JP7081058B1 - Plating equipment - Google Patents

Abstract

Provided is a plating apparatus capable of smoothly contacting a plating solution with a surface to be plated and suppressing bubbles from remaining on the surface to be plated. The substrate holder of the plating apparatus has a head module for contacting and holding the substrate, an inclined module configured to incline the head module, and an elevating module configured to elevate the head module. .. The tilt module includes a first member, a second member that supports the head module and is rotatably connected to the first member around the rotation axis, and an actuator for rotating the second member around the rotation axis. , Have. The rotation axis is offset from the center of the substrate held by the head module, and the elevating module is configured to elevate and elevate the substrate holder by elevating and lowering the first member of the tilt module.

Description

The present application relates to a plating apparatus.

Conventionally, a so-called cup-type plating apparatus is known as a plating apparatus for plating a substrate (see, for example, Patent Document 1). Such a plating apparatus includes a plating tank in which an anode is arranged, a substrate holder which is arranged above the anode and holds a substrate as a cathode so that the surface to be plated of the substrate faces the anode. It is equipped with an elevating mechanism that elevates and lowers the board holder.

By the way, in a cup-type plating apparatus, when a substrate is immersed in a plating solution in a plating tank, bubbles may be generated on the surface of the surface to be plated and the bubbles may stay on the surface of the surface to be plated. .. When the substrate is plated with air bubbles remaining on the surface of the surface to be plated in this way, the plating quality may deteriorate. Therefore, the plating apparatus according to Patent Document 1 is provided with a special mechanism (referred to as "tilting mechanism") for tilting the substrate holder with respect to the horizontal plane. According to such a plating apparatus, in a state where the substrate holder is tilted by the tilting mechanism, the substrate holder is lowered by the elevating mechanism and the substrate is immersed in the plating solution to make the surface to be plated of the substrate of the plating solution. It can be immersed in the plating solution in a state of being inclined with respect to the liquid surface. As a result, air bubbles on the surface of the surface to be plated of the substrate can be removed from the surface of the surface to be plated by utilizing buoyancy, and deterioration of plating quality due to air bubbles can be suppressed.

Japanese Unexamined Patent Publication No. 2002-20692

As described above, when the substrate is immersed in the plating solution, the surface to be plated of the substrate is tilted with respect to the surface of the plating solution, so that the plating solution can be smoothly contacted with the surface to be plated. can. Here, the substrate to be plated may have different dimensions or shapes depending on the desired application and the like. Therefore, it is considered that various aspects of the mechanism for inclining the substrate and immersing it in the plating solution will be developed, so that a mechanism suitable for the substrate can be adopted.

Since the present invention has been made in view of the above circumstances, it is intended to provide a plating apparatus capable of smoothly contacting the plating solution with the surface to be plated and suppressing bubbles from remaining on the surface to be plated. Is one of the purposes.

According to one embodiment, a plating apparatus is proposed, which stores a plating solution and has a plating tank in which an anode is arranged and a cathode arranged above the anode with respect to the upper surface of the anode. It is provided with a substrate holder for holding the substrate as. The board holder has a head module for contacting and holding the board, an tilting module configured to tilt the head module, and an elevating module configured to raise and lower the head module. .. Then, the tilt module has a first member, a second member that supports the head module and is rotatably connected to the first member around the rotation axis, and the second member around the rotation axis. The rotation axis is offset from the center of the substrate held by the head module, and the elevating module elevates and elevates the first member of the tilt module. Is configured to raise and lower the substrate holder.

FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment. FIG. 3 is a vertical sectional view schematically showing the configuration of the plating module of the present embodiment. FIG. 4 is a diagram showing the substrate holder of the present embodiment on a schematic body, in which the surface to be plated of the substrate held by the substrate holder is arranged along a horizontal plane. FIG. 5 is a diagram showing the substrate holder of the present embodiment on a schematic body, in which the surface to be plated of the substrate is inclined with respect to the horizontal plane. FIG. 6 is a diagram showing a substrate holder of a modified example on a schematic body, and is in a state where the surface to be plated of the substrate held by the substrate holder is arranged along a horizontal plane. FIG. 7 is a diagram showing a substrate holder of a modified example on a schematic body, and the surface to be plated of the substrate is in a state of being inclined with respect to a horizontal plane.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and duplicated description will be omitted.

<Overall configuration of plating equipment>
FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of the present embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of the present embodiment. The plating apparatus of this embodiment is used to perform a plating process on a substrate. The substrate includes a square substrate and a circular substrate. As shown in FIGS. 1 and 2, the plating apparatus 1000 includes a load / unload module 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, and a spin rinse dryer module. It includes 600, a transfer device 700, and a control module 800.

The load / unload module 100 is a module for carrying a substrate such as a semiconductor wafer into the plating apparatus 1000 and carrying out the substrate from the plating apparatus 1000, and is equipped with a cassette for accommodating the substrate. In the present embodiment, four load / unload modules 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load / unload modules 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate, and is configured to transfer the substrate between the load / unload module 100, the aligner 120, and the transfer device 700. When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary stand (not shown). The aligner 120 is a module for aligning the positions of the orientation flat (orientation flat) and the notch of the substrate in a predetermined direction. In the present embodiment, the two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary.

The pre-wet module 200 is a module for adhering a treatment liquid (pre-wet liquid) such as pure water or degassed water to the surface to be plated of the substrate before the plating treatment. In the present embodiment, the two pre-wet modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wet modules 200 are arbitrary. The pre-soak module 300 is a module for etching the oxide film on the surface to be plated of the substrate before the plating treatment. In the present embodiment, the two pre-soak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-soak modules 300 are arbitrary.

The plating module 400 is a module for applying a plating process to a substrate. In the present embodiment, there are two sets of 12 plating modules 400 arranged three in the vertical direction and four in the horizontal direction, and a total of 24 plating modules 400 are provided. However, the plating module 400 is provided. The number and arrangement of are arbitrary.

The cleaning module 500 is a module for cleaning the substrate after the plating treatment. In the present embodiment, the two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer module 600 is a module for rotating the substrate after the cleaning treatment at high speed to dry it. In the present embodiment, the two spin rinse dryer modules are arranged side by side in the vertical direction, but the number and arrangement of the spin rinse dryer modules are arbitrary.

The transport device 700 is a device for transporting a substrate between a plurality of modules in the plating device 1000. The control module 800 is a module for controlling a plurality of modules of the plating apparatus 1000, and can be composed of, for example, a general computer or a dedicated computer having an input / output interface with an operator.

An example of a series of plating processes by the plating apparatus 1000 will be described. First, the board is carried into the load / unload module 100. Subsequently, the transfer robot 110 takes out the board from the load / unload module 100 and transfers the board to the aligner 120. The aligner 120 aligns the positions of the orifra, the notch, and the like in a predetermined direction. The transfer robot 110 transfers the substrate oriented by the aligner 120 to the transfer device 700.

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200. The pre-wet module 200 applies a pre-wet treatment to the substrate. The transport device 700 transports the pre-wet-treated substrate to the pre-soak module 300. The pre-soak module 300 applies a pre-soak treatment to the substrate. The transport device 700 transports the pre-soaked substrate to the plating module 400. The plating module 400 applies a plating process to the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer module 600. In the spin rinse dryer module 600, the substrate is subjected to a drying process. The transfer device 700 transfers the dried substrate to the transfer robot 110. The transfer robot 110 transfers the board received from the transfer device 700 to the load / unload module 100. Finally, the board is unloaded from the load / unload module 100.

The configuration of the plating apparatus 1000 described with reference to FIGS. 1 and 2 is only an example, and is not limited to such an example.

<Plating module configuration>
Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. FIG. 3 is a vertical sectional view schematically showing the configuration of the plating module 400 of the first embodiment. The plating module 400 of this embodiment is a cup type.

As shown in FIG. 3, the plating module 400 includes a plating tank 410 for accommodating a plating solution. The plating tank 410 includes a cylindrical inner tank having an open upper surface and an outer tank (not shown) provided around the inner tank so that the plating solution overflowing from the upper edge of the inner tank can be collected. To. A plating solution is stored inside the plating tank 410. The plating solution Ps may be any solution containing ions of a metal element constituting the plating film, and specific examples thereof are not particularly limited. In this embodiment, the copper plating treatment is used as an example of the plating treatment, and the copper sulfate solution is used as an example of the plating liquid Ps.

The plating module 400 includes a membrane 420 that vertically separates the inside of the inner tank of the plating tank 410. The inside of the inner tank is divided into a cathode region 422 and an anode region 424 by a membrane 420. The cathode region 422 and the anode region 424 are each filled with the plating solution Ps. In this embodiment, an example in which the membrane 420 is provided is shown, but the membrane 420 may not be provided.

An anode 430 is provided on the bottom surface of the inner tank 412 of the anode region 424. Further, in the anode region 424, an anode mask 426 for adjusting the electrolysis between the anode 430 and the substrate Wf is arranged. The anode mask 426 is a substantially plate-shaped member made of, for example, a dielectric material, and is provided on the front surface (upper side) of the anode 430. The anode mask 426 has an opening through which the current flowing between the anode 430 and the substrate Wf passes. The above-mentioned membrane 420 may be provided in the opening of the anode mask 426. Further, the plating module 400 is not limited to the one having the anode mask 426, and may not have the anode mask 426.

A resistor 490 facing the membrane 420 is arranged in the cathode region 422. The resistor 490 is a member for making the plating treatment uniform on the surface to be plated of the substrate Wf. As an example, the resistor 490 may be composed of a porous plate-shaped member or a plate-shaped member having a plurality of through holes communicating the anode side and the substrate side. The plating module 400 is not limited to the one having the resistor 490, and may not have the resistor 490. Further, in the present embodiment, a paddle 492 is provided above the resistor 490. The paddle 492 is made of, for example, titanium (Ti) or a resin. The paddle 492 reciprocates in parallel with the surface to be plated of the substrate Wf to be plated, so that sufficient metal ions are uniformly supplied to the surface of the substrate Wf during plating of the substrate Wf. Stir.

The plating module 400 includes a substrate holder 440 for holding the substrate Wf with the surface to be plated facing downward. The board holder 440 includes a head module 450 for contacting and holding the board Wf. As an example, the head module 450 is configured to be able to hold the substrate Wf by vacuum-sucking the substrate Wf and / or by physically sandwiching and gripping the substrate Wf. Further, the substrate holder 440 includes a feeding contact for supplying power to the substrate Wf from a power source (not shown). Further, in one embodiment, the substrate holder 440 includes a rotation module 480 that rotates the head module 450 around a vertical axis. The rotary module 480 can be realized by a known mechanism such as a motor.

4 and 5 are views showing the substrate holder 440 of the present embodiment as a schematic body. FIG. 4 shows a state in which the surface to be plated of the substrate Wf held by the substrate holder 440 is arranged along the horizontal plane Hp, and FIG. 5 shows that the surface to be plated of the substrate Wf is inclined with respect to the horizontal plane Hp. It is said to be in a state. As shown in FIGS. 4 and 5, the plating module 400 includes an tilt module 460 configured to tilt the head module 450 and an elevating module 470 configured to elevate the head module 450.

As shown in FIGS. 4 and 5, the tilt module 460 has a first member 462 connected to the elevating module 470 and a second member 464 rotatably connected to the first member 462 about the rotation axis Ra. And have. The first member 462 and the second member 464 may be, but are not limited to, formed of metal, resin, or the like. In the example shown in FIGS. 4 and 5, the first member 462 is a plate-shaped member extending in the vertical direction (that is, the plate surface faces in the vertical direction). The second member 464 is rotatably connected to the first member 462 at a horizontal end (right end in the example shown in FIGS. 4 and 5). That is, in the tilt module 460 of the present embodiment, the rotation axis Ra of the first member 462 and the second member 464 is offset from the center Cw of the substrate Wf. In other words, the rotation axis Ra does not pass through the center of the substrate Wf and is deviated from the center of the substrate Wf. The first member 462 is connected to the elevating module 470 and is moved up and down by the elevating module 470, and the second member 464 supports the head module 450 and the rotation module 480.

The tilt module 460 further includes an actuator 466 for rotating the second member 464 around the rotation axis Ra. In the present embodiment, the actuator 466 is configured such that one end 466a is connected to the first member 462, the other end 466b is connected to the second member 464, and the second member 464 rotates by expanding and contracting the actuator 466. ing. Although not limited to, in the present embodiment, the actuator 466 has one end 466a connected vertically above the rotation shaft Ra in the first member 462, and the end portion (right end) on the rotation shaft Ra side in the second member 464. The other end 466b is connected to the end portion (left end portion) on the opposite side to the portion). The actuator 466 is not limited to the examples shown in FIGS. 3 and 4, and for example, a known mechanism using one or more of a fluid actuator, a solenoid, a ball screw, or a motor can be used. In the present embodiment, the center of gravity of the second member 464 is located between the center of the substrate Wf and the rotation axis Ra in the horizontal direction, although it is not limited. As a result, the force for rotating the second member 464 can be reduced. Further, in the present embodiment, as an example, the rotation module 480 has a motor 480a, and the rotation axis of the motor 480a is offset from the center Cw of the substrate Wf. The motor 480a is arranged between the center Cw of the substrate Wf and the rotation axis Ra in the horizontal direction. As a result, the force for rotating the second member 464 can be reduced.

In this way, in the tilt module 460, the second member 464 is rotated around the rotation axis Ra by the operation of the actuator 466, whereby the head module 450 and the substrate Wf can be tilted (see FIGS. 4 and 5). .. Further, the elevating module 470 can elevate the head module 450 and the substrate Wf in a state where the substrate Wf is tilted by elevating and lowering the first member 462 of the tilt module 460. The specific configuration of the elevating module 470 is not particularly limited, and a known mechanism such as an elevating mechanism having a ball screw and a rotary motor can be used.

In this embodiment, the substrate holder 440 includes a position adjusting module 474 for compensating for the horizontal and vertical positions of the substrate Wf when the head module 450 is tilted by the tilt module 460. The position adjusting module 474 has a first mechanism 476 for compensating for horizontal movement and a second mechanism 477 for compensating for vertical movement. The specific configuration of the first mechanism 476 and the second mechanism 477 is not particularly limited, and for example, a known mechanism such as a position adjusting mechanism having a ball screw and a rotary motor can be used. Further, in the present embodiment, each of the first mechanism 476 and the second mechanism 477 is configured to move the elevating module 470 that supports the tilting module 460, but is not limited to such an example. The transport device 700 or the elevating module 470 may form at least one of the first mechanism 476 and the second mechanism 477. The position adjustment module 474 preferably moves the head module 450 in the horizontal direction and the vertical direction so that the center of the substrate Wf does not move when the head module 450 is tilted by the tilt module 460. The board holder 440 may have only one of the first mechanism 476 and the second mechanism 477 as the position adjusting module 474, or may not include the position adjusting module 474.

<Plating process>
Here, the plating process in the plating module 400 of the present embodiment will be described in more detail. In the plating module 400 of the present embodiment, first, the surface to be plated of the substrate Wf is tilted by the tilt angle α with respect to the horizontal plane Hp by the tilt module 460 (see FIG. 5). The inclination angle α is preferably an angle selected from a range of 1 degree (°) or more and 5 degrees (°) or less. Further, at this time, it is preferable to adjust the position adjustment module 474 so that the center position of the substrate Wf does not move. In this state, the substrate Wf is exposed to the plating solution by immersing the substrate Wf in the plating solution of the cathode region 422 using the elevating module 470. As a result, the surface to be plated of the substrate Wf is inclined by the inclination angle α with respect to the liquid surface of the plating solution Ps (this liquid surface is a surface parallel to the horizontal plane Hp and is a kind of horizontal plane), and the substrate Wf is inclined. Is exposed to the plating solution. Therefore, the plating solution can be smoothly contacted with the surface to be plated, and it is possible to prevent bubbles from remaining on the surface to be plated.

Further, in the present embodiment, the rotary module 480 rotates the head module 450 when the substrate Wf is immersed in the plating solution Ps, although it is not limited. That is, in the elevating module 470, the surface to be plated of the substrate Wf is inclined with respect to the horizontal plane Hp by the inclined module 460, and the substrate Wf is lowered and immersed in the plating solution Ps while the substrate Wf is rotated by the rotating module 480. As a result, it is possible to further prevent bubbles from remaining on the surface to be plated of the substrate Wf.

Then, when the substrate Wf is immersed in the plating solution Ps, the tilt module 460 rotates the second member 464 so that the surface to be plated of the substrate Wf is arranged along the horizontal plane Hp. At this time, it is preferable that the position adjustment module 474 adjusts the center position of the substrate Wf so that the center position does not move. Then, in the plating module 400, the plated surface of the substrate Wf can be plated by applying a voltage between the anode 430 and the substrate Wf in a state where the substrate Wf is immersed in the plating solution Ps. Further, in one embodiment, the plating process is performed while rotating the substrate Wf (head module 450) using the rotation module 480. By the plating treatment, a conductive film (plating film) is deposited on the surface to be plated of the substrate.

<Modification example>
6 and 7 are views showing the substrate holder of the modified example as a model body. FIG. 6 shows a state in which the plated surface of the substrate held by the substrate holder is arranged along the horizontal plane, and FIG. 7 shows a state in which the plated surface of the substrate is inclined with respect to the horizontal plane. .. Regarding the substrate holder 440A of the modified example, the description of the portion overlapping with the substrate holder 440A of the above-described embodiment will be omitted.

As shown in FIGS. 6 and 7, the modified substrate holder 440A has an inclined module 460A. The tilt module 460A has a first member 462A connected to the elevating module 470 and a second member 464A rotatably connected to the first member 462A around the rotation axis Ra2. In the above embodiment, the second member 464 is rotatably connected to the first member 462 at its end (the right end in FIG. 4), but in the modified example, the second member 464A is It is rotatably connected to the second member 464A at a substantially central position in the horizontal direction. However, the rotation shaft Ra2 of the second member 464A is located vertically above the substrate Wf gripped by the head module 450. That is, the rotation axis Ra2 of the second member 464A intersects the axis extending vertically along the center of the surface to be plated of the substrate Wf, and is offset from the center of the substrate Wf.

Further, the tilt module 460A of the modified example includes an actuator 466A for rotating the second member 464A. As an example, in the actuator 466A, one end 466Ab is connected to the end portion of the second member 464A (the right end portion in FIGS. 6 and 7), the other end 466Aa is connected to the first member 462A, and the actuator 466A expands and contracts. By doing so, the second member 464A is configured to rotate. In the tilt module 460A of the modified example, the actuator 466A is not limited to such an example, and various mechanisms can be used.

Further, the inclined module 460A of the modified example has an urging member 468 that urges the second member 464A so that the surface to be plated of the substrate Wf is along the horizontal plane Hp. In the present embodiment, a coil spring is used as the urging member 468, but the present invention is not limited to such an example, and various mechanisms such as a leaf spring and one using a magnetic force can be used. By providing such an urging member 468, it is possible to smoothly tilt and release the tilt of the head module 450. The tilting module 460 of the above-described embodiment may also be provided with such an urging member.

Also in the substrate holder 440A of the modified example described above, the substrate Wf can be brought into contact with the plating solution Ps in an inclined state as in the substrate holder 440 of the above-described embodiment. Therefore, it is possible to smoothly contact the plating solution Ps with the surface to be plated and prevent bubbles from remaining on the surface to be plated.

The present invention can also be described as the following forms.
[Form 1] According to Form 1, a plating apparatus is proposed, in which the plating apparatus stores a plating solution and is arranged on a plating tank in which an anode is arranged and on the upper surface of the anode. On the other hand, a substrate holder for holding the substrate as a cathode is provided. The board holder includes a head module for contacting and holding the board, an inclined module configured to incline the head module, and an elevating module configured to elevate the head module. Have. Then, the tilt module has a first member, a second member that supports the head module and is rotatably connected to the first member around the rotation axis, and the second member around the rotation axis. The rotation axis is offset from the center of the substrate held by the head module, and the elevating module elevates and elevates the first member of the tilt module. Is configured to raise and lower the substrate holder.
According to the first embodiment, it is possible to smoothly contact the plating solution with the surface to be plated and to prevent bubbles from remaining on the surface to be plated.

[Form 2] According to the second form, in the first form, the position adjusting module configured to move the head module in the horizontal direction is further provided, and the position adjusting module is tilted by the tilting module. In doing so, the head module is moved horizontally so as to compensate for the horizontal movement of the center of the substrate held by the head module.
According to the second embodiment, it is possible to compensate for the horizontal movement of the center of the substrate when the head module is tilted by the tilt module.

[Form 3] According to Form 3, in Form 2, the position adjusting module is configured to move the head module in the horizontal direction and the vertical direction, and when the head module is tilted by the tilt module, the head module is tilted. The head module is moved horizontally and vertically so as to compensate for the center of the substrate held by the head module to move horizontally and vertically.
According to the third embodiment, it is possible to compensate for the movement of the center of the substrate in the horizontal direction and the vertical direction when the head module is tilted by the tilt module.

[Form 4] According to Form 4, in Forms 1 to 3, the first member is a vertically extending plate-shaped member, and the second member is attached to the first member at a horizontal end. Connected rotatably.

[Form 5] According to Form 5, in Forms 1 to 4, the second member is rotatably connected to the first member on one end side in the horizontal direction and connected to the actuator on the other end side in the horizontal direction. Will be done.

[Form 6] According to Form 6, in Forms 1 to 3, the rotation axis intersects a shaft extending vertically along the center of the surface to be plated of the substrate.

[Form 7] According to Form 7, in the first to sixth aspects, the inclined module has an urging member that urges the second member in a direction in which the surface to be plated of the substrate becomes horizontal.
According to the seventh embodiment, the head module can be driven more smoothly by the tilt module.

[Form 8] According to Form 8, the substrate is further provided with a rotation module configured to rotate the substrate around a rotation axis extending vertically around the center of the surface to be plated.
According to the eighth embodiment, the substrate can be immersed in the plating solution while rotating, and / or the plating process can be performed while rotating the substrate.

[Form 9] According to Form 9, in Form 8, the rotary module is supported by the second member.

[Form 10] According to Form 10, in Forms 1 to 9, the tilt module tilts the head module at an tilt angle of 1 degree or more and 5 degrees or less.

[Form 11] According to Form 11, in the first to tenth forms, the resistor further provided above the anode and below the substrate holder inside the plating tank.

Although the embodiments of the present invention have been described above, the embodiments of the invention described above are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination of embodiments and modifications is possible within a range that can solve at least a part of the above-mentioned problems, or a range that exhibits at least a part of the effect, and is described in the claims and the specification. Any combination of each component or omission is possible.

400 ... Plating module 410 ... Plating tank 420 ... Membrane 430 ... Anode 440 ... 440A ... Substrate holder 450 ... Head module 460, 460A ... Inclined module 462, 462A ... First member 464, 464A ... Second member 466, 466A ... Actuator 468 ... Elevating member 470 ... Elevating module 474 ... Position adjustment module 476 ... First mechanism 477 ... Second mechanism 480 ... Rotating module 490 ... Resistor 800 ... Control module 1000 ... Plating device Wf ... Board Cs ... Board center Ra, Ra2 …Axis of rotation

Claims (11)

In addition to storing the plating solution, the plating tank in which the anode is placed and
A substrate holder that is placed above the anode and holds the substrate as a cathode with respect to the upper surface of the anode.
A head module for contacting and holding the substrate, and
An tilting module configured to tilt the head module,
An elevating module configured to elevate and elevate the head module,
With a board holder and
Equipped with
The tilt module rotates the first member, the second member that supports the head module and is rotatably connected to the first member about the rotation axis, and the second member around the rotation axis. With an actuator to make it
The axis of rotation is offset from the center of the substrate held by the head module.
The elevating module is configured to elevate and elevate the substrate holder by elevating and elevating the first member of the tilt module.
The first member has a vertically extending portion extending in the vertical direction, and the elevating module is connected to one end side in the horizontal direction of the vertically extending portion.
The axis of rotation extends perpendicular to the direction in which the elevating module of the first member is connected.
Plating equipment. Further equipped with a position adjusting module configured to move the head module in the horizontal direction, the head module is further provided.
The position adjusting module moves the head module horizontally so as to compensate for the horizontal movement of the center of the substrate held by the head module when the head module is tilted by the tilt module. Let, let
The plating apparatus according to claim 1. The position adjusting module is configured to move the head module horizontally and vertically, and when the head module is tilted by the tilt module, the center of the substrate held by the head module is horizontally and vertically. The plating apparatus according to claim 2, wherein the head module is moved in the horizontal direction and the vertical direction so as to compensate for the movement in the vertical direction. The actuator has a first end connected to the first member and a second end connected to the second member, and by expanding and contracting, the second member is attached to the first member. The plating apparatus according to any one of claims 1 to 3, which is rotated .
The first member has a horizontally extending portion extending in a direction opposite to the one end side from the vertically extending portion.
The second member has a plate-like portion extending in the horizontal direction, and is rotatably connected to the horizontally extending portion of the first member.
The first end of the actuator is connected to the vertically extending portion of the first member, and the second end of the actuator is connected to the one end side of the second member.
The plating apparatus according to any one of claims 1 to 4. The plating apparatus according to any one of claims 1 to 5 , wherein the rotating shaft intersects a shaft extending vertically about the center of the surface to be plated of the substrate. The tilt module is an urging member arranged between a portion of the second member to which the actuator is connected and a portion to which the first member is connected, and the surface to be plated of the substrate is horizontal. The plating apparatus according to any one of claims 1 to 6, further comprising an urging member that urges the second member in a direction. The plating apparatus according to any one of claims 1 to 7, further comprising a rotation module configured to rotate the substrate around a rotation axis extending vertically around the center of the surface to be plated. The plating apparatus according to claim 8, wherein the rotating module is provided vertically above the center of the surface to be plated of the substrate in a state where the surface to be plated of the substrate is horizontal, and is supported by the second member. The plating apparatus according to any one of claims 1 to 9, wherein the tilt module tilts the head module at an tilt angle of 1 degree or more and 5 degrees or less. The plating apparatus according to any one of claims 1 to 10, further comprising a resistor arranged above the anode and below the substrate holder inside the plating tank.

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