JP6999150B2 - ワークの検査結果判定方法 - Google Patents
ワークの検査結果判定方法 Download PDFInfo
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- JP6999150B2 JP6999150B2 JP2017081547A JP2017081547A JP6999150B2 JP 6999150 B2 JP6999150 B2 JP 6999150B2 JP 2017081547 A JP2017081547 A JP 2017081547A JP 2017081547 A JP2017081547 A JP 2017081547A JP 6999150 B2 JP6999150 B2 JP 6999150B2
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- 0 *C*(CCC1)CC1C(CC1)C*(C*)C[C@]1NC* Chemical compound *C*(CCC1)CC1C(CC1)C*(C*)C[C@]1NC* 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Textile Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
F1=Afa(OK,NG)+Bfb(OK,NG)+Cfc(OK,NG)+・・・
(1)
2 搬送テーブル
6 イオナイザ
7 整列ガイド
8 側面カメラ部
9 内面カメラ部
10 上面カメラ部
11 下面カメラ部
12 前面カメラ部
13 後面カメラ部
20 制御部
30 ワークの外観検査装置
Claims (5)
- 複数のワークに対して複数の検査項目について検査を実施し、全検査項目の検査結果に基づいてワークの等級を判定するワークの検査結果判定方法において、
前記複数のワークに対して複数の検査項目について検査を実施する工程と、
各ワークについて、全検査項目の検査結果に基づいて、検査項目毎に定まる関数を結合させた結合関数を用いてその評価値を求める工程と、
各ワークの評価値を2次元の所望空間に配置する工程と、
前記2次元の所望空間に配置された評価値の分布状態に基づいて、当該所望空間中に、この所望空間を複数の等級を示す領域に区画する境界を設定する工程と、を備え、
前記評価値を求める工程において、前記結合関数の検査項目毎に定まる関数は、当該検査項目の重要度配分を示す係数と、閾値を基準とした良または不良の程度を表すOKパラメータまたはNGパラメータを含み、前記結合関数は前記検査項目毎に定まる関数を合算して得られ、前記2次元の所望空間上の一方の軸と他方の軸に各々対応して配置された、OKスコアとNGスコアとを含む、
ことを特徴とするワークの検査結果判定方法。 - 前記検査は画像検査であることを特徴とする請求項1記載のワークの検査結果判定方法。
- 前記評価値を求める工程において、検査結果項目に定まる関数は、当該検査項目の重要度配分により定まる係数を含むことを特徴とする請求項1または2記載のワークの検査結果判定方法。
- 前記境界を設定する工程において、複数の等級を示す領域は良品領域および不良品領域を含むことを特徴とする請求項1乃至3のいずれか記載のワークの検査結果判定方法。
- 前記境界を設定する工程の後、各ワークについて良品又は不良品の判定を行うことを特徴とする請求項4記載のワークの検査結果判定方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107108365A TWI662272B (zh) | 2017-03-28 | 2018-03-13 | Method for judging inspection result of workpiece |
KR1020180037975A KR102297748B1 (ko) | 2017-04-17 | 2018-04-02 | 워크의 검사 결과 판정 방법 |
CN201810338039.2A CN108732171B (zh) | 2017-03-28 | 2018-04-16 | 工件的检查结果判定方法 |
KR1020200046014A KR20200044750A (ko) | 2017-03-28 | 2020-04-16 | 워크의 검사 결과 판정 방법 |
Applications Claiming Priority (2)
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JP2017063160 | 2017-03-28 | ||
JP2017063160 | 2017-03-28 |
Publications (2)
Publication Number | Publication Date |
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JP2018165712A JP2018165712A (ja) | 2018-10-25 |
JP6999150B2 true JP6999150B2 (ja) | 2022-01-18 |
Family
ID=63922884
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Application Number | Title | Priority Date | Filing Date |
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JP2017081547A Active JP6999150B2 (ja) | 2017-03-28 | 2017-04-17 | ワークの検査結果判定方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6999150B2 (ja) |
KR (1) | KR20200044750A (ja) |
TW (1) | TWI662272B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151233A1 (en) | 2004-12-30 | 2008-06-26 | Danmarks Tekniske Universitet | Method And Apparatus For Classification Of Surfaces |
JP2011089976A (ja) | 2009-09-28 | 2011-05-06 | Hitachi High-Technologies Corp | 欠陥検査装置および欠陥検査方法 |
JP2011145179A (ja) | 2010-01-15 | 2011-07-28 | Panasonic Corp | 官能検査装置及び官能検査方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07239938A (ja) * | 1994-02-28 | 1995-09-12 | Matsushita Electric Ind Co Ltd | 検査方法 |
US6148099A (en) * | 1997-07-03 | 2000-11-14 | Neopath, Inc. | Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification |
JP5598912B2 (ja) | 2009-11-27 | 2014-10-01 | 株式会社 東京ウエルズ | ワークの外観検査装置およびワークの外観検査方法 |
US10043264B2 (en) * | 2012-04-19 | 2018-08-07 | Applied Materials Israel Ltd. | Integration of automatic and manual defect classification |
JP5921990B2 (ja) * | 2012-08-23 | 2016-05-24 | 株式会社ニューフレアテクノロジー | 欠陥検出方法 |
-
2017
- 2017-04-17 JP JP2017081547A patent/JP6999150B2/ja active Active
-
2018
- 2018-03-13 TW TW107108365A patent/TWI662272B/zh active
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2020
- 2020-04-16 KR KR1020200046014A patent/KR20200044750A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151233A1 (en) | 2004-12-30 | 2008-06-26 | Danmarks Tekniske Universitet | Method And Apparatus For Classification Of Surfaces |
JP2011089976A (ja) | 2009-09-28 | 2011-05-06 | Hitachi High-Technologies Corp | 欠陥検査装置および欠陥検査方法 |
JP2011145179A (ja) | 2010-01-15 | 2011-07-28 | Panasonic Corp | 官能検査装置及び官能検査方法 |
Also Published As
Publication number | Publication date |
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TWI662272B (zh) | 2019-06-11 |
TW201842323A (zh) | 2018-12-01 |
JP2018165712A (ja) | 2018-10-25 |
KR20200044750A (ko) | 2020-04-29 |
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