JP7068769B2 - Light emitting element package and light emitting device - Google Patents

Description

The present invention relates to a light emitting device package and a light emitting device.

A light emitting device in which a plurality of light emitting elements such as light emitting diodes (LEDs) are placed on a wiring pattern formed on a substrate is known. As a light emitting element used in such a light emitting device, a flip-chip type light emitting diode in which a positive electrode and a negative electrode are arranged on a surface opposite to the main light emitting direction is known. Since such a flip-chip type light emitting diode does not require wire bonding and the light emission is not blocked by the wire, it contributes to the improvement of the light emitting efficiency of the light emitting device.

When mounting a flip-chip type light emitting diode, an organic white resin may be used on a substrate that requires a wiring pattern. In order to further increase the brightness of such a light emitting device and improve the luminous efficiency, a light emitting device in which a reflective frame is arranged around a flip-chip type light emitting element mounted in a mounting area on a substrate is known. (Patent Document 1).

Further, there is known a light emitting diode in which a light emitting diode is provided on the surface of a substrate and a light emitting diode is placed on the surface of the substrate, and a light emitting diode is electrically connected on the back surface of the substrate through a through hole (Patent Document 2).

Japanese Unexamined Patent Publication No. 2007-180585 Japanese Unexamined Patent Publication No. 2011-258801

The light of the light emitting element is irradiated to the adhesive layer that adheres the reflective member to the substrate, the reflective frame and the adhesive layer are thermally expanded, and the light emitted by the light emitting element is absorbed by the adhesive layer, so that the light emitting element is emitted. There is a loss of light and deterioration of the adhesive layer.

An object of the present invention is to provide a light emitting element package capable of suppressing light loss and deterioration of the adhesive layer caused by the adhesive layer absorbing the light emitted by the light emitting element, and a light emitting device using the same. That is.

The light emitting element package of the present disclosure includes a base material having a mounting portion on the first surface for mounting the light emitting element, and a base material.
A reflection frame body disposed on the first surface of the base material, which has an inner peripheral surface that surrounds the mounting portion in an annular shape and reflects the light emitted by the light emitting element mounted on the mounting portion. With the frame
It is provided with an adhesive layer provided on the first surface of the base material and for adhering the reflective frame body to the first surface of the base material.
The reflective frame is
An inner peripheral edge portion arranged in contact with the first surface and
It has a peripheral wall that defines a space on the side separated from the light emitting element from the inner peripheral edge portion.
The space is located at the bottom of the peripheral wall and
The inner peripheral edge portion has an inner side wall that defines a radial inner edge of the space.
The peripheral wall has a bottom wall facing the space, and has a gap between the adhesive layer and the inner side wall.
The adhesive layer adheres to the peripheral wall and the first surface while being housed in the space.
The adhesive surface between the adhesive layer and the peripheral wall or the adhesive surface between the adhesive layer and the first surface is a radius centered on the center of the mounting portion of the reflective frame on the first surface. Adhesive with a length of 20% or more and less than 80% of the length of direction A.
The end portion of the inner end surface of the adhesive layer located on the side of the first surface is characterized in that it is located on the outer side of the end portion of the inner end surface located on the side of the bottom wall. And.

Further, the light emitting device of the present disclosure includes the light emitting element package and the light emitting element mounted on the mounting portion.

According to the light emitting element package and the light emitting device of the present disclosure, it is possible to suppress the loss of light and the deterioration of the adhesive layer caused by the adhesive layer absorbing the light emitted by the light emitting element.

It is a top view of the light emitting device. It is sectional drawing of a light emitting device. It is a partial cross-sectional view of the light emitting element package of 1st Embodiment. It is a partial cross-sectional view of the light emitting element package of 2nd Embodiment. It is a partial cross-sectional view of the light emitting element package of 2nd Embodiment. It is a partial cross-sectional view of the light emitting element package of 3rd Embodiment. It is a partial cross-sectional view of the light emitting element package of 4th Embodiment. It is a partial cross-sectional view of the light emitting element package of 5th Embodiment. It is a partial cross-sectional view of the light emitting element package of 5th Embodiment. It is a partial cross-sectional view of the light emitting element package of the sixth embodiment. It is a partial cross-sectional view of the light emitting element package of 7th Embodiment. It is a partial cross-sectional view of the light emitting element package of 8th Embodiment. It is a partial cross-sectional view of the light emitting element package of 9th Embodiment. It is a partial cross-sectional view of the light emitting element package of 9th Embodiment. It is a top view which shows schematically the light emitting device fixed to the 1st heat radiation member. It is sectional drawing which shows schematically the light emitting device fixed to the 1st heat radiation member. It is a top view which shows schematically the light emitting device fixed to the 2nd heat radiation member. It is sectional drawing which shows schematically the light emitting device fixed to the 2nd heat radiation member.

1 and 2 are a plan view and a cross-sectional view showing a state in which the light emitting device 10 is mounted on the module substrate 11 via the conductor wiring 9. The light emitting device 10 includes a light emitting element package 1 provided with a base material 2 and a reflective frame body 3 and a light emitting element 4 mounted on the light emitting element package 1.

The light emitting element package 1 of this embodiment will be described. FIG. 3 is a partial cross-sectional view of the light emitting device package 1 of the first embodiment. The light emitting device 10 includes a light emitting element package 1 and a light emitting element 4. The light emitting element package 1 is mainly composed of a base material 2, a reflective frame body 3, and an adhesive layer 7 for adhering the reflective frame body 3 to the base material 2.

The base material 2 is used as a support member for supporting the light emitting element 4, and has a mounting portion 6 on the first surface 5 on which the light emitting element 4 is mounted. The material of the base material 2 is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride material sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as an epoxy resin. For example, aluminum nitride is used. Since aluminum nitride has a high thermal conductivity, the heat dissipation of the light emitting element 4 can be improved. The UV-LED (Ultra Violet-Light Emitting Diode) has a flip-chip structure, and a ceramic substrate that does not require an insulating layer is preferably used as a base material.

The material of the reflective frame 3 is made of a metal such as aluminum (Al) or Fe—Ni—cobalt (Co) alloy, ceramics such as an aluminum sintered body, or a resin such as an epoxy resin, and the light emitting element 4 emits light. It is not particularly limited as long as it can reflect light. A metal such as Al having a high reflectance with respect to light in the ultraviolet light region to the visible light region, a white resin, or the like is used, and it is preferable to form the material with a material such as Al having a high thermal conductivity.

As the material of the adhesive layer 7, for example, silicon, epoxy resin, active brazing material and the like are used. The adhesive layer 7 is housed in at least a part of the space 3c.

The reflection frame body 3 surrounds the mounting portion 6 in an annular shape, and has an inner peripheral surface 3a that reflects the light emitted by the light emitting element 4 mounted on the mounting portion 6. A reflective surface is formed on the inner peripheral surface 3a over the entire surface of the inner peripheral surface 3a, and the light emitted by the light emitting element 4 is reflected on the entire surface of the inner peripheral surface 3a, so that the efficiency of extracting light is improved. Can be planned. The opening of the reflective frame 3 may be increased as the distance from the first surface 5 increases.

A space 3c separated from the first surface 5 is provided in at least a part of the bottom portion 3b of the reflective frame body 3 facing the first surface 5, and the adhesive layer 7 is housed in at least a part of the space 3c. The adhesive layer 7 accommodated in the space 3c is adhered to the bottom wall 3h facing the first surface 5, and the reflective frame 3 is arranged on the first surface 5.

The reflective frame body 3 has an annular inner peripheral edge portion 3e along the inner peripheral surface 3a on the inner side of the space 3c. The top portion 3f located on the first surface 5 side of the inner peripheral edge portion 3e has an annular plane and is not adhered to the first surface 5. The broken line indicates the state after thermal expansion (the same applies to FIGS. 4 to 14), and the top portion 3f abuts on or abuts on the first surface 5 before and after the thermal expansion of the reflective frame body 3 and the adhesive layer 7. Close to each other.

In the present embodiment, the light emitting element 4 is mounted on the first adhesive surface 3i to which the adhesive layer 7 is adhered to the bottom wall 3h and the second adhesive surface 3k to which the adhesive layer 7 is adhered to the first surface 5. The length of the radial direction (hereinafter referred to as “radial direction”) A about the center of the mounting portion is the same. That is, the cross-sectional shape orthogonal to the circumferential direction of the adhesive layer 7 is rectangular. When it is thermally expanded, the first adhesive surface 3i extends in the radial direction A with respect to the second adhesive surface 3k, and moves outward in a direction away from the first surface. The inner side wall 3m of the peripheral wall 3g that defines the inner end of the space 3c moves outward in a state of extending in a direction away from the first surface 5, but before and after thermal expansion, it moves inward with the adhesive layer 7. A gap 8 is provided between the side wall 3m and the inner side wall 3m to prevent the inner side wall 3m from coming into contact with the adhesive layer 7 and causing thermal stress in the adhesive layer 7.

The top portion 3f of the inner peripheral edge portion 3e configured in an annular shape is in contact with or close to the first surface 5 over the entire circumference, and the light such as ultraviolet light or blue light emitted by the light emitting element 4 is the inner peripheral edge. It is substantially blocked by the portion 3e, and the light of the light emitting element 4 is suppressed from being irradiated to the adhesive layer 7 located outside the inner peripheral edge portion 3e.

In the present embodiment, since the top portion 3f of the inner peripheral edge portion 3e can abut on the first surface 5, the load of the reflective frame body 3 is applied to the first adhesive surface 3i to which the adhesive layer 7 is adhered and the inner peripheral edge portion 3e. Therefore, the load of the reflective frame body 3 is received only by the first adhesive surface 3i, and the top portion 3f of the inner peripheral edge portion 3e is not in contact with the first surface 5 as compared with the case where the reflective frame body 3 is received. Can be arranged on the first surface 5 in a stable state, and it is possible to suppress the generation of thermal stress in the adhesive layer 7.

The length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A is the length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A and the radial direction A of the gap 8. It is desirable that the length b is less than 90% of the total length. The length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A is the length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A, and the length of the gap 8 in the radial direction A. When it is 90% or more with respect to the length to which the b is added, when the reflective frame body 3 is thermally expanded, the adhesive layer 7 comes into contact with the inner side wall 3 m of the peripheral wall 3 g, and the adhesive layer 7 is inward. Thermal stress may be generated in the adhesive layer 7 by receiving a force pushing outward from the side wall 3 m in the radial direction. Further, the adhesive layer may be peeled off from the first surface 5 due to thermal stress.

The length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A is the length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A and the length of the gap 8 in the radial direction A. It is desirable that the length is 20% to 80% with respect to the sum of the length b and the length c in the radial direction A of the top portion 3f of the inner peripheral edge portion 3e. The length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A is the length a of the first adhesive surface 3i or the second adhesive surface 3k in the radial direction A, and the length of the gap 8 in the radial direction A. If it is less than 20% of the total length of the b and the radial length c of the top portion 3f of the inner peripheral edge portion 3e, the adhesive state in which the reflective frame body 3 is adhered to the first surface 5 is formed. It becomes unstable, and the adhesion between the reflective frame body 3 and the first surface 5 via the adhesive layer 7 is lowered.

The length a of the first bonding surface 3i or the second bonding surface 3k in the radial direction A is the length a of the first bonding surface 3i or the second bonding surface 3k in the radial direction A, and the length of the gap 8 in the radial direction A. When it is 80% or more of the total length of the b and the length c of the top portion 3f of the inner peripheral edge portion 3e in the radial direction A, the amount of heat absorbed by the adhesive layer 7 increases, and the adhesive layer 7 is formed. The adhesion between the reflective frame body 3 and the first surface 5 is reduced. The length of the space 3c in which the adhesive layer 7 of the reflective frame 3 is accommodated is preferably about 10 to 50 μm in the direction away from the first surface.

4 and 5 are cross-sectional views of the light emitting device package 1 of the second embodiment. The description is omitted for the part that overlaps with the description of the first embodiment, and the same reference numerals are used. In FIG. 4, the first adhesive surface 3i of the adhesive layer 7 bonded to the bottom wall 3h is inward in the radial direction A with respect to the second adhesive surface 3k bonded to the first surface 5 of the adhesive layer 7. It is extended. In FIG. 5, the first adhesive surface 3i extends to the corner of the inner side wall 3 m.

As described above, when the length of the first adhesive surface 3i of the adhesive layer 7 bonded to the bottom wall 3h in the radial direction becomes large, the adhesive strength of the adhesive layer 7 can be increased while securing the gap 8. can. As shown in FIG. 5, the first adhesive surface 3i is extended to the corner of the inner side wall 3 m to secure a gap 8 and further increase the adhesive strength of the adhesive layer 7 to form a reflective frame body 3. The adhesion with the adhesive layer 7 can be improved.

In the present embodiment, the inner side end surface 7a of the adhesive layer 7 is configured so that the opening becomes narrower as the distance from the first surface 5 increases, and the first surface side end portion 7b of the inner side end surface 7a is inner. It is located on the outer side of the bottom wall side end portion 7c of the side end surface 7a. Since the inner side wall 3m of the peripheral wall 3g moves outward in a state substantially orthogonal to the first surface 5 due to thermal expansion, the inner side wall 3m of the peripheral wall 3g is the first of the inner side end faces 7a of the adhesive layer 7. It is possible to suppress the generation of thermal stress in the adhesive layer 7 in contact with the one-side end portion 7b.

FIG. 6 is a cross-sectional view of the light emitting element package 1 of the third embodiment. The description is omitted for the part that overlaps with the description of the first or second embodiment, and the same reference numerals are used. As shown in FIG. 6, the inner side wall 3 m of the peripheral wall 3 g is configured to be inclined so that the opening surrounded by the inner side wall 3 m becomes larger as the distance from the first surface 5 increases, and the inner side wall 3 m is formed. The first surface side end portion 3n of the above is located on the inward side of the bottom wall side end portion 3p of the inner side wall 3m.

Since the inner side wall 3m has a spread angle θ1 and moves outward in a state of having substantially the same spread angle θ1 due to thermal expansion, the first surface side end 3n of the inner side wall 3m is the adhesive layer 7. It is possible to further suppress the generation of thermal stress in the adhesive layer 7 in contact with the first surface side end portion 7b of the above.

FIG. 7 is a cross-sectional view of the light emitting device package 1 of the fourth embodiment. The description is omitted for the part that overlaps with the description of the first to third embodiments, and the same reference numerals are used. The reflective frame body 3 has an annular outer peripheral edge portion 3r along the space 3c on the outer side of the space 3c, and the top portion 3s located on the first surface 5 side of the outer peripheral edge portion 3r is an annular shape. It has a flat surface, does not adhere to the first surface 5 before and after thermal expansion, and is in contact with or in close contact with the first surface 5. The adhesive layer 7 has a rectangular cross section as in FIG.

The light radiated from the outer peripheral portion of the reflective frame body 3 to the reflective frame body 3 is formed in an annular shape and is substantially blocked by the top portion 3s of the outer peripheral edge portion 3r which is in contact with or adjacent to the first surface 5 and is a space 3c. It is suppressed that the adhesive layer 7 housed in the above is irradiated with light from the outer peripheral portion. Further, since the outer peripheral edge portion 3r can be brought into contact with the first surface 5 by such a configuration, the reflective frame body 3 is in a more stable state as compared with the case where the outer peripheral edge portion 3r is not provided. It can be placed on the first surface 5, and it is possible to further suppress the generation of thermal stress in the adhesive layer 7.

8 and 9 are cross-sectional views of the light emitting device package 1 of the fifth embodiment. The description is omitted for the part that overlaps with the description of the first to fourth embodiments, and the same reference numerals are used. In FIG. 8, the first adhesive surface 3i of the adhesive layer 7 bonded to the bottom wall 3h is on the outer side in the radial direction A with respect to the second adhesive surface 3k bonded to the first surface 5 of the adhesive layer 7. Extends to. In FIG. 9, the peripheral wall 3g has an outer side wall 3t that is in the radial direction A of the space 3c and defines the outer side end, and the first adhesive surface 3i extends to the corner of the outer side wall 3t. It is extended.

The length of the first adhesive surface 3i of the adhesive layer 7 bonded to the bottom wall 3h in the radial direction is increased, and the adhesive strength of the adhesive layer 7 can be increased. As shown in FIG. 9, by extending the first adhesive surface 3i to the corner of the outer side wall 3t, the adhesive strength of the adhesive layer 7 is further increased to improve the adhesion between the reflective frame body 3 and the adhesive layer 7. Can be made to.

In the present embodiment, the outer end surface 7f of the adhesive layer 7 is configured so that the opening becomes larger as the distance from the first surface 5 increases, and the first surface side end portion 7g of the outer end surface 7f is outer. It is located inward from the bottom wall side end portion 7h of the side end surface 7f. Since the outer side wall 3t of the peripheral wall 3g moves outward in a state substantially orthogonal to the first surface 5 due to thermal expansion, the outer side wall 3t of the peripheral wall 3g is the first surface side end of the outer end surface 7f. It is possible to suppress the generation of thermal stress in the adhesive layer 7 in contact with the portion 7g.

FIG. 10 is a cross-sectional view of the light emitting element package 1 of the sixth embodiment. The description is omitted for the part that overlaps with the description of the first to fifth embodiments, and the same reference numerals are used. As shown in FIG. 10, the outer side wall 3t of the peripheral wall 3g is configured such that the opening surrounded by the outer side wall 3t becomes smaller as the distance from the first surface 5 increases, and the first of the outer side walls 3t. The surface side end portion 3u is located on the outer side of the bottom wall side end portion 3v of the outer side wall 3t. Since the outer side wall 3t has a spread angle θ2 and moves outward in a state of having substantially the same spread angle θ2 before and after thermal expansion, the first surface side end portion 3u of the outer side wall 3t has. It is possible to further suppress the generation of thermal stress in the adhesive layer 7 by coming into contact with the first surface side end portion 7 g of the adhesive layer 7.

FIG. 11 is a cross-sectional view of the light emitting element package 1 of the seventh embodiment. The description is omitted for the parts that overlap with the description of the first to sixth embodiments, and the same reference numerals are used. The adhesive layer 17 is spherical in cross-sectional view and can be arranged in an annular shape. In FIG. 11, the cross-sectional shape is circular, but the cross-sectional shape may be a perfect circle or an ellipse. By doing so, it is possible to reduce the adhesive area in which the adhesive layer 17 adheres to the bottom wall 3h of the peripheral wall 3g, and it is possible to suppress the thermal stress generated in the adhesive layer 17 when it is thermally expanded. Further, by forming the adhesive layer 17 with a sphere, the length of the adhesive layer 7 in the radial direction A can be reduced, and the light emitting element package 1 can be made compact.

FIG. 12 is a cross-sectional view of the light emitting device package 1 of the eighth embodiment. The description is omitted for the part that overlaps with the description of the first to seventh embodiments, and the same reference numerals are used. In the present embodiment, the bottom portion 13b of the reflective frame body 13 facing the first surface 5 is continuously provided on the side edge portion of the first surface 5 of the inner peripheral surface 13a, and is provided with the first surface toward the outside. There is provided an inclined bottom surface 13w that increases the distance between the two. The inclined bottom surface 13w is provided with a third adhesive surface 13x to which the adhesive layer 17 to be adhered to the first surface 5 is adhered. An inner peripheral edge portion 13y formed in an annular shape along the inner peripheral surface 13a is provided on the inner side of the third adhesive surface 13x. The inner peripheral edge portion 13y is defined by the inner peripheral surface 13a and the inclined bottom surface 13w, and the tapered annular top portion 13z abuts or is in close contact with the first surface 5.

In the present embodiment, since the inclined bottom surface 13w away from the first surface 5 toward the outside is provided, the third adhesive surface 13x to which the adhesive layer 17 is adhered can be directly provided on the bottom surface 13w. The inclined bottom surface 13w is composed of the entire bottom portion 13b of the reflective frame body 13, and the third adhesive surface 13x can be widened to increase the adhesion strength in which the adhesive layer 17 adheres to the reflective frame body 13.

13 and 14 are partial cross-sectional views of the light emitting device package of the ninth embodiment. The base material 2 has an inner peripheral edge portion 3e on the first surface 5 side of the reflective frame body 3 or an inner peripheral edge portion 13y on the first surface 5 side of the reflective frame body 13 on the second adhesive surface 3k of the first surface 5. It may have convex portions 21 and 22 that surround it in an annular shape. By doing so, the adhesive layers 7 and 17 can be provided higher than the first surface 5 by the height of the convex portions 21 and 22, and the first surface 5 of the base material 2 and the reflective frame body 3 can be provided. Even if light enters the spaces 3c and 13c from the contact points of the inner peripheral edges 3e and 13y of 13, the adhesive layer 7 is less likely to be reflected by the convex portions 21 and 22 and irradiated to the adhesive layers 7 and 17. , 17 absorbs light and suppresses deterioration of the adhesive layers 7 and 17.

15 to 18 are diagrams for explaining the light emitting device.

FIG. 15 is a plan view schematically showing a light emitting device 10 fixed to the first heat radiating member 12, and FIG. 16 is a cross-sectional view schematically showing the light emitting device 10 fixed to the first heat radiating member 12. be. The light emitting device 10 is screwed to a heat radiating member 12 made of Al or the like. The heat radiating member 12 is provided with a plurality of heat radiating fins 15, and the heat generated by the light emitting device 10 is radiated from the radiating fins 15.

FIG. 17 is a plan view schematically showing a light emitting device 14 fixed to the second heat radiating member 16, and FIG. 18 is a cross-sectional view schematically showing the light emitting device 14 fixed to the second heat radiating member 16. be.
The light emitting device 14 is configured by mounting a plurality of light emitting element packages 1 on a module substrate 20 via a conductor wiring 18. The light emitting device 14 is screwed to a second heat radiating member 16 made of Cu, Al, or the like. A U-shaped water cooling tube 19 is provided inside the second heat radiating member 16 in the plan view of FIG. 17, and the heat generated by the light emitting device 14 is the water flowing through the water cooling tube 19 via the second heat radiating member 16. Is transmitted to. In FIG. 18, the water cooling pipe 19 is schematically shown by shifting the inflow side flow path and the outflow side flow path up and down in order to facilitate the illustration.

1 Light emitting element package 2 Base material 3,13 Reflective frame 3a Inner peripheral surface 3b Bottom 3c, 13c Space 3e, 13y Inner peripheral edge 3f, 3s, 13z Top 3g Peripheral wall 3h Bottom wall 3i 1st adhesive surface 3k 2nd adhesive Surface 3m Inner side wall 3n (Inner side wall) 1st surface side end 3p (Inner side wall) Bottom wall side end 3r Outer peripheral edge 3t Outer side wall 3u (Outer side wall) 1st surface side end Part 3v (outer side wall) bottom wall side end 4 light emitting element 5 first surface 6 mounting part 7,17 adhesive layer 7a inner side end surface 7b (inner end surface of the adhesive layer) first surface side end 7c Bottom wall side end (on the inner end face of the adhesive layer) 7f Outer end face 7g First face side end (on the outer end face of the adhesive layer) 7h Bottom (on the outer end face of the adhesive layer) Wall side end 8 Gap 9,18 Conductor wiring 10,14 Light emitting device 11,20 Module board 12 First heat dissipation member 13w Inclined bottom surface 13x Third adhesive surface 13y Inner peripheral edge 15 Fin 16 Second heat dissipation member 19 Water cooling pipe 21, 22 Convex part

Claims (12)

A base material having a mounting portion on the first surface for mounting a light emitting element,
A reflection frame body disposed on the first surface of the base material, which has an inner peripheral surface that surrounds the mounting portion in an annular shape and reflects the light emitted by the light emitting element mounted on the mounting portion. With the frame
It is provided with an adhesive layer provided on the first surface of the base material and for adhering the reflective frame body to the first surface of the base material.
The reflective frame is
An inner peripheral edge portion arranged in contact with the first surface and
It has a peripheral wall that defines a space on the side separated from the light emitting element from the inner peripheral edge portion.
The space is located at the bottom of the peripheral wall and
The inner peripheral edge portion has an inner side wall that defines a radial inner edge of the space.
The peripheral wall has a bottom wall facing the space, and has a gap between the adhesive layer and the inner side wall.
The adhesive layer adheres to the peripheral wall and the first surface while being housed in the space.
The adhesive surface between the adhesive layer and the peripheral wall or the adhesive surface between the adhesive layer and the first surface is a radius centered on the center of the mounting portion of the reflective frame on the first surface. Adhesive with a length of 20% or more and less than 80% of the length of direction A.
The end portion of the inner end surface of the adhesive layer located on the side of the first surface is located on the outer side of the end portion of the inner end surface located on the side of the bottom wall. package. The adhesive layer is adhered to the bottom wall of the peripheral wall facing the first surface.
The first adhesive surface of the adhesive layer bonded to the bottom wall is in the radial direction A centered on the center of the mounting portion, rather than the second adhesive surface bonded to the first surface of the adhesive layer. The light emitting element package according to claim 1, which extends inward. The peripheral wall has an inner side wall that defines the inner side edge of the space.
The light emitting element package according to claim 2, wherein the first adhesive surface extends to a corner of the inner side wall. The light emitting element package according to claim 3, wherein the inner side wall is configured such that the opening surrounded by the inner side wall becomes larger as the distance from the first surface increases. Any of claims 1 to 4, wherein the reflective frame body has an annular outer peripheral edge portion along the space on the outer side of the space, and the outer peripheral edge portion is in contact with the first surface. The light emitting element package according to item 1. The first adhesive surface of the adhesive layer to be adhered to the bottom wall is in the radial direction with the center of the mounting portion as the axis, rather than the second adhesive surface to be adhered to the first surface of the adhesive layer. The light emitting element package according to claim 2, which extends outward in A. The peripheral wall has an outer side wall that is in the radial direction A of the space and defines the outer side end.
The light emitting element package according to claim 2, wherein the first adhesive surface extends to a corner of the outer side wall. The light emitting element package according to claim 7, wherein the outer side wall is configured such that the opening surrounded by the outer side wall becomes smaller as the distance from the first surface increases. The light emitting element package according to any one of claims 1 to 8, wherein the adhesive layer has a circular cross-sectional view and is arranged in an annular shape. The bottom portion of the reflective frame body facing the first surface is composed of an inclined bottom surface in which the distance from the first surface increases toward the outside.
The light emitting element package according to claim 1, wherein the adhesive layer is housed in a space sandwiched between the inclined bottom surface and the first surface. The light emitting element according to claim 2 or 6, wherein the base material has a convex portion on the second adhesive surface of the first surface that surrounds the inner peripheral edge portion on the first surface side of the reflective frame body in an annular shape. package. The light emitting device package according to any one of claims 1 to 10.
A light emitting device including a light emitting element mounted on the mounting portion.

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