JP7056354B2 - Recording device, wiring member and manufacturing method of wiring member - Google Patents

Description

The present invention relates to a recording device, a wiring member constituting the recording device, and a method for manufacturing the wiring member.

As an example of a recording device, Patent Document 1 describes a printer that discharges ink from a nozzle to record an image. In the printer of Patent Document 1, the head unit has a plurality of nozzles. Further, the head unit is provided with a plurality of piezoelectric elements that apply pressure to the ink in the pressure chamber communicating with the nozzles, corresponding to the plurality of nozzles. Further, in Patent Document 1, the flexible cable is connected to a plurality of piezoelectric elements.

Japanese Unexamined Patent Publication No. 2017-222182

In recent years, inkjet printers as described in Patent Document 1 are often used for discharging various types of liquids, such as for industrial use. At this time, depending on the type of liquid, the viscosity is high at room temperature and may not be suitable for ejection from a nozzle. In this case, for example, it is conceivable to provide a heater for heating the head unit so that the ink in the head unit has a temperature suitable for ejection. In the printer of Patent Document 1, if the head unit is configured to be heated, heat is also transferred to the connection portion between the head unit and the flexible cable. At this time, if the heat of the connection portion cannot be sufficiently dissipated, the flexible cable may be peeled off from the head unit due to the difference in the linear expansion coefficient between the head unit and the flexible cable.

Further, in Patent Document 1, for example, the heat generated by the IC mounted on the flexible cable may be transferred to the connection portion between the head unit and the flexible cable, so that the flexible cable may be peeled off from the head unit. ..

An object of the present invention is to provide a recording device, a wiring member, and a method for manufacturing the wiring member, which can sufficiently dissipate heat of a connection portion between the recording head and the wiring member.

The recording apparatus of the present invention includes a recording head having a plurality of recording elements and a wiring member connected to the recording head, and the wiring member is provided on a flexible base material and the base material. A plurality of arranged wirings and the plurality of wirings include a plurality of individual wirings individually for the plurality of recording elements, and at least a part of the individual wirings among the plurality of individual wirings is. It has a first wiring portion connected to the recording head, and a second wiring portion that is a portion other than the first wiring portion and has a thickness larger than that of the first wiring portion.

It is a schematic top view of the printer 1 which concerns on embodiment of this invention. It is a perspective view of the ink ejection device 3. It is an exploded perspective view of the ink ejection device 3. FIG. 2 is a sectional view taken along line IV-IV of FIG. It is a top view of the head unit 25. FIG. 5 is a sectional view taken along line VI-VI of FIG. (A) is a cross-sectional view along the length direction of the COF 22 in the portion where the ground wiring 66 is arranged, and (b) is the COF 22 in the portion where the individual wiring 67 and the control wiring 68 are arranged. It is sectional drawing along the length direction of. (A) is a diagram showing the arrangement of wiring on one surface 61a of the base material 61 of the COF 22, and (b) is a diagram showing the arrangement of wiring on the other surface 61b of the base material 61 of the COF 22. (A) is a sectional view taken along line IXA-IXA of FIG. 8 (b), FIG. 8 (b) is a sectional view taken along line IXB-IXB of FIG. 8 (b), and FIG. IXC-IXC line cross-sectional view of FIG. 8 (d) is an IXD-IXD line cross-sectional view of FIG. 8 (b). It is a flowchart which shows the manufacturing procedure of COF22. (A) is a cross-sectional view along the length direction of the COF 100 of the modified example 1 in the portion where the ground wiring 101 is arranged, and (b) is the individual wiring 102 and the control wiring 103 arranged. It is sectional drawing along the length direction of COF100 in a part. It is a figure which shows the arrangement of the wiring on one surface 61a of the base material 61 of COF100. (A) is a sectional view corresponding to FIG. 9 (a) in COF100, (b) is a sectional view corresponding to FIG. 9B in COF100, and (c) is a sectional view corresponding to FIG. 9 (b) in COF100. It is a cross-sectional view corresponding to FIG. 9C, and FIG. 9D is a cross-sectional view corresponding to FIG. 9D in COF100. It is a flowchart which shows the manufacturing procedure of COF100. (A) is a diagram showing a state in which the first material layers 101a and 102a are formed, (b) is a diagram showing a state in which the first material layers 101a and 103a are formed, and (c) is a diagram showing a state in which the first material layers 101a and 103a are formed, and (c) is a protection. It is a figure which shows the state which formed the layer 104, (d) is the figure which shows the state which formed the protective layer 104, (e) is the figure which shows the state which formed the second material layers 101b, 102b. Yes, (f) is a diagram showing a state in which the second material layers 101b and 103b are formed. (A) is a flowchart showing a procedure for manufacturing COF 110 in Modification 2, (b) is a diagram showing a state in which wiring 111 is formed on a base material 61, and (c) is a diagram showing an unnecessary portion of wiring 111. It is a figure which shows the removed state. (A) is a cross-sectional view corresponding to FIG. 12 (a) of the COF 120 of the modified example 3, (b) is a diagram corresponding to FIG. 12 (b) of the COF 120 of the modified example 3, and (c) is a modified view. FIG. 12 (c) is a diagram corresponding to FIG. 12 (c) of COF 120 of Example 3, and FIG. 12 (d) is a diagram corresponding to FIG. 12 (d) of COF 120 of Modification 3.

Hereinafter, preferred embodiments of the present invention will be described.

<Outline configuration of printer>
As shown in FIG. 1, the inkjet printer 1 includes a platen 2, an ink ejection device 3, a cartridge holder 4, and a transfer mechanism 5. In the following, each of the front, back, left, and right directions shown in FIG. 1 is defined as "front", "rear", "left", and "right" of the printer. In addition, the front side of the paper is defined as "top" and the other side of the paper is defined as "bottom".

The recording paper P, which is the recording medium, is placed on the upper surface of the platen 2. The ink ejection device 3 has an inkjet head 21 (the "recording head" of the present invention). The inkjet head 21 includes four head units 25 that eject ink to the recording paper P placed on the platen 2. The ink ejection device 3 is configured to be reciprocally movable in the left-right direction (hereinafter, also referred to as a scanning direction) along the two guide rails 11 and 12 in the region facing the platen 2. An endless belt 13 is connected to the ink ejection device 3, and the endless belt 13 is driven by the drive motor 14, so that the ink ejection device 3 moves in the scanning direction. The ink ejection device 3 ejects ink from the nozzle 30 (see FIG. 5) of each head unit 25 toward the recording paper P placed on the platen 2 while moving in the scanning direction. The detailed configuration of the ink ejection device 3 will be described later.

Ink cartridges 15 of four colors (black, yellow, cyan, magenta) are detachably mounted on the cartridge holder 4. The cartridge holder 4 is connected to the ink ejection device 3 by a tube (not shown). The four-color inks stored in the four ink cartridges 15 of the cartridge holder 4 are supplied to the ink ejection device 3 via the tube.

The transport mechanism 5 has two transport rollers 16 and 17 arranged so as to sandwich the platen 2 in the front-rear direction. The two transfer rollers 16 and 17 are driven in synchronization with each other by a transfer motor (not shown). The transport mechanism 5 transports the recording paper P placed on the platen 2 forward (hereinafter, also referred to as a transport direction) by the two transport rollers 16 and 17.

<Ink ejection device>
Next, the detailed configuration of the ink ejection device 3 will be described. As shown in FIGS. 2 to 6, the ink ejection device 3 includes a head holder 20, an inkjet head 21 having four head units 25, four COF 22s (“wiring members” of the present invention), and a rigid substrate. It is equipped with 23.

<Head holder 20>
The head holder 20 is a member having a rectangular planar shape long in the scanning direction. The head holder 20 is connected to an endless belt 13 (see FIG. 1) driven by a drive motor 14, and can move in the scanning direction along the guide rails 11 and 12. As shown in FIG. 4, a concave unit accommodating portion 20a is formed in the lower portion of the head holder 20, and the four head units 25 of the inkjet head 21 are accommodated in the unit accommodating portion 20a. Further, a concave substrate accommodating portion 20b is formed in the upper part of the head holder 20, and the rigid substrate 23 is accommodated in the substrate accommodating portion 20b.

As shown in FIGS. 3 and 4, in the substrate accommodating portion 20b of the head holder 20, eight cylindrical flow path portions 27 extending upward from the bottom surface of the substrate accommodating portion 20b and forming an ink flow path are provided. Has been done. The eight cylindrical flow path portions 27 correspond to the eight nozzle rows 31 of the four head units 25 of the inkjet head 21, which will be described later.

As shown in FIG. 4, a flow path member 81 is arranged above the ink ejection device 3. The flow path member 81 is formed with ink flow paths (not shown) connected to the eight cylindrical flow path portions 27. The flow path member 81 is connected to the cartridge holder 4 (see FIG. 1) via a tube or the like (not shown), and is stored in each of the four ink cartridges 15 of the cartridge holder 4 in the eight tubular flow path portions 27. Only four colors of ink are supplied. One color of ink from one ink cartridge 15 is supplied to the two tubular flow path portions 27. Further, a heater 82 (“heating unit” of the present invention) is arranged on the upper surface of the flow path member 81. The heater 82 heats the ink flowing in the flow path member 81. The heater 82 may be arranged at another position as long as the ink can be heated. The temperature of the heater 82 is set to, for example, about 40 to 60 ° C., depending on the viscosity of the ink at room temperature and the viscosity of the desired ink at the time of ejection.

Further, although not shown in FIG. 4, an ink flow path connecting the eight cylindrical flow path portions 27 and the four head units 25 is formed in the head holder 20. Further, as shown in FIGS. 3 and 4, the head holder 20 is also formed with four passing holes 20c through which the four COFs 22 corresponding to the four head units 25 pass.

<Inkjet head 21>
As shown in FIGS. 3 and 4, the inkjet head 21 has four head units 25 and a unit holding plate 26 for holding the four head units 25. The four head units 25 are housed in the unit housing portion 20a of the head holder 20 in a state of being arranged side by side at intervals in the scanning direction.

As shown in FIGS. 5 and 6, each head unit 25 includes a plurality of nozzles 30 arranged on the lower surface thereof. The region on the lower surface of the head unit 25 in which the ejection ports of the plurality of nozzles 30 are formed is hereinafter referred to as an ink ejection surface 25a. The plurality of nozzles 30 on the ink ejection surface 25a form two nozzle rows 31 arranged in the transport direction and arranged in the scanning direction.

Since one head unit 25 has two nozzle rows 31, the inkjet head 21 has a total of eight nozzle rows 31. The eight nozzle rows 31 and the eight tubular flow path portions 27 of the head holder 20 correspond to each other, and each nozzle row 31 has one of four colors of ink from the corresponding tubular flow path portion 27. Is supplied. That is, the one-color ink supplied from one ink cartridge 15 (see FIG. 1) to the ink ejection device 3 passes through the two tubular flow path portions 27 to two nozzles out of the eight nozzle rows 31. Supply to column 31. It should be noted that the color of ink ejected by each of the eight nozzle rows 31 is not limited to a specific combination, and can be appropriately selected. For example, the two nozzle rows 31 of one head unit 25 may be the nozzle rows 31 that eject the same color. Alternatively, four types of nozzle rows 31 for ejecting four colors of ink may be arranged symmetrically in the scanning direction. For example, the four types of nozzle rows 31 may be arranged in the order of black, magenta, cyan, and yellow from the center to the left and right sides in the scanning direction.

As shown in FIGS. 3 and 4, the unit holding plate 26 has four openings 26a that expose the ink ejection surfaces 25a of the four head units 25, respectively. The unit holding plate 26 is arranged under the head holder 20 with a spacer 49 interposed therebetween so as to cover the four head units 25 from below. However, the ink ejection surface 25a of each head unit 25 is exposed from the opening 26a of the unit holding plate 26.

<Head unit 25>
Next, the structure of the head unit 25 will be specifically described. As shown in FIG. 5, the head unit 25 has an outer shape that is long in the transport direction and has a substantially rectangular shape in a plan view. Further, as shown in FIG. 6, the head unit 25 has a holder member 32 and a head main body portion 33 held by the holder member 32. Two ink supply flow paths 34 are formed in the holder member 32. These two ink supply flow paths 34 are connected to the two tubular flow path portions 27 via an ink flow path (not shown) formed in the head holder 20.

The head main body 33 includes a first flow path substrate 36, a second flow path substrate 37, a nozzle plate 38, a plurality of piezoelectric elements 39, a protective member 40, and the like.

A plurality of pressure chambers 41 are formed on the first flow path substrate 36. The plurality of pressure chambers 41 are arranged in the transport direction corresponding to the plurality of nozzles 30 and form two pressure chamber rows arranged in the scanning direction. Further, the first flow path substrate 36 has a vibrating film 45 that covers a plurality of pressure chambers 41.

The second flow path substrate 37 is joined to the lower surface of the first flow path substrate 36. The second flow path substrate 37 is formed with two manifolds 42 that communicate with the two ink supply flow paths 34 of the holder member 32, respectively. The ink supplied from the ink cartridge 15 (see FIG. 1) to the tubular flow path portion 27 via the flow path member 81 is supplied to the manifold 42 via the ink supply flow path 34 of the holder member 32.

The two manifolds 42 extend in the transport direction (vertical to the paper surface in FIG. 6) in the region overlapping the plurality of pressure chambers 41 of the first flow path substrate 36. The lower end of each manifold 42 is covered with a synthetic resin film 46. Further, on the lower side of the film 46, a unit holding plate 26 for holding the head unit 25 with the spacer 49 interposed therebetween is arranged. As a result, the damper chamber 48 is formed between the film 46 and the unit holding plate 26, and the film 46 can be deformed. Then, the pressure fluctuation of the manifold 42 is suppressed by the deformation of the film 46.

The second flow path substrate 37 is formed with a plurality of communication holes 43 for communicating the manifold 42 and the plurality of pressure chambers 41, respectively. Further, the second flow path substrate 37 is also formed with a plurality of communication holes 44 for communicating the plurality of pressure chambers 41 and the plurality of nozzles 30 formed in the nozzle plate 38 described below.

The nozzle plate 38 is joined to the lower surface of the second flow path substrate 37. A plurality of nozzles 30 arranged in the transport direction are formed on the nozzle plate 38. As described above, the plurality of nozzles 30 constitute two nozzle rows 31. Each nozzle 30 communicates with the pressure chamber 41 of the first flow path substrate 36 via the communication hole 44 formed in the second flow path substrate 37.

The plurality of piezoelectric elements 39 are arranged on the upper surface of the vibrating film 45 parallel to the ink ejection surface 25a. The plurality of piezoelectric elements 39 are arranged in the transport direction corresponding to the plurality of pressure chambers 41, respectively, and form two rows of piezoelectric elements arranged in the scanning direction. The piezoelectric element 39 vibrates the vibrating film 45 by utilizing the piezoelectric strain when the applied voltage changes, and imparts ejection energy for ejecting from the nozzle 30 to the ink in the pressure chamber 41. A drive wiring 47 for applying a predetermined drive voltage to the piezoelectric element 39 is connected to each piezoelectric element 39. The drive wiring 47 is drawn inward from each piezoelectric element 39 in the scanning direction. At the end of each drive wiring 47 on the opposite side of the piezoelectric element 39, a drive contact 47a to which the COF 22 described below is connected is provided. The drive contacts 47a of the plurality of drive wirings 47 are arranged in the region between the two piezoelectric element rows on the upper surface of the vibration film 45 of the first flow path substrate 36. In this embodiment, each piezoelectric element 39, a pressure chamber 41 corresponding to the piezoelectric element 39, a nozzle 30, an ink flow path connecting these, and a portion of a vibrating film 45 covering the upper surface of the pressure chamber. The combination of the above corresponds to the "recording element" of the present invention.

Two protective members 40 that cover each of the two piezoelectric element rows are arranged on the upper surface of the vibrating film 45 of the first flow path substrate 36. The protective member 40 is provided for the purpose of blocking the piezoelectric element 39 from the outside air and preventing it from coming into contact with moisture.

<Rigid board 23>
As shown in FIGS. 2 to 4, the rigid substrate 23 is arranged above the four head units 25 with the head holder 20 interposed therebetween, and is accommodated in the substrate accommodating portion 20b of the head holder 20. The rigid substrate 23 is arranged so as to overlap the four head units 25 in the vertical direction. As shown in FIGS. 2 to 4, connectors 53 (53a, 53b) are provided on the upper surfaces of the left end portion and the right end portion of the rigid substrate 23, respectively. Further, an insertion port 20d into which an FFC (not shown) for connecting a rigid substrate 23 and a control device (not shown) is inserted is formed in the left wall portion and the right wall portion of the head holder 20, respectively. The connector 53 may be provided on the lower surface of the rigid substrate 23, or may be provided on both the upper surface and the lower surface. In the rigid substrate 23, four through holes 50a to 50d through which the four COFs 22 extending from the lower four head units 25 pass are formed side by side in the scanning direction. Further, the rigid substrate 23 is also formed with eight flow path holes 51a to 51h through which the eight cylindrical flow path portions 27 of the head holder 20 penetrate. In the present embodiment, as shown in FIG. 3, of the eight flow path holes 51a to 51h, the six flow path holes 51b to 51g are connected to the through hole 50, but the through hole 50 and the flow path are connected. The holes 51 may not be connected to each other and may be provided independently of each other.

As shown in FIG. 4, four connection terminals 52 are provided near the edges of the four through holes 50a to 50d on the upper surface of the rigid substrate 23, respectively. More specifically, the connection terminals 52 are provided on the left side (connector 53a side) of the two through holes 50a and 50b located on the left side. Further, for the two through holes 50c and 50d located on the right side, a connection terminal 52 is provided on the right side (connector 53b side) of the through holes 50c and 50d. The two connection terminals 52 on the left side are connected to the connector 53a on the left side via wiring or circuit elements (not shown) arranged on the rigid substrate 23. Similarly, the two connection terminals 52 on the right side are connected to the connector 53b on the right side via wiring or circuit elements (not shown) arranged on the rigid substrate 23. Each COF 22 passes through the corresponding through hole 50 and is connected to a connection terminal 52 provided on the upper surface of the rigid substrate 23.

<COF>
Next, COF22 will be described in detail. As shown in FIG. 4, each head unit 25 and the rigid substrate 23 are electrically connected by a COF (Chip On Film) 22. The COF 22 is joined to a portion of each head unit 25 in which one end in the length direction of the COF 22 is arranged between two left and right piezoelectric element trains and a plurality of drive contacts 47a of the head unit 25 are arranged. There is. Further, as shown in FIGS. 3 and 4, the four COFs 22 are arranged in the scanning direction from the four head units 25, respectively, from the through holes 20c of the head holder 20 and the through holes 50a to 50d of the rigid substrate 23, respectively. It extends upward through to the upper surface of the rigid substrate 23. The other end of the COF 22 in the length direction is joined to the portion of the rigid substrate 23 where the connection terminal 52 is arranged.

As shown in FIGS. 7 to 9, the COF 22 includes a base material 61, a driver IC 62, two ground wirings 66, a plurality of individual wirings 67, and a plurality of control wirings 68. The base material 61 is a flexible film-like member made of a synthetic resin material such as polyimide. At one end of the base material 61 in the length direction, one surface 61a is joined to a portion of the upper surface of the head unit 25 where the conduction contact 47a is arranged. Further, the base material 61 is bent at the first bent portion 71 near the joint portion with the head unit 25, and as described above, passes through the through holes 20c of the head holder 20 and the through holes 50a to 50d of the rigid substrate 23. It extends above the rigid substrate 23. Further, the base material 61 is bent at the second bent portion 72 above the rigid substrate 23. Then, at the other end of the base material 61 in the length direction, one surface 61a is joined to a portion of the upper surface of the rigid substrate 23 where the connection terminal 52 is arranged.

The driver IC 62 is mounted on a portion of one surface 61a of the base material 61 that extends in the vertical direction. The two ground wirings 66 are arranged at both ends in the width direction (transport direction) of the base material 61 and extend along the length direction of the base material 61. The ground wiring 66 has a wiring layer 66a on one side and a wiring layer 66b on the other side. The one-side wiring layer 66a is made of a conductive material such as Cu, is arranged on one surface 61a of the base material 61, and extends over almost the entire length in the length direction of the base material 61.

The other side wiring layer 66b is made of a conductive material such as Cu, and is a portion of the other surface 61b of the base material 61 that extends in the vertical direction located between the first bent portion 71 and the second bent portion 72. Is located in. The other surface 61b of the base material 61 is a surface opposite to one surface 61a of the base material 61. The other-side wiring layer 66b overlaps with a vertically extending portion of the one-side wiring layer 66a located between the first bent portion 71 and the second bent portion 72 in the thickness direction of the base material 61. .. Further, the one-side wiring layer 66a and the other-side wiring layer 66b are connected to each other via a plurality of through holes 73 formed in the base material 61. The plurality of through holes 73 are arranged, for example, at intervals of about 50 to 100 μm along the length direction of the base material 61. Alternatively, the plurality of through holes 73 may be arranged at intervals of about 1 mm, which is larger than this, for example.

The plurality of individual wirings 67 are individual wirings for the plurality of piezoelectric elements 39. The plurality of individual wirings 67 are two ground wirings 66 in the width direction of the base material 61 among the parts of the base material 61 between the joint portion with the head unit 25 and the portion on which the driver IC 62 is mounted. It is placed in the middle part. Each of the plurality of individual wirings 67 extends along the length direction of the base material 61, and is arranged at intervals in the width direction of the base material 61. Further, in the width direction of the base material 61, the distance D2 between the individual wirings 67 (for example, about 30 to 50 μm) is smaller than the distance D1 between the outermost individual wirings 67 and the ground wiring 66 (for example, about 100 μm). ..

The individual wiring 67 has a wiring layer 67a on one side and a wiring layer 67b on the other side. The one-side wiring layer 67a is made of a conductive material such as Cu and is arranged on one surface 61a of the base material 61. The individual wiring 67 extends over the entire length between the joint portion of the base material 61 with the head unit 25 and the portion on which the driver IC 62 is mounted in the length direction of the base material 61.

The other side wiring layer 67b is made of a conductive material such as Cu, and is located between the first bent portion 71 and the portion on which the driver IC 62 is mounted in the other surface 61b of the base material 61 in the vertical direction. It is placed in the part that extends to. The other side wiring layer 67b is a portion of the one side wiring layer 67a extending in the vertical direction located between the first bent portion 71 and the portion on which the driver IC 62 is mounted, and the thickness direction of the base material 61. overlapping. Further, the one-side wiring layer 67a and the other-side wiring layer 67b are connected to each other via a plurality of through holes 74 formed in the base material 61. The plurality of through holes 74 are arranged, for example, along the length direction of the base material 61 at intervals of about 50 to 100 μm.

The plurality of control wirings 68 are the two ground wirings 66 in the width direction of the base material 61 among the parts of the base material 61 between the portion where the driver IC 62 is mounted and the joint portion with the rigid substrate 23. It is placed in the middle part. Each of the plurality of control wirings 68 extends along the length direction of the base material 61, and is arranged at intervals in the width direction of the base material 61. Further, the number of control wirings 68 is smaller than the number of individual wirings 67, and the distance D4 between the control wirings 68 (for example, about 100 μm) in the width direction of the base material 61 is larger than the distance D2 between the individual wirings 67. It is larger and smaller than the distance D1 between the outermost individual wiring 67 and the ground wiring 66 and the distance D3 between the outermost control wiring 68 and the ground wiring 66 (for example, about 85 μm).

The control wiring 68 has a wiring layer 68a on one side and a wiring layer 68b on the other side. The one-side wiring layer 68a is made of a conductive material such as Cu and is arranged on one surface 61a of the base material 61. The control wiring 68 extends over the entire length of the base material 61 between the portion of the base material 61 on which the driver IC 62 is mounted and the joint portion with the rigid substrate 23 in the length direction of the base material 61.

The other side wiring layer 68b is made of a conductive material such as Cu, and is located between the portion of the other surface 61b of the base material 61 on which the driver IC 62 is mounted and the second bent portion 72 in the vertical direction. It is placed in the part that extends to. The other-side wiring layer 68b includes a portion of the one-side wiring layer 68a on which the driver IC 62 is mounted, a portion extending in the vertical direction located between the second bent portion 72, and a portion in the thickness direction of the base material 61. overlapping. Further, the one-side wiring layer 68a and the other-side wiring layer 68b are connected to each other via a plurality of through holes 75 formed in the base material 61. The plurality of through holes 75 are arranged at intervals of about 50 to 100 μm along the length direction of the base material 61, for example.

Further, the thicknesses of the wiring layers 66a to 68a on one side of the wirings 66 to 68 are all the same T11 (for example, about 8 μm, and the thicknesses of the wiring layers 66b to 68b on the other side of the wirings 66 to 68 are all the same T12. T12 may be the same as the thickness T11 or may be different from the thickness T11. Here, the fact that the thickness is the same means that the thickness varies slightly (for example, 1 to 2) within the range of manufacturing error. It also includes variations of% or less. The same applies to the following description of the thickness.

Then, in the present embodiment, of the ground wiring 66, the central portion 66c (“second wiring portion” of the present invention) of the base material 61 located between the first bent portion 71 and the second bent portion 72. The thickness is the sum of the thickness T11 of the one-side wiring layer 66a and the thickness T12 of the other-side wiring layer 66b [T11 + T12] (for example, about 16 to 32 μm). On the other hand, the thickness of the portion of the ground wiring 66 other than the central portion 66c is the thickness T11 of the one-side wiring layer 66a. That is, in the ground wiring 66, the thickness of the central portion 66c is larger than the thickness of the portions other than the central portion 66c.

Similarly, of the individual wiring 67, the thickness of the central portion 67c (“second wiring portion” of the present invention) located between the first bent portion 71 and the portion on which the driver IC 62 is mounted on the base material 61 is thick. , The thickness [T11 + T12] is the sum of the thickness T11 of the one-side wiring layer 67a and the thickness T12 of the other-side wiring layer 67b. On the other hand, the thickness of the portion of the individual wiring 67 other than the central portion 67c is the thickness T11 of the one-side wiring layer 67a. That is, in the individual wiring 67, the thickness of the central portion 67c is larger than the thickness of the portions other than the central portion 67c.

Similarly, of the control wiring 68, the thickness of the central portion 68c (“second wiring portion” of the present invention) located between the portion of the base material 61 on which the driver IC 62 is mounted and the second bent portion 72 is thick. , The thickness [T11 + T12] is the sum of the thickness T11 of the one-side wiring layer 68a and the thickness T12 of the other-side wiring layer 68b. On the other hand, the thickness of the portion of the control wiring 68 other than the central portion 68c is the thickness T11 of the one-side wiring layer 68a. That is, in the control wiring 68, the thickness of the central portion 68c is larger than the thickness of the portions other than the central portion 68c.

Further, as described above, since the plurality of wirings 66 to 68 are arranged on the base material 61, they are arranged at the joint portion of the base material 61 with the head unit 25 among the ground wiring 66 and the individual wirings 67. The connection portions 66d and 67d (“first wiring portion” of the present invention) are electrically connected to the head unit 25. Further, of the ground wiring 66 and the control wiring 68, the connection portions 66e and 68d arranged at the joint portion of the base material 61 with the rigid substrate 23 are electrically connected to the rigid substrate 23.

As a result, a signal for controlling the driver IC 62 can be transmitted from the rigid board 23 to the driver IC 62 via the plurality of control wirings 68. Further, the drive signal can be individually transmitted from the driver IC 62 to the plurality of piezoelectric elements 39 of the head unit 25 via the plurality of individual wirings 67 to change the voltage applied to the piezoelectric element 39. Further, the ground wiring 66 is connected to a ground terminal of a power supply (not shown) via a rigid board 23.

Further, on one surface 61a of the base material 61, one side wiring layer 66a of the two ground wirings 66, one side wiring layer 67a of the plurality of individual wirings 67, and one side wiring layer of the plurality of control wirings 68. A solder resist 76 covering 68a is arranged. However, of the one-side wiring layers 66a and 67a, the portions forming the connection portions 66d and 67d, and the portions of the one-side wiring layers 66a and 68a forming the connection portions 66e and 68d are provided. It is not covered with solder resist 76 and is exposed. Further, on the other surface 61b of the base material 61, the other side wiring layer 66b of the two ground wirings 66, the other side wiring layer 67b of the plurality of individual wirings 67, and the other side wiring layer of the plurality of control wirings 68. A solder resist 77 covering 68b is arranged.

<Manufacturing method of COF22>
Next, a method for producing COF22 will be described. As shown in FIG. 10, in order to produce COF22, first, a plurality of through holes 73 to 75 are formed in the base material 61 (S101). Subsequently, one side wiring layers 66a to 68a of the wirings 66 to 68 are formed on one surface 61a of the base material 61 (S102, "one side wiring layer forming step" of the present invention). In S102, for example, after forming a film of a conductive material such as Cu over the entire area of one surface 61a of the base material 61, an unnecessary portion of the film of the conductive material is removed by etching. The side wiring layers 66a to 68a are formed. Subsequently, a conductive material such as Cu is formed in the plurality of through holes 73 to 75 (S103), and a solder resist 76 is formed on one surface 61a of the base material 61 (S104).

Subsequently, the other side wiring layers 66b to 68b of the wirings 66 to 68 are formed on the other surface 61b of the base material 61 (S105, "the other side wiring layer forming step" of the present invention). Also in S105, for example, after forming a film of a conductive material such as Cu over the entire area of the other surface 61b of the base material 61, an unnecessary portion of the film of the conductive material is removed by etching to remove the other. The side wiring layers 66b to 68b are formed. Subsequently, a solder resist 77 is formed on one surface 61a of the base material 61 (S106), and the driver IC 62 is mounted on one surface 61a of the base material 61 (S107).

<Effect>
Here, in the present embodiment, the ink is heated by the heater 82, but the heat generated by the heater 82 is also applied to the joint portion between the COF 22 and the head unit 25 and the joint portion between the COF 22 and the rigid substrate 23. Be transmitted. Further, when the head unit 25 is driven, the driver IC 62 generates heat, but the heat generated by the driver IC 62 is also transmitted to the joint portion between the COF 22 and the head unit 25 and the joint portion between the COF 22 and the rigid substrate 23. When heat is transferred to the joint portion between the COF 22 and the head unit 25, the COF 22 may be peeled off from the head unit 25 due to the difference in the linear expansion coefficient between the COF 22 and the head unit 25. When heat is transferred to the joint portion between the COF 22 and the rigid substrate 23, the COF 22 may be peeled off from the rigid substrate 23 due to the difference in the coefficient of linear expansion between the COF 22 and the rigid substrate 23. For example, the coefficient of linear expansion of COF22 is about 5 ppm / ° C, while the coefficient of linear expansion of silicon constituting the head unit 25 is about 3.4 ppm / ° C, and the coefficient of linear expansion of the rigid substrate is about 10 to 15 ppm. It is about / ° C.

Therefore, in the present embodiment, in the wirings 66 to 68, the thickness of the central portion 66c to 68c is made larger than the thickness of the other portions. As a result, the heat dissipation effect in the wirings 66 to 68 is enhanced, and the temperature of the joint portion between the COF 22 and the head unit 25 is unlikely to increase. As a result, it is possible to prevent the COF 22 from being peeled off from the head unit 25 or the rigid substrate 23.

Here, in the COF 22, the number of individual wirings 67 individually provided for the plurality of piezoelectric elements 39 (for example, about 400 to 2000) is the number of ground wirings 66 (2) and the control wiring 68. It is sufficiently large compared to the number of (for example, about 10 to 50). Therefore, the total surface area of the plurality of individual wirings 67 is sufficiently larger than the total surface area of the two ground wirings 66 and the total surface area of the plurality of control wirings 68. Therefore, in the plurality of individual wirings 67, the heat dissipation effect by making the thickness of the central portion 67c larger than the thickness of the other portions is particularly high.

Further, in the wirings 66 to 68, by increasing the thickness of the central portions 66c to 68c, the electric resistance of the wirings 66 to 68 becomes smaller. As a result, when a current flows through the wirings 66 to 68, heat is less likely to be generated in the wirings 66 to 68. Even with this, the temperature of the joint portion between the COF 22 and the head unit 25 and the joint portion between the COF 22 and the rigid substrate 23 is unlikely to increase.

Further, in the present embodiment, the heat dissipation effect is enhanced by increasing the thickness of the central portions 66c to 68c of the wirings 66 to 68. Therefore, the device can be downsized as compared with the case where a heat sink is separately provided.

Here, considering only increasing the heat dissipation effect as described above, it is conceivable to increase the thickness of the portions other than the central portions 66c to 68c of the wirings 66 to 68.

However, when the COF 22 is adhered to the head unit 25, these joint portions are heated, whereas when the thickness of the connecting portions 66d and 67d of the wirings 66 and 67 is increased, the COF 22 and the head unit 25 are adhered to each other. Occasionally, heat can easily escape from these joints, making it difficult to control the bond temperature. Similarly, when the COF 22 is bonded to the rigid substrate 23, these joint portions are heated, whereas when the thickness of the connection portions 66e and 68d of the wirings 66 and 68 is increased, the COF 22 and the rigid substrate 23 are bonded to each other. During bonding, heat tends to escape from these joints, making it difficult to control the bonding temperature.

Similarly, when the driver IC 62 is mounted on the base material 61, these joint portions are heated, whereas when the thickness of the connection portion of the wirings 67 and 68 with the driver IC 62 is increased, the base material of the driver IC 62 is increased. At the time of mounting on 61, heat easily escapes from these joint portions, and it becomes difficult to control the temperature at the time of mounting.

Further, if the thickness of the portion of the wiring 66, 67 arranged in the first bent portion 71 is increased, the rigidity of the first bent portion 71 becomes high, and it is difficult to bend the COF 22 in the first bent portion 71. Further, when the thickness of the portion of the wiring 66 and 68 arranged in the second bent portion 72 is increased, the rigidity of the second bent portion is increased and the COF 22 is difficult to bend in the second bent portion 72.

For these reasons, in the present embodiment, as described above, in the wirings 66 to 68, the thickness of the portions other than the central portions 66c to 68c is reduced. This makes it possible to prevent the wiring from being short-circuited. Further, it is easy to bend the COF 22 at the first and second bent portions 71 and 72.

Further, in the present embodiment, the one-side wiring layers 66a to 68a extending over the entire area of the wirings 66 to 68 are arranged on one surface 61a of the base material 61. Further, on the other surface 61b of the base material 61, a part of the one-side wiring layers 66a to 68a and the other-side wiring layers 66b to 68b overlapping in the thickness direction of the base material 61 are arranged. Thereby, the thickness of the central portion 66c to 68c of the wiring 66 to 68 can be made larger than the thickness of the portion other than the central portion 66c to 68c.

Further, in this case, the one-side wiring layers 66a to 68a arranged on one surface 61a of the base material 61 and the other-side wiring layers 66b to 68b arranged on the other surface 61b of the base material 61 are formed. The above-mentioned second wiring portion is formed so as to overlap with each other in the thickness direction of the base material 61. Therefore, as compared with the case where the wiring is arranged only on one surface 61a of the base material 61 and the thickness of the second wiring portion which is a part thereof is increased as in the modification 1 described later, the second wiring portion The amount of protrusion from the base material 61 can be reduced. As a result, when an external force is applied to the COF 22, even if the second wiring portions of the plurality of wirings bend in a direction approaching each other, it is difficult for the wirings to come into contact with each other.

Further, in the present embodiment, the one-side wiring layers 66a to 68a arranged on one surface 61a of the base material 61 and the other-side wiring layers 66b to 68b arranged on the other surface 61b of the base material 61 are provided. Each can be easily connected via the through holes 73 to 75 formed in the base material 61.

Further, in the COF 22 of the present embodiment, as described above, through holes 73 to 75 are formed in the base material 61, and one side wiring layers 66a to 68a are formed on one surface 61a of the base material 61, and the base material 61 is formed. It can be easily manufactured by forming the other side wiring layers 66b to 68b on the other surface 61b of the above.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made as long as it is described in the claims.

In the above-described embodiment, in any of the wirings 66 to 68, the one-side wiring layers 66a to 68a and the other-side wiring layers 66b to 68b are connected via through holes 73 to 75 formed in the base material 61. It was, but it is not limited to this. For example, of the wirings 66 to 68 arranged on the COF 22, the ground wiring 66 is located on the outermost side in the width direction of the base material 61, and instead of the through hole 73, the base material 61 A pattern for connection may be provided so as to extend around the edge portion in the width direction of the above and connect the one-side wiring layer 66a and the other-side wiring layer 66b.

Further, in the above-described embodiment, the wirings 66 to 68 are arranged on one side wiring layer 66a to 68a arranged on one surface 61a of the base material 61 and the other side arranged on the other surface 61b of the base material 61, respectively. It is assumed that the side wiring layers 66b to 68b are provided, but the present invention is not limited to this.

In the first modification, as shown in FIGS. 11 (a), 12 (a) and 13 (a) to (d), in the COF 100, the ground wiring 101 includes the first material layer 101a and the second material layer 101b. are doing. The first material layer 101a is made of a conductive first material such as Cu, and is arranged on one surface 61a of the base material 61. The position of the first material layer 101a is the same as that of the one-side wiring layer 66a of the above-described embodiment. The second material layer 101b extends in the vertical direction located between the first bent portion 71 and the second bent portion 72 of the base material 61 on the surface of the first material layer 101a opposite to the base material 61. It is placed in the part. The second material layer 101b is made of a second material such as Ag or Au, which has conductivity and has a higher thermal conductivity than the first material layer 101a.

Further, as shown in FIGS. 11 (b), 12 (a), and 13 (b), the individual wiring 102 has a first material layer 102a and a second material layer 102b. The first material layer 102a is made of the first material and is arranged on one surface 61a of the base material 61. The position of the first material layer 102a is the same as that of the one-side wiring layer 67a of the above-described embodiment. The second material layer 102b is made of the above-mentioned second material, and has a surface on the opposite side of the first material layer 102a from the base material 61, a first bent portion 71 of the base material 61, and a portion on which the driver IC 62 is mounted. It is located in the part extending in the vertical direction, which is located between the two.

Further, as shown in FIGS. 11 (b), 12 (c), and 13 (d), the control wiring 103 has a first material layer 103a and a second material layer 103b. The first material layer 103a is made of the first material and is arranged on one surface 61a of the base material 61. The position of the first material layer 103a is the same as that of the one-side wiring layer 68a of the above-described embodiment. The second material layer 103b is made of the above-mentioned second material, and has a portion of the surface of the first material layer 103a opposite to the base material 61 on which the driver IC 62 of the base material 61 is mounted and the second bent portion 72. It is located in the part extending in the vertical direction, which is located between them.

Further, in the first modification, the thicknesses of the first material layers 101a to 103a are all T21 (for example, about 8 μm), and the thicknesses of the second material layers 101b to 103b are all T22. The thickness T22 may be the same as the thickness T21 or may be different from the thickness T21.

In the first modification, the thickness of the central portion 101c (“second wiring portion” of the present invention) located between the first bent portion 71 and the second bent portion 72 of the ground wiring 101 is the first. The total thickness of the material layer 101a T21 and the thickness T22 of the second material layer 101b is [T21 + T22] (for example, about 16 to 32 μm). On the other hand, the thickness of the portion of the ground wiring 101 other than the central portion 101c is the thickness T21 of the first material layer 101a. That is, in the ground wiring 101, the thickness of the central portion 101c is larger than the thickness of the portions other than the central portion 101c.

Similarly, of the individual wiring 102, the thickness of the central portion 102c (“second wiring portion” of the present invention) located between the first bent portion 71 of the base material 61 and the portion on which the driver IC 62 is mounted. Is the total thickness [T21 + T22] of the thickness T21 of the first material layer 102a and the thickness T22 of the second material layer 102b. On the other hand, the thickness of the portion of the individual wiring 102 other than the central portion 102c is the thickness T21 of the first material layer 102a. That is, in the individual wiring 102, the thickness of the central portion 102c is larger than the thickness of the portion other than the central portion 102c.

Similarly, in the control wiring 103, the thickness of the central portion 103c (“second wiring portion” of the present invention) located between the portion of the base material 61 on which the driver IC 62 is mounted and the second bent portion 72. Is the total thickness [T21 + T22] of the thickness T21 of the first material layer 103a and the thickness T22 of the second material layer 103b. On the other hand, the thickness of the portion of the control wiring 103 other than the central portion 103c is the thickness T21 of the first material layer 103a. That is, in the control wiring 103, the thickness of the central portion 103c is larger than the thickness of the portions other than the central portion 103c.

In the first modification, of the ground wiring 101, the connection portion 101d arranged at the joint portion of the base material 61 with the head unit 25 and electrically connected to the head unit 25, and the individual wiring 102. The connection portion 102d arranged at the joint portion of the base material 61 with the head unit 25 and electrically connected to the head unit 25 corresponds to the “first wiring portion” of the present invention.

Further, as shown in FIGS. 13 (a) to 13 (d), the protective layer 104 is arranged on one surface 61a of the base material 61. Further, on one surface 61a of the base material 61, a solder resist 105 covering the wirings 101 to 103 and the protective layer 104 is arranged.

The protective layer 104 is arranged on one surface 61a of the base material 61 other than the portion where the wirings 101 to 103 are arranged. As a result, the protective layer 104 is arranged between the adjacent individual wirings 102, between the adjacent control wirings 103, between the ground wirings 101 and the individual wirings 102, and between the ground wirings 101 and the control wirings 103. The wiring. The thickness of the protective layer 104 is T21, which is the same as the thickness of the first material layers 101a to 103a. As a result, the second material layers 101b to 103b protrude from the protective layer 104 on the side opposite to the first material layers 101a to 103a in the thickness direction of the base material 61. Further, the protective layer 104 is made of a material having higher rigidity than the solder resist 105, such as epoxy resin.

In order to manufacture the COF100, as shown in FIGS. 14, 15 (a) and 15 (b), first, the first material layers 101a to 103a are first formed on one surface 61a of the base material 61 (S201, book). The "first material layer forming step" of the invention). The method for forming the first material layers 101a to 103a is the same as the method for forming the one-side wiring layers 66a to 68a in the above-described embodiment.

Subsequently, as shown in FIGS. 15 (c) and 15 (d), the protective layer 104 is formed on one surface 61a of the base material 61 (S202, "protective layer forming step" of the present invention). In S202, the protective layer 104 is formed by, for example, a spin coating method. When the protective layer 104 is formed by the spin coating method, the protective layer 104 having substantially the same thickness as the first material layers 101a to 103b is formed, and the surface of the first material layers 101a to 103b opposite to the base material 61 is the protective layer. Not covered by 104.

Alternatively, in S202, the protective layer 104 may be formed by a method other than the spin coating method. However, depending on the method of forming the protective layer 104, the surface of the first material layers 101a to 103b may be covered with the protective layer 104. In that case, after the protective layer 104 is formed, a part of the formed protective layer 104 is removed to expose the surfaces of the first material layers 101a to 103b.

Subsequently, as shown in FIGS. 15 (e) and 15 (f), the second material layers 101b to 103b are formed on the surface of the first material layers 101a to 103a opposite to the base material 61 (S203). In S203, a film of the second material is formed on the entire surface of the first material layers 101a to 103a and the protective layer 104 on the opposite side of the base material 61, and then by etching, the film of the second material is unnecessary. The second material layers 101b to 103b are formed by removing the portions.

After that, the solder resist 105 is formed on one surface 61a of the base material 61 (S204), and the driver IC 62 is mounted (S205). In S205, the solder resist 105 is formed, for example, by a spin coating method. At this time, the base material 61 is rotated after arranging a large amount of the solder resist material on one surface 61a of the base material 61 so that the wirings 101 to 103 are covered with the formed solder resist 105. This forms the solder resist 105.

Also in the first modification, in the wirings 101 to 103, the thickness of the central portions 101c to 103c is made larger than the thickness of the portions other than the central portions 101c to 103c. As a result, the heat dissipation effect in the wirings 101 to 103 is enhanced, and the temperature of the joint portion between the COF 100 and the head unit 25 and the joint portion between the COF 100 and the rigid substrate 23 is unlikely to increase. As a result, it is possible to prevent the COF 100 from being peeled off from the head unit 25 or the rigid substrate 23.

Further, in the wirings 101 to 103, by increasing the thickness of the central portions 101c to 103c, the electric resistance of the wirings 101 to 103 becomes smaller. As a result, when a current flows through the wirings 101 to 103, heat is less likely to be generated in the wirings 101 to 103. Even with this, the temperature of the joint portion between the COF 100 and the head unit 25 and the joint portion between the COF 100 and the rigid substrate 23 is unlikely to increase.

Here, it is conceivable to increase the thickness of the portions other than the central portions 101c to 103c of the wirings 101 to 103 only in consideration of increasing the above-mentioned effect.

However, if the thickness of the connection portions 101d and 102d (“first wiring portion” of the present invention) arranged at the joint portion of the base material 61 with the head unit 25 among the wirings 101 and 102 is increased, the COF 100 can be head united. When the COF 100 is pressed toward the head unit 25 in order to be joined to the 25, the connecting portions 101d and 102d of the adjacent wirings 101 and 102 approach each other in the width direction of the base material 61 due to the force applied to the COF 100. There is a risk that the wiring will come into contact with each other and cause a short circuit.

Further, when the thickness of the portions 101e and 103d arranged at the joint portion of the base material 61 with the rigid substrate 23 of the wirings 101 and 103 is increased, the COF 100 is bonded to the rigid substrate 23 in order to bond the COF 100 to the rigid substrate 23. Due to the force applied to the COF 100, the portions 101e and 103d of the adjacent wirings 101 and 103 bend so as to approach each other in the width direction of the base material 61, and the wirings come into contact with each other and short-circuit. There is a risk that it will end up.

Further, if the thickness of the connection portion of the wirings 102 and 103 with the driver IC 62 is increased, when the driver IC 62 is pressed against the base material 61 in order to mount the driver IC 62 on the base material 61, the adjacent individual wirings 102 or There is a risk that the connection portions of the adjacent control wiring 103 with the driver IC 62 will bend so as to approach each other in the width direction of the base material 61, and the wirings will come into contact with each other and cause a short circuit.

Further, if the thickness of the portion of the wirings 101 and 102 arranged in the first bent portion 71 is large, the rigidity of the first bent portion 71 becomes high, and it is difficult to bend the COF 100 in the first bent portion 71. Further, if the thickness of the portion of the wirings 101 and 103 arranged in the second bent portion 72 is large, the rigidity of the second bent portion 72 becomes high, and it is difficult to bend the COF 100 in the second bent portion 72.

For these reasons, in the modified example 1, as described above, in the wirings 101 to 103, the thickness of the portions other than the central portions 101c to 103c is reduced. This makes it possible to prevent the wiring from being short-circuited. In addition, the COF 100 can be easily bent at the first and second bent portions 71 and 72.

Further, in the first modification, the first material layers 101a to 103a extending over the entire area of the wirings 101 to 103 are arranged on one surface 61a of the base material 61. Further, the second material layers 101b to 103b are arranged on a part of the surface of the first material layers 101a to 103a on the opposite side of the base material 61. Thereby, the thickness of the central portion 101c to 103c of the wiring 101 to 103 can be made larger than the thickness of the portion other than the central portion 101c to 103c.

Further, in the first modification, the wiring 101 is made by using the second material constituting the second material layers 101b to 103b as a material having a higher thermal conductivity than the first material constituting the first material layers 101a to 103a. The heat dissipation effect in ~ 103 can be further enhanced.

Further, in the central portions 101c to 103c having a large thickness among the wirings 101 to 103, when an external force is applied to the COF 100, the central portions 101c to 103c may bend in the width direction of the base material 61 and short-circuit. be. In the first modification, the protective layer 104 is arranged between the adjacent first material layers 101a to 103a. As a result, when an external force is applied to the COF 100, the central portions 101c to 103c are prevented from bending in the width direction of the base material 61 by the protective layer 104, and the wirings can be prevented from coming into contact with each other. can.

Further, in the COF 100 of the modified example 1, as described above, the first material layers 101a to 103a are formed on one surface 61a of the base material 61, and the surface of the first material layers 101a to 103a on the opposite side to the base material 61. It can be easily manufactured by forming the second material layers 101b to 103b in a part of the above.

Further, in the first modification, when the first material layers 101a to 103a are formed and then the protective layer 104 is formed when the COF 100 is manufactured, the surface of the first material layers 101a to 103a opposite to the base material 61 is formed. A continuous flat surface is formed by the surface of the protective layer 104 opposite to the base material 61. Thereby, after that, the film of the second material to be the second material layers 101b to 103b can be easily formed.

Further, in the first modification, the thicknesses of the first material layers 101a to 103a are all the same T21, and the thicknesses of the second material layers 101b to 103b are all the same T22. Therefore, when the COF100 is manufactured as described above. In addition, wirings 101 to 103 can be easily formed.

Further, in the first modification, the protective layer 104 is arranged on one surface 61a of the base material 61, but the protective layer 104 may not be provided.

Further, in the first modification, the second material constituting the second material layers 101b to 103b has a higher thermal conductivity than the first material constituting the first material layers 101a to 103a. Is not limited. The second material may be a material having a lower thermal conductivity than the first material. Even in this case, the heat dissipation effect can be enhanced as compared with the case where the wirings 101 to 103 are formed only by the first material layers 101a to 103a and the second material layers 101b to 103b are absent.

Further, in the first modification, the second material layers 101b to 103b made of a second material different from the first material are arranged on the surface of the first material layers 101a to 103a made of the first material opposite to the base material 61. It was, but it is not limited to this. For example, in the first modification, all the portions of the wirings 101 to 103 are formed of the same material, and the thickness of the above-mentioned second wiring portion of the wirings 101 to 103 is the portion other than the second wiring of the wirings 101 to 103. It may be larger than the thickness of (the portion including the above-mentioned first wiring portion). Further, even in this case, the COF can be manufactured by the same procedure as in the first modification. However, in this case, the same material is used for S201 and S203 to form each portion of the wiring 101 to 103.

Further, when the entire wiring is made of the same material, the COF can be manufactured by a procedure different from that of the first modification. For example, in the second modification, in order to manufacture the COF 110, first, as shown in FIGS. 16A and 16B, a wiring 111 is first formed on one surface 61a of the base material 61 (S301, the present invention). "Wiring formation process"). At this time, the thickness of the entire wiring 111 is set to, for example, T22, which is the same as the thickness of the wirings 101 to 103 in the second wiring portion of the first modification. Subsequently, as shown in FIG. 16C, by etching, the portion of the wiring 111 formed in S301 other than the second wiring portion, which is opposite to the base material 61 in the thickness direction, is removed. , The thickness of this portion of the wiring 111 is reduced (S302, "removal step" of the present invention). Then, similarly to the first modification, a solder resist is formed on one surface 61a of the base material 61 (S303), and the driver IC 62 is mounted (S304).

By forming a wiring having a large thickness as a whole and removing a part of the formed wiring in this way, it is possible to form a wiring having a thickness larger than that of the first wiring portion in the second wiring portion. ..

Further, in the above example, the ground wiring, the individual wiring, and the control wiring have the same thickness at the portion where the position of the base material 61 in the length direction is the same, but the thickness is not limited to this. For example, in the modified example 3, as shown in FIGS. 17 (a) to 17 (d), the COF 120 replaces the ground wiring 101 with the ground wiring 121 in the COF 100 of the modified example 1. The ground wiring 121 has a first material layer 121a and a second material layer 121b. The thickness of the first material layer 121a is T31, which is larger than T21, which is the same as the thickness of the first material layers 102a and 103a. The thickness of the second material layer 121b is T32, which is larger than the thickness T22 of the second material layers 102b and 103b. For example, the thicknesses T21 and T22 are about 8 μm, while the thicknesses T31 and T32 are about 16 μm. The first material layer 121a and the second material layer 121b are the same as the first material layer 101a and the second material layer 101b, respectively, except for the thickness.

As a result, in the COF 120, the thickness of the ground wiring 111 becomes larger than the thickness of the individual wiring 102 and the control wiring 103 when the portions of the base material 61 in the length direction are compared with each other.

In the case of the modification 3, the heat dissipation effect can be enhanced by making the thickness of the ground wiring 111 larger than the thickness of the individual wiring 102 and the control wiring 103. Further, in the width direction of the base material 61, the distance D1 between the ground wiring 111 and the individual wiring 102 and the distance D3 between the ground wiring 111 and the control wiring 103 are the distance D2 between the individual wiring 102 and the control wiring 103. Since the distance is larger than D4, even if the thick ground wiring 111 bends in the width direction of the base material 61, it is unlikely that the ground wiring 111 and the individual wiring 102 or the control wiring 103 come into contact with each other and cause a short circuit. ..

Further, in the third modification, the thickness of the first material layer 120a is T31, which is larger than the thickness T21 of the first material layers 102a and 103a, and the thickness of the second material layer 120b is larger than the thickness T22 of the second material layers 102b and 103b. T32 is also large, but it is not limited to this. For example, the thickness of the first material layer 120a may be made larger than the thickness T21 of the first material layers 102a and 103a, and the thickness of the second material layer 120b may be T22 which is the same as the thickness of the second material layers 102b and 103b. .. Alternatively, the thickness of the first material layer 120a is set to T21, which is the same as the thickness of the first material layers 102a and 103a, and the thickness of the second material layer 120b is made larger than the thickness T22 of the second material layers 102b and 103b. May be good.

Further, in the modified example 3, the case where the wiring is arranged only on one surface 61a of the base material 61 has been described, but the present invention is not limited to this. Even in the case where the one-side wiring layer is formed on one surface 61a of the base material 61 and the other-side wiring layer is formed on the other surface 61b of the base material 61 as in the above-described embodiment, in the ground wiring, The thickness of at least one of the wiring portion on one side and the wiring portion on the other side may be larger than that of the individual wiring and the control wiring.

Further, in the above example, of the wiring, the portion of the base material 61 arranged at the first bent portion 71, the second bent portion 72, the joint portion with the head unit 25, and the joint portion with the rigid substrate 23. The portion excluding the above is used as the thick second wiring portion, but the present invention is not limited to this.

For example, although it becomes difficult to bend the COF in the first bent portion, the portion of the wiring arranged in the first bent portion 71 may be included in the second wiring portion. Alternatively, although it becomes somewhat difficult to bend the COF at the second bent portion, the portion of the wiring arranged at the second bent portion 72 may be included in the second wiring portion.

Alternatively, the portion of the wiring arranged at the joint portion of the base material 61 with the rigid substrate 23 may be included in the thick second wiring portion. The distance between the control wires is larger than the distance between the individual wires. Therefore, when the COF is pressed toward the connection terminal 52 in order to join the COF to the connection terminal 52, even if the adjacent control wirings bend in a direction approaching each other, the control wirings are unlikely to come into contact with each other.

Alternatively, the portion of the wiring arranged in the portion where the driver IC 62 of the base material 61 is mounted may be included in the thick second wiring portion. Alternatively, as the wiring member, an FPC on which the driver IC is not mounted may be used instead of the COF on which the driver IC is mounted.

Further, in the above example, all the individual wirings and the ground wiring on the COF have a first wiring portion connected to the head unit 25 and a second wiring portion having a thickness larger than that of the first wiring portion. However, it is not limited to this. If at least a part of the individual wirings on the COF has the first wiring portion and the second wiring portion, the other wirings have the first wiring portion and It may not have a second wiring portion. Further, at this time, it is preferable that more than half of the individual wirings have the first wiring portion and the second wiring portion among the plurality of individual wirings. In the COF, the total surface area of the plurality of individual wirings is sufficiently large compared to the total surface area of the ground wiring and the total surface area of the control wiring. Therefore, if more than half of the individual wirings have a first wiring portion and a second wiring portion, the heat dissipation effect can be sufficiently high.

Further, in the above-described embodiment, the ink in the flow path member 81 is heated by the heater 82, but the heater 82 may not be used. Even in this case, for example, the driver IC 62 generates heat when the head unit 25 is driven, and this heat is transferred to the joint portion between the COF and the head unit 25. Therefore, even if there is no heater 82, it is significant to increase the heat dissipation efficiency by making the thickness of the second wiring portion larger than the thickness of the first wiring portion.

Further, in the above, an example in which the present invention is applied to an inkjet printer provided with an inkjet head that ejects ink from a nozzle has been described, but the present invention is not limited thereto. For example, the present invention can be applied to a recording device such as a thermal head provided with a recording head that records by a method other than ejecting ink from a nozzle, or to a wiring member constituting the recording device.

1 Printer 21 Inkjet head 22 COF
23 Rigid board 61 Base material 61a One side 61b The other side 66 Ground wiring 66a One side wiring layer 66b The other side wiring layer 67 Individual wiring 67a One side wiring layer 67b The other side wiring layer 68 Control wiring 71 First bent part 72 No. 2 Bent part 82 Heater 100 COF
101 Ground wiring 101a 1st material layer 101b 2nd material layer 102 Individual wiring 102a 1st material layer 102b 2nd material layer 103 Control wiring 104 Protective layer 110 COF
111 Ground wiring 111a First material layer 111b Second material layer 120 COF
121 Ground wiring

Claims (19)

A recording head with multiple recording elements and
A wiring member connected to the recording head is provided.
The wiring member is
With a flexible substrate,
With a plurality of wirings arranged on the substrate,
The plurality of wirings
The plurality of individual wirings individually for the plurality of recording elements are included.
Of the plurality of individual wirings, at least a part of the individual wirings
The first wiring portion connected to the recording head and
A recording device having a portion other than the first wiring portion and having a second wiring portion having a thickness larger than that of the first wiring portion. The recording device according to claim 1, wherein more than half of the individual wirings of the plurality of individual wirings have the first wiring portion and the second wiring portion. At least some of the individual wiring is
A one-side wiring layer arranged on one surface of the base material and common to the first wiring portion and the second wiring portion,
A claim characterized by having a other side wiring layer arranged on the other surface of the base material and overlapping with a portion of the one side wiring layer forming the second wiring portion in the thickness direction of the base material. Item 2. The recording device according to Item 1 or 2. 3. The third aspect of the present invention is characterized in that the portion of the one-side wiring layer forming the second wiring portion and the other-side wiring layer are connected via a through hole formed in the base material. The recording device described. The first wiring portion and the second wiring portion are arranged on one surface of the base material, and the first wiring portion and the second wiring portion are arranged on one surface of the base material.
The claim is characterized in that the thickness of the second wiring portion arranged on the one surface of the base material is larger than the thickness of the first wiring portion arranged on the one surface of the base material. The recording device according to 1 or 2. At least some of the individual wiring is
A first material layer arranged on the one surface of the base material, made of a first conductive material, and common to the first wiring portion and the second wiring portion,
A second material layer made of a second conductive material different from the first conductive material and arranged on the surface of the first material layer opposite to the base material of the portion forming the second wiring portion. The recording device according to claim 5, wherein the recording device has. The recording device according to claim 6, wherein the second conductive material is a material having a higher thermal conductivity than the first conductive material. The wiring member is
The recording apparatus according to claim 6 or 7, wherein the recording device is arranged on the substrate and has a protective layer located between the first material layers of the adjacent wiring. The wiring member is
It has a driver IC, which is mounted on the substrate and connected to the wiring.
The recording device according to any one of claims 1 to 8, wherein the portion of the wiring that overlaps with the driver IC in the thickness direction of the base material is smaller in thickness than the second wiring portion. The wiring member is bent and extended at the first bent portion, and the wiring member is bent and extended.
The recording device according to any one of claims 1 to 9, wherein the second wiring portion is located on the opposite side of the first bending portion to the first wiring portion. A rigid substrate, which is connected to the recording head via the wiring member, is provided.
The wiring member is bent and extended at the second bent portion on the rigid substrate side of the first bent portion.
The recording device according to claim 10, wherein the second wiring portion is located between the first bent portion and the second bent portion. The plurality of wirings
Two ground wires arranged at both ends in the width direction of the base material and held at the ground potential, and
Including the plurality of individual wirings arranged between the two ground wirings in the width direction of the substrate and arranged in the width direction of the substrate.
The two ground wirings have the first wiring portion and the second wiring portion.
In the width direction of the base material, the distance between the ground wiring and the individual wiring closest to the ground wiring is larger than the distance between the individual wirings.
The recording device according to any one of claims 1 to 11, wherein the thickness of the ground wiring is larger than the thickness of the individual wiring. The recording head has a plurality of recording elements and has a plurality of recording elements.
The plurality of wirings
Two ground wires arranged at both ends in the width direction of the base material and held at the ground potential, and
Includes the plurality of individual wires arranged between the two ground wires in the width direction of the substrate and aligned in the width direction of the substrate.
The two ground wirings have the first wiring portion and the second wiring portion.
The recording device according to any one of claims 1 to 11, wherein the thickness of the ground wiring and the thickness of the individual wiring are the same. The recording head has a nozzle for ejecting a liquid.
The recording device according to any one of claims 1 to 13, further comprising a heating unit for heating the liquid. A flexible base material that is a wiring member connected to a recording head having a plurality of recording elements,
A plurality of wirings arranged on the substrate and connected to the recording head.
The plurality of wirings
The plurality of individual wirings individually for the plurality of recording elements are included.
Of the plurality of individual wirings, at least a part of the individual wirings
The first wiring portion connected to the recording head and
A wiring member having a portion other than the first wiring portion and having a second wiring portion having a thickness larger than that of the first wiring portion.
Wiring member. A method for manufacturing a wiring member connected to a recording head having a plurality of recording elements.
On one surface of the flexible substrate, a first wiring portion connected to the recording head of at least a part of the individual wirings of the plurality of individual wirings individual to the plurality of recording elements, and A one-sided wiring layer forming step of forming a common one-sided wiring layer in a second wiring portion other than the first wiring portion,
A step of forming the other side wiring layer on the other side surface of the base material so as to form the other side wiring layer overlapping the portion of the one side wiring layer forming the second wiring portion in the thickness direction of the base material. A method for manufacturing a wiring member, which comprises. A method for manufacturing a wiring member connected to a recording head having a plurality of recording elements.
On a flexible substrate, a first wiring portion of at least a part of the individual wirings of the plurality of individual wirings individual to the plurality of recording elements, connected to the recording head, and the first wiring. A first material layer forming step for forming a first material layer made of a first conductive material, which is common to the second wiring portion other than the portion.
Of the first material layer of at least a part of the individual wiring, the surface of the portion forming the second wiring portion on the opposite side of the base material is made of a second conductive material different from the first conductive material. A method for manufacturing a wiring member, which comprises a second material layer forming step for forming a second material layer. In the first material layer forming step, the first material layer arranged in the width direction of the base material is formed.
After the first material layer forming step and before the second material layer forming step, a protective layer forming step of forming a protective layer located between the adjacent first material layers on the base material is performed. The method for manufacturing a wiring member according to claim 17, further comprising. A method for manufacturing a wiring member connected to a recording head having a plurality of recording elements.
A wiring forming step of forming at least a part of individual wirings among a plurality of individual wirings individually for the plurality of recording elements on the surface of a flexible base material.
By removing a part of the at least a part of the individual wiring in the thickness direction of the first wiring portion connected to the recording head, the thickness of the first wiring portion can be reduced to a thickness other than the first wiring portion of the wiring. A method for manufacturing a wiring member, which comprises a removal step of making the thickness of the second wiring portion smaller than the thickness of the wiring portion.

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