JP7124437B2 - Optical member for sealing and method for manufacturing optical member for sealing - Google Patents

Description

The present invention relates to an optical member for sealing and a method for manufacturing the optical member for sealing .

For example, there is known an optical member that closes an opening of a housing that houses an optical device such as an optical sensor. The optical members disclosed in Patent Documents 1 and 2 are provided with an antireflection layer that enhances light transmittance. In some cases, the antireflection layer of the optical member is provided with a metal layer that serves as an attachment portion when the optical member is attached to a housing using a bonding material such as solder. The metal layer of the optical member of the above document is provided on the antireflection layer.

JP 2005-079146 A JP 2013-219237 A

In a conventional optical member having an antireflection layer and a metal layer as described above, the outer peripheral edge of the antireflection layer is exposed. When the outer peripheral edge of the antireflection layer is exposed, the antireflection layer may easily peel off from the outer peripheral edge of the antireflection layer.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a sealing optical member capable of easily protecting the outer peripheral edge of the antireflection layer in an optical member having an antireflection layer and a metal layer. An object of the present invention is to provide a member and a method for manufacturing an optical member for sealing .

An optical member for solving the above problems is an optical member having a light transmitting portion, comprising: a substrate having a first principal surface and a second principal surface opposite to the first principal surface; An antireflection layer provided in a portion excluding an outer peripheral edge, and a metal layer having a frame shape along the outer peripheral edge of the antireflection layer in a plan view of the substrate, wherein the metal layer is the antireflection layer. a first bonding portion bonded to a principal surface and a second bonding portion bonded to the first principal surface of the substrate, wherein the first bonding portion and the second bonding portion are continuous; there is

According to this configuration, the outer peripheral edge of the antireflection layer can be covered with the metal layer having a layer structure in which the first joint portion and the second joint portion are continuous. That is, the metal layer can be used to cover the outer periphery of the antireflection layer without separately providing a protective layer different from the metal layer.

In the above optical member, the outer peripheral edge of the metal layer is preferably located inside the outer peripheral edge of the substrate when the substrate is viewed from above.
According to this configuration, for example, even if the outer peripheral edge of the substrate rubs against another member, the outer peripheral edge of the metal layer does not easily rub against the other member.

In the above optical member, it is preferable that the width dimension of the second joint portion in the direction along the first main surface is larger than the width dimension of the first joint portion.
According to this configuration, it is possible to ensure a wider contact area between the substrate and the metal layer.

In the above optical member, the substrate is a glass substrate or a sapphire substrate, and has a circular shape in plan view. A second antireflection layer provided on the second main surface may be further provided. With this configuration, it is possible to further increase the light transmittance of the optical member.

A substrate manufacturing method for solving the above-described problem is a substrate manufacturing method for use in an optical member having a light transmitting portion, wherein a plurality of first plate pieces having a first shape are laminated to form a first columnar body. a second step of forming a second columnar body composed of a plurality of second plate pieces having a second shape by grinding the outer peripheral surface of the first columnar body; and a third step of obtaining a substrate composed of the second plate pieces by separating the plurality of second plate pieces forming the second columnar body.

In the method for manufacturing a substrate, the plurality of first plate pieces are glass plate pieces or sapphire plate pieces, and the plurality of glass plate pieces or the plurality of sapphire pieces constituting the first columnar bodies in the first step. The plate pieces are preferably joined by optical contact. According to this method, the shape of the first columnar body can be easily maintained.

In the substrate manufacturing method described above, it is preferable that the plurality of first plate pieces are glass plate pieces formed using an overflow down-draw method.
According to this method, since both main surfaces of the glass plate piece, which is the first plate piece, have high smoothness, the bonding strength of the optical contact can be easily increased.

In the substrate manufacturing method, the first shape is a shape having corners in a plan view, and in the second step, at least the corners of the plurality of first plate pieces forming the first columnar bodies are formed. It can be ground.

As described above, a substrate having a shape in which the corners are ground can be easily obtained from the first plate piece having the corners.
In the above substrate manufacturing method, the first shape may be rectangular in plan view, and the second shape may be circular in plan view.

According to this method, for example, the plurality of first plate pieces can be efficiently obtained by cutting the plate material along grid-like cutting lines. A circular substrate in a plan view can be obtained from the plurality of first plate pieces thus obtained.

A method of manufacturing an optical member that solves the above problems is a method of manufacturing an optical member having a light transmitting portion, wherein a plurality of first plate pieces having a first shape are laminated to form a first columnar body. a first step; a second step of grinding the outer peripheral surface of the first columnar body to form a second columnar body composed of a plurality of second plate pieces having a second shape; A substrate is obtained by separating the plurality of second plate pieces constituting the body to obtain a substrate comprising the second plate pieces and having a first main surface and a second main surface opposite to the first main surface. a fourth step of providing an antireflection layer on a portion of the first main surface of the substrate excluding an outer peripheral edge; and a fifth step of providing a metal layer on the substrate provided with the antireflection layer, In the fifth step, the metal layer is formed so as to have a frame shape along the outer periphery of the antireflection layer in plan view of the substrate, and the metal layer is bonded to the main surface of the antireflection layer. The structure includes a first joint portion and a second joint portion joined to the first main surface of the substrate, and the first joint portion and the second joint portion are continuous.

According to the optical member of one aspect of the present invention, the outer peripheral edge of the antireflection layer can be easily protected in the optical member having the antireflection layer and the metal layer. According to the method for manufacturing a substrate and the method for manufacturing an optical member, which are other aspects of the present invention, an optical member can be preferably manufactured.

1 is a plan view schematically showing an optical member in an embodiment; FIG. FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1; FIG. 3 is a cross-sectional view schematically showing how the optical member is used; (a) is a flow chart showing a method for manufacturing a substrate, and (b) is a flow chart showing a method for manufacturing an optical member. It is explanatory drawing explaining manufacture of a 1st plate piece. 1 shows a substrate manufacturing method, (a) is an explanatory diagram of the first step, (b) is an explanatory diagram of the second step, and (c) and (d) are explanatory diagrams of the third step. be. It is a sectional view showing a modification of an optical member typically.

Embodiments of an optical member, a substrate manufacturing method, and an optical member manufacturing method will be described below with reference to the drawings. In the drawings, for convenience of explanation, part of the configuration may be exaggerated or simplified. Also, the dimensional ratio of each part may differ from the actual one.

As shown in FIGS. 1 and 2, the optical member 11 has a light transmitting portion 11a, a substrate 12, an antireflection layer 13 provided on a portion (central portion) of the substrate 12 excluding the outer periphery, and the substrate and a metal layer 14 having a frame shape along the outer periphery of the antireflection layer 13 when viewed from the thickness direction of the antireflection layer 12 .

The substrate 12 has a first major surface 12a and a second major surface 12b opposite the first major surface 12a. Specific examples of the substrate 12 include a glass substrate, a sapphire substrate, a resin substrate, and the like. Substrate 12 is preferably a glass substrate or a sapphire substrate. The outer shape of the substrate 12 includes, for example, a circular shape, a polygonal shape (such as a square shape), and the like in a plan view. The thickness of the substrate 12 is preferably in the range of 0.1 mm or more and 1 mm or less, more preferably in the range of 0.2 mm or more and 0.5 mm or less.

The antireflection layer 13 constitutes a part of the light transmitting portion 11a. The antireflection layer 13 can be composed of a well-known dielectric multilayer film. The dielectric multilayer film has a structure in which a high refractive index film and a low refractive index film having a lower refractive index than the high refractive index film are alternately laminated. Examples of the high refractive index film include at least one selected from niobium oxide, titanium oxide, tantalum oxide, lanthanum oxide, tungsten oxide, and zirconium oxide. Examples of the low refractive index film include at least one selected from silicon oxide, aluminum oxide, and magnesium fluoride.

In the dielectric multilayer film, the total number of laminated layers of the high refractive index film and the low refractive index film is, for example, 4 or more and 60 or less. A gradation layer in which the refractive index gradually decreases or increases from the high refractive index film to the low refractive index film may be provided between the high refractive index film and the low refractive index film. Also, a graded layer whose refractive index gradually decreases or increases from the dielectric multilayer film toward the substrate 12 may be provided between the substrate 12 and the dielectric multilayer film. In addition to the high refractive index film and the low refractive index film, in the laminated structure of the dielectric multilayer film, a medium refractive index film having a lower refractive index than the high refractive index film and a higher refractive index than the low refractive index film is provided. may

As shown in FIG. 3, the metal layer 14 of the optical member 11 is configured as a mounting portion 11b for mounting the optical member 11 to the housing. The metal layer 14 of the optical member 11 is formed in a continuous frame shape so as to surround the opening of the housing. In the optical member 11, a region inside the metal layer 14 in plan view is configured as a light transmitting portion 11a.

The metal layer 14 of the optical member 11 is composed of three layers, ie, a base layer, an intermediate layer, and a surface layer, in order from the substrate 12 side. Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. Examples of metals used for the intermediate layer include Ni, Pt, and Pd. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 14 may be a simple substance or an alloy.

As shown in FIGS. 1 and 2, the metal layer 14 of the optical member 11 includes a first bonding portion 14a bonded to the main surface (upper surface) of the antireflection layer 13 and a first bonding portion 14a bonded to the first main surface 12a of the substrate 12. and a second joint portion 14b to be joined. The metal layer 14 of the optical member 11 has a structure in which a first joint portion 14a and a second joint portion 14b are continuous. The outer peripheral edge ME1 of the metal layer 14 is positioned inside the outer peripheral edge BE1 of the substrate 12 (on the center side of the substrate 12) when the substrate 12 is viewed from above. A protrusion length L1 by which the outer peripheral surface of the substrate 12 protrudes from the outer peripheral edge ME1 of the metal layer 14 is preferably in the range of 0.01 mm or more and 0.1 mm or less, more preferably 0.03 mm or more and 0.03 mm or more. 07 mm or less.

The width dimension W2 of the second joint portion 14b in the direction along the first main surface 12a of the substrate 12 is, for example, within the range of 0.3 to 3 times the width dimension W1 of the first joint portion 14a. is preferred. In the metal layer 14 of the optical member 11, it is more preferable that the width dimension W2 of the second joint portion 14b is larger than the width dimension W1 of the first joint portion 14a.

Next, the usage method and application of the optical member will be described.
As shown in FIG. 3, the optical member 11 is attached to the opening of the housing C to seal the opening of the housing C. As shown in FIG. Specifically, the metal layer 14 of the optical member 11 is bonded to the opening of the housing C using the bonding material BM. As the bonding material BM, a commercially available solder material (for example, reflow solder material) or brazing material can be used. Examples of the bonding material BM include Au--Sn alloy, Pb--Sn alloy, and Au--Ge alloy. The optical member 11 is attached to the housing C using a bonding material BM so as to keep the inside of the housing C airtight. Examples of the material of the housing C include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, alloys such as Fe—Ni—Co alloy, Cu—W alloy, Kovar (registered trademark), and the like. A metal layer can be provided in the opening of the housing C as required. For example, when the casing C is made of ceramics, a metal layer containing a metal element constituting the bonding material BM is provided in the opening of the casing C to increase the adhesion (bonding strength) with the bonding material. can be done.

Although not shown, the housing C accommodates optical devices such as a laser module, an optical sensor, an imaging device, and an optical switch.
An electronic component package can be obtained by using the optical member 11 as described above. That is, the electronic component package includes a housing C, an optical device housed in the housing C, and an optical member 11 attached to the housing C. As shown in FIG.

Next, a method for manufacturing the substrate 12 will be described.
As shown in FIG. 4A, in the method for manufacturing the substrate 12, first, step S10 of preparing the first plate piece is performed. As shown in FIG. 5, in the preparation of the first plate piece in step S10, the plate material 15 serving as the base material is cut along grid-like cutting lines indicated by broken lines in FIG. As shown, a plurality of first plate pieces 16 having a quadrangular (square) shape in plan view are formed.

As shown in FIG. 6A, in the method for manufacturing the substrate 12, a first step of stacking the plurality of first plate pieces 16 is performed (step S11). As shown in FIG. 6(b), in the first process of step S11, the first columnar body 17 (prismic body) is formed by laminating the first plate pieces 16. As shown in FIG.

In the first process of step S11, when the first plate piece 16 is a glass plate piece or a sapphire plate piece and both main surfaces of these plate pieces have smoothness that allows optical contact, the plurality of plate pieces are brought into optical contact. can be joined to form the first columnar body 17 . In addition, since the glass plate piece formed by the overflow down-draw method has high smoothness on both main surfaces, even if the polishing of both main surfaces is simplified or omitted, the plurality of pieces constituting the first columnar body 17 can be can be joined by optical contact.

As shown in FIG. 6B, in the method for manufacturing the substrate 12, a second step of grinding the outer peripheral surface of the first columnar body 17 is performed (step S12). As shown in FIG. 6C, in the second step of step S12, the second columnar body 19 is formed by a plurality of second plate pieces 18 having a circular shape in plan view.

As shown in FIG. 6(b), in the second step, the grinding blade BL is brought into contact with the outer peripheral surface of the first columnar body 17 rotated about the central axis, whereby the outer peripheral surface of the first columnar body 17 (second 1 corners of the columnar body 17) are ground. The first columnar body 17 can be rotated around the central axis by, for example, rotationally driving a support that clamps the upper and lower surfaces of the first columnar body 17 . In the second step, it is also possible to grind the outer peripheral surface of the first columnar body 17 by moving the grinding blade BL along the circumferential direction of the first columnar body 17 . That is, in the second step, the first columnar body 17 is ground by relatively moving the first columnar body 17 and the grinding blade BL.

As shown in FIGS. 6(c) and 6(d), in the method for manufacturing the substrate 12, a third step of separating the plurality of second plate pieces 18 forming the second columnar bodies 19 is performed (step S13). . In the third process of step S13, a plurality of substrates 12 made up of second plate pieces 18 are obtained.

Next, a method for manufacturing the optical member 11 will be described.
As shown in FIG. 4B, in the method for manufacturing the optical member 11, a fourth step of forming the antireflection layer 13 on the substrate 12 obtained by the method for manufacturing the substrate 12 is performed (step S14). In the fourth process of step S14, the dielectric multilayer film described above is formed on the first main surface 12a of the substrate 12. As shown in FIG. Methods for forming a dielectric multilayer film include, for example, a sputtering method, a vacuum deposition method, a vacuum deposition method using ion assist or ion plating, and a CVD method. Among these film forming methods, the vacuum vapor deposition method using ion assist or the sputtering method is preferred because the thickness of each layer can be controlled with high precision and a dielectric multilayer film with stable film quality can be obtained. preferable. In order to form the antireflection layer 13 at a predetermined position on the first main surface 12a of the substrate 12, a mask covering the predetermined position (outer peripheral portion) of the first main surface 12a of the substrate 12 may be used.

Next, in the method for manufacturing the optical member 11, the fifth step of providing the metal layer 14 on the substrate 12 provided with the antireflection layer 13 is performed (step S15). In the fifth step of step S15, a metal film is formed on a part of the first main surface 12a side of the substrate 12 provided with the antireflection layer 13 so as to arrange the metal layer 14 as described above. Methods for forming a metal film include, for example, a sputtering method, a vacuum deposition method, a vacuum deposition method using ion assist or ion plating, and a CVD method.

In order to form the metal layer 14 at a predetermined position of the substrate 12 provided with the antireflection layer 13, a mask covering the predetermined positions of the substrate 12 and the antireflection layer 13 may be used.
Next, the operation and effects of this embodiment will be described.

(1) The optical member 11 having the light transmitting portion 11a includes the substrate 12, the antireflection layer 13 provided on the first main surface 12a of the substrate 12, and the antireflection layer 13 along the outer peripheral edge of the antireflection layer 13 in plan view of the substrate 12. and a metal layer 14 having a frame shape. The metal layer 14 of the optical member 11 has a first joint portion 14a joined to the main surface of the antireflection layer 13 and a second joint portion 14b joined to the first main surface 12a of the substrate 12. . In the metal layer 14 of the optical member 11, the first joint portion 14a and the second joint portion 14b are continuous.

According to this configuration, the outer periphery of the antireflection layer 13 can be covered with the metal layer 14 having a layer structure in which the first joint portion 14a and the second joint portion 14b are continuous. That is, the metal layer 14 can be used to cover the outer periphery of the antireflection layer 13 without providing a separate protective layer different from the metal layer 14 . Therefore, in the optical member 11 having the antireflection layer 13 and the metal layer 14, the outer peripheral edge of the antireflection layer 13 can be easily protected. As a result, peeling of the antireflection layer 13 can be suppressed.

Also, the metal layer 14 of the optical member 11 is provided over the main surface (outer surface) of the antireflection layer 13 , side surfaces of the antireflection layer 13 , and the first main surface 12 a of the substrate 12 . Therefore, for example, the contact area of the metal layer 14 becomes wider than when the metal layer 14 having a predetermined width in plan view is provided only on the main surface of the antireflection layer 13 or only on the first main surface 12a of the substrate 12. Therefore, the adhesion strength of the metal layer 14 can be increased.

(2) The outer peripheral edge ME1 of the metal layer 14 of the optical member 11 is located inside the outer peripheral edge BE1 of the substrate 12 when viewed from above. In this case, for example, even if the outer peripheral edge BE1 of the substrate 12 rubs against another member, the outer peripheral edge ME1 of the metal layer 14 does not easily rub against the other member. Therefore, peeling of the metal layer 14 can be suppressed.

(3) In the metal layer 14 of the optical member 11, when the width dimension W2 of the second joint portion 14b is larger than the width dimension W1 of the first joint portion 14a, the adhesion area between the substrate 12 and the metal layer 14 is increased. can be secured. Therefore, the adhesion of the metal layer 14 to the substrate 12 can be used to prevent the metal layer 14 from peeling off.

(4) The method for manufacturing the substrate 12 includes a first step of forming the first columnar bodies 17 by laminating a plurality of first plate pieces 16 having a first shape, and and a second step of forming a second columnar body 19 composed of a plurality of second plate pieces 18 having a second shape by grinding. The method for manufacturing the substrate 12 further includes a third step of obtaining the substrate 12 composed of the second plate pieces 18 by separating the plurality of second plate pieces 18 forming the second columnar bodies 19 .

According to this method, for example, by preparing first plate pieces 16 having different dimensions and different external shapes in advance, it is possible to manufacture second plate pieces 18 (substrates 12) having different dimensions and different external shapes.

(5) In the method for manufacturing the substrate 12, the plurality of first plate pieces 16 are glass plate pieces or sapphire plate pieces, and the plurality of glass plate pieces or sapphire plate pieces forming the first columnar bodies 17 in the first step. are preferably joined by optical contact. In this case, the shape of the first columnar body 17 can be easily maintained. The shape of the first columnar body 17 may be maintained by pressing the top surface of the top layer and the bottom surface of the bottom layer of the plurality of first plate pieces 16 in the stacking state and sandwiching them in the stacking direction. Moreover, the pressing and clamping may be performed in a state where they are joined by optical contact.

(6) In the method for manufacturing the substrate 12, the plurality of first plate pieces 16 are preferably glass plate pieces formed using the overflow down-draw method. In this case, since both main surfaces of the glass plate piece, which is the first plate piece 16, have high smoothness, the bonding strength of the optical contact can be easily increased.

(7) In the method for manufacturing the substrate 12, the first shape of the plurality of first plate pieces 16 is a shape having corners in a plan view. At least the corners of one plate piece 16 are ground. From the first plate piece 16 having such corners, it is possible to easily obtain the substrate 12 having the corners ground.

(8) In the method for manufacturing the substrate 12, the first shape is rectangular in plan view, and the second shape is circular in plan view. In this case, for example, the plurality of first plate pieces 16 can be efficiently obtained by cutting the plate material 15 along grid-like cutting lines. A circular substrate 12 in a plan view can be obtained from the plurality of first plate pieces 16 thus obtained.

(Change example)
This embodiment can be implemented with the following modifications. This embodiment and the following modified examples can be implemented in combination with each other within a technically consistent range.

- As shown in FIG. A second antireflection layer 20 may be further provided. In this optical member 11, the second antireflection layer 20 is arranged at a position facing the first antireflection layer 13 in the thickness direction of the substrate 12, and the substrate 12, the first antireflection layer 13, and the second antireflection layer 13 The light transmitting portion 11a is composed of the anti-reflection layer 20 of . In this case, it is possible to further improve the light transmittance of the optical member 11 . Therefore, the performance of the optical device accommodated in the housing C can be exhibited more effectively.

In the optical member 11, the width dimension W2 of the second joint portion 14b in the metal layer 14 may be the same as the width dimension W1 of the first joint portion 14a, or may be larger than the width dimension W1 of the first joint portion 14a. It can be small. When the width dimension W2 of the second joint portion 14b is smaller than the width dimension W1 of the first joint portion 14a, the substrate 12 can be easily attached to and detached from the film forming jig using the outer peripheral portion thereof. Thereby, for example, the productivity of the optical member 11 can be improved.

In the optical member 11, the outer peripheral edge ME1 of the metal layer 14 is located inside the outer peripheral edge BE1 of the substrate 12 when viewed from above. can also be changed to a position overlapping with the outer peripheral edge BE1 of .

- In the method of manufacturing the substrate 12 described above, the first plate piece 16 having the first shape may be formed by punching the plate material 15 . Further, the substrate 12 is changed to a base material having a columnar shape and a cross section of the first shape, and the base material is cut along the radial direction to form the first plate piece 16 having the first shape. may

- The substrate 12 can be obtained by a different manufacturing method than the method for manufacturing the substrate 12 described above. For example, the plate member 15 may be provided with the antireflection layer 13 in advance. That is, after forming the first plate piece 16 with the antireflection layer 13 by cutting the plate material 15 with the antireflection layer 13, by grinding the outer peripheral surface of the first plate piece 16 with the antireflection layer 13, A substrate 12 with an antireflection layer 13 can be obtained. By providing the metal layer 14 on the substrate 12 with the antireflection layer 13 thus obtained, the optical member 11 can be obtained. The optical member 11 can also be obtained by using the plate material 15 provided with the metal layer 14 in addition to the antireflection layer 13 . However, if the antireflection layer 13 or the like is provided on the plate 15 in advance, the antireflection layer 13 may peel off from the plate 15 when the plate 15 with the antireflection layer 13 is cut. Manufacturing methods are preferred.

- In the manufacturing method of the board|substrate 12, the plate glass shape|molded using methods other than the overflow down-draw method may be sufficient as the glass plate piece which is the 1st plate piece 16. FIG. Methods other than the overflow downdraw method include, for example, the rollout method, the redraw method, the slot downdraw method, the float method, and the like. When glass plate pieces obtained by various methods are joined by optical contact to form the first columnar body 17, both main surfaces of the glass plate pieces may be polished until they become smooth surfaces enabling optical contact. Further, as the smoothness of both main surfaces of the glass plate pieces is increased, the bonding strength between the glass plate pieces using optical contact can be increased.

- In the manufacturing method of the board|substrate 12, the shape of the 1st plate piece 16 may be polygonal shapes, such as triangular shape and hexagonal shape, and circular shape may be sufficient as it. The shape of the second plate piece 18 can also be changed according to various shapes of substrates (optical members).

DESCRIPTION OF SYMBOLS 11... Optical member 11a... Light transmission part 12... Substrate 12a... First main surface 12b... Second main surface 13... First antireflection layer 14... Metal layer 14a... First joining part, 14b... Second joint portion 16... First plate piece 17... First columnar body 18... Second plate piece 19... Second columnar body 20... Second antireflection layer ME1, BE1... Periphery edge , W1, W2 . . . width dimensions.

Claims (6)

An optical member for sealing having a light transmitting portion,
a substrate having a first major surface and a second major surface opposite the first major surface;
an antireflection layer provided on a portion of the first main surface excluding the outer periphery;
a metal layer having a frame shape along the outer peripheral edge of the antireflection layer in plan view of the substrate,
The metal layer is configured as an attachment portion attached to the housing of the electronic component package,
The metal layer has a first bonding portion bonded to the main surface of the antireflection layer and a second bonding portion bonded to the first main surface of the substrate, and the first bonding portion and An optical member for sealing , wherein the second joint portion is continuous with the second joint portion. 2. The optical member for sealing according to claim 1, wherein the outer peripheral edge of the metal layer is located inside the outer peripheral edge of the substrate when the substrate is viewed from above. 3. The sealing material according to claim 1, wherein the width dimension of the second joint portion in the direction along the first main surface is larger than the width dimension of the first joint portion. optical components. The substrate is a glass substrate or a sapphire substrate and has a circular shape in plan view,
If the antireflection layer provided on the first main surface is the first antireflection layer, the antireflection layer further includes a second antireflection layer provided on the second main surface. 4. The optical member for sealing according to any one of items 3. 5. The sealing material according to any one of claims 1 to 4, wherein the metal layer is composed of three layers, an underlying layer, an intermediate layer, and a surface layer, in order from the substrate side. optical components. A method for manufacturing an optical member for sealing having a light transmitting portion,
a first step of forming a first columnar body by stacking a plurality of first plate pieces having a first shape;
a second step of grinding the outer peripheral surface of the first columnar body to form a second columnar body composed of a plurality of second plate pieces having a second shape;
By separating the plurality of second plate pieces forming the second columnar body, a substrate comprising the second plate pieces and having a first principal surface and a second principal surface opposite to the first principal surface a third step of obtaining
a fourth step of providing an antireflection layer on a portion of the first main surface of the substrate excluding an outer peripheral edge;
A fifth step of providing a metal layer configured as a mounting portion to be attached to the housing of the electronic component package on the substrate provided with the antireflection layer,
In the fifth step, the metal layer is formed so as to have a frame shape along the outer peripheral edge of the antireflection layer in plan view of the substrate,
a first joint where the metal layer is joined to the main surface of the antireflection layer; and a second joint where the metal layer is joined to the first main surface of the substrate, and the first joint and the second joint portion are continuous with each other.

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