JP7125591B2 - ロードポート及びｅｆｅｍ - Google Patents

ロードポート及びｅｆｅｍ Download PDF

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Publication number
JP7125591B2
JP7125591B2 JP2018072021A JP2018072021A JP7125591B2 JP 7125591 B2 JP7125591 B2 JP 7125591B2 JP 2018072021 A JP2018072021 A JP 2018072021A JP 2018072021 A JP2018072021 A JP 2018072021A JP 7125591 B2 JP7125591 B2 JP 7125591B2
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JP
Japan
Prior art keywords
load port
door
space
seal portion
foup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018072021A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019186293A (ja
Inventor
淳志 鈴木
辰弥 三浦
育志 谷山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Priority to JP2018072021A priority Critical patent/JP7125591B2/ja
Priority to KR1020190039226A priority patent/KR20190116103A/ko
Priority to TW108112022A priority patent/TWI803613B/zh
Priority to CN201910269198.6A priority patent/CN110349893B/zh
Publication of JP2019186293A publication Critical patent/JP2019186293A/ja
Application granted granted Critical
Publication of JP7125591B2 publication Critical patent/JP7125591B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Brushes (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Measurement Of Force In General (AREA)
JP2018072021A 2018-04-04 2018-04-04 ロードポート及びｅｆｅｍ Active JP7125591B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018072021A JP7125591B2 (ja) 2018-04-04 2018-04-04 ロードポート及びｅｆｅｍ
KR1020190039226A KR20190116103A (ko) 2018-04-04 2019-04-03 로드 포트 및 efem
TW108112022A TWI803613B (zh) 2018-04-04 2019-04-03 裝載端口以及設備前端模組
CN201910269198.6A CN110349893B (zh) 2018-04-04 2019-04-04 装载端口以及efem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018072021A JP7125591B2 (ja) 2018-04-04 2018-04-04 ロードポート及びｅｆｅｍ

Publications (2)

Publication Number Publication Date
JP2019186293A JP2019186293A (ja) 2019-10-24
JP7125591B2 true JP7125591B2 (ja) 2022-08-25

Family

ID=68171752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018072021A Active JP7125591B2 (ja) 2018-04-04 2018-04-04 ロードポート及びｅｆｅｍ

Country Status (4)

Country Link
JP (1) JP7125591B2 (zh)
KR (1) KR20190116103A (zh)
CN (1) CN110349893B (zh)
TW (1) TWI803613B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7422577B2 (ja) * 2020-03-23 2024-01-26 平田機工株式会社 ロードポート及び制御方法
CN112242338B (zh) * 2020-12-18 2021-03-02 西安奕斯伟硅片技术有限公司 能够保持foup的盖部的洁净度的装载端口及设备前端模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013118278A (ja) 2011-12-02 2013-06-13 Shin Etsu Polymer Co Ltd 基板収納容器
WO2017022431A1 (ja) 2015-08-04 2017-02-09 シンフォニアテクノロジー株式会社 ドア開閉システムおよびドア開閉システムを備えたロードポート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
JP6024980B2 (ja) 2012-10-31 2016-11-16 Tdk株式会社 ロードポートユニット及びｅｆｅｍシステム
US9136149B2 (en) * 2012-11-16 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Loading port, system for etching and cleaning wafers and method of use
JP2015115517A (ja) * 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ
JP6291878B2 (ja) * 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ
JP2016178133A (ja) * 2015-03-19 2016-10-06 シンフォニアテクノロジー株式会社 ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法
KR101739518B1 (ko) 2015-08-20 2017-05-26 비알 컨설팅 인코포레이티드 황칠나무의 추출물을 포함하는 조성물
JP6687840B2 (ja) * 2016-03-29 2020-04-28 シンフォニアテクノロジー株式会社 ロードポート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013118278A (ja) 2011-12-02 2013-06-13 Shin Etsu Polymer Co Ltd 基板収納容器
WO2017022431A1 (ja) 2015-08-04 2017-02-09 シンフォニアテクノロジー株式会社 ドア開閉システムおよびドア開閉システムを備えたロードポート

Also Published As

Publication number Publication date
TW201943007A (zh) 2019-11-01
TWI803613B (zh) 2023-06-01
CN110349893A (zh) 2019-10-18
KR20190116103A (ko) 2019-10-14
JP2019186293A (ja) 2019-10-24
CN110349893B (zh) 2023-11-14

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