JP7087296B2

JP7087296B2 - Liquid spray heads, liquid sprayers and piezoelectric devices

Info

Publication number: JP7087296B2
Application number: JP2017148080A
Authority: JP
Inventors: 栄樹平井; 本規 ▲高▼部
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2017-07-31
Filing date: 2017-07-31
Publication date: 2022-06-21
Anticipated expiration: 2037-07-31
Also published as: JP2019025795A

Description

本発明は、例えば液体噴射ヘッドに好適に利用される圧電デバイスの構造に関する。 The present invention relates to, for example, the structure of a piezoelectric device suitably used for a liquid injection head.

圧力室の壁面を構成する振動板を圧電素子により振動させることで圧力室内の液体をノズルから噴射する液体噴射ヘッドが従来から提案されている。例えば特許文献１には、第１電極と第２電極との間に圧電体層を介在させた積層構造の圧電素子が開示されている。圧電素子の面上に形成された第２電極には、信号配線を介して駆動信号が供給される。信号配線は、長尺状の圧電素子における一方の端部側に形成される。 Conventionally, a liquid injection head for injecting a liquid in a pressure chamber from a nozzle by vibrating a diaphragm constituting the wall surface of the pressure chamber with a piezoelectric element has been proposed. For example, Patent Document 1 discloses a piezoelectric element having a laminated structure in which a piezoelectric layer is interposed between a first electrode and a second electrode. A drive signal is supplied to the second electrode formed on the surface of the piezoelectric element via signal wiring. The signal wiring is formed on one end side of the elongated piezoelectric element.

特開２０１４－１５１６２３号公報Japanese Unexamined Patent Publication No. 2014-151623

しかし、特許文献１の構成では、圧電素子のうち信号配線とは反対側の端部において機械的な強度を充分に確保することが困難である。したがって、圧電体層の変形時に当該圧電体層にクラックが発生する可能性がある。以上の事情を考慮して、本発明の好適な態様は、圧電体層におけるクラックの発生を抑制することを目的とする。 However, in the configuration of Patent Document 1, it is difficult to sufficiently secure the mechanical strength at the end of the piezoelectric element on the side opposite to the signal wiring. Therefore, cracks may occur in the piezoelectric layer when the piezoelectric layer is deformed. In consideration of the above circumstances, a preferred embodiment of the present invention is to suppress the occurrence of cracks in the piezoelectric layer.

＜態様１＞
以上の課題を解決するために、本発明の好適な態様に係る液体噴射ヘッドは、液体を収容する圧力室と、前記圧力室から液体を噴射させる圧電デバイスとを具備する液体噴射ヘッドであって、前記圧電デバイスは、第１電極と、圧電体層と、第２電極と、絶縁層と、前記第２電極に電気的に接続される第１配線と、前記第２電極に電気的に接続される第２配線とを具備し、前記第１電極と前記圧電体層と前記第２電極とがこの順番で積層された第１領域と、前記圧電体層の第１端側に位置し、前記第１電極と前記圧電体層と前記絶縁層と前記第１配線とがこの順番で積層された第２領域と、前記圧電体層における前記第１端とは反対の第２端側に位置し、前記第１電極と前記圧電体層と前記絶縁層と前記第２配線とがこの順番で積層された第３領域とを含む。以上の態様では、圧電素子の第１端側に第１配線が形成され、第１端とは反対の第２端側に第２配線が形成されるから、第２配線が形成されない構成と比較して、圧電素子の第２端側の部分について剛性が増加する。また、圧電体層において第１端側と第２端側との間で機械的な剛性の差異が低減される。したがって、圧電体層におけるクラックの発生を抑制することが可能である。また、第１領域内の圧電体層に印加される電圧を下回る電圧が第３領域内の圧電体層に印加されるから、第１領域と第３領域との間で圧電体層に作用する応力の差異が低減される。以上の観点からしても、圧電体層におけるクラックの発生を抑制することが可能である。
＜態様２＞
態様１の好適例（態様２）において、前記第１電極は、前記圧電体層が積層された第１部分と、前記第１部分とは異なる第２部分とを含み、前記第１配線は、前記圧電体層の面上において前記第２電極に導通し、前記絶縁層を挟んで前記第１電極の前記第２部分に重なる。以上の態様では、圧電体層の面上において第２電極に導通する第１配線が、絶縁層を挟んで第１電極の第２部分に重なるから、第１電極と第２電極とが電気的に絶縁される。したがって、第１電極と第２電極とにより圧電体層に適切な電圧を印加することが可能である。
＜態様３＞
態様２の好適例（態様３）において、前記第１電極は、前記第１部分を挟んで前記第２部分とは反対側の第３部分を含み、前記第２配線は、前記圧電体層の面上において前記第２電極に導通し、前記絶縁層を挟んで前記第１電極の前記第３部分に重なる。以上の態様では、第２配線の構造が第１配線の構造に近付くから、圧電体層の第１端側と第２端側との間の剛性の相違に起因した異常変形が抑制される。したがって、圧電体層におけるクラックの発生を抑制できるという効果は格別に顕著である。
＜態様４＞
態様１から態様３の何れかの好適例（態様４）において、前記第１配線は、前記絶縁層に形成された第１コンタクトホールを介して、前記圧電体層の面上で前記第２電極に導通し、前記第２配線は、前記絶縁層に形成された第２コンタクトホールを介して、前記圧電体層の面上で前記第２電極に導通する。以上の態様では、第１コンタクトホールを介して第１配線を第２電極に導通させ、第２コンタクトホールを介して第２配線を第２電極に導通させることが可能である。
＜態様５＞
態様１から態様４の何れかの好適例（態様５）に係る液体噴射ヘッドは、平面視で前記第２配線を挟んで前記第１配線とは反対側に形成され、前記第１電極に導通する第３配線を具備する。以上の態様では、第３配線を介して第１電極に電圧を印加することが可能である。また、第１電極と比較して低抵抗な材料で第３配線を形成すれば、圧電体層の変形を阻害しないように第１電極を充分に薄く形成した構成でも、第１電極の抵抗に起因した電圧降下を第３配線により低減できるという利点がある。
＜態様６＞
態様１から態様５の何れかの好適例（態様６）において、前記第１配線には外部回路から駆動信号が供給され、前記第２配線は、前記第２電極と前記第１配線とを介して前記外部回路に電気的に接続される。
＜態様７＞
本発明の好適な態様（態様７）に係る液体噴射装置は、以上に例示した何れかの態様に係る液体噴射ヘッドを具備する。液体噴射装置の好例は、インクを噴射する印刷装置であるが、本発明に係る液体噴射装置の用途は印刷に限定されない。
＜態様８＞
本発明の好適な態様（態様８）に係る圧電デバイスは、第１電極と、圧電体層と、第２電極と、絶縁層と、前記第２電極に電気的に接続される第１配線と、前記第２電極に電気的に接続される第２配線とを具備し、前記第１電極と前記圧電体層と前記第２電極とがこの順番で積層された第１領域と、前記圧電体層の第１端側に位置し、前記第１電極と前記圧電体層と前記絶縁層と前記第１配線とがこの順番で積層された第２領域と、前記圧電体層における前記第１端とは反対の第２端側に位置し、前記第１電極と前記圧電体層と前記絶縁層と前記第２配線とがこの順番で積層された第３領域とを含む。以上の態様では、圧電素子の第１端側に第１配線が形成され、第１端とは反対の第２端側に第２配線が形成されるから、第２配線が形成されない構成と比較して、圧電素子の第２端側の部分について剛性が増加する。また、圧電体層において第１端側と第２端側との間で機械的な剛性の差異が低減される。したがって、圧電体層におけるクラックの発生を抑制することが可能である。また、第１領域内の圧電体層に印加される電圧を下回る電圧が第３領域内の圧電体層に印加されるから、第１領域と第３領域との間で圧電体層に作用する応力の差異が低減される。以上の観点からしても、圧電体層におけるクラックの発生を抑制することが可能である。 <Aspect 1>
In order to solve the above problems, the liquid injection head according to a preferred embodiment of the present invention is a liquid injection head including a pressure chamber for accommodating the liquid and a piezoelectric device for injecting the liquid from the pressure chamber. The piezoelectric device is electrically connected to the first electrode, the piezoelectric layer, the second electrode, the insulating layer, the first wiring electrically connected to the second electrode, and the second electrode. The first region is provided with the second wiring to be provided, and the first electrode, the piezoelectric layer, and the second electrode are laminated in this order, and the first region is located on the first end side of the piezoelectric layer. The position is located in the second region where the first electrode, the piezoelectric layer, the insulating layer, and the first wiring are laminated in this order, and on the second end side of the piezoelectric layer opposite to the first end. A third region in which the first electrode, the piezoelectric layer, the insulating layer, and the second wiring are laminated in this order is included. In the above aspect, since the first wiring is formed on the first end side of the piezoelectric element and the second wiring is formed on the second end side opposite to the first end, it is compared with the configuration in which the second wiring is not formed. As a result, the rigidity of the portion on the second end side of the piezoelectric element increases. Further, in the piezoelectric layer, the difference in mechanical rigidity between the first end side and the second end side is reduced. Therefore, it is possible to suppress the occurrence of cracks in the piezoelectric layer. Further, since a voltage lower than the voltage applied to the piezoelectric layer in the first region is applied to the piezoelectric layer in the third region, it acts on the piezoelectric layer between the first region and the third region. The difference in stress is reduced. From the above viewpoint, it is possible to suppress the occurrence of cracks in the piezoelectric layer.
<Aspect 2>
In a preferred example of the first aspect (aspect 2), the first electrode includes a first portion in which the piezoelectric layer is laminated and a second portion different from the first portion, and the first wiring is the first portion. It conducts to the second electrode on the surface of the piezoelectric layer and overlaps the second portion of the first electrode with the insulating layer interposed therebetween. In the above embodiment, since the first wiring conducting to the second electrode on the surface of the piezoelectric layer overlaps the second portion of the first electrode with the insulating layer interposed therebetween, the first electrode and the second electrode are electrically connected. Insulated to. Therefore, it is possible to apply an appropriate voltage to the piezoelectric layer by the first electrode and the second electrode.
<Aspect 3>
In a preferred example of the second aspect (aspect 3), the first electrode includes a third portion opposite to the second portion with the first portion interposed therebetween, and the second wiring is the piezoelectric layer. It conducts on the surface to the second electrode and overlaps the third portion of the first electrode with the insulating layer interposed therebetween. In the above aspect, since the structure of the second wiring approaches the structure of the first wiring, abnormal deformation due to the difference in rigidity between the first end side and the second end side of the piezoelectric layer is suppressed. Therefore, the effect of suppressing the generation of cracks in the piezoelectric layer is particularly remarkable.
<Aspect 4>
In any of the preferred examples of Aspects 1 to 3 (Aspect 4), the first wiring is the second electrode on the surface of the piezoelectric layer via the first contact hole formed in the insulating layer. The second wiring conducts to the second electrode on the surface of the piezoelectric layer through the second contact hole formed in the insulating layer. In the above aspect, it is possible to conduct the first wiring to the second electrode through the first contact hole and to conduct the second wiring to the second electrode through the second contact hole.
<Aspect 5>
The liquid injection head according to any of the preferred examples (aspect 5) of aspects 1 to 4 is formed on the side opposite to the first wiring with the second wiring sandwiched in a plan view, and conducts to the first electrode. The third wiring is provided. In the above aspect, it is possible to apply a voltage to the first electrode via the third wiring. Further, if the third wiring is formed of a material having a lower resistance than that of the first electrode, even if the first electrode is formed sufficiently thin so as not to hinder the deformation of the piezoelectric layer, the resistance of the first electrode can be increased. There is an advantage that the resulting voltage drop can be reduced by the third wiring.
<Aspect 6>
In any of the preferred examples (Aspect 6) of Aspects 1 to 5, a drive signal is supplied to the first wiring from an external circuit, and the second wiring is via the second electrode and the first wiring. Is electrically connected to the external circuit.
<Aspect 7>
The liquid injection device according to a preferred embodiment (aspect 7) of the present invention includes the liquid injection head according to any of the above-exemplified embodiments. A good example of a liquid injection device is a printing device that injects ink, but the application of the liquid injection device according to the present invention is not limited to printing.
<Aspect 8>
The piezoelectric device according to a preferred embodiment (aspect 8) of the present invention includes a first electrode, a piezoelectric layer, a second electrode, an insulating layer, and a first wiring electrically connected to the second electrode. A first region in which the first electrode, the piezoelectric layer, and the second electrode are laminated in this order, and the piezoelectric body are provided with a second wiring electrically connected to the second electrode. A second region located on the first end side of the layer, in which the first electrode, the piezoelectric layer, the insulating layer, and the first wiring are laminated in this order, and the first end of the piezoelectric layer. It is located on the second end side opposite to the above, and includes a third region in which the first electrode, the piezoelectric layer, the insulating layer, and the second wiring are laminated in this order. In the above aspect, since the first wiring is formed on the first end side of the piezoelectric element and the second wiring is formed on the second end side opposite to the first end, it is compared with the configuration in which the second wiring is not formed. As a result, the rigidity of the portion on the second end side of the piezoelectric element increases. Further, in the piezoelectric layer, the difference in mechanical rigidity between the first end side and the second end side is reduced. Therefore, it is possible to suppress the occurrence of cracks in the piezoelectric layer. Further, since a voltage lower than the voltage applied to the piezoelectric layer in the first region is applied to the piezoelectric layer in the third region, it acts on the piezoelectric layer between the first region and the third region. The difference in stress is reduced. From the above viewpoint, it is possible to suppress the occurrence of cracks in the piezoelectric layer.

第１実施形態に係る液体噴射装置の構成図である。It is a block diagram of the liquid injection apparatus which concerns on 1st Embodiment. 液体噴射ヘッドの分解斜視図である。It is an exploded perspective view of a liquid injection head. 液体噴射ヘッドの断面図（図２のIII-III線の断面図）である。It is sectional drawing (cross-sectional view of line III-III of FIG. 2) of the liquid injection head. 複数の圧電デバイスの平面図である。It is a top view of a plurality of piezoelectric devices. 図４におけるＶ-Ｖ線の断面図である。It is sectional drawing of the VV line in FIG. 第１領域内の電気的な構成を示す回路図である。It is a circuit diagram which shows the electric structure in the 1st region. 第２領域内の電気的な構成を示す回路図である。It is a circuit diagram which shows the electric structure in the 2nd region. 第３領域内の電気的な構成を示す回路図である。It is a circuit diagram which shows the electric structure in the 3rd region. 対比例に係る圧電デバイスの断面図である。It is sectional drawing of the piezoelectric device which concerns on the inverse proportion. 第２実施形態における複数の圧電デバイスの平面図である。It is a top view of the plurality of piezoelectric devices in the 2nd Embodiment. 図１０におけるXI－XI線の断面図である。It is sectional drawing of the XI-XI line in FIG. 変形例における圧電デバイスの断面図である。It is sectional drawing of the piezoelectric device in the modification.

＜第１実施形態＞
図１は、本発明の第１実施形態に係る液体噴射装置１００を例示する構成図である。第１実施形態の液体噴射装置１００は、液体の例示であるインクを媒体（噴射対象）１２に噴射するインクジェット方式の印刷装置である。媒体１２は、典型的には印刷用紙であるが、樹脂フィルムまたは布帛等の任意の材質の印刷対象が媒体１２として利用される。図１に例示される通り、液体噴射装置１００には、インクを貯留する液体容器１４が設置される。例えば液体噴射装置１００に着脱可能なカートリッジ、可撓性のフィルムで形成された袋状のインクパック、またはインクを補充可能なインクタンクが液体容器１４として利用される。 <First Embodiment>
FIG. 1 is a block diagram illustrating the liquid injection device 100 according to the first embodiment of the present invention. The liquid injection device 100 of the first embodiment is an inkjet printing device that injects ink, which is an example of a liquid, onto a medium (injection target) 12. The medium 12 is typically printing paper, but a printing target of any material such as a resin film or a cloth is used as the medium 12. As illustrated in FIG. 1, a liquid container 14 for storing ink is installed in the liquid injection device 100. For example, a cartridge that can be attached to and detached from the liquid injection device 100, a bag-shaped ink pack made of a flexible film, or an ink tank that can be refilled with ink is used as the liquid container 14.

図１に例示される通り、液体噴射装置１００は、制御ユニット２０と搬送機構２２と移動機構２４と液体噴射ヘッド２６とを具備する。制御ユニット２０は、例えばＣＰＵ（Central Processing Unit）またはＦＰＧＡ（Field Programmable Gate Array）等の処理回路と半導体メモリー等の記憶回路とを含み、液体噴射装置１００の各要素を統括的に制御する。搬送機構２２は、制御ユニット２０による制御のもとで媒体１２をＹ方向（Ｙ1，Ｙ2）に搬送する。 As illustrated in FIG. 1, the liquid injection device 100 includes a control unit 20, a transfer mechanism 22, a moving mechanism 24, and a liquid injection head 26. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and comprehensively controls each element of the liquid injection device 100. The transport mechanism 22 transports the medium 12 in the Y direction (Y1, Y2) under the control of the control unit 20.

移動機構２４は、制御ユニット２０による制御のもとで液体噴射ヘッド２６をＸ方向（Ｘ1，Ｘ2）に往復させる。Ｘ方向は、媒体１２が搬送されるＹ方向に交差（典型的には直交）する方向である。第１実施形態の移動機構２４は、液体噴射ヘッド２６を収容する略箱型の搬送体２４２（キャリッジ）と、搬送体２４２が固定された搬送ベルト２４４とを具備する。なお、複数の液体噴射ヘッド２６を搬送体２４２に搭載した構成や、液体容器１４を液体噴射ヘッド２６とともに搬送体２４２に搭載した構成も採用され得る。 The moving mechanism 24 reciprocates the liquid injection head 26 in the X direction (X1, X2) under the control of the control unit 20. The X direction is a direction that intersects (typically orthogonally) the Y direction in which the medium 12 is conveyed. The moving mechanism 24 of the first embodiment includes a substantially box-shaped transport body 242 (carriage) for accommodating the liquid injection head 26, and a transport belt 244 to which the transport body 242 is fixed. It should be noted that a configuration in which a plurality of liquid injection heads 26 are mounted on the transport body 242 and a configuration in which the liquid container 14 is mounted on the transport body 242 together with the liquid injection head 26 can also be adopted.

液体噴射ヘッド２６は、液体容器１４から供給されるインクを制御ユニット２０による制御のもとで複数のノズル（噴射孔）から媒体１２に噴射する。搬送機構２２による媒体１２の搬送と搬送体２４２の反復的な往復とに並行して各液体噴射ヘッド２６が媒体１２にインクを噴射することで、媒体１２の表面に所望の画像が形成される。 The liquid injection head 26 ejects the ink supplied from the liquid container 14 to the medium 12 from a plurality of nozzles (injection holes) under the control of the control unit 20. A desired image is formed on the surface of the medium 12 by each liquid injection head 26 injecting ink onto the medium 12 in parallel with the transfer of the medium 12 by the transfer mechanism 22 and the repetitive reciprocation of the transfer body 242. ..

図２は、液体噴射ヘッド２６の分解斜視図であり、図３は、図２におけるIII-III線の断面図（Ｘ-Ｚ平面に平行な断面）である。図２に例示される通り、Ｘ-Ｙ平面（例えば媒体１２の表面に平行な平面）に垂直な方向を以下ではＺ方向（Ｚ1，Ｚ2）と表記する。各液体噴射ヘッド２６によるインクの噴射方向（典型的には鉛直方向）がＺ方向に相当する。なお、以下の説明では、Ｘ方向の一方側を「Ｘ1側」と表記するとともに他方側を「Ｘ2側」と表記する。同様に、Ｙ方向の一方側を「Ｙ1側」と表記するとともに他方側を「Ｙ2側」と表記し、Ｚ方向の一方側を「Ｚ1側」と表記するとともに他方側を「Ｚ2側」と表記する。 FIG. 2 is an exploded perspective view of the liquid injection head 26, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 2 (cross section parallel to the XZ plane). As illustrated in FIG. 2, the direction perpendicular to the XY plane (for example, the plane parallel to the surface of the medium 12) is hereinafter referred to as the Z direction (Z1, Z2). The ink injection direction (typically the vertical direction) by each liquid injection head 26 corresponds to the Z direction. In the following description, one side in the X direction is referred to as "X1 side" and the other side is referred to as "X2 side". Similarly, one side in the Y direction is described as "Y1 side", the other side is described as "Y2 side", one side in the Z direction is described as "Z1 side", and the other side is described as "Z2 side". write.

図２および図３に例示される通り、液体噴射ヘッド２６は、Ｙ方向に長尺な略矩形状の流路基板３２を具備する。流路基板３２のうちＺ方向におけるＺ2側の面上には、圧力室基板３４と振動板３６と複数の圧電デバイス３８と筐体部４２と封止体４４とが設置される。他方、流路基板３２のうちＺ方向におけるＺ1側の面上には、ノズル板４６と吸振体４８とが設置される。液体噴射ヘッド２６の各要素は、概略的には流路基板３２と同様にＹ方向に長尺な板状部材であり、例えば接着剤を利用して相互に接合される。 As illustrated in FIGS. 2 and 3, the liquid injection head 26 includes a substantially rectangular flow path substrate 32 that is long in the Y direction. A pressure chamber substrate 34, a diaphragm 36, a plurality of piezoelectric devices 38, a housing portion 42, and a sealing body 44 are installed on the surface of the flow path substrate 32 on the Z2 side in the Z direction. On the other hand, the nozzle plate 46 and the vibration absorbing body 48 are installed on the surface of the flow path substrate 32 on the Z1 side in the Z direction. Each element of the liquid injection head 26 is generally a plate-shaped member elongated in the Y direction like the flow path substrate 32, and is joined to each other by using, for example, an adhesive.

図２に例示される通り、ノズル板４６は、Ｙ方向に配列する複数のノズルＮが形成された板状部材である。各ノズルＮは、インクが通過する貫通孔である。なお、流路基板３２と圧力室基板３４とノズル板４６とは、例えばシリコン（Ｓi）の単結晶基板をエッチング等の半導体製造技術により加工することで形成される。ただし、液体噴射ヘッド２６の各要素の材料や製法は任意である。Ｙ方向は、複数のノズルＮが配列する方向とも換言され得る。 As illustrated in FIG. 2, the nozzle plate 46 is a plate-shaped member in which a plurality of nozzles N arranged in the Y direction are formed. Each nozzle N is a through hole through which ink passes. The flow path substrate 32, the pressure chamber substrate 34, and the nozzle plate 46 are formed by processing, for example, a silicon (Si) single crystal substrate by a semiconductor manufacturing technique such as etching. However, the material and manufacturing method of each element of the liquid injection head 26 are arbitrary. The Y direction can be paraphrased as a direction in which a plurality of nozzles N are arranged.

流路基板３２は、インクの流路を形成するための板状部材である。図２および図３に例示される通り、流路基板３２には、開口部３２２と供給流路３２４と連通流路３２６とが形成される。開口部３２２は、複数のノズルＮにわたり連続するように平面視で（すなわちＺ方向からみて）Ｙ方向に沿う長尺状に形成された貫通孔である。他方、供給流路３２４および連通流路３２６は、ノズルＮ毎に個別に形成された貫通孔である。また、図３に例示される通り、流路基板３２のうちＺ方向におけるＺ1側の表面には、複数の供給流路３２４にわたる中継流路３２８が形成される。中継流路３２８は、開口部３２２と複数の供給流路３２４とを連通させる流路である。 The flow path substrate 32 is a plate-shaped member for forming a flow path of ink. As illustrated in FIGS. 2 and 3, the flow path substrate 32 is formed with an opening 322, a supply flow path 324, and a communication flow path 326. The opening 322 is a through hole formed in a long shape along the Y direction in a plan view (that is, when viewed from the Z direction) so as to be continuous over the plurality of nozzles N. On the other hand, the supply flow path 324 and the communication flow path 326 are through holes individually formed for each nozzle N. Further, as illustrated in FIG. 3, a relay flow path 328 extending over a plurality of supply flow paths 324 is formed on the surface of the flow path substrate 32 on the Z1 side in the Z direction. The relay flow path 328 is a flow path that allows the opening 322 and the plurality of supply flow paths 324 to communicate with each other.

筐体部４２は、例えば樹脂材料の射出成形で製造された構造体であり、流路基板３２のうちＺ方向におけるＺ2側の表面に固定される。図３に例示される通り、筐体部４２には収容部４２２と導入口４２４とが形成される。収容部４２２は、流路基板３２の開口部３２２に対応した外形の凹部であり、導入口４２４は、収容部４２２に連通する貫通孔である。図３から理解される通り、流路基板３２の開口部３２２と筐体部４２の収容部４２２とを相互に連通させた空間が液体貯留室（リザーバー）Ｒとして機能する。液体容器１４から供給されて導入口４２４を通過したインクが液体貯留室Ｒに貯留される。 The housing portion 42 is, for example, a structure manufactured by injection molding of a resin material, and is fixed to the surface of the flow path substrate 32 on the Z2 side in the Z direction. As illustrated in FIG. 3, the housing portion 42 is formed with a housing portion 422 and an introduction port 424. The accommodating portion 422 is a concave portion having an outer shape corresponding to the opening portion 322 of the flow path substrate 32, and the introduction port 424 is a through hole communicating with the accommodating portion 422. As can be understood from FIG. 3, the space in which the opening 322 of the flow path substrate 32 and the accommodating portion 422 of the housing portion 42 communicate with each other functions as a liquid storage chamber (reservoir) R. The ink supplied from the liquid container 14 and passing through the introduction port 424 is stored in the liquid storage chamber R.

吸振体４８は、液体貯留室Ｒ内の圧力変動を吸収するための要素であり、例えば弾性変形が可能な可撓性のシート部材（コンプライアンス基板）を含んで構成される。具体的には、流路基板３２の開口部３２２と中継流路３２８と複数の供給流路３２４とを閉塞して液体貯留室Ｒの底面を構成するように、流路基板３２のうちＺ方向におけるＺ1側の表面に吸振体４８が設置される。 The vibration absorber 48 is an element for absorbing pressure fluctuations in the liquid storage chamber R, and is configured to include, for example, a flexible sheet member (compliance substrate) capable of elastic deformation. Specifically, the Z direction of the flow path substrate 32 so as to block the opening 322 of the flow path substrate 32, the relay flow path 328, and the plurality of supply flow paths 324 to form the bottom surface of the liquid storage chamber R. The vibration absorber 48 is installed on the surface on the Z1 side of the above.

図２および図３に例示される通り、圧力室基板３４は、相異なるノズルＮに対応する複数の圧力室Ｃが形成された板状部材である。複数の圧力室Ｃは、Ｙ方向に沿って配列する。各圧力室Ｃ（キャビティ）は、平面視でＸ方向に沿う長尺状の開口部である。Ｘ方向におけるＸ1側における圧力室Ｃの端部は平面視で流路基板３２の１個の供給流路３２４に重なり、Ｘ方向のＸ2側における圧力室Ｃの端部は平面視で流路基板３２の１個の連通流路３２６に重なる。 As illustrated in FIGS. 2 and 3, the pressure chamber substrate 34 is a plate-shaped member in which a plurality of pressure chambers C corresponding to different nozzles N are formed. The plurality of pressure chambers C are arranged along the Y direction. Each pressure chamber C (cavity) is a long opening along the X direction in a plan view. The end of the pressure chamber C on the X1 side in the X direction overlaps one supply flow path 324 of the flow path substrate 32 in a plan view, and the end of the pressure chamber C on the X2 side in the X direction is a flow path substrate in a plan view. It overlaps with one communication flow path 326 of 32.

圧力室基板３４のうち流路基板３２とは反対側の表面には振動板３６が設置される。振動板３６は、弾性的に変形可能な板状部材である。図３に例示される通り、第１実施形態の振動板３６は、第１層３６１と第２層３６２との積層で構成される。第２層３６２は、第１層３６１からみて圧力室基板３４とは反対側に位置する。第１層３６１は、酸化シリコン（ＳiＯ_２）等の弾性材料で形成された弾性膜であり、第２層３６２は、酸化ジルコニウム（ＺrＯ_２）等の絶縁材料で形成された絶縁膜である。なお、所定の板厚の板状部材のうち圧力室Ｃに対応する領域について板厚方向の一部を選択的に除去することで、圧力室基板３４と振動板３６の一部または全部とを一体に形成することも可能である。 A diaphragm 36 is installed on the surface of the pressure chamber substrate 34 on the side opposite to the flow path substrate 32. The diaphragm 36 is a plate-shaped member that can be elastically deformed. As illustrated in FIG. 3, the diaphragm 36 of the first embodiment is composed of a stack of a first layer 361 and a second layer 362. The second layer 362 is located on the side opposite to the pressure chamber substrate 34 when viewed from the first layer 361. The first layer 361 is an elastic film made of an elastic material such as silicon oxide (SiO ₂ ), and the second layer 362 is an insulating film made of an insulating material such as zirconium oxide (ZrO ₂ ). By selectively removing a part of the plate-shaped member having a predetermined plate thickness in the plate thickness direction in the region corresponding to the pressure chamber C, the pressure chamber substrate 34 and a part or all of the diaphragm 36 can be removed. It is also possible to form them integrally.

図３から理解される通り、流路基板３２と振動板３６とは、各圧力室Ｃの内側で相互に間隔をあけて対向する。圧力室Ｃは、流路基板３２と振動板３６との間に位置し、当該圧力室Ｃ内に充填されたインクに圧力を付与するための空間である。液体貯留室Ｒに貯留されたインクは、中継流路３２８から各供給流路３２４に分岐して複数の圧力室Ｃに並列に供給および充填される。以上の説明から理解される通り、振動板３６は、圧力室Ｃの壁面（具体的には、圧力室Ｃの一面である上面）を構成する。 As can be understood from FIG. 3, the flow path substrate 32 and the diaphragm 36 face each other at a distance inside each pressure chamber C. The pressure chamber C is located between the flow path substrate 32 and the diaphragm 36, and is a space for applying pressure to the ink filled in the pressure chamber C. The ink stored in the liquid storage chamber R branches from the relay flow path 328 to each supply flow path 324, and is supplied and filled in parallel to the plurality of pressure chambers C. As can be understood from the above description, the diaphragm 36 constitutes a wall surface of the pressure chamber C (specifically, an upper surface which is one surface of the pressure chamber C).

図２および図３に例示される通り、振動板３６のうち圧力室Ｃとは反対側の表面（すなわち第２層３６２の表面）には、相異なるノズルＮ（または圧力室Ｃ）に対応する複数の圧電デバイス３８が設置される。各圧電デバイス３８は、駆動信号の供給により変形するアクチュエーターであり、平面視でＸ方向に沿う長尺状に形成される。複数の圧電デバイス３８は、複数の圧力室Ｃに対応するようにＹ方向に配列する。圧電デバイス３８の変形に連動して振動板３６が振動すると、圧力室Ｃ内の圧力が変動することで、圧力室Ｃに充填されたインクが連通流路３２６とノズルＮとを通過して噴射される。 As illustrated in FIGS. 2 and 3, the surface of the diaphragm 36 opposite the pressure chamber C (ie, the surface of the second layer 362) corresponds to a different nozzle N (or pressure chamber C). A plurality of piezoelectric devices 38 are installed. Each piezoelectric device 38 is an actuator that is deformed by supplying a drive signal, and is formed in a long shape along the X direction in a plan view. The plurality of piezoelectric devices 38 are arranged in the Y direction so as to correspond to the plurality of pressure chambers C. When the diaphragm 36 vibrates in conjunction with the deformation of the piezoelectric device 38, the pressure in the pressure chamber C fluctuates, so that the ink filled in the pressure chamber C passes through the communication flow path 326 and the nozzle N and is ejected. Will be done.

図２および図３の封止体４４は、複数の圧電デバイス３８を保護するとともに圧力室基板３４および振動板３６の機械的な強度を補強する構造体であり、振動板３６の表面に例えば接着剤で固定される。封止体４４のうち振動板３６との対向面に形成された凹部の内側に複数の圧電デバイス３８が収容される。 The sealant 44 of FIGS. 2 and 3 is a structure that protects a plurality of piezoelectric devices 38 and reinforces the mechanical strength of the pressure chamber substrate 34 and the diaphragm 36, and is, for example, adhered to the surface of the diaphragm 36. It is fixed with an agent. A plurality of piezoelectric devices 38 are housed inside a recess formed in the sealing body 44 on the surface facing the diaphragm 36.

図３に例示される通り、振動板３６の表面（または圧力室基板３４の表面）には、例えば配線基板５０が接合される。配線基板５０は、制御ユニット２０または電源回路（図示略）と液体噴射ヘッド２６とを電気的に接続するための複数の配線（図示略）が形成された実装部品である。例えばＦＰＣ（Flexible Printed Circuit）やＦＦＣ（Flexible Flat Cable）等の可撓性の配線基板５０が好適に採用される。圧電デバイス３８を駆動するための駆動信号が配線基板５０から各圧電デバイス３８に供給される。 As illustrated in FIG. 3, for example, a wiring board 50 is joined to the surface of the diaphragm 36 (or the surface of the pressure chamber board 34). The wiring board 50 is a mounting component on which a plurality of wirings (not shown) for electrically connecting the control unit 20 or the power supply circuit (not shown) and the liquid injection head 26 are formed. For example, a flexible wiring board 50 such as an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable) is preferably adopted. A drive signal for driving the piezoelectric device 38 is supplied from the wiring board 50 to each piezoelectric device 38.

各圧電デバイス３８の具体的な構成を以下に詳述する。図４は、複数の圧電デバイス３８の平面図である。なお、図４では、任意の１個の要素の奥側に位置する要素の周縁（本来は手前側の要素に隠れる部位）も便宜的に図示されている。また、図５は、図４におけるＶ-Ｖ線の断面図（圧電デバイスの長手方向に沿う断面）である。図４および図５に例示される通り、圧力室ＣのうちＸ方向のＸ1側の壁面と振動板３６の表面（第１層３６１の表面）とが交差する部分を、以下の説明では端部ｃ1と表記する。また、圧力室ＣのうちＸ方向のＸ2側の壁面と振動板３６の表面とが交差する部分を、以下の説明では端部ｃ2と表記する。 The specific configuration of each piezoelectric device 38 will be described in detail below. FIG. 4 is a plan view of the plurality of piezoelectric devices 38. In FIG. 4, the peripheral edge of the element located on the back side of any one element (the part originally hidden by the element on the front side) is also shown for convenience. Further, FIG. 5 is a cross-sectional view of the VV line in FIG. 4 (cross section along the longitudinal direction of the piezoelectric device). As illustrated in FIGS. 4 and 5, the portion of the pressure chamber C where the wall surface on the X1 side in the X direction and the surface of the diaphragm 36 (the surface of the first layer 361) intersect is the end portion in the following description. Notated as c1. Further, the portion of the pressure chamber C where the wall surface on the X2 side in the X direction and the surface of the diaphragm 36 intersect is referred to as an end portion c2 in the following description.

図４および図５に例示される通り、圧電デバイス３８は、第１電極５１と圧電体層５２と第２電極５３と絶縁層５４と第１配線５５と第２配線５６との積層で構成される。なお、本明細書において「要素Ａと要素Ｂとが積層される」という表現は、要素Ａと要素Ｂとが直接的に接触する構成には限定されない。すなわち、要素Ａと要素Ｂとの間に他の要素Ｃが介在する構成も、「要素Ａと要素Ｂとが積層される」という概念に包含される。また、「要素Ａの面上に要素Ｂが形成される」という表現も同様に、要素Ａと要素Ｂとが直接的に接触する構成には限定されない。すなわち、要素Ａの表面に要素Ｃが形成され、要素Ｃの表面に要素Ｂが形成された構成でも、要素Ａと要素Ｂとの少なくとも一部が平面視で重なる構成であれば、「要素Ａの面上に要素Ｂが形成される」という概念に包含される。 As illustrated in FIGS. 4 and 5, the piezoelectric device 38 is composed of a stack of a first electrode 51, a piezoelectric layer 52, a second electrode 53, an insulating layer 54, a first wiring 55, and a second wiring 56. Ru. In the present specification, the expression "element A and element B are laminated" is not limited to a configuration in which element A and element B are in direct contact with each other. That is, a configuration in which another element C is interposed between the element A and the element B is also included in the concept that "the element A and the element B are laminated". Similarly, the expression "element B is formed on the surface of element A" is not limited to the configuration in which element A and element B are in direct contact with each other. That is, even in a configuration in which the element C is formed on the surface of the element A and the element B is formed on the surface of the element C, if at least a part of the element A and the element B overlap in a plan view, "element A". It is included in the concept that "element B is formed on the plane of."

第１電極５１は、振動板３６の面上（具体的には第２層３６２の表面）に形成される。具体的には、第１電極５１は、複数の圧電デバイス３８（または複数の圧力室Ｃ）にわたり連続するようにＹ方向に延在する帯状の共通電極である。第１電極５１におけるＹ方向の端部には、例えば配線基板５０から所定の基準電圧Ｖbsが印加される。 The first electrode 51 is formed on the surface of the diaphragm 36 (specifically, the surface of the second layer 362). Specifically, the first electrode 51 is a band-shaped common electrode extending in the Y direction so as to be continuous over the plurality of piezoelectric devices 38 (or the plurality of pressure chambers C). A predetermined reference voltage Vbs is applied to the end of the first electrode 51 in the Y direction, for example, from the wiring board 50.

図４および図５に例示される通り、第１電極５１のうちＸ方向におけるＸ1側の端部（周縁）Ｅa1は、圧力室ＣにおけるＸ1側の端部ｃ1からみてＸ2側に位置する。また、第１電極５１のうちＸ方向におけるＸ2側の端部Ｅa2は、圧力室ＣにおけるＸ2側の端部ｃ2からみてＸ1側に位置する。すなわち、各圧力室Ｃの端部ｃ1および端部ｃ2は、第１電極５１が形成された範囲の外側に位置する。 As illustrated in FIGS. 4 and 5, the end (peripheral) Ea1 on the X1 side of the first electrode 51 in the X direction is located on the X2 side with respect to the end c1 on the X1 side in the pressure chamber C. Further, the end portion Ea2 on the X2 side of the first electrode 51 in the X direction is located on the X1 side with respect to the end portion c2 on the X2 side in the pressure chamber C. That is, the end portion c1 and the end portion c2 of each pressure chamber C are located outside the range in which the first electrode 51 is formed.

圧電体層５２は、第１電極５１の面上に形成される。圧電体層５２は、圧電デバイス３８毎（または圧力室Ｃ毎）に個別に形成されて平面視で圧力室Ｃに重なる。すなわち、Ｘ方向に長尺な複数の圧電体層５２が相互に間隔をあけてＹ方向に配列する。圧電体層５２の材料または製法は任意である。例えば、チタン酸ジルコン酸鉛等の圧電材料の薄膜をスパッタリング等の公知の成膜技術により形成し、フォトリソグラフィ等の公知の加工技術により当該薄膜を選択的に除去することで、圧電体層５２を形成することが可能である。 The piezoelectric layer 52 is formed on the surface of the first electrode 51. The piezoelectric layer 52 is individually formed for each piezoelectric device 38 (or for each pressure chamber C) and overlaps the pressure chamber C in a plan view. That is, a plurality of piezoelectric layers 52 elongated in the X direction are arranged in the Y direction with a space between them. The material or manufacturing method of the piezoelectric layer 52 is arbitrary. For example, a thin film of a piezoelectric material such as lead zirconate titanate is formed by a known film forming technique such as sputtering, and the thin film is selectively removed by a known processing technique such as photolithography to form a piezoelectric layer 52. Is possible to form.

図４および図５に例示される通り、圧電体層５２におけるＸ方向のＸ1側の端部Ｅb1（第１端の例示）は、第１電極５１の端部Ｅa1からみてＸ方向のＸ2側に位置する。また、圧電体層５２におけるＸ方向のＸ2側の端部Ｅb2（第２端の例示）は、第１電極５１の端部Ｅa2からみてＸ方向のＸ1側に位置する。以上の説明から理解される通り、各圧電体層５２は、第１電極５１が形成された範囲の内側に位置する。すなわち、図４および図５に例示される通り、第１電極５１は、圧電体層５２が積層された第１部分Ｓ1と、圧電体層５２が積層されない第２部分Ｓ2および第３部分Ｓ3とを含む。第１部分Ｓ1は、圧電体層５２と平面視で重なる領域であり、第２部分Ｓ2および第３部分Ｓ3は、平面視で圧電体層５２の周縁からＸ方向に張出した領域である。第２部分Ｓ2は、第１部分Ｓ1からみてＸ方向のＸ1側（端部Ｅa1側）の領域である。第３部分Ｓ3は、第１部分Ｓ1を挟んで第２部分Ｓ2とは反対側（第１部分Ｓ1からみてＸ方向のＸ2側）の領域である。 As illustrated in FIGS. 4 and 5, the end Eb1 on the X1 side of the piezoelectric layer 52 (example of the first end) is on the X2 side in the X direction when viewed from the end Ea1 of the first electrode 51. To position. Further, the end portion Eb2 (example of the second end) on the X2 side of the piezoelectric layer 52 is located on the X1 side in the X direction with respect to the end portion Ea2 of the first electrode 51. As can be understood from the above description, each piezoelectric layer 52 is located inside the range in which the first electrode 51 is formed. That is, as illustrated in FIGS. 4 and 5, the first electrode 51 includes a first portion S1 in which the piezoelectric layer 52 is laminated, and a second portion S2 and a third portion S3 in which the piezoelectric layer 52 is not laminated. including. The first portion S1 is a region that overlaps the piezoelectric layer 52 in a plan view, and the second portion S2 and the third portion S3 are regions that project in the X direction from the peripheral edge of the piezoelectric layer 52 in a plan view. The second portion S2 is a region on the X1 side (end Ea1 side) in the X direction when viewed from the first portion S1. The third portion S3 is a region on the opposite side of the first portion S1 from the second portion S2 (X2 side in the X direction when viewed from the first portion S1).

第２電極５３は、圧電体層５２の面上に形成される。第２電極５３は、圧電デバイス３８毎（または圧力室Ｃ毎）に個別に形成された個別電極である。具体的には、Ｘ方向に延在する複数の第２電極５３が、相互に間隔をあけてＹ方向に配列する。第２電極５３の材料または製法は任意である。例えば、白金またはイリジウム等の導電材料の薄膜をスパッタリング等の公知の成膜技術により形成し、フォトリソグラフィ等の公知の加工技術により当該薄膜を選択的に除去することで、第２電極５３を形成することが可能である。 The second electrode 53 is formed on the surface of the piezoelectric layer 52. The second electrode 53 is an individual electrode individually formed for each piezoelectric device 38 (or each pressure chamber C). Specifically, a plurality of second electrodes 53 extending in the X direction are arranged in the Y direction at intervals from each other. The material or manufacturing method of the second electrode 53 is arbitrary. For example, a thin film of a conductive material such as platinum or iridium is formed by a known film forming technique such as sputtering, and the thin film is selectively removed by a known processing technique such as photolithography to form a second electrode 53. It is possible to do.

第２電極５３のうちＸ方向におけるＸ1側の端部Ｅc1は、圧電体層５２の端部Ｅb1からみてＸ方向のＸ2側に位置する。また、第２電極５３のうちＸ方向におけるＸ2側の端部Ｅc2は、圧電体層５２の端部Ｅb2からみてＸ方向のＸ1側に位置する。また、第２電極５３は、Ｙ方向においても圧電体層５２の内側に位置する。以上の説明から理解される通り、第２電極５３は、圧電体層５２が形成された範囲の内側に位置する。 The end Ec1 on the X1 side of the second electrode 53 is located on the X2 side in the X direction with respect to the end Eb1 of the piezoelectric layer 52. Further, the end Ec2 on the X2 side of the second electrode 53 is located on the X1 side in the X direction when viewed from the end Eb2 of the piezoelectric layer 52. Further, the second electrode 53 is located inside the piezoelectric layer 52 also in the Y direction. As can be understood from the above description, the second electrode 53 is located inside the range in which the piezoelectric layer 52 is formed.

第１電極５１と圧電体層５２と第２電極５３との積層により圧電素子Ｐが構成される。圧力室Ｃ毎（またはノズルＮ毎）に圧電素子Ｐが個別に形成される。Ｘ方向に長尺な複数の圧電素子Ｐが、相互に間隔をあけてＹ方向に配列する。圧電体層５２のうち第１電極５１と第２電極５３とで挟まれた部分（いわゆる能動部）が、第１電極５１に印加される基準電圧Ｖbsと第２電極５３に供給される駆動信号Ｖdrとの電圧差に応じて変形する。なお、Ｚ方向は、圧電素子Ｐを構成する複数層が積層された方向とも換言され得る。 The piezoelectric element P is configured by laminating the first electrode 51, the piezoelectric layer 52, and the second electrode 53. Piezoelectric elements P are individually formed for each pressure chamber C (or for each nozzle N). A plurality of piezoelectric elements P elongated in the X direction are arranged in the Y direction at intervals from each other. The portion of the piezoelectric layer 52 sandwiched between the first electrode 51 and the second electrode 53 (so-called active portion) is the reference voltage Vbs applied to the first electrode 51 and the drive signal supplied to the second electrode 53. It deforms according to the voltage difference with Vdr. The Z direction can also be rephrased as a direction in which a plurality of layers constituting the piezoelectric element P are laminated.

絶縁層５４は、複数の圧電素子Ｐが形成された振動板３６の表面を覆う絶縁性の被膜である。すなわち、絶縁層５４は、第１電極５１と圧電体層５２と第２電極５３とを被覆する。絶縁層５４は、例えば酸化珪素（ＳｉＯ_ｘ）または窒化珪素（ＳｉＮ_ｘ）等の絶縁材料で形成される。 The insulating layer 54 is an insulating film that covers the surface of the diaphragm 36 on which a plurality of piezoelectric elements P are formed. That is, the insulating layer 54 covers the first electrode 51, the piezoelectric layer 52, and the second electrode 53. The insulating layer 54 is formed of an insulating material such as silicon oxide (SiO _x ) or silicon nitride (SiN _x ).

第１配線５５は、絶縁層５４の面上に形成された導電層である。第１配線５５は、圧電素子Ｐ毎（または圧力室Ｃ毎）に個別に形成される。具体的には、Ｘ方向に長尺な複数の第１配線５５が、相互に間隔をあけてＹ方向に配列する。 The first wiring 55 is a conductive layer formed on the surface of the insulating layer 54. The first wiring 55 is individually formed for each piezoelectric element P (or for each pressure chamber C). Specifically, a plurality of first wirings 55 elongated in the X direction are arranged in the Y direction with mutual spacing.

図４および図５に例示される通り、第１配線５５は、圧電体層５２の端部Ｅb1側に形成される。すなわち、第１配線５５は、圧電体層５２の端部Ｅb1に平面視で重なる。具体的には、第１配線５５のうちＸ方向におけるＸ1側の端部Ｅd1は、第１電極５１の端部Ｅa1からみてＸ方向のＸ1側に位置する。また、第１配線５５のうちＸ方向におけるＸ2側の端部Ｅd2は、第２電極５３の端部Ｅc1からみてＸ方向のＸ2側に位置する。以上の説明から理解される通り、第１配線５５は、圧電体層５２および第２電極５３の面上と第１電極５１の第２部分Ｓ2（圧電体層５２に重ならない部分）の面上とにわたり連続する。なお、図４においては、第１配線５５が圧電体層５２よりも幅広である構成を例示したが、第１配線５５の配線幅は任意である。 As illustrated in FIGS. 4 and 5, the first wiring 55 is formed on the end Eb1 side of the piezoelectric layer 52. That is, the first wiring 55 overlaps the end portion Eb1 of the piezoelectric layer 52 in a plan view. Specifically, the end Ed1 on the X1 side of the first wiring 55 in the X direction is located on the X1 side in the X direction when viewed from the end Ea1 of the first electrode 51. Further, the end Ed2 on the X2 side of the first wiring 55 is located on the X2 side in the X direction when viewed from the end Ec1 of the second electrode 53. As can be understood from the above description, the first wiring 55 is on the surface of the piezoelectric layer 52 and the second electrode 53 and on the surface of the second portion S2 (the portion that does not overlap the piezoelectric layer 52) of the first electrode 51. And so on. Although FIG. 4 illustrates a configuration in which the first wiring 55 is wider than the piezoelectric layer 52, the wiring width of the first wiring 55 is arbitrary.

第１配線５５のうち圧電体層５２の面上に位置する端部Ｅd2側の部分は、絶縁層５４に形成されたコンタクトホールＨ1（第１コンタクトホールの例示）を介して第２電極５３に電気的に接続される。また、第１配線５５のうち圧電体層５２の端部Ｅb1からみてＸ方向のＸ1側の部分は、絶縁層５４を挟んで第１電極５１の第２部分Ｓ2に平面視で重なる。したがって、第１配線５５（さらには第２電極５３）と第１電極５１とは電気的に絶縁される。第１配線５５のうち端部Ｅd1側の部分は、配線基板５０の配線に電気的に接続される。以上の構成において、配線基板５０（外部回路の例示）から第１配線５５に供給された駆動信号Ｖdrは、第１配線５５を介して第２電極５３に供給される。 The portion of the first wiring 55 on the end Ed2 side located on the surface of the piezoelectric layer 52 is connected to the second electrode 53 via the contact hole H1 (example of the first contact hole) formed in the insulating layer 54. It is electrically connected. Further, the portion of the first wiring 55 on the X1 side in the X direction when viewed from the end portion Eb1 of the piezoelectric layer 52 overlaps the second portion S2 of the first electrode 51 with the insulating layer 54 interposed therebetween in a plan view. Therefore, the first wiring 55 (further, the second electrode 53) and the first electrode 51 are electrically insulated from each other. The portion of the first wiring 55 on the Ed1 side is electrically connected to the wiring of the wiring board 50. In the above configuration, the drive signal Vdr supplied from the wiring board 50 (exemplification of the external circuit) to the first wiring 55 is supplied to the second electrode 53 via the first wiring 55.

第２配線５６は、絶縁層５４の面上に形成された導電層である。第２配線５６は、圧電素子Ｐ毎（または圧力室Ｃ毎）に個別に形成される。具体的には、Ｘ方向に長尺な複数の第２配線５６が、相互に間隔をあけてＹ方向に配列する。 The second wiring 56 is a conductive layer formed on the surface of the insulating layer 54. The second wiring 56 is individually formed for each piezoelectric element P (or for each pressure chamber C). Specifically, a plurality of second wirings 56 that are long in the X direction are arranged in the Y direction at intervals from each other.

図４および図５に例示される通り、第２配線５６は、圧電体層５２の端部Ｅb2側に形成される。すなわち、第２配線５６は、圧電体層５２の端部Ｅb2に平面視で重なる。具体的には、第２配線５６のうちＸ方向におけるＸ1側の端部Ｅe1は、第２電極５３の端部Ｅc2からみてＸ方向のＸ1側に位置する。また、第２配線５６のうちＸ方向におけるＸ2側の端部Ｅe2は、第１電極５１の端部Ｅa2からみてＸ方向のＸ2側に位置する。第１実施形態では、さらに、第２配線５６におけるＸ2側の端部Ｅe2は、圧力室Ｃの端部ｃ2からみてＸ2側に位置する。以上の説明から理解される通り、第２配線５６は、圧電体層５２および第２電極５３の面上と第１電極５１の第３部分Ｓ3（圧電体層５２に重ならない部分）の面上とにわたり連続する。すなわち、第１配線５５と第２配線５６とは、概略的には、Ｙ-Ｚ平面を挟んで面対称に形成される。なお、図４においては、第２配線５６が圧電体層５２よりも幅広である構成を例示したが、第２配線５６の配線幅は任意である。 As illustrated in FIGS. 4 and 5, the second wiring 56 is formed on the end Eb2 side of the piezoelectric layer 52. That is, the second wiring 56 overlaps the end portion Eb2 of the piezoelectric layer 52 in a plan view. Specifically, the end Ee1 on the X1 side of the second wiring 56 in the X direction is located on the X1 side in the X direction when viewed from the end Ec2 of the second electrode 53. Further, the end Ee2 on the X2 side of the second wiring 56 is located on the X2 side in the X direction when viewed from the end Ea2 of the first electrode 51. Further, in the first embodiment, the end portion Ee2 on the X2 side of the second wiring 56 is located on the X2 side with respect to the end portion c2 of the pressure chamber C. As can be understood from the above description, the second wiring 56 is on the surface of the piezoelectric layer 52 and the second electrode 53 and on the surface of the third portion S3 (the portion that does not overlap the piezoelectric layer 52) of the first electrode 51. And so on. That is, the first wiring 55 and the second wiring 56 are generally formed symmetrically with the YZ plane interposed therebetween. Although FIG. 4 illustrates a configuration in which the second wiring 56 is wider than the piezoelectric layer 52, the wiring width of the second wiring 56 is arbitrary.

第２配線５６のうち圧電体層５２の端部Ｅb2からみてＸ方向のＸ2側の部分は、絶縁層５４を挟んで第１電極５１の第３部分Ｓ3に平面視で重なる。すなわち、第２配線５６と第１電極５１とは電気的に絶縁される。他方、第２配線５６のうち端部Ｅe1側の部分は、圧電体層５２の面上において第２電極５３のうち端部Ｅc2側の部分に平面視で重なる。第２配線５６のうち圧電体層５２の面上に位置する端部Ｅe1側の部分は、絶縁層５４に形成されたコンタクトホールＨ2（第２コンタクトホールの例示）を介して第２電極５３に電気的に接続される。すなわち、第２配線５６は、第２電極５３と第１配線５５とを介して配線基板５０の配線に電気的に接続される。したがって、配線基板５０から第１配線５５に供給された駆動信号Ｖdrは、第２電極５３を介して第２配線５６にも供給される。 The portion of the second wiring 56 on the X2 side in the X direction when viewed from the end portion Eb2 of the piezoelectric layer 52 overlaps the third portion S3 of the first electrode 51 with the insulating layer 54 interposed therebetween in a plan view. That is, the second wiring 56 and the first electrode 51 are electrically insulated from each other. On the other hand, the portion of the second wiring 56 on the end Ee1 side overlaps the portion of the second electrode 53 on the end Ec2 side on the surface of the piezoelectric layer 52 in a plan view. The portion of the second wiring 56 on the end Ee1 side located on the surface of the piezoelectric layer 52 is connected to the second electrode 53 via the contact hole H2 (example of the second contact hole) formed in the insulating layer 54. It is electrically connected. That is, the second wiring 56 is electrically connected to the wiring of the wiring board 50 via the second electrode 53 and the first wiring 55. Therefore, the drive signal Vdr supplied from the wiring board 50 to the first wiring 55 is also supplied to the second wiring 56 via the second electrode 53.

第１配線５５および第２配線５６は、共通の導電層（単層または複数層）を選択的に除去することで一括的に形成される。したがって、第１配線５５と第２配線５６とは、共通の導電材料により略同一の膜厚に形成される。例えば、金等の低抵抗な金属の導電層をスパッタリング等の公知の成膜技術により形成し、フォトリソグラフィ等の公知の加工技術により当該導電層を選択的に除去することで、第１配線５５と第２配線５６とが一括的に形成される。第１配線５５および第２配線５６の膜厚は、第２電極５３の膜厚よりも厚い。例えば、第２電極５３は、圧電体層５２の変形を過度に抑制しないように充分に薄い膜厚に形成される。他方、第１配線５５および第２配線５６については、配線抵抗が充分に低減されるように相応の膜厚が確保される。 The first wiring 55 and the second wiring 56 are collectively formed by selectively removing a common conductive layer (single layer or a plurality of layers). Therefore, the first wiring 55 and the second wiring 56 are formed of a common conductive material to have substantially the same film thickness. For example, the first wiring 55 is formed by forming a conductive layer of a low resistance metal such as gold by a known film forming technique such as sputtering, and selectively removing the conductive layer by a known processing technique such as photolithography. And the second wiring 56 are collectively formed. The film thickness of the first wiring 55 and the second wiring 56 is thicker than the film thickness of the second electrode 53. For example, the second electrode 53 is formed to have a sufficiently thin film thickness so as not to excessively suppress the deformation of the piezoelectric layer 52. On the other hand, for the first wiring 55 and the second wiring 56, a corresponding film thickness is secured so that the wiring resistance is sufficiently reduced.

図４および図５に例示される通り、圧電デバイス３８のうち圧電体層５２が形成された範囲は、平面視で第１領域Ｑ1と第２領域Ｑ2と第３領域Ｑ3とに区分される。第２領域Ｑ2は、圧電体層５２における端部Ｅb1側の領域であり、第３領域Ｑ3は、圧電体層５２における端部Ｅb2側の領域である。第１領域Ｑ1は、第２領域Ｑ2と第３領域Ｑ3との間の領域である。すなわち、第１領域Ｑ1からみてＸ方向のＸ1側に第２領域Ｑ2が位置し、第１領域Ｑ1からみてＸ方向のＸ2側の第３領域Ｑ3が位置する。 As illustrated in FIGS. 4 and 5, the range in which the piezoelectric layer 52 is formed in the piezoelectric device 38 is divided into a first region Q1, a second region Q2, and a third region Q3 in a plan view. The second region Q2 is a region on the end Eb1 side of the piezoelectric layer 52, and the third region Q3 is a region on the end Eb2 side of the piezoelectric layer 52. The first region Q1 is a region between the second region Q2 and the third region Q3. That is, the second region Q2 is located on the X1 side in the X direction when viewed from the first region Q1, and the third region Q3 on the X2 side in the X direction when viewed from the first region Q1 is located.

第１領域Ｑ1は、第１配線５５および第２配線５６が形成されない領域である。したがって、第１領域Ｑ1（能動部）においては、第１電極５１（第１部分Ｓ1）と圧電体層５２と第２電極５３とが振動板３６側からこの順番で積層される。他方、第２領域Ｑ2は、第１配線５５が形成された領域である。したがって、第２領域Ｑ2においては、第１電極５１（第２部分Ｓ2）と圧電体層５２と絶縁層５４と第１配線５５とが振動板３６側からこの順番で積層される。また、第３領域Ｑ3は、第２配線５６が形成された領域である。したがって、第３領域Ｑ3においては、第１電極５１（第３部分Ｓ3）と圧電体層５２と絶縁層５４と第２配線５６とが振動板３６側からこの順番で積層される。 The first region Q1 is a region in which the first wiring 55 and the second wiring 56 are not formed. Therefore, in the first region Q1 (active portion), the first electrode 51 (first portion S1), the piezoelectric layer 52, and the second electrode 53 are laminated in this order from the diaphragm 36 side. On the other hand, the second region Q2 is a region in which the first wiring 55 is formed. Therefore, in the second region Q2, the first electrode 51 (second portion S2), the piezoelectric layer 52, the insulating layer 54, and the first wiring 55 are laminated in this order from the diaphragm 36 side. Further, the third region Q3 is a region in which the second wiring 56 is formed. Therefore, in the third region Q3, the first electrode 51 (third portion S3), the piezoelectric layer 52, the insulating layer 54, and the second wiring 56 are laminated in this order from the diaphragm 36 side.

図６に例示される通り、第１領域Ｑ1には、圧電体層５２を誘電体とする容量素子Ｃpが第１電極５１と第２電極５３との間に形成される。他方、第２領域Ｑ2においては、第１電極５１と第１配線５５との間に圧電体層５２と絶縁層５４とが介在する。すなわち、第２領域Ｑ2においては、図７に例示される通り、圧電体層５２を誘電体とする容量素子Ｃpと、絶縁層５４を誘電体とする容量素子Ｃsとが、第１電極５１と第１配線５５との間に直列に接続される。第３領域Ｑ3においては、第１電極５１と第２配線５６との間に圧電体層５２と絶縁層５４とが介在する。すなわち、第３領域Ｑ3においては、図８に例示される通り、圧電体層５２を誘電体とする容量素子Ｃpと、絶縁層５４を誘電体とする容量素子Ｃsとが、第１電極５１と第２配線５６との間に直列に接続される。 As illustrated in FIG. 6, in the first region Q1, a capacitive element Cp having the piezoelectric layer 52 as a dielectric is formed between the first electrode 51 and the second electrode 53. On the other hand, in the second region Q2, the piezoelectric layer 52 and the insulating layer 54 are interposed between the first electrode 51 and the first wiring 55. That is, in the second region Q2, as illustrated in FIG. 7, the capacitive element Cp having the piezoelectric layer 52 as a dielectric and the capacitive element Cs having the insulating layer 54 as a dielectric are the first electrodes 51. It is connected in series with the first wiring 55. In the third region Q3, the piezoelectric layer 52 and the insulating layer 54 are interposed between the first electrode 51 and the second wiring 56. That is, in the third region Q3, as illustrated in FIG. 8, the capacitive element Cp having the piezoelectric layer 52 as a dielectric and the capacitive element Cs having the insulating layer 54 as a dielectric are the first electrodes 51. It is connected in series with the second wiring 56.

以上に説明した通り、第１実施形態では、圧電体層５２の長手方向（Ｘ方向）において第１配線５５とは反対側に第２配線５６が形成される。以上の構成によれば、圧電体層５２のうち端部Ｅb2側の部分の機械的な剛性が、第１配線５５が形成された端部Ｅb1側と同等に確保される。したがって、端部Ｅb2の近傍における圧電体層５２や振動板３６におけるクラックの発生を抑制することが可能である。 As described above, in the first embodiment, the second wiring 56 is formed on the side opposite to the first wiring 55 in the longitudinal direction (X direction) of the piezoelectric layer 52. According to the above configuration, the mechanical rigidity of the portion of the piezoelectric layer 52 on the end Eb2 side is ensured to be the same as that on the end Eb1 side on which the first wiring 55 is formed. Therefore, it is possible to suppress the occurrence of cracks in the piezoelectric layer 52 and the diaphragm 36 in the vicinity of the end portion Eb2.

図９は、第２配線５６を形成しない構成（以下「対比例」という）の断面図である。図９に例示される通り、対比例において、第１電極５１と第２電極５３とが対向する領域Ｑa内では、基準電圧Ｖbsと駆動信号Ｖdrとの差分に相当する電圧Ｖaが圧電体層５２に印加される。他方、領域ＱaからみてＸ方向のＸ2側に位置する領域Ｑb内では、圧電体層５２に電圧は印加されない。すなわち、圧電体層５２は、領域Ｑa内では電圧Ｖaに応じて変形する一方、領域Ｑb内では変形しない。したがって、領域Ｑaと領域Ｑbとの境界に局所的な応力差が発生し、圧電体層５２にクラックが発生する可能性がある。 FIG. 9 is a cross-sectional view of a configuration (hereinafter referred to as “inverse proportion”) in which the second wiring 56 is not formed. As illustrated in FIG. 9, in the region Qa where the first electrode 51 and the second electrode 53 face each other in inverse proportion, the voltage Va corresponding to the difference between the reference voltage Vbs and the drive signal Vdr is the piezoelectric layer 52. Is applied to. On the other hand, no voltage is applied to the piezoelectric layer 52 in the region Qb located on the X2 side in the X direction with respect to the region Qa. That is, the piezoelectric layer 52 is deformed in the region Qa according to the voltage Va, but is not deformed in the region Qb. Therefore, a local stress difference may occur at the boundary between the region Qa and the region Qb, and a crack may occur in the piezoelectric layer 52.

他方、第１実施形態の第３領域Ｑ3内においては、第１電極５１と第２配線５６との間に圧電体層５２と絶縁層５４とが介在する。以上の構成では、第１電極５１と第２配線５６との間の電圧Ｖaは、図８の容量素子Ｃsと容量素子Ｃpとで分割される。したがって、圧電体層５２に印加される電圧Ｖbは、第１電極５１と第２配線５６との間の電圧Ｖaを下回る。すなわち、第３領域Ｑ3内の圧電体層５２には、第１領域Ｑ1内の圧電体層５２よりも低い電圧が印加される。したがって、圧電体層５２のうち第１領域Ｑ1と第３領域Ｑ3との境界に発生する応力差は、対比例１と比較して低減される。すなわち、第１実施形態によれば、機械的な剛性の観点だけでなく、以上に説明した電気的な観点からも、圧電体層５２におけるクラックの発生を抑制できるという利点がある。 On the other hand, in the third region Q3 of the first embodiment, the piezoelectric layer 52 and the insulating layer 54 are interposed between the first electrode 51 and the second wiring 56. In the above configuration, the voltage Va between the first electrode 51 and the second wiring 56 is divided by the capacitive element Cs and the capacitive element Cp in FIG. Therefore, the voltage Vb applied to the piezoelectric layer 52 is lower than the voltage Va between the first electrode 51 and the second wiring 56. That is, a voltage lower than that of the piezoelectric layer 52 in the first region Q1 is applied to the piezoelectric layer 52 in the third region Q3. Therefore, the stress difference generated at the boundary between the first region Q1 and the third region Q3 of the piezoelectric layer 52 is reduced as compared with the inverse proportion 1. That is, according to the first embodiment, there is an advantage that the generation of cracks in the piezoelectric layer 52 can be suppressed not only from the viewpoint of mechanical rigidity but also from the viewpoint of electrical described above.

＜第２実施形態＞
本発明の第２実施形態を説明する。なお、以下に例示する各形態において作用または機能が第１実施形態と同様である要素については、第１実施形態の説明で使用した符号を流用して各々の詳細な説明を適宜に省略する。 <Second Embodiment>
A second embodiment of the present invention will be described. For the elements whose actions or functions are the same as those of the first embodiment in each of the embodiments exemplified below, the reference numerals used in the description of the first embodiment will be diverted and detailed description of each will be omitted as appropriate.

図１０は、第２実施形態における複数の圧電デバイス３８の平面図であり、図１１は、図１０におけるXI－XI線の断面図である。図１０および図１１に例示される通り、第２実施形態の圧電デバイス３８は、第１実施形態と同様の要素に加えて第３配線５７を具備する。第３配線５７は、複数の圧電デバイス３８にわたり連続するようにＹ方向に延在する帯状の電極である。第３配線５７は、第１電極５１と比較して抵抗率が低い導電材料で形成される。例えば、共通の導電層を選択的に除去することで、第１配線５５と第２配線５６と第３配線５７とが一括的に形成される。 10 is a plan view of the plurality of piezoelectric devices 38 in the second embodiment, and FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG. As illustrated in FIGS. 10 and 11, the piezoelectric device 38 of the second embodiment includes a third wiring 57 in addition to the same elements as those of the first embodiment. The third wiring 57 is a band-shaped electrode extending in the Y direction so as to be continuous over the plurality of piezoelectric devices 38. The third wiring 57 is made of a conductive material having a resistivity lower than that of the first electrode 51. For example, by selectively removing the common conductive layer, the first wiring 55, the second wiring 56, and the third wiring 57 are collectively formed.

図１０および図１１に例示される通り、第３配線５７は、第１電極５１のうち端部Ｅa2側の部分に平面視で重なる。したがって、第３配線５７は、平面視で第２配線５６を挟んで第１配線５５とは反対側に形成される。第３配線５７は、絶縁層５４に形成されたコンタクトホールＨ3を介して第１電極５１に導通する。図４に例示される通り、コンタクトホールＨ3は、例えば圧電デバイス３８毎に個別に形成される。ただし、コンタクトホールＨ3の形状や位置は任意である。例えば、複数の圧電デバイス３８にわたり連続するＸ方向に長尺なコンタクトホールＨ3を形成してもよい。第３配線５７には、例えば配線基板５０から所定の基準電圧Ｖbsが印加される。基準電圧Ｖbsは、第３配線５７を介して第１電極５１に印加される。 As illustrated in FIGS. 10 and 11, the third wiring 57 overlaps the portion of the first electrode 51 on the end Ea2 side in a plan view. Therefore, the third wiring 57 is formed on the side opposite to the first wiring 55 with the second wiring 56 interposed therebetween in a plan view. The third wiring 57 conducts to the first electrode 51 via the contact hole H3 formed in the insulating layer 54. As illustrated in FIG. 4, the contact holes H3 are individually formed for each piezoelectric device 38, for example. However, the shape and position of the contact hole H3 are arbitrary. For example, a continuous contact hole H3 in the X direction may be formed across the plurality of piezoelectric devices 38. A predetermined reference voltage Vbs is applied to the third wiring 57, for example, from the wiring board 50. The reference voltage Vbs is applied to the first electrode 51 via the third wiring 57.

第２実施形態においても第１実施形態と同様の効果が実現される。また、第３実施形態では、第３配線５７を介して第１電極５１に電圧を印加することが可能である。ところで、圧電体層５２の変形量を充分に確保する観点からは、第１電極５１を充分に薄く形成することが重要である。しかし、第１電極５１の膜厚が薄いほど第１電極５１の抵抗が増大するから、配線基板５０から第１電極５１に印加された電圧に、第１電極５１のＹ方向に沿った電圧降下が発生する。以上に説明した電圧降下に起因して、各圧電デバイス３８の圧電素子Ｐに印加される電圧に誤差が発生する可能性がある。第２実施形態では、第１電極５１と比較して抵抗率が低い導電材料で第３配線５７が形成される。したがって、第１電極５１における電圧降下が抑制され、結果的に各圧電素子Ｐに印加される電圧の誤差を低減できるという利点がある。 The same effect as that of the first embodiment is realized in the second embodiment. Further, in the third embodiment, it is possible to apply a voltage to the first electrode 51 via the third wiring 57. By the way, from the viewpoint of ensuring a sufficient amount of deformation of the piezoelectric layer 52, it is important to form the first electrode 51 sufficiently thin. However, as the thickness of the first electrode 51 becomes thinner, the resistance of the first electrode 51 increases, so that the voltage applied from the wiring board 50 to the first electrode 51 causes a voltage drop along the Y direction of the first electrode 51. Occurs. Due to the voltage drop described above, an error may occur in the voltage applied to the piezoelectric element P of each piezoelectric device 38. In the second embodiment, the third wiring 57 is formed of a conductive material having a resistivity lower than that of the first electrode 51. Therefore, there is an advantage that the voltage drop in the first electrode 51 is suppressed, and as a result, the error of the voltage applied to each piezoelectric element P can be reduced.

＜変形例＞
以上に例示した各形態は多様に変形され得る。前述の各形態に適用され得る具体的な変形の態様を以下に例示する。なお、以下の例示から任意に選択された２以上の態様は、相互に矛盾しない範囲で適宜に併合され得る。 <Modification example>
Each of the above-exemplified forms can be variously modified. Specific embodiments that can be applied to each of the above-mentioned embodiments are illustrated below. It should be noted that the two or more embodiments arbitrarily selected from the following examples can be appropriately merged within a range that does not contradict each other.

（１）前述の各形態では、絶縁層５４が各圧電体層５２の全体を覆う構成を例示したが、絶縁層５４が形成される範囲は以上の例示に限定されない。例えば、図１２に例示される通り、第２電極５３の表面の一部または全部に絶縁層５４を形成しない構成も採用され得る。第１配線５５および第２配線５６の各々において絶縁層５４の周縁から張出した部分が第２電極５３に導通する。図１２の例示から理解される通り、コンタクトホールＨ1およびコンタクトホールＨ2を省略してもよい。また、第２実施形態において、第３配線５７のうち絶縁層５４の周縁から張出した部分を第１電極５１に接触させてもよい。すなわち、コンタクトホールＨ3は省略される。 (1) In each of the above-described embodiments, the configuration in which the insulating layer 54 covers the entire piezoelectric layer 52 is exemplified, but the range in which the insulating layer 54 is formed is not limited to the above examples. For example, as illustrated in FIG. 12, a configuration in which the insulating layer 54 is not formed on a part or all of the surface of the second electrode 53 may be adopted. In each of the first wiring 55 and the second wiring 56, the portion protruding from the peripheral edge of the insulating layer 54 conducts to the second electrode 53. As can be understood from the example of FIG. 12, the contact hole H1 and the contact hole H2 may be omitted. Further, in the second embodiment, the portion of the third wiring 57 overhanging from the peripheral edge of the insulating layer 54 may be brought into contact with the first electrode 51. That is, the contact hole H3 is omitted.

（２）前述の各形態では、複数の圧電デバイス３８にわたり連続する帯状の第１電極５１を例示したが、第１電極５１の平面形状は以上の例示に限定されない。例えば、第１電極５１を圧電デバイス３８毎に個別に形成してもよい。第１電極５１を個別電極とした構成では、第１電極５１が形成された範囲の内側に圧電体層５２が形成される。 (2) In each of the above-described embodiments, the strip-shaped first electrode 51 continuous over the plurality of piezoelectric devices 38 is illustrated, but the planar shape of the first electrode 51 is not limited to the above examples. For example, the first electrode 51 may be individually formed for each piezoelectric device 38. In the configuration in which the first electrode 51 is an individual electrode, the piezoelectric layer 52 is formed inside the range in which the first electrode 51 is formed.

（３）圧力室Ｃの端部ｃ1および端部ｃ2の位置は前述の各形態での例示に限定されない。例えば、第１電極５１の端部Ｅa1と第１配線５５の端部Ｅd2との間の範囲内の任意の位置に圧力室Ｃの端部ｃ1を位置させてもよい。同様に、例えば、第１電極５１の端部Ｅa2と第２配線５６の端部Ｅe1との間の範囲内の任意の位置に圧力室Ｃの端部ｃ2を位置させてもよい。 (3) The positions of the end portion c1 and the end portion c2 of the pressure chamber C are not limited to the above-mentioned examples. For example, the end portion c1 of the pressure chamber C may be positioned at an arbitrary position within the range between the end portion Ea1 of the first electrode 51 and the end portion Ed2 of the first wiring 55. Similarly, for example, the end portion c2 of the pressure chamber C may be positioned at an arbitrary position within the range between the end portion Ea2 of the first electrode 51 and the end portion Ee1 of the second wiring 56.

（４）圧力室Ｃまたは圧電デバイス３８の平面形状は前述の各形態の例示に限定されない。例えば、シリコン（Ｓi）の単結晶基板を圧力室基板３４として利用した構成では、実際には、圧力室Ｃの平面形状に結晶面が反映される。 (4) The planar shape of the pressure chamber C or the piezoelectric device 38 is not limited to the above-mentioned examples of each form. For example, in a configuration in which a silicon (Si) single crystal substrate is used as the pressure chamber substrate 34, the crystal plane is actually reflected in the planar shape of the pressure chamber C.

（５）前述の各形態では、液体噴射ヘッド２６を搭載した搬送体２４２を往復させるシリアル方式の液体噴射装置１００を例示したが、複数のノズルＮが媒体１２の全幅にわたり分布するライン方式の液体噴射装置にも本発明を適用することが可能である。 (5) In each of the above-described embodiments, the serial type liquid injection device 100 that reciprocates the carrier 242 equipped with the liquid injection head 26 is exemplified, but the line type liquid in which a plurality of nozzles N are distributed over the entire width of the medium 12 is illustrated. The present invention can also be applied to an injection device.

（６）前述の各形態で例示した液体噴射装置１００は、印刷に専用される機器のほか、ファクシミリ装置やコピー機等の各種の機器に採用され得る。もっとも、本発明の液体噴射装置の用途は印刷に限定されない。例えば、色材の溶液を噴射する液体噴射装置は、液晶表示装置のカラーフィルターを形成する製造装置として利用される。また、導電材料の溶液を噴射する液体噴射装置は、配線基板の配線や電極を形成する製造装置として利用される。 (6) The liquid injection device 100 exemplified in each of the above-described embodiments can be adopted in various devices such as a facsimile machine and a copier, in addition to a device dedicated to printing. However, the application of the liquid injection device of the present invention is not limited to printing. For example, a liquid injection device that injects a solution of a coloring material is used as a manufacturing device for forming a color filter of a liquid crystal display device. Further, a liquid injection device for injecting a solution of a conductive material is used as a manufacturing device for forming wiring and electrodes on a wiring board.

１００…液体噴射装置、１２…媒体、１４…液体容器、２０…制御ユニット、２２…搬送機構、２４…移動機構、２６…液体噴射ヘッド、３２……流路基板、３４……圧力室基板、３４２…除去部、３６……振動板、３８……圧電デバイス、４２……筐体部、４４……封止体、４６……ノズル板、Ｎ……ノズル、４８……吸振体、５０……配線基板、５１…第１電極、５２…圧電体層、５３…第２電極、５４…絶縁層、５５…第１配線、５６…第２配線、５７…第３配線、Ｃ…圧力室、Ｒ…液体貯留室、Ｐ…圧電素子。 100 ... liquid injection device, 12 ... medium, 14 ... liquid container, 20 ... control unit, 22 ... transfer mechanism, 24 ... movement mechanism, 26 ... liquid injection head, 32 ... flow path substrate, 34 ... pressure chamber substrate, 342 ... Removal part, 36 ... Vibration plate, 38 ... Piezoelectric device, 42 ... Housing part, 44 ... Sealed body, 46 ... Nozzle plate, N ... Nozzle, 48 ... Vibration absorber, 50 ... ... Wiring board, 51 ... 1st electrode, 52 ... Piezoelectric layer, 53 ... 2nd electrode, 54 ... Insulation layer, 55 ... 1st wiring, 56 ... 2nd wiring, 57 ... 3rd wiring, C ... Pressure chamber, R ... Liquid storage chamber, P ... Piezoelectric element.

Claims

A pressure chamber that holds the liquid and is formed longitudinally in the X direction,
The diaphragm constituting the wall surface of the pressure chamber and
A liquid injection head including a piezoelectric device for injecting a liquid from the pressure chamber.
The piezoelectric device is
With the first electrode
Piezoelectric layer and
With the second electrode
Insulation layer and
The first wiring electrically connected to the second electrode and
A second wiring electrically connected to the second electrode is provided.
A first region in which the first electrode, the piezoelectric layer, and the second electrode are laminated in this order,
A second region located on the first end side of the piezoelectric layer in the X direction, in which the first electrode, the piezoelectric layer, the insulating layer, and the first wiring are laminated in this order.
A third region located on the second end side of the piezoelectric layer opposite to the first end, and the first electrode, the piezoelectric layer, the insulating layer, and the second wiring are laminated in this order. Including and
The portion where the wall surface of the end portion of the pressure chamber and the diaphragm on the first end side intersect is defined as the first pressure chamber end portion.
Assuming that the portion where the wall surface of the end portion of the pressure chamber and the diaphragm intersect on the second end side is the second pressure chamber end portion.
The second region is located between the first region and the end of the first pressure chamber in a plan view.
The third region is a liquid injection head located between the first region and the end of the second pressure chamber in a plan view.

The liquid injection head according to claim 1, wherein the end of the first pressure chamber and the end of the second pressure chamber do not overlap with the second electrode.

The liquid injection head according to claim 2, wherein the end of the first pressure chamber and the end of the second pressure chamber do not overlap with the piezoelectric layer.

The liquid injection head according to claim 3, wherein the end of the first pressure chamber and the end of the second pressure chamber do not overlap with the first electrode.

The width of the first wiring in the Y direction intersecting the X direction is larger than the width of the second electrode.
The liquid injection head according to any one of claims 1 to 4, wherein the width of the second wiring in the Y direction is larger than the width of the second electrode.

The first electrode includes a first portion in which the piezoelectric layer is laminated and a second portion different from the first portion.
The liquid injection according to any one of claims 1 to 5, wherein the first wiring conducts to the second electrode on the surface of the piezoelectric layer and overlaps the second portion of the first electrode with the insulating layer interposed therebetween. head.

The first electrode includes a third portion opposite to the second portion with the first portion interposed therebetween.
The second wiring conducts to the second electrode on the surface of the piezoelectric layer and overlaps the third portion of the first electrode with the insulating layer interposed therebetween.
The liquid injection head according to claim 6 .

The first wiring conducts to the second electrode on the surface of the piezoelectric layer through the first contact hole formed in the insulating layer.
The liquid injection head according to any one of claims 1 to 7, wherein the second wiring conducts to the second electrode on the surface of the piezoelectric layer through a second contact hole formed in the insulating layer. ..

The liquid injection head according to any one of claims 1 to 8, which is formed on the side opposite to the first wiring so as to sandwich the second wiring in a plan view and includes a third wiring conducting the first electrode.

A drive signal is supplied to the first wiring from an external circuit.
The liquid injection head according to any one of claims 1 to 9, wherein the second wiring is electrically connected to the external circuit via the second electrode and the first wiring.

A liquid injection device comprising the liquid injection head according to any one of claims 1 to 10.

It is used for a liquid injection head that accommodates a liquid and is provided with a pressure chamber formed longitudinally in the X direction and a diaphragm constituting the wall surface of the pressure chamber, and injects the liquid from the pressure chamber.
Piezoelectric device
With the first electrode
Piezoelectric layer and
With the second electrode
Insulation layer and
The first wiring electrically connected to the second electrode and
A second wiring electrically connected to the second electrode is provided.
A first region in which the first electrode, the piezoelectric layer, and the second electrode are laminated in this order,
A second region located on the first end side of the piezoelectric layer, in which the first electrode, the piezoelectric layer, the insulating layer, and the first wiring are laminated in this order.
A third region located on the second end side of the piezoelectric layer opposite to the first end, and the first electrode, the piezoelectric layer, the insulating layer, and the second wiring are laminated in this order. Including and
The portion where the wall surface of the end portion of the pressure chamber and the diaphragm on the first end side intersect is defined as the first pressure chamber end portion.
Assuming that the portion where the wall surface of the end portion of the pressure chamber and the diaphragm intersect on the second end side is the second pressure chamber end portion.
The second region is located between the first region and the end of the first pressure chamber in a plan view.
The third region is a piezoelectric device located between the first region and the end of the second pressure chamber in a plan view.