JP7047864B2 - Modeling equipment and modeling method - Google Patents

Description

The present invention relates to a modeling device and a modeling method, and more particularly to a modeling device and a modeling method for forming a three-dimensional modeled object on an object surface. The modeling apparatus and modeling method according to the present invention can be suitably used for forming a three-dimensional model by rapid prototyping (sometimes referred to as 3D printing, addition manufacturing, or direct digital manufacturing).

The technique of directly generating a 3D (three-dimensional) shape from CAD data is called rapid prototyping (sometimes called 3D printing, additive manufacturing, or direct digital manufacturing, but hereinafter, rapid prototyping is used as a general term). This has contributed to the production of prototypes mainly for the purpose of confirming the shape in an extremely short lead time. The modeling equipment that forms a three-dimensional model by rapid prototyping such as a 3D printer can be roughly classified into those that handle resins and those that handle metals. The metal three-dimensional model manufactured by rapid prototyping is used exclusively as an actual part, unlike the case of resin. That is, it functions as a part of an actual mechanical structure (whether it is a mass-produced product or a prototype), not as a prototype part for shape confirmation. Two types of existing metal 3D printers (hereinafter abbreviated as M3DP (Metal 3D Printer)) are well known: PBF (Powder Bed Fusion) and DED (Directed Energy Deposition).

In PBF, sintered metal powder is thinly laminated on a bed on which a work piece is mounted, and a high-energy laser beam is scanned therein with a galvano mirror or the like to melt and solidify the portion hit by the beam. When the drawing for one layer is completed, the bed is lowered by the thickness of one layer, the sintered metal powder is spread over it again, and the same is repeated. In this way, modeling is repeated layer by layer to obtain a desired three-dimensional shape.

Due to its modeling principle, PBF is essentially (1) inadequate manufacturing accuracy of parts, (2) poor finished surface roughness, (3) slow processing speed, and (4) sintering. There are some problems such as the troublesome and troublesome handling of metal powder.

In DED, a method of adhering a melted metal material to a processing target is adopted. For example, powdered metal is ejected near the focal point of a laser beam focused by a condenser lens. Then, the powdered metal is melted by irradiation with a laser and becomes a liquid. If there is an object to be machined near its focal point, the liquefied metal adheres to the object to be machined, cooled and solidified again. This focal point becomes, so to speak, a pen tip, and "thick lines" can be drawn one after another on the surface of the object to be processed. A desired shape is formed by appropriately moving one of the processing target and the processing head (laser, powder injection nozzle, etc.) with respect to the other based on CAD data (see, for example, Patent Document 1).

As can be seen from this, in DED, since the powder material is sprayed from the processing head in a required amount as needed, there is no waste and there is no need to process in a large amount of surplus powder.

As described above, DED has been improved in handling powder metal as a raw material as compared with PBF, but there are many points to be improved.

Against this background, it is strongly desired to improve the convenience of the modeling device that forms a three-dimensional model as a machine tool, and in the end, to improve the economic rationality of manufacturing.

U.S. Patent Application Publication No. 2003/2068620

According to the first aspect of the present invention, it is a modeling device for forming a three -dimensional model, a moving system for moving a target surface, a measurement system for acquiring position information of the target surface, and a beam. A beam modeling system having a beam irradiation unit for emitting and a material processing unit for supplying a modeling material, and the modeling material being used as the material while relatively moving the target surface and the beam from the beam irradiation unit. A control device for controlling the moving system and the beam modeling system is provided so that the target portion on the target surface is shaped by supplying from the processing unit, and the measurement system is the target. Before the modeling to the target portion on the surface is started, the position information of the target surface is acquired, and after the control device acquires the position information of the target surface, the target surface is based on the position information. A modeling device is provided that initiates modeling to the above target site .

Here, the target surface is a surface on which a target portion for modeling is set.

This makes it possible to form a three-dimensional model with good processing accuracy.

According to the second aspect of the present invention, it is a modeling method for forming a three -dimensional modeled object, and the modeling material is supplied while relatively moving the target surface and the beam on the target surface. The movement of the target surface, the irradiation of the beam, and the supply of the modeling material are controlled so that the target portion of the target surface is shaped, and the target portion on the target surface is shaped. Is a modeling method that acquires the position information of the target surface, acquires the position information of the target surface, and then starts modeling the target portion on the target surface based on the position information. , Provided.

This makes it possible to form a three-dimensional model with good processing accuracy.

It is a block diagram which shows the whole structure of the modeling apparatus which concerns on one Embodiment. It is a figure which shows the structure of the mobile system together with the measurement system. It is a perspective view which shows the moving system which mounted the work. It is a figure which shows the beam modeling system together with the table on which the work is mounted. It is a figure which shows an example of the structure of the light source system which constitutes a part of the beam irradiation part which a beam modeling system has. It is a figure which shows the state which the parallel beam from a light source system is irradiated to a mirror array, and the angle of incidence of the reflected beam from each of a plurality of mirror elements with respect to a condensing optical system is controlled individually. The material processing unit of the beam modeling system is shown together with the condensing optical system. It is a figure which shows the plurality of supply ports formed in the nozzle of a material handling section, and the opening / closing member which opens and closes each of the plurality of supply ports. 9 (A) is an enlarged view of the inside of the circle A of FIG. 4, and FIG. 9 (B) is a diagram showing the relationship between the one-character region shown in FIG. 9 (A) and the scanning direction. It is a figure which shows an example of the irradiation area of the beam formed on the modeling surface. It is a block diagram which shows the input / output relation of the control device which mainly constitutes the control system of a modeling device. It is a figure which shows the arrangement of the measuring apparatus on a table. It is a figure which shows the constituent part arranged in the table which constitutes the measuring apparatus together with the measuring member. FIG. 14 (A) is a diagram showing an optical arrangement when measuring the intensity distribution of the beam on the rear focal plane of the condensing optical system, and FIG. 14 (B) is a diagram showing the optical arrangement when measuring the intensity distribution of the beam on the pupil surface. It is a figure which shows the optical arrangement of. It is a flowchart corresponding to a series of processing algorithms of a control device. 16 (A) and 16 (B) are diagrams for explaining one effect of the modeling apparatus according to the embodiment in comparison with the prior art. It is a figure which shows an example of the measuring apparatus for measuring the intensity distribution of a beam on a modeling surface. 18 (A) and 18 (B) are diagrams for explaining an example in which the thickness of the coating layer is increased by slightly increasing the width of the single character region.

Hereinafter, one embodiment will be described with reference to FIGS. 1 to 18 (B). FIG. 1 shows a block diagram of the entire configuration of the modeling apparatus 100 according to the embodiment.

The modeling device 100 is a DED type M3DP. The modeling apparatus 100 can also be used to form a three-dimensional model on the table 12, which will be described later, by rapid prototyping, but the work (for example, an existing part) is subjected to additional processing by three-dimensional modeling. It can also be used for. In this embodiment, the latter case of performing additional processing on the work will be mainly described. At the actual manufacturing site, it is common to repeat processing for parts produced by different manufacturing methods, different materials, or different machine tools to make the desired parts, and add them by three-dimensional modeling. The requirements for processing are potentially the same.

The modeling device 100 includes four systems of a mobile system 200, a transport system 300, a measurement system 400, and a beam modeling system 500, and a control device 600 including these systems that controls the entire modeling device 100. Of these, the transport system 300, the measurement system 400, and the beam modeling system 500 are arranged apart from each other in a predetermined direction. In the following description, for convenience, it is assumed that the transport system 300, the measurement system 400, and the beam modeling system 500 are arranged apart from each other in the X-axis direction (see FIG. 2) described later.

FIG. 2 schematically shows the configuration of the mobile system 200 together with the measurement system 400. Further, FIG. 3 shows a mobile system 200 on which the work W is mounted in a perspective view. In the following, the left-right direction in the paper surface in FIG. 2 is the Y-axis direction, the direction orthogonal to the paper surface is the X-axis direction, the direction orthogonal to the X-axis and the Y-axis is the Z-axis direction, and the X-axis, the Y-axis, and the Z-axis are rotated. The rotation (tilt) direction of the above will be described as the θx, θy, and θz directions, respectively.

The moving system 200 changes the position and posture of the target surface of modeling (here, the surface on which the target portion TA on the work W is set) TAS (see, for example, FIGS. 4 and 9 (A)). Specifically, by driving a work having a target surface and a table on which the work is mounted in six degrees of freedom directions (X-axis, Y-axis, Z-axis, θx, θy, and θz directions), Change the position of the target surface in the direction of 6 degrees of freedom. In the present specification, with respect to a table, a work, a target surface, etc., the positions in the three degrees of freedom direction in the θx, θy, and θz directions are appropriately collectively referred to as “posture”, and the remaining three degrees of freedom direction (X) corresponding to this. Positions in the axis, Y-axis, and Z-axis directions) are collectively referred to as "positions" as appropriate.

The mobile system 200 includes a stewart platform type six-DOF parallel link mechanism as an example of a drive mechanism that changes the position and orientation of the table. The mobile system 200 is not limited to one that can drive the table in the direction of six degrees of freedom.

As shown in FIG. 2, the mobile system 200 (excluding the stator of the planar motor described later) is arranged on the base BS installed on the floor F so that its upper surface is substantially parallel to the XY plane. Has been done. As shown in FIG. 3, the mobile system 200 includes a plan-view regular hexagonal slider 10 constituting a base platform, a table 12 constituting an end effector, and six expansion / contraction systems connecting the slider 10 and the table 12. Possible rods (links) 14 ₁ to 14 ₆ and expansion and contraction mechanisms 16 ₁ to _{16 6 provided} on the rods 14 ₁ to 146, respectively, to expand and contract the rods (not shown in FIG. 3, see FIG. 11). Have. The moving system 200 has a structure in which the movement of the table 12 can be controlled with 6 degrees of freedom in a three-dimensional space by independently adjusting the lengths of the rods 14 ₁ to 14 ₆ by the expansion / contraction mechanisms 16 ₁ to 16 ₆ . ing. Since the mobile system 200 is provided with a Stewart platform type 6-DOF parallel link mechanism as the drive mechanism of the table 12, it has features such as high accuracy, high rigidity, large bearing capacity, and easy inverse kinematics calculation. ..

In the modeling apparatus 100 according to the present embodiment, in order to form a modeled object having a desired shape for the work at the time of addition processing to the work, the beam modeling system 500 is more specifically described later. The position and orientation of the work (table 12) are controlled with respect to the beam from the irradiation unit. In principle, on the contrary, the beam from the beam irradiation unit may be more movable, or both the beam and the work (table) may be movable. As will be described later, since the beam modeling system 500 has a complicated configuration, it is easier to move the work.

Here, the table 12 is made of a plate member having a shape as if each apex of an equilateral triangle is cut off. The work W to be added is mounted on the upper surface of the table 12. The table 12 is provided with a chuck mechanism 13 (not shown in FIG. 3, see FIG. 11) for fixing the work W. As the chuck mechanism 13, for example, a mechanical chuck, a vacuum chuck, or the like is used. Further, the table 12 is provided with a measuring device 110 (see FIGS. 12 and 13) including a measuring member 92 having a circular shape in a plan view shown in FIG. The measuring device 110 will be described in detail later. The table 12 is not limited to the shape shown in FIG. 3, and may have any shape such as a rectangular plate shape or a disk shape.

In this case, as is clear from FIG. 3, both ends of the rods _{14 1} to 146 are connected to the slider 10 and the table 12 via a universal joint 18, respectively. Further, the rods 14 ₁ and 142 are connected in the vicinity of _one vertex position of the triangle of the table 12, and the slider ₁₀ and these rods 14 ₁ and 142 form a substantially triangle. There is. Similarly, rods 14 ₃ , _{144, and rods 14 5 ,} 146 are connected in the vicinity of each of the remaining vertex positions of the triangle _on the table 12, respectively, and the slider 10, rods 14 ₃ , ₁₄₄ , and rod 14 are connected. The layout is such that a rough triangle is formed by ₅ , ₁₄₆ , respectively.

Each of these rods _{14 1} to 146 has a first shaft member 20 and a second shaft member 22 that can move relative to each other in the axial direction, as typically shown for the rod 14 ₁ in FIG. One end (lower end) of the first shaft member 20 is attached to the slider 10 via a universal joint 18, and the other end (upper end) of the second shaft member 22 has a universal joint attached to the table 12. It is attached via.

A stepped columnar hollow portion is formed inside the first shaft member 20, and a bellows type air cylinder, for example, is housed in the lower end side of the hollow portion. A pneumatic circuit and a pneumatic source (both not shown) are connected to this air cylinder. Then, by controlling the air pressure of the compressed air supplied from the air pressure source via the pneumatic circuit, the internal pressure of the air cylinder is controlled so that the piston of the air cylinder is reciprocated in the axial direction. It has become. In an air cylinder, the return process utilizes the gravity acting on the piston when incorporated into the parallel linkage.

Further, on the upper end side of the hollow portion of the first shaft member 20, an armature unit (not shown) composed of a plurality of armature coils arranged side by side in the axial direction is arranged.

On the other hand, one end (lower end) of the second shaft member 22 is inserted into the hollow portion of the first shaft member 20. A small diameter portion having a smaller diameter than the other portions is formed at one end of the second shaft member 22, and a circular tubular mover yoke made of a magnetic member is provided around the small diameter portion. Has been done. A hollow columnar, that is, a cylindrical magnet body composed of a plurality of permanent magnets having the same dimensions is provided on the outer peripheral portion of the mover yoke. In this case, the movable element yoke and the magnet body constitute a hollow cylindrical magnet unit. In the present embodiment, the armature unit and the magnet unit constitute a shaft motor, which is a kind of electromagnetic force linear motor. In the shaft motor configured in this way, by supplying a sinusoidal drive current having a predetermined period and a predetermined amplitude to each coil of the armature unit which is a stator, between the magnetic pole unit and the armature unit. The second shaft member 22 is driven relative to the first shaft member 20 in the axial direction by the Lorentz force (driving force) generated by the electromagnetic interaction, which is a kind of electromagnetic interaction.

That is, in the present embodiment, the above-mentioned air cylinder and the shaft motor drive the first shaft member 20 and the second shaft member 22 relative to each other in the axial direction to expand and contract each of the rods _{14 1} to 146. The expansion and contraction mechanisms 16 ₁ to 16 ₆ (see FIG. 11) described above are respectively configured.

Further, the magnet unit, which is a mover of the shaft motor, is non-contactly supported by the armature unit, which is a stator, via an air pad provided on the inner peripheral surface of the first shaft member 20.

Although not shown in FIG. 3, each of the rods _{14 1} to 146 is an absolute type linear encoder that detects the axial position of the second shaft member 22 with respect to the first shaft member 20. Encoders 24 ₁ to 24 ₆ are provided, and the outputs of these linear encoders 24 ₁ to ₂₄₆ are supplied to the control device 600 (see FIG. 11). The axial position of the second shaft member 22 detected by the linear encoders 24 ₁ to ₂₄₆ corresponds to the length of each of the rods _{14 1} to 146.

The expansion / contraction mechanisms 16 ₁ to ₁₆₆ are controlled by the control device ₆₀₀ based on the outputs of the linear encoders 24 ₁ to 246 (see FIG. 11). Details of the configuration of the parallel linkage mechanism similar to the mobile system 200 of the present embodiment are disclosed in, for example, US Pat. No. 6,940,582, and the control device 600 is disclosed in the above-mentioned US patent specification. The position and posture of the table 12 are controlled via the expansion / contraction mechanisms 16 ₁ to 16 ₆ by the same method as in the case of using inverse kinematics calculation.

In the mobile system 200, the expansion / contraction mechanisms 16 ₁ to 166 provided _on the rods _{14 1} to 146 respectively have an air cylinder arranged in series (or parallel) with each other and a shaft motor which is a kind of electromagnetic force linear motor. Therefore, in the control device 600, the table 12 can be roughly and greatly driven by the pneumatic control of the air cylinder, and can be finely and finely moved by the shaft motor. As a result, it becomes possible to accurately control the position (that is, the position and the posture) of the table 12 in the six degrees of freedom direction in a short time.

Further, since each of the rods _{14 1} to 146 has an air pad that non-contactly supports the magnet unit which is the mover of the shaft motor with respect to the armature unit which is the stator, the rod by the expansion / contraction mechanism can be used. Friction, which is a non-linear component when controlling expansion and contraction, can be avoided, whereby the position and posture of the table 12 can be controlled with higher accuracy.

Further, in the present embodiment, a shaft motor is used as the electromagnetic force linear motor constituting the expansion / contraction mechanisms _{16 1} to 166, and the shaft motor uses a magnet unit in which a cylindrical magnet is used on the mover side. Therefore, a magnetic flux (magnetic field) is generated in all directions of the magnet's radiation direction, and the magnetic flux in all directions can contribute to the generation of Lorentz force (driving force) due to electromagnetic interaction. It can generate a clearly larger thrust than a motor or the like, and is easier to miniaturize than a hydraulic cylinder or the like.

Therefore, according to the moving system 200 in which each rod includes a shaft motor, it is possible to simultaneously realize miniaturization and weight reduction and improvement of output, and it can be suitably applied to the modeling apparatus 100.

Further, in the control device 600, low-frequency vibration can be suppressed by controlling the pneumatic pressure of the air cylinders constituting the expansion / contraction mechanism, and high-frequency vibration can be insulated by controlling the current for the shaft motor.

The mobile system 200 further includes a planar motor 26 (see FIG. 11). A mover of a flat motor 26 made of a magnet unit (or a coil unit) is provided on the bottom surface of the slider 10, and a flat surface made of a coil unit (or a magnet unit) is provided inside the base BS correspondingly. The stator of the motor 26 is housed. A plurality of air bearings (pneumatic pressure bearings) are provided on the bottom surface of the slider 10 so as to surround the mover, and the slider 10 is finished with a high flatness by the plurality of air bearings on the upper surface (guide surface) of the base BS. It is buoyantly supported on top through a predetermined clearance (gap or gap). The slider 10 is driven in the XY plane in a non-contact manner with respect to the upper surface of the base BS by the electromagnetic force (Lorentz force) generated by the electromagnetic interaction between the stator and the mover of the plane motor 26. In the present embodiment, as shown in FIG. 1, the mobile system 200 can freely move the table 12 between the arrangement positions of the measurement system 400, the beam modeling system 500, and the transfer system 300. The mobile system 200 may include a plurality of tables 12 on which the work W is mounted. For example, while machining a work held in one of a plurality of tables using the beam modeling system 500, measurement using the measurement system 400 for a work held in another table. May be done. Even in such a case, each table can be freely moved between the arrangement positions of the measurement system 400, the beam modeling system 500, and the transfer system 300. Alternatively, a table for holding the work when measuring using the measurement system 400 exclusively and a table for holding the work when processing using the beam modeling system 500 are provided, and the work is carried in and carried into the two tables. When a configuration is adopted in which the carry-out can be carried out by a work transfer system or the like, each slider 10 may be fixed on the base BS. Even when a plurality of tables 12 are provided, each table 12 is movable in the direction of 6 degrees of freedom, and its position in the direction of 6 degrees of freedom can be controlled.

The flat motor 26 is not limited to the air levitation type, and a magnetic levitation type flat motor may be used. In the latter case, it is not necessary to provide the slider 10 with an air bearing. Further, as the flat motor 26, either a moving magnet type or a moving coil type can be used.

In the control device 600, the slider 10 can be freely moved in the X and Y two-dimensional directions on the base BS by controlling at least one of the magnitude and the direction of the current supplied to each coil of the coil unit constituting the planar motor 26. Can be driven.

In the present embodiment, the moving system 200 includes a position measuring system 28 (see FIG. 11) that measures position information regarding the X-axis direction and the Y-axis direction of the slider 10. As the position measurement system 28, a two-dimensional absolute encoder can be used. Specifically, a two-dimensional scale having a strip-shaped absolute cord having a predetermined width over the entire length in the X-axis direction is provided on the upper surface of the base BS, and correspondingly, a light source such as a light emitting element is provided on the bottom surface of the slider 10. The one-dimensional light-receiving element array arranged in the X-axis direction and the one-dimensional light-receiving element array arranged in the Y-axis direction receive the reflected light from the two-dimensional scale illuminated by the light beam emitted from the light source. An X head and a Y head are provided. As a two-dimensional scale, for example, on a non-reflective substrate (reflectivity 0%), a plurality of square reflecting portions (with a constant period along two directions (X-axis direction and Y-axis direction) orthogonal to each other (reflective part). Marks) are arranged two-dimensionally, and the reflection characteristics (reflectivity) of the reflecting portion have gradations according to a predetermined rule. As the two-dimensional absolute encoder, for example, the same configuration as the two-dimensional absolute encoder disclosed in US Patent Application Publication No. 2014/0070073 may be adopted. According to the absolute type two-dimensional encoder having the same configuration as that of the US Patent Application Publication No. 2014/0070073, it is possible to measure the two-dimensional position information with the same high accuracy as the conventional incremental encoder. Since it is an absolute encoder, it does not require origin detection unlike an incremental encoder. The measurement information of the position measurement system 28 is sent to the control device 600.

In the present embodiment, as will be described later, the measurement system 400 provides position information in at least a part of the target surface (for example, the upper surface) on the work W mounted on the table 12 in the three-dimensional space (shape in the present embodiment). Information) is measured, and after the measurement, additional processing (modeling) is performed on the work W. Therefore, when the control device 600 measures at least a part of the shape information of the target surface on the work W, the measurement result and the _linear encoders ₂₄₁ to the rods ₁₄₁ to 146 at the time of the measurement are measured. By associating the measurement result of 246 with the measurement result of the position measurement system 28, the position and orientation of the target surface on the work W mounted on the table ₁₂ can be set to the reference coordinate system of the modeling device 100 (hereinafter referred to as a table). It can be associated with a coordinate system). As a result, after that, the target value of the target surface TAS on the work W is controlled by controlling the open loop of the position in the ₆ degrees of freedom direction of the table 12 based on the measurement results of the _linear encoders 241 to 246 and the position measurement system 28. It is possible to control the position with respect to the direction of 6 degrees of freedom. In the present embodiment, since the absolute type encoder is used as the _linear encoders 241 to ₂₄₆ and the position measurement system 28, it is not necessary to set the origin, so that resetting is easy. It should be measured by the measurement system 400 used to enable position control in the 6-DOF direction with respect to the target value of the target surface on the work W by controlling the open loop of the position in the 6-DOF direction of the table 12. The above-mentioned position information in the three-dimensional space is not limited to the shape, and any three-dimensional position information of at least three points according to the shape of the target surface is sufficient.

In the present embodiment, the case where the flat motor 26 is used as the driving device for driving the slider 10 in the XY plane has been described, but a linear motor may be used instead of the flat motor 26. In this case, instead of the above-mentioned two-dimensional absolute encoder, a position measurement system for measuring the position information of the slider 10 may be configured by an absolute type linear encoder. Further, the position measurement system for measuring the position information of the slider 10 is not limited to the encoder, and may be configured by using an interferometer system.

Further, in the present embodiment, the mechanism for driving the table is configured by using a plane motor for driving the slider in the XY plane and a stewart platform type 6-DOF parallel link mechanism in which the base platform is configured by the slider. Although the case has been illustrated, the present invention is not limited to this, and a mechanism for driving the table may be configured by using another type of parallel link mechanism or a mechanism other than the parallel link mechanism. For example, a slider that moves in the XY plane and a Z tilt drive mechanism that drives the table 12 on the slider in the Z-axis direction and the tilt direction with respect to the XY plane may be adopted. As an example of such a Z tilt drive mechanism, the table 12 can be supported from below at each vertex position of a triangle via, for example, a universal joint or other joint, and the support points can be driven independently of each other in the Z-axis direction 3. A mechanism having two actuators (such as a voice coil motor) can be mentioned. However, the configuration of the mechanism for driving the table of the moving system 200 is not limited to these, and the table (movable member) on which the work is placed is placed in the three-degree-of-freedom direction in the XY plane and the Z-axis direction. In addition, the configuration may be such that it can be driven in at least five degrees of freedom in the tilt direction with respect to the XY plane, and it is not necessary to have a slider that moves in the XY plane. For example, a mobile system may be configured by a table and a robot that drives the table. Regardless of the configuration, if the measurement system for measuring the position of the table is configured by using a combination of an absolute type linear encoder or a combination of the linear encoder and an absolute type rotary encoder, resetting is facilitated. be able to.

In addition, instead of the mobile system 200, a system capable of driving the table 12 in three degrees of freedom direction in the XY plane, the Z axis direction, and at least five degrees of freedom direction (θx or θy) with respect to the XY plane is provided. You may adopt it. In this case, the table 12 itself may be floated and supported (non-contact support) on the upper surface of a support member such as a base BS via a predetermined clearance (gap or gap) by air levitation or magnetic levitation. When such a configuration is adopted, the table moves in a non-contact manner with respect to the member supporting the table, which is extremely advantageous in terms of positioning accuracy and greatly contributes to the improvement of modeling accuracy.

The measurement system 400 measures the three-dimensional position information of the work for associating the position and orientation of the work mounted on the table 12 with the table coordinate system, for example, the shape. As shown in FIG. 2, the measurement system 400 includes a laser non-contact three-dimensional measuring device 401. The three-dimensional measuring instrument 401 is provided at the frame 30 installed on the base BS, the head portion 32 mounted on the frame 30, the Z-axis guide 34 mounted on the head portion 32, and the lower end of the Z-axis guide 34. The rotation mechanism 36 is provided, and a sensor unit 38 connected to the lower end of the rotation mechanism 36 is provided.

The frame 30 includes a horizontal member 40 extending in the Y-axis direction and a pair of pillar members 42 that support the horizontal member 40 from below at both ends in the Y-axis direction.

The head portion 32 is attached to the horizontal member 40 of the frame 30.

The Z-axis guide 34 is movably mounted on the head portion 32 in the Z-axis direction, and is driven in the Z-axis direction by a Z drive mechanism 44 (not shown in FIG. 2, see FIG. 11). The position (or displacement from the reference position) of the Z-axis guide 34 in the Z-axis direction is measured by the Z encoder 46 (not shown in FIG. 2, see FIG. 11).

The rotation mechanism 36 rotates the sensor unit 38 parallel to the Z axis within a predetermined angle range (for example, a range of 90 degrees (π / 2) or 180 degrees (π)) with respect to the head unit 32 (Z axis guide 34). It is continuously (or stepped at a predetermined angle) rotationally driven around the central axis. In the present embodiment, the rotation center axis of the sensor unit 38 by the rotation mechanism 36 coincides with the center axis of the line light emitted from the irradiation unit described later constituting the sensor unit 38. The rotation angle (or the position of the sensor unit in the θz direction) of the sensor unit 38 from the reference position by the rotation mechanism 36 is measured by a rotation angle sensor 48 (not shown in FIG. 2, see FIG. 11) such as a rotary encoder. To.

The sensor unit 38 includes an irradiation unit 50 that irradiates a test object (work W in FIG. 2) placed on the table 12 with line light for light cutting, and an irradiation unit 50 that irradiates the line light to cut light. It is mainly composed of a detection unit 52 that detects the surface of the subject on which a surface (line) appears. Further, the sensor unit 38 is connected to an arithmetic processing unit 54 that obtains the shape of the test object based on the image data detected by the detection unit 52. In the present embodiment, the arithmetic processing unit 54 is included in the control device 600 for comprehensively controlling each component of the modeling device 100 (see FIG. 11).

The irradiation unit 50 is composed of a cylindrical lens (not shown), a slit plate having a thin band-shaped notch, or the like, and receives illumination light from a light source to generate fan-shaped line light 50a. As the light source, an LED, a laser light source, an SLD (super luminescent diode) or the like can be used. When an LED is used, a light source can be formed inexpensively. In addition, when a laser light source is used, since it is a point light source, it is possible to produce line light with little aberration, it has excellent wavelength stability, the half width is small, and a filter with a small half width can be used to cut stray light, so it is affected by disturbance. Can be reduced. Further, when SLD is used, in addition to the characteristics of the laser light source, the coherence is lower than that of the laser beam, so that the generation of speckle on the surface of the subject can be suppressed. The detection unit 52 is for capturing the line light 50a projected on the surface of the object (work W) from a direction different from the light irradiation direction of the irradiation unit 50. Further, the detection unit 52 is composed of an imaging lens, a CCD, or the like (not shown), and as will be described later, the table 12 is moved to take an image of the subject (work W) every time the line light 50a is scanned at predetermined intervals. It has become like. The positions of the irradiation unit 50 and the detection unit 52 are such that the incident direction of the line light 50a on the surface of the test object (work W) with respect to the detection unit 52 and the light irradiation direction of the irradiation unit 50 have a predetermined angle θ. It is stipulated to be done. In the present embodiment, the predetermined angle θ is set to, for example, 45 degrees.

The image data of the subject (work W) imaged by the detection unit 52 is sent to the arithmetic processing unit 54, where a predetermined image arithmetic processing is performed to increase the height of the surface of the subject (work W). It is calculated and the three-dimensional shape (surface shape) of the test object (work W) can be obtained. In the image of the test object (work W), the arithmetic processing unit 54 is based on the position information of the light cut surface (line) by the line light 50a deformed according to the unevenness of the test object (work W). The height of the surface of the test object (work W) from the reference plane is calculated using the principle of triangulation for each pixel in the longitudinal direction in which the (line) (line light 50a) extends, and the height of the test object (work W) is calculated. Performs arithmetic processing to obtain a three-dimensional shape.

In the present embodiment, the control device 600 moves the table 12 in a direction substantially perpendicular to the longitudinal direction of the line light 50a projected on the object (work W), whereby the line light 50a is transferred to the object (work). The surface of W) is scanned. The control device 600 detects the rotation angle of the sensor unit 38 with the rotation angle sensor 48, and moves the table 12 in a direction substantially perpendicular to the longitudinal direction of the line light 50a based on the detection result. As described above, in the present embodiment, the table 12 is moved when measuring the shape or the like of the object (work W). Therefore, as a premise, the work W is held and below the sensor unit 38 of the measurement system 400. At the time of movement, the position and posture of the table 12 (position in the direction of 6 degrees of freedom) are always set to a predetermined reference state. The reference state is, for example, a state in which all of the rods 141 to ₁₄₆ have _a length (or a minimum length) corresponding to the neutral point of the expansion / contraction stroke range, and at this time, the Z axis, θx, and θy of the table 12 And the positions in each direction of θz (Z, θx, θy, θz) = (Z ₀ , 0, 0, 0). Further, in this reference state, the positions (X, Y) of the table 12 in the XY plane coincide with the X and Y positions of the slider 10 measured by the position measurement system 28.

After that, the above-mentioned measurement for the test object (work W) is started, and the position of the table 12 in the six degrees of freedom direction is managed by the control device 600 on the table coordinate system including during this measurement. That is, the control device 600 controls the planar motor 26 based on the measurement information of the position measurement system 28, and also controls the expansion / contraction mechanisms 16 ₁ to 16 ₆ based on the measured values of the linear encoders 24 ₁ to ₂₄₆ . Controls the position of the table 12 in the direction of six degrees of freedom.

By the way, when the optical cutting method is used as in the three-dimensional measuring machine 401 according to the present embodiment, the line light 50a irradiated from the irradiation unit 50 of the sensor unit 38 to the subject (work W) is referred to the sensor unit 38. It is desirable to arrange the table 12 (work W) in a direction orthogonal to the relative movement direction. For example, in FIG. 2, when the relative movement direction between the sensor unit 38 and the object (work W) is set in the Y-axis direction, it is desirable to arrange the line light 50a along the X-axis direction. By doing so, it is possible to perform relative movement with respect to the subject (work W) that effectively utilizes the entire area of the line light 50a at the time of measurement, and the shape of the subject (work W) can be optimally measured. .. A rotation mechanism 36 is provided so that the direction of the line light 50a and the above-mentioned relative movement direction can always be orthogonal to each other.

The above-mentioned three-dimensional measuring device 401 is configured in the same manner as the shape measuring device disclosed in, for example, US Patent Application Publication No. 2012/01058667. However, in the apparatus described in US Patent Application Publication No. 2012/0105867, scanning of the line light in the direction parallel to the X and Y planes with respect to the subject is performed by moving the sensor unit. The present embodiment differs in that it is performed by moving the table 12. In this embodiment, either the Z-axis guide 34 or the table 12 may be driven when scanning the line light in the direction parallel to the Z-axis with respect to the subject.

In the measurement method using the three-dimensional measuring machine 401 according to the present embodiment, a line-shaped projection pattern consisting of a single line light is projected on the surface of the subject by using the optical cutting method, and the line-shaped projection pattern is produced. Each time the entire surface of the subject is scanned, the line-shaped projection pattern projected on the subject is imaged from an angle different from the projection direction. Then, the height of the surface of the subject from the reference plane is calculated from the captured image of the surface of the subject using the principle of triangulation for each pixel in the longitudinal direction of the linear projection pattern, and the subject is examined. Find the three-dimensional shape of the surface.

In addition, as the three-dimensional measuring instrument constituting the measuring system 400, for example, an apparatus having the same configuration as the optical probe disclosed in US Pat. No. 7,009,717 can be used. The optical probe is composed of two or more optical groups and includes two or more visual field directions and two or more projection directions. One optical group includes one or more visual field directions and one or more projection directions, at least one visual field direction and at least one projection direction differ between the optical groups, and the data obtained by the visual field directions are the same optical group. It is generated only by the pattern projected by the projection direction of.

The measurement system 400 may include a mark detection system 56 (see FIG. 11) that optically detects an alignment mark in place of or in addition to the above-mentioned three-dimensional measuring instrument 401. .. The mark detection system 56 can detect, for example, an alignment mark formed on a work. The control device 600 accurately detects the center positions (three-dimensional coordinates) of at least three alignment marks using the mark detection system 56, thereby calculating the position and posture of the work (or table 12). The mark detection system 56 can be configured to include, for example, a stereo camera. The mark detection system 56 may optically detect at least three alignment marks formed in advance on the table 12.

In the present embodiment, the control device 600 scans the surface (target surface) of the work W by using the three-dimensional measuring device 401 as described above, and acquires the surface shape data thereof. Then, the control device 600 performs the minimum self-centered processing using the surface shape data, and associates the three-dimensional position and the posture of the target surface on the work with the table coordinate system. Here, including the above-mentioned measurement with respect to the test object (work W), the position of the table 12 in the six degrees of freedom direction is controlled by the control device 600 on the table coordinate system, and thus the three-dimensional position of the work. And after the orientation is associated with the table coordinate system, all controls of the position (ie, position and orientation) of the work W in the 6 degrees of freedom direction follow the table coordinate system, including during additional machining by 3D modeling. This can be done by controlling the open loop of table 12.

The measurement system 400 of the present embodiment is used not only for position measurement of a work or the like before the start of additional processing, but also for shape inspection of a part (work) after additional processing, which will be described later.

FIG. 4 shows the beam shaping system 500 together with the table 12 on which the work W is mounted. As shown in FIG. 4, the beam modeling system 500 includes a light source system 510, a beam irradiation unit 520 for emitting a beam, a material processing unit 530 for supplying a powdery modeling material, and a water shower nozzle 540 (FIG. 4). 4 is not shown, and see FIG. 11). The beam modeling system 500 does not have to include the water shower nozzle 540.

As shown in FIG. 5, the light source system 510 includes a light source unit 60, a light guide fiber 62 connected to the light source unit 60, and a double flyeye optical system 64 arranged on the emission side of the light guide fiber 62. It is equipped with a condenser lens system 66.

The light source unit 60 includes a housing 68 and a plurality of laser units 70 housed inside the housing 68 and arranged in a matrix parallel to each other. As the laser unit 70, a unit of a light source such as various lasers that perform pulse oscillation or continuous wave oscillation operation, for example, a carbon dioxide gas laser, an Nd: YAG laser, a fiber laser, or a GaN-based semiconductor laser can be used.

The light guide fiber 62 is a fiber bundle configured by randomly bundling a large number of optical fiber strands, and has a plurality of incident ports 62a individually connected to the emission ends of the plurality of laser units 70 and an incident port 62a. It has an injection section 62b having a number of ejection ports larger than the number of ejection ports. The light guide fiber 62 receives a plurality of laser beams (hereinafter, abbreviated as “beams” as appropriate) emitted from each of the plurality of laser units 70 through the respective incident ports 62a and distributes them to a large number of emission ports. Then, at least a part of each laser beam is emitted from a common ejection port. In this way, the light guide fiber 62 mixes and emits the beams emitted from each of the plurality of laser units 70. As a result, the total output can be increased according to the number of laser units 70 as compared with the case of using a single laser unit. However, if a single laser unit can provide sufficient output, it is not necessary to use multiple laser units.

Here, the injection unit 62b has a cross-sectional shape similar to the overall shape of the incident end of the first fly-eye lens system constituting the incident end of the double fly-eye optical system 64 described below, and emits light into the cross section. The exits are provided in an almost even arrangement. Therefore, the light guide fiber 62 also serves as a shaping optical system that shapes the beam mixed as described above so as to be similar to the overall shape of the incident end of the first flyeye lens system.

The double fly-eye optical system 64 is for making the cross-sectional intensity distribution of the beam (illumination light) uniform, and the first fly is sequentially arranged on the beam path (optical path) of the laser beam behind the light guide fiber 62. It is composed of an eye lens system 72, a lens system 74, and a second fly eye lens system 76. A diaphragm is provided around the second fly-eye lens system 76.

In this case, the incident surface of the first fly-eye lens system 72 and the incident surface of the second fly-eye lens system 76 are optically coupled to each other. Further, an emission-side focal plane of the first fly-eye lens system 72 (where a surface light source described later is formed) and an emission-side focal surface of the second fly-eye lens system 76 (where a surface light source described later is formed) are formed. ), And the pupil plane (entering pupil) PP of the condensing optical system described later are optically coupled to each other. In the present embodiment, the pupil plane (entering pupil) PP of the condensing optical system 82 coincides with the front focal plane (see, for example, FIGS. 4, 6, 7, etc.).

The beam mixed by the light guide fiber 62 is incident on the first flyeye lens system 72 of the double flyeye optical system 64. As a result, a surface light source, that is, a secondary light source composed of a large number of light source images (point light sources) is formed on the focal plane on the emission side of the first flyeye lens system 72. Laser light from each of these multiple point light sources is incident on the second flyeye lens system 76 via the lens system 74. As a result, a surface light source (tertiary light source) in which a large number of minute light source images are uniformly distributed in a region having a predetermined shape is formed on the focal plane on the emission side of the second fly-eye lens system 76.

The condenser lens system 66 emits the laser beam emitted from the tertiary light source as a beam having a uniform illuminance distribution.

By optimizing the area of the incident end of the second fly-eye lens system 76, the focal length of the condenser lens system 66, and the like, the beam emitted from the condenser lens system 66 can be regarded as a parallel beam.

The light source system 510 of the present embodiment includes an illuminance uniforming optical system including a light guide fiber 62, a double flyeye optical system 64, and a condenser lens system 66, and a plurality of lasers are used by using the illuminance uniformizing optical system. The beams emitted from the units 70 are mixed to generate a parallel beam having a uniform cross-sectional illuminance distribution.

The illuminance uniform optical system is not limited to the above-mentioned configuration. An illuminance uniforming optical system may be configured by using a rod integrator, a collimator lens system, or the like.

The light source unit 60 of the light source system 510 is connected to the control device 600 (see FIG. 11), and the control device 600 individually controls the on / off of the plurality of laser units 70 constituting the light source unit 60. As a result, the amount of light (laser output) of the laser beam irradiated from the beam irradiation unit 520 to the work W (upper target surface) is adjusted.

As shown in FIG. 4, the beam irradiation unit 520 includes a light source system 510, a beam cross-sectional intensity conversion optical system 78 and a space sequentially arranged on the optical path of a parallel beam from the light source system 510 (condenser lens system 66). It has a mirror array 80 which is a kind of a light modulator (SLM: Spatial Light Modulator), and a condensing optical system 82 that collects light from the mirror array 80. Here, the spatial light modulator is a general term for elements that spatially modulate the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction.

The beam cross-section intensity conversion optical system 78 converts the intensity distribution of the cross section of the parallel beam from the light source system 510 (condenser lens system 66). In the present embodiment, the beam cross-section intensity conversion optical system 78 converts a parallel beam from the light source system 510 into a donut-shaped (ring band-shaped) parallel beam in which the intensity of the region including the center of the cross section is almost zero. In the present embodiment, the beam cross-section intensity conversion optical system 78 is composed of, for example, a convex conical reflector and a concave conical reflector sequentially arranged on the optical path of the parallel beam from the light source system 510. The convex conical reflector has a conical reflecting surface on the outer peripheral surface on the 510 side of the light source system, and the concave conical reflector is composed of an annular member whose inner diameter is larger than the outer diameter of the convex conical reflector. The inner peripheral surface has a reflecting surface facing the reflecting surface of the convex conical reflecting mirror. In this case, the reflecting surface of the convex conical reflecting mirror and the reflecting surface of the concave conical reflecting mirror are parallel to each other when viewed in an arbitrary cross section passing through the center of the concave conical reflecting mirror. Therefore, the parallel beam from the light source system 510 is radially reflected by the reflecting surface of the convex conical reflecting mirror, and this reflected beam is reflected by the reflecting surface of the concave conical reflecting mirror to be converted into a ring-shaped parallel beam. Will be done.

In the present embodiment, the parallel beam that has passed through the beam cross-section intensity conversion optical system 78 irradiates the work via the mirror array 80 and the condensing optical system 82, as will be described later. Beam cross-section intensity conversion The intensity of the beam incident on the pupil surface (entrance pupil) PP of the condensing optical system 82 from the mirror array 80 by converting the cross-section intensity distribution of the parallel beam from the light source system 510 using the optical system 78. It is possible to change the distribution. Further, by converting the cross-sectional intensity distribution of the parallel beam from the light source system 510 using the beam cross-sectional intensity conversion optical system 78, the condensed optical system 82 emits the beam substantially emitted from the focused optical system 82. It is also possible to change the intensity distribution on the surface.

The beam cross-sectional intensity conversion optical system 78 is not limited to the combination of the convex conical reflector and the concave conical reflector, and the diffractive optical element and the afocal disclosed in, for example, US Patent Application Publication No. 2008/0030852. It may be configured by using a combination of a lens and a conical axicon system. The beam cross-sectional intensity conversion optical system 78 may have various configurations as long as it converts the cross-sectional intensity distribution of the beam. Depending on the configuration of the beam cross-section intensity conversion optical system 78, it is possible to make the intensity of the parallel beam from the light source system 510 in the region including the center of the cross section not almost zero and smaller than the intensity in the region outside the beam cross-section intensity conversion optical system 78. Is.

In the present embodiment, the mirror array 80 includes a base member 80A having a surface (hereinafter, referred to as a reference surface for convenience) forming 45 degrees (π / 4) with respect to the XY plane and the XZ plane, and the base member 80A. For example, M (= P × Q) mirror elements 81 _{p, q} (p = 1 to P, q = 1 to Q) arranged in a matrix of P rows and Q columns on a reference plane, and each mirror element. It has a drive unit 87 (not shown in FIG. 4, see FIG. 11) including M actuators (not shown) that individually drive 81 _{p and q} . The mirror array 80 can substantially form a large reflecting surface parallel to the reference surface by adjusting the inclination of a large number of mirror elements 81 _{p, q} with respect to the reference surface.

Each mirror element 81 p, q of the mirror array 80 is configured to be rotatable around a rotation axis parallel to one diagonal of each mirror element 81 _{p , q} , for example, and determines an inclination angle of the reflection surface with respect to a reference surface. It can be set to any angle within the angle range. The angle of the reflective surface of each mirror element is measured by a sensor that detects the rotation angle of the rotation axis, for example, a rotary encoder 83 _{p, q} (not shown in FIG. 4, see FIG. 11).

The drive unit 87 includes, for example, an electromagnet or a voice coil motor as an actuator, and the individual mirror elements 81 _{p and q} are driven by the actuator and operate with a very high response.

Of the plurality of mirror elements constituting the mirror array 80, each of the mirror elements 81 _{p and q} illuminated by the ring-shaped parallel beam from the light source system 510 is a reflected beam in a direction corresponding to the inclination angle of the reflecting surface thereof. (Parallel beam) is emitted and incident on the condensing optical system 82 (see FIG. 6). In this embodiment, the reason why the mirror array 80 is used and the reason why the annular parallel beam is incident on the mirror array 80 will be described later, but it is not always necessary to make the mirror array 80 incident on the mirror array 80. The cross-sectional shape (cross-sectional intensity distribution) of the parallel beam may be different from that of the annular shape, or the beam cross-sectional intensity conversion optical system 78 may not be provided.

The condensing optical system 82 has a numerical aperture of N.I. A. Is, for example, an optical system having a high NA of 0.5 or more, preferably 0.6 or more, and low aberration. Since the focusing optical system 82 has a large diameter, low aberration, and high NA, a plurality of parallel beams from the mirror array 80 can be focused on the rear focal plane. Although the details will be described later, the beam irradiation unit 520 can collect the beam emitted from the focusing optical system 82, for example, in a spot shape or a slit shape. Further, since the condensing optical system 82 is composed of one or a plurality of large-diameter lenses (in FIG. 4 and the like, one large-diameter lens is typically shown), the area of incident light is increased. This allows the numerical aperture of N.I. A. A larger amount of light energy can be taken in as compared with the case of using a condensing optical system having a small size. Therefore, the beam focused by the condensing optical system 82 according to the present embodiment is extremely sharp and has a high energy density, which is directly linked to the improvement of the processing accuracy of the additional processing by modeling.

In the present embodiment, as will be described later, by moving the table 12 in the scanning direction parallel to the XY plane (Y-axis direction as an example in FIG. 4), the work W having the beam and the target surface TAS for modeling at the upper end. A case of performing modeling (processing) while performing relative scanning in the scanning direction (scanning direction) will be described. At the time of modeling, the table 12 may be moved in at least one direction of the X-axis direction, the Z-axis direction, the θx direction, the θy direction, and the θz direction while the table 12 is moving in the Y-axis direction. Needless to say. Further, as will be described later, the powdery modeling material (metal material) supplied by the material processing unit 530 is melted by the energy of the laser beam. Therefore, as described above, when the total amount of energy taken in by the condensing optical system 82 increases, the energy of the beam emitted from the condensing optical system 82 increases, and the amount of metal that can be dissolved in a unit time increases. If the supply amount of the modeling material and the speed of the table 12 are increased by that amount, the throughput of the modeling process by the beam modeling system 500 is improved.

However, even if the total output of the laser is greatly increased by the method described above, in reality, the scanning operation of the table 12 cannot be made infinitely high speed, so the throughput is sufficient to fully utilize the laser power. Cannot be realized. In order to solve this problem, in the modeling apparatus 100 of the present embodiment, as will be described later, the irradiation region of the slit-shaped beam (hereinafter referred to as a single character region) is referred to as the irradiation region of the slit-shaped beam instead of the irradiation region of the spot-shaped beam (FIG. 9B). (Refer to the reference numeral LS)) is formed on the surface (hereinafter referred to as the modeling surface) MP (for example, see FIGS. 4 and 9 (A)) to which the target surface TAS of modeling should be aligned, and the one-character region LS thereof is formed. It is possible to perform modeling (processing) while relative scanning the work W in a direction perpendicular to the longitudinal direction of the beam to be formed (hereinafter referred to as a single character beam). As a result, it is possible to process a significantly larger area (for example, an area of several times to several tens of times) at once as compared with the case of scanning the work with a spot-shaped beam. As will be described later, in the present embodiment, the above-mentioned modeling surface MP is the rear focal surface of the condensing optical system 82 (see, for example, FIGS. 4 and 9 (A)), but the modeling surface is rearward. It may be a surface near the side focal plane. Further, in the present embodiment, the modeling surface MP is perpendicular to the optical axis AX on the emission side of the condensing optical system 82, but it does not have to be perpendicular to the optical axis AX.

As a method of setting or changing the intensity distribution of the beam on the modeling surface MP (for example, a method of forming a single character region as described above), for example, the incident angles of a plurality of parallel beams incident on the focused optical system 82. A method of controlling the distribution can be adopted. A lens system that focuses parallel light to a single point, such as the focused optical system 82 of the present embodiment, is rearranged at the incident angle of the parallel beam LB (see, for example, FIGS. 4, 6, etc.) in the pupil surface (incident pupil) PP. The light-collecting position on the side focal plane (light-collecting surface) is determined. Here, the incident angle is a. The angle α (0≤α <90 degrees) formed by the parallel beam incident on the pupil surface PP of the condensing optical system 82 with respect to the axis parallel to the optical axis AX of the condensing optical system 82 (0≤α <90 degrees). π / 2)) and b. The pupil plane when a two-dimensional orthogonal coordinate system (X, Y) orthogonal to the optical axis (AX) is set with the point on the optical axis (AX) as the origin. The angle β (0 ≦) of the normal projection of the parallel beam incident on the PP onto the pupil surface PP (XY coordinate plane) with respect to the reference axis (for example, the X axis (X ≧ 0)) on the two-dimensional orthogonal coordinate system (X, Y). It is determined by β <360 degrees (2π)). For example, a beam incident perpendicularly (parallel to the optical axis) to the pupil surface PP of the focusing optical system 82 is placed on the optical axis AX by the focusing optical system 82. A beam slightly inclined with respect to the optical axis AX is focused at a position slightly deviated from the optical axis AX. Using this relationship, a parallel beam from the light source system 510 is reflected and collected. By assigning an appropriate angle distribution to the incident angles (incident directions) of the plurality of parallel beam LBs incident on the pupil surface PP of the condensing optical system 82 when incident on the optical optical system 82, the incident surface MP in the modeling surface MP. The intensity distribution of the beam, eg, at least one of the position, number, size, and shape of the irradiation area on the modeling surface can be arbitrarily changed, and thus, for example, a single character region, a three-row region, a missing single character region, etc. (Fig. 10) can also be easily formed, and it is also easy to form a spot-shaped irradiation region.

Since the condensing optical system 82 of the present embodiment has a configuration in which the pupil surface (entering pupil) PP and the front focal plane coincide with each other, the incident angles of a plurality of parallel beam LBs using the mirror array 80 are used. By changing the above, the focusing positions of the plurality of parallel beam LBs can be accurately and easily controlled, but the pupil surface (entrance pupil) of the focusing optical system 82 and the front focal plane do not match. May be.

Further, if the shape and size of the irradiation region formed on the modeling surface are not variable, a solid mirror having a desired shape is used to generate one parallel beam incident on the pupil surface of the focused optical system 82. It is also possible to change the position of the irradiation area by controlling the angle of incidence.

However, when performing additional processing (modeling) on a work, the region of the target surface on which the target portion of the modeling is set is not always a flat surface. That is, it is not always possible to perform relative scanning of a single character beam. In the vicinity of the contour edge of the work or near the boundary between the solid region and the hollow region, the boundary is slanted, narrowed, or has an R, making it difficult to apply single-character beam relative scanning. Is. For example, with a wide brush, it is difficult to fill such a place, so a narrow brush and a thin pencil are required accordingly, so to speak, in real time and continuously, freely. I want to be able to use a brush and a thin pencil properly. Similarly, in the vicinity of the contour edge of the work or near the boundary between the solid region and the hollow region, the width of the scan direction (relative movement direction) of the irradiation region of the beam can be changed, or the size of the irradiation region ( For example, there is a request to change the length, number, or position (position of the irradiation point of the beam) of a single character beam.

Therefore, in the present embodiment, the mirror array 80 is adopted, and the control device 600 operates each mirror element 81 _{p, q} with a very high response, so that a plurality of mirror elements are incident on the pupil surface PP of the condensing optical system 82. The incident angle of the parallel beam LB of the above is controlled. As a result, the intensity distribution of the beam on the modeling surface MP is set or changed. In this case, the control device 600 is on the modeling surface MP during the relative movement between the beam and the target surface TAS (the surface on which the target portion TA of modeling is set, which is the surface on the work W in this embodiment). It is possible to change the intensity distribution of the beam, for example at least one of the shape, size and number of irradiation areas of the beam. In this case, the control device 600 can continuously or intermittently change the intensity distribution of the beam on the modeling surface MP. For example, it is possible to continuously or intermittently change the width of the one-character region in the relative movement direction during the relative movement of the beam and the target surface TAS. The control device 600 can also change the intensity distribution of the beam on the modeling surface MP according to the relative position between the beam and the target surface TAS. The control device 600 can also change the intensity distribution of the beam on the modeling surface MP according to the required modeling accuracy and throughput.

Further, in the present embodiment, the control device 600 detects the state of each mirror element (here, the tilt angle of the reflecting surface) by using the rotary encoders 83 _{p and q} described above, thereby changing the state of each mirror element. Since the mirror array 80 is monitored in real time, the tilt angle of the reflecting surface of each mirror element of the mirror array 80 can be accurately controlled.

As shown in FIG. 7, the material processing unit 530 includes a nozzle unit 84 having a nozzle member (hereinafter, abbreviated as nozzle) 84a provided below the injection surface of the condensing optical system 82, and the nozzle unit 84. It has a material supply device 86 connected via a pipe 90a, and a plurality of powder cartridges 88A and 88B connected to the material supply device 86 via a pipe, for example, two powder cartridges 88A and 88B. In FIG. 7, the portion below the condensing optical system 82 in FIG. 4 is shown when viewed from the −Y direction.

The nozzle unit 84 extends below the condensing optical system 82 in the X-axis direction and supports a nozzle 84a having at least one supply port for supplying powder of a modeling material and both ends of the nozzle 84a in the longitudinal direction. Each of the upper end portions includes a pair of support members 84b and 84c connected to the housing of the condensing optical system 82. One end (lower end) of the material supply device 86 is connected to one of the support members 84b via the pipe 90a, and a supply path for communicating the pipe 90a and the nozzle 84a is formed inside. In the present embodiment, the nozzle 84a is arranged directly below the optical axis of the condensing optical system 82, and a plurality of supply ports described later are provided on the lower surface (bottom surface). The nozzle 84a does not necessarily have to be arranged on the optical axis of the condensing optical system 82, and may be arranged at a position slightly deviated from the optical axis on one side in the Y-axis direction.

Pipes 90b and 90c as supply paths to the material supply device 86 are connected to the other end (upper end) of the material supply device 86, and powder cartridges 88A and 88B are connected to the material supply device 86 via the pipes 90b and 90c, respectively. It is connected. On the other hand, the powder cartridge 88A contains the powder of the first modeling material (for example, titanium). Further, the powder of the second modeling material (for example, stainless steel) is housed in the other powder cartridge 88B.

In the present embodiment, the modeling device 100 includes two powder cartridges for supplying the two types of modeling materials to the material supply device 86, but the modeling device 100 may have only one powder cartridge.

In the supply of powder from the powder cartridges 88A and 88B to the material supply device 86, each of the powder cartridges 88A and 88B may have a function of forcibly supplying the powder to the material supply device 86, but in the present embodiment. The material supply device 86 is provided with a function of switching between the pipes 90b and 90c and a function of sucking powder from either one of the powder cartridges 88A and 88B using a vacuum. The material supply device 86 is connected to the control device 600 (see FIG. 11). At the time of modeling, the control device 600 switches between the pipes 90b and 90c using the material supply device 86, and the powder of the first modeling material (for example, titanium) from the powder cartridge 88A and the second from the powder cartridge 88B. The powder of the modeling material (for example, stainless steel) is selectively supplied to the material supply device 86, and the powder of either modeling material is supplied from the material supply device 86 to the nozzle 84a via the pipe 90a. By changing the configuration of the material supply device 86, the first modeling material from the powder cartridge 88A and the second modeling material from the powder cartridge 88B are simultaneously supplied to the material supply device 86 when necessary. A mixture of the two modeling materials may be supplied to the nozzle 84a via the pipe 90a. A nozzle that can be connected to the powder cartridge 88A and another nozzle that can be connected to the powder cartridge 88B are provided below the condensing optical system 82, and powder is supplied from either nozzle or both nozzles at the time of modeling. The powder may be supplied from.

Further, the control device 600 can adjust the supply amount of the modeling material supplied from the powder cartridges 88A and 88B to the nozzle 84a via the material supply device 86 per unit time. For example, by adjusting the amount of powder supplied from at least one of the powder cartridges 88A and 88B to the material supply device 86, the supply amount of the modeling material supplied to the nozzle 84a via the material supply device 86 per unit time. Is adjustable. For example, by adjusting the level of the vacuum used for supplying the powder from the powder cartridges 88A and 88B to the material supply device 86, it is possible to adjust the supply amount of the modeling material supplied to the nozzle 84a per unit time. Is. Alternatively, it is also possible to provide a valve for adjusting the amount of powder supplied from the material supply device 86 to the pipe 90a to adjust the supply amount of the modeling material supplied to the nozzle 84a per unit time.

Here, although not shown in FIG. 7, in reality, as shown in FIG. 8, a plurality of, for example, N supply ports 91 _i (i = 1 to N) are actually formed on the lower surface (bottom surface) of the nozzle 84a. ) Are formed at equal intervals in the X-axis direction, and each supply port 91 _i can be individually opened and closed by the opening / closing member 93 _i . In FIG. 8, for convenience of illustration, 12 supply ports 91 _i are shown as an example, and both are shown so that the relationship between the supply port and the opening / closing member can be understood. However, in reality, more than 12 supply ports are formed, and the partition between adjacent supply ports is narrower. However, as long as the supply ports are arranged over substantially the entire length in the longitudinal direction of the nozzle 84a, the number of supply ports may be any number. For example, the supply port may be one slit-shaped opening over substantially the entire length of the nozzle 84a in the longitudinal direction.

The opening / closing member _93i can be slidably driven in the + Y direction and the −Y direction, as is typically shown with an arrow for the _kth opening / closing member _93k in FIG. Open and close. The opening / closing member 93 _i is not limited to the slide drive, and may be configured to be rotatable in the tilt direction about one end portion.

Each opening / closing member _93i is driven and controlled by the control device 600 via an actuator (not shown). The control device 600 supplies a plurality, for example, N, depending on the intensity distribution of the beam on the modeling surface, for example, setting (or changing) the shape, size, arrangement, etc. of the irradiation region of the beam formed on the modeling surface. Each of the openings 91 _i is controlled to open and close by using each opening / closing member 93 _i . As a result, the supply operation of the modeling material by the material processing unit 530 is controlled. In this case, the control device 600 selects at least one of the plurality of supply ports _91i , and only the opening / closing member _93i that closes the selected at least one supply port is open control, for example. -Driven in the Y direction. Therefore, in the present embodiment, the modeling material can be supplied from only a part of a plurality of, for example, N supply ports _91i .

Further, the control device 600 controls at least one of the supply amount control per unit time of the modeling material supplied to the nozzle 84a via the material supply device 86 described above and the opening / closing control using an arbitrary opening / closing member _93i . It is also possible to adjust the supply amount of the modeling material per unit time from the supply port _91i that is opened and closed by the opening / closing member _93i . The control device 600 is set (or changed) from an arbitrary supply port _91i according to the intensity distribution of the beam on the modeling surface, for example, the shape, size, arrangement, etc. of the irradiation region of the beam formed on the modeling surface. Determine the amount of modeling material supplied per unit time. The control device 600 determines the supply amount per unit time from each supply port 91 _i , for example, based on the width of the above-mentioned one character area in the scanning direction.

The opening / closing member 93 _i may be configured so that the opening degree of each supply port 91 _i can be adjusted. In this case, the control device 600 may adjust the opening degree of each supply port by each opening / closing member _93i according to the width of the above-mentioned one character area in the scanning direction, for example.

In addition, at least one supply port for supplying the powder of the modeling material may be movable. For example, one slit-shaped supply port extending in the X-axis direction is formed on the lower surface of the nozzle 84a, and the nozzle 84a is provided in at least one of the X-axis direction and the Y-axis direction with respect to the pair of support members 84b and 84c. The nozzle 84a has a movable configuration, and the control device 600 has a nozzle 84a having a supply port formed on the lower surface according to a change in the intensity distribution of the beam on the modeling surface, that is, a change in the shape, size, and position of the irradiation region of the beam. May be moved. The nozzle 84a may be movable in the Z-axis direction.

Alternatively, the nozzle 84a is movable with respect to the main body portion and at least two movable members having a supply port formed on the bottom surface thereof, for example, movable in at least one of the X-axis direction and the Y-axis direction in the XY plane. At least a part of the movable member may be moved by the control device 600 in response to a change in the intensity distribution of the beam on the modeling surface. Also in this case, at least a part of the movable member may be movable in the Z-axis direction.

Further, the supply port of one of the plurality of supply ports and the other supply port may be relatively movable. Alternatively, for example, the position of the one supply port in the Y-axis direction and the position of the other supply port in the Y-axis direction may be different. Alternatively, the position of the one supply port in the Z-axis direction and the position of the other supply port in the Z-axis direction may be different.

It should be noted that the movement of at least one supply port may be performed not only according to the setting or change of the intensity distribution of the beam, but also may be moved for another purpose.

As described above, the plurality of supply ports 91 _i provided in the nozzle 84a are arranged and adjacent to each other at equal intervals over the entire length of the nozzle 84a in the X-axis direction orthogonal to the optical axis of the condensing optical system 82. There is only a slight gap between the supply ports 91 _i . Therefore, as shown by the black arrow in FIG. 9A, the powdery modeling material PD is transferred from each of the plurality of supply ports _91i of the nozzle 84a to Z parallel to the optical axis AX of the condensing optical system 82. If the light is supplied directly below along the axial direction, the modeling material PD is supplied to the above-mentioned single character region LS (irradiation region of the single character beam) directly below the optical axis AX of the condensing optical system 82. In this case, the modeling material PD can be supplied from the nozzle 84a by utilizing the weight of the modeling material PD or by ejecting with a slight ejection pressure applied. Therefore, there is no need for a complicated mechanism such as a gas flow generation mechanism that guides the supply of the modeling material, such as the case where the modeling material is supplied from an oblique direction with respect to the target surface of the modeling. Further, it is extremely advantageous to be able to supply the modeling material vertically to the work at a close distance as in the present embodiment in order to secure the processing accuracy in the modeling.

The nozzle 84a may be provided with a gas supply port. The gas supplied from the gas supply port may be flowed to guide the supply of the modeling material, or may be flowed with a gas that contributes to another purpose, for example, modeling.

In the present embodiment, since the ring-shaped parallel beam is applied to the mirror array 80, the reflected beam from the mirror array 80 is a partial region near the peripheral edge of the condensing optical system 82 (a partial region having a large NA). The modeling surface MP (book) of the condensing optical system 82 via the region of the peripheral edge away from the optical axis of the terminal lens located at the emission end of the condensing optical system 82, that is, the emission end of the beam irradiating unit 520. In the embodiment, the light is focused on the rear focal plane of the focusing optical system 82 (see FIG. 4). That is, for example, a single character beam is formed only by the light passing through the portion near the peripheral edge of the same focused optical system 82. Therefore, it is possible to form a high-quality beam spot as compared with the case where light passing through different optical systems is focused on the same region to form a beam spot (laser spot). Further, in the present embodiment, it is possible to limit the irradiation of the beam to the nozzle 84a provided at the lower center of the ejection surface (lower end surface) of the condensing optical system 82. Therefore, in the present embodiment, all the reflected beams from the mirror array 80 can be used for spot formation, and the beam is nozzleed at a portion corresponding to the nozzle 84a on the incident surface side of the condensing optical system 82. It is not necessary to provide a light-shielding member or the like for limiting the irradiation of 84a. For this reason, the mirror array 80 is illuminated by a band-shaped parallel beam.

The optical member located at the emission end of the condensing optical system 82 has an optical surface formed at least in a region away from the optical axis of the surface on the emission side, and the modeling surface (rear focal surface) is formed through the optical surface. ) It is only necessary to be able to focus the beam. Therefore, in the region including the optical axis, at least one of the ejection surface and the incident surface of this optical member may be a plane perpendicular to the optical axis of the condensing optical system 82, or the region including the optical axis. A hole may be formed in the. An optical member located at the ejection end of the condensing optical system 82 may be configured by a donut-shaped condensing lens having a hole in the central region including the optical axis.

In order to limit the beam incident on the nozzle 84a from the condensing optical system 82, for example, the limiting member 85 shown by the two-dot chain line in FIG. 7 is placed on the incident surface side (for example, the pupil surface PP) of the condensing optical system 82. It may be provided. The limiting member 85 limits the incident of the beam from the condensing optical system 82 onto the nozzle 84a. As the limiting member 85, a light-shielding member may be used, but a dimming filter or the like may be used. In such a case, the parallel beam incident on the focused optical system 82 may be a parallel beam having a circular cross section or a parallel beam having a ring-shaped cross section. In the latter, since the beam is not applied to the limiting member 85, all the reflected beams from the mirror array 80 can be used for spot formation.

It is not always necessary to completely block the beam incident on the nozzle 84a from the condensing optical system 82, but in order to prevent the beam from the condensing optical system 82 from being incident on the nozzle 84a, the condensing optical system The beam may be emitted only from the peripheral regions (for example, two arc regions) separated on both sides of the optical axis in the Y-axis direction of the emission surface of the end lens of 82.

The water shower nozzle 540 (see FIG. 11) is used during so-called quenching. The water shower nozzle 540 has a supply port for supplying a cooling liquid (cooling water), and injects the cooling liquid onto the object to be cooled. The water shower nozzle 540 is connected to the control device 600 (see FIG. 11). At the time of quenching, the control device 600 controls the light source unit 60 to adjust the thermal energy of the beam from the beam irradiation unit 520 to an appropriate value for quenching. Then, the control device 600 can perform quenching by irradiating the surface of the work with a beam to raise the temperature to a high temperature, and then injecting a coolant to the high temperature portion via the water shower nozzle 540 to quench the work. In this case, it is also possible to perform the quenching process at the same time as the addition processing to the work by the three-dimensional modeling. When the quenching process is performed at the same time as the addition processing, it is desirable to use a metal having good hardenability as a modeling material.

In the present embodiment, during addition processing to the work, the light passes near the peripheral edge of the condensing optical system 82 as shown in FIG. 9 (A), which is an enlarged view of the inside of the circle A of FIGS. 4 and 4. Beams passing through optical paths on the + Y side and −Y side (front and rear of the work W (table 12) in the scanning direction) of the nozzle 84a (shown as beams LB1 ₁ and LB1 ₂ in FIG. 9A for convenience). Is focused directly under the nozzle 84a, and a single character region LS whose longitudinal direction is the X-axis direction (the direction orthogonal to the paper surface in FIG. 9A) is formed on the modeling surface (see FIG. 9B). For the single character beam forming the single character region LS, the powdery modeling material PD passes through the plurality of supply ports 91 _i of the nozzle 84a along the Z axis parallel to the optical axis AX of the condensing optical system 82 (optical axis). Supplied (along the XZ plane containing AX). As a result, a linear molten pool WP extending in the X-axis direction is formed directly below the nozzle 84a. Then, the formation of the molten pool WP is performed while scanning the table 12 in the scanning direction (+ Y direction in FIG. 9A). This makes it possible to form a bead (melted and solidified metal) BE having a predetermined width over the length in the longitudinal direction (X-axis direction) of the single character beam (melting pond WP).

In this case, for example, the width of the single character beam in the X-axis direction, the width in the Y-axis direction, or both are gradually narrowed without reducing the number of parallel beam LBs incident on the condensing optical system 82. When the incident angles of the plurality of parallel beams LB incident on the optical system 82 are adjusted, the light collection density (energy density) of the beams becomes high. Therefore, by increasing the supply amount of powder (modeling material) per unit time and increasing the relative movement speed of the target surface TAS accordingly, the thickness of the formed bead BE layer is kept constant and at the same time. It is possible to maintain a high level of throughput. However, the thickness of the bead BE layer to be formed can be kept constant by using other adjustment methods, not limited to such an adjustment method. For example, the laser output (the amount of energy of the laser beam) of at least one of the plurality of laser units 70 may be adjusted according to the width of the single character beam in the X-axis direction, the width in the Y-axis direction, or both. Alternatively, the number of parallel beam LBs incident on the condensing optical system 82 from the mirror array 80 may be changed. In this case, the throughput is somewhat lower than that of the adjustment method described above, but the adjustment is simple.

The modeling device 100 according to the present embodiment is provided with a measuring device 110 that receives a beam from the condensing optical system 82 and performs measurement processing. For example, the measuring device 110 can receive a beam from the condensing optical system 82 and measure the optical characteristics of the beam. In this embodiment, the measuring device 110 is used to manage the intensity distribution of the beam. In the present embodiment, the measuring device 110 uses the intensity distribution of the beam on the rear focal plane of the condensing optical system 82 (which coincides with the modeling surface MP in the present embodiment) and the pupil surface PP of the condensing optical system 82 (this). The embodiment measures the intensity distribution of the beam at the front focal plane).

As shown in FIG. 12, the measuring device 110 has a measuring member 92 that constitutes a part of the upper surface of the table 12, and the remaining components housed inside the table 12.

In FIG. 13, a component portion which is a part of the measuring device 110 and is arranged inside the table 12 is shown in a perspective view together with the measuring member 92. As shown in FIG. 13, the measuring device 110 includes a measuring member 92, a first optical system 94, an optical system unit 95, and a light receiver 96.

The measuring member 92 is arranged in a circular opening formed on the upper surface of the table 12 so that the upper surface is flush with the rest of the table 12 (same surface). The measuring member 92 has a base material formed of, for example, quartz, which can transmit a beam from the condensing optical system 82, and the surface of the base material also serves as a reflective film by vapor deposition of a metal such as chromium. A light-shielding film is formed, and a circular opening 92a is formed in the central portion of the light-shielding film. Therefore, the upper surface of the measuring member 92 includes the surface of the light-shielding film and the surface of the base material in the opening 92a. The light-shielding film is formed very thinly, and in the following description, it is assumed that the surface of the light-shielding film and the surface of the base material in the opening 92a are located on the same surface. Further, it is not necessary to form a light-shielding film, but by forming a light-shielding film, the effect of suppressing the influence of flare or the like at the time of measurement can be expected.

The first optical system 94 is arranged below the measuring member 92. The beam through the opening 92a of the measuring member 92 is incident on the first optical system 94. In the present embodiment, the first optical system 94 is a collimator optical system, but it does not have to be a collimator optical system.

The optical system unit 95 has a circular rotating plate 101 having a rotating shaft 101a at the center. On the rotating plate 101, an opening 97 and a lens (second optical system) 98 are arranged at predetermined angular intervals about the rotating shaft 101a. By rotating the rotating shaft 101a, that is, rotating the rotating plate 101, either the opening 97 or the lens 98 is selected on the optical path of light through the first optical system 94 (position corresponding to the optical axis AX1). It can be arranged as an optical axis. The rotation of the rotation shaft 101a is performed by the drive device 102 (not shown in FIG. 13, see FIG. 11) under the instruction of the control device 600.

The opening 97 allows parallel light emitted from the first optical system 94 to pass through as it is. The aperture 97 is arranged on the optical path of the beam via the condensing optical system 82, and the light receiver is moved by moving the first optical system 94 or at least one optical element constituting the first optical system 94. In 96, it is possible to measure the intensity distribution of the beam in the pupil surface (incident pupil) PP (corresponding to the front focal plane in this embodiment) of the condensing optical system 82. The measuring device 110 may not be able to measure the intensity distribution of the pupil surface (entering pupil) PP of the condensing optical system 82. In this case, the lens 98 may be fixed.

The lens 98 constitutes a relay optical system together with the first optical system 94, and optically conjugates the upper surface of the measuring member 92 having the opening 92a with the light receiving surface of the light receiving element (described later) of the light receiving device 96.

The light receiver 96 has a light receiving element (hereinafter referred to as “CCD”) 96a made of a two-dimensional CCD or the like, and an electric circuit 96b such as a charge transfer control circuit or the like. Needless to say, a CMOS image sensor may be used as the light receiving element 96a. The light receiving result (light receiving data) of the light receiving device 96 is output to the control device 600 (see FIG. 11). The CCD96a has an area sufficient to receive all of the parallel light incident on the first optical system 94 through the opening 92a, emitted from the first optical system 94, and passing through the opening 97. Further, the light receiving surface of the CCD 96a is optically conjugated to the upper surface of the measuring member 92 (the surface forming the opening 92a) by the relay optical system composed of the first optical system 94 and the lens 98. Further, each pixel of the CCD96a has a size in which a plurality of pixels are included in the irradiation region of the beam converged via the relay optical system described above. One or a plurality of reference pixels are defined in the CCD96a, and the positional relationship between the reference pixels and the reference point of the table 12, for example, the center point is known. Therefore, the control device 600 can know the positional relationship between the beam incident on the CCD 96a and the reference pixel from the output of the receiver 96, and the position information of the beam in the table coordinate system (for example, the focused position information of the beam). ) Can be obtained.

As for the light receiving surface of the CCD 96a, the upper surface (base material surface) of the measuring member 92 coincides with the rear focal surface (modeling surface MP) of the condensing optical system 82, and the opening 97 has the opening 92a and the first optical. When arranged on the optical path of the beam via the system 94, it is conjugated with the pupil surface of the focused optical system 82.

Further, instead of the opening 97, an optical system (optical member) may be arranged on the rotating plate 101 so that the light receiving surface of the CCD 96a and the pupil surface of the condensing optical system 82 may be conjugated. Further, at the time of measurement, the upper surface of the measuring member 92 may be arranged at a position shifted from the rear focal plane of the condensing optical system 82 in the optical axis AX direction.

Further, the optical system unit 95 is not limited to the above-mentioned one. For example, without using the rotating plate 101, for example, the lens 98 is held by a movable member, and the movable member is moved in the direction perpendicular to the optical axis (for example, along the X-axis direction) to insert and remove the lens 98. Is also good.

As is clear from the above description, in the present embodiment, since the measuring device 110 including the measuring member 92 is provided on the table 12 that can be freely moved in the direction of six degrees of freedom, it functions as a light receiving unit of the measuring device 110. The measuring member 92 moves in at least one direction in the Z-axis direction parallel to the optical axis AX on the ejection surface side of the focusing optical system 82, the X-axis perpendicular to the optical axis AX, and the Y-axis direction. The beam from the system 82 can be received.

The intensity distribution of the beam on the rear focal plane of the condensing optical system 82 is measured, for example, as follows.

First, the control device 600 sets the planar motor 26 and the expansion / contraction mechanism _{16 1} to 166 based _on the measured values of the position measuring system 28 and the linear encoders 24 ₁ to 246 based on known target values (design information, etc.). The table 12 is controlled to move the table 12, and the opening 92a of the measuring member 92 is positioned on the optical axis AX of the condensing optical system 82.

Further, the control device 600 rotates the rotating plate 101 via the driving device 102, and arranges the lens 98 on the optical path of the beam through the opening 92a and the first optical system 94. Then, in this state, based on the light receiving data (referred to as LRD1, see FIG. 11) which is the light receiving result of the beam converged on the light receiving surface of the CCD 96a by the lens 98, in the rear focal plane of the focused optical system 82. Measure the intensity distribution of the beam.

In FIG. 14A, the optical arrangement when measuring the beam intensity distribution on the rear focal plane of the condensing optical system 82 is arranged on the optical axis AX1 of the measuring device 110 and the optical axis AX of the condensing optical system 82. It is shown developed along the line (however, the portion upstream of the condensing optical system 82 is not shown). At this time, the reflective surfaces of the mirror elements 81 _{p and q} of the mirror array 80 are designed so that a desired beam intensity distribution (shape, size, arrangement, etc. of the beam irradiation region) can be obtained on the rear focal plane. It is assumed that it is set to the upper angle.

In the optical arrangement shown in FIG. 14A, when the control device 600 oscillates a laser beam from at least one laser unit 70 of the light source unit 60 and a parallel beam is emitted from the light source system 510, the parallel beam is emitted. It is reflected by the plurality of mirror elements 81 _{p and q} of the mirror array 80, respectively, and becomes a plurality of parallel beams to be incident on the condensing optical system 82. The plurality of parallel beams incident on the focusing optical system 82 are focused on the rear focal plane by the focusing optical system 82, and are incident on the opening 92a located at or near the rear focal plane.

The light that has passed through the opening 92a is collected by the relay optical system including the first optical system 94 and the lens 98 on the optically conjugate surface of the measuring member 92, that is, the light receiving surface of the CCD 96a. Therefore, the intensity distribution of the light receiving surface of the CCD96a is the intensity distribution of the beam in the upper surface of the measuring member 92. A beam having the intensity distribution is received by the CCD 96a, and the light receiving data LRD1 obtained by photoelectric conversion is transmitted from the light receiver 96 (electric circuit 96b) to the control device 600 (see FIG. 11).

Therefore, the control device 600 captures the light receiving data LRD1 while stepping the table 12 in the Z-axis direction via the expansion / contraction mechanisms _{16 1} to 166 based _on the measured values of the linear encoders 24 ₁ to 246. Based on the captured light-receiving data LRD1, for example, a position in the Z-axis direction where the area of the irradiation region of the beam formed on the light-receiving surface of the CCD96a is minimized is found. The area of the irradiation region of the beam formed on the light receiving surface of the CCD 96a is minimized because the upper surface of the measuring member 92 coincides with the rear focal plane of the condensing optical system 82 and is the sharpest in the opening 92a. It is when the irradiation area of the beam is formed. Therefore, the control device 600 coincides with the upper surface of the measuring member 92 and the rear focal plane at the Z position of the table 12 where the number of pixels that have received the beam is the smallest, based on the light receiving data LRD1 from the light receiving receiver 96. It can be determined that the Z position is set. In the present embodiment, since the rear focal plane is the modeling surface MP, the control device 600 determines the beam intensity distribution (shape and size of the beam irradiation region) on the modeling surface MP based on the light receiving data LRD1 at the Z position. , Arrangement, etc.) can be obtained. When the intensity distribution of the beam (shape, size, arrangement, etc. of the irradiation region of the beam) on the modeling surface MP is different from the desired state, the control device 600 may be used, for example, at least one of a plurality of mirror elements 81 _{p, q} of the mirror array 80. The angle of the portion is adjusted to adjust the intensity distribution of the beam on the modeling surface MP to a desired state.

Further, from the positional relationship between the beam intensity distribution on the light receiving surface of the CCD96a and one or a plurality of reference pixels in a state where the upper surface of the measuring member 92 and the rear focal plane coincide with each other, the modeling surface MP ( The position of the beam irradiation region on the rear focal plane of the condensing optical system 82 on the table coordinate system can be obtained.

If the Z position of the rear focal plane of the condensing optical system 82 is known and it can be determined that the Z position has not changed, the step movement in the Z-axis direction may not be necessary.

In the present embodiment, the control device 600 measures the intensity distribution of the beam (shape, size, arrangement, etc. of the irradiation region of the beam) on the above-mentioned modeling surface MP, and then the condensing optical system 82 described below. The intensity distribution of the beam in the pupil surface (entering pupil) PP is measured.

The intensity distribution of the beam on the pupil surface (entering pupil) PP (corresponding to the front focal plane in this embodiment) of the condensing optical system 82 is measured, for example, as follows.

After the measurement of the beam intensity distribution (shape, size, arrangement, etc. of the beam irradiation region) on the modeling surface MP described above is completed, in the control device 600, the upper surface of the measuring member 92 (the forming surface of the opening 92a) is focused. The rotary plate 101 is rotated via the drive device 102 while maintaining the position of the table 12 at the position on the optical axis AX of the optical system 82 and at the same height as the modeling surface MP, and the opening 97 is formed. Is arranged on the optical path of the beam through the opening 92a and the first optical system 94. Then, in this state, the intensity distribution of the beam on the pupil surface PP is measured.

FIG. 14B shows the optical arrangement when the intensity distribution of the beam on the pupil surface PP is measured developed along the optical axis AX1 of the measuring device 110 and the optical axis AX of the condensing optical system 82. (However, the portion upstream of the condensing optical system 82 is not shown). As shown in FIG. 14B, in this state, since the opening 97 is arranged on the optical path of the beam, the parallel light via the first optical system 94 constitutes the receiver 96 as it is. It is incident on the CCD96a. In this case, the light receiving surface of the CCD96a can be regarded as being arranged at a position conjugate with the pupil surface PP of the condensing optical system 82, and receives a light flux corresponding to the intensity distribution of the beam on the pupil surface PP. Is possible. Therefore, the control device 600 takes in the light receiving data of the light receiving receiver 96 (referred to as LRD2, see FIG. 11), and obtains the intensity distribution of the beam in the pupil surface PP based on the light receiving data LRD2. Then, the obtained intensity distribution data is stored in the memory.

The control device 600 can adjust at least a part of the angles of the plurality of mirror elements 81 _{p, q} of the mirror array 80, for example, based on the intensity distribution of the beam in the pupil surface PP.

The control device 600 may measure the intensity distribution of the beam on the pupil surface PP every time the intensity distribution of the beam on the modeling surface MP is measured, but the intensity distribution of the beam on the modeling surface MP may be measured a predetermined number of times. You may do it once every time you do it.

FIG. 11 shows a block diagram showing an input / output relationship of the control device 600 that mainly constitutes the control system of the modeling device 100. The control device 600 includes a workstation (or a microcomputer) and the like, and controls each component of the modeling device 100 in an integrated manner.

The basic function of the modeling apparatus 100 according to the present embodiment configured as described above is to add a desired shape to an existing part (work) by three-dimensional modeling. The work is put into the modeling device 100, and after the desired shape is accurately added, the work is carried out from the modeling device 100. At this time, the actual shape data of the added shape is sent from the device to an external device, for example, a higher-level device. The series of operations performed by the modeling apparatus 100 is automated, and the work can be supplied in lot units with a fixed amount collected on the pallet as one lot.

FIG. 15 shows a flowchart corresponding to a series of processing algorithms of the control device 600. The processing (including determination) of each step in the following flowchart is performed by the control device 600, but the description of the control device 600 will be omitted below unless it is particularly necessary.

When a start command is input to the control device 600 from the outside, the process according to the flowchart of FIG. 15 is started.

First, in step S2, the count value n of the counter indicating the number of the work in the lot is initialized (n ← 1).

In the next step S4, a pallet (not shown) on which one lot of workpieces before additional processing is mounted is carried in from the outside to a predetermined carry-in / out position in the modeling apparatus 100. This loading / unloading is performed by a loading / unloading device (not shown) according to the instruction of the control device 600. Here, one lot is, for example, i × j pieces, and i × j pieces of work are mounted on the pallet in a matrix-like arrangement of i rows and j columns. That is, on the upper surface of the pallet, the mounting position (mounting position) of the work is determined by the matrix-like arrangement of i rows and j columns, and the work is mounted (mounted) at each mounting position. For example, each mounting position is marked, and the position of each mark on the pallet is known. In the following, one lot is 4 × 5 = 20 as an example, and marks are attached to the upper surface of the pallet in a matrix-like arrangement of 4 rows and 5 columns, and the workpiece is mounted on each mark. It shall be. For example, the 1st to 5th workpieces in the lot are arranged at positions of 1 row 1 column to 1 row 5 columns, respectively, and the 6th to 10th workpieces are arranged in 2 rows 1 column to 2 rows 5 respectively. The 11th to 15th works are arranged at the positions of columns, the 11th to 15th works are arranged at the positions of 3 rows, 1 column to 3 rows and 5 columns, respectively, and the 16th to 20th works are arranged at 4 rows, 1 column to 4 respectively. Arranged at the position of row 5 column.

In the next step S6, the nth work in the lot is taken out from the pallet and mounted on the table 12. At this time, it is assumed that the mobile system 200 is in the loading / unloading position set in the vicinity of the position where the transport system 300 in the modeling apparatus 100 is installed. Further, at this time, the table 12 is in the above-mentioned reference state (Z, θx, θy, θz) = (Z ₀ , 0, 0, 0), and its XY position is a slider measured by the position measurement system 28. It coincides with the X and Y positions of 10.

Specifically, the control device 600 specifies the position (i, j) on the pallet of the work to be taken out with reference to the count value n, and the specified position (i.j.) with respect to the transfer system 300. ) Gives instructions to take out the work. In response to this instruction, the work is taken out from the pallet by the transfer system 300 and mounted on the table 12. For example, when n = 1, the work at the position of the first row and the first column on the pallet is taken out and mounted on the table 12.

Next, in step S7, the table 12 on which the work is mounted is moved below the measurement system 400 (sensor unit 38). In the movement of the table 12, the control device 600 controls the planar motor 26 based on the measurement information of the position measurement system 28 to drive the movement system 200 on the base BS in the X-axis direction (and the Y-axis direction). It is done by. Even during this movement, the table 12 maintains the above-mentioned reference state.

In the next step S8, the measurement system 400 is used to position information in at least a part of the target surface on the work surface mounted on the table 12 in the reference state in the three-dimensional space (three-dimensional shape information in the present embodiment). ) Is measured. After that, based on this measurement result, the position of the target surface on the work in the six degrees of freedom direction can be managed by open-loop control on the table coordinate system (reference coordinate system).

In the next step S9, the table 12 on which the workpiece whose position information (shape information) has been measured for at least a part of the target surface has been measured is moved below the beam modeling system 500 (nozzle unit 84) in the same manner as described above. do.

In the next step S10, additional processing is performed by three-dimensional modeling to add a shape corresponding to 3D data to the work on the table 12. This additional processing is performed as follows.

That is, the control device 600 converts the three-dimensional CAD data of the shape to be added by the addition processing (the shape obtained by removing the shape of the work to be added processing from the shape of the object created after the addition processing) as the data for three-dimensional modeling. For example, the data is converted into STL (Stereo Lithography) data, and further, the data of each layer sliced in the Z-axis direction is generated from the three-dimensional STL data. Then, the control device 600 controls the moving system 200 and the beam modeling system 500 in order to perform additional processing of each layer on the work based on the data of each layer, and forms the above-mentioned one-character region and the nozzle 84a for the one-character beam. The formation of the linear molten pool by supplying the modeling material from the above is repeatedly performed for each layer while scanning the table 12 in the scanning direction. Here, the position and orientation of the target surface on the work during the additional machining are controlled in consideration of the position information of the target surface (shape information in the present embodiment) measured earlier. For example, the position information (shape information) of the target surface TAS of the work W acquired by using the measurement system 400 aligns the target portion TA on the target surface TAS of the work W with the irradiation region of the beam in the modeling surface MP. Used to do. In addition, the control device 600 also controls the beam modeling system 500 based on the position information (shape information) of the target surface TAS of the work W acquired by using the measurement system 400. The content of this control is described above as a method of setting or changing the intensity distribution of the beam on the modeling surface, for example, the shape, size, arrangement, etc. of the irradiation region of the beam formed on the modeling surface. It includes all of the various controls related to the various controls of the unit 520 and the various control contents related to the supply operation of the modeling material by the material processing unit 530 described as being performed according to the setting or change of the intensity distribution of the beam.

Here, in the above description, the target surface (for example, the upper surface) TAS on which the target portion TA of the additional processing of the work W is set is perpendicular to the optical axis of the condensing optical system 82 by adjusting the inclination of the table 12. It is assumed that the plane is set to a plane (a plane parallel to the XY plane), and the modeling accompanied by the scanning operation of the table 12 is performed. However, the target surface on which the target portion for additional processing of the work is set is not always a plane on which a single character beam can be used. However, the modeling apparatus 100 according to the present embodiment includes a moving system 200 capable of arbitrarily setting the position of the table 12 on which the work is mounted in the six degrees of freedom direction. Therefore, in such a case, the control device 600 controls the moving system 200 and the beam irradiation unit 520 of the beam modeling system 500 based on the three-dimensional shape of the work measured by the measurement system 400, and controls the modeling surface MP. The width of the beam irradiation region on the modeling surface MP in the X-axis direction to the extent that the target surface (for example, the upper surface) on the work W aligned with the above can be regarded as flat that can be additionally processed in the beam irradiation region on the modeling surface MP. The opening and closing operation of each supply port _91i is performed through each opening / closing member _93i of the nozzle 84a, and the modeling material is supplied to the beam irradiated to the irradiation region from the necessary supply port. As a result, even if the upper surface (target surface) of the work is not flat, it is possible to perform modeling on a necessary portion.

In addition, when modeling by stacking beads, additional processing (bead formation) is performed with a beam having a small width in the X-axis direction of the irradiation region on the modeling surface to form a plane having a relatively large area, and then on the modeling surface. Additional processing (bead formation) may be performed on the plane using a single character beam having an increased width in the X-axis direction of the irradiation region. For example, when modeling on an uneven target surface, a flat surface is formed by performing additional processing (bead formation) to fill the recesses with a beam having a small width in the X-axis direction of the irradiation region on the modeling surface, and then modeling. Additional processing (bead formation) may be performed on the plane of the single character beam having a widened width in the X-axis direction of the irradiation region in the surface MP. Even in such a case, it goes without saying that the powder of the modeling material is supplied from one or a plurality of supply ports selected according to the change in the size (width) of the irradiation region of the beam on the modeling surface MP.

After the addition processing to the work is completed, in step S11, the table 12 on which the addition processing work W is mounted is moved below the measurement system 400.

In the next step S12, the shape of the work on the table 12 is inspected by using the three-dimensional measuring machine 401 of the measuring system 400. Specifically, the control device 600 measures the three-dimensional shape of the work that has been additionally processed by using the three-dimensional measuring machine 401 with the work mounted on the table 12, and the additional processing that is obtained from the design value has been completed. Obtain the dimensional error of the measured 3D shape of the work with respect to the 3D shape of the work. Here, the work that has been subjected to additional processing (work on the table 12) to be inspected includes both a work that has undergone only the first additional processing and a work that has undergone correction processing described later after the additional processing.

After the inspection is completed, in the next step S14, by determining whether or not the dimensional error obtained by the inspection is equal to or less than the predetermined threshold value, the pass / fail determination of the additional processing, that is, the determination of whether or not the addition is passed is determined. conduct. Then, if the determination in step S14 is affirmed, that is, if the determination is successful, the process proceeds to step S15.

On the other hand, if the determination in step S14 is denied, that is, if the determination is unsuccessful, the process proceeds to step S19, the table 12 on which the work is mounted is moved below the beam modeling system 500, and then the table in step S20. The work mounted on the 12 is modified. This correction processing is performed from the beam irradiation unit 520 of the beam modeling system 500, as in the case of modeling with a normal 3D printer, so that the dimensional error becomes as zero as possible based on the dimensional error obtained by the inspection. (For example, a spot-shaped beam) is used to form a molten pool while moving the table 12 in a stationary state or at an extremely low speed. In this case, if the dimensional error obtained as a result of the inspection is a positive (positive) value, that is, if an unnecessarily thick shape is added to the target surface of the work by additional processing, it is extra. It is necessary to remove the modeling material of the part. In the present embodiment, the control device 600 irradiates an extra shape portion on the target surface of the work with a beam from the beam irradiation unit 520 of the beam modeling system 500 without supplying the modeling material, and modeling of that portion. While melting the material, the table 12 is moved while rapidly accelerating and decelerating, and the melted modeling material is removed from the target surface of the work. The beam modeling system 500 may be provided with a compressed air ejection device that moves the table 12 while rapidly accelerating or decelerating it, or instead, blows away the melted modeling material. Alternatively, a removing device having a cutting tool or the like that mechanically removes excess modeling material without melting the modeling material by the beam may be provided in the beam modeling system 500. In any case, it is desirable to provide a recovery device in the beam modeling system 500 for recovering the modeling material (melted modeling material or mechanically removed modeling material) removed from the target surface of the work. .. The recovery device may be provided completely separately from the nozzle 84a, but when the nozzle is provided with a recovery port for excess powdery modeling material that has not melted, the recovery port is used to recover the removed modeling material. It may also be used as a mouth.

When the above-mentioned correction processing is completed, the process returns to step S11, the table 12 on which the correction processing work is mounted is moved below the measurement system 400, and then the three-dimensional measuring machine 401 of the measurement system 400 is used in the next step S12. Inspect the shape of the work on the table 12. Then, in step S14, a pass / fail determination of the additional processing, that is, a determination of pass / fail is performed. Then, when the judgment in step S14 is denied (if it fails) again, the inspection result of the shape after the correction process is passed until the judgment in step S14 is affirmed. Until then, the loop processing (including determination) of steps S19, S20, S11, S12, and S14 is repeated, and necessary further correction processing is performed.

In step S15, the table 12 on which the work that has been added (including modified) is mounted is moved to the above-mentioned loading / unloading position.

In the next step S16, the nth work in the processed lot mounted on the table 12 is returned to the pallet. Specifically, the control device 600 identifies a position on the pallet with reference to the count value n, and gives an instruction to the transfer system 300 to return the work to the specified position on the pallet. In response to this instruction, the transfer system 300 removes the work that has been subjected to the addition processing from the table 12 and returns it to the specified position on the pallet. Prior to and after the instruction to the transfer system 300, the control device 600 applies the actual shape data of the added shape obtained in the shape inspection of the work performed in step S12 immediately before to an external device, for example. Send to higher-level device.

When the process of step S16 is executed, the process proceeds to step S22. At this point, there is no work on the table 12. In step S22, the counter count value n is incremented by 1 (n ← n + 1).

In the next step S24, it is determined whether or not the count value n exceeds N (N is the number of workpieces in one lot, N = 20 in this embodiment). If the determination in step S24 is denied, that is, if there is a work whose processing has not been completed in the lot, the process returns to step S6, and steps S6 to S24 are repeated until the determination in step S24 is affirmed. repeat. As a result, the series of processes (including judgment) described above are performed on the second and subsequent works in the lot. Then, when the processing is completed for all the workpieces in the lot and the determination in step S24 is affirmed, the process proceeds to step S26, and the pallet on which the processed workpieces are mounted on the loading / unloading device (not shown). After instructing to carry out the device, the series of processes of this routine is terminated.

In the above description, after the addition processing to the work is completed, the table 12 on which the addition processing work W is mounted is moved below the measurement system 400, and the table is used by the three-dimensional measuring machine 401 of the measurement system 400. It was decided to inspect the shape of the work on the work 12, but without performing such an inspection, after the addition processing to the work was completed, the table 12 on which the addition processing work W was mounted was placed on the pallet with the processed work. You may move to the loading / unloading position to return. That is, it is not always necessary to inspect the shape of the work that has been subjected to additional processing and the above-mentioned correction processing using this inspection result. Alternatively, after the addition processing to the work is completed, the table 12 on which the addition processing work W is mounted is moved below the measurement system 400, and the work on the table 12 is moved by using the three-dimensional measuring machine 401 of the measurement system 400. It is also possible to inspect the shape and move to the loading / unloading position in order to return the work that has been additionally processed to the pallet without performing correction processing regardless of the inspection result. In this case as well, the actual shape data of the added shape obtained as a result of the inspection is sent to an external device, for example, a higher-level device by the control device 600. Further, when the correction process is performed, it is not necessary to perform the shape inspection of the work. That is, the process may proceed to step S15 after step S20, and the table 12 on which the modified workpiece may be mounted may be moved to the above-mentioned loading / unloading position.

Further, in the above description, in order to determine whether or not correction processing is necessary after the completion of additional processing on the work, a table 12 on which the additional processing work W is mounted is used to inspect the shape of the processed work. It was moved below the measurement system 400. However, not limited to this, the table 12 on which the work W is mounted is moved below the measurement system 400 in the middle of the addition processing to the work, and after acquiring the position information (shape information) of the target surface including the addition portion, The table 12 on which the work W is mounted may be moved to the lower side of the beam modeling system 500 again, and modeling may be resumed based on the position information (shape information) of the target surface including the acquired additional portion.

As described above in detail, according to the modeling apparatus 100 and the modeling method executed by the modeling apparatus 100 according to the present embodiment, the work to which the additional processing has been performed is mounted on the table 12 without being removed from the table 12. The three-dimensional shape of the target surface of the work in the as-is state can be measured by the measurement system 400, and based on the measurement result, for example, the pass / fail (OK / NG) of the shape after processing is determined. It will be possible to do. Then, in the case of failure, it is possible to perform correction processing as it is by using the beam modeling system 500 while the work is mounted on the table 12, which is extremely efficient.

Further, in the process of mass-producing parts, it is extremely convenient to manufacture the parts and perform dimensional inspection on the spot in order to control the quality. This is because the accuracy of the device is accompanied by drift due to various factors. By performing the inspection on the spot, the control device 600 can detect the tendency of this drift, and it becomes possible to feed back the machining accuracy based on the result. That is, the control device 600 obtains the tendency of the device to drift in modeling based on the position information (shape information) of the target surface of the work acquired by using the measurement system 400, and the measurement system 400 according to the obtained result. , At least one of the beam shaping system 500 and the mobile system 200 can be adjusted, thereby suppressing dimensional variation and improving yield and quality variation.

The control device 600 is not limited to the case where the tendency of the device to drift in modeling is obtained, and the measurement system 400 and beam modeling are based on the position information (shape information) of the target surface of the work acquired by using the measurement system 400. At least one of the system 500 and the mobile system 200 may be coordinated. The work in this case includes at least one of the work before the additional processing, the work after the additional processing, and the work after the correction processing.

In the case of the modeling apparatus 100 according to the present embodiment, as can be seen from the explanations so far, there is almost no reaction force due to machining, so that the fixed state of the work is directly linked to the machining accuracy and finish of the machine tool such as a machining center. Unlike, it is not necessary to firmly fix the work on the table 12. Further, since the modeling apparatus 100 includes the measurement system 400, even if the work is mounted on the table 12 somewhat roughly by the transfer system 300, the position with respect to the coordinate system is specified again by the measurement system 400. It doesn't matter. Since the three-dimensional shape measurement (one aspect of the three-dimensional alignment) is performed by the measurement system 400, the transfer system 300 loads the work onto the table 12 and unloads the additionally processed work from the table 12. It is possible to automate a series of operations including, and efficient production is possible.

Further, according to the modeling apparatus 100 according to the present embodiment, the intensity distribution of the beam in the above-mentioned modeling surface MP is not only before the start of modeling due to the relative movement between the beam and the target surface TAS, but also between the beam and the target surface TAS. During the relative movement, it can be continuously changed if necessary, and can be changed according to the relative position between the target surface TAS and the beam, and also according to the required modeling accuracy and throughput. This makes it possible for the modeling apparatus 100 to form a modeled object on the target surface TAS of the work W with high processing accuracy and high throughput by, for example, rapid prototyping.

Further, in the modeling apparatus 100, when performing additional processing (modeling) of a relatively wide area on a flat target surface TAS, a powdery modeling material PD is supplied from the nozzle 84a to the above-mentioned single character beam to be a nozzle. A method is adopted in which a linear molten pool WP is formed directly below 84a, and the molten pool WP is formed while scanning the table 12 in the scanning direction (+ Y direction in FIG. 4). According to this method, as shown in FIG. 16 (B), a shape that could not be generated without reciprocating a spot-shaped beam several tens of times with a conventional 3D printer or the like is shown in FIG. 16 (A). In addition, it can be generated by several round trips of the table 12 for a single character beam. According to this embodiment, it is possible to form a modeled object on the target surface of the work in a much shorter time than in the case of the conventional one-stroke modeling of modeling by a spot-shaped beam. That is, the throughput can be improved also in this respect.

Further, according to the modeling apparatus 100 according to the present embodiment, the intensity distribution of the beam in the modeling surface of the condensing optical system 82 is changed by changing the inclination angle of the reflection surface of each mirror element of the mirror array 80. Therefore, it is possible to easily change at least one of the position, number, size, and shape of the irradiation region of the beam in the modeling plane as the change of the intensity distribution. Therefore, for example, by setting the irradiation area to a spot shape, a slit shape (line shape), etc., and performing three-dimensional modeling on the target surface on the work by the above-mentioned method, it is possible to form a highly accurate three-dimensional model. It will be possible.

Further, the modeling apparatus 100 according to the present embodiment has a plurality of, for example, two powder cartridges 88A and 88B, and inside each of the powder cartridges 88A and 88B, a powder of a first modeling material (for example, titanium) is used. Contains powder of 2 modeling materials (eg, stainless steel). Then, at the time of additional processing (during modeling), the control device 600 switches the powder supply path to the nozzle unit 84 using the material supply device 86, that is, the pipes 90b and 90c. As a result, the powder of the first modeling material (for example, titanium) from the powder cartridge 88A and the powder of the second modeling material (for example, stainless steel) from the powder cartridge 88B are selectively supplied to the nozzle unit 84. Therefore, it is possible to easily generate a joint shape of different materials only by switching the powder material supplied by the control device 600 according to the site. Moreover, the switching can be performed almost instantly. Furthermore, it is possible to make an "alloy" on the spot by mixing and supplying different materials, or to change the composition depending on the location or to make a gradation.

In the modeling device 100 according to the present embodiment, the control device 600 measures the intensity distribution of the beam in the modeling surface MP at an appropriate frequency by the above-mentioned method using the measuring device 110, and performs necessary calibration. be able to. For example, the control device 600 controls the mirror array 80 or the like based on the measurement result of the beam intensity distribution in the modeling surface MP using the measuring device 110 to adjust the beam intensity distribution in the modeling surface MP. be able to.

Further, the control device 600 measures the intensity distribution of the beam in the modeling surface MP by using the measuring device 110, for example, prior to the modeling process (additional processing) for the work, and is performing the modeling process based on the measurement result. In addition, at least one of the beam modeling system 500 and the mobile system 200 may be adjusted. Also in this case, following the measurement of the beam intensity distribution in the modeling surface MP, the beam intensity distribution in the pupil surface PP is measured, and based on the result, the beam modeling system 500 and the moving system are measured during the modeling process. Adjustment (control) of at least one of 200 may be performed.

As the adjustment (control) of the moving system 200 in this case, the position control of the table 12 for aligning the target portion TA on the target surface TAS of the work W with the irradiation region of the beam on the modeling surface MP is typical. Listed in.

Further, as the content of the adjustment (control) of the beam modeling system 500, first, the intensity distribution of the beam on the modeling surface, for example, the shape, size, arrangement, etc. of the irradiation region of the beam formed on the modeling surface is set. Or, various controls related to the beam irradiation unit 520 described as a method of changing the beam, and various operations related to the supply operation of the modeling material by the material processing unit 530 described as being performed according to the setting or change of the intensity distribution of the beam. All of the control contents are included.

Further, when the intensity distribution of the beam on the modeling surface MP cannot be measured at once by the photoreceiver 96 while the table 12 is stationary, for example, when the arrangement range of the beam irradiation region on the modeling surface MP is wide. The beam intensity distribution on the modeling surface MP is measured while moving the table 12 (opening 92a of the measuring member 92) in at least one direction in the X-axis direction and the Y-axis direction in the XY plane.

In the modeling device 100 according to the present embodiment, the table 12 is provided with all the constituent parts of the measuring device 110, but the table 12 is not limited to this, and the light receiving surface of the CCD 96a and the measuring member 92 functioning as a light receiving unit As long as the optical conjugate relationship with the forming surface of the opening 92a is maintained, the constituent parts of the measuring device 110 other than the measuring member 92 may be provided outside the table 12.

Further, a sensor device similar to the above-mentioned measuring device 110 may be mounted, and a movable member that can move independently of the table 12 may be provided separately from the table 12. In this case, the movable member may be movable in the three axes of X, Y, and Z, and the control device 600 adopts a configuration in which the positions of the movable member and the sensor can be controlled (managed) on the table coordinate system. You may. Using the sensor device, the control device 600 can measure the intensity distribution of the beam on the above-mentioned modeling surface. Also in this case, the intensity distribution of the beam on the pupil surface PP may be measured. Further, in this case, the control device 600 is based on the intensity distribution of the beam in the modeling surface MP measured by using the sensor device, and during the modeling process, the control device 600 is at least one of the beam modeling system 500 and the moving system 200 described above. It may be adjusted. In addition, the control device 600 may measure the work on the table 12 by using the measurement system 400, and at the same time, measure the intensity distribution of the beam on the above-mentioned modeling surface by using the sensor device. can.

As can be seen from the above description, the measuring device 110 can also be used as an unevenness sensor for detecting unevenness (intensity distribution) inside the irradiation region of the beam intensity.

Further, the wavefront aberration of the condensing optical system 82 may be measured by using the measuring device 110. For example, the forming surface of the opening 92a and the light receiving surface of the CCD96a are optically conjugated in an empty area of the rotating plate 101 shown in FIG. 13, for example, in a region in a circle of a virtual line (dashed-dotted line) in FIG. A microlens array in which a plurality of microlenses are arranged in a matrix may be arranged. In this case, the rotating plate 101 is rotated to position the microlens array on the optical path of the parallel light emitted from the first optical system 94, and the pattern plate on which the pinhole pattern is formed as the light transmitting portion is formed. For example, by arranging it on the emission side of the second fly-eye lens system 76, it is possible to configure a Shack-Hartmann type wave surface aberration measuring instrument capable of measuring the wave surface aberration of the condensing optical system 82. In this case, the pattern plate is configured to be removable on the injection side of the second flyeye lens system 76. When a configuration capable of measuring wave surface aberration is adopted, even if the position of the rear focal plane of the focused optical system 82 changes, the rear focal plane of the focused optical system 82 after the change is obtained from the wave surface aberration measurement result. The position can be measured, the position of the modeling surface MP can be changed based on the position, and the position of the upper surface of the measuring member 92 during the measurement process by the measuring device 110 can be adjusted. Further, when a configuration capable of measuring wavefront aberration is adopted, the configuration may be such that the optical characteristics of the condensing optical system 82 can be adjusted at the same time. For example, the condensing optical system 82 is composed of a plurality of lenses, and some of the lenses are tilted in the optical axis AX direction and the plane orthogonal to the optical axis AX (tilt direction) by a driving element such as a piezoelectric element. It may be configured to be driveable. In such a case, the optical characteristics of the condensing optical system 82 can be adjusted by driving the movable lens in at least one of the axis AX direction and the tilt direction.

In addition, instead of the above-mentioned measuring device 110, as shown in FIG. 17, the above-mentioned receiver 96 is mounted on the upper surface of the table 12, and the light receiving surface of the CCD96a is flush with the other parts of the table 12 (same). It may be arranged so as to be a surface). Then, the intensity distribution of the beam on the modeling surface MP may be measured by the light receiver 96. In this case as well, not only the measurement when the table 12 is stopped, but also the scan measurement for measuring the intensity distribution of the beam while the table 12 is moving is enabled, so that the influence of the finite number of pixels of the CCD or the mirror array can be obtained. Can be eliminated and correct measurement results can be obtained. In this way, by measuring the beam intensity distribution with a sensor that receives the beam from the condensing optical system 82, it is possible to manage the beam intensity distribution in consideration of fluctuation factors such as thermal aberration of the condensing optical system 82. It will be possible. Further, by controlling the mirror array 80 or the like based on the result, the intensity distribution of the beam on the rear focal plane of the condensing optical system 82 or the like can be accurately set to a desired state.

In the above embodiment, the beam modeling system 500 forms an irradiation region of a single linear beam (single character beam), and the work W is scanned in the scanning direction (for example, the Y-axis direction) with respect to the single character beam. The case was explained. However, in the beam modeling system 500, as described above, by assigning an appropriate angle distribution to the incident angles of the plurality of parallel beams LB incident on the condensing optical system 82, the intensity distribution of the beam on the modeling surface MP can be obtained. It can be changed freely. Therefore, in the modeling apparatus 100, at least one of the position, number, size, and shape of the beam irradiation region on the modeling surface MP can be changed, and as described above, the beam irradiation region is, for example, one character region, three. It is also possible to form a column area, a missing single character area, and the like (see FIG. 10).

Until now, by making the single character area as thin and sharp as possible, the energy density of the beam irradiated to the single character area when defocused is sharply reduced, and the thickness of the molten pool (coating layer) is controlled. The explanation was given on the premise of how to use it with the highest possible sex. However, in this case, the thickness of the coating layer becomes very thin, and when adding layers of the same thickness, it is necessary to divide into more layers and perform additional processing (modeling) (overlapping many times). Must be painted), which is disadvantageous in terms of productivity.

Therefore, it may be desired to increase the thickness of the coating layer in consideration of the balance between the required molding accuracy and the throughput. In such a case, the control device 600 changes the intensity distribution of the beam in the modeling plane according to the required modeling accuracy and throughput, specifically, of each mirror element 81 _{p, q} of the mirror array 80. You can control the tilt angle to make the width of one character area a little thicker. For example, the one-character area LS shown in FIG. 18B changes to the one-character area LS'. By doing so, the change in energy density at the time of defocusing becomes gradual, and as shown in FIG. 18 (A), the thickness h of the high energy area in the vertical direction becomes thicker, whereby in one scan. The thickness of the layer that can be formed can be increased, and the productivity can be improved.

As described above, the modeling apparatus 100 according to the present embodiment is characterized in that it is provided with a large number of conveniences and a solution that meets the requirements of an actual processing site, as compared with a conventional 3D printer for metal. ..

In the above embodiment, as an example, a case where the workpieces are processed in lot units with a fixed amount collected on the pallet as one lot has been described, but the present invention is not limited to this, and the workpieces may be processed one by one. .. In this case, the transport system 300 loads the work before machining received from the external transport system onto the table 12, and the work after machining is unloaded from the table and passed to the external transport system.

In the above embodiment, the case where the mirror array 80 is used as the spatial light modulator has been described, but instead of this, a digital micromirror device (DMD®) manufactured by MEMS technology has been described. ) May be arranged in a matrix, and a large-area digital mirror device may be used. In such a case, it becomes difficult to measure the state (for example, tilt angle) of each mirror element with an encoder or the like. In such a case, the surface of the large-area digital mirror device is irradiated with the detection light, the reflected light from a large number of mirror elements constituting the digital mirror device is received, and each mirror element is based on the intensity distribution thereof. A detection system that detects the state of the above may be used. In this case, the detection system may detect the state of each of a large number of mirror elements based on the image information obtained by imaging the image formed by the digital mirror device by the image pickup means.

In the modeling apparatus 100 according to the above embodiment, the detection system 89 shown by the virtual line in FIG. 11 may be used together with the rotary encoders 83 _{p and q} . In this detection system 89, the surface of the mirror array 80 is irradiated with the detection light, the reflected light from a large number of mirror elements 81 _{p, q} constituting the mirror array 80 is received, and each mirror element is based on the intensity distribution thereof. A detection system that detects the state of 81 _{p, q} can be used. As the detection system, for example, a system having the same configuration as that disclosed in US Pat. No. 8,456,624 can be used.

Further, in the above embodiment, a case where a mirror array 80 of a type capable of changing the inclination angle of the reflection surface of each mirror element 81 _{p, q} with respect to the reference surface is used has been illustrated, but the present invention is not limited to this, and each mirror element is not limited to this. A mirror array having a structure that can be tilted with respect to the reference plane and can be displaced in a direction orthogonal to the reference plane may be adopted. Further, each mirror element does not necessarily have to be tiltable with respect to the reference plane. As described above, a mirror array that can be displaced in a direction orthogonal to the reference plane is disclosed, for example, in US Pat. No. 8,456,624. In addition, a mirror array of a type in which each mirror element can rotate around two axes orthogonal to each other parallel to the reference plane (that is, the tilt angle in the two orthogonal directions can be changed) may be adopted. A mirror array that can change the tilt angle in two orthogonal directions in this way is disclosed in, for example, US Pat. No. 6,737,662. Even in these cases, the state of each mirror element can be detected by using the detection system disclosed in the above-mentioned US Pat. No. 8,456,624.

A detection system may be used in which the surface of the mirror array 80 is irradiated with the detection light and the reflected light from a large number of mirror elements 81 _{p, q} constituting the mirror array 80 is received. Alternatively, as the detection system, the mirror array (optical device) may be provided with a sensor that individually detects the tilt angle and the spacing with respect to the reference plane (base) of each mirror element.

In the above embodiment, the case where the intensity distribution of the beams on the modeling surface is changed by individually controlling the incident angles of the plurality of parallel beams incident on the pupil surface of the condensing optical system 82 has been described. It is not necessary that all the angles of incidence of the plurality of parallel beams incident on the pupil surface of the condensing optical system 82 can be controlled (changed). Therefore, when the incident angle of the parallel beam incident on the condensing optical system 82 is controlled by using the mirror array as in the above embodiment, all the mirror elements are in the state of the reflecting surface (position and inclination angle of the reflecting surface). At least one of them) does not have to be changeable. Further, in the above embodiment, the case where the mirror array 80 is used for controlling the incident angles of the plurality of parallel beams incident on the condensing optical system 82, that is, for changing the intensity distribution of the beams on the modeling surface has been described. Instead of the mirror array, a spatial light modulator (non-emission type image display element) described below may be used. Examples of the transmissive spatial light modulator include an electrochromic display (ECD) in addition to a transmissive liquid crystal display element (LCD: Liquid Crystal Display). In addition to the above-mentioned micromirror array, the reflective spatial light modulator includes a reflective liquid crystal display element, an electrophonetic display (EPD), electronic paper (or electronic ink), and a light diffractive light. A valve (Grating Light Valve) and the like can be mentioned as an example. Further, in the above embodiment, the case where a mirror array (a kind of spatial light modulator) is used for changing the intensity distribution of the beam on the modeling surface has been described, but the spatial light modulator may be used for other purposes. ..

Further, as described above, it is desirable that the condensing optical system 82 has a large aperture, but the numerical aperture is N.I. A. A condensing optical system having a value smaller than 0.5 may be used.

In the above embodiment, the case where titanium and stainless steel powders are used as the modeling material has been exemplified, but powders other than metals such as iron powder and other metal powders as well as powders such as nylon, polypropylene and ABS can be used. It can also be used. Further, the modeling apparatus 100 according to the above embodiment can also be applied when a material other than powder, for example, a filler wire used for welding, is used as the modeling material. However, in this case, a wire feeding device or the like is provided instead of the powder supply system such as the powder cartridge and the nozzle unit.

Further, in the above embodiment, the case where the powdery modeling material PD is supplied from each of the plurality of supply ports _91i of the nozzle 84a along the Z-axis direction parallel to the optical axis AX of the condensing optical system 82 has been described. However, the present invention is not limited to this, and the modeling material (powder) may be supplied from a direction inclined with respect to the optical axis AX. Further, the modeling material (powder) may be supplied from a direction inclined with respect to the vertical direction.

In the modeling apparatus 100 of the above embodiment, the nozzle 84a provided in the material processing unit has a collection port (suction port) for collecting the powdered modeling material that has not been melted, in addition to the supply port of the modeling material described above. You may be.

So far, an example of adding a shape to an existing work has been described, but the usage of the modeling apparatus 100 according to the present embodiment is not limited to this, and it is on the table 12 like a normal 3D printer or the like. It is also possible to generate a three-dimensional shape from nothing by modeling. In this case, the work of "nothing" is nothing but additional processing. At the time of modeling the three-dimensional modeled object on the table 12, the control device 600 is at least three places preformed on the table 12 by the mark detection system 56 (see FIG. 11) included in the measurement system 400. By optically detecting the alignment mark of, the position information in the direction of 6 degrees of freedom of the object surface of modeling set on the table 12 is obtained, and based on this result, the position information on the table 12 with respect to the beam (irradiation region) is obtained. Three-dimensional modeling may be performed while controlling the position and orientation of the target surface.

In the above embodiment, as an example, the case where the control device 600 controls each component of the mobile system 200, the transport system 300, the measurement system 400, and the beam modeling system 500 has been described, but the present invention is not limited to this. The control device may be configured by a plurality of hardware including a processing device such as a microprocessor. In this case, each of the mobile system 200, the transfer system 300, the measurement system 400 and the beam modeling system 500 may be provided with a processing device, or the mobile system 200, the transfer system 300, the measurement system 400 and the beam modeling system 500 may be provided. It may be a combination of a first processing device that controls at least two of them and a second processing device that controls the remaining systems, or a first process that controls two of the above four systems. It may be a combination of the device and the second and third processing devices that individually control the remaining two systems. In either case, each processing device is responsible for a part of the functions of the control device 600 described above. Alternatively, the control device of the modeling system may be configured by a processing device such as a plurality of microprocessors and a host computer that collectively manages these processing devices.

At least a part of the constituent elements of each of the above-described embodiments can be appropriately combined with at least another part of the constituent requirements of each of the above-described embodiments. Some of the constituent requirements of each of the above embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all published gazettes and US patents cited in each of the above embodiments shall be incorporated as part of the text.

As described above, the modeling apparatus and modeling method according to the present invention are suitable for forming a three-dimensional model.

12 ... table, 82 ... condensing optical system, 83 ... rotary encoder, 91 ... supply port, 85 ... limiting member, 89 ... detection system, 92 ... measuring member, 92a ... opening, 100 ... modeling device, 110 ... measuring device, 200 ... mobile system, 300 ... transfer system, 400 ... measurement system, 401 ... three-dimensional measuring machine, 500 ... beam modeling system, 520 ... beam irradiation unit, 530 ... material processing unit, 600 ... control device, PD ... modeling material, LS ... single character area, TA ... target part, TAS ... target surface, W ... work, WP ... molten pond.

Claims (29)

It is a modeling device that forms a three-dimensional model.
A moving system that moves the target surface,
A measurement system for acquiring the position information of the target surface and
A beam modeling system having a beam irradiation unit that emits a beam and a material processing unit that supplies modeling materials.
The movement is such that the target portion on the target surface is shaped by supplying the modeling material from the material processing unit while relatively moving the target surface and the beam from the beam irradiation unit. A control device for controlling the system and the beam modeling system is provided.
The moving system has a holding member capable of holding the work, and has a holding member.
The target surface includes at least a part of the surface of the work held by the holding member.
The measurement system is at least on the surface of the work after the work is held by the holding member and before modeling by forming a molten pool at a target portion on the surface of the work is started. Get some location information,
The control device is a modeling device that starts modeling by forming a molten pool at a target portion on the surface of the work based on the position information after acquiring the position information of at least a part of the surface of the work. The modeling device according to claim 1, wherein the moving system has a movable member capable of holding the work as the holding member . The modeling device according to claim 2, further comprising a transport device for transporting the work on the movable member. The modeling device according to claim 2, wherein the mobile system moves the work below the measurement system before the position information is acquired by the measurement system. The modeling device according to claim 2, wherein the moving system moves the work below the beam modeling system after the position information is acquired by the measurement system. The modeling device according to claim 2, wherein the measurement system measures the work moving below the measurement system. The modeling system according to any one of claims 1 to 6, wherein the measurement system acquires position information of the target surface before the material processing unit starts supplying the modeling material. The modeling device according to any one of claims 1 to 7, wherein the measurement system includes a three-dimensional measuring device. The modeling device according to any one of claims 1 to 8, wherein the measurement system can measure position information of at least three points on the target surface. The modeling device according to any one of claims 1 to 8, wherein the measurement system can measure a three-dimensional shape of the target surface. Any one of claims 1 to 10, wherein the control device acquires at least a part of the position information of the surface of the portion added on the target surface by the modeling after the modeling by using the measurement system. The modeling device described in the section. The control device controls the position and orientation of the movable member under the reference coordinate system.
The modeling apparatus according to any one of claims 2 to 6, wherein the target surface is associated with the reference coordinate system by acquiring the position information of the target surface. The modeling device according to claim 12, wherein the control device manages the position of the target surface in an open loop on the reference coordinate system. The control device measures the position information of at least a part of the surface of the portion of the work added to the target surface of the work by the modeling while holding the shaped work by the movable member. The modeling apparatus according to any one of claims 2 to 6, 12, and 13 acquired by using the system. The beam irradiation unit has a condensing optical system that emits the beam.
Any of claims 1 to 14, wherein the control device adjusts the intensity distribution of the beam in the first plane perpendicular to the optical axis on the emission plane side of the condensing optical system based on the measurement result of the measurement system. The modeling device described in item 1. The modeling apparatus according to claim 15, wherein the first surface is a rear focal surface of the condensing optical system or a surface in the vicinity thereof. The control device adjusts the angle of at least one incident beam incident on the second plane perpendicular to the optical axis on the incident plane side of the condensing optical system to adjust the intensity of the beam in the first plane. The modeling apparatus according to claim 15, which adjusts the distribution. The modeling apparatus according to claim 17, wherein the second surface includes a front focal surface of the condensing optical system or a surface in the vicinity thereof. The modeling apparatus according to claim 17, wherein the at least one incident beam includes a plurality of beams having different angles of incidence with respect to the second surface. The modeling apparatus according to any one of claims 1 to 19, wherein the adjustment of the beam modeling system based on the measurement result of the measurement system includes the adjustment of the beam irradiation unit. The modeling apparatus according to claim 1, wherein the adjustment of the beam modeling system based on the measurement result of the measurement system includes the adjustment of the material processing unit. The target portion is shaped by relatively moving the target surface and the beam from the beam irradiation portion while forming a molten pool on the target portion by irradiating the beam from the beam irradiation portion. The modeling apparatus according to any one of claims 1 to 21. The three-dimensional model is formed by laminating a plurality of layers, and the control device is based on the data of the multi-layered laminated cross section obtained from the 3D data of the three-dimensional model, and the mobile system and the beam modeling system. The modeling apparatus according to any one of claims 1 to 22 for controlling and. The control device controls the moving system and the beam modeling system based on the 3D data of the three-dimensional model to be formed and the position information of the target surface acquired by using the measurement system. Item 6. The modeling apparatus according to any one of Items 1 to 23. The modeling apparatus according to any one of claims 1 to 24, wherein the position information of the target surface acquired by the measurement system is the shape information of the target surface. The modeling device according to claim 12, wherein the control device associates the position of the target surface with the reference coordinate system. The modeling device according to claim 12, wherein the control device associates the posture of the target surface with the reference coordinate system. The modeling device according to any one of claims 1 to 27, wherein the beam modeling system is modeled by a DED method. It is a modeling method that forms a three-dimensional model.
The movement of the target surface, the irradiation of the beam, and the modeling so that the target portion on the target surface is shaped by supplying the modeling material while relatively moving the target surface and the beam. Controlling the supply of materials and
Acquiring the position information of at least a part of the surface of the work by using at least a part of the surface of the work held by the holding member as the target surface.
Including
The position information is acquired after the work is held by the holding member and before modeling by forming a molten pool at a target portion on the surface of the work is started. Including getting the location information of at least a part of the surface of
A modeling method that starts modeling by forming a molten pool at a target portion on the surface of the work based on the position information after acquiring the position information of at least a part of the surface of the work.

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