JP7001101B2 - Interposers and electronic devices - Google Patents

Description

The present invention relates to an interposer for connecting a plurality of circuit boards on which a predetermined circuit is formed, and an electronic device including the interposer.

With the increasing integration of circuit boards and electronic components provided in electronic devices, and with the mixture of circuit boards with different wiring densities, multiple circuit boards are electrically connected to each other via an interposer as necessary. May take a structure.

For example, Patent Document 1 discloses a structure in which a first member (first circuit board) and a second member (second circuit board) are electrically connected with an interposer interposed therebetween.

Japanese Unexamined Patent Publication No. 2010-258301

However, in the structure shown in Patent Document 1, it is difficult to obtain an interposer having an arbitrary shape (outer shape) due to the following problems.

(A) The interposer is obtained by dividing a mother substrate formed by laminating a plurality of insulating layers, but a portion having a narrow width (width in a direction orthogonal to the laminating direction of the plurality of insulating layers) in the interposer to be divided. If there is, it is difficult to divide the interposer because the part is easily broken when it is divided.

(B) A mother substrate having a large thickness (thickness in the stacking direction of a plurality of insulating layers) is difficult to process (cut out, etc.), and it is difficult to form a thick interposer in a desired shape. In particular, it is difficult to accurately cut out a portion having a high aspect ratio from the mother substrate.

An object of the present invention is to provide an interposer that can be easily formed into an arbitrary shape, and an electronic device including the interposer.

(1) The interposer of the present invention is
A laminate having a first mounting surface and a second mounting surface facing each other, formed by laminating a plurality of flexible insulating layers, and being bendable.
The first electrode formed on the first mounting surface and
A second electrode that is electrically conductive with the first electrode and is formed on the second mounting surface,
Equipped with
The laminated body is
An upright portion located between the first mounting surface and the second mounting surface and in which the stacking direction of the plurality of insulating layers is parallel to the first mounting surface and the second mounting surface.
It is characterized by having a bent portion that is bent in a plan view of the first mounting surface and the second mounting surface.

In this configuration, since the interposer is formed into a desired shape by bending the laminated body, it is possible to easily form an interposer having an arbitrary shape as compared with the case where the interposer is formed into a desired shape by dividing (cutting out, etc.) from the mother substrate. ..

(2) In the above (1), it is preferable that the laminated body has a notch portion formed in a bent portion (bent portion). According to this configuration, the bent portion is easily bent, and an interposer having a desired shape can be easily formed. Further, with this configuration, the bending radius of the bent portion can be reduced.

(3) In the above (1) or (2), it is preferable that the laminated body has recesses formed in the bent portion in which the number of laminated layers of the insulating layer is smaller than the number of laminated layers of the other portions. According to this configuration, the bendable portion (bent portion) becomes easy to bend, and an interposer having a desired shape can be easily formed. Further, with this configuration, the bending radius of the bent portion can be reduced.

(4) In any of the above (1) to (3), the laminated body is provided with a first connection portion having the first mounting surface, and the first electrode is the said first connection portion. It may be a configuration which is a conductor pattern formed on the first mounting surface and formed on the surface of the insulating layer.

(5) In any of the above (1) to (4), the laminated body is provided with a second connecting portion having the second mounting surface, and the second electrode is the said second connecting portion. It may be a configuration which is a conductor pattern formed on the second mounting surface and formed on the surface of the insulating layer.

(6) In any of the above (1) to (5), among the plurality of insulating layers, two or more insulating layers adjacent to each other are preferably made of a thermoplastic resin. According to this configuration, the laminated body can be easily formed by collectively pressing the plurality of laminated insulating layers, so that the man-hours in the manufacturing process of the laminated body can be reduced and the cost can be kept low. Further, with this configuration, it is possible to realize an interposer that can be easily plastically deformed and can maintain (maintain) a desired shape.

(7) The electronic device of the present invention is
With the first member
The second member and
An interposer that electrically connects the first member and the second member,
Equipped with
The interposer is
A laminate having a first mounting surface and a second mounting surface facing each other, formed by laminating a plurality of flexible insulating layers, and being bendable.
The first electrode formed on the first mounting surface and
A second electrode electrically connected to the first electrode and formed on the second mounting surface,
Have,
The laminated body is
An upright portion located between the first mounting surface and the second mounting surface and in which the stacking direction of the plurality of insulating layers is perpendicular to the first mounting surface and the second mounting surface.
It has a bent portion that is bent in a plan view of the first mounting surface and the second mounting surface.
The first electrode is electrically connected to the first member, and the second electrode is electrically connected to the second member.

With this configuration, it is possible to realize an electronic device having an interposer that can be easily formed into an arbitrary shape.

According to the present invention, it is possible to realize an interposer that can be easily formed into an arbitrary shape and an electronic device including the interposer.

FIG. 1A is an external perspective view of the interposer 301 according to the first embodiment, and FIG. 1B is an external perspective view of the interposer 301 as viewed from another viewpoint. FIG. 2 is a plan view of the interposer 301. FIG. 3 is an external perspective view showing a state of the interposer 301 before bending. FIG. 4 is a perspective view showing in order the manufacturing process of the interposer 301 in the state before bending. FIG. 5A is an exploded perspective view showing a main part of the electronic device 401 according to the first embodiment, and FIG. 5B is a plan view showing the main part of the electronic device 401. FIG. 6A is an external perspective view of the interposer 302 according to the second embodiment, and FIG. 6B is an external perspective view of the interposer 302 as viewed from another viewpoint. FIG. 7 is an external perspective view showing a state of the interposer 302 before bending. FIG. 8 is a perspective view showing in order the manufacturing process of the interposer 302 in the state before bending. FIG. 9 is a plan view showing a main part of the electronic device 402 according to the second embodiment. FIG. 10 is an external perspective view showing a main part of the electronic device 403 according to the third embodiment. FIG. 11 is an external perspective view of the interposer 303 according to the third embodiment. FIG. 12A is an external perspective view showing a state of the interposer 303 before bending, and FIG. 12B is a plan view showing a state of the interposer 303 before bending. FIG. 13 is a perspective view showing in order the manufacturing process of the interposer 303 in a state before bending. 14 (A) is a plan view showing a plurality of laminated bodies 10C divided from the mother substrate 10M, and FIG. 14 (B) is a plan view showing a plurality of laminated bodies 10D divided from the mother substrate 10M. be. FIG. 15A is an external perspective view showing the state of the interposer 304 according to the fourth embodiment before bending, and FIG. 15B is a plan view showing the state of the interposer 304 before bending. FIG. 16 is an external perspective view showing a main part of the electronic device 405 according to the fifth embodiment. 17 (A) is a plan view of the interposer 305 according to the fifth embodiment, and FIG. 17 (B) is a sectional view taken along the line AA in FIG. 17 (A). FIG. 18 is a plan view showing a state of the interposer 305 before bending. FIG. 19 is an exploded perspective view showing a main part of the electronic device 406 according to the sixth embodiment. FIG. 20 is an external perspective view showing a state before bending of the interposer 306 according to the sixth embodiment. FIG. 21 is a perspective view showing in order the manufacturing process of the interposer 306 in a state before bending.

Hereinafter, a plurality of embodiments for carrying out the present invention will be shown with reference to the drawings with reference to some specific examples. The same reference numerals are given to the same parts in each figure. Although the embodiments are shown separately for convenience in consideration of the explanation of the main points or the ease of understanding, partial replacement or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

<< First Embodiment >>
FIG. 1A is an external perspective view of the interposer 301 according to the first embodiment, and FIG. 1B is an external perspective view of the interposer 301 as viewed from another viewpoint. FIG. 2 is a plan view of the interposer 301. FIG. 3 is an external perspective view showing a state of the interposer 301 before bending.

The interposer of the present invention is sandwiched between the first member and the second member, and electrically connects the first member and the second member.

The interposer 301 includes a laminate 10 formed by laminating a plurality of flexible insulating layers (detailed later), a plurality of first electrodes P11, P12, P13, P14, and a plurality of second electrodes. It includes P21, P22, P23, and P24.

The laminate 10 is bent and has a first mounting surface MS1 and a second mounting surface MS2 facing each other. The laminate 10 is formed by bending a flat plate of a thermoplastic resin such as a liquid crystal polymer (LCP) into an L shape.

The bent laminate 10 is L-shaped, for example, by heating and pressurizing the vicinity of the center of the rectangular parallelepiped laminate 10 (rectangular flat plate whose longitudinal direction coincides with the U-axis direction) shown in FIG. 3 in the longitudinal direction. Obtained by folding it into. As a result, a laminated body that maintains (maintains) the bent shape can be obtained.

The plurality of first electrodes P11, P12, P13, P14 are formed on the first mounting surface MS1 of the laminated body 10, and the plurality of second electrodes P21, P22, P23, P24 are formed on the second mounting surface MS2. Has been done. The plurality of first electrodes P11, P12, P13, and P14 are arranged at equal intervals, and the plurality of second electrodes P21, P22, P23, and P24 are arranged at equal intervals.

As shown in FIGS. 1A and 1B, linear conductors 21, 22, 23, 24 are formed inside the laminated body 10 (the surface of the insulating layer). The first electrode P11 and the second electrode P21 are end faces (ends) of the conductor 21 exposed on the first mounting surface MS1 and the second mounting surface MS2, respectively. The first electrode P12 and the second electrode P22 are end faces of the conductor 22 exposed to the first mounting surface MS1 and the second mounting surface MS2, respectively. The first electrode P13 and the second electrode P23 are end faces of the conductor 23 exposed to the first mounting surface MS1 and the second mounting surface MS2, respectively. The first electrode P14 and the second electrode P24 are end faces of the conductor 24 exposed to the first mounting surface MS1 and the second mounting surface MS2, respectively. The conductors 21, 22, 23, 24 are conductor patterns such as Cu foil.

In this way, the first electrode P11 and the second electrode P21 are conducting. The first electrode P12 and the second electrode P22 are conducting. The first electrode P13 and the second electrode P23 are conducting. Further, the first electrode P14 and the second electrode P24 are conducting.

The laminated body 10 has an upright portion. The upright portion is located between the first mounting surface MS1 and the second mounting surface MS2, and the stacking direction of the plurality of insulating layers (detailed later) is parallel to the first mounting surface MS1 and the second mounting surface MS2. (Direction parallel to the XY plane). In the present embodiment, substantially the entire laminated body 10 is the upright portion.

Further, as shown in FIG. 2, the laminated body 10 has a bent portion CR that is bent in a plan view (viewed from the Z-axis direction) of the first mounting surface MS1 and the second mounting surface MS2.

The interposer 301 according to this embodiment is manufactured by, for example, the following process. FIG. 4 is a perspective view showing in order the manufacturing process of the interposer 301 in the state before bending. In FIG. 4, for convenience of explanation, the manufacturing process using individual pieces (one chip) will be described, but the actual manufacturing process is performed in the state of an assembled substrate. This also applies to each figure showing the subsequent manufacturing process.

First, as shown in (1) in FIG. 4, a plurality of flexible insulating layers 11 and 12 are prepared. The insulating layers 11 and 12 are rectangular resin flat plates having substantially the same shape. The insulating layers 11 and 12 are sheets made of a thermoplastic resin such as a liquid crystal polymer (LCP).

After that, linear conductors 21, 22, 23, 24 are formed on the insulating layer 12. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface (surface) of the insulating layer 12 in the assembled substrate state, and the metal foil is patterned by photolithography. As a result, conductors 21, 22, 23, 24 are formed on the surface of the insulating layer 12.

Next, as shown in (2) in FIG. 4, the plurality of insulating layers 12 and 11 are laminated in this order, and then the laminated plurality of insulating layers 11 and 12 are heated and pressed to form a laminated body.

Finally, by dividing the laminated body in the assembled substrate state, an individual interposer 301 (rectangular parallelepiped laminated body 10) as shown in (3) in FIG. 4 is obtained.

Next, the electronic device provided with the interposer of the present invention will be described with reference to the drawings. FIG. 5A is an exploded perspective view showing a main part of the electronic device 401 according to the first embodiment, and FIG. 5B is a plan view showing the main part of the electronic device 401. In FIG. 5B, the second circuit board 201 is shown by a two-dot chain line in order to make the structure easy to understand.

The electronic device 401 includes a first circuit board 101, a second circuit board 201, and an interposer 301. The interposer 301 is entirely arranged (sandwiched) between the first circuit board 101 and the second circuit board 201. The first circuit board 101 and the second circuit board 201 are, for example, glass / epoxy boards.

In the present embodiment, the first circuit board 101 is an example of the "first member" in the present invention, and the second circuit board 201 is an example of the "second member" in the present invention.

As shown in FIG. 5A and the like, the interposer 301 is mounted on the upper surface S1 of the first circuit board 101 together with a plurality of parts 81, 82, 83, 84, and the components are mounted on the lower surface S2 of the second circuit board 201. 91 and 92 are implemented. As shown in FIG. 5A, the first mounting surface MS1 of the laminated body 10 faces the upper surface S1 of the first circuit board 101, and the second mounting surface MS2 faces the lower surface S2 of the second circuit board 201. do. The components 81, 82, 83, 84, 91, 92 are chip components such as a chip inductor and a chip capacitor.

A plurality of first lands are formed on the upper surface S1 of the first circuit board 101 at positions facing the first electrodes P11, P12, P13, and P14 (not shown). The first electrodes P11, P12, P13, and P14 of the interposer 301 are directly soldered to the plurality of first lands. As a result, the interposer 301 (first electrodes P11, P12, P13, P14) is electrically connected to the first circuit board 101.

A plurality of second lands are formed on the lower surface S2 of the second circuit board 201 at positions facing the second electrodes P21, P22, P23, and P24 (not shown). The second electrodes P21, P22, P23, and P24 of the interposer 301 are directly soldered to the plurality of second lands. As a result, the interposer 301 (second electrodes P21, P22, P23, P24) is electrically connected to the second circuit board 201.

In the method of obtaining the state shown in FIG. 5A, for example, the interposer 301 is attached to the lower surface S2 of the second circuit board 201, and then the second circuit board 201 with the interposer 301 is mounted on the first circuit board 101. .. Specifically, cream solder is printed on each second land of the second circuit board 201, the interposer 301 is mounted on the second circuit board 201 in the same manner as the component 91 (see FIG. 5A), and then the second circuit board 201 is mounted. By passing the two circuit boards 201 through the reflow furnace, they are soldered together with the parts 91 by the batch reflow soldering method. After that, the second circuit board 201 with the interposer 301 is mounted on the upper surface S1 of the first circuit board 101 by the reflow soldering method. The solder for mounting components on the second circuit board 201 is a solder having a higher melting point than the solder used for surface mounting on the first circuit board 101.

As a method for obtaining the state shown in FIG. 5A, for example, the interposer 301 may be mounted on the upper surface S1 of the first circuit board 101, and the second circuit board 201 may be further mounted on the interposer 301.

Further, in the present embodiment, the first circuit board 101 and the second circuit board 201 are glass / epoxy boards, and the effective relative permittivity is about 4. On the other hand, the laminate 10 of the interposer 301 is a liquid crystal polymer (LCP), and the effective relative permittivity is about 3. That is, in the present embodiment, the effective relative permittivity of the laminated body 10 of the interposer 301 is smaller than the effective relative permittivity of the first circuit board 101 and the second circuit board 201.

In this embodiment, the effective elastic modulus of the interposer 301 is smaller than the effective elastic modulus of the first circuit board 101 and the second circuit board 201. For example, the Young's modulus of a glass / epoxy substrate is about 25 GPa. On the other hand, the Young's modulus of the liquid crystal polymer (LCP), which is the laminate 10 of the interposer 301, is about 15 GPa.

The "effective relative permittivity" and "effective elastic modulus" in the present specification are not limited to the "relative permittivity" and "elastic modulus" of a single material, but are not limited to composite materials (resin, conductor pattern, interlayer connection conductor, adhesive). Refers to the "relative permittivity" and "elastic modulus" of the entire (composite material composed of such as).

According to the interposer 301 according to the present embodiment, the following effects are obtained.

(A) In the present embodiment, the interposer 301 is sandwiched between the first member (first circuit board 101) and the second member (second circuit board 201), and the first member and the second member form the interposer 301. It is electrically connected via. According to this configuration, the parts 81, 82, 83, 84, 91, 92 are on the surface of the first member (upper surface S1 of the first circuit board 101) and the surface of the second member (lower surface S2 of the second circuit board 201). The first circuit board 101 and the second circuit board 201 can be electrically connected in a separated state while securing a space for mounting.

(B) In the present embodiment, the laminated body 10 is bent to form the interposer 301. Therefore, an interposer having a desired shape can be easily formed as compared with the case where the interposer is formed by dividing (cutting out or the like) from the mother substrate. Further, it is possible to realize an electronic device provided with an interposer that can be easily formed into a desired shape.

(C) Further, in the present embodiment, since the laminated body 10 is bent to form a desired shape, it is desired even if there is a portion that is difficult to divide from the mother substrate (particularly, a portion having a shape having a high aspect ratio). The shape of the interposer can be easily obtained.

(D) In the present embodiment, as shown in FIG. 5A and the like, the thickness of the interposer (height in the Z-axis direction) is mainly composed of an upright portion. Therefore, the number of laminated insulating layers is smaller than that of a normal interposer (interposer in which a plurality of insulating layers are laminated in the thickness direction (Z-axis direction) to form a laminated body) (thickness in the W-axis direction shown in FIG. 3). With a thin laminated body 10), an interposer having the same thickness as a normal interposer can be formed. Therefore, according to this configuration, the laminate can be formed with a small number of manufacturing steps and a small number of materials, so that an interposer having a desired shape can be obtained at low cost.

(E) In the present embodiment, the wiring in the thickness direction (Z-axis direction) of the interposer is mainly formed by a conductor pattern (conductors 21 to 24) instead of an interlayer connecting conductor such as a through hole or a via conductor. With this configuration, the interposer can be easily formed. In the case of a normal interposer, since wiring in the thickness direction is performed by an interlayer connecting conductor, a through hole is formed in the laminated body (or each insulating layer forming the laminated body), and a conductive member is filled. This process is required, which complicates the manufacturing process. In particular, when wiring in the thickness direction of a thick laminate is performed by through holes of inner surface plating, it is necessary to form elongated through holes, which makes it difficult to form through holes.

Further, since the wiring in the thickness direction (Z-axis direction) of the interposer is formed mainly by the conductor pattern, the line width of the wiring can be easily adjusted. Can be reduced to. Further, by forming the wiring in the thickness direction of the interposer mainly by the conductor pattern, the reliability of the electrical connection can be improved as compared with a normal interposer. In addition, when wiring in the thickness direction of a laminated body having a large number of laminated insulating layers is performed by a via conductor (for example, an interlayer connection conductor formed by filling a conductive paste), the number of via conductors increases and conductor loss occurs. Becomes larger. In addition, the reliability of electrical connection decreases as the number of connection points by via conductors increases.

Further, when wiring in the thickness direction (Z-axis direction) is performed by a via conductor (for example, an interlayer connection conductor formed by filling a conductive paste), the material is limited because it is fired at a low temperature. In addition, since low-temperature firing is performed, firing defects and insufficient strength of the via conductor are likely to occur, and cracks are likely to occur in the via conductor when bending stress is applied to the interposer. On the other hand, in the present embodiment, since the Cu foil conductor pattern (conductors 21 to 24) is used for the wiring in the thickness direction, cracks are unlikely to occur in the wiring even when bending stress is applied to the interposer.

(F) In the present embodiment, the plurality of insulating layers 11 and 12 (two or more insulating layers adjacent to each other) forming the laminated body 10 are made of a thermoplastic resin. According to this configuration, the laminated body 10 can be easily formed by collectively pressing the plurality of laminated insulating layers 11 and 12, so that the man-hours in the manufacturing process of the laminated body 10 can be reduced and the cost can be kept low. can. Further, with this configuration, it is possible to realize an interposer that can be easily plastically deformed and can maintain (maintain) a desired shape.

(G) The laminated body 10 of the interposer 301 has a bent portion CR bent so as to avoid the parts 83 and 84 mounted on the first circuit board 101 and the parts 92 mounted on the second circuit board 201. With this configuration, the effective occupied area of the interposer 301 is reduced, and the mounting space for components on the first circuit board 101 and the second circuit board 201, or the wiring space for the first circuit board 101 and the second circuit board 201, etc. It becomes easier to secure.

(H) Further, in the present embodiment, the interposer 301 is connected to and fixed to the plurality of first lands of the first circuit board 101 via the plurality of first electrodes P11, P12, P13, and P14. Therefore, the interposer 301 that can support the second circuit board 201 can be easily and stably mounted on the first circuit board 101.

(I) In the present embodiment, the interposer 301 is connected to and fixed to the plurality of second lands of the second circuit board 201 via the plurality of second electrodes P21, P22, P23, P24. Therefore, it becomes possible to mount the interposer 301 and the second circuit board 201 using solder, and the interposer 301 between the first circuit board 101 and the second circuit board 201 (with almost no unnecessary gaps). It can be joined and can be placed in a narrow space inside an electronic device.

Further, as compared with the case where the first circuit board 101 and the second circuit board 201 are connected via the connector, a gap is less likely to be formed between the interposer 301 and the second circuit board 201, which is caused by leakage of electromagnetic waves. Unwanted radiation and energy loss are suppressed. Further, impedance mismatch is less likely to occur and reflection loss is suppressed as compared with the case of connecting via a connector.

(J) In the present embodiment, a plurality of first electrodes P11, P12, P13, and P14 are arranged at equal intervals. With this configuration, the mountability of the interposer 301 on the first member (first circuit board 101) is enhanced, and the overall bonding strength is also enhanced.

(K) In the present embodiment, a plurality of second electrodes P21, P22, P23, P24 are arranged at equal intervals. With this configuration, even if the interposer 301 is long, the interposer 301 can be solder-mounted on the first circuit board 101 in the same manner as other components. Further, with this configuration, the mountability of the second circuit board 201 on the interposer 301 is enhanced, and the overall bonding strength is also enhanced.

(L) The interposer 301 according to the present embodiment has a smaller effective relative permittivity than the first circuit board 101 and the second circuit board 201. Therefore, the capacitive component generated between the conductor patterns of the interposer 301 can be reduced. Generally, the linear expansion coefficient of the circuit board on which the component is mounted needs to be matched with the linear expansion coefficient of the component to be mounted. Conventionally, a substrate such as a glass / epoxy board containing a filler such as glass fiber is used. Used. On the other hand, the interposer 301 of the present invention does not have many components like the first circuit board 101 and the second circuit board 201, so that there is no such restriction, and the first circuit board 101 and the like. It is possible to make the effective relative permittivity lower than that of the second circuit board 201.

(M) In the present embodiment, the interposer 301 has a smaller effective elastic modulus than the first circuit board 101 and the second circuit board 201, and has variability. With this configuration, the degree of freedom in the shape of the interposer 301 is increased, and for example, it can be mounted even in a place having some unevenness in the height direction. Further, since the interposer 301 is more flexible than the first circuit board 101 and the second circuit board 201, the joint portion (first electrodes P11, P12) due to the stress applied to the first circuit board 101 and the second circuit board 201 , P13, P14 and a plurality of first lands, and second electrodes P21, P22, P23, P24 and a plurality of second lands) are suppressed from being damaged.

A plating film such as Ni / Au or Ni / Sn is applied to the surfaces of the plurality of first electrodes P11, P12, P13, P14 and the surfaces of the plurality of second electrodes P21, P22, P23, P24. May be good. By applying the plating film to the surface of the electrodes (plural first electrodes P11, P12, P13, P14 and a plurality of second electrodes P21, P22, P23, P24), the solder wettability is enhanced. Further, according to this configuration, oxidation of the electrode and the like are suppressed, and the chemical stability of the electrode is enhanced.

Further, by applying a plating film to the surfaces of the plurality of first electrodes P11, P12, P13, P14, the area of the first electrodes P11, P12, P13, P14 can be increased. With this configuration, the mountability of the interposer 301 on the first circuit board 101 is enhanced, and the bonding strength between the interposer 301 and the first circuit board 101 (a plurality of first electrodes P11, P12, P13, P14 and the first circuit board 101). The bonding strength with the first land) can be increased.

Further, by applying a plating film to the surfaces of the plurality of second electrodes P21, P22, P23, P24, the area of the second electrodes P21, P22, P23, P24 can be increased. With this configuration, the mountability of the second circuit board 201 on the interposer 301 is enhanced, and the bonding strength between the interposer 301 and the second circuit board 201 (a plurality of second electrodes P21, P22, P23, P24 and the second circuit board 201). The bonding strength with the second land) can be increased.

<< Second Embodiment >>
The second embodiment shows an example of an interposer including a ground conductor.

FIG. 6A is an external perspective view of the interposer 302 according to the second embodiment, and FIG. 6B is an external perspective view of the interposer 302 as viewed from another viewpoint. FIG. 7 is an external perspective view showing a state of the interposer 302 before bending.

The interposer 302 is different from the interposer 301 according to the first embodiment in that a ground conductor is formed in the laminated body. Further, the interposer 301 is different from the interposer 301 in that it includes a plurality of ground electrodes PG11, PG12, PG21, and PG22. Other configurations of the interposer 302 are the same as those of the interposer 301.

Hereinafter, a portion different from the interposer 301 according to the first embodiment will be described.

The interposer 302 includes a laminate 10A formed by laminating a plurality of insulating layers, a plurality of first electrodes P11, P12, P13, P14, a plurality of second electrodes P21, P22, P23, P24, and a plurality of the interposers 302. The ground electrodes PG11, PG12, PG21, and PG22 are provided. The plurality of first electrodes P11 to P14 and the plurality of second electrodes P21 to P24 are the same as those described in the first embodiment.

The laminate 10A is formed by bending a flat plate of a thermoplastic resin such as a liquid crystal polymer (LCP) into an L shape. The bent laminate 10A is, for example, L-shaped by heating and pressurizing the vicinity of the center of the rectangular parallelepiped laminate 10A (rectangular flat plate whose longitudinal direction coincides with the U-axis direction) shown in FIG. 7 in the longitudinal direction. Obtained by folding it into.

The plurality of ground electrodes PG11 and PG12 are formed on the first mounting surface MS1 of the laminated body 10A, and the plurality of ground electrodes PG21 and PG22 are formed on the second mounting surface MS2. As shown in FIG. 6B, the ground electrodes PG11 and PG12 are arranged so as to sandwich each of the first electrodes P11, P12, P13 and P14. Further, as shown in FIG. 6A, the ground electrodes PG21 and PG22 are arranged so as to sandwich each of the second electrodes P21, P22, P23 and P24.

As will be described in detail later, a ground conductor (conductor pattern) is formed inside the laminated body 10A (the surface of the insulating layer). The plurality of ground electrodes PG11, PG12, PG21, and PG22 are end faces (ends) of the ground conductor exposed on the first mounting surface MS1 and the second mounting surface MS2.

Further, as shown in FIGS. 6A and 6B, the laminated body 10A has a bent portion that is bent when viewed from the Z-axis direction.

The interposer 302 according to this embodiment is manufactured by, for example, the following process. FIG. 8 is a perspective view showing in order the manufacturing process of the interposer 302 in the state before bending.

First, as shown in (1) in FIG. 8, a plurality of flexible insulating layers 11a, 12a, 13a, 14a are prepared. The insulating layers 11a, 12a, 13a, 14a are rectangular resin flat plates having substantially the same shape. The insulating layers 11a, 12a, 13a, 14a are sheets made of a thermoplastic resin such as a liquid crystal polymer (LCP).

After that, linear conductors 21, 22, 23, 24 are formed on the insulating layer 13a. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface (surface) of the insulating layer 12a in the assembled substrate state, and the metal foil is patterned by photolithography. As a result, conductors 21, 22, 23, 24 are formed on the surface of the insulating layer 13a.

Further, a planar ground conductor 31 is formed on the insulating layer 12a, and a planar ground conductor 32 is formed on the insulating layer 14a. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface (surface) of the insulating layers 12a and 14a in the assembled substrate state, and the metal foil is patterned by photolithography. As a result, the ground conductor 31 is formed on the surface of the insulating layer 12a, and the ground conductor 32 is formed on the surface of the insulating layer 14a.

The ground conductors 31 and 32 have substantially the same shape and have a conductor portion and an opening portion. As shown in (1) in FIG. 8, the conductor portions of the ground conductors 31 and 32 overlap the entire conductors 21, 22, 23, 24 when a plurality of insulating layers 11a, 12a, 13a, 14a are laminated. The shape.

Next, as shown in (2) in FIG. 8, after stacking the plurality of insulating layers 14a, 13a, 12a, 11a in this order, the laminated plurality of insulating layers 11a, 12a, 13a, 14a are heated and pressurized. Form a laminate.

Finally, by dividing the laminated body in the assembled substrate state, an individual interposer 302 (rectangular parallelepiped laminated body 10A) as shown in (3) in FIG. 4 is obtained.

The interposer 302 according to the present embodiment has a stripline structure including an insulating layer 12a sandwiched between a conductor 21, a ground conductor 31, 32, a conductor 21 and a ground conductor 31, and an insulating layer 13a sandwiched between the conductor 21 and the ground conductor 32. Transmission line is configured. It should be noted that not only the transmission line including the conductor 21 but also the transmission line including the conductors 22 to 24 are similarly configured. That is, the interposer 302 includes four transmission lines.

Next, an electronic device including a plurality of interposers according to the present embodiment will be described with reference to the drawings. FIG. 9 is a plan view showing a main part of the electronic device 402 according to the second embodiment. In FIG. 9, the second circuit board 201 is shown by a chain double-dashed line in order to make the structure easy to understand.

The electronic device 402 differs from the electronic device 401 described in the first embodiment in that it includes a plurality of interposers 302A and 302B. Further, the electronic device 402 is electronic in that parts 71, 72, 73, 81, 82, 83, 84, 85, 86, 88, 89 are mounted on the upper surface (surface) of the first circuit board 101. Different from device 401. Other configurations of the electronic device 402 are substantially the same as those of the electronic device 401.

Hereinafter, the parts different from the electronic device 401 according to the first embodiment will be described.

The interposers 302A and 302B differ from the interposer 302 described above in the number of transmission lines. As shown in FIG. 9, the interposer 302A is configured with five transmission lines, and the interposer 302B is configured with nine transmission lines. The interposer 302A has a shape in which a flat plate of a thermoplastic resin is bent into an L shape, and the interposer 302B has a shape in which a flat plate of a thermoplastic resin is bent into a U shape.

As shown in FIG. 9, the plurality of interposers 302A and 302B are components (parts 71 to 73, 81 to 89 mounted on the upper surface of the first circuit board 101, and components mounted on the lower surface of the second circuit board 201. ) Is arranged in a frame shape (ring shape) so as to avoid it. Specifically, in a plan view of the upper surface of the first circuit board 101 (viewed from the Z-axis direction), the approximate outer shape of the plurality of interposers 302A and 302B arranged in a frame shape is rectangular. Parts 81 to 88 are arranged outside the approximate outer shape. The plurality of interposers 302A and 302B are arranged so as to surround the parts 71 to 73. The parts 81 to 88 are arranged outside the approximate outer shape of the interposers 302A and 302B (arranged so as to surround the plurality of interposers 302A and 302B). The components 71 to 73 and 81 to 89 are chip components such as a chip inductor and a chip capacitor.

As shown in FIG. 9, the interposers 302A and 302B (laminated circuit boards) are the first circuit boards at least three of the rectangular outlines of the plurality of interposers 302A and 302B arranged in a frame shape. It is interposed between the 101 and the second circuit board 201. The plurality of first electrodes of the interposers 302A and 302B and the plurality of ground electrodes (see the first electrodes P11, P12, P13, P14 and the ground electrodes PG11 and PG12 shown in FIG. 6B) are the first circuit board 101. Each is directly soldered to a plurality of first lands formed on the upper surface. The plurality of second electrodes of the interposers 302A and 302B and the plurality of ground electrodes (see the second electrodes P21, P22, P23, P24 and the ground electrodes PG21 and PG22 shown in FIG. 6A) are the second circuit board 201. Each is directly soldered to a plurality of second lands formed on the lower surface.

As a result, the first circuit board 101 and the second circuit board 201 are electrically connected via the plurality of interposers 302A and 302B.

According to the electronic device 402 according to the present embodiment, the following effects are obtained in addition to the effects described in the first embodiment.

(N) According to the present embodiment, even if the first circuit board 101 and the second circuit board 201 have a large area, the interposer can be mounted on the first circuit board 101 and the second circuit board 201, and the whole can be mounted. The bonding strength (the bonding strength between the first circuit board 101 and the interposer, and the bonding strength between the second circuit board 201 and the interposer) can be increased. In this embodiment, in particular, interposers 302A and 302B (laminated bodies) are interposed between the first circuit board 101 and the second circuit board 201 at at least three apex portions of the rectangular outline outer shape. , The support structure of the second circuit board 201 by the interposer is stabilized.

(O) In the present embodiment, a plurality of interposers 302A and 302B are mounted on the parts (parts 71 to 73, 81 to 89 mounted on the upper surface of the first circuit board 101, and the lower surface of the second circuit board 201. It is arranged in a frame shape (ring shape) so as to avoid parts). With this configuration, the occupied area for mounting the interposer and components can be reduced (space can be saved).

In the interposers 302, 302A, 302B according to the present embodiment, the planar ground conductors 31, 32 (conductor pattern) are formed on the laminated body. According to this configuration, the shielding effect of the ground conductor suppresses the radiation of noise from the parts 71 to 73 surrounded by the interposers 302A and 302B, or the noise to the parts 71 to 73 surrounded by the interposers 302A and 302B. The influence of can be suppressed. Further, by arranging the interposers 302A and 302B provided with the planar ground conductor between the parts 71 to 73 and the parts 81 to 89, the isolation between the parts 71 to 73 and the parts 81 to 89 is increased. You can blister.

<< Third Embodiment >>
In the third embodiment, an example of an interposer having a ring-shaped outer shape is shown.

FIG. 10 is an external perspective view showing a main part of the electronic device 403 according to the third embodiment. FIG. 11 is an external perspective view of the interposer 303 according to the third embodiment. FIG. 12A is an external perspective view showing a state of the interposer 303 before bending, and FIG. 12B is a plan view showing a state of the interposer 303 before bending.

The electronic device 403 is different from the electronic device 401 according to the first embodiment in that it includes an interposer 303. The interposer 303 is different from the interposer 301 according to the first embodiment in that it includes the laminated body 10B bent in a ring shape. Other configurations of the electronic device 403 are the same as those of the electronic device 401.

Hereinafter, the parts different from the electronic device 401 according to the first embodiment will be described.

The bent laminate 10B is, for example, inside the back surface PS2 of the substantially rectangular parallelepiped laminate 10B (a substantially rectangular flat plate whose longitudinal direction coincides with the U-axis direction) shown in FIGS. 12 (A) and 12 (B). It can be obtained by bending it into a ring shape. Both ends of the laminate 10B (the left and right ends of the laminate 10B shown in FIGS. 12A and 12B) that come into contact with each other when bent into a ring shape are connected by an adhesive (not shown). ..

A plurality of recesses HL1 and HL2 are formed in the bent portion of the laminated body 10B. As will be described in detail later, the recesses HL1 and HL2 are portions where the number of layers of the insulating layer is smaller than the number of layers of the other portions. Therefore, the portion where the recesses HL1 and HL2 are formed is more easily bent than the other portions.

The recess HL1 is a recess formed on the surface PS1 of the laminated body 10B shown in FIGS. 12A and 12B and extends in the lateral direction (V-axis direction). The recess HL2 is a recess formed on the back surface PS2 of the laminated body 10B shown in FIGS. 12A and 12B and extends in the lateral direction (V-axis direction). The recesses HL1 and HL2 substantially overlap each other when viewed from the stacking direction (W-axis direction) of the plurality of insulating layers.

The laminated body 10B has an upright portion. In the present embodiment, substantially the entire laminated body 10B is the upright portion. Further, the laminated body 10B has a bent portion that is bent in a plan view of the first mounting surface MS1 and the second mounting surface MS2.

The interposer according to this embodiment is manufactured by, for example, the following process. FIG. 13 is a perspective view showing in order the manufacturing process of the interposer 303 in a state before bending.

First, as shown in (1) in FIG. 13, a plurality of flexible insulating layers 11b1, 11b2, 11b3, 11b4, 12b, 13b1, 13b2, 13b3, 13b4 are prepared. The insulating layer 12b is a rectangular resin flat plate. The insulating layers 11b1 to 11b4 and 13b1 to 13b4 are rectangular resin flat plates having substantially the same shape. The insulating layers 11b1 to 11b4 and 13b1 to 13b4 have a shorter length in the longitudinal direction (U-axis direction) than the insulating layer 12b. The insulating layers 11b1 to 11b4, 12b and 13b1 to 13b4 are sheets made of a thermoplastic resin such as a liquid crystal polymer (LCP).

After that, conductors 21, 22, 23, 24 are formed on the surface of the insulating layer 12b. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface (surface) of the insulating layer 12b in the assembled substrate state, and the metal foil is patterned by photolithography. As a result, conductors 21, 22, 23, 24 are formed on the surface of the insulating layer 12b.

Next, as shown in (2) in FIG. 13, a plurality of insulating layers 13b1 to 13b4, 12b and 11b1 to 11b4 are laminated. The insulating layers 11b1 to 11b4 are arranged in this order in the + U direction, and the insulating layers 13b1 to 13b4 are arranged in this order in the + U direction.

When laminating a plurality of insulating layers, the insulating layers 13b1, 12b, 11b1 are laminated in this order. The insulating layers 13b2, 12b, 11b2 are laminated in this order. The insulating layers 13b3, 12b, 11b3 are laminated in this order. The insulating layers 13b4, 12b, 11b4 are laminated in this order.

After that, the plurality of laminated insulating layers 11b1 to 11b4, 12b, 13b1 to 13b4 are heated and pressed to form a laminated body.

When forming the laminated body, the recess HL1 is formed on the insulating layer 12b in the portion where the insulating layers 11b1 to 11b4 are not laminated (the portion having a small number of laminated layers) due to the difference in the number of laminated layers. Further, a recess HL2 is formed in a portion under the insulating layer 12b where the insulating layers 13b1 to 13b4 are not laminated due to the difference in the number of laminated insulating layers. The recesses HL1 and HL2 are portions where the number of laminated insulating layers is smaller than that of the other portions. Therefore, the portion where the recesses HL1 and HL2 are formed is more easily bent than the other portions.

Finally, by dividing the laminated body in the assembled substrate state, an individual interposer 303 (a substantially rectangular parallelepiped laminated body 10B) as shown in (3) in FIG. 13 is obtained.

According to the electronic device 403 according to the present embodiment, the following effects are obtained in addition to the effects described in the first embodiment.

(P) In the present embodiment, the laminated body 10B has recesses HL1 and HL2 (recesses having a smaller number of laminated insulating layers than other portions) formed in the bent portion. With this configuration, the bent portion (bent portion) becomes easy to bend, and an interposer having a desired shape can be easily formed. Further, with this configuration, the bending radius of the bent portion can be reduced.

(Q) Further, in the present embodiment, the interposer 303 having a ring-shaped outer shape is formed by bending the substantially rectangular parallelepiped laminated body 10B. Therefore, as shown below, the number of interposers obtained by dividing the interposer from the mother substrate can be increased as compared with the case where the interposer having a ring-shaped planar shape is divided from the mother substrate.

14 (A) is a plan view showing a plurality of laminated bodies 10C divided from the mother substrate 10M, and FIG. 14 (B) is a plan view showing a plurality of laminated bodies 10D divided from the mother substrate 10M. be. As shown in FIG. 14B, when the laminated body 10D having a ring-shaped planar shape is divided, the number of interposers (laminated body 10D) obtained by dividing the laminated body 10D from the mother substrate 10M is small. On the other hand, when the laminated body 10C having a rectangular planar shape is divided, the number of interposers (laminated body 10C) obtained by dividing the laminated body 10C from the mother substrate 10M can be increased as shown in FIG. 14 (A).

In this embodiment, an example is shown in which both ends in the longitudinal direction of the laminate 10B that come into contact with each other when bent into a ring shape are connected by an adhesive, but the present invention is not limited to this configuration. Both ends of the laminated body 10B bent in a ring shape in the longitudinal direction may not be connected by an adhesive.

Further, in the present embodiment, an example is shown in which the concave portion HL1 is formed on the front surface PS1 of the laminated body 10B and the concave portion HL2 is formed on the back surface PS2 of the laminated body 10B, but the present invention is not limited to this configuration. The recess may be formed only on the front surface PS1 of the laminated body, or may be formed only on the back surface PS2.

In this embodiment, an example is shown in which recesses HL1 and HL2 having a smaller number of laminated insulating layers than other portions are formed in a bent portion of the laminated body 10B, but the configuration is not limited to this. do not have. A notch (groove) may be formed in the bent portion of the laminated body. The notch is formed, for example, by grinding from the front surface (or back surface) of the laminate with a laser. The portion where the notch is formed is easier to bend than the other portions. Therefore, by forming a notch in the bent portion, the same action / effect as in the case of forming the concave portion (see (p) above) can be obtained.

The notch is not limited to that formed on the front surface PS1 or the back surface PS2 of the laminated body 10B, and may be formed on the end surface (first mounting surface MS1 or second mounting surface MS2) of the laminated body 10B. good. Further, both recesses and notches may be formed in the laminate.

<< Fourth Embodiment >>
In the fourth embodiment, an example of a laminated body having a connecting portion is shown.

FIG. 15A is an external perspective view showing the state of the interposer 304 according to the fourth embodiment before bending, and FIG. 15B is a plan view showing the state of the interposer 304 before bending.

The interposer 304 is different from the interposer 303 described in the third embodiment in that the laminated body 10E has the connecting portions NP1 and NP2. Other configurations of the interposer 304 are the same as those of the interposer 303.

Hereinafter, a portion different from the interposer 303 according to the third embodiment will be described.

The interposer 304 includes a laminated body 10E bent in a ring shape, similarly to the interposer 303 described in the third embodiment.

The bent laminate 10E is formed with the back surface PS2 of the substantially rectangular laminate 10E (a substantially rectangular flat plate whose longitudinal direction coincides with the U-axis direction) shown in FIGS. 15 (A) and 15 (B) as the inside. , Obtained by folding into a ring. As shown in FIG. 15A, the laminated body 10E has an L-shaped connecting portion NP1 formed at one end in the longitudinal direction and an L-shaped connecting portion NP2 formed at the other end in the longitudinal direction.

Both ends of the laminated body 10E bent in a ring shape are connected by connecting portions NP1 and NP2. Specifically, the connecting portions NP1 and NP2 are caught on each other, and both ends of the laminated body 10E are fixed.

<< Fifth Embodiment >>
In the fifth embodiment, an example is shown in which the method of bending the laminated body is different from that of the interposer shown above.

FIG. 16 is an external perspective view showing a main part of the electronic device 405 according to the fifth embodiment. 17 (A) is a plan view of the interposer 305 according to the fifth embodiment, and FIG. 17 (B) is a sectional view taken along the line AA in FIG. 17 (A). FIG. 18 is a plan view showing a state of the interposer 305 before bending. Further, in FIG. 18, a portion to be bent into a mountain fold is shown by a alternate long and short dash line.

The electronic device 405 differs from the electronic device 401 according to the first embodiment in that it includes an interposer 305. Other configurations of the electronic device 405 are the same as those of the electronic device 401.

Hereinafter, the parts different from the electronic device 401 according to the first embodiment will be described.

The interposer 305 includes a ring-shaped laminated body 10F, a plurality of first electrodes P11P, P12P, P13P, P14P, P15P, P16P, P17P, P18P, and a plurality of second electrodes P21P, P22P, P23P, P24P. It includes P25P, P26P, P27P, and P28P.

The laminated body 10F bent in a ring shape can be obtained, for example, by folding the laminated body 10F (flat plate having a substantially cross-shaped outer shape) shown in FIG. 18 along a bending line (dashed-dotted line in FIG. 18). Be done. A rectangular opening OP is formed in the center of the laminated body 10F shown in FIG.

The laminated body 10F before being bent has a portion in a part of the outer shape that is in close contact with each other when folded into a ring shape. Specifically, some sides of the laminated body 10F shown in FIG. 18 (for example, side FS11 and side FS12, side FS21 and side FS22, side FS31 and side FS32, side FS41 and side FS42 shown in FIG. 18) , When folded, they are in close contact with each other.

The plurality of first electrodes P11P to P18P are formed on the first mounting surface MS1 of the laminated body 10F, and the plurality of second electrodes P21P to P28P are formed on the second mounting surface MS2.

As shown in FIGS. 17B and 18 and the like, linear conductors 21,22,23,24,25,26,27,28 are formed inside the laminated body 10F (the surface of the insulating layer 12f). Has been done. The laminated body 10F is formed by laminating a plurality of insulating layers 11f and 12f. The insulating layer 11f is, for example, a solder resist film or a coverlay film. The insulating layer 12f is a sheet made of a thermoplastic resin such as a liquid crystal polymer (LCP). The conductors 21 to 28 are conductor patterns such as Cu foil.

The insulating layer 11f is an insulating film formed on substantially the entire surface of the insulating layer 12f and covering the conductors 21 to 28. The insulating layer 11f has an opening at a position corresponding to a plurality of electrodes (a plurality of first electrodes P11P to P18P and a plurality of second electrodes P21P to P28P). Therefore, by forming the insulating layer 11f on the insulating layer 12f, a part of the conductors 21 to 28 is exposed from the surface of the laminated body 10F.

As shown in FIG. 18, in the present embodiment, the portions of the conductor 21 exposed on the surface of the laminated body 10F are the first electrode P11P and the second electrode P21P. Further, the portions of the conductor 22 exposed on the surface of the laminated body 10F are the first electrode P12P and the second electrode P22P. The portions of the conductor 23 exposed on the surface of the laminated body 10F are the first electrode P13P and the second electrode P23P. The portions of the conductor 24 exposed on the surface of the laminated body 10F are the first electrode P14P and the second electrode P24P. The portions of the conductor 25 exposed on the surface of the laminated body 10F are the first electrode P15P and the second electrode P25P. The portions of the conductor 26 exposed on the surface of the laminated body 10F are the first electrode P16P and the second electrode P26P. The portions of the conductor 27 exposed on the surface of the laminated body 10F are the first electrode P17P and the second electrode P27P. The portions of the conductor 28 exposed on the surface of the laminated body 10F are the first electrode P18P and the second electrode P28P.

In this way, the first electrode P11P and the second electrode P21P are conducting. The first electrode P12P and the second electrode P22P are conducting. The first electrode P13P and the second electrode P23P are conducting. The first electrode P14P and the second electrode P24P are conducting. The first electrode P15P and the second electrode P25P are conducting. The first electrode P16P and the second electrode P26P are conducting. The first electrode P17P and the second electrode P27P are conducting. Further, the first electrode P18P and the second electrode P28P are conducting.

Further, as shown in FIG. 17A, the laminated body 10F has bent portions CR1 and CR2 that are bent in a plan view (viewed from the Z-axis direction) of the first mounting surface MS1 and the second mounting surface MS2. , CR3, CR4.

According to the electronic device 405 according to the present embodiment, the following effects are obtained in addition to the effects described in the first embodiment.

(R) In the present embodiment, the laminated body 10F before being bent is a part of the outer shape that is in close contact with each other when bent (sides FS11 and FS12, sides FS21 and sides FS22, and sides shown in FIG. 18). It has FS31 and side FS32, and side FS41 and side FS42). With this configuration, the rigidity of the entire bent laminated body 10F can be increased, and even when an external force is applied to the bent laminated body 10F, it can be made difficult to be deformed. Therefore, after the first member and the second member are connected by the interposer 305, the positional relationship between the first member and the second member, the positional relationship between the first member and the interposer 305, or the second member and the interposer 305. The positional relationship can be maintained with high accuracy.

<< 6th Embodiment >>
In the sixth embodiment, an example in which the connecting portion is provided in the laminated body is shown.

FIG. 19 is an exploded perspective view showing a main part of the electronic device 406 according to the sixth embodiment. FIG. 20 is an external perspective view showing a state before bending of the interposer 306 according to the sixth embodiment. In FIG. 19, the connection portions CP21 and CP22 are shown by dot hatching in order to make the structure easy to understand. Further, in FIG. 20, the protruding portions PP21 and PP22 are shown by dot hatching.

The electronic device 406 is different from the electronic device 401 according to the first embodiment in that it includes an interposer 306. Further, the interposer 306 is different from the interposer 301 according to the first embodiment in that it includes a laminated body 10G bent in a substantially crank shape. Other configurations of the electronic device 406 are the same as the electronic device 401.

Hereinafter, the parts different from the electronic device 401 according to the first embodiment will be described.

The interposer 306 includes a laminated body 10G, a plurality of first electrodes (not shown), and a plurality of second electrodes P21P and P22P.

The laminated body 10G can be obtained, for example, by bending the laminated body 10G (a substantially U-shaped flat plate whose longitudinal direction coincides with the U-axis direction) shown in FIG. 20 into a crank shape.

A plurality of recesses HL2 are formed in the bent portion of the laminated body 10G. The recess HL2 is a recess formed on the back surface PS2 of the laminated body 10G shown in FIG. 20 and extending in the lateral direction (V-axis direction). The recess HL2 is a portion where the number of layers of the insulating layer is smaller than the number of layers of the other portions. Therefore, the portion where the recess HL2 is formed is easier to bend than the other portions.

Further, the laminated body 10G is provided with connecting portions CP21 and CP22 having a rectangular planar shape. The connection portions CP21 and CP22 are portions of the interposer 306 that are connected to the second circuit board 201. The connection portion CP21 has a second mounting surface MS2A, and the connection portion CP22 has a second mounting surface MS2B.

The connection portions CP21 and CP22 according to the present embodiment are examples of the "second connection portion" in the present invention.

The connecting portion CP21 is formed by bending the protruding portion PP21 of the laminated body 10G shown in FIG. The connecting portion CP22 is formed by bending the protruding portion PP22 of the laminated body 10G shown in FIG.

A plurality of first electrodes (not shown) are formed on the first mounting surface MS1 of the laminated body 10G. The second electrode P21P is formed on the second mounting surface MS2A of the connecting portion CP21, and the second electrode P22P is formed on the second mounting surface MS2B of the connecting portion CP22. As will be described in detail later, the second electrodes P21P and P22P are conductor patterns formed on the surface of the insulating layer.

As shown in FIG. 20, linear conductors 21 and 22 are formed inside the laminated body 10G (the surface of the insulating layer). The plurality of first electrodes are end faces (ends) of conductors 21 and 22, which are exposed on the first mounting surface MS1, respectively. Further, in the present embodiment, the portion of the conductor 21 exposed on the surface (surface PS1) of the laminated body 10G is the second electrode P21P. The portion of the conductor 22 exposed on the surface of the laminated body 10G is the second electrode P22P.

As shown in FIG. 19, the interposer 306 is mounted on the upper surface S1 of the first circuit board 101 together with a plurality of parts 81, 82, 83, 84, and the parts 91, 92 are mounted on the lower surface S2 of the second circuit board 201. Will be implemented. The first mounting surface MS1 of the laminated body 10G faces the upper surface S1 of the first circuit board 101. The second mounting surface MS2A of the connecting portion CP21 and the second mounting surface MS2B of the connecting portion CP22 face the lower surface S2 of the second circuit board 201.

The plurality of first electrodes (not shown) of the interposer 306 are directly soldered to the plurality of first lands (not shown) formed on the upper surface S1 of the first circuit board 101. As a result, the interposer 306 and the first circuit board 101 are electrically connected.

The second electrode P21P formed on the connection portion CP21 and the second electrode P22P formed on the connection portion CP22 are respectively on a plurality of second lands (not shown) formed on the lower surface S2 of the second circuit board 201. Soldered directly. As a result, the interposer 306 and the second circuit board 201 are electrically connected.

The interposer 306 according to the present embodiment is manufactured by, for example, the following process. FIG. 21 is a perspective view showing in order the manufacturing process of the interposer 306 in a state before bending.

First, as shown in (1) in FIG. 21, a plurality of flexible insulating layers 12g, 13g1, 13g2, 13g3 are prepared. The insulating layer 12 g is a U-shaped resin flat plate. The insulating layers 13g1 to 13g3 are rectangular resin flat plates having substantially the same shape. The insulating layers 13g1 to 13g3 have a shorter length in the longitudinal direction (U-axis direction) than the insulating layer 12g. The insulating layers 12g and 13g1 to 13g3 are sheets made of a thermoplastic resin such as a liquid crystal polymer (LCP).

Next, conductors 21 and 22 are formed on the surface of the insulating layer 12 g. Specifically, a metal foil (for example, Cu foil) is laminated on one side main surface (surface) of the insulating layer 12 g in the assembled substrate state, and the metal foil is patterned by photolithography. As a result, conductors 21 and 22 are formed on the surface of the insulating layer 12 g.

After that, a plurality of insulating layers 12g and 13g1 to 13g3 are laminated. The insulating layers 13g1 to 13g3 are arranged in this order in the + U direction.

When laminating a plurality of insulating layers, the insulating layers 13g and 112g are laminated in this order. The insulating layers 13g and 212g are laminated in this order. The insulating layers 13g and 3 and 12g are laminated in this order.

Next, as shown in (2) in FIG. 21, a plurality of laminated insulating layers 12g and 13g1 to 13g3 are heated and pressed to form a laminated body 10GP.

When forming the laminated body, the recess HL2 is formed in the portion where the insulating layers 13g1 to 13g3 under the insulating layer 12g are not laminated (the portion where the number of laminations is small) due to the difference in the number of laminations of the insulating layers. The recess HL2 is a portion where the number of laminated insulating layers is smaller than that of other portions. Therefore, the portion where the recess HL2 is formed is easier to bend than the other portions.

After that, the insulating layer 11g is laminated (formed) on the laminated body 10GP to form the laminated body 10G shown in (3) in FIG. The insulating layer 11g is an insulating film formed on substantially the entire surface of the laminated body 10GP (insulating layer 12g) and covering the conductors 21 and 22. The insulating layer 11g has openings OP1 and OP2 at positions corresponding to the second electrode. Therefore, by forming the insulating layer 11g on the laminated body 10GP, a part of the conductors 21 and 22 is exposed on the surface of the laminated body 10G. The insulating layer 11g is, for example, a solder resist film or a coverlay film.

The second electrode P21P is a portion of the conductor 21 exposed on the surface PS1 of the laminated body 10G. The second electrode P22P is a portion of the conductor 22 exposed on the surface PS1 of the laminated body 10G.

Finally, by dividing the laminated body in the assembled substrate state, an individual interposer 306 (a laminated body 10G which is a substantially U-shaped flat plate) is obtained.

In this embodiment, an example is shown in which only the second connection portions (connection portions CP21, CP22) having the second mounting surface are provided on the laminated body, but the configuration is not limited to this. The laminated body may be configured to be provided with only the connection portion (first connection portion) having the first mounting surface. Further, both the connecting portion having the first mounting surface (first connecting portion) and the connecting portion having the second mounting surface (second connecting portion) may be provided in the laminated body.

Further, in the present embodiment, an example is shown in which two second connecting portions (connecting portions CP21 and CP22) having a rectangular planar shape are provided on the laminated body 10G, but the present invention is not limited to this configuration. The number and shape of the connecting portions (first connecting portion and the second connecting portion) can be appropriately changed within the range in which the effects of the present invention are exhibited.

<< Other Embodiments >>
The shape of the folded laminate is not limited to the shape described in each of the above-described embodiments, and can be appropriately changed as long as the effects of the present invention are exhibited. Further, the method of bending the laminated body is not limited to the one described in each of the above-described embodiments, and can be appropriately changed as long as the effects of the present invention are exhibited.

In each of the above-described embodiments, an example of a laminated body formed by laminating two or three insulating layers is shown, but the configuration is not limited to this. The number of layers of the insulating layer forming the laminate can be appropriately changed within the range in which the effects of the present invention are to be achieved, and may be, for example, 4 or more.

In each of the above embodiments, the configuration in which the entire interposer is arranged (sandwiched) between the first member (first circuit board 101) and the second member (second circuit board 201) has been shown. The configuration is not limited to this. A part of the interposer may be arranged between the first member and the second member.

In each of the above embodiments, the laminate is formed by laminating two or more insulating layers made of a thermoplastic resin (liquid crystal polymer), and the insulating layer made of a thermoplastic resin is covered with a coverlay film or the like. Although an example of forming by laminating insulating layers is shown, the present invention is not limited to this configuration. Each insulating layer may be another thermoplastic resin such as polyimide (PI) or polyetheretherketone (PEEK). Further, the laminated body is not limited to one in which the surfaces are fused by heating and pressurizing a plurality of laminated insulating layers, and a structure having an adhesive layer between each insulating layer may be used. Further, the insulating layer may be a thermosetting resin such as an epoxy resin. Further, a laminate may be formed by heating and pressurizing a laminate in which a bonding layer (for example, a semi-cured prepreg resin) is sandwiched between a plurality of insulating layers made of a thermosetting resin.

Further, the laminated body of the interposer may be a composite of a plurality of resins. For example, the laminate may be formed by laminating a thermosetting resin such as a glass / epoxy substrate and a thermoplastic resin.

In each of the embodiments shown above, the interposer is an electrode (first electrode and second electrode) for electrically connecting the first member (first circuit board 101) and the second member (second circuit board 201). Although an example in which only the electrode) is provided is shown, the present invention is not limited to this configuration. For example, the interposer may include an auxiliary electrode (an electrode that does not electrically connect between the first member and the second member). The configuration including the auxiliary electrode enables solder mounting to the first member or the second member in the same manner as other parts even when the interposer has a long shape.

In each of the above embodiments, the interposer and the second member (second circuit board 201) are directly connected via solder, but the interposer and the second circuit board 201 are used. May be connected via a connector. For example, a plug may be mounted on the second mounting surface MS2 of the interposer, a receptacle may be mounted on the lower surface S2 of the second circuit board 201, and the plug and the receptacle may be fitted to each other to be electrically and mechanically connected.

Further, the interposer of the present invention may be configured to embed various parts such as chip parts.

Further, in each of the above-described embodiments, an example of an interposer in which only a signal line is formed is shown, but the present invention is not limited to this configuration. For example, the interposer may be formed with an inductor, a capacitor, or the like other than the signal line in a conductor pattern. Further, the interposer may be provided with a frequency filter such as various filters (low-pass filter, high-pass filter, band-pass filter, band-elimination filter).

Further, the circuit configuration formed on the interposer (laminated body) is not limited to the configuration described in each embodiment. The circuit formed in the interposer can be appropriately changed within the range in which the action / effect of the present invention is exhibited. For example, the interposer may include a coil formed of a conductor pattern or a capacitor formed of a conductor pattern. Further, for example, various transmission lines (strip line, microstrip line, coplanar line, etc.) and the like may be formed in the interposer. Further, for example, chip components such as a chip-type inductor and a chip-type capacitor may be mounted on the laminate.

Finally, the description of the embodiments described above is exemplary in all respects and not restrictive. Modifications and changes can be made as appropriate for those skilled in the art. The scope of the invention is indicated by the claims, not by the embodiments described above. Further, the scope of the present invention includes modifications from the embodiments within the scope of the claims and within the scope of the claims.

OP, OP1, OP2 ... Opening CP21, CP22 ... Connection part CR, CR1, CR2, CR3, CR4 ... Bending part FS11, FS12, FS21, FS22, FS31, FS32, FS41, FS42 ... Side HL1, HL2 ... Recessed MS1 ... 1 mounting surface MS2, MS2A, MS2B ... 2nd mounting surface NP1, NP2 ... Connecting portions P11, P11P, P12, P12P, P13, P13P, P14, P14P, P15P, P16P, P17P, P18P ... First electrodes P21, P21P, P22, P22P, P23, P23P, P24, P24P, P25P, P26P, P27P, P28P ... Second electrode PG11, PG12, PG21, PG22 ... Ground electrode PP21, PP22 ... S2 ... Bottom surface of the second circuit board PS1 ... Front surface of the laminated body PS2 ... Back surface of the laminated body 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10GP ... Laminated body 10M ... Mother substrate 11, 11a, 11b1, 11b2, 11b3, 11b4, 11f, 11g, 12, 12a, 12b, 12f, 12g, 13a, 13b1, 13b2, 13b3, 13b4, 13g1, 13g2, 13g3, 14a ... Insulation layer 21,22,23,24,25, 26, 27, 28 ... Conductors 71, 72, 73, 81, 82, 83, 84, 85, 86, 87, 88, 89, 91, 92 ... Parts 101 ... First circuit board (first member)
201 ... Second circuit board (second member)
301, 302, 302A, 302B, 303, 304, 305, 306 ... Interposer 401, 402, 403, 405, 406 ... Electronic equipment

Claims (6)

With the first member
The second member and
An interposer that electrically connects the first member and the second member,
Equipped with
The interposer is
A laminated body having a first mounting surface and a second mounting surface facing each other, formed by laminating a plurality of flexible insulating layers, and bent by plastic deformation.
The first electrode formed on the first mounting surface and
A second electrode electrically connected to the first electrode and formed on the second mounting surface,
The ground conductor formed on the insulating layer and
Have,
The laminate is located between the first mounting surface and the second mounting surface, and the stacking direction of the plurality of insulating layers is a direction perpendicular to the first mounting surface and the second mounting surface. It has an upright portion and a bent portion that is bent in a plan view of the first mounting surface and the second mounting surface.
The first electrode is electrically connected to the first member, and the second electrode is electrically connected to the second member.
A component is mounted on the first main surface of the first member, and the component is mounted on the first main surface.
The first member is electrically connected to the first electrode of the laminate on the first main surface.
The bent portion is an electronic device that surrounds the component . The electronic device according to claim 1, wherein the laminated body has a notch formed in a bent portion. The electronic device according to claim 1 or 2, wherein the laminated body has a recess formed in a bent portion in which the number of laminated layers of the insulating layer is smaller than the number of laminated layers of other portions. The laminated body is provided with a first connection portion having the first mounting surface.
The electronic device according to any one of claims 1 to 3, wherein the first electrode is a conductor pattern formed on the first mounting surface of the first connection portion and formed on the surface of the insulating layer. .. The laminated body is provided with a second connecting portion having the second mounting surface.
The electronic device according to any one of claims 1 to 4, wherein the second electrode is a conductor pattern formed on the second mounting surface of the second connecting portion and formed on the surface of the insulating layer. .. The electronic device according to any one of claims 1 to 5, wherein the two or more insulating layers adjacent to each other among the plurality of insulating layers are made of a thermoplastic resin.

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