JP7048653B2 - レーザ溶接方法およびレーザ溶接システム - Google Patents

レーザ溶接方法およびレーザ溶接システム Download PDF

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JP7048653B2
JP7048653B2 JP2020033024A JP2020033024A JP7048653B2 JP 7048653 B2 JP7048653 B2 JP 7048653B2 JP 2020033024 A JP2020033024 A JP 2020033024A JP 2020033024 A JP2020033024 A JP 2020033024A JP 7048653 B2 JP7048653 B2 JP 7048653B2
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Prior art keywords
laser
welding
waveform
energy
laser welding
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Japanese (ja)
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JP2020138238A (ja
Inventor
唐江鋒
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上海微電子装備（集団）股▲フン▼有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2020033024A 2019-02-28 2020-02-28 レーザ溶接方法およびレーザ溶接システム Active JP7048653B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910149926.XA CN111618432B (zh) 2019-02-28 2019-02-28 一种激光焊接方法和激光焊接系统
CN201910149926.X 2019-02-28

Publications (2)

Publication Number Publication Date
JP2020138238A JP2020138238A (ja) 2020-09-03
JP7048653B2 true JP7048653B2 (ja) 2022-04-05

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JP2020033024A Active JP7048653B2 (ja) 2019-02-28 2020-02-28 レーザ溶接方法およびレーザ溶接システム

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JP (1) JP7048653B2 (zh)
KR (1) KR102334747B1 (zh)
CN (1) CN111618432B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112692433A (zh) * 2020-12-17 2021-04-23 乐歌人体工学科技股份有限公司 一种激光焊接方法及装置
CN114713925B (zh) * 2022-02-16 2024-05-14 深圳市鹏汇激光科技有限公司 激光焊锡控制方法、装置、系统及计算机可读存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005138126A (ja) 2003-11-05 2005-06-02 Mitsubishi Heavy Ind Ltd 溶接システム
JP2009248155A (ja) 2008-04-08 2009-10-29 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
JP2010240689A (ja) 2009-04-06 2010-10-28 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
JP2015015333A (ja) 2013-07-04 2015-01-22 株式会社アマダミヤチ レーザ装置及びレーザ出力補正方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3806829A (en) * 1971-04-13 1974-04-23 Sys Inc Pulsed laser system having improved energy control with improved power supply laser emission energy sensor and adjustable repetition rate control features
CH599827A5 (zh) * 1975-10-02 1978-05-31 Lasag Ag
JPH07273387A (ja) * 1994-03-31 1995-10-20 Fanuc Ltd 出力波形制御方式
DE19636429C1 (de) * 1996-09-07 1997-11-20 Jenoptik Jena Gmbh Verfahren zur Herstellung einer Schwächelinie mittels Laser
CN103934571B (zh) * 2014-04-11 2016-03-23 上海交通大学 厚板机器人焊接系统及多层多道焊缝实时跟踪、规划方法
CN107959223A (zh) * 2017-12-13 2018-04-24 深圳市创鑫激光股份有限公司 一种激光控制方法、激光设备及存储介质

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005138126A (ja) 2003-11-05 2005-06-02 Mitsubishi Heavy Ind Ltd 溶接システム
JP2009248155A (ja) 2008-04-08 2009-10-29 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
JP2010240689A (ja) 2009-04-06 2010-10-28 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
JP2015015333A (ja) 2013-07-04 2015-01-22 株式会社アマダミヤチ レーザ装置及びレーザ出力補正方法

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Publication number Publication date
KR102334747B1 (ko) 2021-12-03
CN111618432B (zh) 2021-08-17
KR20200105624A (ko) 2020-09-08
CN111618432A (zh) 2020-09-04
JP2020138238A (ja) 2020-09-03

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