JP2019201173A - Optical member, manufacturing method of substrate, and manufacturing method of the optical member - Google Patents

Abstract

To provide an optical member having an antireflection layer and a metal layer, capable of easily protecting an outer peripheral edge in the antireflection layer.SOLUTION: An optical member 11 comprises: a substrate 12 having a light transmission part 11a and a first main surface 12a and a second main surface 12b opposite to the first main surface 12a; an antireflection layer 13 provided at a part excluding an outer peripheral edge of the first main surface 12a; and a metal layer 14 having a frame shape along the outer peripheral edge of the antireflection layer 13 in a plan view of the substrate 12. The metal layer 14 of the optical member 11, includes: a first bonding part 14a bonded to a main surface of the antireflection layer 13; and a second bonding part 14b bonded to the first main surface 12a of the substrate 12, and includes a layer structure in which the first bonding part 14a and the second bonding part 14b are continued.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an optical member, a substrate manufacturing method, and an optical member manufacturing method.

  For example, an optical member that closes an opening of a housing that houses an optical device such as an optical sensor is known. The optical members disclosed in Patent Document 1 and Patent Document 2 include an antireflection layer that enhances light transmittance. The antireflection layer of the optical member may be provided with a metal layer that serves as an attachment portion when attached to the housing using a bonding material such as solder. The metal layer of the optical member of the above document is provided on the antireflection layer.

JP 2005-079146 A JP 2013-219237 A

  In the optical member having the conventional antireflection layer and metal layer as described above, the outer peripheral edge of the antireflection layer is exposed. If the outer peripheral edge of the antireflection layer is exposed, the antireflection layer may be easily peeled off from the outer peripheral edge of the antireflection layer.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an optical member that can easily protect the outer peripheral edge of an antireflection layer in an optical member having an antireflection layer and a metal layer. It is providing the manufacturing method of the board | substrate suitable for an optical member, and the manufacturing method of an optical member.

  An optical member that solves the above problem is an optical member having a light transmission portion, and includes a substrate having a first main surface and a second main surface opposite to the first main surface, and the first main surface. An antireflection layer provided in a portion excluding the outer periphery, and a metal layer having a frame shape along the outer periphery of the antireflection layer in a plan view of the substrate, and the metal layer is formed of the antireflection layer. A first joint that is joined to the main surface; and a second joint that is joined to the first main surface of the substrate; and the first joint and the second joint are continuous. Yes.

  According to this configuration, the outer peripheral edge of the antireflection layer can be covered with the metal layer having a layer structure in which the first joint portion and the second joint portion are continuous. That is, the outer peripheral edge of the antireflection layer can be covered using the metal layer without separately providing a protective layer different from the metal layer.

The said optical member WHEREIN: It is preferable that the outer periphery of the said metal layer is located inside the outer periphery of the said board | substrate by planar view of the said board | substrate.
According to this configuration, for example, even if the outer peripheral edge of the substrate rubs against other members, the outer peripheral edge of the metal layer is less likely to rub against other members.

In the optical member, it is preferable that a width dimension of the second joint portion in a direction along the first main surface is larger than a width dimension of the first joint portion.
According to this structure, the contact | adherence area of a board | substrate and a metal layer can be ensured more widely.

  In the optical member, the substrate is a glass substrate or a sapphire substrate, has a circular shape in plan view, and the antireflection layer provided on the first main surface is the first antireflection layer, You may further provide the 2nd antireflection layer provided in the 2nd principal surface. According to this configuration, it is possible to further increase the light transmittance of the optical member.

  A method of manufacturing a substrate that solves the above problem is a method of manufacturing a substrate that is used for an optical member having a light transmission portion, in which a plurality of first plate pieces having a first shape are stacked to form a first columnar body. A second step of forming a second columnar body composed of a plurality of second plate pieces having a second shape by grinding an outer peripheral surface of the first columnar body, And a third step of obtaining a substrate made of the second plate piece by separating the plurality of second plate pieces constituting the second columnar body.

  In the substrate manufacturing method, the plurality of first plate pieces are glass plate pieces or sapphire plate pieces, and the plurality of glass plate pieces or the plurality of sapphire pieces constituting the first columnar body in the first step. The plate pieces are preferably joined by optical contact. According to this method, the shape of the first columnar body can be easily maintained.

In the substrate manufacturing method, the plurality of first plate pieces are preferably glass plate pieces formed using an overflow down draw method.
According to this method, since the smoothness of both main surfaces of the glass plate piece which is the first plate piece is high, the bonding strength of the optical contact can be easily increased.

  In the substrate manufacturing method, the first shape is a shape having a corner portion in a plan view, and in the second step, at least corner portions of the plurality of first plate pieces constituting the first columnar body are formed. You may grind.

A substrate having a shape obtained by grinding the corner portion can be easily obtained from the first plate piece having the corner portion as described above.
In the method for manufacturing a substrate, the first shape may be a quadrangular shape in plan view, and the second shape may be a circular shape in plan view.

  According to this method, for example, a plurality of first plate pieces can be efficiently obtained by cutting the plate material along a grid-like cutting line. A circular substrate can be obtained in plan view from the plurality of first plate pieces thus obtained.

  The manufacturing method of the optical member which solves the said subject is a manufacturing method of the optical member which has a light transmissive part, Comprising: The 1st columnar body is formed by laminating | stacking several 1st board pieces which have a 1st shape. A first step, a second step of forming a second columnar body composed of a plurality of second plate pieces having a second shape by grinding an outer peripheral surface of the first columnar body, and the second columnar shape. Separating the plurality of second plate pieces constituting the body to obtain a substrate having the second main surface which is composed of the second plate pieces and which is opposite to the first main surface and the first main surface; And a fourth step of providing an antireflection layer on a portion of the substrate excluding the outer peripheral edge of the first main surface, and a fifth step of providing a metal layer on the substrate provided with the antireflection layer, 5th process WHEREIN: The said metal so that it may become a frame shape along the outer periphery of the said antireflection layer by planar view of the said board | substrate. And the metal layer has a first joint joined to the main surface of the antireflection layer, and a second joint joined to the first main surface of the substrate, and The first joint and the second joint are continuous.

  According to the optical member which is one embodiment of the present invention, the outer peripheral edge of the antireflection layer can be easily protected in the optical member having the antireflection layer and the metal layer. According to the method for manufacturing a substrate and the method for manufacturing an optical member according to another aspect of the present invention, the optical member can be preferably manufactured.

It is a top view which shows typically the optical member in embodiment. FIG. 2 is a cross-sectional view taken along line 2-2 in FIG. It is sectional drawing which shows the use condition of an optical member typically. (A) is a flowchart which shows the manufacturing method of a board | substrate, (b) is a flowchart which shows the manufacturing method of an optical member. It is explanatory drawing explaining manufacture of a 1st board piece. The manufacturing method of a board | substrate is shown, (a) is explanatory drawing of a 1st process, (b) is explanatory drawing of a 2nd process, (c) And (d) is explanatory drawing of a 3rd process. is there. It is sectional drawing which shows the example of a change of an optical member typically.

  Hereinafter, embodiments of an optical member, a substrate manufacturing method, and an optical member manufacturing method will be described with reference to the drawings. Note that in the drawings, for convenience of explanation, some components may be exaggerated or simplified. Further, the dimensional ratio of each part may be different from the actual one.

  As shown in FIGS. 1 and 2, the optical member 11 includes a light transmitting portion 11 a, a substrate 12, an antireflection layer 13 provided on a portion (center portion) excluding the outer peripheral edge on the substrate 12, and a substrate 12 and a metal layer 14 having a frame shape along the outer peripheral edge of the antireflection layer 13 when viewed from the thickness direction.

  The substrate 12 has a first main surface 12a and a second main surface 12b opposite to the first main surface 12a. Specific examples of the substrate 12 include a glass substrate, a sapphire substrate, and a resin substrate. The substrate 12 is preferably a glass substrate or a sapphire substrate. Examples of the outer shape of the substrate 12 include a circular shape and a polygonal shape (square shape, etc.) in a plan view. The thickness of the substrate 12 is preferably in the range of 0.1 mm to 1 mm, and more preferably in the range of 0.2 mm to 0.5 mm.

  The antireflection layer 13 constitutes a part of the light transmission part 11a. The antireflection layer 13 can be composed of a known dielectric multilayer film. The dielectric multilayer film has a structure in which a high refractive index film and a low refractive index film having a refractive index lower than that of the high refractive index film are alternately stacked. Examples of the high refractive index film include at least one selected from niobium oxide, titanium oxide, tantalum oxide, lanthanum oxide, tungsten oxide, and zirconium oxide. Examples of the low refractive index film include at least one selected from silicon oxide, aluminum oxide, and magnesium fluoride.

  In the dielectric multilayer film, the total number of layers of the high refractive index film and the low refractive index film is, for example, 4 layers or more and 60 layers or less. A gradual layer whose refractive index gradually decreases or gradually increases from the high refractive index film to the low refractive index film may be provided between the high refractive index film and the low refractive index film. Further, a transition layer whose refractive index gradually decreases or gradually increases from the dielectric multilayer film toward the substrate 12 may be provided between the substrate 12 and the dielectric multilayer film. In addition, in the multilayer structure of dielectric multilayer films, in addition to the high refractive index film and the low refractive index film, a medium refractive index film having a refractive index smaller than that of the high refractive index film and larger than that of the low refractive index film is provided. May be.

  As shown in FIG. 3, the metal layer 14 of the optical member 11 is configured as an attachment portion 11b for attaching the optical member 11 to the housing. The metal layer 14 of the optical member 11 is formed in a continuous frame shape so as to surround the opening of the housing. In the optical member 11, a region inside the metal layer 14 in a plan view is configured as the light transmission portion 11a.

  The metal layer 14 of the optical member 11 is composed of three layers of a base layer, an intermediate layer, and a surface layer in order from the substrate 12 side. Examples of the metal used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. Examples of the metal used for the intermediate layer include Ni, Pt, and Pd. Examples of the metal used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 14 may be a simple substance or an alloy.

  As shown in FIGS. 1 and 2, the metal layer 14 of the optical member 11 is formed on the first joint surface 14 a joined to the main surface (upper surface) of the antireflection layer 13 and the first main surface 12 a of the substrate 12. It has the 2nd junction part 14b joined. The metal layer 14 of the optical member 11 has a structure in which the first joint portion 14a and the second joint portion 14b are continuous. The outer peripheral edge ME1 of the metal layer 14 is located on the inner side (center side of the substrate 12) than the outer peripheral edge BE1 of the substrate 12 in a plan view of the substrate 12. The protrusion length L1 from which the outer peripheral surface of the substrate 12 protrudes from the outer peripheral edge ME1 of the metal layer 14 is preferably in the range of 0.01 mm or more and 0.1 mm or less, more preferably 0.03 mm or more, 0. Within the range of 07 mm or less.

  The width dimension W2 of the second joint portion 14b in the direction along the first main surface 12a of the substrate 12 is, for example, in the range of 0.3 to 3 times the width dimension W1 of the first joint portion 14a. It is preferable. In the metal layer 14 of the optical member 11, the width dimension W2 of the second joint portion 14b is more preferably larger than the width dimension W1 of the first joint portion 14a.

Next, the usage method and application of the optical member will be described.
As shown in FIG. 3, the optical member 11 is attached to the opening of the housing C to seal the opening of the housing C. More specifically, the metal layer 14 of the optical member 11 is bonded to the opening of the housing C using the bonding material BM. As the bonding material BM, a commercially available solder material (for example, a reflow solder material) or a brazing material can be used. Examples of the bonding material BM include an Au—Sn alloy, a Pb—Sn alloy, and an Au—Ge alloy. The optical member 11 is attached to the housing C using a bonding material BM so as to maintain the airtightness in the housing C. Examples of the material of the housing C include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, alloys such as Fe—Ni—Co alloy, Cu—W alloy, and Kovar (registered trademark). A metal layer can be provided in the opening of the housing C as necessary. For example, when the casing C is made of ceramics, the adhesiveness (bonding strength) with the bonding material is improved by providing a metal layer containing the metal element constituting the bonding material BM at the opening of the casing C. Can do.

In the housing C, although not shown, optical devices such as a laser module, an optical sensor, an image sensor, and an optical switch are accommodated.
By using the optical member 11 as described above, an electronic component package can be obtained. That is, the electronic component package includes a housing C, an optical device accommodated in the housing C, and an optical member 11 attached to the housing C.

Next, a method for manufacturing the substrate 12 will be described.
As shown in FIG. 4A, in the method for manufacturing the substrate 12, first, step S10 for preparing a first plate piece is performed. As shown in FIG. 5, in the preparation of the first plate piece in step S <b> 10, the plate material 15 as a base material is cut along a grid-like cutting line indicated by a broken line in FIG. As shown, a plurality of quadrangular (square) first plate pieces 16 are formed in plan view.

  As shown in FIG. 6A, in the method for manufacturing the substrate 12, a first step of stacking the plurality of first plate pieces 16 is performed (step S11). As shown in FIG. 6B, in the first step of step S11, a first columnar body 17 (rectangular columnar body) formed by laminating the first plate pieces 16 is formed.

  In the first step of step S11, when the first plate piece 16 is a glass plate piece or a sapphire plate piece and both main surfaces of these plate pieces have smoothness capable of optical contact, a plurality of plate pieces are optically contacted. Thus, the first columnar body 17 can be formed by bonding. Moreover, since the glass plate piece shape | molded using the overflow down draw method has high smoothness of both main surfaces, even if it simplifies or abbreviate | omits grinding | polishing of both main surfaces, the plurality which comprises the 1st columnar body 17 is comprised. The first plate piece 16 (glass plate piece) can be joined by optical contact.

  As shown in FIG. 6B, in the method for manufacturing the substrate 12, a second step of grinding the outer peripheral surface of the first columnar body 17 is performed (step S12). As shown in FIG. 6C, in the second step of step S12, a second columnar body 19 composed of a plurality of second plate pieces 18 having a circular shape in plan view is formed.

  As shown in FIG. 6B, in the second step, the grinding blade BL is brought into contact with the outer peripheral surface of the first columnar body 17 rotated around the central axis, so that the outer peripheral surface of the first columnar body 17 (first The corner of one columnar body 17 is ground. The first columnar body 17 can be rotated around the central axis by, for example, rotationally driving a support that sandwiches the upper and lower surfaces of the first columnar body 17. In the second step, the outer peripheral surface of the first columnar body 17 can be ground by moving the grinding blade BL along the circumferential direction of the first columnar body 17. That is, in the second step, the first columnar body 17 is ground by relatively moving the first columnar body 17 and the grinding blade BL.

  As shown in FIGS. 6C and 6D, in the method of manufacturing the substrate 12, a third step of separating the plurality of second plate pieces 18 constituting the second columnar body 19 is performed (step S13). . In the third step of step S13, a plurality of substrates 12 made of the second plate pieces 18 are obtained.

Next, a method for manufacturing the optical member 11 will be described.
As shown in FIG.4 (b), in the manufacturing method of the optical member 11, the 4th process of providing the antireflection layer 13 in the board | substrate 12 obtained with the manufacturing method of said board | substrate 12 is performed (step S14). In the fourth step of step S14, the above-described dielectric multilayer film is formed on the first main surface 12a of the substrate 12. Examples of the method for forming the dielectric multilayer film include a sputtering method, a vacuum evaporation method, a vacuum evaporation method using ion assist or ion plating, and a CVD method. Among these film forming methods, the thickness of each layer can be controlled with high precision, and a stable dielectric multilayer film can be obtained. Therefore, vacuum deposition using ion assist or sputtering is used. preferable. In order to form the antireflection layer 13 at a predetermined position on the first main surface 12a of the substrate 12, a mask that covers a predetermined position (outer peripheral edge portion) of the first main surface 12a of the substrate 12 may be used.

  Next, in the manufacturing method of the optical member 11, the 5th process which provides the metal layer 14 in the board | substrate 12 which provided the antireflection layer 13 is performed (step S15). In the fifth step of step S15, a metal film is formed on a part of the substrate 12 on which the antireflection layer 13 is provided on the first main surface 12a side so that the metal layer 14 is arranged as described above. Examples of the method for forming the metal film include a sputtering method, a vacuum evaporation method, a vacuum evaporation method using ion assist or ion plating, and a CVD method.

In order to form the metal layer 14 at a predetermined position of the substrate 12 provided with the antireflection layer 13, a mask covering the predetermined positions of the substrate 12 and the antireflection layer 13 may be used.
Next, the operation and effect of this embodiment will be described.

  (1) The optical member 11 having the light transmission part 11 a is along the outer periphery of the substrate 12, the antireflection layer 13 provided on the first main surface 12 a of the substrate 12, and the antireflection layer 13 in a plan view of the substrate 12. And a metal layer 14 having a frame shape. The metal layer 14 of the optical member 11 has a first joint portion 14 a joined to the main surface of the antireflection layer 13 and a second joint portion 14 b joined to the first main surface 12 a of the substrate 12. . In the metal layer 14 of the optical member 11, the first joint portion 14a and the second joint portion 14b are continuous.

  According to this configuration, the outer peripheral edge of the antireflection layer 13 can be covered with the metal layer 14 having a layer structure in which the first joint portion 14a and the second joint portion 14b are continuous. That is, the outer peripheral edge of the antireflection layer 13 can be covered using the metal layer 14 without providing a separate protective layer different from the metal layer 14. Therefore, in the optical member 11 having the antireflection layer 13 and the metal layer 14, the outer peripheral edge of the antireflection layer 13 can be easily protected. Thereby, peeling of the antireflection layer 13 can be suppressed.

  The metal layer 14 of the optical member 11 is provided over the main surface (outer surface) of the antireflection layer 13, the side surface of the antireflection layer 13, and the first main surface 12 a of the substrate 12. For this reason, for example, the adhesion area of the metal layer 14 is wider than when the metal layer 14 having a predetermined width in plan view is provided only on the main surface of the antireflection layer 13 or only on the first main surface 12a of the substrate 12. Therefore, the adhesion strength of the metal layer 14 can be increased.

  (2) The outer peripheral edge ME1 of the metal layer 14 of the optical member 11 is located on the inner side of the outer peripheral edge BE1 of the substrate 12 in a plan view of the substrate 12. In this case, for example, even if the outer peripheral edge BE1 of the substrate 12 rubs against other members, the outer peripheral edge ME1 of the metal layer 14 becomes difficult to rub against other members. Therefore, peeling of the metal layer 14 can be suppressed.

  (3) In the metal layer 14 of the optical member 11, when the width dimension W2 of the second joint portion 14b is larger than the width dimension W1 of the first joint portion 14a, the contact area between the substrate 12 and the metal layer 14 is wider. Can be secured. Therefore, peeling of the metal layer 14 can be suppressed by utilizing the adhesion of the metal layer 14 to the substrate 12.

  (4) The manufacturing method of the substrate 12 includes a first step of forming the first columnar body 17 by laminating a plurality of first plate pieces 16 having a first shape, and an outer peripheral surface of the first columnar body 17. A second step of forming a second columnar body 19 composed of a plurality of second plate pieces 18 having a second shape by grinding. The method for manufacturing the substrate 12 further includes a third step of obtaining the substrate 12 composed of the second plate pieces 18 by separating the plurality of second plate pieces 18 constituting the second columnar body 19.

  According to this method, for example, by preparing the first plate pieces 16 having different dimensions and different external shapes in advance, the second plate pieces 18 (substrate 12) having different dimensions and different external shapes can be manufactured.

  (5) In the manufacturing method of the substrate 12, the plurality of first plate pieces 16 are glass plate pieces or sapphire plate pieces, and the plurality of glass plate pieces or sapphire plate pieces constituting the first columnar body 17 in the first step. Are preferably joined by optical contact. In this case, the shape of the first columnar body 17 can be easily maintained. Note that the shape of the first columnar body 17 may be maintained by pressing and sandwiching the upper surface of the uppermost layer and the lower surface of the lowermost layer of the plurality of first plate pieces 16 in the stacked state. Moreover, you may perform the said press clamping in the state joined by the optical contact.

  (6) In the manufacturing method of the board | substrate 12, it is preferable that the some 1st plate piece 16 is a glass plate piece shape | molded using the overflow down draw method. In this case, since the smoothness of both main surfaces of the glass plate piece that is the first plate piece 16 is high, the bonding strength of the optical contact can be easily increased.

  (7) In the method for manufacturing the substrate 12, the first shape of the plurality of first plate pieces 16 is a shape having a corner portion in a plan view, and in the second step, the plurality of first shapes constituting the first columnar body 17. At least a corner portion of one plate piece 16 is ground. Thus, the board | substrate 12 of the shape which ground the corner | angular part from the 1st board piece 16 of the shape which has a corner | angular part can be obtained easily.

  (8) In the method for manufacturing the substrate 12, the first shape is a quadrangular shape in plan view, and the second shape is a circular shape in plan view. In this case, for example, the plurality of first plate pieces 16 can be efficiently obtained by cutting the plate material 15 along a grid-like cutting line. The circular substrate 12 can be obtained from the plurality of first plate pieces 16 thus obtained in a plan view.

(Example of change)
This embodiment can be implemented with the following modifications. The present embodiment and the following modifications can be implemented in combination with each other within a technically consistent range.

  As shown in FIG. 7, the optical member 11 is provided on the second main surface 12 b of the substrate 12 when the antireflection layer 13 provided on the first main surface 12 a of the substrate 12 is the first antireflection layer 13. The second antireflection layer 20 may be further provided. In the optical member 11, the second antireflection layer 20 is disposed at a position facing the first antireflection layer 13 in the thickness direction of the substrate 12, and the substrate 12, the first antireflection layer 13, and the second antireflection layer 13 are disposed. The antireflection layer 20 constitutes the light transmission part 11a. In this case, the optical transparency of the optical member 11 can be further improved. Therefore, the performance of the optical device accommodated in the housing C can be exhibited more.

  -In the optical member 11, the width dimension W2 of the 2nd junction part 14b in the metal layer 14 may be the same as the width dimension W1 of the 1st junction part 14a, and is larger than the width dimension W1 of the 1st junction part 14a. It may be small. When the width dimension W2 of the second bonding portion 14b is made smaller than the width dimension W1 of the first bonding portion 14a, the outer peripheral edge portion of the substrate 12 can be easily attached to and detached from the film forming jig. Thereby, for example, the productivity of the optical member 11 can be increased.

  In the optical member 11, the outer peripheral edge ME <b> 1 of the metal layer 14 is located on the inner side of the outer peripheral edge BE <b> 1 of the substrate 12 in a plan view of the substrate 12. It can also be changed to a position overlapping with the outer peripheral edge BE1.

  In the method for manufacturing the substrate 12, the first plate piece 16 having the first shape may be formed by punching the plate material 15. Moreover, the said board | substrate 12 is columnar, and a cross section is changed into a 1st shape base material, The 1st board piece 16 which has a 1st shape is formed by cut | disconnecting the base material along a radial direction. May be.

  The substrate 12 can be obtained by another manufacturing method instead of the manufacturing method of the substrate 12. For example, the antireflection layer 13 may be provided on the plate 15 in advance. That is, by cutting the plate material 15 with the antireflection layer 13 to form the first plate piece 16 with the antireflection layer 13 and then grinding the outer peripheral surface of the first plate piece 16 with the antireflection layer 13, The substrate 12 with the antireflection layer 13 can be obtained. The optical member 11 can be obtained by providing the metal layer 14 on the substrate 12 with the antireflection layer 13 thus obtained. The optical member 11 can also be obtained using a plate material 15 provided with a metal layer 14 in addition to the antireflection layer 13. However, when the antireflection layer 13 or the like is provided on the plate material 15 in advance, the antireflection layer 13 may be peeled off from the plate material 15 when the plate material 15 with the antireflection layer 13 is cut. A production method is preferred.

  -In the manufacturing method of the board | substrate 12, the glass plate piece which is the 1st plate piece 16 may be the plate glass shape | molded using methods other than the overflow downdraw method. Examples of methods other than the overflow downdraw method include a rollout method, a redraw method, a slot downdraw method, and a float method. When the first columnar body 17 is formed by joining glass plate pieces obtained by various methods by optical contact, both main surfaces of the glass plate piece may be polished until they become smooth surfaces capable of optical contact. Further, as the smoothness of both main surfaces of the glass plate pieces is increased, the bonding strength between the glass plate pieces using the optical contact can be increased.

  In the method for manufacturing the substrate 12, the shape of the first plate piece 16 may be a polygonal shape such as a triangular shape or a hexagonal shape, or may be a circular shape. The shape of the second plate piece 18 can also be changed according to various shapes of substrates (optical members).

DESCRIPTION OF SYMBOLS 11 ... Optical member, 11a ... Light transmissive part, 12 ... Board | substrate, 12a ... 1st main surface, 12b ... 2nd main surface, 13 ... 1st antireflection layer, 14 ... Metal layer, 14a ... 1st junction part, 14b ... 2nd junction part, 16 ... 1st board piece, 17 ... 1st columnar body, 18 ... 2nd plate piece, 19 ... 2nd columnar body, 20 ... 2nd antireflection layer, ME1, BE1 ... outer periphery , W1, W2 ... width dimensions.

Claims (10)

An optical member having a light transmission part,
A substrate having a first main surface and a second main surface opposite to the first main surface;
An antireflection layer provided on a portion excluding the outer peripheral edge of the first main surface;
A metal layer having a frame shape along an outer peripheral edge of the antireflection layer in a plan view of the substrate,
The metal layer includes a first bonding portion bonded to the main surface of the antireflection layer, and a second bonding portion bonded to the first main surface of the substrate, and the first bonding portion; The optical member, wherein the second joint portion is continuous.   2. The optical member according to claim 1, wherein an outer peripheral edge of the metal layer is located inside an outer peripheral edge of the substrate in a plan view of the substrate.   3. The optical member according to claim 1, wherein a width dimension of the second joint portion in a direction along the first main surface is larger than a width dimension of the first joint portion. The substrate is a glass substrate or a sapphire substrate, has a circular shape in plan view,
When the antireflection layer provided on the first main surface is a first antireflection layer, the antireflection layer further comprises a second antireflection layer provided on the second main surface. Item 4. The optical member according to any one of Items 3. A method of manufacturing a substrate used for an optical member having a light transmission part,
A first step of forming a first columnar body by laminating a plurality of first plate pieces having a first shape;
A second step of forming a second columnar body composed of a plurality of second plate pieces having a second shape by grinding the outer peripheral surface of the first columnar body;
And a third step of obtaining a substrate made of the second plate piece by separating the plurality of second plate pieces constituting the second columnar body.   The plurality of first plate pieces are glass plate pieces or sapphire plate pieces, and the plurality of glass plate pieces or the plurality of sapphire plate pieces constituting the first columnar body in the first step are optical contacts. The method for manufacturing a substrate according to claim 5, wherein bonding is performed.   The substrate manufacturing method according to claim 6, wherein the plurality of first plate pieces are glass plate pieces formed using an overflow downdraw method.   The first shape is a shape having a corner portion in a plan view, and in the second step, at least corner portions of the plurality of first plate pieces constituting the first columnar body are ground. The manufacturing method of the board | substrate as described in any one of Claims 5-7.   9. The method of manufacturing a substrate according to claim 8, wherein the first shape is a quadrangular shape in plan view, and the second shape is a circular shape in plan view. A method of manufacturing an optical member having a light transmission part,
A first step of forming a first columnar body by laminating a plurality of first plate pieces having a first shape;
A second step of forming a second columnar body composed of a plurality of second plate pieces having a second shape by grinding the outer peripheral surface of the first columnar body;
By separating the plurality of second plate pieces constituting the second columnar body, the substrate has a second main surface that is made of the second plate piece and opposite to the first main surface and the first main surface. A third step of obtaining
A fourth step of providing an antireflection layer on a portion excluding the outer peripheral edge of the first main surface of the substrate;
And a fifth step of providing a metal layer on the substrate provided with the antireflection layer,
In the fifth step, the metal layer is formed to have a frame shape along the outer peripheral edge of the antireflection layer in a plan view of the substrate,
The metal layer includes a first bonding portion bonded to the main surface of the antireflection layer, and a second bonding portion bonded to the first main surface of the substrate, and the first bonding portion. And a method of manufacturing an optical member, wherein the second joining portion is continuous.