JP7125591B2 - ロードポート及びefem - Google Patents
ロードポート及びefem Download PDFInfo
- Publication number
- JP7125591B2 JP7125591B2 JP2018072021A JP2018072021A JP7125591B2 JP 7125591 B2 JP7125591 B2 JP 7125591B2 JP 2018072021 A JP2018072021 A JP 2018072021A JP 2018072021 A JP2018072021 A JP 2018072021A JP 7125591 B2 JP7125591 B2 JP 7125591B2
- Authority
- JP
- Japan
- Prior art keywords
- load port
- door
- space
- seal portion
- foup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Brushes (AREA)
- Electrophonic Musical Instruments (AREA)
- Measurement Of Force In General (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018072021A JP7125591B2 (ja) | 2018-04-04 | 2018-04-04 | ロードポート及びefem |
KR1020190039226A KR20190116103A (ko) | 2018-04-04 | 2019-04-03 | 로드 포트 및 efem |
TW108112022A TWI803613B (zh) | 2018-04-04 | 2019-04-03 | 裝載端口以及設備前端模組 |
CN201910269198.6A CN110349893B (zh) | 2018-04-04 | 2019-04-04 | 装载端口以及efem |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018072021A JP7125591B2 (ja) | 2018-04-04 | 2018-04-04 | ロードポート及びefem |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019186293A JP2019186293A (ja) | 2019-10-24 |
JP7125591B2 true JP7125591B2 (ja) | 2022-08-25 |
Family
ID=68171752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018072021A Active JP7125591B2 (ja) | 2018-04-04 | 2018-04-04 | ロードポート及びefem |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7125591B2 (zh) |
KR (1) | KR20190116103A (zh) |
CN (1) | CN110349893B (zh) |
TW (1) | TWI803613B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7422577B2 (ja) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | ロードポート及び制御方法 |
CN112242338B (zh) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | 能够保持foup的盖部的洁净度的装载端口及设备前端模块 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118278A (ja) | 2011-12-02 | 2013-06-13 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
WO2017022431A1 (ja) | 2015-08-04 | 2017-02-09 | シンフォニアテクノロジー株式会社 | ドア開閉システムおよびドア開閉システムを備えたロードポート |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5169272A (en) * | 1990-11-01 | 1992-12-08 | Asyst Technologies, Inc. | Method and apparatus for transferring articles between two controlled environments |
JP6024980B2 (ja) | 2012-10-31 | 2016-11-16 | Tdk株式会社 | ロードポートユニット及びefemシステム |
US9136149B2 (en) * | 2012-11-16 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Loading port, system for etching and cleaning wafers and method of use |
JP2015115517A (ja) * | 2013-12-13 | 2015-06-22 | シンフォニアテクノロジー株式会社 | 基板搬送装置及びefem |
JP6291878B2 (ja) * | 2014-01-31 | 2018-03-14 | シンフォニアテクノロジー株式会社 | ロードポート及びefem |
JP2016178133A (ja) * | 2015-03-19 | 2016-10-06 | シンフォニアテクノロジー株式会社 | ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法 |
KR101739518B1 (ko) | 2015-08-20 | 2017-05-26 | 비알 컨설팅 인코포레이티드 | 황칠나무의 추출물을 포함하는 조성물 |
JP6687840B2 (ja) * | 2016-03-29 | 2020-04-28 | シンフォニアテクノロジー株式会社 | ロードポート |
-
2018
- 2018-04-04 JP JP2018072021A patent/JP7125591B2/ja active Active
-
2019
- 2019-04-03 KR KR1020190039226A patent/KR20190116103A/ko active IP Right Grant
- 2019-04-03 TW TW108112022A patent/TWI803613B/zh active
- 2019-04-04 CN CN201910269198.6A patent/CN110349893B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118278A (ja) | 2011-12-02 | 2013-06-13 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
WO2017022431A1 (ja) | 2015-08-04 | 2017-02-09 | シンフォニアテクノロジー株式会社 | ドア開閉システムおよびドア開閉システムを備えたロードポート |
Also Published As
Publication number | Publication date |
---|---|
TW201943007A (zh) | 2019-11-01 |
TWI803613B (zh) | 2023-06-01 |
CN110349893A (zh) | 2019-10-18 |
KR20190116103A (ko) | 2019-10-14 |
JP2019186293A (ja) | 2019-10-24 |
CN110349893B (zh) | 2023-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7100243B2 (ja) | 排気ノズルユニット、ロードポート、及びefem | |
JP7164824B2 (ja) | ドア開閉システムおよびドア開閉システムを備えたロードポート | |
JP7193748B2 (ja) | ロードポート | |
JP6536090B2 (ja) | 搬送装置 | |
JP6291878B2 (ja) | ロードポート及びefem | |
WO2016147980A1 (ja) | ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法 | |
KR102687869B1 (ko) | 로드 포트 | |
JP7125591B2 (ja) | ロードポート及びefem | |
JP2018110246A (ja) | Efem | |
TWI850913B (zh) | 裝載埠 | |
JP2020109868A (ja) | ロードポート及び搬送室 | |
JP2019197912A (ja) | ロードポート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210209 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220120 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220325 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220712 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220725 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7125591 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |