JP7022980B2 - Wafer peeling equipment and wafer polishing equipment - Google Patents

Description

The present invention relates to a wafer peeling device and a wafer polishing device.

In a polishing device for a semiconductor wafer such as silicon, double-sided polishing or single-sided polishing of the wafer is performed. In the case of single-sided polishing of a wafer, the wafer is attached to a ceramic plate, and the plate is carried onto the surface plate in the polishing section so that the surface to be polished, which is the lower surface side of the wafer, faces the surface plate surface. The plate is pressed by the ring, and the surface plate and the top ring (plate) are rotated relative to each other to polish the surface to be polished of the wafer.
There are three types of methods for attaching the wafer to the plate: vacuum suction method, adhesive adhesion method, and water attachment method using the frictional force of the suede cloth attached to the plate surface. ..
In any case, after polishing, it is necessary to peel the wafer from the plate.

Patent Document 1 (Japanese Unexamined Patent Publication No. 2002-319610) discloses a wafer peeling storage device. In the peeling device shown in Patent Document 1, the plate is carried in a state of being tilted on the support base so that the surface to be polished faces upward, and the wafer is peeled by a wedge-shaped peeling jig. Then, the peeled wafer is slid on the inclined surface while shuffling water from the nozzle, and is guided by a guide to be stored in a predetermined position of the storage portion arranged in the water tank.

Japanese Unexamined Patent Publication No. 2002-319610

In the wafer peeling device shown in Patent Document 1, the peeled wafer is stored in a storage portion arranged in a water tank while being showered with water and guided by a guide, so that the wafer is polished. It is suitable because particles do not adhere to the surface.
However, in Patent Document 1, when the plate is carried from the polishing portion to the peeling device, the surface to be polished of the wafer is upward from the state where the surface to be polished of the wafer is facing downward in the polishing portion. It is necessary to invert it so that it faces the surface and carry it into the peeling device. In this case, some kind of reversing device is used, but there is a risk of damaging the surface to be polished of the wafer during handling at that time. Further, since the wafer is peeled from the plate by using a wedge-shaped peeling jig even after being carried into the peeling device, there is a problem that the surface to be polished of the wafer may be damaged at that time as well.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a wafer peeling device and a wafer polishing device capable of avoiding a defect of damaging the surface to be polished as much as possible.
In order to achieve the above object, the present invention comprises the following configurations.
That is, in the wafer peeling device according to the present invention, the surface to be polished of the wafer attached to the lower surface of the plate is pressed against the platen, and the platen and the plate are relatively rotated to polish the wafer. A first wafer peeling device that peels the wafer from the plate, the inner wall of which is formed on a tapered surface that narrows downward, and the plate can be guided by the inner wall and positioned on the bottom surface to be received. 2. The first recess of the tray with the tray having the recess, the water supply mechanism for supplying water into the tray, and the plate after polishing the wafer with the surface to be polished of the wafer facing downward. Water is ejected to the outer peripheral portion of the wafer attached to the plate, which is provided in the tray and carried into the first recess of the tray, to peel off the wafer. A nozzle device for dropping the peeled wafer into the water in the second recess, a plate carrying portion for carrying the plate after the wafer is peeled from the first recess to the outside of the tray, and the above. It is characterized by comprising a wafer carry-out portion that holds the back surface of the surface to be polished of the wafer and carries out the wafer out of the tray after the plate is carried out.

It is preferable that the wafer is a wafer whose plate is water-bonded.
A plurality of the nozzle devices are arranged on the tray at intervals in the circumferential direction, and water is ejected from each of the nozzle devices toward the outer peripheral portion of the wafer attached to the plate from diagonally below. Is suitable.

The water supply mechanism is provided with a water supply unit that supplies water into the tray from a water supply port that opens in the bottom surface of the second recess, and a water supply unit that discharges water supplied into the tray to keep the water level in the tray constant. It can be composed of a drainage portion and a backing plate which is arranged so as to cover the upper part of the water supply port of the water supply portion and guides the water supplied into the tray in the lateral direction.

The inner wall of the second recess can be formed into a tapered surface that narrows downward.
It is preferable to fix the tray on a slide table that can slide laterally with respect to the support portion.
Further, it is preferable that the support portion is provided so as to be vertically movable by an elevating device.

Further, the wafer polishing apparatus according to the present invention is a wafer polishing apparatus for polishing the wafer by pressing the surface to be polished of the wafer attached to the lower surface of the plate against the platen and rotating the platen and the plate relative to each other. A sticking part for sticking the wafer to the plate, a loading part in which a plurality of the plates to which the wafer is stuck in the sticking part are positioned on a support base and carried by a carry-in device, and the like. A plurality of polishing portions having a platen and a plurality of polishing portions in the final stage, in which the plurality of plates carried into the loading section are carried in by a transport device and the wafer is polished. The wafer peeling device according to any one of the above, which also serves as an unloading portion, and the plate from the plurality of wafer peeling devices, wherein the wafer is carried in together with the plate with the surface to be polished facing downward. It is characterized by including a mounting section on which the plate carried out by the carry-out section is placed, and a storage section in which the peeled wafer carried out by the wafer transfer section from a plurality of the wafer peeling devices is stored. And.

The support base in the loading unit is configured as a rotary table that is sequentially positioned and rotated in a horizontal plane, and the plate to which the wafer is attached is placed in a predetermined position of the support table rotated to a predetermined position by the carry-in device. It can be carried in sequentially.
A plurality of the wafer peeling devices in the unloading section are arranged on a turntable that is sequentially positioned and rotated in a horizontal plane, and the plates are sequentially removed from the wafer peeling device rotated at a predetermined position by the plate carrying section. It is possible to carry out the wafer upside down on the above-mentioned placement portion, and after carrying out the plate, sequentially carry out the wafer after peeling by the wafer carry-out portion and store it in the storage portion.

A new wafer on the plate, which is inverted from the wafer peeling device and is carried out and placed on the plate, a cleaning portion where the wafer-attached surface of the plate is cleaned, and a plate cleaned by the cleaning portion. It is preferable to provide a plate circulation device including the sticking portion to which the plate is attached, and the plate carrying portion in which the plate to which the wafer is attached is turned upside down and carried into the loading portion.

According to the present invention, the wafer polished in the final polishing portion is carried into the tray of the wafer peeling device in a state where the upper surface of the plate is attracted by the transport device (the wafer has the surface to be polished facing down), and is carried into the tray of the conventional wafer peeling device. Since handling such as inverting the plate is not performed as described above, damage to the wafer is prevented as much as possible from this point.
Further, in the present invention, since the wafer is easily separated from the plate by the jet output of water, damage to the wafer is avoided as much as possible.
Further, in the present invention, after the plate is carried out on the mounting part by the plate carrying part, the peeled wafer holds the back surface of the surface to be polished of the wafer by the wafer carrying part and reaches the wafer storage part in the water tank. Since the wafer is transported and stored in the storage portion, it is possible to prevent the wafer from being damaged on the surface to be polished from this point as well.

It is a top view which shows the whole outline of a polishing apparatus. It is explanatory drawing of the state which the wafer is attached to the plate. It is a front view which shows the outline of a polished part. It is sectional drawing of the wafer peeling apparatus. It is sectional drawing of the wafer peeling apparatus (without a plate). It is a top view of the wafer peeling apparatus. It is an enlarged view of a nozzle device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing an outline of the entire wafer polishing apparatus 10, FIG. 2 is an explanatory view of a state in which a wafer is attached to a plate, and FIG. 3 is a front view showing an outline of a polishing portion.
First, the polishing apparatus 10 will be described with reference to FIG. 1 together with its operation.
Reference numeral 12 is a plate circulation device, which includes a sticking portion 15 for sticking the wafer 14 to the plate 13. The wafer 14 is water-coated on the plate 13 by a known method (FIG. 2). Details of the plate circulation device 12 will be described later.

Reference numeral 16 is a loading portion, and a plurality of plates 13 (five in FIG. 1) to which the wafer 14 is attached can be rotated in a horizontal plane by the carry-in device 18 from the carry-in position 43 in the plate circulation device 12. It is positioned on the support base 17 provided in the above and is sequentially carried in. The plate 13 is inverted by the carry-in device 18 so that the surface to be polished of the wafer 14 faces downward, and is carried onto the support base 17. The support base 17 is sequentially rotated by a required rotation angle, and the plate 13 is carried into a predetermined position on the support base 17 by the carry-in device 18.

Nos. 20, 21 and 22 are known polishing portions.
The polishing unit 20 is a primary polishing unit, and rough polishing of the wafer 14 is performed. The polishing unit 21 is a secondary polishing unit, and medium polishing of the wafer 14 is performed. The polishing unit 22 is the final polishing unit, and the wafer 14 is finished and polished. Each of the polishing portions 20, 21 and 22 has a surface plate 24 to which a polishing cloth is attached and rotates in a horizontal plane. When polishing the wafer 14, the slurry is supplied from a slurry supply unit (not shown).
Five support arms 26 with support rollers are arranged at required intervals in each of the polishing portions 20, 21 and 22. Each support arm 26 rotatably supports each plate 13 carried in by the transport device on the surface plate 24.

The loading unit 16, the polishing unit 20, the polishing unit 21, the polishing unit 22, and the wafer peeling device described later are arranged on the same circumference in this order. Carrying in 5 plates 13 from the loading part 16 to the polishing part 20, carrying in 5 plates 13 from the polishing part 20 to the polishing part 21, carrying in 5 plates 13 from the polishing part 21 to the polishing part 22 The five plates 13 are carried from the polishing unit 22 to the wafer peeling device 28 by a common transfer device 30 having two arms. The transport device 30 is provided so as to rotate about the rotation shaft 30a. Five suction devices are attached to the tip of each arm of the transfer device 30, and the plate 13 is sucked and conveyed by the suction device.

FIG. 3 is a front view showing an outline of each of the polished portions 20, 21 and 22.
Each polishing portion 20, 21, 22 has five top rings 31 (only two are shown in FIG. 3) for pressing each plate 13 carried onto the surface plate 24. Each top ring 31 is moved up and down by the cylinder device 32 so that the plate 13 can be pressed with a required pressure. Further, the top ring 31 is rotatably provided about an axis by a drive device (not shown). By rotating the top ring 31, the plate 13 pressed by the top ring 31 is also rotated.

With the above configuration, the five wafers 14 sequentially carried in from the loading section 16 are primary polished in the polishing section 20 by rotating the surface plate 24 and the top ring 31 and supplying the slurry on the surface plate 24. However, the secondary polishing is performed in the polishing unit 21, and the final polishing is performed in the polishing unit 22.
The polishing units 20, 21, and 22 are provided with a brush device 33 for dressing the polishing cloth.

The five wafers 14 that were finally polished in the polishing section 22 were attached to the plate 13 and provided at five locations of the wafer peeling device 28 by the transfer device 30 with the surface to be polished facing downward. It is carried into each individual peeling device. The wafer 14 is peeled from the plate 13 in each of the individual peeling devices provided at these five locations.
Details of this individual peeling device will be described later.

The plate 13 from which the wafer 14 has been peeled off by each individual peeling device is inverted on the mounting table (mounting portion) 36 in the plate circulation device 12 by the plate carrying portion 35 (the surface on which the wafer 14 is attached is attached). It is carried in (upward).
The individual peeling devices in the wafer peeling device 28 are arranged on the rotary table 29 in a predetermined arrangement. The plate 13 is sequentially carried out onto the mounting part 36 by the plate carrying portion 35 from each peeling device that is rotated at a predetermined position by rotating the rotary table 29 by a predetermined rotation angle.

The plate circulation device 12 is basically composed of a roller device, and is adapted to perform various treatments on the plate 13 after the wafer 14 is peeled off while the plate 13 is being conveyed.
The plate 13 is carried from the mounting portion 36 to the delivery portion 37. The new plate 13 can also be carried into the delivery section 37 from the stocker 38 of the new plate.
Reference numeral 39 is a cleaning portion, and the lower surface of the plate 13 is cleaned with a brush using cleaning water. 40 is also a cleaning unit, and the upper surface of the plate 13 is cleaned with a brush using cleaning water. A suede cloth capable of containing a required amount of water is attached to the upper surface (attaching surface of the wafer) of the plate 13 so that the wafer 14 can be attached with water. Will be included.

Reference numeral 41 denotes a draining portion, and the water is absorbed by, for example, an appropriate cloth so that the required amount of water contained in the suede cloth is obtained, and the water content is adjusted.
Reference numeral 15 is the above-mentioned sticking portion, and the moisture-adjusted plate 13 is positioned and carried in.
Reference numeral 42 is a stocker in which the wafer 14 is stocked. The wafer 14 is positioned and carried onto the plate 13 in the sticking portion 15 from the stocker 42, and is pressed onto the plate 13, so that the wafer 14 is accurately positioned and stuck on the plate 13.

It is important that the wafer 14 is accurately positioned and attached onto the plate 13 in the polishing of the wafer 14 in the subsequent process and in the peeling of the wafer 14 in the wafer peeling device 28.
The plate 13 to which the wafer 14 is attached is carried in to the carry-in position 43 to the loading part 16, is inverted by the carry-in device 18 as described above, and is carried into the required position of the loading part 16.
In this way, the plate 13 can be circulated and used.

When the plate 13 is carried out from the wafer peeling device 28, the peeled wafer 14 remains in the individual peeling device. In this case, the wafer 14 is in a state where the back surface of the surface to be polished faces upward.
The wafer 14 is sucked and conveyed from each individual peeling device that is rotated to the required position by the rotation of the turntable 29, and the back surface of the surface to be polished on the upper surface thereof is sucked and conveyed by the wafer carry-out portion 45 equipped with the suction device. The wafer is stored in the wafer storage unit (cassette) 47 arranged in the 46.
As described above, the wafer 14 is attached to the plate 13, the wafer 14 is polished in each of the polishing portions 20, 21 and 22, the wafer 14 is peeled off, the plate 13 is carried out, the circulation is performed, and the peeled wafer 14 storage section (wafer). Storage in the storage unit 47) can be continuously and automatically performed.

Next, the individual peeling device in the wafer peeling device 28 will be described with reference to FIGS. 4 to 6.
4 and 5 are cross-sectional views of an individual wafer peeling device (hereinafter, may be simply referred to as a peeling device) 28, FIG. 6 is a plan view thereof, and FIG. 7 is an enlarged view of the nozzle device.
The wafer peeling device 28 has a tray 50.
The tray 50 is formed on a tapered surface 51a whose inner wall narrows downward, and the plate 13 is guided by the inner wall of the tapered surface 51a to be positioned on the bottom surface and can be received by a first recess (plate receiving recess). ) 51. 4 and 6 show a state in which the plate 13 is positioned and received in the first recess 51. FIG. 5 shows the state before receiving the plate.

Further, the tray 50 is recessed in the bottom surface of the first recess 51, has an inner diameter smaller than that of the bottom surface of the first recess 51, and can accommodate the peeled wafer 14 by positioning the outer periphery by the inner wall. It has 2 recesses (wafer receiving recesses) 52.
When the upper part of the inner wall of the second recess 52 is formed on the tapered surface 52a that narrows downward, the peeled wafer 14 is guided by the tapered surface and falls in a state of being positioned in the second recess 52. Suitable.
FIG. 4 shows a state in which the peeled wafer 14 has fallen into the second recess 52. A recess is further formed in the bottom surface so that the surface to be polished of the wafer 14 does not contact the bottom surface of the second recess 52, and only the outer edge portion of the wafer 14 contacts the bottom surface of the second recess 52. It is good to be able to receive it.

Water is supplied from the water supply mechanism 54 to the inside of the tray 50.
The water supply mechanism 54 has a water supply unit 55 that supplies water into the tray 50 from a water supply port that opens at the bottom surface of the second recess 52, and discharges the water supplied into the tray 50 to keep the water level in the tray 50 constant. It has a drainage section 56 for holding and a backing plate 57 which is arranged so as to cover the upper part of the water supply port of the water supply section 55 and guides the water supplied into the tray 50 in the lateral direction.
The water level in the tray 50 is kept constant by the water supply mechanism 54, and the wafer 14 that has fallen into the second recess 52 is positioned in water with its outer peripheral portion positioned by the inner wall of the second recess 52. It will be in a state of doing.
The backing plate 57 prevents the water flow from being ejected directly toward the wafer 14.

As described above, the plate 13 after polishing the wafer is carried into the first recess 51 of the tray 50 by the transfer device 30 with the surface to be polished of the wafer 14 facing downward, and is guided to the tapered surface 51a. Is positioned.
Then, in the tray 50, a nozzle device 60 that ejects water toward the outer peripheral portion of the wafer 14 attached to the plate 13 carried into the first recess 51 of the tray 50 by the transport device 30 is provided in the tray 50. Four are provided at appropriate intervals in the circumferential direction.
As is clear from FIG. 7, water is ejected from the nozzle device 60 diagonally upward toward the outer peripheral portion of the wafer 14 from the nozzle opening 61 opened obliquely upward in the tray 50.

By ejecting water from the nozzle device 60 toward the outer peripheral portion of the wafer 14, the wafer 14 adhered to the plate 13 is easily peeled off from the plate 13.
The peeling of the wafer 14 by the jet output of water can be applied not only to the peeling of the wafer 14 bonded to the plate 13 but also to the peeling of the wafer 14 bonded by a water-soluble adhesive having a weak adhesive force.
Further, in the above configuration, since a strong water flow is not directly applied to the wafer 14, the wafer 14 can be reliably peeled off without damaging the film on the wafer surface which is applied for the purpose of surface protection and improvement of wettability. ..
In the peeled wafer 14, after the plate 13 is carried out on the mounting portion 36 by the plate carrying portion 35 as described above, the wafer carrying portion 45 holds the back surface side of the surface to be polished of the wafer 14. , Is transported to the wafer storage section 47 in the water tank 46 and is stored.

In this embodiment, the tray 50 is fixed on a slide table 64 that can slide laterally with respect to the support portion 63. As a result, even if the positions of the plate 13 and the tray 50 transported by the transport device 30 are slightly displaced, the plate 13 abuts on the tapered surface 51a and the tray 50 can move laterally, so that the displacement is displaced. It will be adjusted.
The slide base 64 may be made to move freely in the horizontal direction by providing a sliding portion 66 on the upper surface of the supporting portion 63 (see FIG. 5).
Further, the support portion 63 may be provided with respect to the base portion 65 so as to be vertically movable by an elevating device. As a result, the tray 50 can move so as to be closer to the plate 13 that has been moved to a predetermined position by the transport device 30, and the misalignment between the plate 13 and the tray 50 can be adjusted more easily. be able to.
As a specific example of the elevating device, as shown in FIG. 5, there is a cylinder mechanism 67 including a rod 68 and a cylinder 69. By moving the rod 68 up and down, the support portion 63 and the slide base 64 move, so that the tray 50 can be moved up and down.

In the present embodiment, the wafer 14 polished by the final polishing unit 22 is attracted to the upper surface of the plate 13 by the transfer device 30 (the wafer 14 has the surface to be polished facing downward), and the tray of the wafer peeling device 28 is used. Since the wafer is carried into the 50 and is not handled such as inverting the plate as in the conventional case, the wafer 14 is prevented from being damaged as much as possible from this point.
Further, in the present embodiment, as described above, the wafer 14 is easily peeled off from the plate 13 by the jet output of water, so that damage to the wafer 14 is avoided as much as possible.
Further, in the present embodiment, as described above, in the peeled wafer 14, the plate 13 is carried out onto the mounting portion 36 by the plate carrying portion 35, and then the wafer 14 is subjected to the polished surface of the wafer 14 by the wafer carrying portion 45. Since the back surface side is held and transported to and stored in the wafer storage portion 47 in the water tank 46, it is possible to prevent the wafer 14 from being damaged on the polished surface side as much as possible from this point as well.

10 Polishing device, 12 Plate circulation device, 13 Plate, 14 Wafer, 15 Pasting part, 16 Loading part, 17 Support stand, 18 Carrying device, 20 Polishing part, 21 Polishing part, 22 Polishing part, 24 Plate, 26 Support arm , 28 Wafer peeling device, 29 turntable, 30 transfer device, 30a rotary shaft, 31 top ring, 32 cylinder device, 33 brush device, 35 plate carry-out part, 36 mounting part, 37 delivery part, 38 stocker, 39 cleaning part , 40 Cleaning part, 41 Draining part, 42 Stocker, 43 Carry-in position, 45 Wafer unloading part, 46 Water tank, 47 Wafer storage part, 50 tray, 51 First recess, 51a Tapered surface, 52 Second recess, 52a Tapered Surface, 54 water supply mechanism, 55 water supply part, 56 drainage part, 57 backing plate, 60 nozzle device, 61 nozzle port, 63 support part, 64 slide base, 65 base, 66 sliding part, 67 cylinder mechanism, 68 rod, 69 cylinder

Claims (11)

A wafer peeling device that presses the surface to be polished of a wafer attached to the lower surface of a plate against a surface plate, rotates the surface plate and the plate relative to each other to polish the wafer, and then peels the wafer from the plate. There,
The inner wall is formed on a tapered surface that narrows downward, and the plate is guided by the inner wall and positioned on the bottom surface to be positioned and received. A tray having a second recess that has an inner diameter smaller than the bottom surface of the first recess and can accommodate the wafer after peeling by positioning the outer circumference with an inner wall.
A water supply mechanism that supplies water to the tray,
A transport device that carries the plate after polishing the wafer into the first recess of the tray with the surface to be polished of the wafer facing downward.
Water is ejected to the outer peripheral portion of the wafer attached to the plate provided in the tray and carried into the first recess of the tray to peel off the wafer, and the peeled wafer is referred to as the peeled wafer. A nozzle device that drops the wafer into the water in the second recess,
A plate carry-out portion for carrying out the plate after the wafer is peeled off from the first recess to the outside of the tray.
A wafer peeling device comprising a wafer carry-out portion that holds the back surface side of the surface to be polished of the wafer and carries out the wafer out of the tray after the plate is carried out. The wafer peeling apparatus according to claim 1, wherein the wafer is a wafer bonded to the plate with water. A plurality of the nozzle devices are arranged on the tray at intervals in the circumferential direction, and each of the nozzle devices ejects water from diagonally below toward the outer peripheral portion of the wafer attached to the plate. The wafer peeling apparatus according to claim 1 or 2. The water supply mechanism keeps the water level in the tray constant by discharging the water supply unit that supplies water into the tray from the water supply port that opens in the bottom surface of the second recess and the water supplied in the tray. Claim 1 to any one of claims 1 to 3, characterized by having a drainage portion and a backing plate which is arranged so as to cover the upper part of the water supply port of the water supply portion and guides the water supplied into the tray in the lateral direction. The wafer stripping device described. The wafer peeling apparatus according to any one of claims 1 to 4, wherein the inner wall of the second recess is formed on a tapered surface that narrows downward. The wafer peeling apparatus according to any one of claims 1 to 5, wherein the tray is fixed on a slide table that can slide laterally with respect to a support portion. The wafer peeling device according to claim 6, wherein the support portion is provided so as to be movable up and down by an elevating device. A wafer polishing device that polishes the wafer by pressing the surface to be polished of the wafer attached to the lower surface of the plate against the surface plate and rotating the surface plate and the plate relative to each other.
A sticking part for sticking the wafer to the plate and
A loading section in which a plurality of the plates to which the wafer is attached are positioned on a support base and carried by a loading device in the pasting section.
A polishing unit having a surface plate and a plurality of polishing stages, in which the plurality of plates carried into the loading unit are carried in by a transport device and the wafer is polished.
Any one of claims 1 to 7, wherein the plurality of wafers polished by the polishing portion in the final stage are carried in together with the plate with the surface to be polished facing downward, which also serves as an unloading portion. The wafer stripping device described and
A mounting section on which the plate carried out by the plate unloading section from the plurality of wafer peeling devices is mounted, and a mounting section on which the plate is mounted.
A wafer polishing device comprising a storage section for accommodating the wafer after peeling, which is carried out from the plurality of wafer peeling devices by the wafer carry-out section. The support base in the loading unit is configured as a rotary table that is sequentially positioned and rotated in a horizontal plane, and the plate to which the wafer is attached is sequentially carried into a predetermined position of the support table by the carry-in device. The wafer polishing apparatus according to claim 8. A plurality of the wafer peeling devices in the unloading section are arranged on a turntable that is sequentially positioned and rotated in a horizontal plane, and from the wafer peeling device rotated to a predetermined position, the plates are sequentially mounted by the plate unloading section. 8. The eighth aspect of the present invention is characterized in that the wafer is carried out upside down on the above-mentioned placing portion, and after the plate is carried out, the peeled wafers are sequentially carried out by the wafer carrying out portion and stored in the storage portion. Or the wafer polishing apparatus according to 9. New to the above-mentioned mounting portion of the plate which is inverted from the wafer peeling device and carried out and placed, the cleaning portion where the affixed surface of the wafer of the plate is cleaned, and the plate cleaned by the cleaning portion. A claim comprising a plate circulation device including a sticking portion to which a wafer is affixed, and a carrying device for carrying the plate to which the wafer is affixed upside down into the loading portion. Item 10. The wafer polishing apparatus according to Item 10.

Images