JP7037474B2 - Illuminator - Google Patents

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JP7037474B2
JP7037474B2 JP2018228858A JP2018228858A JP7037474B2 JP 7037474 B2 JP7037474 B2 JP 7037474B2 JP 2018228858 A JP2018228858 A JP 2018228858A JP 2018228858 A JP2018228858 A JP 2018228858A JP 7037474 B2 JP7037474 B2 JP 7037474B2
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circuit board
light
partition wall
illumination device
light emitters
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JP2020091410A (en
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剛忠 池田
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Alpine Electronics Inc
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Alpine Electronics Inc
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Description

本発明は、照光装置に関し、例えば、車載機器の操作パネルの操作スイッチの照光装置に関する。 The present invention relates to an illuminating device, for example, an illuminating device for an operation switch of an operation panel of an in-vehicle device.

この種の照光装置として、例えば下記特許文献1に記載のものが知られている。この特許文献1には、回路基板に実装された発光ダイオードと、発光ダイオードの周囲を囲む筒状の仕切壁と、発光ダイオードの前方側に配置され発光ダイオードの発光により透過する透過部が設けられた前面部材と、を備えた照光装置が記載されている。 As an illumination device of this type, for example, the one described in Patent Document 1 below is known. This Patent Document 1 is provided with a light emitting diode mounted on a circuit board, a tubular partition wall surrounding the light emitting diode, and a transmissive portion arranged on the front side of the light emitting diode and transmitted by light emission of the light emitting diode. A front member and a lighting device including the front member are described.

特開2010-271557号公報Japanese Unexamined Patent Publication No. 2010-271557

上述したような照光装置においては、1つの発光ダイオードで1つの透過部を照明する構成であり、透過部の中心が明るく周辺が暗くなり、輝度ムラが生じてしまうという問題点がある。また、熱が集中するという問題点がある。別の構成として、複数の発光ダイオードを分散配置して1つの透過部を照明する構成も考えられる。これによれば熱の集中と輝度ムラは軽減できる。しかし、遮光部で光が吸収され、光の利用効率が下がってしまうという問題点がある。 In the illumination device as described above, one light emitting diode illuminates one transmissive portion, and there is a problem that the center of the transmissive portion is bright and the periphery is dark, resulting in uneven brightness. In addition, there is a problem that heat is concentrated. As another configuration, a configuration in which a plurality of light emitting diodes are dispersedly arranged to illuminate one transmissive portion is also conceivable. According to this, heat concentration and uneven brightness can be reduced. However, there is a problem that the light is absorbed by the light-shielding portion and the utilization efficiency of the light is lowered.

本発明はこのような点に鑑みなされたもので、透過部の輝度ムラを低減させ、発光体の熱の集中を防ぎ、光の利用効率を高めることが可能な照光装置を提供することを目的とする。 The present invention has been made in view of such a point, and an object of the present invention is to provide an illumination device capable of reducing luminance unevenness of a transmitting portion, preventing heat concentration of a light emitter, and increasing light utilization efficiency. And.

所定の位置に透過部を有する前面部材と、前記透過部に対向して前記前面部材の裏面側から前記透過部を照明する複数の発光体と、複数の前記発光体の各々を実装した回路基板と、複数の前記発光体の全てを囲む1対の仕切壁と、を備えた照光装置であって、複数の前記発光体は、前記透過部の外形の最大幅より広い範囲で分散配置され、前記仕切壁の内壁は、反射処理が施され、前記前面部材から前記回路基板に広がる方向に傾斜を持たせ、前記回路基板は、前記発光体の周囲に反射処理が施され、一対の前記仕切壁により形成される前記前面部材側に位置する開口部は、上方から見たとき、透過部を内側に含んだものである。 A circuit board on which each of a front member having a transmissive portion at a predetermined position, a plurality of light emitters facing the transmissive portion and illuminating the transmissive portion from the back surface side of the front member, and the plurality of light emitters are mounted. A lighting device including a pair of partition walls surrounding all of the light emitting bodies, and the plurality of the light emitting bodies are distributed and arranged in a range wider than the maximum width of the outer shape of the transmitting portion. The inner wall of the partition wall is subjected to reflection treatment to be inclined in a direction extending from the front member to the circuit board, and the circuit board is subjected to reflection treatment around the light emitting body to form a pair of the partitions. The opening located on the front member side formed by the wall includes the transmissive portion inside when viewed from above.

透過部の透過輝度をほぼ均一化させ、発光体の熱の集中を防ぎ、さらに光の利用効率を高めることができる。 It is possible to make the transmitted brightness of the transmitting portion substantially uniform, prevent heat concentration of the light emitter, and further improve the efficiency of light utilization.

本発明の第1実施形態と第2実施形態とを示す照光装置の正面図である。It is a front view of the illumination apparatus which shows 1st Embodiment and 2nd Embodiment of this invention. 第1実施形態における照光装置の断面図(図1におけるA-A断面)である。It is sectional drawing (AA cross section in FIG. 1) of the illumination apparatus in 1st Embodiment. 第1実施形態における照光装置の分解斜視図である。It is an exploded perspective view of the illumination device in 1st Embodiment. 光学シミュレーション結果の表である。It is a table of optical simulation results. 第2実施形態における照光装置の断面図(図1におけるA-A断面)である。It is sectional drawing (AA cross section in FIG. 1) of the illumination apparatus in 2nd Embodiment. 第2実施形態における照光装置の分解斜視図である。It is an exploded perspective view of the illumination device in 2nd Embodiment.

本発明の第1実施形態を図1から図3に基づいて説明する。 The first embodiment of the present invention will be described with reference to FIGS. 1 to 3.

照光装置は、回路基板1に実装された複数の発光体3と、この複数の発光体3の周囲を囲む仕切壁4と、複数の発光体3の前方側に配置され複数の発光体3の発光により透過する透過部5が設けられた前面部材6と、を備えている。 The illumination device includes a plurality of light emitters 3 mounted on the circuit board 1, a partition wall 4 surrounding the plurality of light emitters 3, and a plurality of light emitters 3 arranged on the front side of the plurality of light emitters 3. It includes a front member 6 provided with a transmissive portion 5 that transmits light.

前面部材6は、例えば光透過性の合成樹脂(例えばポリカーボネート樹脂)からなるシート基材6Aの表面側に、不透過性の遮光層6Bを抜き印刷することによって車載音響装置の作動状態を表す透過部5を形成し、不透過性の遮光層6Bの表面側に無色透明な保護層6Cを印刷したものである。なお、印刷による表示内容は、図示したものに限ったものではなく、操作内容や機器の種類によって異なるものである。 The front member 6 represents the operating state of the in-vehicle acoustic device by punching out and printing the impermeable light-shielding layer 6B on the surface side of the sheet base material 6A made of, for example, a light-transmitting synthetic resin (for example, polycarbonate resin). Part 5 is formed, and a colorless and transparent protective layer 6C is printed on the surface side of the impermeable light-shielding layer 6B. It should be noted that the display content by printing is not limited to the one shown in the figure, but differs depending on the operation content and the type of device.

複数の発光体3(例えばLED)は、透過部5に対向するように、各々の発光体(第1の発光体3Aおよび第2の発光体3Bおよび第3の発光体3C)の間に間隔をあけて設けられる。また、複数の発光体3の分散配置の幅W3は、透過部5の外形の最大幅W1より大きいものである。なお、本実施形態においては、発光体の数を3個としているが、発光体の数は2個以上であれば何個でもよい。また、本実施形態においては、透過部5を回路基板1上に投影した時、投影された透過部5の外形より外側に配置される発光体の数を2個としているが、投影された透過部5の外形より外側に配置される発光体の数は1個以上であれば何個でもよい。 The plurality of illuminants 3 (for example, LEDs) are spaced between each illuminant (first illuminant 3A and second illuminant 3B and third illuminant 3C) so as to face the transmissive portion 5. It is provided with an opening. Further, the width W3 of the distributed arrangement of the plurality of light emitters 3 is larger than the maximum width W1 of the outer shape of the transmissive portion 5. In the present embodiment, the number of light emitting bodies is three, but the number of light emitting bodies may be any number as long as it is two or more. Further, in the present embodiment, when the transmissive portion 5 is projected onto the circuit board 1, the number of light emitters arranged outside the outer shape of the projected transmissive portion 5 is two, but the projected transmissive portion is used. The number of light emitters arranged outside the outer shape of the portion 5 may be any number as long as it is one or more.

仕切壁4は、反射率が高く遮光性のある白色の合成樹脂からなり、前面部材6と回路基板1の間に、前面部材6から回路基板1に広がる方向に傾斜を持たせる。また、仕切壁4の前面部材6側に位置する開口部の幅W2は、透過部5の外形の最大幅W1より大きく、発光体3の分散配置の幅W3より小さいものである。また、上方から見たとき、開口部は透過部を内側に含むものである。 The partition wall 4 is made of a white synthetic resin having high reflectance and light-shielding property, and has an inclination between the front member 6 and the circuit board 1 in a direction extending from the front member 6 to the circuit board 1. Further, the width W2 of the opening located on the front member 6 side of the partition wall 4 is larger than the maximum width W1 of the outer shape of the transmissive portion 5 and smaller than the width W3 of the distributed arrangement of the light emitters 3. Further, when viewed from above, the opening includes the transmissive portion inside.

回路基板1は、発光体3の周囲を白色の塗料で塗布し、回路基板上に白色の塗料の層2を形成することで反射率を高めたものである。 In the circuit board 1, the periphery of the light emitting body 3 is coated with a white paint, and a layer 2 of the white paint is formed on the circuit board to increase the reflectance.

このように構成された照光装置の透過部5は、複数の発光体3が発光すると、光が前面部材6側に向かい、透過照明される。前面部材6側に向かった光には、直接シート基材6Aを通り抜けて透過照明する光と、仕切壁4の内壁と回路基板1の上の白い塗料の層2とで光の反射を繰り返した後にシート基材6Aを通り抜けて透過照明する光とがある。 When the plurality of light emitting bodies 3 emit light, the transmissive portion 5 of the illumination device configured in this way directs the light toward the front member 6 side and is transilluminated. The light directed toward the front member 6 was repeatedly reflected by the light transmitted directly through the sheet base material 6A and transmitted and illuminated, and the inner wall of the partition wall 4 and the layer 2 of the white paint on the circuit board 1. Later, there is light that passes through the sheet base material 6A and is transmitted and illuminated.

光の反射を繰り返した後に透過照明する光は、反射を繰り返すことで光が拡散し、透過部5の透過輝度が均一化される。 The light transmitted and illuminated after repeated reflections of light is diffused by repeating the reflections, and the transmitted brightness of the transmitting portion 5 is made uniform.

このように、回路基板1に実装された複数の発光体3と、複数の発光体3の周囲を囲むように配置される仕切壁4と、複数の発光体3の前方側に配置され複数の発光体3の発光により透過する透過部5が設けられた前面部材6と、を備えた照光装置において、複数の発光体3の分散配置の幅W3を透過部5の外形の幅W1より大きくし、仕切壁4を反射率が高い樹脂とし前面部材6から回路基板1に広がる方向に傾斜を持たせ、回路基板1の複数の発光体3の周囲を白い塗料で覆って白色の塗料の層2を回路基板1上に形成し、仕切壁4の前面部材6側に位置する開口部の幅W2は、透過部5の外形の最大幅W1より大きく、複数の発光体3の分散配置の幅W3より小さくし、かつ、上方から見たとき開口部は透過部5を内側に含むものとしたことにより、透過部5を照明する光には、直接シート基材6Aを通り抜けて透過照明する光の他に、仕切壁4の内壁と、回路基板1の上の白い塗料の層2と、で光の反射を繰り返し拡散した後に、シート基材6Aを通り抜けて透過照明する光が加わり、透過部5の透過輝度をほぼ均一化させ、さらに光の利用効率を高めることができる。また、熱の集中も防ぐことができる。 In this way, the plurality of light emitters 3 mounted on the circuit board 1, the partition wall 4 arranged so as to surround the periphery of the plurality of light emitters 3, and the plurality of light emitters 3 arranged on the front side of the plurality of light emitters 3. In the illumination device provided with the front member 6 provided with the transmissive portion 5 transmitted by the light emitted from the light emitting body 3, the width W3 of the distributed arrangement of the plurality of light emitters 3 is made larger than the width W1 of the outer shape of the transmissive portion 5. The partition wall 4 is made of a resin having high reflectance and is inclined in a direction extending from the front member 6 to the circuit board 1, and the periphery of the plurality of light emitters 3 of the circuit board 1 is covered with white paint to cover the white paint layer 2. The width W2 of the opening located on the front member 6 side of the partition wall 4 is larger than the maximum width W1 of the outer shape of the transmissive portion 5, and the width W3 of the distributed arrangement of the plurality of light emitters 3 is larger than the maximum width W1. Since the opening is made smaller and the opening includes the transmitting portion 5 inside when viewed from above, the light that illuminates the transmitting portion 5 directly passes through the sheet base material 6A and is transmitted and illuminated. In addition, after the light reflection is repeatedly diffused by the inner wall of the partition wall 4 and the layer 2 of the white paint on the circuit board 1, the light that passes through the sheet base material 6A and is transmitted and illuminated is added, and the transmitting portion 5 is added. It is possible to make the transmitted brightness of the light substantially uniform and further improve the efficiency of light utilization. In addition, heat concentration can be prevented.

図4は仕切壁4の角度の有無と白い塗料の層2の有無による照度の差を光学シミュレーションで確認した結果である。光学シミュレーションのソフトはOPTIS社のSPEOSを用いた。 FIG. 4 shows the result of confirming the difference in illuminance between the presence / absence of the angle of the partition wall 4 and the presence / absence of the layer 2 of the white paint by optical simulation. The optical simulation software used was SPEOS from OPTIS.

図4に示すように、本実施形態例の白い塗料の層2と仕切壁4の傾斜があるパターンの場合、直接シート基材6Aを通り抜けて透過照明する光の他に、仕切壁4の内壁と、回路基板1の上の白い塗料の層2と、で光の反射を繰り返した光が透過部を照明する光に加わるため、他のパターンと比較し、照度が高い結果である。よって、本実施形態例は、光の利用効率を高めることができると言える。なお、白い塗料の層2がなく仕切壁4の傾斜があるパターンと、白い塗料の層2があり仕切壁4の傾斜がないパターンのものは、照度はほとんど変化していない。これに対して、両方の対策をしたパターンは、大幅な照度の上昇が見られる。 As shown in FIG. 4, in the case of a pattern in which the white paint layer 2 and the partition wall 4 of the present embodiment are inclined, in addition to the light transmitted directly through the sheet base material 6A and illuminating the partition wall 4, the inner wall of the partition wall 4 is used. And, since the light repeatedly reflected by the white paint layer 2 on the circuit board 1 is added to the light illuminating the transmission portion, the result is that the illuminance is higher than that of other patterns. Therefore, it can be said that the present embodiment can improve the efficiency of light utilization. It should be noted that the illuminance of the pattern in which the partition wall 4 is inclined without the layer 2 of the white paint and the pattern in which the partition wall 4 is not inclined with the layer 2 of the white paint are hardly changed. On the other hand, in the pattern with both measures, a significant increase in illuminance can be seen.

図1、図5、図6に基づいて本発明の第2実施形態を説明する。図5は第2実施形態における本照光装置の断面図である。第2実施形態における照光装置は、第1実施形態で回路基板1の上に形成される白い塗料の層2の代わりに、光反射率の高いフィラーを含有する樹脂材からなるカバー層7を有すること以外、第1実施形態と同様の構成を備える。なお、前記第1実施形態と同一箇所には同一符号を付し、第1実施形態と同様の機能部に関しては、説明を省略する。 A second embodiment of the present invention will be described with reference to FIGS. 1, 5, and 6. FIG. 5 is a cross-sectional view of the main illumination device according to the second embodiment. The illumination device in the second embodiment has a cover layer 7 made of a resin material containing a filler having a high light reflectance, instead of the layer 2 of the white paint formed on the circuit board 1 in the first embodiment. Other than that, it has the same configuration as that of the first embodiment. The same parts as those in the first embodiment are designated by the same reference numerals, and the description of the same functional parts as those in the first embodiment will be omitted.

回路基板1は、複数の発光体3の上を覆うようにして、反射率が高いカバー層7を回路基板1の上に配置することで反射率を高めたものである。 The circuit board 1 has a high reflectance by arranging a cover layer 7 having a high reflectance on the circuit board 1 so as to cover the plurality of light emitters 3.

このように構成された照光装置の透過部5は、複数の発光体3が発光すると、カバー層7を通り抜けた後に、前面部材6側に向かい、透過照明される。前面部材6側に向かった光には、直接シート基材6Aを通り抜けて透過照明する光と、仕切壁4の内壁と回路基板1の上のカバー層7とで光の反射を繰り返した後にシート基材6Aを通り抜けて透過照明する光とがある。 When the plurality of light emitting bodies 3 emit light, the transmissive portion 5 of the illumination device configured in this way passes through the cover layer 7 and then faces the front member 6 side and is transilluminated. For the light directed toward the front member 6, the light that directly passes through the sheet base material 6A and is transmitted and illuminated, and the light is repeatedly reflected by the inner wall of the partition wall 4 and the cover layer 7 on the circuit board 1, and then the sheet. There is light that passes through the base material 6A and is transmitted and illuminated.

光の反射を繰り返した後に透過照明する光は、反射を繰り返すことで光が散乱し、透過部5の透過輝度が均一化される。 The light transmitted and illuminated after repeated reflections of light is scattered by repeating the reflections, and the transmitted brightness of the transmitting portion 5 is made uniform.

このように、回路基板1に実装された複数の発光体3と、複数の発光体3の周囲を囲むように配置される仕切壁4と、複数の発光体3の前方側に配置され複数の発光体3の発光により透過する透過部5が設けられた前面部材6と、を備えた照光装置において、複数の発光体3の分散配置の幅W3を透過部5の外形の幅W1より大きくし、仕切壁4を反射率が高い樹脂とし前面部材6から回路基板1に広がる方向に傾斜を持たせ、発光体3の上を覆うようにして、反射率が高い樹脂材料で形成したカバー層7を回路基板1の上に配置し、仕切壁4の前面部材6側に位置する開口部の幅W2は、透過部5の外形の最大幅W1より大きく、複数の発光体3の分散配置の幅W3より小さくし、かつ、上方から見た時、開口部は透過部5を内側に含むものとしたことにより、透過部5を照明する光には、直接シート基材6Aを通り抜けて透過照明する光の他に、仕切壁4の内壁と、回路基板1の上のカバー層7と、で光の反射を繰り返し拡散した後に、シート基材6Aを通り抜けて透過照明する光が加わり、透過部5の透過輝度をほぼ均一化させ、さらに光の利用効率を高めることができる。また、熱の集中を防ぐことができる。 In this way, the plurality of light emitters 3 mounted on the circuit board 1, the partition wall 4 arranged so as to surround the periphery of the plurality of light emitters 3, and the plurality of light emitters 3 arranged on the front side of the plurality of light emitters 3. In the illumination device provided with the front member 6 provided with the transmissive portion 5 transmitted by the light emitted from the light emitting body 3, the width W3 of the distributed arrangement of the plurality of light emitters 3 is made larger than the width W1 of the outer shape of the transmissive portion 5. The partition wall 4 is made of a resin having a high reflectance, and the cover layer 7 is made of a resin material having a high reflectance so as to be inclined in a direction extending from the front member 6 to the circuit board 1 so as to cover the light emitting body 3. The width W2 of the opening located on the front member 6 side of the partition wall 4 is larger than the maximum width W1 of the outer shape of the transmissive portion 5, and the width of the distributed arrangement of the plurality of light emitters 3 is larger than the maximum width W1. Since it is smaller than W3 and the opening includes the transmitting portion 5 inside when viewed from above, the light that illuminates the transmitting portion 5 directly passes through the sheet base material 6A and is transmitted and illuminated. In addition to the light, the inner wall of the partition wall 4 and the cover layer 7 on the circuit board 1 repeatedly diffuse the reflection of the light, and then the light transmitted through the sheet base material 6A and illuminate the transmitted portion 5 is added. It is possible to make the transmitted brightness of the light substantially uniform and further improve the efficiency of light utilization. In addition, heat concentration can be prevented.

1 回路基板
2 白い塗料の層
3 複数の発光体
3A 第1の発光体
3B 第2の発光体
3C 第3の発光体
4 仕切壁
5 透過部
6 前面部材
6A シート基材
6B 不透過性の遮光層
6C 無色透明な保護層
7 カバー層
1 Circuit board 2 White paint layer 3 Multiple light emitters 3A First light emitter 3B Second light emitter 3C Third light emitter 4 Partition wall 5 Transmissive part 6 Front member 6A Sheet base material 6B Impermeable light shielding Layer 6C Colorless and transparent protective layer 7 Cover layer

Claims (5)

所定の位置に透過部を有する前面部材と、
前記透過部に対向して前記前面部材の裏面側から前記透過部を照明する複数の発光体と、
複数の前記発光体の各々を実装した回路基板と、
複数の前記発光体の全てを囲む1対の仕切壁と、を備えた照光装置であって、
複数の前記発光体は、前記透過部の外形の最大幅より広い範囲で分散配置され、
前記仕切壁の内壁は、反射処理が施され、前記前面部材から前記回路基板に広がる方向に傾斜を持たせ、
前記回路基板は、前記発光体の周囲に反射処理が施され、
一対の前記仕切壁により形成される前記前面部材側に位置する開口部は、複数の前記発光体の分散配置される幅より小さい幅であることを特徴とする照光装置。
A front member having a transmissive part at a predetermined position,
A plurality of light emitters facing the transmissive portion and illuminating the transmissive portion from the back surface side of the front member,
A circuit board on which each of the plurality of light emitters is mounted,
An illumination device comprising a pair of partition walls surrounding all of the plurality of light emitters.
The plurality of the light emitters are dispersedly arranged in a range wider than the maximum width of the outer shape of the transmissive portion.
The inner wall of the partition wall is subjected to a reflection treatment so as to have an inclination in a direction extending from the front member to the circuit board.
The circuit board is subjected to a reflection treatment around the light emitter, and the circuit board is subjected to a reflection treatment.
An illumination device having an opening formed by the pair of partition walls on the front surface member side and having a width smaller than the distributed width of the plurality of light emitters.
前記仕切壁の内壁は、前記仕切壁全体が光を反射する材料で形成されることで反射処理されることを特徴とする請求項1記載の照光装置。 The illumination device according to claim 1, wherein the inner wall of the partition wall is subjected to a reflection treatment by forming the entire partition wall with a material that reflects light. 前記仕切壁の内壁は、前記仕切壁の内壁を前記仕切壁の基材よりも反射率の高い反射部材で形成することで反射処理されることを特徴とする請求項1記載の照光装置。 The illumination device according to claim 1, wherein the inner wall of the partition wall is subjected to a reflection treatment by forming the inner wall of the partition wall with a reflective member having a higher reflectance than the base material of the partition wall. 前記回路基板は、前記回路基板の表面に前記回路基板の基材よりも反射率の高い塗料を塗布して覆うことで反射処理されることを特徴とする請求項1から3のいずれか1項記載の照光装置。 One of claims 1 to 3, wherein the circuit board is subjected to a reflection treatment by applying a coating material having a higher reflectance than the substrate of the circuit board to the surface of the circuit board to cover the surface of the circuit board. The illumination device described. 前記回路基板は、前記回路基板の表面に前記回路基板の基材よりも反射率の高い樹脂材料で形成したカバー層で前記発光体および前記回路基板を上から覆うことで反射処理されることを特徴とする請求項1から3のいずれか1項記載の照光装置。

The circuit board is reflected by covering the light emitter and the circuit board from above with a cover layer formed on the surface of the circuit board with a resin material having a higher reflectance than the base material of the circuit board. The illumination device according to any one of claims 1 to 3, which is characterized.

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116876A (en) 2006-11-08 2008-05-22 Calsonic Kansei Corp Indicator structure
WO2011042986A1 (en) 2009-10-09 2011-04-14 三菱電機株式会社 Indicator device
JP2014044970A (en) 2011-12-14 2014-03-13 Mitsubishi Electric Corp Light emitting device and manufacturing method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116876A (en) 2006-11-08 2008-05-22 Calsonic Kansei Corp Indicator structure
WO2011042986A1 (en) 2009-10-09 2011-04-14 三菱電機株式会社 Indicator device
JP2014044970A (en) 2011-12-14 2014-03-13 Mitsubishi Electric Corp Light emitting device and manufacturing method of the same

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