WO2022259506A1

WO2022259506A1 - Plating apparatus

Info

Publication number: WO2022259506A1
Application number: PCT/JP2021/022249
Authority: WO
Inventors: 正輝富田; 正也関
Original assignee: 株式会社荏原製作所
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2022-12-15
Also published as: JP7081058B1; CN115210413A; JPWO2022259506A1; KR20220167371A; KR102493757B1

Abstract

The present invention provides a plating apparatus which is capable of smoothly bringing a plating solution into contact with a surface to be plated, and which is also capable of suppressing remaining of air bubbles on the surface to be plated.　A substrate holder of this plating apparatus comprises: a head module which comes into contact with a substrate so as to hold the substrate; an inclination module which is configured so as to incline the head module; and a lifting/lowering module which is configured so as to lift or lower the head module. The inclination module comprises: a first member; a second member which supports the head module, while being connected to the first member so as to be rotatable about a rotary shaft; and an actuator for rotating the second member about the rotary shaft. The rotary shaft is offset from the center of the substrate, which is held by the head module; and the lifting/lowering module is configured so as to lift or lower the substrate holder by lifting or lowering the first member of the inclination module.

Description

Plating equipment

This application relates to plating equipment.

Conventionally, a so-called cup-type plating apparatus is known as a plating apparatus for plating substrates (see Patent Document 1, for example). Such a plating apparatus includes a plating tank in which an anode is arranged, a substrate holder arranged above the anode and holding a substrate as a cathode so that the surface to be plated of the substrate faces the anode, an elevating mechanism for elevating the substrate holder.

By the way, in the cup-type plating apparatus, when the substrate is immersed in the plating solution in the plating bath, air bubbles are generated on the surface of the substrate to be plated, and there is a possibility that the air bubbles stay on the surface of the plated surface. . When the substrate is plated with air bubbles remaining on the surface of the substrate to be plated, the plating quality may deteriorate. Therefore, the plating apparatus according to Patent Document 1 has a special mechanism (referred to as a "tilt mechanism") for tilting the substrate holder with respect to the horizontal plane. According to such a plating apparatus, while the substrate holder is tilted by the tilting mechanism, the substrate holder is lowered by the elevating mechanism to immerse the substrate in the plating solution. It can be immersed in the plating solution while being inclined with respect to the liquid surface. As a result, air bubbles on the surface of the substrate to be plated can be removed from the surface of the surface to be plated using buoyancy, and deterioration of plating quality due to air bubbles can be suppressed.

JP-A-2002-220692

As described above, when the substrate is immersed in the plating solution, by inclining the surface to be plated of the substrate with respect to the liquid surface of the plating solution, the plating solution can smoothly contact the surface to be plated. can. Here, the substrate to be plated may vary in size or shape depending on the desired application. Therefore, it is thought that a suitable mechanism for the substrate can be adopted by developing various modes as a mechanism for tilting the substrate and immersing it in the plating solution.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and provides a plating apparatus capable of smoothly bringing a plating solution into contact with a surface to be plated and preventing air bubbles from remaining on the surface to be plated. is one of the purposes.

According to one embodiment, a plating apparatus is proposed that includes a plating bath that stores a plating solution and in which an anode is arranged, and a cathode that is arranged above the anode and faces the upper surface of the anode. a substrate holder for holding a substrate as a The substrate holder has a head module for contacting and holding the substrate, a tilting module configured to tilt the head module, and a lifting module configured to lift the head module. . The tilt module includes: a first member; a second member that supports the head module and is connected to the first member so as to be rotatable around the rotation axis; the axis of rotation is offset from the center of the substrate held by the head module, and the lift module lifts and lowers the first member of the tilt module. to move the substrate holder up and down.

FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. FIG. 3 is a longitudinal sectional view schematically showing the configuration of the plating module of this embodiment. FIG. 4 is a diagram schematically showing the substrate holder of the present embodiment, in which the surface to be plated of the substrate held by the substrate holder is arranged along the horizontal plane. FIG. 5 is a diagram schematically showing the substrate holder of this embodiment, in which the surface to be plated of the substrate is inclined with respect to the horizontal plane. FIG. 6 is a diagram schematically showing a substrate holder of a modification, in which the surface to be plated of the substrate held by the substrate holder is arranged along the horizontal plane. FIG. 7 is a diagram schematically showing a substrate holder of a modified example, in which the surface to be plated of the substrate is inclined with respect to the horizontal plane.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

<Overall Configuration of Plating Equipment>
FIG. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. FIG. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. The plating apparatus of this embodiment is used for plating a substrate. Substrates include rectangular substrates and circular substrates. As shown in FIGS. 1 and 2, the plating apparatus 1000 includes a load/unload module 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer module. 600 , a transport device 700 and a control module 800 .

The load/unload module 100 is a module for loading a substrate such as a semiconductor wafer into the plating apparatus 1000 or unloading the substrate from the plating apparatus 1000, and is equipped with a cassette for housing the substrate. Although four load/unload modules 100 are arranged horizontally in this embodiment, the number and arrangement of the load/unload modules 100 are arbitrary. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load/unload module 100 , the aligner 120 and the transfer device 700 . When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary placement table (not shown). The aligner 120 is a module for aligning the orientation flats and notches of the substrate in a predetermined direction. Although two aligners 120 are arranged horizontally in this embodiment, the number and arrangement of the aligners 120 are arbitrary.

The pre-wet module 200 is a module for attaching a treatment liquid (pre-wet liquid) such as pure water or degassed water to the surface to be plated of the substrate before plating. Although two pre-wet modules 200 are arranged vertically in this embodiment, the number and arrangement of the pre-wet modules 200 are arbitrary. The presoak module 300 is a module for etching the oxide film on the surface to be plated of the substrate before plating. In this embodiment, two presoak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the presoak modules 300 are arbitrary.

The plating module 400 is a module for plating the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged vertically and four horizontally, and a total of 24 plating modules 400 are provided. The number and arrangement of are arbitrary.

The cleaning module 500 is a module for cleaning the substrate after plating. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer module 600 is a module for drying the substrate after cleaning by rotating it at high speed. Although two spin rinse dryer modules are arranged vertically in this embodiment, the number and arrangement of the spin rinse dryer modules are arbitrary.

The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000 . The control module 800 is a module for controlling a plurality of modules of the plating apparatus 1000, and can be composed of, for example, a general computer having an input/output interface with an operator or a dedicated computer.

An example of a series of plating processes by the plating apparatus 1000 will be explained. First, a substrate is loaded into the load/unload module 100 . Subsequently, the transfer robot 110 takes out the substrate from the load/unload module 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the positions of orientation flats, notches, and the like in a predetermined direction. The transport robot 110 transfers the substrate aligned by the aligner 120 to the transport device 700 .

The transport device 700 transports the substrate received from the transport robot 110 to the pre-wet module 200 . The pre-wet module 200 pre-wets the substrate. The transport device 700 transports the pre-wet processed substrate to the pre-soak module 300 . The presoak module 300 applies a presoak treatment to the substrate. The transport device 700 transports the presoaked substrate to the plating module 400 . The plating module 400 applies plating to the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500 . The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer module 600 . The spin rinse dryer module 600 applies a drying process to the substrate. The transport device 700 delivers the dried substrate to the transport robot 110 . The transfer robot 110 transfers the substrate received from the transfer device 700 to the load/unload module 100 . Finally, the substrate is unloaded from load/unload module 100 .

The configuration of the plating apparatus 1000 described with reference to FIGS. 1 and 2 is merely an example, and is not limited to such an example.

<Configuration of plating module>
Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. FIG. 3 is a longitudinal sectional view schematically showing the configuration of the plating module 400 of the first embodiment. The plating module 400 of this embodiment is of a cup type.

As shown in FIG. 3, the plating module 400 includes a plating tank 410 for containing the plating solution. The plating tank 410 includes a cylindrical inner tank with an open upper surface and an outer tank (not shown) provided around the inner tank so as to store the plating solution overflowing from the upper edge of the inner tank. be. A plating solution is stored inside the plating tank 410 . The plating solution Ps is not particularly limited as long as it contains ions of metal elements forming the plating film. In this embodiment, a copper plating process is used as an example of the plating process, and a copper sulfate solution is used as an example of the plating solution Ps.

The plating module 400 includes a membrane 420 that vertically separates the interior of the inner tank of the plating tank 410 . The interior of the inner tank is partitioned into a cathode area 422 and an anode area 424 by a membrane 420 . The cathode region 422 and the anode region 424 are each filled with a plating solution Ps. In addition, although an example in which the membrane 420 is provided is shown in this embodiment, the membrane 420 may not be provided.

An anode 430 is provided on the bottom surface of the inner tank 412 in the anode region 424 . Also, an anode mask 426 for adjusting electrolysis between the anode 430 and the substrate Wf is arranged in the anode region 424 . The anode mask 426 is a substantially plate-shaped member made of, for example, a dielectric material, and is provided on the front surface (upper side) of the anode 430 . Anode mask 426 has an opening through which current flows between anode 430 and substrate Wf. Note that the membrane 420 described above may be provided in the opening of the anode mask 426 . Also, the plating module 400 is not limited to having the anode mask 426 and may not have the anode mask 426 .

A resistor 490 facing the membrane 420 is arranged in the cathode region 422 . The resistor 490 is a member for uniformizing the plating process on the surface to be plated of the substrate Wf. The resistor 490 can be composed of, for example, a porous plate-like member or a plate-like member in which a plurality of through-holes communicating between the anode side and the substrate side are formed. In addition, the plating module 400 is not limited to having the resistor 490 , and may not have the resistor 490 . Also, in this embodiment, a paddle 492 is provided above the resistor 490 . The paddle 492 is made of titanium (Ti) or resin, for example. The paddle 492 reciprocates in parallel with the surface to be plated of the substrate Wf, which is the object of plating, to supply the plating solution so that sufficient metal ions are uniformly supplied to the surface of the substrate Wf during plating of the substrate Wf. Stir.

The plating module 400 includes a substrate holder 440 for holding the substrate Wf with the surface to be plated facing downward. The substrate holder 440 includes a head module 450 for contacting and holding the substrate Wf. For example, the head module 450 is configured to hold the substrate Wf by vacuum-sucking the substrate Wf and/or by physically sandwiching and gripping the substrate Wf. The substrate holder 440 also includes a power supply contact for supplying power to the substrate Wf from a power source (not shown). In one embodiment, substrate holder 440 also includes a rotation module 480 that rotates head module 450 about a vertical axis. Rotation module 480 can be implemented by a known mechanism such as a motor.

4 and 5 are diagrams schematically showing the substrate holder 440 of this embodiment. In FIG. 4, the surface to be plated of the substrate Wf held by the substrate holder 440 is arranged along the horizontal plane Hp, and in FIG. state. As shown in FIGS. 4 and 5, the plating module 400 has a tilt module 460 configured to tilt the head module 450 and a lift module 470 configured to lift the head module 450.

As shown in FIGS. 4 and 5, the tilting module 460 includes a first member 462 connected to the lifting module 470 and a second member 464 rotatably connected to the first member 462 about the rotation axis Ra. and have The first member 462 and the second member 464 are not limited, but may be made of metal, resin, or the like. In the example shown in FIGS. 4 and 5, the first member 462 is a plate-like member extending vertically (that is, the plate surface faces the vertical direction). The second member 464 is rotatably connected to the first member 462 at its horizontal end (the right end in the example shown in FIGS. 4 and 5). That is, in the tilt module 460 of this embodiment, the rotation axis Ra between the first member 462 and the second member 464 is offset from the center Cw of the substrate Wf. In other words, the rotation axis Ra does not pass through the center of the substrate Wf and is shifted from the center of the substrate Wf. The first member 462 is connected to an elevating module 470 so as to be elevated by the elevating module 470 , and the second member 464 supports the head module 450 and the rotation module 480 .

The tilt module 460 further comprises an actuator 466 for rotating the second member 464 about the rotation axis Ra. In this embodiment, the actuator 466 is configured such that one end 466a is connected to the first member 462, the other end 466b is connected to the second member 464, and the second member 464 rotates as the actuator 466 expands and contracts. ing. Although not limited, in the present embodiment, the actuator 466 has one end 466a connected to the first member 462 vertically above the rotation axis Ra, and an end (right end) of the second member 464 on the rotation axis Ra side. The other end 466b is connected to the end (left end) on the opposite side of the terminal). It should be noted that the actuator 466 is not limited to the examples shown in FIGS. 3 and 4, and can be, for example, a known mechanism using one or more of fluid actuators, solenoids, ball screws, or motors. In this embodiment, although not limited, the center of gravity of the second member 464 is positioned between the center of the substrate Wf and the rotation axis Ra in the horizontal direction. Thereby, the force for rotating the second member 464 can be reduced. Further, in this embodiment, as an example, the rotation module 480 has a motor 480a, and the rotation axis of the motor 480a is offset from the center Cw of the substrate Wf. The motor 480a is arranged horizontally between the center Cw of the substrate Wf and the rotation axis Ra. Thereby, the force for rotating the second member 464 can be reduced.

In this way, the tilt module 460 rotates the second member 464 around the rotation axis Ra by the operation of the actuator 466, thereby tilting the head module 450 and the substrate Wf (see FIGS. 4 and 5). . The elevating module 470 can elevate the head module 450 and the substrate Wf while the substrate Wf is tilted by elevating the first member 462 of the tilting module 460 . The specific configuration of the elevating module 470 is not particularly limited, and for example, a known mechanism such as an elevating mechanism having a ball screw and a rotary motor can be used.

In this embodiment, the substrate holder 440 includes a position adjustment module 474 for compensating the horizontal and vertical positions of the substrate Wf when the head module 450 is tilted by the tilt module 460 . Position adjustment module 474 has a first mechanism 476 for compensating for horizontal movement and a second mechanism 477 for compensating for vertical movement. A specific configuration of the first mechanism 476 and the second mechanism 477 is not particularly limited, and for example, a known mechanism such as a position adjustment mechanism having a ball screw and a rotary motor can be used. Also, in the present embodiment, each of the first mechanism 476 and the second mechanism 477 is configured to move the elevating module 470 that supports the tilting module 460, but is not limited to such an example. At least one of the first mechanism 476 and the second mechanism 477 may be configured by the transport device 700 or the elevating module 470 . The position adjustment module 474 preferably moves the head module 450 horizontally and vertically so that the center of the substrate Wf does not move when the head module 450 is tilted by the tilt module 460 . The substrate holder 440 may have only one of the first mechanism 476 and the second mechanism 477 as the position adjustment module 474 , or may not have the position adjustment module 474 .

<Plating>
Here, the plating process in the plating module 400 of this embodiment will be described in more detail. In the plating module 400 of the present embodiment, first, the tilt module 460 tilts the surface of the substrate Wf to be plated by the tilt angle α with respect to the horizontal plane Hp (see FIG. 5). It should be noted that the inclination angle α is preferably an angle selected from the range of 1 degree (°) or more and 5 degrees (°) or less. Also, at this time, the position adjustment module 474 may be adjusted so that the center position of the substrate Wf does not move. In this state, the substrate Wf is exposed to the plating solution by immersing the substrate Wf in the plating solution of the cathode region 422 using the elevating module 470 . As a result, the surface to be plated of the substrate Wf is inclined by an inclination angle α with respect to the liquid surface of the plating solution Ps (this liquid surface is a surface parallel to the horizontal surface Hp, and is a type of horizontal surface). are exposed to the plating solution. Therefore, the plating solution can be smoothly brought into contact with the surface to be plated, and air bubbles can be prevented from remaining on the surface to be plated.

In addition, although not limited to this embodiment, the rotation module 480 rotates the head module 450 when the substrate Wf is immersed in the plating solution Ps. That is, the elevating module 470 lowers the substrate Wf and immerses it in the plating solution Ps while tilting the surface to be plated of the substrate Wf with respect to the horizontal surface Hp by the tilting module 460 and rotating the substrate Wf by the rotating module 480 . Thereby, it is possible to further suppress the air bubbles from remaining on the surface to be plated of the substrate Wf.

Then, when the substrate Wf is immersed in the plating solution Ps, the tilt module 460 rotates the second member 464 so that the surface to be plated of the substrate Wf is arranged along the horizontal plane Hp. At this time, the position adjusting module 474 may be adjusted again so that the center position of the substrate Wf does not move. The plating module 400 applies a voltage between the anode 430 and the substrate Wf while the substrate Wf is immersed in the plating solution Ps, thereby plating the surface of the substrate Wf to be plated. In one embodiment, the plating process is performed while rotating the substrate Wf (head module 450) using the rotation module 480. FIG. By plating, a conductive film (plating film) is deposited on the surface of the substrate to be plated.

<Modification>
6 and 7 are diagrams schematically showing substrate holders of modifications. In FIG. 6, the surface to be plated of the substrate held by the substrate holder is arranged along the horizontal plane, and in FIG. 7, the surface to be plated of the substrate is inclined with respect to the horizontal plane. . It should be noted that, regarding the substrate holder 440A of the modified example, description of portions that overlap with the substrate holder 440A of the above-described embodiment will be omitted.

As shown in FIGS. 6 and 7, a modified substrate holder 440A has a tilt module 460A. The tilting module 460A has a first member 462A connected to the lifting module 470 and a second member 464A rotatably connected to the first member 462A about the rotation axis Ra2. In the above-described embodiment, the second member 464 was rotatably connected to the first member 462 at its end (the right end in FIG. 4). It is rotatably connected to the second member 464A at a substantially central position in the horizontal direction. However, the rotation axis Ra<b>2 of the second member 464</b>A is positioned vertically above the substrate Wf held by the head module 450 . That is, the rotation axis Ra2 of the second member 464A intersects the axis extending vertically through the center of the surface to be plated of the substrate Wf and is offset from the center of the substrate Wf.

The modified tilt module 460A also includes an actuator 466A for rotating the second member 464A. As an example, the actuator 466A has one end 466Ab connected to the end of the second member 464A (the right end in FIGS. 6 and 7) and the other end 466Aa connected to the first member 462A so that the actuator 466A expands and contracts. By doing so, the second member 464A is configured to rotate. Also in the tilt module 460A of the modified example, the actuator 466A is not limited to such an example, and various mechanisms can be used.

In addition, the tilt module 460A of the modified example has a biasing member 468 that biases the second member 464A so that the surface to be plated of the substrate Wf is aligned with the horizontal plane Hp. In the present embodiment, a coil spring is used as the biasing member 468, but the present invention is not limited to this example, and various mechanisms such as those using leaf springs and magnetic force can be used. By providing such a biasing member 468, it is possible to smoothly tilt the head module 450 and release the tilt. Note that the tilt module 460 of the embodiment described above may also be provided with such a biasing member.

Also in the substrate holder 440A of the modified example described above, the substrate Wf can be brought into contact with the plating solution Ps in an inclined state, like the substrate holder 440 of the embodiment described above. Therefore, the plating solution Ps can be smoothly brought into contact with the surface to be plated, and air bubbles can be prevented from remaining on the surface to be plated.

The present invention can also be described as the following forms.
[Mode 1] According to mode 1, a plating apparatus is proposed, and the plating apparatus includes a plating tank in which a plating solution is stored and an anode is arranged, and a plating bath arranged above the anode and on the upper surface of the anode. a substrate holder for holding a substrate as a cathode. The substrate holder includes a head module for contacting and holding the substrate, a tilting module configured to tilt the head module, and an elevating module configured to elevate the head module. have. The tilt module includes: a first member; a second member that supports the head module and is connected to the first member so as to be rotatable around the rotation axis; the axis of rotation is offset from the center of the substrate held by the head module, and the lift module lifts and lowers the first member of the tilt module. to move the substrate holder up and down.
According to the first aspect, it is possible to smoothly bring the plating solution into contact with the surface to be plated, and to prevent air bubbles from remaining on the surface to be plated.

[Mode 2] According to Mode 2, in Mode 1, a position adjustment module configured to horizontally move the head module is further provided, and the position adjustment module tilts the head module by the tilt module. The head module is moved horizontally so as to compensate for the horizontal movement of the center of the substrate held by the head module.
According to the form 2, when the tilt module tilts the head module, it is possible to compensate for the horizontal movement of the center of the substrate.

[Mode 3] According to Mode 3, in Mode 2, the position adjustment module is configured to move the head module in the horizontal direction and the vertical direction, and when the head module is tilted by the tilt module, The head module is moved horizontally and vertically so as to compensate for the horizontal and vertical movement of the center of the substrate held by the head module.
According to the third aspect, when the tilt module tilts the head module, it is possible to compensate for the horizontal and vertical movement of the center of the substrate.

[Mode 4] According to Mode 4, in Modes 1 to 3, the first member is a vertically extending plate-like member, and the second member is attached to the first member at its horizontal end. rotatably connected.

[Mode 5] According to Mode 5, in Modes 1 to 4, the second member is rotatably connected to the first member at one end in the horizontal direction, and is connected to the actuator at the other end in the horizontal direction. be done.

[Mode 6] According to Mode 6, in Modes 1 to 3, the rotation axis intersects the axis extending vertically through the center of the surface to be plated of the substrate.

[Mode 7] According to Mode 7, in Modes 1 to 6, the tilt module has a biasing member that biases the second member in a direction in which the surface to be plated of the substrate is horizontal.
According to the seventh aspect, the head module can be driven more smoothly by the tilt module.

[Mode 8] According to Mode 8, in Modes 1 to 7, the substrate is further provided with a rotation module configured to rotate the substrate around a rotation axis extending vertically from the center of the surface to be plated.
According to mode 8, the substrate can be immersed in the plating solution while being rotated and/or the plating can be performed while the substrate is being rotated.

[Mode 9] According to Mode 9, in Mode 8, the rotating module is supported by the second member.

[Mode 10] According to Mode 10, in Modes 1 to 9, the tilt module tilts the head module at a tilt angle of 1 degree or more and 5 degrees or less.

[Embodiment 11] According to Embodiment 11, in Embodiments 1 to 10, there is further provided a resistor disposed above the anode and below the substrate holder inside the plating tank.

Although the embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention, and do not limit the present invention. The present invention may be modified and improved without departing from its spirit, and the present invention includes equivalents thereof. In addition, any combination of the embodiments and modifications is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects, and is described in the scope of claims and the specification. Any combination or omission of each component is possible.

DESCRIPTION OF SYMBOLS 400... Plating module 410... Plating tank 420... Membrane 430...

Anode

440, 440A... Substrate holder 450...

Head module

460, 460A...

Tilt module

462, 462A...

First member

464, 464A...

Second member

466, 466A... Actuator 468 Biasing member 470 Lifting module 474 Position adjustment module 476 First mechanism 477 Second mechanism 480 Rotation module 490 Resistor 800 Control module 1000 Plating device Wf Substrate Cs Center of substrate Ra, Ra2 …Axis of rotation

Claims

A plating bath in which a plating solution is stored and an anode is arranged;
a substrate holder disposed above the anode for holding a substrate as a cathode against an upper surface of the anode,
a head module for holding in contact with the substrate;
a tilting module configured to tilt the head module;
an elevating module configured to elevate the head module;
a substrate holder having
with
The tilt module includes a first member, a second member that supports the head module and is rotatably connected to the first member about a rotation axis, and a rotation of the second member about the rotation axis. an actuator for causing
the rotation axis is offset from the center of the substrate held by the head module;
The elevating module is configured to elevate the substrate holder by elevating the first member of the tilting module.
Plating equipment.
further comprising a positioning module configured to move the head module horizontally;
The position adjustment module horizontally moves the head module so as to compensate for the horizontal movement of the center of the substrate held by the head module when the head module is tilted by the tilt module. let
The plating apparatus according to claim 1.
The position adjustment module is configured to move the head module in the horizontal direction and the vertical direction, and when the head module is tilted by the tilt module, the center of the substrate held by the head module moves horizontally and vertically. 3. The plating apparatus of claim 2, wherein the head module is moved horizontally and vertically to compensate for the vertical movement.
The first member is a vertically extending plate-like member,
said second member is rotatably connected to said first member at a horizontal end;
The plating apparatus according to any one of claims 1 to 3.
5. The second member according to any one of claims 1 to 4, wherein said second member is rotatably connected to said first member at one end in the horizontal direction, and is connected to said actuator at the other end in the horizontal direction. Plating equipment.
The plating apparatus according to any one of claims 1 to 3, wherein the rotation axis intersects an axis extending vertically through the center of the surface to be plated of the substrate.
The plating apparatus according to any one of claims 1 to 6, wherein the tilt module has a biasing member that biases the second member in a direction in which the surface to be plated of the substrate is horizontal.
The plating apparatus according to any one of claims 1 to 7, further comprising a rotation module configured to rotate the substrate around a rotation axis extending vertically through the center of the surface to be plated.
The plating apparatus according to claim 8, wherein the rotating module is supported by the second member.
The plating apparatus according to any one of claims 1 to 9, wherein the tilt module tilts the head module at a tilt angle of 1 degree or more and 5 degrees or less.
The plating apparatus according to any one of claims 1 to 10, further comprising a resistor arranged above said anode and below said substrate holder inside said plating tank.