JP7121064B2 - Ultrasonic processing equipment - Google Patents

Description

The present invention relates to an ultrasonic processing apparatus for applying ultrasonic processing to electric wires.

When manufacturing an electric wire with a terminal by crimping a terminal on an aluminum electric wire, ultrasonic processing is applied to the conductor of the electric wire, which is composed of multiple strands, so that the multiple strands of the conductor are joined together to form a single wire. is performed (see, for example, Patent Document 1).

JP 2018-160414 A

By the way, when the conductors of an electric wire are ultrasonically welded to form a single wire, an operator holds the electric wire and inserts the conductor exposed at the end of the electric wire between the horn and the anvil of the ultrasonic processing apparatus. It is crowded. Then, a predetermined amount of ultrasonic energy is applied to the conductor.

However, depending on how the conductor is inserted between the horn and the anvil, the volume of the inserted conductor varies. At this time, since the ultrasonic energy applied to the conductor is constant, if the volume of the inserted conductor varies, the amount of ultrasonic energy applied per unit volume of the conductor will vary. Become. As a result, the finish of the single-wired electric wire is uneven, which may cause discoloration, breakage of the wires, and the like.

SUMMARY OF THE INVENTION The present invention has been made in view of the circumstances described above, and an object of the present invention is to provide an ultrasonic processing apparatus capable of uniformly performing ultrasonic processing on the conductor of an electric wire to form a single wire with a stable finish. is to provide

In order to achieve the above object, an ultrasonic processing apparatus according to the present invention is characterized by the following (1) to ( 2 ).
(1) An ultrasonic processing device that applies ultrasonic waves to a conductor composed of a plurality of strands exposed at the end of an electric wire and joins the strands to form a single wire,
An ultrasonic wave applying mechanism having an ultrasonic wave applying chamber in which the conductor is arranged, and performing ultrasonic processing for applying ultrasonic waves to the conductor of the electric wire arranged in the ultrasonic wave applying chamber;
a wire gripping mechanism that grips the wire and places the conductor in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism;
an abutment detection mechanism that positions the electric wire in the electric wire gripping mechanism by abutting the end of the conductor of the electric wire gripped by the electric wire gripping mechanism;
with
The abutment detection mechanism has a detection unit that detects that the end of the conductor has been abutted,
The ultrasonic wave applying mechanism can apply ultrasonic waves to the conductor in the ultrasonic wave applying chamber by detecting the abutment of the end of the conductor by the detection unit ,
The abutting detection mechanism is
arranged on the opposite side of the ultrasonic applying mechanism with respect to the wire gripping mechanism,
The electric wire gripping mechanism is
Provided movably between a set position close to the ultrasonic wave applying mechanism and a processing position spaced apart from the ultrasonic wave applying mechanism,
After the detection unit of the abutment detection mechanism detects the abutment of the end of the conductor, the conductor is moved from the set position to the processing position while gripping the electric wire, and the conductor is placed in the ultrasonic wave application chamber. ,
An ultrasonic processing device characterized by:

( 2 ) The wire gripping mechanism includes a wire clamper that clamps the wire when the detection unit of the abutment detection mechanism detects the abutment of the end of the conductor.
The ultrasonic processing apparatus according to (1) above, characterized in that:

According to the ultrasonic processing apparatus having the above configuration (1), the end of the conductor is abutted against the abutting detection mechanism and the electric wire is positioned by the electric wire gripping mechanism, whereby the conductor is made into a single wire by the ultrasonic applying mechanism. is executed. In this way, since the ultrasonic applying mechanism single-wires the conductor of the electric wire positioned by the electric wire holding mechanism, the operator grasps the electric wire and inserts the conductor into the ultrasonic applying chamber for ultrasonic processing. , the length of the conductor to which ultrasonic waves are applied can be made constant, and the quality of single-tracking can be kept constant.

Furthermore, according to the ultrasonic processing apparatus having the above configuration ( 1 ), the wire holding mechanism holds the wire whose end of the conductor is positioned by the abutting detection mechanism, and moves to the processing position away from the ultrasonic wave applying mechanism. do. This moves the wire away from the exposed side of the conductor and places the conductor into the ultrasound application chamber. Therefore, it is possible to suppress the curling of the wires of the conductor, and it is possible to perform the ultrasonic processing favorably.

According to the ultrasonic processing apparatus having the configuration ( 2 ) above, when the detection unit of the abutment detection mechanism detects the abutment of the end of the conductor, the wire clamper of the wire gripping mechanism clamps the wire. That is, since the wire gripping mechanism grips the wire whose end portion of the conductor is positioned by the abutting detection mechanism, the conductor of the positioned wire can be placed in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism, stably. can be made into a single line.

ADVANTAGE OF THE INVENTION According to this invention, the ultrasonic processing apparatus which can perform an ultrasonic processing to the conductor of an electric wire without dispersion|variation, and can form a single wire by the stable finish can be provided.

The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading the following detailed description of the invention (hereinafter referred to as "embodiment") with reference to the accompanying drawings. .

FIG. 1 is a schematic plan view of an ultrasonic processing apparatus according to an embodiment of the invention. FIG. 2 is a schematic side view of an ultrasonic processing apparatus according to an embodiment of the invention. FIG. 3 is a sectional view taken along line II in FIG. FIG. 4 is a flowchart for explaining ultrasonic processing by an ultrasonic processing apparatus. FIG. 5 is a timing chart for explaining ultrasonic processing by an ultrasonic processing apparatus. FIG. 6 is a diagram showing the procedure of ultrasonic processing by an ultrasonic processing apparatus, and FIGS. 6(a) to 6(d) are schematic plan views of the ultrasonic processing apparatus. 7A to 7D are diagrams showing the procedure of ultrasonic processing by an ultrasonic processing apparatus, and FIGS. 7A to 7D are schematic plan views of the ultrasonic processing apparatus.

Specific embodiments relating to the present invention will be described below with reference to each drawing.

FIG. 1 is a schematic plan view of an ultrasonic processing apparatus according to an embodiment of the invention. FIG. 2 is a schematic side view of an ultrasonic processing apparatus according to an embodiment of the invention. FIG. 3 is a sectional view taken along line II in FIG.

As shown in FIGS. 1 and 2, the ultrasonic processing apparatus 1 according to the present embodiment includes an ultrasonic applying mechanism 10, an electric wire gripping mechanism 20, and an abutting detection mechanism 30. As shown in FIG. This ultrasonic processing apparatus 1 applies ultrasonic processing to an electric wire 5 . The electric wire 5 is an aluminum electric wire in which a conductor 6 in which a plurality of wires 6a made of aluminum or an aluminum alloy are bundled is covered with a jacket 7 made of an insulating resin. The ultrasonic processing apparatus 1 applies ultrasonic processing to the conductor 6 exposed from the jacket 7 at the end of the electric wire 5, and joins the plurality of strands 6a to form a single wire.

The ultrasonic wave imparting mechanism 10 is arranged on one end side of the wire gripping mechanism 20 . The abutting detection mechanism 30 is arranged on the opposite side of the wire gripping mechanism 20 with the ultrasonic applying mechanism 10 interposed therebetween.

As shown in FIG. 3, the ultrasonic wave application mechanism 10 includes a horn 11, an anvil plate 12, a gliding jaw 13, and an anvil . The ultrasonic wave applying mechanism 10 has a rectangular space defined by the horn 11, the anvil plate 12, the gliding jaw 13, and the anvil 14 as an ultrasonic wave applying chamber S in which the conductor 6 of the electric wire 5 is arranged. there is The ultrasonic applying mechanism 10 ultrasonically joins the wires 6a constituting the conductors 6 of the electric wires 5 arranged in the ultrasonic applying chamber S to each other.

The horn 11 includes a vibrator (not shown) that oscillates ultrasonic vibrations when supplied with alternating current, and is ultrasonically vibrated by this vibrator. Anvil plate 12 is arranged on the side of horn 11 . The gliding jaw 13 is arranged at a position facing the anvil plate 12 on the upper surface of the horn 11 and is movable toward and away from the anvil plate 12 . Gliding jaw 13 moves in the direction indicated by arrow A in FIG. 3 and presses conductor 6 in this direction.

The anvil 14 is arranged above the horn 11 and the anvil plate 12 and is movable horizontally and vertically. Anvil 14 presses conductor 6 toward horn 11 by moving in the direction indicated by arrow B in FIG. 3 and further in the direction indicated by arrow C in FIG.

The ultrasonic wave applying mechanism 10 can freely change the width and height of the ultrasonic wave applying chamber S by moving the gliding jaw 13 and the anvil 14 . By adjusting the width and height of the ultrasonic wave applying chamber S in this way, the conductor 6 is pressed and formed into a desired target shape.

The ultrasonic wave applying mechanism 10 moves the gliding jaw 13 in a direction (arrow A direction in FIG. 3) to approach the anvil plate 12 while the conductor 6 of the electric wire 5 is placed in the ultrasonic wave applying chamber S. Further, the anvil 14 moves upward in the ultrasonic wave application chamber S (in the direction of arrow B in FIG. 3), and further moves in the direction of approaching the horn 11 (in the direction of arrow C in FIG. 3). As a result, the conductor 6 in the ultrasonic wave imparting chamber S is pressed from the width direction and the vertical direction. In this state, the horn 11 is ultrasonically vibrated. As a result, the conductors 6 in the ultrasonic wave imparting chamber S are joined to each other while the oxide film formed on the surface of each wire 6a is destroyed. As a result, the conductor 6 of the electric wire 5 is made into a single wire having a rectangular cross-sectional shape, and the strands 6a of the electric wire 5 are in a state of good conduction.

The wire gripping mechanism 20 includes a clamp unit 21 , a wire guide 22 , a wire clamper 23 and a seating sensor 24 .

The clamp unit 21 is formed in a rectangular plate shape. The clamp unit 21 has a slider 25 at its bottom. The slider 25 is provided so as to be able to reciprocate on a pair of guide rails 26 arranged in parallel. This allows the clamp unit 21 to slide toward and away from the ultrasonic wave applying mechanism 10 . The clamp unit 21 is provided with a drive cylinder 28 for advancing and retracting a rod 27 on the side opposite to the ultrasonic wave applying mechanism 10 . The rod 27 of the drive cylinder 28 is connected at its end to the clamping unit 21 . The clamp unit 21 slides in the approach direction (arrow D direction in FIG. 1) and separation direction (arrow E direction in FIG. 1) with respect to the ultrasonic wave applying mechanism 10 by advancing and retracting the rod 27 of the drive cylinder 28. . That is, the clamp unit 21 is moved between a set position close to the ultrasonic wave applying mechanism 10 and a processing position away from the ultrasonic wave applying mechanism 10 .

The wire guide 22 is provided on the upper surface of the clamp unit 21 . The wire guide 22 has two guide walls 29A and 29B erected on the upper surface of the clamp unit 21. As shown in FIG. The guide walls 29A and 29B are arranged parallel to each other with a gap along the sliding direction of the clamp unit 21 . The wire guide 22 has a wire housing portion WS between the guide walls 29A and 29B. The electric wire 5 is accommodated in the electric wire accommodating portion WS with the exposed end portion of the conductor 6 directed toward the ultrasonic wave imparting mechanism 10 .

The wire clamper 23 is provided on one guide wall 29A of the wire guide 22 . The wire clamper 23 can move toward and away from the other guide wall 29B. Thereby, the wire clamper 23 can appear and disappear with respect to the wire housing portion WS. The wire clamper 23 projects toward the wire housing portion WS while the wire housing portion WS accommodates the wire 5, so that the wire clamper 23 grips the wire 5 while sandwiching it between itself and the other guide wall 29B.

A seating sensor 24 is provided on the wire guide 22 . The seating sensor 24 is a sensor that optically detects the presence or absence of the electric wire 5 in the electric wire housing portion WS using, for example, a laser.

The abutment detection mechanism 30 includes a moving mechanism section 31 , a holding block 32 and an abutment block 33 .

The moving mechanism 31 has a ball screw 36 rotated by a drive motor 35 . The ball screw 36 is rotated in forward and reverse directions by the drive motor 35 . One end of a support arm 37 is screwed onto the ball screw 36 .

A holding block 32 is fixed to the other end of the support arm 37 . The abutment block 33 is provided on the holding block 32 . The abutting block 33 is arranged on the holding block 32 on the ultrasonic applying mechanism 10 side. A holding block 32 having an abutment block 33 is movably moved in a direction (direction of arrow F in FIG. 1) and a direction (direction of arrow G in FIG. 1) to approach and separate from the ultrasonic wave applying mechanism 10. supported by The holding block 32 is biased toward the ultrasonic wave applying mechanism 10 by a biasing member (not shown) such as a coil spring. The holding block 32 also includes a proximity sensor (detection section) 38 . The proximity sensor 38 is provided on the side of the holding block 32 opposite to the abutment block 33 . The proximity sensor 38 is a sensor that detects the abutment block 33 when the abutment block 33 is pushed into the holding block 32 against the biasing force of the biasing member.

The abutment block 33 moves in the direction (arrow F direction in FIG. 1) in which the ball screw 36 of the moving mechanism 31 rotates forward and the holding block 32 approaches the ultrasonic wave applying mechanism 10, thereby moving the ultrasonic wave applying mechanism. 10 is placed in the set position. Further, the abutment block 33 moves in the direction in which the ball screw 36 of the moving mechanism 31 is reversed to move the holding block 32 away from the ultrasonic wave applying mechanism 10 (direction of arrow G in FIG. 1). It is arranged at a retracted position away from the mechanism 10 .

A pair of a processing start switch 61 and a foot switch 63 are provided in the ultrasonic processing apparatus 1 configured as described above. The pair of machining start switches 61 are pressed with both hands by the operator, and the foot switch 63 is stepped on and pressed by the operator. These machining start switch 61 and foot switch 63 are connected to a control device 65 . The control device 65 controls driving of each mechanism of the ultrasonic processing apparatus 1 . The control device 65 also has a bar code reader (not shown). The barcode reader reads the barcode attached to the pole on which the plurality of electric wires 5 before ultrasonic processing are hung. The control device 65 extracts the wire information about the wire 5 of the rod from the barcode read by the barcode reader, and based on this wire information, the ultrasonic wave application mechanism 10, the wire gripping mechanism 20, and the abutment detection mechanism 30 are operated. Control. The wire information is, for example, various kinds of information about the wire 5, such as the outer diameter of the conductor 6 of the wire 5 and the number of wires 6a.

Next, the work performed by the operator and the control performed by the controller 65 when the conductor 6 of the electric wire 5 is subjected to ultrasonic processing by the ultrasonic processing apparatus 1 to form a single wire will be described.
FIG. 4 is a flowchart for explaining ultrasonic processing by an ultrasonic processing apparatus. FIG. 5 is a timing chart for explaining ultrasonic processing by an ultrasonic processing apparatus. FIG. 6 is a diagram showing the procedure of ultrasonic processing by an ultrasonic processing apparatus, and FIGS. 6(a) to 6(d) are schematic plan views of the ultrasonic processing apparatus. 7A to 7D are diagrams showing the procedure of ultrasonic processing by an ultrasonic processing apparatus, and FIGS. 7A to 7D are schematic plan views of the ultrasonic processing apparatus.

The electric wire 5 is sent from the previous process in a state of being hung on a rod. For example, five electric wires 5 are hung on the rod. When the rod on which the electric wire 5 is hung is fed in, the operator causes the barcode attached to the rod to be read by the barcode reader of the controller 65 (step SH1, timing T1). As a result, the wire information of the bar code read by the bar code reader is transmitted to the control device 65, and the product switching process is performed (timing T2). Then, the control device 65 starts controlling the driving of the ultrasonic applying mechanism 10, the wire gripping mechanism 20, and the abutment detecting mechanism 30 based on the transmitted wire information.

At this time, as shown in FIG. 6A, in the ultrasonic processing apparatus 1, the abutment block 33 of the abutment detection mechanism 30 is arranged at the retracted position, and the clamp unit 21 of the wire gripping mechanism 20 is arranged at the set position. It is

The drive motor 35 of the abutment detection mechanism 30 is driven by the controller 65, and as shown in FIG. 6B, the abutment block 33 arranged at the retracted position is moved to the set position (step SM1, timing T3).

The operator takes out one electric wire 5 from the rod (step SH2). Then, the semi-stripped jacket 7 with a cut formed in the vicinity of the end of the electric wire 5 is removed (step SH3). As a result, the conductor 6 is exposed at the end of the electric wire 5 .

Next, as shown in FIG. 6(c), the operator sets the electric wire 5 to the ultrasonic processing apparatus 1 (timing T4). Specifically, the end of the conductor 6 of the electric wire 5 is abutted against the abutment block 33 (step SH4), and the electric wire 5 is placed in the electric wire accommodating portion WS of the electric wire guide 22 of the electric wire gripping mechanism 20 and the detection position of the seating sensor 24. It is lowered to and housed (step SH5).

When the electric wire 5 is set in the ultrasonic processing apparatus 1, detection is performed by the proximity sensor 38 of the abutting detection mechanism 30 and the seating sensor 24 of the electric wire gripping mechanism 20 (timing T5).

When the proximity sensor 38 of the abutting detection mechanism 30 is turned on (step SM2) and the seating sensor 24 of the wire gripping mechanism 20 is turned on (step SM3), as shown in FIG. A retraction operation of the abutting block 33 is performed. Specifically, the wire clamper 23 of the wire gripping mechanism 20 is moved to clamp the wire 5 in the wire housing portion WS of the wire guide 22 (step SM4, timing T6). In this state, if the ON state of the proximity sensor 38 is maintained (step SM5), the abutment block 33 arranged at the set position moves to the retracted position (step SM6, timing T7). At this time, when the wire clamping mechanism 20 moves the wire clamper 23 to clamp the wire 5 , the amount of movement of the wire clamper 23 is transmitted to the control device 65 . The control device 65 determines the outer diameter of the electric wire 5 based on the amount of movement of the electric wire clamper 23, and if the outer diameter of the electric wire 5 is outside the specified outer diameter, the subsequent ultrasonic machining process is not performed. , the operator is notified that the outer diameter of the electric wire 5 is out of standard by means of an alarm or the like.

The operator confirms the set state of the wire 5 set in the wire gripping mechanism 20 (step SH6), and presses the pair of processing start switches 61 (step SH7, timing T8). When it is determined that the pair of machining start switches 61 have been turned ON (step SM7, timing T9), as shown in FIG. It is moved to a processing position away from the sound wave applying mechanism 10 (step SM8, timing T10). Then, the conductor 6 exposed at the end of the electric wire 5 is placed in the ultrasonic wave applying chamber S of the ultrasonic wave applying mechanism 10 .

When it is determined that the clamp unit 21 of the wire gripping mechanism 20 has been placed at the processing position (step SM9), ultrasonic processing is performed by the ultrasonic applying mechanism 10 (step SM10, timing T11). Specifically, as shown in FIG. 7(b), the gliding jaw 13 moves in the direction of approaching the anvil plate 12 (direction of arrow A in FIG. 7) and the anvil 14 moves in the direction of approaching the horn 11 (direction of arrow A in FIG. 7). 7) and downward to press the conductor 6 in the ultrasonic applying chamber S from the width direction and the vertical direction. In this state, the horn 11 is ultrasonically vibrated, the conductor 6 is made into a single wire having a rectangular cross-sectional shape, and the ultrasonic processing is completed (step SM11). In this ultrasonic processing, a necessary amount of ultrasonic energy corresponding to the conductor 6 of the wire 5 is applied based on the wire information of the read bar code.

As shown in FIG. 7(c), after the ultrasonic processing is completed and the gliding jaw 13 and the anvil 14 have returned to their original positions, the operator steps on the foot switch 63 (step SH8, timing T12). As a result, the foot switch 63 is turned on (timing T13).

When it is determined that the foot switch 63 is turned on (step SM12), the clamp unit 21 of the wire gripping mechanism 20 arranged at the processing position is moved to the ultrasonic applying mechanism 10 as shown in FIG. 7(d). It is moved to an adjacent set position (step SM13, timing T14). Furthermore, the wire clamper 23 of the wire gripping mechanism 20 is moved to release the clamping of the wire 5 (step SM14, timing T15). The worker takes out the wire 5 with the conductor 6 made into a single wire from the wire gripping mechanism 20 (step SH9), and then checks the appearance of the conductor 6 of the wire 5 made into a single wire (step SH10). It is returned to the rod (step SH11).

When the seating sensor 24 of the wire gripping mechanism 20 is OFF (step SM15) and the proximity sensor 38 of the abutting detection mechanism 30 is OFF (step SM16), the abutting block 33 arranged at the retracted position is It is moved to the set position (step SM17, timing T16).

For the second and subsequent electric wires 5 of the rod, the work of steps SH2 to SH11 by the operator and the operations of steps SM2 to SM17 by the control device 65 are performed at timings T4 to T16 (see FIG. 5).

Then, after completing the processing of all the electric wires 5 of the rod, the operator sends the rod on which the electric wires 5 that have been processed are hung to the next process (step SH12).

As described above, according to the ultrasonic processing apparatus 1 according to the present embodiment, the end of the conductor 6 is abutted against the abutment block 33 of the abutment detection mechanism 30 and the wire 5 is held in the wire gripping mechanism 20. By being positioned, the conductor 6 is made into a single wire by the ultrasonic wave applying mechanism 10 . As described above, since the ultrasonic applying mechanism 10 single-wires the conductor 6 of the electric wire 5 positioned by the electric wire holding mechanism 20, the operator grasps the electric wire 5 and inserts the conductor 6 into the ultrasonic applying chamber S. , the length of the conductor 6 to which ultrasonic waves are applied can be made constant, and the quality of the single wire can be kept constant, compared with the case where the ultrasonic processing is performed by inserting the .

Also, the wire gripping mechanism 20 grips the wire 5 whose end portion of the conductor 6 is positioned by the abutting detection mechanism 30 and moves to a processing position away from the ultrasonic wave applying mechanism 10 . As a result, the electric wire 5 is moved in the direction opposite to the exposed side of the conductor 6, and the conductor 6 is arranged in the ultrasonic wave applying chamber S. Therefore, it is possible to suppress the curling of the wires 6a of the conductor 6, and it is possible to perform the ultrasonic processing favorably.

Moreover, when the proximity sensor 38 of the abutment detection mechanism 30 detects the abutment of the end of the conductor 6 , the wire clamper 23 of the wire gripping mechanism 20 clamps the wire 5 . That is, since the wire gripping mechanism 20 grips the wire 5 whose end portion of the conductor 6 is positioned by the abutting detection mechanism 30, the conductor 6 of the positioned wire 5 is placed in the ultrasonic wave applying chamber S of the ultrasonic wave applying mechanism 10. It can be placed in a single line stably.

In the ultrasonic processing apparatus 1 according to the above-described embodiment, the operation of ultrasonic processing is started by having the worker read the bar code of the rod. An ultrasonic processing operation may be started by pressing the button.

Further, in the above-described embodiment, the case of having a plurality of strands 6a made of aluminum or an aluminum alloy was illustrated as the conductor 6 to be singulated by applying ultrasonic waves, but the conductor 6 of the electric wire 5 is copper or copper It may have a plurality of strands 6a made of an alloy.

It should be noted that the present invention is not limited to the above-described embodiments, and can be modified, improved, etc. as appropriate. In addition, the material, shape, size, number, location, etc. of each component in the above-described embodiment are arbitrary and not limited as long as the present invention can be achieved.

Here, the features of the ultrasonic processing apparatus according to the embodiments of the present invention described above are summarized and listed briefly in [1] to [3] below.
[1] Ultrasonic waves are applied to a conductor (6) composed of a plurality of strands (6a) exposed at the end of an electric wire (5) to join the strands (6a) to form a single wire. A processing device (1),
An ultrasonic wave applying chamber (S) in which the conductor (6) is arranged, and applying ultrasonic waves to the conductor (6) of the electric wire (5) arranged in the ultrasonic wave applying chamber (S) An ultrasonic applying mechanism (10) for performing sonic processing;
A wire gripping mechanism (20) that grips the wire (5) and places the conductor (6) in the ultrasonic wave applying chamber (S) of the ultrasonic wave applying mechanism (10);
Abutment for positioning the wire (5) in the wire gripping mechanism (20) by abutting the end of the conductor (6) of the wire (5) gripped by the wire gripping mechanism (20) a sensing mechanism (30);
with
The abutment detection mechanism (30) has a detection unit (proximity sensor 38) that detects that the end of the conductor (6) is abutted,
The ultrasonic wave imparting mechanism (10) detects the abutment of the end of the conductor (6) by the detection unit (proximity sensor 38), thereby causing the conductor (6) in the ultrasonic wave imparting chamber (S) to the application of ultrasound is feasible,
An ultrasonic processing device characterized by:

[2] The bump detection mechanism (30)
arranged on the opposite side of the ultrasonic applying mechanism (10) with respect to the wire gripping mechanism (20),
The wire gripping mechanism (20) is
provided movably between a set position close to the ultrasonic wave applying mechanism (10) and a processing position spaced apart from the ultrasonic wave applying mechanism (10),
After the detection part (proximity sensor 38) of the abutment detection mechanism (30) detects the abutment of the end of the conductor (6), the electric wire (5) is gripped from the set position to the processing position. moving to place the conductor (6) in the ultrasound application chamber (S);
The ultrasonic processing apparatus according to [1] above, characterized in that:

[3] The electric wire gripping mechanism (20) detects the electric wire ( 5) with a wire clamper (23) for clamping
The ultrasonic processing apparatus according to the above [1] or [2], characterized by:

REFERENCE SIGNS LIST 1 ultrasonic processing device 5 electric wire 6 conductor 6a wire 10 ultrasonic applying mechanism 20 electric wire gripping mechanism 23 electric wire clamper 30 abutment detection mechanism 38 proximity sensor (detection unit)
S Ultrasonic wave applying chamber

Claims (2)

An ultrasonic processing device that applies ultrasonic waves to a conductor composed of a plurality of strands exposed at the end of an electric wire and joins the strands to form a single wire,
An ultrasonic wave applying mechanism having an ultrasonic wave applying chamber in which the conductor is arranged, and performing ultrasonic processing for applying ultrasonic waves to the conductor of the electric wire arranged in the ultrasonic wave applying chamber;
a wire gripping mechanism that grips the wire and places the conductor in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism;
an abutment detection mechanism that positions the electric wire in the electric wire gripping mechanism by abutting the end of the conductor of the electric wire gripped by the electric wire gripping mechanism;
with
The abutment detection mechanism has a detection unit that detects that the end of the conductor has been abutted,
The ultrasonic wave applying mechanism can apply ultrasonic waves to the conductor in the ultrasonic wave applying chamber by detecting the abutment of the end of the conductor by the detection unit ,
The abutting detection mechanism is
arranged on the opposite side of the ultrasonic applying mechanism with respect to the wire gripping mechanism,
The electric wire gripping mechanism is
Provided movably between a set position close to the ultrasonic wave applying mechanism and a processing position spaced apart from the ultrasonic wave applying mechanism,
After the detection unit of the abutment detection mechanism detects the abutment of the end of the conductor, the conductor is moved from the set position to the processing position while gripping the electric wire, and the conductor is placed in the ultrasonic wave application chamber. ,
An ultrasonic processing device characterized by: The wire gripping mechanism includes a wire clamper that clamps the wire when the detection unit of the abutment detection mechanism detects the abutment of the end of the conductor.
2. The ultrasonic processing apparatus according to claim 1 , wherein:

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