JP7024111B2 - 電子ビーム製造中にビルド品質を監視及び制御するシステム並びに方法 - Google Patents
電子ビーム製造中にビルド品質を監視及び制御するシステム並びに方法 Download PDFInfo
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Description
このように、繰り返しの実行の費用を回避し、高価な組立後の検査及び特徴付けの必要性を回避するために、高歩留まりの部品組立を提供する付加製造システムが望まれている。システムは、現場での監視及び分析、層画像の測定、並びに発見された欠陥の現場での修復またはビルドの中止のための能力に応じて、リアルタイムかつ現場でのビルド品質の制御を提供する。
Claims (18)
- ビルド部品の電子ビーム製造中のビルド品質を監視及び制御するシステムであって、
ハウジングと、
ビルドチャンバ内に配置されたビルドプラットフォームと、
前記ビルドチャンバ内の前記ビルドプラットフォームを移動させるアクチュエータと、
を含む、前記ビルドチャンバと、
溶融プールを形成するため、前記ビルドチャンバ内、かつ、前記ビルドプラットフォーム上に配置された金属粉末の層上に、少なくとも1つの電子ビームを向ける少なくとも1つの電子ビーム源と、
前記ビルド部品の少なくとも1つの欠陥を検出するために前記少なくとも1つの電子ビームに曝されている領域及び前記溶融プールから放出された後方散乱エネルギをリアルタイムで検出し、前記欠陥を表す検出信号を生成するように構成されている検出器と、
前記検出信号を受信し、分析し、前記ビルドプラットフォーム上の前記金属粉末の層上に前記少なくとも1つの電子ビームを向け、3次元ビルド部品を適応的に形成するように前記金属粉末の層のパターン化された部分を連続的に固化させるように、少なくとも1つの電子ビーム源及び少なくとも1つの前記アクチュエータを制御する補正信号を生成するように構成されているコントローラと、
を含み、
溶融プールを形成するために、前記ビルドプラットフォーム上に配置された金属粉末の複数の堆積層上及び前記ビルドチャンバ内に複数の電子ビームを向ける複数の電子ビーム源を含み、
前記複数の電子ビームの少なくとも1つは、専用のビルド分析ビームである、
システム。 - 前記ビルド部品の前記欠陥は、前記ビルド部品の微細構造、密度、トポグラフィ、及び化学的性質の少なくとも1つである、
請求項1に記載のシステム。 - 前記検出器は、前記ビルド部品の密度、トポグラフィ、微細構造、及び化学的性質の少なくとも1つをリアルタイムかつ現場での検出を提供するように構成されている、請求項1に記載のシステム。
- 前記後方散乱エネルギは、前記金属粉末及び前記溶融プールの少なくとも1つから放出される後方散乱電子、二次電子、オージェ電子、後方散乱光子、及び放射線の少なくとも1つである、請求項1に記載のシステム。
- 前記検出器は、エネルギ感知光子計数検出器である、請求項1に記載のシステム。
- 前記検出器が、少なくとも1つのエネルギ及び波長分散コンポーネントを含む、請求項1に記載のシステム。
- 前記検出器は、前記ビルドチャンバ内の既存のポートに後付けされた後付け検出器である、請求項1に記載のシステム。
- 前記ビルド部品は、タービン部品及びタービン部品修理の1つを含む、請求項1に記載のシステム。
- 金属粉末の複数の堆積層から3次元ビルドを適応的に形成するシステムであって、
ハウジングと、
ビルドチャンバ内に配置されたビルドプラットフォームと、
前記ビルドチャンバ内の前記ビルドプラットフォームを移動させるアクチュエータと、
を含む、前記ビルドチャンバと、
溶融プールを形成するため、前記ビルドチャンバ内、かつ、前記ビルドプラットフォーム上に配置された金属粉末の堆積層上に、少なくとも1つの電子ビームを向ける少なくとも1つの電子ビーム源と、
前記少なくとも1つの電子ビームに曝されている領域及び前記溶融プールから放出された後方散乱エネルギをリアルタイムに検出し、検出は、微細構造、密度、トポグラフィ、及び化学的性質の少なくとも1つにおける欠陥を示し、前記欠陥を表す検出信号を生成するように構成されている検出器と、
前記検出信号を受信し、分析し、補正信号を生成するプロセッサと、
前記補正信号を受信し、前記ビルドプラットフォーム上の前記金属粉末の堆積層上に前記少なくとも1つの電子ビームを向け、3次元ビルド部品を適応的に形成するように複数の前記金属粉末の堆積層のパターン化された部分を連続的に固化させるように、少なくとも1つの電子ビーム源及び少なくとも1つの前記アクチュエータの制御を提供するように構成されているコントローラと、
専用のビルド分析ビームと、
を含むシステム。 - 前記後方散乱エネルギは、前記溶融プール及び下にある粉末層の少なくとも1つから放射される後方散乱電子、二次電子、オージェ電子、後方散乱光子、及び放射線の少なくとも1つである、請求項9に記載のシステム。
- 前記検出器は、エネルギ感知光子計数検出器である、請求項9に記載のシステム。
- 前記検出器が、少なくとも1つのエネルギ及び波長分散型X線分析器を含む、請求項9に記載のシステム。
- 前記検出器は、前記ビルドチャンバ内の既存のポートに後付けされた後付け検出器である、請求項9に記載のシステム。
- 前記少なくとも1つの電子ビーム源は、前記複数の堆積層に対して固定され、
前記コントローラは、前記金属粉末の複数の堆積層上に前記少なくとも1つの電子ビーム源を個々に向けるように動作可能である、
請求項9に記載のシステム。 - 前記コントローラは、単結晶構造を有する3次元部品を形成するために、前記補正信号に応じて、前記複数の金属粉末の堆積層の前記パターン化された部分を固化する速度を最適化するように動作可能である、請求項9に記載のシステム。
- ビルド部品の電子ビーム製造中のビルド品質を監視及び制御する方法であって、
(a)少なくとも1つの電子ビーム源を提供し、
(b)溶融プールを形成するために、金属粉末の堆積層に少なくとも1つの電子ビームを向けるために、前記少なくとも1つの電子ビーム源を制御し、
(c)前記溶融プール及び表面層の少なくとも1つの欠陥の存在を判定するために、少なくとも1つの前記溶融プールから後方散乱エネルギをリアルタイムで検出し、
(d)前記溶融プール内の検出された欠陥に応じて、少なくとも1つの電子ビーム及びビルドプレートを調整し、前記金属粉末の堆積層のパターン化された部分を固化するために、アクチュエータ及び前記電子ビーム源の少なくとも1つを制御する、
(e)3次元ビルド部品を形成するために、(a)~(d)を繰り返し、
溶融プールを形成するために、ビルドプラットフォーム上に配置された金属粉末の複数の堆積層上及びビルドチャンバ内に複数の電子ビームを向ける複数の電子ビーム源を含み、
前記複数の電子ビームの少なくとも1つは、専用のビルド分析ビームである、
方法。 - 前記制御することが、単結晶構造を有する前記3次元ビルド部品を形成するために、前記溶融プール内の検出された欠陥に応じて、複数の前記金属粉末の堆積層の前記パターン化された部分を固化する速度を最適化する、ことを含む、請求項16に記載の方法。
- 前記3次元ビルド部品が、タービン部品またはタービン部品修理である、請求項16に記載の方法。
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US15/919,771 US11413698B2 (en) | 2018-03-13 | 2018-03-13 | System and method for monitoring and controlling build quality during electron beam manufacturing |
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