JP7039978B2 - Power converter - Google Patents

Description

The present invention relates to a power conversion device used for an electric vehicle or the like.

In an electric vehicle such as an electric vehicle or a hybrid vehicle, a power conversion device is used to drive an electric motor or the like as a power source. The power converter generally includes a converter that boosts the DC voltage of the power supply, converts it to a desired voltage, and outputs it. In recent years, motors for electric vehicles tend to have higher output, and therefore, in order to cope with an increase in drive current, a vehicle system including a power conversion device including a plurality of converters has been studied.

Patent Document 1 discloses a power supply system provided with a plurality of converters corresponding to a plurality of power storage devices. For the plurality of converters, the operation mode is selected so that one or two are operated based on the level of the required power of the load device and the necessity of the boosting operation of the plurality of converters. For example, when the required power of the load device is smaller than the reference value and the boosting operation is required, the boosting operation is executed by one of the plurality of converters, and the remaining converters are stopped. When the boost operation is not required, the upper arm on mode is selected. For example, for the higher output voltage of the corresponding power storage device, the switching element to be the upper arm is fixed on and the remaining converter is stopped. .. When the output voltages of the two power storage devices are the same, the switching element is fixed on for the two converters.

Japanese Unexamined Patent Publication No. 2010-74885

In a normal range (that is, a small current range) such as city driving, the required power is relatively small, so that it is possible to suppress power loss by stopping a part of a plurality of converters. However, in the power supply system of Patent Document 1, although the method of selecting a converter in the upper arm-on mode is disclosed, the converter to be selected in the mode in which the boosting operation is executed by one converter is not specified. The upper arm-on mode is also premised on having a plurality of power storage devices.

Further, it has been found that, in general, a converter is provided with a cooling unit, but when a plurality of converters are provided, the cooling performance differs depending on the arrangement thereof, which also affects the loss generated. Therefore, it is desired to improve the power conversion efficiency by reducing the loss even in the small current range.

The present invention has been made in view of the above problems, and is an object of the present invention to realize a further loss reduction in a configuration including a plurality of converters and to provide a highly efficient power conversion device.

One aspect of the present invention is
The converter unit (2) connected between the power supply (B, B1, B2) and the load (MG1, MG2, MG3), the control unit (3) that controls the drive of the converter unit, and the cooling unit (4). ), Which is a power conversion device (1).
The converter unit has a multi-phase converter (21, 22) connected in parallel, and the converters have a reactor (L1, L2) and a semiconductor switching element (S1, S2, S3, S4, S5, respectively). It is configured to include S6, S7, S8), and the cooling unit includes a flow path (411) through which a cooling medium for cooling the reactor flows .
The control unit drives one or more of the plurality of phases of the converter in response to the power requirement, and the driven converter has a higher heat transfer coefficient between the reactor and the cooling medium, and the heat transfer coefficient is higher with respect to the reactor. It is in the power conversion device that selects in the order of good cooling performance.

When the current required under the usage conditions is small, the power conversion device of the above aspect can reduce the loss by driving a part of the multi-phase converter and stopping the part. Furthermore, the converter to be driven is selected by paying attention to the cooling performance for the reactor. Generally, as the temperature of the reactor increases, the inductance characteristics decrease and the ripple current associated with switching increases. Therefore, by driving from a converter having good cooling performance by the cooling unit, it is possible to operate a reactor having better inductance characteristics, the ripple current is reduced, and further loss reduction is possible.

As described above, according to the above aspect, it is possible to realize further loss reduction and provide a highly efficient power conversion device in a configuration including a plurality of converters.
The reference numerals in parentheses described in the scope of claims and the means for solving the problem indicate the correspondence with the specific means described in the embodiments described later, and limit the technical scope of the present invention. It's not a thing.

The equivalent circuit diagram which shows the schematic structure of the power conversion apparatus in the reference form 1. FIG. The partially enlarged view which shows the structural example of the 1st cooling part of the power conversion apparatus in the reference form 1. FIG. The overall schematic block diagram of the vehicle system to which the power conversion device is applied in the reference form 1. FIG. The equivalent circuit diagram of the vehicle system to which the power conversion device is applied in the reference form 1. The partial schematic diagram which shows the structural example of the semiconductor laminated unit which includes the 2nd cooling part of the power conversion apparatus in the reference form 1. FIG. The partial schematic diagram explaining the cooling performance of the semiconductor laminated unit including the 2nd cooling part of the power conversion apparatus in the reference form 1. FIG. The figure which shows the relationship between the laminated structure of the cooling pipes constituting the 2nd cooling part of a power conversion apparatus, and the heat transfer coefficient in the reference form 1. FIG. The figure which shows the inductance characteristic of the reactor which constitutes the converter part of the power conversion apparatus in the reference form 1. FIG. The figure which shows the difference of the ripple current by the inductance characteristic of the reactor which constitutes the converter part of the power conversion apparatus in the reference form 1. FIG. The figure which shows the resistance temperature characteristic of the reactor which constitutes the converter part of the power conversion apparatus in the reference form 1. FIG. The flowchart which is executed in the control part of the power conversion apparatus in the reference form 1. FIG. The partially enlarged view which shows the structural example of the 1st cooling part of the power conversion apparatus in Embodiment 2. The partially enlarged view which shows the structural example of the 1st cooling part of the power conversion apparatus in Embodiment 2. FIG. 3 is a partially enlarged view showing a configuration example of a first cooling unit of the power conversion device according to the third embodiment. The partially enlarged view which shows the structural example of the 1st cooling part of the power conversion apparatus in Embodiment 4. The partially enlarged view which shows the structural example of the 1st cooling part of the power conversion apparatus in Embodiment 4. FIG. 5 is an equivalent circuit diagram showing a configuration of a power supply system including a power conversion device according to the fifth embodiment. The overall schematic block diagram which shows the arrangement example of each part of the power conversion apparatus in Embodiment 5. FIG. 5 is an equivalent circuit diagram of a vehicle system to which a power conversion device is applied according to the fifth embodiment. FIG. 6 is an overall schematic configuration diagram of a vehicle system including a power conversion device according to the sixth embodiment. The overall schematic block diagram which shows the arrangement example of each part of the power conversion apparatus in Embodiment 7. FIG. 6 is a partially enlarged view showing a configuration example of a first cooling unit of the power conversion device according to the seventh embodiment.

( Reference form 1)
Reference mode 1 showing the basic configuration of the power conversion device will be described with reference to FIGS. 1 to 11.
As shown in FIG. 1, the power conversion device 1 is a power storage device B, a converter unit 2 connected between the power storage device B and a load (not shown), and a control unit that controls the drive of the converter unit 2. 3 and a cooling unit 4 are provided. The power storage device B is a DC power supply device configured to be rechargeable and dischargeable, and can be composed of, for example, a secondary battery such as a lithium ion battery, a nickel hydrogen battery, or a lead storage battery.

The converter unit 2 is a multi-phase converter including a multi-phase converter connected in parallel, and here, the converter unit 2 has a configuration including a first converter 21 and a second converter 22. The first converter 21 of the converter unit 2 includes a first reactor L1 and semiconductor switching elements S1 and S2. Similarly, the second converter 22 includes a second reactor L2 and semiconductor switching elements S3 and S4. The converter unit 2 may have a configuration having three or more phases.

The control unit 3 outputs a control signal corresponding to the power request to the converter unit 2 and drives one or more phases of the first converter 21 and the second converter 22. Specifically, the semiconductor switching elements S1 and S2 of the first converter 21 and the semiconductor switching elements S3 and S4 of the second converter 22 are alternately driven on and off to control the power conversion operation of the converter unit 2. ..

Further, the power conversion device 1 is provided with a filter capacitor 11 for noise removal on the power supply side of the converter unit 2, and a smoothing capacitor 12 for voltage smoothing on the load side of the converter unit 2. The filter capacitor 11 is arranged between the positive electrode side power line 13 and the negative electrode side power line 14 connected to the power storage device B, and the smoothing capacitor 12 includes the positive electrode side power line 15 and the negative electrode side power line 16 connected to the load. It is placed between. As shown in FIG. 3, which will be described later, the power conversion device 1 can be connected to the motor generators MG1 and MG2, which are loads, to form a part of the vehicle system 10 of the hybrid vehicle.

The first converter 21 has a first arm 211 including a series connection body of two semiconductor switching elements S1 and S2, and the first reactor L1 has a connection point between the upper and lower arms of the first arm 211 and a positive electrode side power line 13. It is connected to the. Similarly, the second converter 22 has a second arm 221 including a series connection of two semiconductor switching elements S3 and S4, and the second reactor L2 is a connection point between the upper and lower arms of the second arm 221 and a positive electrode side. It is connected to the power line 13.

As the semiconductor switching elements S1, S2, S3, and S4, for example, an IGBT (that is, an insulated gate bipolar transistor) is used. In addition to the illustrated IGBT, a power semiconductor switching element such as a MOSFET (that is, a field effect transistor) or a bipolar transistor can also be used. The semiconductor switching elements S1, S2, S3, and S4 are connected in series with the direction from the positive electrode side power line 15 to the negative electrode side power line 16 as the forward direction. Freewheel diodes (hereinafter abbreviated as diodes) D1, D2, D3, and D4 are connected in antiparallel to the semiconductor switching elements S1, S2, S3, and S4, respectively.

The first converter 21 alternately turns on and off the semiconductor switching elements S1 and S2 based on the control signal to boost the DC voltage from the power storage device B, convert it into desired DC power, and output it. Similarly, the second converter 22 boosts the DC voltage from the power storage device B by alternately turning on and off the semiconductor switching elements S3 and S4, converts the DC voltage into a desired DC power, and outputs the voltage. In this step-up operation, electromagnetic energy is stored in the first reactor L1 and the second reactor L2 during the on period of the semiconductor switching elements S2 and S4, which are the lower arms of each phase, and emitted via the diodes D1 and D3 during the off period. It is done by doing. The boost ratio to the input voltage can be adjusted by the on-period ratio (that is, the duty ratio) in the switching cycle.

The converter unit 2 is configured as a buck-boost converter, and the first converter 21 and the second converter 22 can also charge the power storage device B by stepping down the regenerative power from the motor generators MG1 and MG2. In this embodiment, the first converter 21 and the second converter 22 have basically the same structure, and the first reactor L1 and the second reactor L2, the semiconductor switching elements S1, S2 and the semiconductor switching elements S3, S4 are equivalent. Has the characteristics of.

Further, the power conversion device 1 includes a cooling unit 4 through which a cooling medium for cooling the converter unit 2 flows. The cooling unit 4 is provided in contact with the heat generating component constituting the converter unit 2, and suppresses the temperature rise by heat exchange with the cooling medium. The cooling unit 4 has, for example, a first cooling unit 41 for cooling the first reactor L1 and the second reactor L2, and a second cooling unit 42 for cooling the first arm 211 and the second arm 221. In particular, the power conversion efficiency can be improved by effectively cooling the first reactor L1 and the second reactor L2, which generate a large amount of heat, with a cooling medium. Further, the power conversion efficiency can be further improved by efficiently absorbing the heat generated by the switching operation of the first arm 211 and the second arm 221 into the cooling medium.

As shown in FIG. 2, the first cooling unit 41 is, for example, a flow path of a cooling medium such as cooling water formed in the wall surface portion 412 of the power conversion device 1 in contact with the first reactor L1 and the second reactor L2. Has 411. The wall surface portion 412 has a double wall structure having a space portion as a flow path 411 inside, and is made of, for example, a metal having good thermal conductivity. The flow path 411 is connected to an external cooling medium circulation flow path (not shown) to circulate the cooling medium in one direction. Here, for example, the refrigerant flow is in the direction from the left to the right in the figure. The direction is F. The wall surface portion 412 constitutes the bottom of a case (not shown) in which the power conversion device 1 is housed, and the upper surface in the drawing is a mounting surface 413 on which the first reactor L1 and the second reactor L2 are placed.

The arrangement of the first reactor L1 and the second reactor L2 can be preset in consideration of the cooling performance by the cooling medium. For example, in the illustrated arrangement, the first reactor L1 is located on the upstream side and the second reactor L2 is located on the downstream side along the refrigerant flow direction F. At this time, the first reactor L1 located on the upstream side can exchange heat with a cooling medium having a lower temperature, and is not affected by the heat generated by the second reactor L2 located on the downstream side, so that the first reactor L1 is located on the downstream side. The cooling performance is better than that of the second reactor L2. As described above, the cooling performance of each phase of the converter unit 2 differs depending on the arrangement of the first reactor L1 and the second reactor L2.

Therefore, when the control unit 3 drives one or more phases of the first converter 21 and the second converter 22, the order thereof is determined in the order in which the cooling performance for the first reactor L1 and the second reactor L2 is good. For example, in the arrangement shown in the figure, the first reactor L1 has higher cooling performance, so when the converter unit 2 is driven in one phase, the first converter 21 is driven. In the case of two-phase drive, the first converter 21 and the second converter 22 are driven.

When the converter unit 2 has three or more converters, each reactor may be arranged from the upstream side to the downstream side, selected in order from the converter corresponding to the upstream reactor, and driven.

By paying attention to the cooling performance of the converter unit 2 by the cooling unit 4 in this way, the control unit 3 enables effective drive control. That is, when the required power is small, the loss is suppressed by stopping one of the two phases of the converter unit 2, and the other phase to be driven is used as the phase with higher cooling performance to further reduce the loss. Reduction is possible. Further, it is more preferable that the cooling unit 4 has a configuration in which the cooling performance of the semiconductor element by the second cooling unit 42 is taken into consideration in addition to the cooling performance of the first reactor L1 and the second reactor L2 by the first cooling unit 41. .. The configuration of the second cooling unit 42 and a detailed example of control by the control unit 3 will be described later.

As shown in FIG. 3, the power conversion device 1 is applied to, for example, a vehicle system 10 for a hybrid vehicle, which is an example of an electric vehicle, and can supply electric power to a plurality of motor generators MG1 and MG2 which are loads. can. The vehicle system 10 includes an inverter unit 5 between the converter unit 2 of the power converter 1 and the motor generators MG1 and MG2. The inverter unit 5 has a first inverter 51 connected to the motor generator MG1 and a second inverter 52 connected to the motor generator MG2, and converts the DC power output from the converter unit 2 into AC power. It drives the motor generators MG1 and MG2. The first inverter 51 and the second inverter 52 are connected in parallel to each other between the positive electrode side power line 15 and the negative electrode side power line 16.

The vehicle system 10 is mounted on a hybrid vehicle equipped with motor generators MG1 and MG2 and engine ENG as power sources, and controls the drive thereof. The motor generators MG1 and MG2 are configured as a three-phase AC motor generator, and are connected to the engine ENG via a power split mechanism 17. The power split mechanism 17 has, for example, a known configuration having a planetary gear mechanism, and can distribute the power from the engine ENG to the motor generator MG1 serving as a generator and the wheels 18 to which the motor generator MG2 is connected. ing. The motor generator MG1 can also function as an electric motor when the engine ENG is started, and can also generate electricity by the rotational force of the wheels 18 in the motor generator MG2 during regenerative braking. The electric power generated by the motor generators MG1 and MG2 is input to the power conversion device 1 via the inverter unit 5 to charge the power storage device B.

As shown in FIG. 4, the first inverter 51 and the second inverter 52 of the inverter unit 5 have six semiconductor switching elements Sup, Sun, Sbp, and Svn, which form the upper and lower arms of the U phase, the V phase, and the W phase, respectively. , Swp, Swn are configured as a three-phase inverter. The first inverter 51 includes a first U-phase arm 511 composed of a series connection of semiconductor switching elements Sup and Sun, a first V-phase arm 512 composed of a series connection of semiconductor switching elements Sbp and Svn, and semiconductor switching elements Swp and Swn. It has a first W phase arm 513 composed of a series connection body of the above, and these three phase arms 511, 512, and 513 are connected in parallel to each other between the positive electrode side power line 15 and the negative electrode side power line 16.

Similarly, the second inverter 52 includes a second U-phase arm 521 composed of a series connection of semiconductor switching elements Sup and Sun, a second V-phase arm 522 composed of a series connection of semiconductor switching elements Sbp and Svn, and a semiconductor switching element. It has a second W phase arm 523 composed of a series connection body of Swp and Swn, and these three phase arms 521, 522, and 523 are connected in parallel to each other between the positive electrode side power line 15 and the negative electrode side power line 16. To.

As the semiconductor switching elements Sup, Sun, Swp, Svn, Swp, and Swn, for example, in addition to the indicated IGBTs, power semiconductor switching elements such as MOSFETs and bipolar transistors can be used. Diodes Dup, Dun, Dbp, Dvn, Dwp, and Dwn are connected in antiparallel to each of the semiconductor switching elements Sup, Sun, Sbp, Svn, Swp, and Swn, respectively.

The first inverter 51 and the second inverter 52 convert the DC power supplied from the converter unit 2 into three-phase AC power by controlling the on / off of the semiconductor switching elements of each phase. In the first inverter 51 and the second inverter 52, the connection points 51u and 52u of the U-phase semiconductor switching elements Sup and Sun are connected to the power lines 531 and 532 to the U-phase coils of the motor generators MG1 and MG2 (not shown). Outputs U-phase current. Similarly, the connection points 51v and 52v of the V-phase semiconductor switches Svp and Swp, and the connection points 51w and 52w of the W-phase semiconductor switches Svn and Swn are the V-phase coils and W-phase coils of the motor generators MG1 and MG2, respectively, which are not shown. It is connected to the power lines 541, 542, 551, and 552 to output V-phase current and W-phase current.

The inverter unit 5 may also convert the regenerative power or generated power from the motor generators MG1 and MG2 supplied to the power lines 531, 532, 541, 542, 551, and 552 into DC power and supply it to the converter unit 2. can.

As shown in FIG. 5, the first arm 211 and the second arm 221 of the converter unit 2 and the phase arms 511 to 513 to 521 to 523 of the inverter unit 5 have power cards PC1 to PC5 having a built-in power semiconductor element. The semiconductor laminated unit U used is configured. The semiconductor laminated unit U is integrally provided with the second cooling unit 42, which is a part of the cooling unit 4, and suppresses heat generation of the converter unit 2 and the inverter unit 5.

The power card PC1 has a main body portion formed by resin-molding two semiconductor switching elements S1 and S2 of the first arm 211, diodes D1 and D2, and a terminal portion (not shown). Similarly, the power card PC2 incorporates two semiconductor switching elements S3 and S4 of the second arm 221 and diodes D3 and D4 in the main body. Further, the power cards PC3 to PC5 include semiconductor switching elements Sup, Sun, Swp, Svn, Swp, Swn and diodes Dup, Dun, Dbp, Dvn, Dwp, Dwn constituting each phase arm 511 to 513 of the first inverter 51. Is built into the main body. Further, the semiconductor switching elements Sup, Sun, Sbp, Svn, Swp, Swn and the diodes Dup, Dun, Dvp, Dvn, Dwp, Dwn constituting each phase arm 521 to 523 of the second inverter 52 are also used as the same power card. Although it is configured, the illustration is omitted here.

The second cooling unit 42 has a plurality of cooling pipes 421 alternately laminated with the power cards PC1 to PC5, and a pair of outlet cooling pipes 422 and 423 connected to both sides of the plurality of cooling pipes 421. There is. The cooling pipes 421 to 423 of the second cooling unit 42 are made of, for example, a metal having good thermal conductivity. Each of the plurality of cooling pipes 421 is composed of flat pipes having both ends open, and has a hollow interior as a cooling medium flow path, and is closely arranged so as to sandwich the power cards PC1 to PC5 from both sides. Each of the pair of lead-in cooling pipes 422 and 423 is a cylindrical tube whose one end (for example, the right end in the figure) is closed, and the open end (for example, the left end in the figure) is connected to a cooling medium circulation flow path (not shown). ing. Here, one (for example, the upper part of the figure) is used as an introduction cooling pipe 422, and the other (for example, the lower part of the figure) is used as a lead-out cooling pipe 423 at both ends of a plurality of cooling pipes 421 arranged in parallel. Connecting.

At this time, inside the plurality of cooling pipes 421, the cooling medium flows in the same direction (for example, from the upper side to the lower side in the figure) from the introduction cooling pipe 422 toward the outlet cooling pipe 423. Further, in the power cards PC1 to PC5, the power card PC1 side near the opening end of the introduction cooling pipe 422 is located on the upstream side, and the power card PC5 side near the closed end is located on the downstream side. As shown in FIG. 6, the flow path resistance of the cooling medium flow path formed in the second cooling unit 42 increases as the flow path becomes longer, so that the downstream side where the number of stacked stages of the plurality of cooling pipes 421 increases. The more difficult it is for the cooling medium to flow. That is, in the second cooling unit 42, the flow rate of the cooling medium becomes larger on the power card PC1 side, and the flow rate of the cooling medium gradually decreases toward the power card PC5 side.

As shown in FIG. 7, in the second cooling unit 42, the heat transfer coefficient decreases as the number of laminated stages of the plurality of cooling pipes 421 increases. The first stage in the figure is the most upstream cooling pipe 421 in contact with the power card PC1, and from the second stage onward, the larger the number, the downstream cooling pipe 421. At this time, the heat transfer coefficient is better in the cooling pipe 421 on the upstream side where the flow velocity and the flow rate increase than in the cooling pipe 421 on the downstream side where the flow velocity and the flow rate decrease, and the cooling performance in the semiconductor laminated unit U is a power card. The PC1 side is better. In the power card PC1 and PC2 of the converter unit 2, the cooling performance with respect to the power card PC1 on the upstream side becomes better.

In this way, the cooling unit 4 is connected to the first reactor L1 and the second reactor L2 in the first cooling unit 41 and the power cards PC1 and PC2 in the second cooling unit 42, respectively, and both are converters. It is preferable to arrange the parts 2 in the order in which they are driven so that the cooling performance is good. That is, by arranging the power card PC1 connected to the first reactor L1 of the first converter 21 on the upstream side of the power card PC2 connected to the second reactor L2 of the second converter 22, it is driven first. The cooling efficiency of the first converter 21 is further increased. Then, by combining the first cooling unit 41 and the second cooling unit 42, the first converter 21 is effectively cooled to further reduce the loss, and efficient power conversion becomes possible.

As shown in FIG. 8, the inductance-DC current characteristics (that is, DC superimposition characteristics) of the first reactor L1 and the second reactor L2 are affected by the cooling performance by the cooling unit 3. As described above, when the first converter 21 and the second converter 22 use the first reactor L1 and the second reactor L2 having the same inductance characteristics, the rate at which the inductance value decreases due to the increase in direct current (that is,). , The slope of the DC superimposition characteristic) is the same, but the characteristic line of the first reactor L1 on the low temperature side shifts to the higher inductance side than the characteristic line of the second reactor L2 on the high temperature side.

As shown in FIG. 9, the currents IL1 and IL2 flowing through the first reactor L1 and the second reactor L2 are accompanied by the on / off of the semiconductor switching elements S1 to S4 while the first converter 21 and the second converter 22 are boosted. It becomes a triangular wave that increases and decreases. Further, the currents IL1 and IL2 include a ripple component, and the magnitude of the ripple component is inversely proportional to the inductance of the first reactor L1 and the second reactor L2. That is, the larger the inductance, the smaller the ripple component, and the higher inductance first reactor L1 has more switching loss (for example, switching loss Eon when on and switching loss Eoff when off) than the second reactor L2. ) Can be reduced.

Further, as shown in FIG. 10, the resistance temperature characteristic generally decreases as the temperature decreases. Since the resistance of the first reactor L1 on the low temperature side is also small, the loss is further reduced. As a result, when the converter unit 2 is driven in one phase, the first converter 21 is selected and the cooling unit 3 efficiently cools the converter unit 2, so that the loss can be greatly reduced.

In this embodiment, the first converter 21 of the converter unit 2 is arranged on the side where the cooling performance is better, but of course, it can be arranged so that the cooling performance of the second converter 22 is better. In that case, the control unit 3 first selects and drives the second converter 22.

Next, the details of the control unit 3 will be described. In FIG. 3, the control unit 3 includes an MG-ECU 31 that controls voltage conversion operations in the converter unit 2 and the inverter unit 5 to control the drive of the motor generators MG1 and MG2, and the motor generators MG1, MG2 and the engine ENG. It has an HV-ECU 32 that controls the entire operation of the hybrid vehicle. The HV-ECU 32 acquires information on the motor generators MG1, MG2, the engine ENG, etc. based on the signals from various detection devices, outputs the drive signals of the motor generators MG1 and MG2 to the MG-ECU 31, and outputs the engine ENG. Drive.

The MG-ECU 31 has a detection signal from a current sensor 61 that detects the current IL1 flowing through the first reactor L1 of the first converter 21 and a current sensor 62 that detects the current IL2 flowing through the second reactor L2 of the second converter 22. Is entered. Further, between the converter unit 2 and the smoothing capacitor 14, a detection signal from the voltage sensor 63 that detects the voltage VH between the positive electrode side power line 11 and the negative electrode side power line 12 is input. Further, information such as the rotation speeds of the motor generators MG1 and MG2 is input from a detection device (not shown).

The HV-ECU 32 determines the operating state of the hybrid vehicle based on the detection signal of the MG-ECU 31 and a signal from a detection device (not shown), for example, a signal such as an accelerator opening degree and a vehicle speed, and the motor generators MG1, MG2 and Adjust the power of the engine ENG. For example, when the hybrid vehicle is traveling, it is possible to travel mainly by the motor generator MG2, by the engine ENG, and by the engine ENG and the motor generator MG2. The HV-ECU 32 calculates the torque command values of the motor generators MG1 and MG2 based on the adjusted power, and outputs the torque command values to the MG-ECU 31.

The MG-ECU 31 calculates the power to be output to the motor generators MG1 and MG2 (hereinafter referred to as the required power Pr) based on the input torque command value and information such as the rotation speed, and the converter unit 2 and the inverter. A control signal for driving the unit 5 is generated. Specifically, it is determined whether or not the first converter 21 and the second converter 22 of the converter unit 2 need to be driven according to the required power Pr, and the first converter 21 or the first converter 21 and the second converter 22 are used. For example, a signal for PWM (that is, pulse width modulation) control is output. Further, a signal for PWM control is output to the first inverter 51 and the second inverter 52 of the inverter unit 5 so that the output torque corresponding to the torque command value can be obtained.

An example of the control procedure of the converter unit 2 executed by the MG-ECU 31 will be described with reference to the flowchart of FIG. First, in step 101, when the required power Pr is acquired, then in step 102, it is determined whether or not the required power Pr is lower than the reference value Pth (that is, Pr <Pth?). The reference value Pth is set in advance, and is used as a reference for determining whether or not one phase of the converter unit 2 can be stopped under operating conditions where the required power Pr is relatively small, for example, in urban areas or constant speed driving. Become.

When the affirmative determination is made in step 102 (that is, Pr <Pth), the process proceeds to step 103, and one of the converter units 2 having a good cooling performance, that is, the first converter 21 is selected. Subsequently, in step 104, a boosting operation is performed by the first converter 21 so that the required power Pr can be obtained, and the voltage is output to the positive electrode wire 15 on the inverter section 5 side. Specifically, for example, the target voltage VH0 after boosting in the first converter 21 is set according to the required power Pr, and the boost ratio VH0 / VB with respect to the voltage VB of the power storage device B of the first converter 21. The target current IL0 of the first reactor L1 is set. Then, the current is controlled so that the current IL1 flowing through the first reactor L1 becomes the target current IL0 according to the step-up ratio VH0 / VB.

As a result, a gate voltage signal is output to the semiconductor switching elements S1 and S2 of the first converter 21 at a predetermined timing based on the PWM signal, and the semiconductor switching elements S1 and S2 are alternately turned on and off to obtain a desired required power Pr. It is output.

In step 103, the second converter 22 that is not selected is stopped. Alternatively, the current is controlled so that the current IL2 = 0.

When the negative determination is made in step 102 (that is, Pr ≧ Pth), the process proceeds to step 105. In step 105, both the first converter 21 and the second converter 22 are selected. Subsequently, in step 106, a boosting operation is performed by the first converter 21 and the second converter 22 so that the required power Pr can be obtained, and the voltage is output to the positive electrode wire 15 on the inverter section 5 side. In this case, for example, the boosting operation by the first converter 21 and the second converter 22 is evenly performed according to the required power Pr.

Specifically, the current flowing through the first reactor L1 and the second reactor L2 so that the target current IL0 corresponding to the step-up ratio VH0 / VB is evenly distributed to the two phases of the first converter 21 and the second converter 22. IL1 and IL2 can be controlled. As shown in FIG. 8, the smaller the currents IL1 and IL2 flowing through the first reactor L1 and the second reactor L2, the larger the inductance value. Therefore, the loss is suppressed by appropriately distributing the currents IL1 and IL2. It will be possible to do.

As described above, in the small current region where the required power Pr is small, the first converter 21 is selected and the second converter 22 is stopped, paying attention to the cooling performance of the converter unit 2, so that the cooling unit 4 first uses the cooling unit 4. The boosting operation can be performed while efficiently cooling the converter 21. Further, even when the required power Pr is larger, the boosting operation can be performed while suppressing the loss by controlling the current flowing through each of the first converter 21 and the second converter 22. Therefore, the switching loss and the conduction loss associated with the step-up operation can be minimized, and the voltage conversion efficiency can be improved.

(Embodiment 2)
The second embodiment according to the power conversion device will be described with reference to FIGS. 12 to 13. The basic configuration of the power conversion device 1 of this embodiment is the same as that of the reference embodiment 1, and the configuration of the cooling unit 4, which is a difference, will be mainly described below. In the above reference embodiment 1 , the first reactor L1 is arranged on the upstream side with respect to the refrigerant flow direction F of the first cooling unit 41 so that the cooling performance is better than that of the second reactor L1, but the cooling medium. By increasing the heat transfer coefficient with, the cooling performance may be improved.
Of the codes used in the second and subsequent embodiments, the same reference numerals as those used in the above-mentioned reference embodiments and embodiments are the same components as those in the above-mentioned reference embodiments and embodiments, unless otherwise specified. Represents.

As shown in FIG. 12, the first cooling unit 41 for cooling the converter unit 2 has a cooling medium flow path 411 in the wall surface portion 412 in contact with the first reactor L1 and the second reactor L2. In the flow path 411, a corrugated plate-shaped fin 414 is arranged at a position directly below the mounting surface 413 of the first reactor L1. As a result, the heat transfer coefficient with the cooling medium can be increased, and the cooling performance on the first reactor L1 side can be further enhanced.

In this case, it is not always necessary to configure the flow path 411 so that the first reactor L1 is on the upstream side, and the first reactor L1 and the second reactor L2 are arranged in parallel with respect to the flow path 411. May be good. At this time, a flow path surrounded by the peaks and valleys of the corrugated plate-shaped fins 414 is formed on the first reactor L1 side, and the cooling medium flows along the fins 414.

The fins 414 can have any shape, and for example, as shown in FIG. 13, a plurality of fins 414 extending in the refrigerant flow direction F of the flow path 411 can be arranged. Also in this case, the first reactor L1 and the second reactor L2 are arranged in parallel with respect to the flow path 411, and one side surface (for example, the lower side surface in the figure) facing from one side surface (for example, the upper side surface in the figure) side. The flow path 411 is configured so that the cooling medium flows toward the direction.

By providing the fins 414, the cooling performance of the first reactor L1 can be improved regardless of the flow direction. Then, when the converter unit 2 is driven in one phase by the control unit 3, the first converter 21 is selected to control the boosting operation, so that the cooling performance is selected in the order of good cooling performance as in the reference embodiment 1. With such a configuration, the cooling performance of the first reactor L1 located on the upstream side in the refrigerant flow direction F can be further enhanced, and the loss reduction effect can be improved.

In the configuration provided with the fins 414, the first reactor L1 may be arranged so as to be on the upstream side. For example, in FIG. 13, a partition wall is provided between the first reactor L1 and the second reactor L2 so that the cooling medium flows to the second reactor L2 side after passing through the first reactor L1 side. Can also be configured .

(Embodiment 3)
As shown in the third embodiment in FIG. 14, in the configuration of the second embodiment in which the fins 414 are provided in the first cooling unit 41 in the reference embodiment 1 (see, for example, FIGS. 2 and 12 ), the first reactor L1 and the first reactor L1 and the first 2 Another heat generating component 71 cooled by the first cooling unit 41 may be arranged in the vicinity of the reactor L2. In that case, the first reactor L1 is arranged on the most upstream side of the flow path 411, the heat generating component 71 is arranged on the most downstream side, the second reactor L2 is sandwiched, and the first reactor L1 is farther from the heat generating component 71. It is good to make it a position. The basic configuration of the power conversion device 1 of this embodiment is the same as that of the reference embodiment 1, and the description thereof will be omitted.

According to this configuration, when the first converter 21 is driven in one phase by the control unit 3, it is located on the opposite side of the heat generating component 71 with the second reactor L2 to be stopped, so that the heat generating component 71 is used. The heat reception can be eliminated. As a result, the cooling performance of the first reactor L1 can be further enhanced, and the effect of reducing loss can be improved.

(Embodiment 4)
As shown in FIG. 15 as the fourth embodiment, the configuration of the flow path 411 for cooling the first reactor L1 and the second reactor L2 in the first cooling unit 41 (see, for example, FIG. 12) is particularly limited. Instead, it may be configured so that the cooling performance with respect to the first reactor L1 is better. Specifically, the space portion to be the flow path 411 is opened only on one end (for example, the left end in the figure) side of the wall surface portion 412, and the space portion is from the open end to the closed end (for example, the right end in the figure). A partition wall 415 along the refrigerant flow direction F is provided in the vicinity. As a result, as shown by the arrow in the figure, the cooling medium is introduced into the flow path 411 from the introduction port 411a on the open end side, and is folded back on the closed end side toward the outlet port 411b, which is a U-shaped flow path. 411 is formed.

In this case, the first reactor L1 may be arranged, for example, in the central portion of the mounting surface 413. The second reactor L2 may be arranged on the closed end side of the flow path 411, for example, a part of the second reactor L2 may be located outside the closed end of the flow path 411. At this time, the area of the flow path 411 in contact with the first reactor L1 is larger than the area of the flow path 411 in contact with the second reactor L2.

In this way, by increasing the contact area with the flow path 411, the heat transfer coefficient can be increased, so that the cooling performance of the first reactor L1 arranged on the side having the larger contact area is further improved. be able to.

For example, as shown in FIG. 16, when the wall thickness of the partition wall 415 in the flow path 411 is configured to increase toward the introduction port 411a and the outlet port 411b of the flow path 411, the flow path 411 The area of the mounting surface 413 in contact with the opening surface becomes smaller on the opening end side. In this case, the first reactor L1 may be arranged at the central portion of the mounting surface 413, and the second reactor L2 may be arranged on the open end side of the flow path 411. As a result, the contact area on the first reactor L1 side becomes larger and the heat transfer coefficient becomes higher, so that the same effect can be obtained.

(Embodiment 5)
As shown in the fifth embodiment in FIG. 17, the power conversion device 1 can also configure the first converter 21 and the second converter 22 of the converter unit 2 by using two arms connected in parallel, respectively. Specifically, a third arm 212 including a series connector of semiconductor switching elements S5 and S6 having the same configuration is connected in parallel to the first arm 211 of the first converter 21, and a boosting operation is performed by the first reactor L1. .. Similarly, a fourth arm 222 including a series connector of semiconductor switching elements S7 and S8 having the same configuration is connected in parallel to the second arm 221 of the second converter 22, and a boosting operation is performed by the second reactor L2. Diodes D5, D6, D7, and D8 are connected in antiparallel to the semiconductor switching elements S5, S6, S7, and S8, respectively.

When the required power Pr in the control unit 3 is large and the converter unit 2 has a large output, the current distributed to the first converter 21 and the second converter 22 is distributed to the two arms 211, 212, 211 and 222, respectively. , Can be further distributed and output.

In this case, as shown in FIG. 18, in the second cooling unit 42, it is preferable to determine the arrangement of the first arm 211 and the third arm 212 constituting the first converter 21 in consideration of the cooling performance. .. In the figure, the second cooling unit 42 includes a semiconductor laminated unit U housed in the upper half of the metal case C, and a control circuit board constituting the control unit 3 is arranged above the semiconductor laminated unit U. .. In the lower half of the case C, the first reactor L1 and the second reactor L2 are housed in contact with the first cooling portion 41 at the bottom of the case. The first cooling unit 41 forms a flow path 411 for the cooling medium inside the wall surface portion 412 including the mounting surface 413 of the first reactor L1 and the second reactor L2.

In the semiconductor laminated unit U, for example, the power card PC1 corresponding to the first arm 211 of the first converter 21 and the power card PC6 corresponding to the third arm 212 are arranged adjacent to each other with the cooling pipe 421 interposed therebetween. In the semiconductor laminated unit U, the power card PC1 is located on one end side (for example, the left end side in the figure) to which the lead-in cooling tubes 422 and 423 are connected, and the power card PC6 is located downstream thereof. PC1 and PC6 are connected to the first reactor L1 located below.

The power card PC2 corresponding to the second arm 221 of the second converter 22 and the power card PC7 corresponding to the fourth arm 222 are arranged on the downstream side of the power card constituting the inverter section 5 and are arranged downward. It is connected to the second reactor L2 located.

According to this configuration, the first reactor L1 and the power cards PC1 and PC6 are effectively cooled by the first cooling unit 41 and the second cooling unit 42, so that the cooling performance of the first converter 21 by the cooling unit 4 can be improved. It will be possible to maximize the loss and further reduce the loss.

Further, as shown in FIG. 19, the vehicle system 10 to which the power conversion device 1 is applied may be configured to include two power storage devices B1 and B2. The power storage device B1 is connected to the first converter 21 via the filter capacitor 11a, and the power storage device B2 is connected to the second converter 22 via the filter capacitor 11b. The filter capacitor 11a is arranged between the positive electrode side power line 13a and the negative electrode side power line 14a of the power storage device B1, and the filter capacitor 11b is arranged between the positive electrode side power line 13b and the negative electrode side power line 14b of the power storage device B2. Will be done.

(Embodiment 6)
As shown as the sixth embodiment in FIG. 20, the inverter unit 5 connected to the converter unit 2 drives the motor generator MG3 in addition to the first inverter 51 and the second inverter 52 for driving the motor generators MG1 and MG2. A third inverter 56 can also be provided. The third inverter 56 has a third U phase arm 561, a third V phase arm 562, and a third W phase arm 563, and has a positive electrode side power line 15 and a negative electrode side power line 16 in parallel with the first inverter 51 and the second inverter 52. Are connected in parallel between.

The configurations of the arms 561 to 563 of the third inverter 56 are the same as those of the first inverter 51 and the second inverter 52, and the description thereof will be omitted. The motor generator MG3 is connected to the third inverter 56 via power lines 533, 543, 552, and is used as a power source for, for example, an engine auxiliary machine.

The converter unit 2 has a first converter 21 to which the first arm 211 is connected to the first reactor L1 and a second converter 22 to which the second arm 221 is connected to the second reactor L2. At this time, in the above embodiment, the power card PC 1 including the first arm 211 and the power card PC 2 including the second arm 221 are arranged in consideration of the cooling performance to reduce the loss. The loss characteristics of the semiconductor element used may be taken into consideration.

For example, the first arm 211 is composed of semiconductor elements such as semiconductor switching elements S1 and S2 and diodes D1 and D2. The losses of the semiconductor switching elements S1 and S2 generally include the switching loss Eon when on and the switching loss Eoff when off, as well as the conduction loss Von during on operation, and the loss of the diodes D1 and D2 includes the recovery loss. There is a conduction loss Vf during Err and ON operation. Therefore, by combining semiconductor devices having smaller characteristics within the required characteristic range, for example, the loss characteristic in the first arm 211 is made better than the loss characteristic in the second arm 221. Can be done.

As described above, the first converter 21 can be configured by connecting the first arm 211 having good loss characteristics to the first reactor L1 having good cooling performance by the first cooling unit 41. Then, by selecting the first converter 21 when the control unit 3 is driven in one phase, it is possible to realize low loss by reducing the cooling performance by the cooling unit 4 and the loss characteristic of the semiconductor element itself. At this time, for example, the cooling performance of the first arm 211 and the second arm 221 by the second cooling unit 42 may be taken into consideration, and further loss reduction becomes possible.

(Embodiment 7)
As shown in FIGS. 21 and 22, in the configuration of the cooling unit 4 in the fifth embodiment (see, for example, FIG. 18), for example, the lower half of the case C is affected by electrical noise. It is also possible to configure the structure in which the electronic component 72 is arranged. The first reactor L1 and the second reactor L2 are arranged in contact with the first cooling portion 41 at the bottom of the case, and the electronic component 72 is arranged adjacent to them. The electronic component 72 is not particularly limited, but is, for example, a DC-DC converter for driving an engine auxiliary machine or the like.

The first cooling unit 41 forms, for example, a U-shaped cooling medium flow path 411 inside the wall surface portion 412 including the mounting surface 413 of the first reactor L1 and the second reactor L2. In this case, the first reactor L1 is arranged on the most upstream side of the flow path 411, the electronic component 72 is arranged on the most downstream side, the second reactor L2 is sandwiched, and the first reactor L1 is farther from the electronic component 72. It is good to make it a position. The electronic component 72 is placed on the mounting surface 413 so that a part of the electronic component 72 is in contact with the flow path 411.

According to this configuration, when the first converter 21 is driven in one phase by the control unit 3, the electronic component 72 is adjacent to the second reactor L2 to be stopped, so that the electric component 72 is electrically accompanied by the drive of the first reactor L1. It is possible to suppress the transmission of noise to the electronic component 72. As a result, the loss of the power conversion device 1 can be reduced, and the vehicle system including the power conversion device 1 can be operated satisfactorily.

The configuration of this embodiment may be applied to any of the above embodiments. Further, the configurations of the above embodiments may be combined, and for example, as shown in the sixth embodiment, the inverter section 5 has the first inverter 51 and the second inverter for driving the motor generators MG1, MG2, and MG3. 52. In the configuration provided with the third inverter 56 (that is, see FIG. 19), the converter unit 2 connected to the inverter unit 5 is provided with the first converter 21 and the second converter 22 as shown in the fifth embodiment. , Each may have two arms connected in parallel (ie, see FIG. 17).

The present invention is not limited to each of the above embodiments, and can be applied to various embodiments without departing from the gist thereof. For example, in each of the above embodiments, the hybrid vehicle has been described as an example, but the present invention is not limited to this, and for example, it can be applied to any electric vehicle capable of traveling by a motor such as an electric vehicle. Further, although the power supply is a power storage device capable of charging and discharging and the converter unit is configured to use a buck-boost converter, a power source capable of only discharging can be used and the converter unit can be configured as a boost converter.

B, B1, B2 power supply (power storage device)
MG1, MG2, MG3 motor generator (load)
L1 1st reactor (reactor)
L2 2nd reactor (reactor)
S1 to S8 Semiconductor switching element 1 Power converter 2 Converter section 21 First converter (converter)
22 Second converter (converter)
3 Control unit 4 Cooling unit

Claims (9)

The converter unit (2) connected between the power supply (B, B1, B2) and the load (MG1, MG2, MG3), the control unit (3) that controls the drive of the converter unit, and the cooling unit (4). ), Which is a power conversion device (1).
The converter unit has a multi-phase converter (21, 22) connected in parallel, and the converters have a reactor (L1, L2) and a semiconductor switching element (S1, S2, S3, S4, S5, respectively). It is configured to include S6, S7, S8), and the cooling unit includes a flow path (411) through which a cooling medium for cooling the reactor flows .
The control unit drives one or more of the plurality of phases of the converter in response to the power requirement, and the driven converter has a higher heat transfer coefficient between the reactor and the cooling medium, and the heat transfer coefficient is higher with respect to the reactor. A power converter that selects in order of best cooling performance. The power conversion according to claim 1, wherein the control unit sequentially selects from the converter in which the reactor is located on the upstream side with respect to the flow of the cooling medium when driving one or more phases of the converter. Device. The cooling unit cools the heat generating component (71) arranged along the flow path together with the reactor, and the reactor is arranged at a position farther from the heat generating component in the order selected by the control unit. , The power conversion device according to claim 1 or 2 . The power conversion device according to any one of claims 1 to 3, wherein the flow path is formed in a wall surface portion (412) in contact with the reactor in the case (C) in which the converter portion is housed. .. The power conversion according to any one of claims 1 to 4, wherein the multi-phase converter has a configuration in which the cooling performance for the semiconductor switching element is improved in the order of the cooling performance for the reactor. Device. The power conversion device according to claim 5 , wherein the cooling unit includes a plurality of cooling pipes (421) through which a cooling medium for cooling the semiconductor switching element is circulated . The converter unit has a plurality of power cards (PC1, PC2, PC6, PC7) including the semiconductor switching element corresponding to the converter having a plurality of phases, and the cooling tube is a plurality of power cards, respectively. The power conversion device according to claim 6, which is arranged in contact with . The power conversion according to any one of claims 1 to 7 , wherein the multi-phase converter has a configuration in which the loss characteristics of the semiconductor switching element become better in the order of better cooling performance with respect to the reactor. Device. An electronic component (72) is arranged side by side with the reactor adjacent to the cooling unit, and the reactor is arranged at a position farther from the electronic component in the order selected by the control unit. Item 6. The power conversion device according to any one of Items 1 to 8.

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