first invention; FIG. (a) is a graph showing the temperature change of the surface of the latent heat storage material and the wooden board according to the first embodiment of the first invention, and (b) is the temperature change of the surface of the latent heat storage material and the wooden board for comparison. is a graph showing (a) to (c) are cross-sectional views of heat storage particles according to a second embodiment of the first invention. (a) is a partially enlarged cross-sectional view for explaining the state of a mixture before being hot-pressed into a wooden board according to a second embodiment of the first invention, and (b) is shown in (a). FIG. 2 is a cross-sectional view of a wooden board obtained by hot-pressing the mixture. (a) is a partially enlarged cross-sectional view for explaining the state of a mixture before being hot-pressed into a wooden board according to a third embodiment of the first invention, and (b) is shown in (a). FIG. 2 is a cross-sectional view of a wooden board obtained by hot-pressing the mixture. (a) is a partially enlarged cross-sectional view for explaining the state of the mixture before being thermocompressed into a wooden board according to the first embodiment of the second invention, and (b) is shown in (a). FIG. 2 is a cross-sectional view of a wooden board obtained by hot-pressing the mixture. (a) is a partially enlarged cross-sectional view for explaining the state of the mixture before being thermocompressed into a wooden board according to the second embodiment of the second invention, and (b) is shown in (a). FIG. 2 is a cross-sectional view of a wooden board obtained by hot-pressing the mixture. 4 is a graph showing changes in internal temperature of wooden boards according to Examples 1 and 2 and Comparative Example. 10 is a graph showing the density of wooden boards according to Examples 4 and 5. FIG.

[First embodiment of the first invention]
FIG. 1 is a partially enlarged cross-sectional view for explaining a wooden board according to a first embodiment of the first invention. After describing the wooden board 10, the manufacturing method thereof will be described below.

1. About the wooden board 10 In this embodiment, as shown in FIG. 1, the wooden board 10 includes wooden pieces 2 as a wooden material, an adhesive 3 for bonding at least the wooden pieces 2 together, and heat storage particles containing a latent heat storage material. 4 and includes. Note that the treatment liquid 5, which will be described later, is not included in the wooden board 10 because it evaporates during manufacture (during thermocompression molding).

In this embodiment, the wooden pieces 2 of the wooden board 10 are adhered to each other via the adhesive 3 , and a plurality of heat storage particles 4 are dispersed inside the wooden board 10 . The heat storage particles 4 exist inside the wooden board 10 in the form shown in FIGS. 2(a) to 2(d), which will be described later. Such a wooden board 10 can be manufactured by a series of steps shown below.

2. Method for manufacturing wooden board 10 2-1. Preparatory Step In this step, first, wood pieces 2, adhesive 3, heat storage particles 4, and a treatment liquid are used as materials constituting a mixture 10a before being hot-pressed into a board during hot-press molding. Prepare 5. The reference numerals shown here are those shown in FIG. These materials are described in detail below.

2-2. Wood Piece 2 In this embodiment, the wood piece 2 is a material that serves as a base material for the wood board 10 and includes at least one form selected from chips, flakes, wafers, and strands. In this embodiment, the wood pieces 2 are used as the wood material, but wood particles granulated from wood fibers or wood powder obtained by pulverizing wood may be used. Examples of the material for the wood piece 2 include coniferous trees such as pine, cedar, and cypress, and broadleaf trees such as lauan, kapoleon, and poplar. In the present embodiment, the wooden pieces 2 are chips obtained by crushing or cutting wood or the like with a crusher or a cutting machine into small pieces.

2-3. Adhesive 3 The adhesive 3 bonds at least the wooden pieces 2 together. When wood fiber or wood flour is used as the wood-based material instead of the wood piece 2, the adhesive at least bonds these to each other. The adhesive 3 may bond the wood piece 2 and the heat storage particles 4 together or bond the heat storage particles 4 to each other.

Although the adhesive 3 is not particularly limited, in this embodiment, the adhesive 3 is preferably a thermosetting resin adhesive. Examples of the adhesive 3 include urea resin adhesive, urea resin adhesive, melamine resin adhesive, urea/melamine cocondensation resin adhesive, and phenol resin adhesive. More preferred adhesives 3 are isocyanate adhesives such as MDI (diphenylmethane diisocyanate), TDI (tolylene diisocyanate), MDI prepolymer, TDI prepolymer, and mixtures of two or more of these.

As will be described later, the isocyanate adhesive is a moisture-curable adhesive that reacts with moisture and hardens. is promoted. Thereby, the adhesiveness between the wooden pieces 2 can be enhanced.

2-4. Regarding the heat storage particles 4 The heat storage particles 4 are particles containing a latent heat storage material. For example, as the heat storage particles 4, as shown in FIG. Particles 43 encapsulated in capsules 42 may be dispersed in granular resin base material 44 . The microcapsules 42 and the resin base material 44 may be either thermosetting resin or thermoplastic resin, and the resin is limited if the latent heat storage material 41 does not flow out of the microcapsules 42 during hot pressing. not a thing The resin base material 44 may be a thermoplastic resin that softens (softens) at a temperature equal to or lower than the heating temperature during hot pressing.

Furthermore, as the heat storage particles 4, as shown in FIG. 2(c), the heat storage particles 4 may be particles in which the latent heat storage material 41 is impregnated into the wood particles 45, which are further coated with a resin. may Examples of the wood particles 45 include granulated particles formed from wood fibers, wood pieces obtained from wood or the like, wood flour, and the like. The heat storage particles 4 are wood particles 45 impregnated with the latent heat storage material 41 exemplified in the first embodiment. A part of the attached latent heat storage material 41 may be impregnated with the wood particles 45 . For example, as shown in FIG. 2(d), granulated particles (woody particles) 46 formed from wood fibers may be impregnated with the latent heat storage material 41, and the latent heat storage material 41 may be impregnated on the surface thereof. It may be attached. In addition, the resin particles 34 may be heat storage particles in which a latent heat storage material is held in the molecular structure of the resin that constitutes the resin particles 34 . Since fine irregularities are formed on the surfaces of the wood particles 45 , the treatment liquid 5 can be easily retained.

The phase change temperature (melting point) from the liquid phase to the solid phase of the latent heat storage material 41 is preferably 18 to 25.degree. As the latent heat storage material, n-hexadecane, n-heptadecane, n-octadecane, n-nonadecane, etc., or a mixture thereof, typically having 16 to 24 carbon atoms, such as n-paraffin or paraffin wax. Saturated aliphatic hydrocarbon; 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, 1-eicosene, etc. or mixtures thereof, typically having 16 to 24 carbon atoms, linear α- monovalent or polyunsaturated aliphatic hydrocarbons such as olefins; long-chain fatty acids composed of octanoic acid, capric acid, lauric acid, myristic acid, etc. or mixtures thereof; esters of the above fatty acids, polyethers such as polyethylene glycol compound etc. can be mentioned. For example, n-octadecane is selected if it melts at 28°C, and n-hexadecane is selected if it melts at 18°C. Furthermore, a plurality of latent heat storage materials having different melting points as described above may be mixed and used.

2-5. Regarding the Treatment Liquid 5 As shown in FIG. 4, in the present embodiment, the treatment liquid added to the mixture 10a is the treatment liquid whose boiling point BP1 is higher than the melting point MP2 of the latent heat storage material 41, as described above. The processing liquid has a boiling point BP1 lower than the heating temperature HP for hot-pressing 10a into a board shape. Since the treatment liquid 5 is liquid when the mixture 10a is produced, the melting point MP1 of the treatment liquid 5 is higher than the melting point MP2 of the latent heat storage material. As will be described later, the heating temperature HP is the surface temperature of the base 61 and the pressing member 62 that come into contact with the surface of the mixture 10a during thermocompression molding.

Here, specifically, when the melting point MP2 of the latent heat storage material 41 is, for example, 18 to 25° C., and the heating temperature HP for hot-pressing the mixture 10a into a board shape is, for example, 120 to 220° C., the treatment The boiling point BP1 of the liquid is preferably about 70 to 110°C. Examples of the processing liquid 5 satisfying such conditions include alcohols such as ethanol, 1-propanol, 2-propanol, and 2-butanol, and water.

Here, when the adhesive 3 is the above-described thermosetting resin adhesive, the boiling point MP1 of the treatment liquid 5 is equal to or higher than the thermosetting start temperature SP of the thermosetting resin. Since thermosetting of the thermosetting resin starts before the treatment liquid 5 reaches the boiling point MP1 during thermocompression molding, it is possible to suppress deterioration of the adhesiveness of the adhesive due to evaporation of the treatment liquid 5. .

For example, in the case of a polyurethane resin adhesive containing an isocyanate compound such as MDI, the thermosetting start temperature SP is generally adjusted to about 80° C., so the boiling point BP1 of the treatment liquid 5 is equal to or higher than that temperature. It is preferable to use water (boiling point 100° C.). In this case, the water is heated to a temperature higher than its boiling point and turned into steam during thermocompression molding, which will be described later. is promoted. Thereby, the adhesion between the wooden pieces 2 by the adhesive 3 can be enhanced.

3. Mixture preparation step Wood pieces 2, adhesive 3, heat storage particles 4, and treatment liquid 5 are mixed. Thus, the mixture 10a shown in FIG. 3 is produced. In the present embodiment, the mixing method is not particularly limited as long as it is possible to ensure that the treatment liquid 5 adheres to the surfaces of the heat storage particles 4 during thermocompression molding, which will be described later.

In this embodiment, the wood piece 2, the adhesive 3, the heat storage particles 4, and the treatment liquid 5 may be mixed at the same time. The particles 4 or the heat storage particles 4 immersed in the treatment liquid 5 may be further mixed. As a result, after the surface of the wooden piece 2 is coated with the adhesive 3, the heat storage particles 4 containing the treatment liquid 5 are mixed, so that the treatment liquid 5 can be prevented from penetrating into the wooden piece 2.例文帳に追加Alternatively, the treatment liquid 5 may be applied after the wood pieces 2, the adhesive 3, and the heat storage particles 4 are mixed.

In the present embodiment, the mixture 10a is placed on a pedestal 61 of the pressing device shown in FIG. 3 and formed into a mat (formed into a forming mat). In this embodiment, the mixture 10a contains the heat storage particles 4 with the treatment liquid 5 adhered to the surface thereof. The mixture 10a may be formed into a mat shape by alternately stacking heat storage layers in which the adhered heat storage particles 4 are scattered. At this time, when forming the heat storage layer, the treatment liquid 5 may be sprayed on this layer. Furthermore, a mixture of the wood pieces 2 and the heat storage particles 4 may be prepared, and the adhesive 5 and the treatment liquid 4 may be sprayed while laminating this in a mat form. The adhesive 5 may be sprayed while preparing a mixture and laminating it in a mat-like manner. As described above, if the wood pieces 2, the adhesive 3, the heat storage particles 4, and the treatment liquid 5 are mixed in a state (mat-like state) before thermocompression molding, the method for producing the mixture 10a is not particularly limited. not something.

4. 3. Thermo-compression molding process Next, as shown in FIG. 3, the wooden board 10 is manufactured by subjecting the mixture 10a formed in the mat shape to thermo-compression molding using a heated pressing member 62 of a hot press device. do. At this time, the base 61 is also heated. As a result, the mat-like mixture 10a is hot-pressed while the treatment liquid 5 is evaporated, and the wooden board 10 is manufactured. The temperature (heating temperature) for molding the mat-like mixture 10a into a board is, for example, in the range of 120 to 220° C., although it depends on the type of the adhesive 3, and the pressure during hot pressing is, for example, 2 to 5 MPa. degree.

Here, as shown in FIG. 5(b), when a wooden board is thermocompressed from a mixture that does not contain the treatment liquid 5, the surface temperature of the wooden board increases toward the heating temperature HP for thermocompression molding, From a certain timing, the liquefied latent heat storage material 41 tends to evaporate.

However, in this embodiment, as shown in FIG. 5(a), the treatment liquid 5 reaches its boiling point BP1 at time t1 during thermocompression molding, and the treatment liquid 5 evaporates. On the other hand, the latent heat storage material 41 contained in the heat storage particles 4 has already liquefied because its melting point MP2 is exceeded. In this state, since the treatment liquid 5 adhering to the heat storage particles 4 has evaporated, the liquefied heat storage particles 4 absorb heat from the heat of vaporization of the treatment liquid 5, and the temperature rise of the latent heat storage material 41 can be suppressed (time t2 onwards). Therefore, even if the latent heat storage material 41 is liquefied at a temperature higher than its melting point during thermocompression molding, the evaporation of the latent heat storage material 41 can be suppressed.

Here, it is preferable that the treatment liquid 5 is vaporized during hot pressing, and the vapor is easily released from the interior of the wooden board 10 to the outside. For example, when the density of the wood board 10 excluding the heat storage particles 4 is high, or when the ratio of the heat storage particles 4 to the total mass of the wood pieces 2 and the heat storage particles 4 is high, the steam escapes from the gaps between the wood pieces 2 to the outside. Hard to get out. Since the amount of the adhesive 3 is very small with respect to the total mass of the wooden board 10, if the ratio of the mass of the heat storage particles 4 to the total mass of the wood pieces 2 and the heat storage particles 4 is specified, the steam It is possible to derive a condition that facilitates release from the inside of 10 to the outside.

From this point of view, the average density of the wood board excluding the heat storage particles 4 as the mixture 10a is in the range of 200 to 380 kg / m ³ , and the mass of the heat storage particles 4 with respect to the mass of the wood pieces 2 and the heat storage particles 4 Mixtures are made so that the proportions range from 20 to 44%. This secures a path for the steam to escape inside the wooden board 10 and facilitates the release of the steam from the inside of the wooden board 10 to the outside.

The density of the wood board excluding the heat storage particles 4 is obtained by subtracting the total mass of the heat storage particles 4 from the mass of the wood board 10 that has been thermocompressed and dividing the result by the volume of the wood board 10. Obtainable.

Here, if the average density of the wooden board excluding the heat storage particles 4 is less than 200 kg/m ³ , the bending strength of the wooden board 10 itself may not be ensured. On the other hand, when the average density of the wood board excluding the heat storage particles 4 exceeds 380 kg/m ³ , the voids in the wood board 10 become smaller, so even if the proportion of the heat storage particles 4 is reduced, the steam can flow well. Sometimes I can't get out.

On the other hand, when the ratio of the mass of the heat storage particles 4 to the mass of the wood piece 2 is less than 20%, the heat storage function may not be sufficient. On the other hand, if the ratio of the mass of the heat storage particles 4 to the mass of the wood pieces 2 exceeds 44%, the heat storage particles 4 block the passage through which the steam in the wood board 10 escapes, and even if the heat storage particles 4 are removed, Even if the average density of the wooden board is reduced, the steam may not escape well.

[Second embodiment of the first invention]
A method for manufacturing a wooden board according to a second embodiment of the first invention will be described below with reference to FIGS. 6 and 7. FIG. A difference of the second embodiment from the first embodiment is that a holding material 6 for holding the treatment liquid is attached to the surface of the heat storage particles 4 . Therefore, detailed description of the same configuration as that of the first embodiment of the first invention will be omitted.

Specifically, in this embodiment, a holding material 6 that holds the treatment liquid 5 is attached to the surface of the heat storage particles 4 . More specifically, in this embodiment, the surfaces of the heat storage particles 4 are covered with a holding material 6 that holds the treatment liquid 5 . The holding material 6 is wood flour, wood fiber, or paper, and the material is not particularly limited as long as it can hold the treatment liquid 5 . Therefore, when the processing liquid 5 is water, for example, silica gel can be used as the holding material 6 .

Such a holding material 6 covers the heat storage particles 4 via an adhesive or adhesive. When the heat storage particles 4 are coated with the holding material 6, after the heat storage particles 4 are coated with an adhesive or adhesive by coating or dipping, the holding material 6 such as wood flour, wood fiber, or paper is laid out. Then, the powder composed of the heat storage particles 4 is rolled while being pressed. Thereby, the surface of the heat storage particles 4 can be uniformly coated with the holding material 6 .

For example, by adjusting the type of wood flour, wood fiber, or paper, the coating thickness, or the like, the amount of holding material 6 coated on one heat storage particle 4 can be adjusted. By adjusting the amount of the holding material 6, the amount of the treatment liquid 5 that can be held by one heat storage particle 4 can be adjusted.

For example, as shown in FIG. 6( a ), the holding material 6 may cover the heat storage particles 4 in which the particles 43 in which the latent heat storage material 41 is encapsulated in microcapsules 42 are dispersed in the resin base material 44 . . Alternatively, as shown in FIG. 6B, the heat storage particles 4 in which the wood particles 45 are impregnated with the latent heat storage material 41 may be covered with the holding material 6 . As shown in FIG. 6(c), the heat storage particles 4 obtained by impregnating the latent heat storage material 41 into the granulated particles 46 made of wood fiber may be covered with the holding material 6. As shown in FIG. Since fine irregularities are formed on the surfaces of the wood particles 45 and the granulated particles 46, the holding material 6 can easily adhere to them.

A preparation step is performed by the same method as the method shown in the first embodiment of the first invention, and a mixture 10a shown in FIG. 7 is produced in the mixture production step. At this time, when the mixture 10a is produced, the treatment liquid 5 is adhered to the surface of the heat storage particles 4 by the same method as the method shown in the first embodiment of the first invention. At this time, the treatment liquid 5 is held in the holding material 6 by the holding material 6 covering the surfaces of the heat storage particles 4 .

The resulting mixture 10a is shaped into a mat, which is thermocompressed as shown in FIG. 7(a) to form a wooden board 10 as shown in FIG. 7(b). In this embodiment, by retaining the treatment liquid 5 on the surfaces of the heat storage particles 4, the treatment liquid 5 can be secured on the surfaces of the heat storage particles 4, so that the temperature rise of the latent heat storage material 41 can be suppressed more reliably. Since the holding material 6 covers the surfaces of the heat storage particles 4 , the treatment liquid 5 is uniformly evaporated from the surfaces of the heat storage particles 4 , so that the temperature of the heat storage particles 4 does not locally increase.

In particular, by using wood flour, wood fiber, or paper as the holding material 6, the holding property of the treatment liquid of the holding material 6 can be enhanced. 6(b) and 6(c), wood powder, wood fiber, or paper, which is the holding material 6, has good compatibility with the wood particles 45 shown in FIGS. can be easily attached to

Here, in the present embodiment, the treatment liquid 5 is water, and it is preferable that the retaining material retains water in an amount equal to or greater than the product of the total mass of the heat storage particles 4 and the moisture content of the wooden pieces 2 . The wooden board 10 molded in this embodiment is a board in which a portion of the wooden pieces are replaced with heat storage particles in contrast to a normal wood board having no heat storage particles. Therefore, if the holding material 6 holds the treatment liquid 5 having a larger mass than the water content (mass) contained in the wood pieces 2 to be replaced with the heat storage particles 4, the temperature rise of the latent heat storage material 41 can be more reliably increased. can be suppressed. The moisture content of the wooden pieces 2 is the mass moisture content contained in the granular wooden pieces 2, and can be obtained by contacting an aggregate of the wooden pieces 2 with a general moisture content measuring instrument. The moisture content of the wooden piece 2 can be adjusted by controlling the temperature and humidity. In the first embodiment of the first invention, water is used as the treatment liquid 5, and the total mass of the heat storage particles 4 is multiplied by the moisture content of the wood piece 2, and the water is attached to the surfaces of the heat storage particles 4. may

[Third embodiment of the first invention]
A method for manufacturing a wooden board according to the third embodiment of the first invention will be described below with reference to FIG. The third embodiment of the first invention differs from the second embodiment of the first invention in that the surface layers 12 are formed on both sides of the core layer 11 in which the heat storage particles are dispersed, and the wood pieces 22 are adhered. The point is to manufacture the board 10 . Therefore, detailed description of the same configuration as that of the second embodiment of the first invention will be omitted.

In this embodiment, as shown in FIG. 8B, the wooden board 10 has a three-layer structure laminated in the thickness direction, and a pair of surface layers 12, 12 are formed on both sides of the wooden board 10. A core layer 11 is formed inside. In this embodiment, the core layer 11 is made up of the wood pieces 2 , the heat storage particles 4 and the adhesive 3 , and the surface layer 12 is made up of the wood pieces 2 and the adhesive 3 .

First, in the preparation step, at the time of thermocompression molding, as materials constituting the mixture before thermocompression molding into a board, wood pieces 2 as wood materials, adhesives 3, heat storage particles 4 containing latent heat storage materials, and treatment Prepare liquid 5. Here, in the present embodiment, the grain size of the wood pieces 22 of the surface layer 12 and the grain size of the wood pieces 21 of the core layer 11 may be the same, but the grain size of the wood pieces 21 of the core layer 11 may be the same. It is more preferable that the grain size of the wood pieces 22 of the surface layer 12 is smaller than . As a result, vapor generated by evaporation of the treatment liquid 5 in the core layer 11 can be uniformly diffused in the core layer 11 during thermocompression molding, which will be described later. Examples of the adhesives 31 and 32 include the adhesives described above, and in the present embodiment, the adhesive 31 is preferably an isocyanate-based adhesive. Adhesive 32 is preferably a urea resin adhesive or a melamine resin adhesive.

In the mixture preparation step, a mixture 11a to be the core layer 11 and a mixture 12a to be the surface layer 12 are prepared. The mixture 11 a of the core layer 11 is a mixture of the wood pieces 21 , the adhesive 31 , the heat storage particles 4 held by the holding material 6 , and the treatment liquid 5 held by the holding material 6 . The mixture 12 a of the surface layer 12 is a mixture of wood pieces 22 and adhesive 32 .

The resulting mixtures 11a and 12a are successively laminated in a mat shape on a pedestal 61 shown in FIG. The wooden board 10 is manufactured by compression molding. The heat storage particles 4 are dispersed in the core layer 11 of the wooden board 10 thus obtained.

Here, as the mixture 11a of the core layer 11, the average density of the core layer 11 excluding the heat storage particles 4 is in the range of 200 to 380 kg/m ³ . The mixture 11a of the core layer 11 is preferably prepared such that the mass ratio of the heat storage particles 4 in the core layer 11 is in the range of 20 to 44%. This range is the same as the range shown in the first embodiment of the first invention, and by satisfying this range, steam is generated in the wooden board 10 in the same manner as in the case shown in the first embodiment of the first invention. A path through which steam escapes is secured, and steam is easily released from the inside of the wooden board 10 to the outside.

[First embodiment of the second invention]
FIG. 9(a) is a partially enlarged cross-sectional view for explaining the state of the mixture before being hot-pressed into a wooden board according to the first embodiment of the second invention, and FIG. Fig. 9(a) is a cross-sectional view of a wood board obtained by hot-pressing the mixture shown in 9(a);

In this embodiment, as shown in FIGS. 9(a) and 9(b), the wood board 10 is composed of wood particles 45 such as wood pieces as shown in FIG. It includes heat storage particles 4 impregnated with latent heat storage material 41 and adhesive 3 . Note that the treatment liquid 5, which will be described later, is not included in the wooden board 10 because it evaporates during manufacture (during thermocompression molding). Hereinafter, members having the same functions as those of the first embodiment of the first invention are denoted by the same reference numerals, and detailed description thereof will be omitted.

In this embodiment, the heat storage particles 4 of the wooden board 10 are bonded to each other via the adhesive 3 . The heat storage particles 4 may exist inside the wooden board 10 in the form shown in FIG. 2(d), for example. Such a wooden board 10 can be manufactured by a series of steps shown below.

First, the heat storage particles 4, the adhesive 3, and the treatment liquid 5 are prepared as materials constituting the mixture 10a before being hot-pressed into a board during hot-press molding. These materials are described in detail below.

In the present embodiment, the wood particles 45 that make up the heat storage particles 4 are granular wood materials that serve as the base material of the wood board 10, and include at least one form selected from chips, flakes, and wafers. . In the present embodiment, the wood particles 45 are used as the granular wood material, but wood particles granulated from wood fibers or wood powder obtained by pulverizing wood, for example, may also be used, to which the latent heat storage material 41 is attached. It is not particularly limited as long as it can be used. Examples of the material of the wood particles 45 include conifers such as pine, cedar, and cypress, and broad-leaved trees such as lauan, kapoleon, and poplar. In the present embodiment, the wood particles 45 are obtained by crushing or cutting wood or the like with a crusher or a cutter into small pieces to form chips.

In this embodiment, the heat storage particles 4 are wood particles 45 impregnated with the latent heat storage material 41 exemplified in the first embodiment of the first invention. 41 may be attached, and a part of the attached latent heat storage material 41 may be impregnated with wood particles 45 . Since fine irregularities are formed on the surfaces of the wood particles 45 , the treatment liquid 5 can be easily retained. The latent heat storage material 41, the adhesive 3, and the treatment liquid 5 according to this embodiment are the same as those exemplified in the first embodiment of the first invention, and satisfy the relationship shown in FIG. A detailed description of is omitted.

The prepared adhesive 3, heat storage particles 4, and treatment liquid 5 are mixed. Thus, a mixture 10a shown in FIG. 9(a) is produced. In this embodiment, as illustrated in the first embodiment of the first invention, if the state in which the treatment liquid 5 is attached to the surfaces of the heat storage particles 4 can be ensured during thermocompression molding, which will be described later, The mixing method is not particularly limited.

In this embodiment, the adhesive 3, the heat storage particles 4, and the treatment liquid 5 may be mixed at the same time. Alternatively, the treatment liquid 5 may be applied after the adhesive 3 and the heat storage particles 4 are mixed. Alternatively, the treatment liquid 5 may be sprayed on the pedestal 61 while forming the mixture 10a into layers to form a mat. Alternatively, the heat storage particles 4 may be prepared and laminated in a mat shape while the adhesive 5 and the treatment liquid 4 are sprayed. The adhesive 5 may be sprayed while laminating the substrate. As described above, the method for producing the mixture 10a is not particularly limited as long as the adhesive 3, the heat storage particles 4, and the treatment liquid 5 are mixed in a state (mat state) before thermocompression molding. .

Next, as shown in FIG. 9(a), the wood board 10 is manufactured by subjecting the mat-shaped mixture 10a to hot pressing members 62 of a hot pressing device to perform thermocompression molding. At this time, the base 61 is also heated. As a result, the mat-like mixture 10a is hot-pressed while the treatment liquid 5 is evaporated, and the wooden board 10 is manufactured. The ranges of the heating temperature and pressure for molding the mat-like mixture 10a into a board are the same as those exemplified in the first embodiment of the first invention.

In this embodiment, as in the first embodiment of the first invention, the treatment liquid 5 evaporates during thermocompression molding. On the other hand, the latent heat storage material 41 contained in the heat storage particles 4 has already been liquefied. Due to the evaporation of the treatment liquid 5 adhering to the heat storage particles 4 , the liquefied heat storage particles 4 absorb heat from the heat of vaporization of the treatment liquid 5 , thereby suppressing the temperature rise of the latent heat storage material 41 . Therefore, even if the latent heat storage material 41 is liquefied at a temperature higher than its melting point during thermocompression molding, the evaporation of the latent heat storage material 41 can be suppressed.

Here, it is preferable that the treatment liquid 5 is vaporized during hot pressing, and the vapor is easily released from the interior of the wooden board 10 to the outside. Therefore, the mixture 10a is prepared so that the average density of the wooden board 10 is in the range of 400 to 900 kg/m ³ . As a result, while maintaining the flexural strength of the wooden board 10, a path for the steam to escape is secured in the wooden board 10, and the steam is easily released from the inside of the wooden board 10 to the outside. The density of the wooden board can be obtained by dividing the mass of the thermocompressed wooden board 10 by the volume of the wooden board 10 .

Here, if the average density of the wooden board 10 is less than 400 kg/m ³ , the bending strength of the wooden board 10 itself may not be ensured. On the other hand, if the average density of the wooden board 10 exceeds 900 kg/m ³ , the voids in the wooden board 10 become smaller, so even if the proportion of the heat storage particles 4 is reduced, the steam may not escape well. .

[Second embodiment of the second invention]
A method for manufacturing a wooden board according to a second embodiment of the second invention will be described below with reference to FIG. This embodiment differs from the first embodiment of the second invention in that a holding material 6 for holding the treatment liquid is attached to the surface of the heat storage particles 4 and a core in which the heat storage particles 4 are dispersed. The point is to manufacture the wooden board 10 in which the surface layers 12 to which the wooden pieces 22 are adhered are formed on both sides of the layer 11 . Therefore, detailed description of the same configuration as that of the first embodiment of the second invention will be omitted.

Specifically, in this embodiment, a holding material 6 that holds the treatment liquid 5 is attached to the surface of the heat storage particles 4 according to the first embodiment of the second invention. In this embodiment, the surfaces of the heat storage particles 4 are covered with a retaining material 6 that retains the treatment liquid 5 . The holding material 6 is preferably wood flour, wood fiber, or paper.

Specifically, in this embodiment, as described in the second embodiment of the first invention, the surface of the heat storage particles 4 in which the wood particles 45 are impregnated with the latent heat storage material 41 is covered with the holding material 6 ( See FIG. 6(b)). Alternatively, as shown in FIG. 6C, the holding material 6 may be coated on the surface of the heat storage particles 4 obtained by impregnating the latent heat storage material 41 with the granulated particles 46 made of wood fibers.

As the holding material 6, materials similar to those described in the second embodiment of the first invention can be used, and the method of coating the heat storage particles 4 with the holding material 6 is also explained in the second embodiment of the first invention. A method similar to the material described above can be mentioned. For example, by adjusting the type of wood flour, wood fiber, or paper that is the holding material 6, the coating thickness, or the like, the amount of the holding material 6 coated on one heat storage particle 4 can be adjusted. By adjusting the amount of the holding material 6, the amount of the treatment liquid 5 that can be held by one heat storage particle 4 can be adjusted. Furthermore, when wood flour, wood fiber, or paper is used as the holding material 6, the holding material 6 can be easily adhered to the heat storage particles 4 because it has good compatibility with the wood particles 45. FIG.

In this embodiment, as shown in FIG. 10(b), the wooden board 10 has a three-layer structure laminated in its thickness direction, and a pair of surface layers 12, 12 are formed on both sides of the wooden board 10. A core layer 11 is formed inside. In this embodiment, the core layer 11 is composed of the heat storage particles 4 and the adhesive 3 , and the surface layer 12 is composed of the wooden pieces 22 and the adhesive 3 .

First, in the preparatory step, the adhesive 3, the heat storage particles 4 containing the latent heat storage material, and the treatment liquid 5 are prepared as materials constituting the mixture before being hot-pressed into a board during hot-press molding. Here, in the present embodiment, the particle size of the wood pieces 22 of the surface layer 12 and the particle size of the wood particles 45 of the core layer 11 may be the same, but the heat storage particles 4 of the core layer 11 (specifically, the particle size of the wood particles 45 of the core layer 11) In particular, it is more preferable that the grain size of the wood pieces 22 of the surface layer 12 is smaller than the grain size of the wood grains 45). As a result, vapor generated by evaporation of the treatment liquid 5 in the core layer 11 can be uniformly diffused in the core layer 11 during thermocompression molding.

Here, the treatment liquid 5 is adhered to the surface of the heat storage particles 4 by the same method as the method shown in the second embodiment of the first invention. At this time, the treatment liquid 5 is held in the holding material 6 by the holding material 6 covering the surfaces of the heat storage particles 4 . Examples of the adhesives 31 and 32 include the adhesives described above, and in the present embodiment, the adhesive 31 is preferably an isocyanate-based adhesive. Adhesive 32 is preferably a urea resin adhesive or a melamine resin adhesive.

In the mixture preparation step, a mixture 11a to be the core layer 11 and a mixture 12a to be the surface layer 12 are prepared. The mixture 11 a of the core layer 11 is a mixture of the adhesive 31 , the heat storage particles 4 held by the holding material 6 , and the treatment liquid 5 held by the holding material 6 . The mixture 12 a of the surface layer 12 is a mixture of wood pieces 22 and adhesive 32 .

The mixtures 11a and 12a thus obtained are successively laminated in a mat shape on a pedestal 61 shown in FIG. The wooden board 10 is manufactured by molding. In this embodiment, by retaining the treatment liquid 5 on the surfaces of the heat storage particles 4, the treatment liquid 5 can be secured on the surfaces of the heat storage particles 4, so that the temperature rise of the latent heat storage material 41 can be suppressed more reliably. Since the holding material 6 covers the surfaces of the heat storage particles 4 , the treatment liquid 5 is uniformly evaporated from the surfaces of the heat storage particles 4 and the temperature of the heat storage particles 4 does not locally increase.

Here, as the mixture 11a of the core layer 11, the mixture 11a of the core layer 11 should be prepared so that the average density of the core layer 11 of the wooden board 10 is in the range of 400 to 900 kg/m ³ . This range is the same as the range shown in the first embodiment of the second invention, and by satisfying this range, steam is generated in the wooden board 10 as in the case shown in the first embodiment of the second invention. A path through which steam escapes is secured, and steam is easily released from the inside of the wooden board 10 to the outside.

Embodiments of the present invention are described below.

[Example 1 (corresponding to the first invention)]
A wooden board shown in FIG. 8(b) was produced. As the wood material, 487 g of wood pieces (wood chips) were prepared, and 300 g of heat storage particles (pellets: manufactured by Mitsubishi Chemical Infratech) coated with wood fibers as a holding material shown in FIG. 6(a) were prepared. The heat storage particles are particles in which microcapsules containing a latent heat storage material are dispersed in a resin.

The phase change temperature (melting point) of the latent heat storage material contained in the heat storage particles is 25°C, and the latent heat storage material does not volatilize at 120°C or less. As a woody material for each surface layer, 372 g of woody pieces (woody chips) smaller in particle size than the woody pieces of the core layer were prepared.

Next, as a mixture for the core layer, an isocyanate-based adhesive (adhesive using MDI as an isocyanate compound) and water were further mixed with the wood pieces and the heat storage particles. In addition, water was added so that the water content equal to or greater than the product of the total mass of the heat storage particles and the moisture content of the wood piece was retained in the retaining material.

Each mixture is laminated, the press hot plate temperature (heating temperature) is 166 ° C., the press time is 5 minutes, the wood board with a finished thickness of 16.2 mm is thermocompressed, and the surface is polished to a thickness of 15 mm. made it At this time, the temperature inside the wooden board during thermocompression molding was measured. The results are shown in FIG.

[Embodiment 2 (corresponding to the first invention)]
A wooden board was produced in the same manner as in Example 1, and the temperature inside the wooden board was measured. The difference from Example 1 is that the wood material used was 387 g of wood pieces (wood chips). The results are shown in FIG.

[Comparative example]
A wooden board was produced in the same manner as in Example 1, and the temperature inside the wooden board was measured. The difference from Example 1 is that water, which is the treatment liquid, was not added. The results are shown in FIG.

〔Results and Discussion〕
As shown in FIG. 11, the internal temperatures of the wooden boards of Examples 1 and 2 became constant when they exceeded 100°C, but the internal temperature of the wooden board of the comparative example increased and finally Typically, the temperature exceeded 120°C and the latent heat storage material evaporated. From these results, as shown in Examples 1 and 2, it was found that the temperature rise of the heat storage particles (latent heat storage material) could be suppressed due to the heat of vaporization caused by the evaporation of the treatment liquid adhering to the heat storage particles. rice field.

[Examples 3 to 7 (corresponding to the first invention)]
In the same manner as in Example 1, two wooden boards for each of Examples 3 to 7 were produced. The difference from Example 1 is that the amounts and proportions of wood chips, which are wood materials, and heat storage particles were changed as shown in Table 1. In addition, Example 7 and Example 1 are the same.

Furthermore, for Examples 3 to 7, the density at the position in the thickness direction from the surface of the wooden board in the board thickness direction was measured, and from this, the average density of the core layer excluding the heat storage particles (the density of the core material excluding the heat storage particles density) was calculated. FIG. 12 shows the densities of the wooden boards in the lower columns of Examples 4 and 5 in Table 1. FIG.

Furthermore, the ratio of the mass of the heat storage particles in the core layer to the mass of the wood material and the heat storage particles in the core layer (ratio of heat storage particles) was calculated. The results are shown in Table 1. Furthermore, the state of evaporation of the latent heat storage material was confirmed for the wooden boards of Examples 3 to 7. The results are also shown in Table 1.

[Embodiments 8 and 9 (corresponding to the first invention)]
Wooden boards of Examples 8 and 9 were produced in the same manner as in Example 3. The difference from Example 1 is that, as shown in Table 1, the heat storage particles of the core layer are made of wood particles (wood chips) impregnated with latent heat storage material (see FIG. 2(c)). And, the amount and ratio of wood chips and heat storage particles were changed as shown in Table 1. For the wooden boards of Examples 8 and 9, the state of evaporation of the latent heat storage material was confirmed. The results are also shown in Table 1.

[Embodiment 10 (corresponding to the second invention)]
A wooden board of Example 10 was produced in the same manner as in Example 1. The difference from Example 1 is that, as shown in Table 1, heat storage particles in which wood particles (wood chips) are impregnated with a latent heat storage material are used as the heat storage particles in the core layer, and no wood material is included in the core layer. It is a point. Furthermore, the state of evaporation of the latent heat storage material in the wooden board of Example 10 was confirmed. The results are also shown in Table 1.

〔Results and Discussion〕
When the particles obtained by dispersing the microcapsules with the latent heat storage material inside in the resin were used as the heat storage particles, in Examples 3, 4, and 7, it was confirmed that the latent heat storage material was slightly evaporated. In Examples 5 and 6, there was almost no evaporation of the latent heat storage material.

In Examples 3 and 4, since the density of the core material excluding the heat storage particles was high, even if the treatment liquid evaporated, it remained inside the core material, and as a result, the temperature of the latent heat storage material rose. On the other hand, in Example 7, since the ratio of the heat storage particles to the wood particles was high, even if the treatment liquid evaporated, the heat storage particles blocked the passage through which the steam escaped in the wood board. It is considered that the temperature of the heat storage material rose.

From the above points, the average density of the core layer excluding the heat storage particles is 363 kg/m ³ or less (Example 5), and the weight of the core layer with respect to the mass of the wood material and heat storage particles in the core layer is If the mass ratio of the heat storage particles is 44% (Example ⁶ ) or less, it is believed that the steam will surely escape from the core layer. If so, it is expected that the vapor escapes from the core layer.

When the heat storage particles in which the latent heat storage material was impregnated into the wood particles were used, as shown in Examples 8 and 9, even if the proportion of the heat storage particles was increased, the latent heat storage material did not substantially evaporate. It is considered that this is because impregnating the wood particles with the latent heat storage material facilitates the formation of gaps inside the wood board. As shown in Example 10, even when the ratio of the heat storage particles in the core layer was 100%, almost no evaporation of the latent heat storage material occurred. The density of the wooden board of Example 10 was about 600 kg/m ³ . Here, from the experience of the inventors, in general wooden boards, if the ^average density of the wooden board is in the range of 400 to 900 kg / m It has been found that the porous material is easily porous, and by setting the thickness in such a range, the evaporation of the latent heat storage material can be suppressed.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the invention described in the claims. Changes can be made.

In each of the embodiments, one type of heat storage particles was used to manufacture the heat storage board, but in these embodiments, heat storage particles containing latent heat storage materials having different melting points, for example, may be used.

2, 21, 22: wood piece (wood material), 3, 31, 32: adhesive, 4: heat storage particles, 41: latent heat storage material, 5: treatment liquid (water), 6: retention material, 10: wood board , 10a, 11a, 12a: mixture

Claims (13)

A wood board is produced by subjecting a mixture obtained by mixing a granular wood material, an adhesive for bonding at least the wood materials together, and heat storage particles containing a latent heat storage material into a board shape by thermocompression molding. A manufacturing method for
The mixture is a treatment liquid having a boiling point higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material, and the treatment having a boiling point lower than the heating temperature for thermocompression molding into a board shape. A mixture is prepared by mixing the heat storage particles with the liquid attached to the surface, the wooden material, and the adhesive, and the mixture is formed into a board while evaporating the treatment liquid during the thermocompression molding. A method of manufacturing a wooden board characterized by: 2. The method of manufacturing a wooden board according to claim 1, wherein the heat storage particles are particles in which microcapsules containing the latent heat storage material are dispersed in a resin. 2. The method of manufacturing a wooden board according to claim 1, wherein the heat storage particles are particles in which the latent heat storage material is attached to at least the surfaces of the wood particles. As the wooden board, a wooden board in which the heat storage particles are uniformly dispersed in the wooden material is manufactured,
As the mixture, the average density of the wooden board excluding the heat storage particles is in the range of 200 to 380 kg/m ³ , and the ratio of the mass of the heat storage particles to the mass of the wood material and the heat storage particles is 20 to 380 kg/m 3 . 3. The method of manufacturing a wooden board according to claim 2, wherein said mixture is produced so as to be in the range of 44%. The wooden board includes a core layer composed of the wooden material, the heat storage particles, and the adhesive, and surface layers formed on both sides of the core layer and composed of the wooden material and the adhesive. It is intended to manufacture a wooden board that
As the mixture, a surface layer mixture obtained by mixing the wooden material and the adhesive, and a core layer mixture obtained by mixing the wooden material, the heat storage particles, the adhesive, and the treatment liquid are prepared,
As a mixture of the core layer, the average density of the core layer excluding the heat storage particles is in the range of 200 to ³⁸⁰ kg/m 3. The method of manufacturing a wooden board according to claim 2, wherein the mixture of the core layer is produced so that the mass ratio of the heat storage particles is in the range of 20 to 44%. The treatment liquid is water, and when preparing the mixture, a mass of water equal to or greater than the total mass of the heat storage particles multiplied by the moisture content of the wood material is attached to the surfaces of the heat storage particles. The method for producing a wooden board according to any one of claims 1 to 5. A mixture obtained by mixing a heat storage particle having a latent heat storage material attached to at least the surface of a granular wood material and an adhesive for bonding the heat storage particles to each other is hot-pressed into a board shape to obtain a wood board. A manufacturing method for manufacturing the
The mixture is a treatment liquid having a boiling point higher than the melting point of the latent heat storage material and lower than the boiling point of the latent heat storage material, and the treatment having a boiling point lower than the heating temperature for thermocompression molding into a board shape. A wood board characterized by preparing a mixture obtained by mixing heat storage particles with a liquid attached to the surface thereof and the adhesive, and forming the mixture into a board while evaporating the treatment liquid during the thermocompression molding. manufacturing method. The wooden board is obtained by bonding the heat storage particles to each other with an adhesive,
8. The method for producing a wooden board according to claim 7, wherein the mixture is produced so that the average density of the wooden board is in the range of 400 to 900 kg/m ³ . As the wooden board, a wooden board having a core layer composed of the heat storage particles and the adhesive, and surface layers formed on both sides of the core layer and composed of the wooden material and the adhesive is manufactured. is a
As the mixture, a surface layer mixture obtained by mixing the wooden material and the adhesive, and a core layer mixture obtained by mixing the wooden material, the heat storage particles, the adhesive, and the treatment liquid are prepared,
8. The mixture of the core layers according to claim 7, wherein the mixture of the core layers is produced so that the average density of the core layers of the wooden boards is in the range of 400 to 900 kg/m ³ . wood board manufacturing method. The method for manufacturing a wooden board according to any one of claims 1 to 9, wherein a retaining material that retains the treatment liquid is attached to the surface of the heat storage particles. 11. The method of manufacturing a wooden board according to claim 10, wherein the holding material is wood flour, wood fiber, or paper. 12. The adhesive according to any one of claims 1 to 11, wherein the adhesive is a thermosetting resin adhesive, and the boiling point of the treatment liquid is equal to or higher than the thermosetting starting temperature of the thermosetting resin. 3. The method for manufacturing the wooden board according to . The method for manufacturing a wooden board according to any one of claims 1 to 12, wherein the adhesive is an isocyanate adhesive, and the treatment liquid is water.

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