JP7000301B2 - 電磁波吸収体 - Google Patents

電磁波吸収体 Download PDF

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Publication number
JP7000301B2
JP7000301B2 JP2018232235A JP2018232235A JP7000301B2 JP 7000301 B2 JP7000301 B2 JP 7000301B2 JP 2018232235 A JP2018232235 A JP 2018232235A JP 2018232235 A JP2018232235 A JP 2018232235A JP 7000301 B2 JP7000301 B2 JP 7000301B2
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Prior art keywords
electromagnetic wave
wave absorber
layer
dielectric layer
conductive layer
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JP2018232235A
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English (en)
Japanese (ja)
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JP2019057730A (ja
JP2019057730A5 (https=
Inventor
博一 請井
丈裕 宇井
一斗 山形
雄希 武田
広宣 待永
祐矢 北川
和明 佐々
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2018232235A priority Critical patent/JP7000301B2/ja
Publication of JP2019057730A publication Critical patent/JP2019057730A/ja
Publication of JP2019057730A5 publication Critical patent/JP2019057730A5/ja
Priority to JP2021209263A priority patent/JP7350048B2/ja
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Publication of JP7000301B2 publication Critical patent/JP7000301B2/ja
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  • Aerials With Secondary Devices (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2018232235A 2018-12-12 2018-12-12 電磁波吸収体 Active JP7000301B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018232235A JP7000301B2 (ja) 2018-12-12 2018-12-12 電磁波吸収体
JP2021209263A JP7350048B2 (ja) 2018-12-12 2021-12-23 電磁波吸収体

Applications Claiming Priority (1)

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JP2018232235A JP7000301B2 (ja) 2018-12-12 2018-12-12 電磁波吸収体

Related Parent Applications (1)

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JP2016241731A Division JP6453295B2 (ja) 2016-12-14 2016-12-14 電磁波吸収体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021209263A Division JP7350048B2 (ja) 2018-12-12 2021-12-23 電磁波吸収体

Publications (3)

Publication Number Publication Date
JP2019057730A JP2019057730A (ja) 2019-04-11
JP2019057730A5 JP2019057730A5 (https=) 2020-01-30
JP7000301B2 true JP7000301B2 (ja) 2022-01-19

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ID=66107802

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JP2018232235A Active JP7000301B2 (ja) 2018-12-12 2018-12-12 電磁波吸収体
JP2021209263A Active JP7350048B2 (ja) 2018-12-12 2021-12-23 電磁波吸収体

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JP2021209263A Active JP7350048B2 (ja) 2018-12-12 2021-12-23 電磁波吸収体

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000301B2 (ja) * 2018-12-12 2022-01-19 日東電工株式会社 電磁波吸収体
CN114731776B (zh) 2019-11-18 2025-07-11 东丽株式会社 层叠片材
EP4220859A4 (en) 2020-09-28 2024-03-27 FUJIFILM Corporation LAMINATE PRODUCTION PROCESS, ANTENNA-IN-PACKAGE PRODUCTION PROCESS, LAMINATE AND COMPOSITION
JP7578993B2 (ja) * 2022-03-24 2024-11-07 北川工業株式会社 電磁波吸収体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296758A (ja) 2003-03-27 2004-10-21 Takechi Kogyo Gomu Co Ltd ミリ波電波吸収体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006436A (ja) * 2002-03-29 2004-01-08 Aichi Steel Works Ltd 電波吸収材料及び電波吸収体
JP7000301B2 (ja) * 2018-12-12 2022-01-19 日東電工株式会社 電磁波吸収体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296758A (ja) 2003-03-27 2004-10-21 Takechi Kogyo Gomu Co Ltd ミリ波電波吸収体

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JP2019057730A (ja) 2019-04-11
JP2022048145A (ja) 2022-03-25
JP7350048B2 (ja) 2023-09-25

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