JP7024441B2 - Electronics - Google Patents

Description

The present invention relates to electronic devices.

For example, vehicles such as hybrid vehicles and electric vehicles are equipped with electronic devices such as power conversion devices. This type of electronic device has an electronic component and a frame that holds the electronic component. Capacitors may be used as electronic components.

Patent Document 1 describes an example of a capacitor fixing structure having an open upper wall and a box-shaped case capable of accommodating a capacitor. In the capacitor fixing structure of Patent Document 1, a push-up piece for pushing up the capacitor is provided on the bottom wall of the case. Further, a side wall is erected on the outer periphery of the bottom wall, and the side wall is provided with a locking claw for sandwiching the capacitor in cooperation with the push-up piece. In this capacitor fixing structure, the capacitor is sandwiched between the push-up piece provided on the bottom wall and the locking claw provided on the side wall.

Japanese Unexamined Patent Publication No. 2012-74546

An electronic device may hold a plurality of electronic components such as a capacitor and an electronic component other than the capacitor. Further, in order to reduce the occupied area of the electronic device, an arrangement in which an electronic component other than the capacitor is housed in the frame and the capacitor is held on the electronic component may be adopted.

In the capacitor fixing structure of Patent Document 1, as described above, the capacitor is housed in the case, and the capacitor is fixed between the push-up piece provided on the bottom wall of the case and the locking claw provided on the side wall. ing. Therefore, it is difficult to arrange electronic components other than the capacitor between the capacitor and the bottom wall of the case.

Further, in the case where the capacitor and the electronic component other than the capacitor are overlapped and arranged, if the capacitor is to be held by the locking claw as in Patent Document 1, it is higher than the case where the capacitor is housed in the case. It is necessary to provide a locking claw at the position. Therefore, in this case, the rigidity of the side wall of the case and the locking claw tends to be lower than that in the case where the capacitor is housed in the case.

In such a state, the side wall of the case and the locking claw may be easily deformed due to the inertia of the capacitor when vibration is applied to the electronic device, and the locking claw may be easily disengaged from the capacitor. In some cases, the locking claws and the side wall of the case may be damaged.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device capable of firmly holding a capacitor and having a small occupied area.

One aspect of the present invention is an accommodation space (20) composed of a substrate portion (21), a side wall portion (22) erected on the outer peripheral edge of the substrate portion, and the substrate portion and the side wall portion. Frame (2) to have
Electronic components (3) arranged in the accommodation space and
Capacitors (4, 402) arranged above (Z1) of the electronic component in a state where the substrate portion is directed downward (Z2).
It has a connecting member (5, 502, 503) that connects the frame and the capacitor.
The capacitor is
A lower bonded portion (41) arranged below the position (40) of 1/2 the height of the capacitor when the substrate portion is directed downward, and bonded to the frame.
Electronic devices (1, 102, 103) that are located above half the height of the capacitor and have upper bonded portions (42, 47) joined to the connecting member. It is in.

The electronic device has a frame provided with a storage space, an electronic component housed in the frame, and a capacitor arranged above the electronic component with the substrate portion facing downward. Therefore, the occupied area of the electronic device in the plan view seen from the stacking direction of the electronic component and the capacitor can be reduced.

The capacitor has a lower bonded portion at the specific position and is bonded to the frame at the lower bonded portion. Further, the capacitor has an upper bonded portion at the specific position, and is bonded to the frame via a connecting member at the upper bonded portion. That is, the capacitor is connected to the frame at both the upper and lower positions of the position with respect to the position of ½ of the height.

The height of the center of gravity of the capacitor is usually about ½ of the height of the capacitor. Therefore, by arranging the lower bonded portion and the upper bonded portion at the specific positions, the capacitor can be held on the frame on both sides of the center of gravity position of the capacitor in the height direction. Therefore, the electronic device can suppress the displacement of the capacitor when vibration is applied from both sides of the position of the center of gravity of the capacitor in the height direction. As a result, the capacitor can be held firmly, and problems such as the capacitor falling off or being damaged from the frame can be avoided.

As described above, according to the above aspect, the capacitor can be firmly held, and an electronic device having a small occupied area can be provided.
The reference numerals in parentheses described in the scope of claims and the means for solving the problem indicate the correspondence with the specific means described in the embodiments described later, and limit the technical scope of the present invention. It's not a thing.

It is a perspective view of the electronic device in Embodiment 1. FIG. It is a side view of the electronic device in Embodiment 1. FIG. FIG. 2 is a cross-sectional view taken along the line III-III in FIG. FIG. 2 is a partial cross-sectional view showing a main part of an electronic device having a connecting member embedded in a capacitor in the second embodiment. It is a partial cross-sectional view which shows the main part of the electronic device which the connecting member holds a capacitor from the lateral direction.

(Embodiment 1)
The embodiment of the electronic device will be described with reference to FIGS. 1 to 3. As shown in FIGS. 1 and 2, the electronic device 1 in the present embodiment includes a frame 2, an electronic component 3 housed in the frame 2, a capacitor 4, and a connecting member connecting the frame 2 and the capacitor 4. It has 5 and. As shown in FIGS. 1 and 3, the frame 2 has a storage space 20 composed of a substrate portion 21, a side wall portion 22 erected on the outer peripheral edge of the substrate portion 21, and a substrate portion 21 and a side wall portion 22. And have. The electronic component 3 is arranged in the accommodation space 20 of the frame 2. The capacitor 4 is arranged above the electronic component 3 with the substrate portion 21 facing downward.

Further, as shown in FIGS. 1 to 3, the capacitor 4 has a lower joined portion 41 joined to the frame 2 and an upper joined portion 42 joined to the connecting member 5. As shown in FIG. 3, the lower bonded portion 41 is arranged below the position 40, which is half the height of the capacitor 4 when the substrate portion 21 is directed downward. The upper bonded portion 42 is arranged above the position 40 which is ½ of the height of the capacitor 4.

The shape of the frame 2 in the electronic device 1 is not particularly limited. For example, the frame 2 of the present embodiment has a rectangular substrate portion 21 and a side wall portion 22 erected on the outer peripheral edge of the substrate portion 21, and has a box shape with one side open. .. Further, at the tip of the side wall portion 22, a flange portion 221 protruding outward of the frame 2, that is, toward the side opposite to the accommodation space 20 is provided.

In the following, the direction parallel to the long side of the substrate portion 21 may be referred to as "vertical direction X", and the direction parallel to the short side of the substrate portion 21 may be referred to as "horizontal direction Y". Further, the direction orthogonal to both the vertical direction X and the horizontal direction Y is referred to as "height direction Z", and the substrate portion 21 side in the height direction Z may be referred to as lower Z2 and the capacitor 4 side may be referred to as upper Z1. The vertical display in the height direction Z is for convenience, and has nothing to do with the orientation of the electronic device 1 in the state of being assembled to a vehicle or the like.

As shown in FIG. 1, the side wall portion 22 of the present embodiment includes the first side wall portion 22a and the third side wall portion 22c erected above Z1 along the long side of the substrate portion 21 and along the short side. It has a second side wall portion 22b and a fourth side wall portion 22d erected on the upper Z1. A first flange portion 221a projecting to the opposite side of the accommodation space 20 in the lateral direction Y is provided at the tip of the upper Z1 of the first side wall portion 22a, and the upper Z1 of the third side wall portion 22c is provided with the lateral direction. A third flange portion 221c projecting on the opposite side of the accommodation space 20 in Y is provided.

Further, a second flange portion 221b projecting to the opposite side of the accommodation space 20 in the vertical direction X is provided at the tip of the upper Z1 of the second side wall portion 22b, and is provided at the tip of the upper Z1 of the fourth side wall portion 22d. Is provided with a fourth flange portion 221d projecting on the opposite side of the accommodation space 20 in the vertical direction X.

The board portion 21 has two bosses 211 erected above Z1. As shown in FIG. 1, the boss 211 of the two bosses is arranged at a corner portion of the substrate portion 21 composed of the first side wall portion 22a and the second side wall portion 22b. Further, although not shown in the figure, the other boss 211 is arranged at a corner portion of the substrate portion 21 composed of the first side wall portion 22a and the fourth side wall portion 22d. These bosses 211 are used for joining the lower bonded portion 41 of the capacitor 4.

The electronic component 3 is accommodated in the concave accommodating space 20 composed of the substrate portion 21 and the side wall portion 22. The number of electronic components 3 arranged in the accommodation space 20 may be one or two or more. As the electronic component 3, for example, a semiconductor module provided with a switching element such as an IGBT (that is, an insulated gate bipolar transistor) or an FET (that is, a field effect transistor), or a passive element such as a coil can be used.

The electronic component 3 of the present embodiment is, for example, a semiconductor module including a plurality of switching elements. Although not shown in the figure, the semiconductor module and the capacitor 4 are electrically connected to each other so as to form a power conversion circuit.

A capacitor 4 is arranged above Z1 of the electronic component 3. The arrangement and form of the capacitor 4 are not particularly limited. For example, the capacitor 4 of the present embodiment is arranged along the first side wall portion 22a of the frame 2.

Further, the capacitor 4 has a lower bonded portion 41 for joining to the frame 2 and an upper bonded portion 42 for joining to the connecting member 5. The mode of joining the lower bonded portion 41 and the frame 2 is not particularly limited. For example, the lower bonded portion 41 may be fastened to the side wall portion 22 via a fastening member such as a bolt or a screw, or the lower bonded portion 41 and the side wall portion 22 are bonded via an adhesive material. It may have been done. Further, the lower bonded portion 41 and the side wall portion 22 may be welded to each other.

As shown in FIG. 3, the capacitor 4 of the present embodiment has a concave capacitor case 43 that opens downward Z2 (that is, the frame side in the height direction Z) and a capacitor element 44 housed in the capacitor case 43. And have. The number of the capacitor elements 44 housed in the capacitor case 43 may be one or two or more. Further, as the capacitor element 44, for example, a film capacitor can be used. For example, in the present embodiment, two film capacitors are housed in the capacitor case 43. Further, the portion of the capacitor case 43 other than the capacitor element 44 is filled with the potting resin 45.

In the present embodiment, the lower bonded portion 41 and the upper bonded portion 42 are provided in the capacitor case 43. As shown in FIG. 2, the lower bonded portion 41 is arranged in Z2 below the position 40 which is half the height of the capacitor 4. More specifically, the lower bonded portion 41 of the present embodiment is arranged at each end portion in the vertical direction X at the open end of the capacitor case 43. Each lower bonded portion 41 has a flat plate shape arranged in parallel with the first flange portion 221a of the frame 2. Further, each lower jointed portion 41 is fastened to the boss 211 of the substrate portion 21 via a bolt 411 as a fastening member.

The arrangement, number, and form of the lower bonded portion 41 are not limited to the embodiment of the present embodiment, and may take various embodiments. For example, the number of the lower jointed portions 41 may be one or more.

As shown in FIGS. 1 and 3, the upper bonded portion 42 is arranged in Z1 above the position 40 which is ½ of the height of the capacitor 4, as shown in FIG. It protrudes from the capacitor case 43 upward Z1 in the height direction Z. The upper bonded portion 42 is arranged in the middle portion of the capacitor case 43 in the vertical direction X, and has a columnar shape. Further, the upper bonded portion 42 is configured so that a bolt can be inserted from the upper Z1. A capacitor joint 51 of a connecting member 5, which will be described later, is fastened to the upper joint 42 via a bolt 421 as a fastening member.

The arrangement, number, and form of the upper bonded portion 42 are not limited to the embodiment of the present embodiment, and may take various embodiments. For example, the number of the upper joined portions 42 may be one or more. Further, the upper bonded portion 42 may not protrude outward of the capacitor 4, or may protrude in a direction other than the height direction Z, such as the vertical direction X or the horizontal direction Y.

A connecting member 5 is bonded to the upper bonded portion 42 of the capacitor 4. The connecting member 5 can be made of, for example, a metal such as stainless steel or iron. For example, the connecting member 5 of the present embodiment is made of stainless steel.

The form, arrangement, and number of the connecting members 5 are not particularly limited. For example, the connecting member 5 of the present embodiment is arranged in the middle portion of the capacitor 4 in the vertical direction X, and extends from the upper bonded portion 42 of the capacitor case 43 to the first flange portion 221a of the frame 2. It is postponed. Further, the connecting member 5 has a capacitor joining portion 51 joined to the upper bonded portion 42 of the capacitor 4, and an extending portion 52 connected to the capacitor joining portion 51 and extended toward the side wall portion 22. is doing.

The extending portion 52 extends in the height direction Z and is arranged along the outer surface of the capacitor case 43.

The capacitor joint portion 51 protrudes from the extension portion 52 on the capacitor 4 side, that is, inward in the lateral direction Y. Further, the capacitor joint 51 is fastened to the upper bonded portion 42 of the capacitor case 43 via a bolt 421 as a fastening member.

The mode of joining the capacitor 4 and the capacitor joining portion 51 is not limited to the mode of the present embodiment. For example, the capacitor joint 51 may be adhered to the capacitor 4 via an adhesive. Further, the capacitor 4 and the capacitor joint 51 may be welded to each other, or the capacitor joint 51 may be embedded in the capacitor 4.

At the end of the lower Z2 in the extending portion 52, a fastening plate portion 521 for joining the connecting member 5 and the frame 2 is provided. The fastening plate portion 521 has a plate shape protruding outward in the lateral direction Y from the extending portion 52. The fastening plate portion 521 is fastened to the first flange portion 221a of the frame 2 via a bolt 522 as a fastening member. The mode of joining the connecting member 5 and the frame 2 is not limited to the mode of the present embodiment. For example, the connecting member 5 may be adhered to the side wall portion 22 via an adhesive, or may be welded to the side wall portion 22.

Next, the operation and effect of the electronic device 1 according to the present embodiment will be described. The electronic device 1 of the present embodiment has a frame 2 provided with an accommodation space 20, an electronic component 3 accommodated in the frame 2, and a capacitor 4 arranged on the electronic component 3. Therefore, the occupied area of the electronic device 1 in the plan view seen from the stacking direction (that is, the height direction Z) of the electronic component 3 and the capacitor 4 can be reduced.

The capacitor 4 has a lower bonded portion 41 below Z2 below the position 40 which is ½ of the height thereof, and is bonded to the frame 2 at the lower bonded portion 41. The capacitor 4 has an upper bonded portion 42 above Z1 above the position 40 which is 1/2 of the height thereof, and is bonded to the frame 2 via the connecting member 5 at the upper bonded portion 42. .. Therefore, the capacitor 4 is held in the frame 2 at both positions above and below the center of gravity of the capacitor 4, and the displacement of the capacitor 4 when vibration is applied is the position of the center of gravity of the capacitor 4 in the height direction Z. It can be suppressed from both sides. As a result, the capacitor 4 can be firmly held, and problems such as the capacitor 4 falling off or being damaged from the frame 2 can be avoided.

Further, the connecting member 5 of the present embodiment has a capacitor joining portion 51 joined to the upper bonded portion 42 and an extending portion 52 connected to the capacitor joining portion 51 and extended toward the side wall portion 22. is doing. The capacitor junction 51 projects toward the capacitor 4 with respect to the extension 52. Therefore, the capacitor 4 can be sandwiched from both sides in the height direction Z by the boss 211 joined to the lower joined portion 41 and the capacitor joining portion 51 joined to the upper joined portion 42. As a result, it can be held more firmly than the capacitor 4.

The upper bonded portion 42 of the capacitor 4 projects outward, and the capacitor joint 51 is fastened to the upper bonded portion 42 via a bolt 421 as a fastening member. As a result, the occupied volume of the capacitor element 44 occupied in the capacitor 4 can be made larger, and the capacity of the capacitor 4 can be made larger.

The capacitor 4 is arranged along the first side wall portion 22a of the frame 2. Therefore, the length of the connecting member 5 that connects the capacitor 4 and the frame 2 can be made relatively short. As a result, the load applied to the connecting member 5 when vibration is applied to the electronic device 1 can be reduced, and problems such as the capacitor 4 falling off or being damaged from the frame 2 can be more effectively avoided.

The electronic component 3 has a semiconductor module provided with a semiconductor switching element, and the semiconductor module and the capacitor 4 are electrically connected to each other so as to form a power conversion circuit. That is, the electronic device 1 of the present embodiment is configured as a power conversion device. In the power conversion device, a smoothing capacitor or a filter capacitor having a relatively large capacity is used for smoothing the current and reducing the ripple. Therefore, there is a problem that the occupied volume and mass of the capacitor 4 tend to increase, and the inertia applied to the capacitor 4 tends to increase when vibration is applied to the power conversion device.

In the present embodiment, as described above, the capacitor 4 is arranged on the electronic component 3 and the capacitor 4 is held from both sides of the center of gravity position in the height direction Z, so that the plane is viewed from the height direction Z. The capacitor 4 can be firmly held while reducing the occupied area of the electronic device 1 in the visual direction. Therefore, the capacitor 4 can be firmly held even when a smoothing capacitor or a filter capacitor having a relatively large capacity is used. As a result, it is possible to more effectively avoid problems such as the capacitor 4 falling off or being damaged from the frame 2 when vibration is applied to the electronic device 1.

As described above, according to the electronic device 1 of the above aspect, the capacitor 4 can be firmly held and the occupied area of the electronic device 1 in the plan view seen from the height direction Z can be reduced.

(Embodiment 2)
This embodiment is an example of an electronic device 102 in which the capacitor joint portion 54 of the connecting member 502 is embedded in the capacitor 402. In addition, among the reference numerals used in the second and subsequent embodiments, the same reference numerals as those used in the above-mentioned embodiments represent the same components and the like as those in the above-mentioned embodiments, unless otherwise specified.

The capacitor 402 of the present embodiment has a capacitor case 46, a capacitor element 44 housed in the capacitor case 46, and a potting resin 45 that fills a gap between the capacitor case 46 and the capacitor element 44. There is. The capacitor case 46 has the same configuration as the capacitor case 43 of the first embodiment except that the upper bonded portion 47 does not project outward from the capacitor 402.

As shown in FIG. 4, the connecting member 502 has a capacitor joint portion 54, an extension portion 52 that is connected to the capacitor joint portion 54 and extends toward the first side wall portion 22a, and a lower Z2 of the extension portion 52. It has a fastening plate portion 521 provided at the end portion of the. The capacitor junction 54 protrudes inward from the extension 52 on the capacitor 402 side, that is, in the lateral direction Y. Further, the capacitor joint portion 54 is embedded in the upper bonded portion 47 of the capacitor case 46, and the extension portion 52 is embedded in the capacitor case 46. Others are the same as those in the first embodiment.

As in the present embodiment, the capacitor bonding portion 54 may be bonded to the capacitor 402 by being embedded in the capacitor 402. In this case, as compared with the first embodiment, the work of fastening the capacitor joint portion 54 to the capacitor 402 can be omitted, and the work of assembling the electronic device 102 can be further simplified. In addition, the electronic device 102 of the present embodiment can exert the same action and effect as the electronic device 102 of the first embodiment.

(Other embodiments)
The present invention is not limited to each of the above embodiments, and can be applied to various embodiments without departing from the gist thereof. For example, in the first and second embodiments, the example of the electronic device 1 in which the capacitor joints 51 and 54 of the connecting members 5 and 502 hold the capacitors 4 and 402 from the upper Z1 is shown, but the connecting member is vertical. The capacitor may be held from the direction X or the lateral direction Y.

For example, as in the electronic device 103 shown in FIG. 5, the capacitor joint portion 55 extends in the height direction Z and is fastened to the side peripheral surface of the capacitor 402 via a bolt 421 as a fastening member. May be good. In this case, the same effects as those of the first and second embodiments can be obtained except for the effect of sandwiching the capacitor 402 from both sides in the height direction Z by the lower bonded portion 41 and the capacitor joining portion 51. ..

1, 102, 103 Electronic equipment 2 Frame 20 Accommodation space 21 Board part 22 Side wall part 3 Electronic component 4, 402 Capacitor 41 Lower joint part 42 Upper joint part 5, 502, 503 Connecting member

Claims (6)

A frame (2) having an accommodation space (20) composed of a substrate portion (21), a side wall portion (22) erected on the outer peripheral edge of the substrate portion, and the substrate portion and the side wall portion.
Electronic components (3) arranged in the accommodation space and
Capacitors (4, 402) arranged above (Z1) of the electronic component in a state where the substrate portion is directed downward (Z2).
It has a connecting member (5, 502, 503) that connects the frame and the capacitor.
The capacitor is
A lower bonded portion (41) arranged below the position (40) of 1/2 the height of the capacitor when the substrate portion is directed downward, and bonded to the frame.
Electronic devices (1, 102, 103) that are located above half the height of the capacitor and have upper bonded portions (42, 47) joined to the connecting member. .. The connecting member includes a capacitor joint portion (51, 54) joined to the upper bonded portion and an extension portion (52) connected to the capacitor joint portion and extended toward the side wall portion. The electronic device (1, 102) according to claim 1, wherein the capacitor joint portion protrudes toward the capacitor side from the extension portion. The electronic device (1) according to claim 2, wherein the upper bonded portion of the capacitor protrudes outward, and the capacitor joint is fastened to the upper bonded portion via a fastening member (421). ). The electronic device (102) according to claim 2, wherein the capacitor junction is embedded in the capacitor. The electronic device according to any one of claims 1 to 4, wherein the capacitor is arranged along the side wall portion of the frame. The electronic component has a semiconductor module including a semiconductor switching element, and the semiconductor module and the capacitor are electrically connected to each other so as to form a power conversion circuit, according to claims 1 to 5. The electronic device according to any one of the items.

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