JP2021158770A - Supersonic wave processing device - Google Patents

Abstract

To provide a supersonic wave processing device capable of realizing a single line in a stable finish by performing a supersonic wave processing process without variations to a conductor of an electric wire.SOLUTION: A supersonic wave processing device comprises: a supersonic wave application mechanism 10 having a supersonic wave application chamber S, and performing a supersonic wave processing process which realizes a single line by applying a supersonic wave to a conductor 6 of an electric wire 5 arranged in the supersonic wave application chamber S; an electric wire gripping mechanism 20 arranging the conductor 6 by gripping the electric wire 5 to the supersonic wave application chamber S of the supersonic wave application mechanism 10; and a striking detection mechanism 30 positioning the electric wire 5 to the electric wire gripping mechanism 20 by striking an end part of the conductor 6 of the electric wire 5, gripped by the electric wire gripping mechanism 20. In the striking detection mechanism 30, a proximity sensor 38 for detecting that the end part of the conductor 6 is struck is included. The supersonic wave application mechanism 10 can execute an application of the supersonic wave to the conductor 6 in the supersonic wave application chamber S by detecting the striking of the end part of the conductor 6 by the proximity sensor 38.SELECTED DRAWING: Figure 1

Description

The present invention relates to an ultrasonic processing apparatus that applies ultrasonic processing to an electric wire.

When manufacturing an electric wire with terminals by crimping terminals to an aluminum electric wire, the conductors of the electric wire consisting of a plurality of strands are subjected to ultrasonic processing to join the plurality of strands of the conductor to each other to form a single wire. (See, for example, Patent Document 1).

JP-A-2018-160414

By the way, when ultrasonically bonding the conductors of an electric wire to make a single wire, an operator grips the electric wire and inserts the conductor exposed at the end of the electric wire between the horn and the anvil of the ultrasonic processing device. It is crowded. Then, ultrasonic energy of a preset magnitude is applied to the conductor.

However, the volume of the inserted conductor varies depending on how the conductor is inserted between the horn and the anvil. At this time, since the ultrasonic energy applied to the conductor is constant, if the volume of the inserted conductor varies, the magnitude of the ultrasonic energy applied per unit volume of the conductor varies. Become. As a result, the finish of the single-wired electric wire varies, which may cause discoloration or breakage of the wire.

The present invention has been made in view of the above circumstances, and an object of the present invention is an ultrasonic processing apparatus capable of performing ultrasonic processing on a conductor of an electric wire without variation to form a single wire with a stable finish. Is to provide.

In order to achieve the above-mentioned object, the ultrasonic processing apparatus according to the present invention is characterized by the following (1) to (3).
(1) An ultrasonic processing device that applies ultrasonic waves to a conductor composed of a plurality of strands exposed at the end of an electric wire and joins the strands to form a single wire.
An ultrasonic wave applying mechanism having an ultrasonic wave applying chamber in which the conductor is arranged and performing an ultrasonic processing process for applying ultrasonic waves to the conductor of the electric wire arranged in the ultrasonic wave applying chamber, and an ultrasonic wave applying mechanism.
An electric wire gripping mechanism that grips the electric wire and arranges the conductor in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism.
An abutting detection mechanism that positions the electric wire against the electric wire gripping mechanism by abutting the end of the conductor of the electric wire that is gripped by the electric wire gripping mechanism.
With
The abutting detection mechanism has a detecting unit for detecting that the end of the conductor has been abutted.
In the ultrasonic wave applying mechanism, the ultrasonic wave can be applied to the conductor in the ultrasonic wave applying chamber by detecting the abutting of the end portion of the conductor by the detecting unit.
An ultrasonic processing device characterized by this.

(2) The abutting detection mechanism is
It is arranged on the opposite side of the ultrasonic wave applying mechanism with respect to the electric wire gripping mechanism.
The electric wire gripping mechanism is
It is provided so as to be movable between a set position close to the ultrasonic wave application mechanism and a processing position away from the ultrasonic wave application mechanism.
After the detection unit of the abutting detection mechanism detects the abutting of the end portion of the conductor, the conductor is moved from the set position to the processing position while grasping the electric wire, and the conductor is arranged in the ultrasonic wave applying chamber. ,
The ultrasonic processing apparatus according to (1) above.

(3) The electric wire gripping mechanism includes an electric wire clamper that clamps the electric wire by detecting the abutting of an end portion of the conductor by the detecting portion of the abutting detection mechanism.
The ultrasonic processing apparatus according to (1) or (2) above.

According to the ultrasonic processing apparatus having the configuration of (1) above, the end of the conductor is abutted against the abutting detection mechanism and the electric wire is positioned at the electric wire gripping mechanism, so that the conductor is made into a single wire by the ultrasonic applying mechanism. Is executed. In this way, since the ultrasonic wave applying mechanism makes a single wire for the conductor of the electric wire positioned by the electric wire gripping mechanism, the operator grips the electric wire and inserts the conductor into the ultrasonic wave applying chamber to perform ultrasonic processing. The length of the conductor to which ultrasonic waves are applied can be made constant, and the quality of single wire can be kept constant, as compared with the case of performing.

According to the ultrasonic processing apparatus having the configuration of (2) above, the electric wire gripping mechanism grips the electric wire whose end portion of the conductor is positioned by the abutting detection mechanism, and moves to a processing position away from the ultrasonic wave applying mechanism. As a result, the electric wire is moved in the direction opposite to the exposed side of the conductor, and the conductor is arranged in the ultrasonic wave applying chamber. Therefore, it is possible to suppress the turning of the wire of the conductor, and the ultrasonic processing can be performed satisfactorily.

According to the ultrasonic processing apparatus having the configuration of (3) above, when the detection unit of the abutting detection mechanism detects the abutting of the end portion of the conductor, the electric wire clamper of the electric wire gripping mechanism clamps the electric wire. That is, since the electric wire gripping mechanism grips the electric wire whose end portion of the conductor is positioned by the abutting detection mechanism, the conductor of the positioned electric wire can be arranged in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism and is stable. Can be made into a single wire.

According to the present invention, it is possible to provide an ultrasonic processing apparatus capable of performing ultrasonic processing on a conductor of an electric wire without variation to form a single wire with a stable finish.

The present invention has been briefly described above. Further, the details of the present invention will be further clarified by reading through the embodiments described below (hereinafter referred to as "embodiments") with reference to the accompanying drawings. ..

FIG. 1 is a schematic plan view of an ultrasonic processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic side view of the ultrasonic processing apparatus according to the embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line II in FIG. FIG. 4 is a flowchart illustrating an ultrasonic processing process by the ultrasonic processing apparatus. FIG. 5 is a timing chart for explaining the ultrasonic processing by the ultrasonic processing apparatus. 6A and 6B are views showing a procedure of ultrasonic wave processing by an ultrasonic processing apparatus, and FIGS. 6A to 6D are schematic plan views of the ultrasonic processing apparatus, respectively. 7A and 7B are views showing a procedure of ultrasonic wave processing by an ultrasonic processing apparatus, and FIGS. 7A to 7D are schematic plan views of the ultrasonic processing apparatus, respectively.

Specific embodiments of the present invention will be described below with reference to the respective figures.

FIG. 1 is a schematic plan view of an ultrasonic processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic side view of the ultrasonic processing apparatus according to the embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line II in FIG.

As shown in FIGS. 1 and 2, the ultrasonic processing apparatus 1 according to the present embodiment includes an ultrasonic wave applying mechanism 10, an electric wire gripping mechanism 20, and a butt detection mechanism 30. The ultrasonic processing apparatus 1 performs ultrasonic processing on the electric wire 5. The electric wire 5 is an aluminum electric wire in which a conductor 6 in which a plurality of strands 6a made of aluminum or an aluminum alloy are bundled is covered with a jacket 7 made of an insulating resin. The ultrasonic processing apparatus 1 performs ultrasonic processing on the conductor 6 exposed from the outer cover 7 at the end of the electric wire 5, and joins the plurality of strands 6a to each other to form a single wire.

The ultrasonic wave applying mechanism 10 is arranged on one end side of the electric wire gripping mechanism 20. The abutting detection mechanism 30 is arranged on the opposite side of the electric wire gripping mechanism 20 with the ultrasonic wave applying mechanism 10 interposed therebetween.

As shown in FIG. 3, the ultrasonic wave applying mechanism 10 includes a horn 11, an anvil plate 12, a gliding jaw 13, and an anvil 14. In the ultrasonic wave applying mechanism 10, the rectangular space defined by the horn 11, the anvil plate 12, the gliding jaw 13 and the anvil 14 is used as the ultrasonic wave applying chamber S in which the conductor 6 of the electric wire 5 is arranged. There is. The ultrasonic wave applying mechanism 10 ultrasonically bonds the strands 6a forming the conductor 6 of the electric wire 5 arranged in the ultrasonic wave applying chamber S to each other.

The horn 11 includes a vibrator (not shown) that oscillates ultrasonic vibration by supplying an alternating current, and the horn 11 is ultrasonically vibrated by this vibrator. The anvil plate 12 is arranged on the side of the horn 11. The gliding jaw 13 is arranged at a position facing the anvil plate 12 on the upper surface of the horn 11, and is movable in the direction of approaching and separating from the anvil plate 12. The gliding jaw 13 moves in the direction indicated by the arrow A in FIG. 3 and presses the conductor 6 in this direction.

The anvil 14 is arranged above the horn 11 and the anvil plate 12 and is movable in the horizontal direction and the vertical direction. The anvil 14 moves in the direction indicated by the arrow B in FIG. 3, and further moves in the direction indicated by the arrow C in FIG. 3, thereby pressing the conductor 6 toward the horn 11.

The ultrasonic wave applying mechanism 10 can freely change the width and height of the ultrasonic wave applying chamber S by moving the gliding jaw 13 and the anvil 14. By adjusting the width and height of the ultrasonic wave applying chamber S in this way, the conductor 6 is pressed to form a desired target shape.

The ultrasonic wave applying mechanism 10 moves the gliding jaw 13 in the direction close to the anvil plate 12 (direction of arrow A in FIG. 3) in a state where the conductor 6 of the electric wire 5 is arranged in the ultrasonic wave applying chamber S. Further, the anvil 14 moves upward of the ultrasonic wave applying chamber S (direction of arrow B in FIG. 3), and further moves in a direction close to the horn 11 (direction of arrow C in FIG. 3). As a result, the conductor 6 in the ultrasonic wave applying chamber S is pressed from the width direction and the vertical direction. Then, in this state, the horn 11 is ultrasonically vibrated. As a result, the conductors 6 in the ultrasonic wave applying chamber S are joined to each other while the oxide film formed on the surface of each wire 6a is destroyed. As a result, in the electric wire 5, the conductor 6 is made into a single wire having a rectangular cross-sectional shape, and the strands 6a are in a state of being satisfactorily conducted with each other.

The electric wire gripping mechanism 20 includes a clamp unit 21, an electric wire guide 22, an electric wire clamper 23, and a seating sensor 24.

The clamp unit 21 is formed in the shape of a rectangular plate. The clamp unit 21 has a slider 25 below the clamp unit 21. The slider 25 is provided so as to be reciprocally movable on a pair of guide rails 26 arranged in parallel. As a result, the clamp unit 21 can slide in the direction of approaching and separating from the ultrasonic wave applying mechanism 10. The clamp unit 21 is provided with a drive cylinder 28 for advancing and retreating the rod 27 on the opposite side of the ultrasonic wave applying mechanism 10. The end of the rod 27 of the drive cylinder 28 is connected to the clamp unit 21. The clamp unit 21 slides in the proximity direction (arrow D direction in FIG. 1) and the separation direction (arrow E direction in FIG. 1) with respect to the ultrasonic wave applying mechanism 10 by moving the rod 27 of the drive cylinder 28 forward and backward. .. That is, the clamp unit 21 is moved between the set position close to the ultrasonic wave applying mechanism 10 and the processing position separated from the ultrasonic wave applying mechanism 10.

The electric wire guide 22 is provided on the upper surface of the clamp unit 21. The electric wire guide 22 has two guide walls 29A and 29B erected on the upper surface of the clamp unit 21. The guide walls 29A and 29B are arranged in parallel with each other at intervals along the slide direction of the clamp unit 21. In the electric wire guide 22, the area between the guide walls 29A and 29B is the electric wire accommodating portion WS. The electric wire 5 is accommodated in the electric wire accommodating portion WS with the end portion where the conductor 6 is exposed directed toward the ultrasonic wave applying mechanism 10.

The electric wire clamper 23 is provided on one guide wall 29A of the electric wire guide 22. The electric wire clamper 23 can move in the direction of approaching and separating from the other guide wall 29B. As a result, the electric wire clamper 23 can appear and disappear with respect to the electric wire accommodating portion WS. The electric wire clamper 23 projects toward the electric wire accommodating portion WS side in a state where the electric wire 5 is accommodated in the electric wire accommodating portion WS, so that the electric wire 5 is sandwiched and gripped with the other guide wall 29B.

The seating sensor 24 is provided on the electric wire guide 22. The seating sensor 24 is a sensor that optically detects the presence or absence of the electric wire 5 in the electric wire accommodating portion WS by, for example, a laser or the like.

The abutting detection mechanism 30 includes a moving mechanism portion 31, a holding block 32, and abutting block 33.

The moving mechanism unit 31 has a ball screw 36 that is rotated by the drive motor 35. The ball screw 36 is rotated in the forward and reverse directions by the drive motor 35. One end of the support arm 37 is screwed onto the ball screw 36.

The holding block 32 is fixed to the other end of the support arm 37. The abutting block 33 is provided on the holding block 32. The abutting block 33 is arranged on the ultrasonic wave applying mechanism 10 side of the holding block 32. The holding block 32 provided with the abutting block 33 is movable in a direction closer to (arrow F direction in FIG. 1) and away from the ultrasonic wave applying mechanism 10 (arrow G direction in FIG. 1). Is supported by. The holding block 32 is urged toward the ultrasonic wave applying mechanism 10 by an urging member (not shown) such as a coil spring. Further, the holding block 32 includes a proximity sensor (detection unit) 38. The proximity sensor 38 is provided on the side of the holding block 32 opposite to the abutting block 33. The proximity sensor 38 is a sensor that detects the abutting block 33 when the abutting block 33 is pushed into the holding block 32 against the urging by the urging member.

The abutting block 33 has an ultrasonic wave applying mechanism by rotating the ball screw 36 of the moving mechanism unit 31 in the normal direction and moving the holding block 32 in a direction close to the ultrasonic wave applying mechanism 10 (in the direction of arrow F in FIG. 1). It is arranged at a set position near 10. Further, the abutting block 33 applies ultrasonic waves by reversing the ball screw 36 of the moving mechanism portion 31 and moving the holding block 32 in the direction away from the ultrasonic wave applying mechanism 10 (in the direction of arrow G in FIG. 1). It is arranged at a retracted position away from the mechanism 10.

The ultrasonic processing apparatus 1 having the above configuration is provided with a pair of processing start switches 61 and a foot switch 63. The pair of machining start switches 61 are pressed by the operator with both hands, and the foot switch 63 is stepped on and pressed by the operator. These machining start switches 61 and foot switches 63 are connected to the control device 65. The control device 65 controls the drive of each mechanism of the ultrasonic processing device 1. Further, the control device 65 includes a barcode reader (not shown). The bar code reader reads the bar code attached to the rod on which the plurality of electric wires 5 are hung before the ultrasonic processing. The control device 65 extracts electric wire information about the electric wire 5 of the rod from the bar code read by the bar code reader, and based on this electric wire information, sets the ultrasonic wave applying mechanism 10, the electric wire gripping mechanism 20, and the abutting detection mechanism 30. Control. The electric wire information is various information about the electric wire 5, such as the outer diameter of the conductor 6 of the electric wire 5 and the number of strands 6a.

Next, the work of the operator and the control by the control device 65 when the conductor 6 of the electric wire 5 is subjected to the ultrasonic processing process to make a single wire by the ultrasonic processing device 1 will be described.
FIG. 4 is a flowchart illustrating an ultrasonic processing process by the ultrasonic processing apparatus. FIG. 5 is a timing chart for explaining the ultrasonic processing by the ultrasonic processing apparatus. 6A and 6B are views showing a procedure of ultrasonic wave processing by an ultrasonic processing apparatus, and FIGS. 6A to 6D are schematic plan views of the ultrasonic processing apparatus, respectively. 7A and 7B are views showing a procedure of ultrasonic wave processing by an ultrasonic processing apparatus, and FIGS. 7A to 7D are schematic plan views of the ultrasonic processing apparatus, respectively.

The electric wire 5 is sent from the previous process in a state of being hung on a rod. For example, five electric wires 5 are hung on the rod. When the rod on which the electric wire 5 is hung is sent, the operator causes the barcode reader of the control device 65 to read the barcode attached to the rod (step SH1, timing T1). As a result, the wire information of the barcode read by the barcode reader is transmitted to the control device 65, and the product switching process is performed (timing T2). Then, the control device 65 starts controlling the drive of the ultrasonic wave applying mechanism 10, the electric wire gripping mechanism 20, and the abutting detection mechanism 30 based on the transmitted electric wire information.

At this time, as shown in FIG. 6A, in the ultrasonic processing apparatus 1, the abutting block 33 of the abutting detection mechanism 30 is arranged at the retracted position, and the clamp unit 21 of the electric wire gripping mechanism 20 is arranged at the set position. Has been done.

The drive motor 35 of the abutting detection mechanism 30 is driven by the control device 65, and as shown in FIG. 6B, the abutting block 33 arranged at the retracted position is moved to the set position (step SM1, timing). T3).

The operator takes out one electric wire 5 from the rod (step SH2). Then, the outer cover 7 having a cut formed near the end of the electric wire 5 and being semi-striped is removed (step SH3). As a result, the electric wire 5 is in a state where the conductor 6 is exposed at the end portion thereof.

Next, as shown in FIG. 6C, the operator sets the electric wire 5 in the ultrasonic processing apparatus 1 (timing T4). Specifically, the tip of the conductor 6 of the electric wire 5 is abutted against the abutting block 33 (step SH4), and the electric wire 5 is placed on the electric wire accommodating portion WS of the electric wire guide 22 of the electric wire gripping mechanism 20 to detect the seating sensor 24. (Step SH5).

When the electric wire 5 is set in the ultrasonic processing device 1, detection is performed by the proximity sensor 38 of the abutting detection mechanism 30 and the seating sensor 24 of the electric wire gripping mechanism 20 (timing T5).

When the proximity sensor 38 of the abutting detection mechanism 30 is turned on (step SM2) and the seating sensor 24 of the electric wire gripping mechanism 20 is turned on (step SM3), as shown in FIG. The abutting block 33 is retracted. Specifically, the electric wire clamper 23 of the electric wire gripping mechanism 20 moves, and the electric wire 5 in the electric wire accommodating portion WS of the electric wire guide 22 is clamped (step SM4, timing T6). In this state, when the ON state of the proximity sensor 38 is maintained (step SM5), the abutting block 33 arranged at the set position moves to the retracted position (step SM6, timing T7). At this time, when the electric wire gripping mechanism 20 moves the electric wire clamper 23 to clamp the electric wire 5, the movement amount of the electric wire clamper 23 is transmitted to the control device 65. The control device 65 determines the outer diameter of the electric wire 5 based on the amount of movement of the electric wire clamper 23, and if the outer diameter of the electric wire 5 is an outer diameter outside the specified value, the subsequent ultrasonic processing step is not performed. , Notify the operator that the outer diameter of the electric wire 5 is out of the standard by an alarm or the like.

The operator confirms the set state of the electric wire 5 set in the electric wire gripping mechanism 20 (step SH6), and presses the pair of machining start switches 61 (step SH7, timing T8). When it is determined that the pair of machining start switches 61 are turned on (step SM7, timing T9), as shown in FIG. 7A, the clamp unit 21 of the electric wire gripping mechanism 20 arranged at the set position is superposed. It is moved to a machining position separated from the sound wave applying mechanism 10 (step SM8, timing T10). Then, in the electric wire 5, the conductor 6 exposed at the end is arranged in the ultrasonic wave applying chamber S of the ultrasonic wave applying mechanism 10.

When it is determined that the clamp unit 21 of the electric wire gripping mechanism 20 is arranged at the machining position (step SM9), the ultrasonic machining process by the ultrasonic wave applying mechanism 10 is performed (step SM10, timing T11). Specifically, as shown in FIG. 7B, the gliding jaw 13 moves in the direction closer to the anvil plate 12 (direction arrow A in FIG. 7) and the anvil 14 approaches the horn 11 (FIG. 7). It moves downward (in the direction of arrow B in 7) and presses the conductor 6 in the ultrasonic applying chamber S from the width direction and the vertical direction. Then, in this state, the horn 11 ultrasonically vibrates, the conductor 6 is made into a single wire into a rectangular cross-sectional shape, and the ultrasonic processing is completed (step SM11). In this ultrasonic processing, a necessary amount of ultrasonic energy corresponding to the conductor 6 of the electric wire 5 is applied based on the electric wire information of the read barcode.

As shown in FIG. 7C, after the ultrasonic processing is completed and the gliding jaw 13 and the anvil 14 return to their original positions, the operator steps on the foot switch 63 (step SH8, timing T12). As a result, the foot switch 63 is turned on (timing T13).

When it is determined that the foot switch 63 is in the ON state (step SM12), as shown in FIG. 7D, the clamp unit 21 of the electric wire gripping mechanism 20 arranged at the processing position is transferred to the ultrasonic wave applying mechanism 10. It is moved to a close set position (step SM13, timing T14). Further, the electric wire clamper 23 of the electric wire gripping mechanism 20 moves to release the clamp of the electric wire 5 (step SM14, timing T15). The operator takes out the electric wire 5 having the single-wired conductor 6 from the electric wire gripping mechanism 20 (step SH9), and then checks the appearance of the conductor 6 of the single-wired electric wire 5 (step SH10). Return to the rod (step SH11).

When the seating sensor 24 of the electric wire gripping mechanism 20 is OFF (step SM15) and the proximity sensor 38 of the abutting detection mechanism 30 is OFF (step SM16), the abutting block 33 arranged at the retracted position is released. It is moved to the set position (step SM17, timing T16).

For the second and subsequent electric wires 5 of the rod, the work of steps SH2 to SH11 by the operator and the operation of steps SM2 to SM17 by the control device 65 are performed at timings T4 to T16 (see FIG. 5).

Then, after the processing of all the electric wires 5 of the rod is completed, the operator sends the rod on which the processed electric wires 5 are hung to the next process (step SH12).

As described above, according to the ultrasonic processing apparatus 1 according to the present embodiment, the end portion of the conductor 6 is abutted against the abutting block 33 of the abutting detection mechanism 30, and the electric wire 5 is attached to the electric wire gripping mechanism 20. By positioning, the conductor 6 is made into a single wire by the ultrasonic wave applying mechanism 10. In this way, since the ultrasonic wave applying mechanism 10 makes a single wire with respect to the conductor 6 of the electric wire 5 positioned by the electric wire gripping mechanism 20, the operator grips the electric wire 5 and the conductor 6 is inside the ultrasonic wave applying chamber S. The length of the conductor 6 to which the ultrasonic wave is applied can be made constant, and the quality of the single wire can be kept constant, as compared with the case where the conductor 6 is inserted and the ultrasonic processing process is performed.

Further, the electric wire gripping mechanism 20 grips the electric wire 5 whose end portion of the conductor 6 is positioned by the abutting detection mechanism 30, and moves to a processing position separated from the ultrasonic wave applying mechanism 10. As a result, the electric wire 5 is moved in the direction opposite to the exposed side of the conductor 6, and the conductor 6 is arranged in the ultrasonic wave applying chamber S. Therefore, the wire 6a of the conductor 6 can be suppressed from being turned over, and the ultrasonic processing can be performed satisfactorily.

Moreover, when the proximity sensor 38 of the abutting detection mechanism 30 detects the abutting of the end portion of the conductor 6, the electric wire clamper 23 of the electric wire gripping mechanism 20 clamps the electric wire 5. That is, since the electric wire gripping mechanism 20 grips the electric wire 5 whose end portion of the conductor 6 is positioned by the abutting detection mechanism 30, the conductor 6 of the positioned electric wire 5 is gripped by the ultrasonic wave applying chamber S of the ultrasonic wave applying mechanism 10. It can be arranged in a single wire and can be stably made into a single wire.

In the ultrasonic processing apparatus 1 according to the above embodiment, the operation of ultrasonic processing is started by having the operator read the bar code of the rod. However, a start switch is provided, and the start switch is operated by the operator. When pressed, the operation of ultrasonic processing may be started.

Further, in the above embodiment, the case where a plurality of strands 6a made of aluminum or an aluminum alloy are provided as the conductor 6 to which ultrasonic waves are applied to form a single wire is illustrated, but the conductor 6 of the electric wire 5 is copper or copper. It may have a plurality of strands 6a made of an alloy.

The present invention is not limited to the above-described embodiment, and can be appropriately modified, improved, and the like. In addition, the material, shape, dimensions, number, arrangement location, etc. of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

Here, the features of the ultrasonic processing apparatus according to the above-described embodiment of the present invention are briefly summarized and listed below [1] to [3], respectively.
[1] Ultrasonic waves are applied to a conductor (6) composed of a plurality of strands (6a) exposed at the end of an electric wire (5), and the strands (6a) are joined to each other to form a single wire. Processing equipment (1)
An ultrasonic wave imparting chamber (S) in which the conductor (6) is arranged, and ultrasonic waves are applied to the conductor (6) of the electric wire (5) arranged in the ultrasonic wave applying chamber (S). An ultrasonic wave applying mechanism (10) that performs sound wave processing and
An electric wire gripping mechanism (20) that grips the electric wire (5) and arranges the conductor (6) in the ultrasonic wave applying chamber (S) of the ultrasonic wave applying mechanism (10).
The end of the conductor (6) of the electric wire (5) gripped by the electric wire gripping mechanism (20) is abutted to position the electric wire (5) on the electric wire gripping mechanism (20). Detection mechanism (30) and
With
The abutting detection mechanism (30) has a detecting unit (proximity sensor 38) that detects that the end portion of the conductor (6) has been abutted.
The ultrasonic wave applying mechanism (10) is detected by the detecting unit (proximity sensor 38) at the end of the conductor (6) to the conductor (6) in the ultrasonic wave applying chamber (S). It is possible to apply ultrasonic waves,
An ultrasonic processing device characterized by this.

[2] The abutting detection mechanism (30) is
It is arranged on the opposite side of the ultrasonic wave applying mechanism (10) with respect to the electric wire gripping mechanism (20).
The electric wire gripping mechanism (20)
It is provided so as to be movable between a set position close to the ultrasonic wave applying mechanism (10) and a processing position separated from the ultrasonic wave applying mechanism (10).
After the detection unit (proximity sensor 38) of the abutting detection mechanism (30) detects the abutting of the end portion of the conductor (6), the wire (5) is gripped from the set position to the processing position. The conductor (6) is moved to be arranged in the ultrasonic wave applying chamber (S).
The ultrasonic processing apparatus according to the above [1].

[3] The electric wire gripping mechanism (20) is such that the detection unit (proximity sensor 38) of the abutting detection mechanism (30) detects the abutting of the end portion of the conductor (6). A wire clamper (23) for clamping 5) is provided.
The ultrasonic processing apparatus according to the above [1] or [2].

1 Ultrasonic processing device 5 Electric wire 6 Conductor 6a Wire 10 Ultrasonic application mechanism 20 Electric wire gripping mechanism 23 Electric wire clamper 30 Butt detection mechanism 38 Proximity sensor (detector)
S Ultrasonic wave application room

Claims (3)

An ultrasonic processing device that applies ultrasonic waves to a conductor composed of a plurality of strands exposed at the end of an electric wire and joins the strands to form a single wire.
An ultrasonic wave applying mechanism having an ultrasonic wave applying chamber in which the conductor is arranged and performing an ultrasonic processing process for applying ultrasonic waves to the conductor of the electric wire arranged in the ultrasonic wave applying chamber, and an ultrasonic wave applying mechanism.
An electric wire gripping mechanism that grips the electric wire and arranges the conductor in the ultrasonic wave applying chamber of the ultrasonic wave applying mechanism.
An abutting detection mechanism that positions the electric wire against the electric wire gripping mechanism by abutting the end of the conductor of the electric wire that is gripped by the electric wire gripping mechanism.
With
The abutting detection mechanism has a detecting unit for detecting that the end of the conductor has been abutted.
In the ultrasonic wave applying mechanism, the ultrasonic wave can be applied to the conductor in the ultrasonic wave applying chamber by detecting the abutting of the end portion of the conductor by the detecting unit.
An ultrasonic processing device characterized by this. The abutment detection mechanism
It is arranged on the opposite side of the ultrasonic wave applying mechanism with respect to the electric wire gripping mechanism.
The electric wire gripping mechanism is
It is provided so as to be movable between a set position close to the ultrasonic wave application mechanism and a processing position away from the ultrasonic wave application mechanism.
After the detection unit of the abutting detection mechanism detects the abutting of the end portion of the conductor, the conductor is moved from the set position to the processing position while grasping the electric wire, and the conductor is arranged in the ultrasonic wave applying chamber. ,
The ultrasonic processing apparatus according to claim 1. The electric wire gripping mechanism includes an electric wire clamper that clamps the electric wire by detecting the abutting of an end portion of the conductor by the detecting portion of the abutting detection mechanism.
The ultrasonic processing apparatus according to claim 1 or 2.

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