JP7028704B2 - Thermosetting material - Google Patents

Description

The present invention relates to a thermosetting material containing an aggregate of boron nitride particles in which a plurality of boron nitride particles are aggregated.

In recent years, the miniaturization and high performance of electronic or electrical equipment have been progressing. Along with this, the mounting density of electronic components has increased, and the need to dissipate heat generated from electronic components has increased. Heat generation is a problem that is directly linked to the reliability of devices and equipment, and how to dissipate heat quickly is an urgent issue.

As one method for solving the above problems, a ceramic substrate having high thermal conductivity such as an alumina substrate or an aluminum nitride substrate is used as a heat dissipation substrate on which a power semiconductor device is mounted. However, these substrates have problems that it is difficult to form multiple layers, workability is poor, and the cost is very high.

On the other hand, in order to dissipate heat, a heat conductive composition containing a heat conductive filler is used. The following Patent Documents 1 to 3 disclose fillers that can be used as thermally conductive fillers.

In Patent Document 1 below, 100 parts by weight of spherical thermally conductive particles (A) having an average primary particle diameter of 0.1 to 10 μm and an organic binder (B) having a reactive functional group (B) 0.1 to The easily deformable aggregate (D) containing 30 parts by weight is disclosed. The average particle size of the easily deformable aggregate (D) is 2 to 100 μm. The average compressive force required for compressive deformation of the easily deformable aggregate (D) at a compressive deformation rate of 10% is 5 mN or less.

The following Patent Document 2 discloses boron nitride agglomerated particles. The boron nitride agglomerated particles have a specific surface area of 10 m ² / g or more and a total pore volume of 2.15 cm ³ / g or less. The surface of the boron nitride aggregated particles is composed of boron nitride primary particles having an average particle size of 0.05 μm or more and 1 μm or less. The maximum particle size of the boron nitride aggregated particles on a volume basis is larger than 25 μm and 200 μm or less.

Patent Document 3 below discloses a heat conductive sheet in which boron nitride powder is dispersed as a heat conductive filler in an organic matrix material. The boron nitride powder contains 1 to 20% by weight of secondary aggregate particles having a particle size of 50 μm or more.

Japanese Unexamined Patent Publication No. 2015-10200 Japanese Unexamined Patent Publication No. 2015-6980 Japanese Unexamined Patent Publication No. 2003-60134

In the conventional composition containing boron nitride particles as described in Patent Documents 1 to 3, the thermal conductivity can be enhanced to some extent.

However, in the conventional compositions containing boron nitride particles as described in Patent Documents 1 to 3, even if the thermal conductivity can be improved to some extent, voids may be generated when the composition is cured. .. When voids are generated in the cured product, the adhesiveness and the insulating property are deteriorated.

An object of the present invention is to provide a thermosetting material capable of increasing thermal conductivity and suppressing the generation of voids in spite of the use of agglomerates of boron nitride particles. ..

According to a broad aspect of the present invention, a thermosetting compound, a thermosetting agent, and a plurality of boron nitride particles are contained, and the boron nitride particles contain an aggregate in which the boron nitride particles are aggregated, and the thermosetting material is contained. Provided by a thermosetting material having a minimum melt viscosity of 1 × 10 ³ Pa · s or more and 1 × 10 ⁴ Pa · s or less when heated from 25 ° C. to curing at a heating rate of 5 ° C./min. Will be done.

In a specific aspect of the thermosetting material according to the present invention, the average aspect ratio of the aggregate is 1 or more and 5 or less.

In certain aspects of the thermosetting material according to the invention, the thermosetting compound comprises an epoxy compound.

In certain aspects of the thermosetting material according to the present invention, the aggregate is a surface treated product with a surface treating agent.

In a specific aspect of the thermosetting material according to the present invention, the content of the boron nitride particles is 10% by volume or more and 80% by volume or less in 100% by volume of the component excluding the solvent.

In certain aspects of the thermosetting material according to the present invention, the thermosetting material is a thermosetting sheet.

The thermosetting material according to the present invention contains a thermosetting compound, a thermosetting agent, and a plurality of boron nitride particles. In the thermosetting material according to the present invention, the boron nitride particles include aggregates in which the boron nitride particles are aggregated. In the thermosetting material according to the present invention, the minimum melt viscosity when the thermosetting material is heated from 25 ° C. to curing at a heating rate of 5 ° C./min is 1 × 10 ³ Pa · s or more, 1 × 10 It is ⁴ Pa · s or less. Since the thermosetting material according to the present invention has the above-mentioned structure, the thermal conductivity is increased and the generation of voids is suppressed even though the aggregate of boron nitride particles is used. can do.

FIG. 1 is a cross-sectional view schematically showing a cured product of a thermosetting material according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail.

The thermosetting material according to the present invention contains (A) a thermosetting compound, (B) a thermosetting agent, and a plurality of (C) boron nitride particles. (C) Boron nitride particles include aggregates in which boron nitride particles are aggregated (also referred to as (C1) aggregates of boron nitride particles or (C1) aggregates).

In the thermosetting material according to the present invention, the minimum melt viscosity when the thermosetting material is heated from 25 ° C. to curing at a heating rate of 5 ° C./min is 1 × 10 ³ Pa · s or more, 1 × 10 It is ⁴ Pa · s or less.

In the present invention, since the above configuration is provided, it is possible to increase the thermal conductivity and suppress the generation of voids even though the aggregate of (C1) boron nitride particles is used. can. In the present invention, since the minimum melt viscosity is at least the above lower limit, the thermal conductivity is high. Further, in the present invention, since the minimum melt viscosity is equal to or less than the upper limit, the generation of voids can be suppressed.

Further, (C) boron nitride particles and (C1) aggregates contribute to the improvement of thermal conductivity. Further, in the (C1) aggregate, there are voids between the (C) boron nitride particles constituting the (C1) aggregate. If gas or the like remains in the voids at the curing stage, it causes voids to be generated in the cured product. By controlling the minimum melt viscosity of the thermosetting material to be equal to or less than the upper limit, the thermosetting component can be satisfactorily infiltrated into the voids at the curing stage. As a result, the generation of voids in the cured product can be suppressed. Further, when voids are generated in the cured product, the adhesiveness and the insulating property are deteriorated. In the present invention, since the generation of voids can be suppressed, high adhesiveness and insulating properties can be maintained. By controlling the minimum melt viscosity of the thermosetting material to be equal to or higher than the lower limit, the fluidity of the thermosetting material can be appropriately suppressed. Further, when the thermosetting material is a thermosetting sheet, the handleability can be improved.

From the viewpoint of effectively increasing thermal conductivity and effectively suppressing the generation of voids, the minimum melt viscosity when the thermosetting material is heated from 25 ° C to curing at a heating rate of 5 ° C / min is It is preferably 1 × 10 ³ Pa · s or more, preferably 1 × 10 ⁴ Pa · s or less. If the minimum melt viscosity is less than the lower limit, it becomes difficult to appropriately suppress the flow of the thermosetting material during thermosetting, the shape of the thermosetting material cannot be maintained, and resin flow occurs. Further, when the minimum melt viscosity exceeds the upper limit, it becomes difficult to effectively suppress the generation of voids, and the thermal conductivity and the insulating property are lowered.

As a method for adjusting the minimum melt viscosity to the above range, a method using a thermosetting compound having a low melt viscosity, a method for surface-treating boron nitride particles, a method for controlling the particle size distribution of the boron nitride particles, and a spherical shape. Examples thereof include a method of adding a submicron filler and a method of combining these methods.

The minimum melt viscosity is a value at which the viscosity is the lowest in the viscosity measurement. The minimum melt viscosity is measured as follows.

Using a leometer (“DynAlyser” manufactured by Leologica), the thermosetting material is sandwiched between a glass plate and a parallel plate (diameter 20 mm), and the temperature rise rate from 25 ° C to curing under the conditions of frequency 1 Hz and strain 1%. The change in melt viscosity is measured by heating at 5 ° C./min. From the obtained results, the minimum value of the melt viscosity is defined as the minimum melt viscosity. For example, when the curing is completed by 200 ° C., the viscosity increases when the curing is performed. Therefore, when measuring the minimum melt viscosity, the heating may be performed from 20 ° C. to 200 ° C.

Further, when measuring the minimum melt viscosity, heating is performed at a heating rate of 5 ° C./min from 25 ° C. until curing. This heating condition is a heating condition for measuring the minimum melt viscosity in the present invention. When using the thermosetting material in the present invention, it is not necessary to heat at a heating rate of 5 ° C./min from 25 ° C. to curing.

From the viewpoint of effectively enhancing both thermal conductivity and withstand voltage, it is preferable that the boron nitride constituting the (C) boron nitride particles is hexagonal boron nitride.

Since it is more excellent due to the effect of the present invention, it is preferable that each of the non-aggregated (C) boron nitride particles and (C1) the (C) boron nitride particles constituting the aggregate has a scaly shape. In each of the non-aggregated (C) boron nitride particles and (C1) the (C) boron nitride particles constituting the aggregate, the ratio of the average major axis to the average thickness is preferably 2 or more, more preferably 3 or more. Yes, preferably 200 or less, more preferably 100 or less.

From the viewpoint of effectively increasing the thermal conductivity and controlling the compression strength within an appropriate range, a plurality of (C) boron nitride particles (non-aggregated (C) boron nitride particles and (C1) aggregates are formed. The average primary particle size of (C) boron nitride particles) is preferably 0.1 μm or more, more preferably 0.5 μm or more, preferably 20 μm or less, and more preferably 10 μm or less.

(C) The average primary particle size of the boron nitride particles means the average particle size of the primary particles on a volume basis. (C) The average primary particle diameter of the boron nitride particles can be measured using a "dry laser diffraction type particle size distribution measuring device (model number: MASTERSIZER 3000)" manufactured by Malvern.

(C1) The average aspect ratio of the aggregates of the boron nitride particles is preferably 1 or more, preferably 5 or less, more preferably 3 or less, still more preferably 2 or less, still more preferably 1.8 or less, and particularly preferably. It is 1.6 or less, most preferably 1.5 or less. When the average aspect ratio of the aggregates of the (C1) boron nitride particles is equal to or higher than the above lower limit and lower than the above upper limit, the (C) boron nitride particles can be packed at high density and the thermal conductivity can be effectively enhanced. Moreover, the generation of voids can be effectively suppressed.

The aspect ratio is major axis / minor axis. The average aspect ratio is obtained by averaging the aspect ratios of a plurality of (C1) aggregates. It is preferable to average the aspect ratios of 50 arbitrarily selected (C1) aggregates.

From the viewpoint of further enhancing the dispersibility, stability over time, and thermal conductivity in the resin, the average particle size of the aggregate of (C1) boron nitride particles is preferably 1 μm or more, more preferably 5 μm or more, and preferably 5 μm or more. It is 100 μm or less, more preferably 80 μm or less.

(C1) The average particle size of the aggregate of boron nitride particles is obtained by measuring the particle size on a volume basis by measuring the particle size distribution. (C1) The average particle size of the aggregate of boron nitride particles can be measured by using a "dry laser diffraction type particle size distribution measuring device (model number: MASTERSIZER 3000)" manufactured by Malvern.

From the viewpoint of effectively enhancing the thermal conductivity, the average sphericity of the aggregate of the (C1) boron nitride particles is preferably 0.7 or more, more preferably 0.75 or more, still more preferably 0.8 or more. be.

The average sphericity is determined by averaging the sphericities of a plurality of (C1) aggregates. (C1) The average sphericity of the aggregate is determined by a method of measuring the sphericity from an arbitrary number of particle images obtained by microscopic observation. (C1) The average sphericity of the aggregate can be measured using a "particle image analyzer (model number: Moforoghi G3)" manufactured by Malvern. The measurement conditions are set to a lens magnification of 10 times and a particle count of 5,000.

From the viewpoint of effectively enhancing the thermal conductivity and effectively suppressing the generation of voids, the (C1) aggregate is preferably a surface-treated product with a surface treatment agent.

Preferred examples of the surface treatment agent include a silane coupling agent, a surfactant and the like.

(C1) Examples of the method for producing an aggregate of boron nitride particles include a spray drying method and a fluidized bed granulation method. A spray drying method (also called spray drying) is preferable. The spray drying method can be classified into a two-fluid nozzle method, a disk method (also called a rotary method), an ultrasonic nozzle method, and the like according to the spray method, and any of these methods can be applied.

From the viewpoint of effectively enhancing the compressive strength and withstand voltage, the thermosetting material according to the present invention includes (A) a thermosetting compound, (B) a thermosetting agent, and (C) boron nitride particles ((C). It is preferable to contain (C1) an agglomerate) and (D) an insulating filler that is not boron nitride particles (may be simply referred to as (D) an insulating filler).

By adopting a composition containing the components (A) to (D), the heat dissipation of the cured product can be significantly improved. For example, by using (A) a thermosetting compound, (B) a thermosetting agent, (C) boron nitride particles (including (C1) aggregates), and (D) an insulating filler in combination, these are used. Compared with the case where is not used in combination, the heat dissipation property, the compression strength and the withstand voltage property are effectively improved. In the present invention, the effects of high heat dissipation and high withstand voltage, which have been difficult to satisfy in the past, can be achieved at a high level.

Hereinafter, other details of the present invention will be described.

((A) Thermosetting compound)
Examples of the thermosetting compound include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds and polyimide compounds. And so on. (A) Only one type of thermosetting compound may be used, or two or more types may be used in combination.

From the viewpoint of effectively enhancing the thermal conductivity and effectively suppressing the generation of voids, the (A) thermosetting compound preferably contains an epoxy compound.

As the (A) thermosetting compound, (A1) a thermosetting compound having a molecular weight of less than 10000 (may be simply referred to as (A1) thermosetting compound) may be used. As the (A) thermosetting compound, (A2) a thermosetting compound having a molecular weight of 10,000 or more (may be simply referred to as (A2) thermosetting compound) may be used. As the (A) thermosetting compound, both (A1) thermosetting compound and (A2) thermosetting compound may be used.

Of the components contained in the thermosetting material, the content of the (A) thermosetting compound is preferably 10% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) the insulating filler. As mentioned above, it is more preferably 20% by weight or more. Of the components contained in the thermosetting material, the content of the (A) thermosetting compound is preferably 90% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) insulating filler. Below, it is more preferably 80% by weight or less, further preferably 70% by weight or less, particularly preferably 60% by weight or less, and most preferably 50% by weight or less. (A) When the content of the thermosetting compound is at least the above lower limit, the adhesiveness and heat resistance of the cured product are further enhanced. (A) When the content of the thermosetting compound is not more than the above upper limit, the coatability at the time of producing the thermosetting material is improved.

Among the components contained in the thermosetting material, the components other than the solvent, (C) boron nitride particles and (D) insulating filler are (C) boron nitride particles when the thermosetting material does not contain a solvent. And (D) a component excluding the insulating filler, and when the thermosetting material contains a solvent, it is a component excluding the solvent, (C) boron nitride particles and (D) the insulating filler. Of the components contained in the thermosetting material, the components other than the solvent, (C) boron nitride particles and (D) insulating filler are solvents when the thermosetting material does not contain (D) insulating filler. And (C) a component excluding boron nitride particles, and when the thermosetting material contains (D) an insulating filler, it is a component excluding (C) boron nitride particles and (D) insulating filler. .. The solvent is removed by volatilization when the thermosetting material is cured.

(A1) Thermosetting compound having a molecular weight of less than 10,000:
Examples of the thermosetting compound (A1) include thermosetting compounds having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The thermosetting compound having a cyclic ether group is preferably a thermosetting compound having an epoxy group or an oxetanyl group. (A1) Only one type of thermosetting compound may be used, or two or more types may be used in combination.

The (A1) thermosetting compound may contain (A1a) a thermosetting compound having an epoxy group (sometimes simply referred to as (A1a) thermosetting compound), and (A1b) an oxetanyl group. It may contain a thermosetting compound having (may be simply referred to as (A1b) thermosetting compound).

From the viewpoint of further enhancing the heat resistance and moisture resistance of the cured product, the (A1) thermosetting compound preferably has an aromatic skeleton.

The aromatic skeleton is not particularly limited, and examples thereof include a naphthalene skeleton, a fluorene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantan skeleton, and a bisphenol A type skeleton. A biphenyl skeleton or a fluorene skeleton is preferable from the viewpoint of further enhancing the cold heat cycle resistance and heat resistance of the cured product.

Examples of the thermosetting compound include an epoxy monomer having a bisphenol skeleton, an epoxy monomer having a dicyclopentadiene skeleton, an epoxy monomer having a naphthalene skeleton, an epoxy monomer having an adamantan skeleton, an epoxy monomer having a fluorene skeleton, and a biphenyl skeleton. Examples thereof include an epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton, an epoxy monomer having a xanthene skeleton, an epoxy monomer having an anthracene skeleton, and an epoxy monomer having a pyrene skeleton. These hydrogenated or modified products may be used. (A1a) Only one type of thermosetting compound may be used, or two or more types may be used in combination.

Examples of the epoxy monomer having a bisphenol skeleton include an epoxy monomer having a bisphenol A type, a bisphenol F type, and a bisphenol S type bisphenol skeleton.

Examples of the epoxy monomer having a dicyclopentadiene skeleton include a dicyclopentadiene dioxide and a phenol novolac epoxy monomer having a dicyclopentadiene skeleton.

Examples of the epoxy monomer having a naphthalene skeleton include 1-glycidylnaphthalene, 2-glycidylnaphthalene, 1,2-diglycidylnaphthalene, 1,5-diglycidylnaphthalene, 1,6-diglycidylnaphthalene, and 1,7-diglycidyl. Examples thereof include naphthalene, 2,7-diglycidylnaphthalene, triglycidylnaphthalene, and 1,2,5,6-tetraglycidylnaphthalene.

Examples of the epoxy monomer having an adamantane skeleton include 1,3-bis (4-glycidyloxyphenyl) adamantane and 2,2-bis (4-glycidyloxyphenyl) adamantane.

Examples of the epoxy monomer having a fluorene skeleton include 9,9-bis (4-glycidyloxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, and 9,9-bis (4-). Glycidyloxy-3-chlorophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-bromophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-fluorophenyl) fluorene, 9,9-bis (4-glycidyloxy-3-methoxyphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dichlorophenyl) Examples thereof include fluorene and 9,9-bis (4-glycidyloxy-3,5-dibromophenyl) fluorene.

Examples of the epoxy monomer having a biphenyl skeleton include 4,4'-diglycidyl biphenyl, 4,4'-diglycidyl-3,3', 5,5'-tetramethylbiphenyl and the like.

Examples of the epoxy monomer having a bi (glycidyloxyphenyl) methane skeleton include 1,1'-bi (2,7-glycidyloxynaphthyl) methane and 1,8'-by (2,7-glycidyloxynaphthyl) methane. 1,1'-by (3,7-glycidyloxynaphthyl) methane, 1,8'-by (3,7-glycidyloxynaphthyl) methane, 1,1'-by (3,5-glycidyloxynaphthyl) methane , 1,8'-by (3,5-glycidyloxynaphthyl) methane, 1,2'-by (2,7-glycidyloxynaphthyl) methane, 1,2'-by (3,7-glycidyloxynaphthyl) Examples thereof include methane and 1,2-bye (3,5-glycidyloxynaphthyl) methane.

Examples of the epoxy monomer having a xanthene skeleton include 1,3,4,5,6,8-hexamethyl-2,7-bis-oxylanylmethoxy-9-phenyl-9H-xanthene.

Specific examples of the (A1b) thermosetting compound include 4,4'-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl and bis 1,4-benzenedicarboxylate [(3-ethyl-). Examples thereof include 3-oxetanyl) methyl] ester, 1,4-bis [(3-ethyl-3-oxetanyl) methoxymethyl] benzene, and oxetane-modified phenol novolak. (A1b) As the thermosetting compound, only one kind may be used, or two or more kinds may be used in combination.

From the viewpoint of further improving the heat resistance of the cured product, the (A1) thermosetting compound preferably contains a thermosetting compound having two or more cyclic ether groups.

From the viewpoint of further improving the heat resistance of the cured product, the content of the thermosetting compound having two or more cyclic ether groups in (A1) 100% by weight of the thermosetting compound is preferably 70% by weight or more. , More preferably 80% by weight or more, and 100% by weight or less. (A1) The content of the thermosetting compound having two or more cyclic ether groups in 100% by weight of the thermosetting compound may be 10% by weight or more and 100% by weight or less. Further, the entire (A1) thermosetting compound may be a thermosetting compound having two or more cyclic ether groups.

(A1) The molecular weight of the thermosetting compound is less than 10,000. The molecular weight of the (A1) thermosetting compound is preferably 200 or more, preferably 1200 or less, more preferably 600 or less, still more preferably 550 or less. (A1) When the molecular weight of the thermosetting compound is at least the above lower limit, the adhesiveness of the surface of the cured product is lowered, and the handleability of the curable composition is further improved. (A1) When the molecular weight of the thermosetting compound is not more than the above upper limit, the adhesiveness of the cured product becomes even higher. Further, the cured product is hard and less likely to become brittle, and the adhesiveness of the cured product is further improved.

In the present specification, the molecular weight of the (A1) thermosetting compound means that (A1) the thermosetting compound is not a polymer and (A1) the structural formula of the thermosetting compound can be specified. It means the molecular weight that can be calculated from the structural formula, and when the (A1) thermosetting compound is a polymer, it means the weight average molecular weight.

Of the components contained in the thermosetting material, the content of the (A1) thermosetting compound is preferably 10% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) the insulating filler. As mentioned above, it is more preferably 20% by weight or more. Of the components contained in the thermosetting material, the content of the (A1) thermosetting compound is preferably 90% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) insulating filler. Below, it is more preferably 80% by weight or less, further preferably 70% by weight or less, particularly preferably 60% by weight or less, and most preferably 50% by weight or less. (A1) When the content of the thermosetting compound is at least the above lower limit, the adhesiveness and heat resistance of the cured product are further enhanced. (A1) When the content of the thermosetting compound is not more than the above upper limit, the coatability at the time of producing the thermosetting material becomes high.

(A2) Thermosetting compound having a molecular weight of 10,000 or more:
(A2) The thermosetting compound is a thermosetting compound having a molecular weight of 10,000 or more. Since the molecular weight of the (A2) thermosetting compound is 10,000 or more, the (A2) thermosetting compound is generally a polymer, and the molecular weight generally means a weight average molecular weight.

From the viewpoint of further enhancing the heat resistance and moisture resistance of the cured product, the (A2) thermosetting compound preferably has an aromatic skeleton. When the (A2) thermosetting compound is a polymer and the (A2) thermosetting compound has an aromatic skeleton, the (A2) thermosetting compound puts the aromatic skeleton on any part of the entire polymer. It may be contained in the main chain skeleton, or may be contained in the side chain. From the viewpoint of further increasing the heat resistance of the cured product and further increasing the moisture resistance of the cured product, the (A2) thermosetting compound preferably has an aromatic skeleton in the main chain skeleton. (A2) Only one type of thermosetting compound may be used, or two or more types may be used in combination.

The aromatic skeleton is not particularly limited, and examples thereof include a naphthalene skeleton, a fluorene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantan skeleton, and a bisphenol A type skeleton. A biphenyl skeleton or a fluorene skeleton is preferred. In this case, the cold and heat cycle resistance and heat resistance of the cured product are further enhanced.

The (A2) thermosetting compound is not particularly limited, and is not particularly limited, and is styrene resin, phenoxy resin, oxetane resin, epoxy resin, episulfide compound, (meth) acrylic resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone. Examples thereof include resins and polyimide resins.

From the viewpoint of suppressing oxidative deterioration of the cured product, further improving the cold heat cycle resistance and heat resistance of the cured product, and further lowering the water absorption rate of the cured product, the (A2) thermosetting compound is a styrene resin. It is preferably a phenoxy resin or an epoxy resin, more preferably a phenoxy resin or an epoxy resin, and even more preferably a phenoxy resin. In particular, the use of a phenoxy resin or an epoxy resin further increases the heat resistance of the cured product. Further, by using the phenoxy resin, the elastic modulus of the cured product is further lowered, and the cold and heat cycle resistance of the cured product is further improved. The thermosetting compound (A2) does not have to have a cyclic ether group such as an epoxy group.

Specifically, as the styrene resin, a homopolymer of a styrene-based monomer, a copolymer of a styrene-based monomer and an acrylic monomer, and the like can be used. A styrene polymer having a styrene-glycidyl methacrylate structure is preferred.

Examples of the styrene-based monomer include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, p-phenylstyrene, p-chlorostyrene, p-ethylstyrene, and pn-. Butylstyrene, p-tert-butylstyrene, pn-hexylstyrene, pn-octylstyrene, pn-nonylstyrene, pn-decylstyrene, pn-dodecylstyrene, 2,4-dimethyl Examples thereof include styrene and 3,4-dichlorostyrene.

Specifically, the phenoxy resin is, for example, a resin obtained by reacting epihalohydrin with a divalent phenol compound, or a resin obtained by reacting a divalent epoxy compound with a divalent phenol compound.

The phenoxy resin has a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol A / F mixed type skeleton, a naphthalene skeleton, a fluorene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantane skeleton or a dicyclopentadiene skeleton. Is preferable. The phenoxy resin more preferably has a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol A / F mixed type skeleton, a naphthalene skeleton, a fluorene skeleton or a biphenyl skeleton, and at least one of the fluorene skeleton and the biphenyl skeleton. It is more preferable to have a skeleton. By using the phenoxy resin having these preferable skeletons, the heat resistance of the cured product is further increased.

The epoxy resin is an epoxy resin other than the phenoxy resin. Examples of the epoxy resin include styrene skeleton-containing epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, biphenol type epoxy resin, naphthalene type epoxy resin, and fluorene type epoxy resin. , Phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, anthracene type epoxy resin, epoxy resin having an adamantan skeleton, epoxy resin having a tricyclodecane skeleton, and epoxy resin having a triazine nucleus as a skeleton. And so on.

(A2) The molecular weight of the thermosetting compound is 10,000 or more. The molecular weight of the (A2) thermosetting compound is preferably 30,000 or more, more preferably 40,000 or more, preferably 1,000,000 or less, and more preferably 250,000 or less. (A2) When the molecular weight of the thermosetting compound is at least the above lower limit, the cured product is unlikely to be thermally deteriorated. (A2) When the molecular weight of the thermosetting compound is less than the above lower limit, thermal deterioration is likely to occur, the melt viscosity is lowered, and resin flow is generated during thermosetting. When the molecular weight of the (A2) thermosetting compound is not more than the above upper limit, the compatibility between the (A2) thermosetting compound and other components becomes high. As a result, the heat resistance of the cured product is further increased.

Of the components contained in the thermosetting material, the content of the (A2) thermosetting compound is preferably 20% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) insulating filler. As described above, it is more preferably 30% by weight or more, preferably 60% by weight or less, and more preferably 50% by weight or less. (A2) When the content of the thermosetting compound is at least the above lower limit, the handleability of the thermosetting material is improved. When the content of the (A2) thermosetting compound is not more than the above upper limit, the dispersion of the (C) boron nitride particles and the (D) insulating filler becomes easy.

((B) Thermosetting agent)
(B) The thermosetting agent is not particularly limited. As the (B) thermosetting agent, an appropriate thermosetting agent capable of curing the (A) thermosetting compound can be used. Further, in the present specification, the (B) thermosetting agent includes a curing catalyst. (B) Only one type of thermosetting agent may be used, or two or more types may be used in combination.

From the viewpoint of further enhancing the heat resistance of the cured product, the thermosetting agent (B) preferably has an aromatic skeleton or an alicyclic skeleton. (B) The heat curing agent preferably contains an amine curing agent (amine compound), an imidazole curing agent, a phenol curing agent (phenol compound) or an acid anhydride curing agent (acid anhydride), and preferably contains an amine curing agent. Is more preferable. The acid anhydride curing agent contains an acid anhydride having an aromatic skeleton, a water additive of the acid anhydride or a modified product of the acid anhydride, or an acid anhydride having an alicyclic skeleton. It preferably contains a water additive of acid anhydride or a modified product of the acid anhydride.

Examples of the amine curing agent include dicyandiamide, imidazole compound, diaminodiphenylmethane, diaminodiphenyl sulfone and the like. From the viewpoint of further enhancing the adhesiveness between the cured product and the thermal conductor and the conductive layer, the amine curing agent is more preferably a dicyandiamide or an imidazole compound. From the viewpoint of further enhancing the storage stability of the curable composition, the (B) thermosetting agent preferably contains a curing agent having a melting point of 180 ° C. or higher, and an amine curing agent having a melting point of 180 ° C. or higher. It is more preferable to include it.

Examples of the imidazole curing agent include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl. -2-Methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2- Undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 '-Methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino -6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl- s-Triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethyl Examples include imidazole.

Examples of the phenol curing agent include phenol novolac, o-cresol novolak, p-cresol novolak, t-butylphenol novolak, dicyclopentadiencresol, polyparavinylphenol, bisphenol A type novolak, xylylene-modified novolak, decalin-modified novolak, and poly ( Examples thereof include di-o-hydroxyphenyl) methane, poly (di-m-hydroxyphenyl) methane, poly (di-p-hydroxyphenyl) methane and the like. From the viewpoint of further enhancing the flexibility of the cured product and the flame retardancy of the cured product, a phenol resin having a melamine skeleton, a phenol resin having a triazine skeleton, or a phenol resin having an allyl group is preferable.

Commercially available products of the above phenol curing agents include MEH-8005, MEH-8010, MEH-8015 and MEH-8015 (all of which are manufactured by Meiwa Kasei Co., Ltd.), YLH903 (manufactured by Mitsubishi Chemical Corporation), LA-7052, LA-7054. , LA-7751, LA-1356 and LA-3018-50P (all manufactured by DIC Corporation), and PS6313 and PS6492 (all manufactured by Gun Ei Chemical Industry Co., Ltd.) and the like.

Examples of the acid anhydride having an aromatic skeleton, the water additive of the acid anhydride, or the modified product of the acid anhydride include styrene / maleic anhydride copolymer, benzophenone tetracarboxylic acid anhydride, and pyromellitic acid anhydride. , Trimellitic anhydride, 4,4'-oxydiphthalic anhydride, phenylethynylphthalic anhydride, glycerol bis (anhydrotrimericate) monoacetate, ethylene glycol bis (anhydrotrimericate), methyltetrahydroanhydride Examples thereof include phthalic acid, methylhexahydroanhydride phthalic acid, and trialkyltetrahydroanhydride phthalic acid.

Examples of commercially available products of the acid anhydride having an aromatic skeleton, a water additive of the acid anhydride, or a modified product of the acid anhydride include SMA resin EF30, SMA resin EF40, SMA resin EF60, and SMA resin EF80 (any of the above). Also manufactured by Sartmer Japan), ODPA-M and PEPA (all manufactured by Manac), Ricacid MTA-10, Ricacid MTA-15, Ricacid TMTA, Ricacid TMEG-100, Ricacid TMEG-200, Ricacid TMEG-300, Rikasid TMEG-500, Rikasid TMEG-S, Rikasid TH, Rikasid HT-1A, Rikasid HH, Rikasid MH-700, Rikasid MT-500, Rikasid DSDA and Rikasid TDA-100 (all manufactured by Shin Nihon Rika Co., Ltd.), and EPICLON B4400, EPICLON B650, EPICLON B570 (all of which are manufactured by DIC) and the like can be mentioned.

The acid anhydride having an alicyclic skeleton, a water additive of the acid anhydride or a modified product of the acid anhydride is an acid anhydride having a polylipocyclic skeleton, a water additive of the acid anhydride or the acid anhydride thereof. A modified acid anhydride, an acid anhydride having an alicyclic skeleton obtained by an addition reaction between a terpene compound and maleic anhydride, a water additive of the acid anhydride, or a modified product of the acid anhydride. Is preferable. The use of these hardeners further enhances the flexibility of the hardened material, as well as the moisture resistance and adhesiveness of the hardened material.

Examples of the acid anhydride having an alicyclic skeleton, a water additive of the acid anhydride, or a modified product of the acid anhydride include methylnadic acid anhydride, an acid anhydride having a dicyclopentadiene skeleton, or the acid anhydride. The modified product of is also mentioned.

The commercially available products of the acid anhydride having an alicyclic skeleton, the water additive of the acid anhydride, or the modified product of the acid anhydride include Ricacid HNA and Ricacid HNA-100 (all of which are manufactured by Shin Nihon Rika Co., Ltd.). , Epicure YH306, Epicure YH307, Epicure YH308H, Epicure YH309 (all of which are manufactured by Mitsubishi Chemical Co., Ltd.) and the like.

The thermosetting agent (B) is also preferably methyl nadic acid anhydride or trialkyltetrahydrophthalic anhydride. The use of methylnadic acid anhydride or trialkyltetrahydrophthalic anhydride increases the water resistance of the cured product.

Of the components contained in the thermosetting material, the content of (B) the thermosetting agent is preferably 0.1% by weight in 100% by weight of the components excluding the solvent, (C) boron nitride particles and (D) the insulating filler. % Or more, more preferably 1% by weight or more, preferably 40% by weight or less, and more preferably 25% by weight or less. (B) When the content of the thermosetting agent is at least the above lower limit, it is easy to sufficiently cure the thermosetting material. When the content of the (B) thermosetting agent is not more than the above upper limit, it becomes difficult to generate an excess (B) thermosetting agent that is not involved in curing. Therefore, the heat resistance and adhesiveness of the cured product are further improved.

((C) Boron Nitride Particles)
From the viewpoint of effectively enhancing heat dissipation and compressive strength, the ratio of (C) the average particle size of the boron nitride particles to (D) the average particle size of the insulating filler is preferably 0.01 or more, more preferably. It is 0.2 or more, preferably 200 or less, and more preferably 10 or less.

Of the components contained in the thermosetting material, the content of (C) boron nitride particles is preferably 10% by volume or more, more preferably 30% by volume in 100% by volume of the component excluding the solvent and 100% by volume of the cured product. % Or more, preferably 80% by volume or less, and more preferably 75% by volume or less. (C) When the content of the boron nitride particles is at least the above lower limit, the heat dissipation property and the compressive strength are effectively increased. (C) When the content of the boron nitride particles is not more than the above upper limit, it is easy to sufficiently cure the thermosetting material. (C) When the content of the boron nitride particles is not more than the above upper limit, the thermal conductivity and the adhesiveness of the cured product are further increased.

Of the components contained in the thermosetting material, the components other than the solvent are thermosetting materials when the thermosetting material does not contain a solvent, and the components when the thermosetting material contains a solvent are solvents. It is an ingredient excluding.

In the thermosetting material, the content of the aggregates of the (C1) boron nitride particles is preferably 20% by volume or more, more preferably 50% by volume or more, still more preferably more preferably 50% by volume or more in 100% by volume of the whole (C) boron nitride particles. It is 60% by volume or more, particularly preferably 70% by volume or more, most preferably 80% by volume or more, and preferably 100% by volume or less. (C1) When the content of the agglomerates is at least the above lower limit, the heat dissipation property and the compressive strength are effectively increased.

Of the components contained in the thermosetting material, the total content of (C) boron nitride particles and (D) insulating filler in 100% by volume of the component excluding the solvent and 100% by volume of the cured product is preferable. Is 10% by volume or more, more preferably 20% by volume or more, further preferably 30% by volume or more, preferably 80% by volume or less, and more preferably 75% by volume or less. When the total content of the boron nitride particles (C) and the insulating filler (D) is at least the above lower limit, the heat dissipation property and the compressive strength are effectively increased. When the total content of the boron nitride particles (C) and the insulating filler (D) is not more than the above upper limit, it is easy to sufficiently cure the thermosetting material. When the total content of the boron nitride particles (C) and the insulating filler (D) is not more than the above upper limit, the thermal conductivity and adhesiveness of the cured product are further increased.

From the viewpoint of effectively enhancing heat dissipation and compression strength, (C) boron nitride particles are contained in 100% by volume of the total of (C) boron nitride particles and (D) insulating filler in the thermosetting material. The amount is preferably 10% by volume or more, more preferably 20% by volume or more, still more preferably 50% by volume or more, and preferably 100% by volume or less. The content of the (C) boron nitride particles may be less than 100% by volume in a total of 100% by volume of the (C) boron nitride particles and (D) the insulating filler in the thermosetting material, 99. It may be less than or equal to the volume.

((D) Insulating filler that is not boron nitride particles)
(D) Insulating filler The insulating filler has insulating properties. (D) The insulating filler may be an organic filler or an inorganic filler. From the viewpoint of effectively enhancing heat dissipation, the (D) insulating filler is preferably an inorganic filler. From the viewpoint of effectively enhancing heat dissipation, the (D) insulating filler preferably has a thermal conductivity of 10 W / m · K or more. (D) The insulating filler is preferably not an agglomerate of particles. (D) Only one kind of insulating filler may be used, or two or more kinds may be used in combination. The insulating property means that the volume resistivity of the filler is ¹⁰⁶ Ω · cm or more.

From the viewpoint of further enhancing the heat dissipation of the cured product, the thermal conductivity of the (D) insulating filler is preferably 10 W / m · K or more, more preferably 15 W / m · K or more, still more preferably 20 W / m · K. It is K or more. (D) The upper limit of the thermal conductivity of the insulating filler is not particularly limited. Inorganic fillers having a thermal conductivity of about 300 W / m · K are widely known, and inorganic fillers having a thermal conductivity of about 200 W / m · K are easily available.

(D) The material of the insulating filler is not particularly limited. (D) The material of the insulating filler is preferably alumina, synthetic magnesite, aluminum nitride, silicon carbide, silicon carbide, zinc oxide or magnesium oxide, and alumina, aluminum nitride, silicon nitride, silicon carbide, zinc oxide or It is more preferably magnesium oxide. The use of these preferred insulating fillers further enhances the heat dissipation of the cured product.

The insulating filler (D) is preferably spherical particles or non-aggregated particles having an aspect ratio of more than 2. The use of these insulating fillers further enhances the heat dissipation of the cured product. The aspect ratio of the spherical particles is 2 or less. (D) The melt viscosity can be adjusted by the aspect ratio of the insulating filler. The melt viscosity can be lowered by using the (D) insulating filler having an aspect ratio of 2 or less, and the melt viscosity can be increased by using the (D) insulating filler having an aspect ratio of more than 2.

(D) The new Mohs hardness of the material of the insulating filler is preferably 12 or less, more preferably 9 or less. (D) When the new Mohs hardness of the material of the insulating filler is 9 or less, the workability of the cured product is further improved.

From the viewpoint of further improving the processability of the cured product, the material of the (D) insulating filler is preferably synthetic magnesite, crystalline silica, zinc oxide, or magnesium oxide. The new Mohs hardness of the materials of these inorganic fillers is 9 or less.

From the viewpoint of effectively enhancing heat dissipation, the average particle size of the (D) insulating filler is preferably 1 μm or more, preferably 100 μm or less. When the average particle size is at least the above lower limit, (D) the insulating filler can be easily filled at a high density. When the average particle size is not more than the above upper limit, the withstand voltage resistance of the cured product is further increased.

The above-mentioned "average particle size" is an average particle size obtained from the particle size distribution measurement result by volume average measured by a dry laser diffraction type particle size distribution measuring device.

Of the components contained in the thermosetting material, the content of the (D) insulating filler is preferably 5% by volume or more, more preferably 10% by volume in 100% by volume of the component excluding the solvent and 100% by volume of the cured product. % Or more, preferably 75% by volume or less, and more preferably 65% by volume or less. (D) When the content of the insulating filler is not less than the above lower limit and not more than the above upper limit, the heat dissipation property of the cured product is effectively increased.

(Other ingredients)
In addition to the above-mentioned components, the thermosetting material may contain other components generally used for thermosetting compositions such as dispersants, chelating agents and antioxidants, and thermosetting sheets.

(Other details of thermosetting materials and cured products)
The thermosetting material may be a thermosetting paste or a thermosetting sheet. A cured product can be obtained by curing a thermosetting material. This cured product is a cured product of a thermosetting material, and is formed of the thermosetting material.

FIG. 1 is a cross-sectional view schematically showing a cured product of a thermosetting material according to an embodiment of the present invention. Note that FIG. 1 is different from the actual size and thickness for convenience of illustration.

The cured product 1 shown in FIG. 1 includes a cured product portion 11, an aggregate 12 of boron nitride particles, and an insulating filler 13. The insulating filler 13 is not an aggregate of boron nitride particles. In FIG. 1, the aggregate 12 of the boron nitride particles is provided with diagonal lines extending from the upper left to the lower right. In FIG. 1, the insulating filler 13 is provided with diagonal lines extending from the upper right to the lower left. In FIG. 1, the aggregate 12 of the boron nitride particles is shown in a schematic diagram.

The cured product portion 11 is a portion where the thermosetting component containing the thermosetting compound and the thermosetting agent is cured, and is obtained by curing the thermosetting component.

The thermosetting material and the cured product can be used in various applications where high heat dissipation and the like are required. The cured product is used, for example, by being arranged between a heat generating component and a heat radiating component in an electronic device.

Hereinafter, the present invention will be clarified by giving specific examples and comparative examples of the present invention. The present invention is not limited to the following examples.

(A1) Thermosetting compound:
(1) Bisphenol A type epoxy monomer ("YD-127" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
(2) Naphthalene skeleton-containing epoxy monomer (“HP-4032” manufactured by DIC Corporation)
(3) Biphenyl skeleton-containing epoxy monomer ("YX4000H" manufactured by Mitsubishi Chemical Corporation)
(4) Bifunctional glycidylamine ("EP-3950S" manufactured by ADEKA Corporation)

(A2) Thermosetting compound:
(1) Bisphenol A type phenoxy resin ("jER1256" manufactured by Mitsubishi Chemical Corporation)
(2) Epoxy group-containing styrene resin ("Marproof G-1010S" manufactured by NOF CORPORATION)

(B) Thermosetting agent:
(1) Amine curing agent ("DD" manufactured by Nippon Carbide)
(2) Isocyanul-modified solid-dispersed imidazole (“2MZA-PW” manufactured by Shikoku Kasei Kogyo Co., Ltd.)
(3) Liquid phenol curing agent ("MEH-8000H" manufactured by Meiwa Kasei Co., Ltd.)

(C) Boron nitride particles:
(1) Boron Nitride Aggregated Particles 1
(2) Boron nitride agglomerated particles 2
(3) Boron nitride agglomerated particles 3
(4) Boron Nitride Aggregated Particles 4

Preparation of Boron Nitride Agglomerated Particles 1:
Primary particles of boron nitride having an average major axis of 7.3 μm and an aspect ratio of 12.9 are aggregated by a spray-drying method so as to have an average particle diameter of 60 μm, and epoxy silane coupling of 1% by weight based on the weight of boron nitride. The surface was treated with an agent (“KBE403” manufactured by Shin-Etsu Chemical Co., Ltd.) to prepare boron nitride agglomerated particles 1. The average aspect ratio of the obtained boron nitride agglomerated particles 1 was 1.2.

Preparation of Boron Nitride Agglomerated Particles 2:
Primary particles of boron nitride having an average major axis of 3.3 μm and an aspect ratio of 12.7 are aggregated so as to have an average particle diameter of 70 μm by a spray-drying method, and epoxy silane coupling is performed in an amount of 1% by weight based on the weight of boron nitride. The surface was treated with an agent (“KBE403” manufactured by Shin-Etsu Chemical Co., Ltd.) to prepare boron nitride agglomerated particles 2. The aspect ratio of the obtained boron nitride agglomerated particles 2 was 1.1.

Preparation of Boron Nitride Agglomerated Particles 3:
Boron nitride agglomerated particles 3 were produced by aggregating the primary particles of boron nitride having an average major axis of 7.3 μm and an aspect ratio of 12.9 so as to have an average particle diameter of 60 μm by a spray dry method. The average aspect ratio of the obtained boron nitride agglomerated particles 3 was 1.2.

Preparation of Boron Nitride Agglomerated Particles 4:
Boron nitride agglomerated particles 4 were prepared by aggregating the primary particles of boron nitride having an average major axis of 5.5 μm and an aspect ratio of 14.0 so as to have an average particle diameter of 40 μm by a spray dry method. The aspect ratio of the obtained boron nitride agglomerated particles 4 was 6.

(E) Dispersant:
(1) Acrylic dispersant ("Disperbyk-2070" manufactured by Big Chemie Japan Co., Ltd.)

(Examples 1 to 4, comparative examples 1 to 3)
Fabrication of thermosetting materials:
Using a homodisper type stirrer, each raw material was mixed and kneaded at the ratio shown in Table 1 below (the compounding unit is parts by weight) to prepare a thermosetting composition. At the time of kneading, when the solid content was high and the homodisper type stirrer was difficult to rotate, it was appropriately diluted with a solvent (methyl ethyl ketone).

Next, the obtained thermosetting composition was applied onto a release polyethylene terephthalate (PET) film to a thickness of 200 μm, dried in an oven at 50 ° C. for 10 minutes, and then placed on the release PET film. A thermosetting sheet (thermosetting material, B-staged thermosetting material) was prepared. In this way, a multilayer sheet of a release PET film and a thermosetting sheet was obtained. No solvent was detected in the thermosetting sheet.

(evaluation)
<Minimum melt viscosity>
A multilayer sheet having a size of 25 mmΦ was cut out from the obtained multilayer sheet, and the release PET film was peeled off from the thermosetting sheet to obtain a measurement sample of the thermosetting sheet (thermosetting material). A measurement sample is sandwiched between a glass plate of a leometer (“DynAlyser” manufactured by Leologica) and a parallel plate (diameter 20 mm), and the temperature rise rate is 5 ° C / min from 25 ° C to 200 ° C under the conditions of frequency 1 Hz and distortion 1%. The change in the melt viscosity of the thermosetting sheet was measured by heating with. The minimum value of the melt viscosity of the measurement result is the minimum melt viscosity. In Examples 1 to 4 and Comparative Examples 1 to 3, the thermosetting sheet was cured after being heated to 200 ° C.

<Thermal conductivity>
Fabrication of laminate:
In the obtained multilayer sheet, the release PET film was peeled off from the thermosetting sheet, and two thermosetting sheets (thermosetting materials) having a thickness of 200 μm were prepared. Two thermosetting sheets with a thickness of 200 μm are stacked, sandwiched between two copper foils with a thickness of 105 μm, and heated from 40 ° C to 200 ° C at a heating rate of 5 ° C / min while pressurizing at a pressure of 6 MPa. Further, the laminated body was prepared by holding at 200 ° C. for 2 hours.

After cutting the obtained laminate into 1 cm squares, carbon black spray was applied to both sides, and the thermal conductivity was measured. The thermal conductivity was measured by a laser flash method using "LFA447Nanoflash" manufactured by NETZSCH. The thermal conductivity in Table 1 is a relative value with the value of Comparative Example 1 as 1.00.

<Void>
The cross section of the obtained laminate was smoothed with a cross section polisher and observed with a scanning electron microscope (SEM) to confirm the presence or absence of voids. The SEM observation conditions were a backscattered electron mode, an acceleration voltage of 10 kV, an emission current of 20 μA, and a magnification of 1000 times. Voids were determined according to the following criteria.

[Void judgment criteria]
◯: No void of 5 μm or more ×: There is a void of 5 μm or more

<Dielectric breakdown voltage>
Electrodes were produced by etching the copper foil in the obtained laminate, and test samples were obtained. An AC voltage was applied to the test sample in the oil tank, and the voltage at which a current of 10 mA or more flowed through the test sample was defined as the dielectric breakdown voltage. The breakdown voltage was determined according to the following criteria.

[Criteria for breakdown voltage]
◯: 60 kV / mm or more ×: less than 60 kV / mm

The results are shown in Table 1 below.

1 ... Cured product 11 ... Cured product part (cured part of thermosetting component)
12 ... Aggregates of boron nitride particles 13 ... Insulating filler

Claims (7)

It contains a thermosetting compound, a thermosetting agent, and a plurality of boron nitride particles.
The thermosetting compound contains a thermosetting compound having a molecular weight of less than 10,000 and a thermosetting compound having a molecular weight of 10,000 or more.
The boron nitride particles contain aggregates in which the boron nitride particles are aggregated.
The minimum melt viscosity when the thermosetting material is heated from 25 ° C. to curing at a heating rate of 5 ° C./min is 1 × 10 ³ Pa · s or more and 1 × 10 ⁴ Pa · s or less. Sex material. The thermosetting material according to claim 1, wherein the aggregate has an average aspect ratio of 1 or more and 5 or less. The thermosetting material according to claim 1 or 2, wherein the thermosetting compound contains an epoxy compound. The thermosetting material according to any one of claims 1 to 3, wherein the aggregate is a surface-treated product with a surface treatment agent. The thermosetting material according to any one of claims 1 to 4, wherein the content of the boron nitride particles is 10% by volume or more and 80% by volume or less in 100% by volume of the component excluding the solvent. The minimum melt viscosity when the thermosetting material is heated from 25 ° C to cure at a heating rate of 5 ° C / min is 6.6 × 10. ³ The thermosetting material according to any one of claims 1 to 5, which is Pa · s or more. The thermosetting material according to any one of claims 1 to 6 , which is a thermosetting sheet.

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