JP6996134B2 - Processing equipment - Google Patents

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JP6996134B2
JP6996134B2 JP2017130600A JP2017130600A JP6996134B2 JP 6996134 B2 JP6996134 B2 JP 6996134B2 JP 2017130600 A JP2017130600 A JP 2017130600A JP 2017130600 A JP2017130600 A JP 2017130600A JP 6996134 B2 JP6996134 B2 JP 6996134B2
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polishing
polishing tool
robot
polished
force
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JP2019013986A (en
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知三 三上
武芳 江口
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IHI Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Description

本発明は、加工装置に関する。 The present invention relates to a processing apparatus.

一般に、ワーク表面の被溶射面にのみ溶射被膜を形成するために、溶射材を塗布しない領域（非塗布領域）にマスキングテープを貼付して溶射剤を塗布する。ただし、マスキングテープが剥がされると、溶射被膜の縁に溶射材の「ささくれ」のようなバリが発生する。そこで、現状では、下記特許文献１に記載の研磨パット等の研磨用工具を用いてそのバリを除去している。 Generally, in order to form a thermal spray coating only on the surface to be sprayed on the work surface, a masking tape is attached to an area where the thermal spray material is not applied (non-applied area) and the thermal spraying agent is applied. However, when the masking tape is peeled off, burrs such as "hangnail" of the sprayed material are generated on the edge of the sprayed coating. Therefore, at present, the burrs are removed by using a polishing tool such as the polishing pad described in Patent Document 1 below.

特開２００２－５７１３０号公報Japanese Unexamined Patent Publication No. 2002-57130

ところで、一般的には、研磨用工具でバリを除去する場合には、研磨用工具をバリに接触させながら往復運動させる。しかしながら、研磨用工具を往復運動させると溶射被膜を剥がす方向にも力がかかるため、溶射被膜を剥がしてしまう場合がある。 By the way, in general, when removing burrs with a polishing tool, the polishing tool is reciprocated while being in contact with the burrs. However, when the polishing tool is reciprocated, a force is also applied in the direction of peeling the thermal spray coating, so that the thermal spray coating may be peeled off.

本発明は、上述した事情に鑑みてなされたものであり、溶射被膜が剥がれることを抑制し、溶射被膜のバリを自動で除去することを目的とするものである。 The present invention has been made in view of the above circumstances, and an object of the present invention is to suppress peeling of the sprayed coating film and to automatically remove burrs from the sprayed coating film.

上記目的を達成するために、本発明では、加工装置に係る第１の解決手段として、研磨用工具を備えるロボットと、前記ロボットを制御することで被研磨対象物に研磨を施す制御装置と、を備える加工装置であって、前記研磨用工具は、研磨力の異方性を有することを特徴とする加工装置、という手段を採用する。 In order to achieve the above object, in the present invention, as a first solution means for a processing device, a robot equipped with a polishing tool, a control device for polishing an object to be polished by controlling the robot, and a control device. The polishing tool is a processing device comprising, and the polishing tool is characterized by having an anisotropic polishing force.

本発明では、加工装置に係る第２の解決手段として、上記第１の解決手段において、前記研磨力の異方性とは、前記制御装置が前記被研磨対象物に対して前記研磨用工具の研磨面を接触させて動かすことで研磨力を発生させる場合に、一方向に動かした場合の研磨力が他の方向に動かした場合よりも高い、という手段を採用する。 In the present invention, as a second solution relating to the processing apparatus, in the first solution means, the anisotropy of the polishing force means that the control device of the polishing tool with respect to the object to be polished. When the polishing force is generated by touching and moving the polishing surface, the means that the polishing force when moved in one direction is higher than that when moved in the other direction is adopted.

本発明では、加工装置に係る第３の解決手段として、上記第２の解決手段において、前記研磨面は、前記一方向の動摩擦係数が他の方向と比較して高い表面形状を有する、という手段を採用する。 In the present invention, as a third solution according to the processing apparatus, in the second solution, the polished surface has a surface shape in which the dynamic friction coefficient in one direction is higher than that in the other direction. Is adopted.

本発明では、加工装置に係る第４の解決手段として、上記第２又は上記第３の解決手段において、記制御装置は、予め教示された目標軌道に基づいて前記ロボットを制御することで、前記研磨用工具を移動させながら前記一方向に沿って往復動作させる、という手段を採用する。 In the present invention, as the fourth solution means for the processing device, in the second or third solution, the control device controls the robot based on the target trajectory taught in advance. A means of reciprocating along the one direction while moving the polishing tool is adopted.

本発明では、加工装置に係る第５の解決手段として、上記第１～第４のいずれかの解決手段において、前記研磨用工具は、基材と、前記基材の表面に複数の砥粒が固定された砥粒層と、を有する、という手段を採用する。 In the present invention, as a fifth solution according to the processing apparatus, in any one of the first to fourth solutions, the polishing tool has a base material and a plurality of abrasive grains on the surface of the base material. A means of having a fixed abrasive grain layer is adopted.

本発明によれば、溶射被膜が剥がれることを抑制し、溶射被膜のバリを自動で除去するができる。 According to the present invention, it is possible to suppress the peeling of the sprayed coating and automatically remove the burrs of the sprayed coating.

本発明の一実施形態に係る加工装置Ａの概要構成を示す図である。It is a figure which shows the outline structure of the processing apparatus A which concerns on one Embodiment of this invention. 本発明の一実施形態に係る研磨用工具５の概要構成を示す図である。It is a figure which shows the outline structure of the polishing tool 5 which concerns on one Embodiment of this invention. 本発明の一実施形態に係る加工装置Ａの動作を説明する図である。It is a figure explaining the operation of the processing apparatus A which concerns on one Embodiment of this invention.

以下、図面を参照して、本発明の一実施形態について説明する。
本実施形態に係る加工装置Ａは、ワークＷの表面に形成された溶射被膜Ｃを仕上げ加工する。加工装置Ａは、図１に示すようにロボット１及び制御装置２を備える。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The processing apparatus A according to the present embodiment finish-processes the thermal spray coating C formed on the surface of the work W. As shown in FIG. 1, the processing device A includes a robot 1 and a control device 2.

ロボット１は、ロボットアーム３、ハンド部４、及び研磨用工具５を備える。
ロボットアーム３は、複数の多関節機構を有する。ロボットアーム３の各関節には、各関節を各々駆動するモータが設けられている。ロボットアーム３は、制御装置２によりモータが駆動されることで、例えば、三次元空間を６軸方向に移動することができる。また、各関節には、モータの回転角度を検知するエンコーダが設けられている。 The robot 1 includes a robot arm 3, a hand portion 4, and a polishing tool 5.
The robot arm 3 has a plurality of articulated mechanisms. Each joint of the robot arm 3 is provided with a motor for driving each joint. The robot arm 3 can move, for example, in a three-dimensional space in the six-axis direction by driving a motor by the control device 2. Further, each joint is provided with an encoder that detects the rotation angle of the motor.

ハンド部４は、研磨用工具５をロボットアーム３に対して着脱可能に接続する。
研磨用工具５は、ハンド部４によりロボットアーム３の先端に取り付けられる。研磨用工具５は、ロボットアーム３の駆動により、三次元空間内で位置と姿勢を移動可能である。 The hand portion 4 detachably connects the polishing tool 5 to the robot arm 3.
The polishing tool 5 is attached to the tip of the robot arm 3 by the hand portion 4. The polishing tool 5 can move its position and posture in a three-dimensional space by driving the robot arm 3.

研磨用工具５は、研磨面を被研磨対象物に接触させて往復運動することで、該被研磨対象物を除去する。本実施形態では、被研磨対象物とは、ワークＷの表面に形成された溶射被膜ＣのバリＣｒである。
この研磨用工具５は、動かされる方向によって異なる研磨力を有する。すなわち、研磨用工具５は、研磨力の異方性を有する。この研磨力とは、被研磨対象物の表面を削り取り、平滑にする力である。 The polishing tool 5 removes the object to be polished by bringing the surface to be polished into contact with the object to be polished and reciprocating. In the present embodiment, the object to be polished is a burr Cr of the thermal spray coating C formed on the surface of the work W.
The polishing tool 5 has different polishing forces depending on the direction in which it is moved. That is, the polishing tool 5 has anisotropy of polishing force. This polishing force is a force for scraping and smoothing the surface of the object to be polished.

以下に、研磨部５１の構成について、図２をも参照して詳しく説明する。
研磨用工具５は、研磨部５１及び支持部５２を備える。 Hereinafter, the configuration of the polishing portion 51 will be described in detail with reference to FIG. 2.
The polishing tool 5 includes a polishing portion 51 and a support portion 52.

研磨部５１は、基材５１１及び砥粒層５１２を備える。
基材５１１の表面には砥粒層５１２が形成されている。基材５１１は、例えば、スチール、ＳＵＳ鋼、銅、銅合金、ニッケル、ニッケル合金等の金属、又は機械的強度、耐熱性等に優れた性質を有するプラスチックが使用される。 The polishing unit 51 includes a base material 511 and an abrasive grain layer 512.
An abrasive grain layer 512 is formed on the surface of the base material 511. As the base material 511, for example, a metal such as steel, SUS steel, copper, copper alloy, nickel, or nickel alloy, or a plastic having excellent mechanical strength, heat resistance, and the like is used.

砥粒層５１２は、基材５１１の表面に砥粒５１３が電着されることで形成される。例えば、砥粒層５１２は、砥粒５１３を結合剤５１４で固着した、いわゆる砥石である。
この砥粒層５１２の表面は、研磨用工具５の研磨面であって、研磨力の異方性を有する。 The abrasive grain layer 512 is formed by electrodepositing the abrasive grains 513 on the surface of the base material 511. For example, the abrasive grain layer 512 is a so-called grindstone in which the abrasive grains 513 are fixed with a binder 514.
The surface of the abrasive grain layer 512 is the polishing surface of the polishing tool 5, and has anisotropy of polishing force.

砥粒５１３は、ダイヤモンド砥粒やｃＢＮ（立方晶窒化ホウ素）砥粒などの硬質粒子である。例えば、砥粒５１３は、図２に示すように、直角三角形状であり、底面が基材５１１の表面に固定されている。これにより、砥粒層５１２を砥粒５１３の斜辺と反対方向にのみ動かすことで、他の方向に動かす場合と比較して高い研磨力が発生させることができる。これにより、砥粒５１３の斜辺と反対方向、すなわち高い研磨力を発生させることができる移動方向が研磨用工具５の研磨方向となる。 The abrasive grains 513 are hard particles such as diamond abrasive grains and cBN (cubic boron nitride) abrasive grains. For example, as shown in FIG. 2, the abrasive grains 513 have a right-angled triangular shape, and the bottom surface is fixed to the surface of the base material 511. As a result, by moving the abrasive grain layer 512 only in the direction opposite to the hypotenuse of the abrasive grain 513, it is possible to generate a higher polishing force as compared with the case where the abrasive grain layer 512 is moved in the other direction. As a result, the direction opposite to the hypotenuse of the abrasive grains 513, that is, the moving direction in which a high polishing force can be generated becomes the polishing direction of the polishing tool 5.

したがって、上記研磨力の異方性とは、被研磨対象物に対して砥粒層５１２の研磨面を接触させて動かすことで研磨力を発生させる場合に、一方向に動かした場合の研磨力が他の方向に動かした場合よりも高いことである。 Therefore, the anisotropy of the polishing force means the polishing force when the polishing force is moved in one direction when the polishing surface of the abrasive grain layer 512 is brought into contact with the object to be polished and moved. Is higher than if you move it in the other direction.

支持部５２は、一端に研磨部５１が固定されることで研磨部５１を支持する。そして、支持部５２の他端がハンド部４に取り付けられることで、研磨用工具５がロボットアーム３の先端に固定される。 The support portion 52 supports the polishing portion 51 by fixing the polishing portion 51 to one end. Then, the other end of the support portion 52 is attached to the hand portion 4, so that the polishing tool 5 is fixed to the tip of the robot arm 3.

制御装置２は、ロボット制御部２１及び記憶部２２を備える。
ロボット制御部２１は、例えば、事前に作業者により手動で教示された目標軌道に沿って研磨用工具５を移動させる、いわゆるティーチングプレイバック制御を行う。そして、ロボット制御部２１は、教示された移動経路に沿って研磨用工具５を移動させながら、研磨方向に沿って往復動作させることでワークに研磨を施す。 The control device 2 includes a robot control unit 21 and a storage unit 22.
The robot control unit 21 performs so-called teaching playback control, for example, to move the polishing tool 5 along a target trajectory manually instructed by an operator in advance. Then, the robot control unit 21 polishes the work by reciprocating along the polishing direction while moving the polishing tool 5 along the taught movement path.

記憶部２２には、加工データが予め記憶されている。この加工データは、加工軌道データテーブル及び加工条件データを含む。
加工軌道データテーブルは、研磨用工具５を移動させる軌道（目標軌道）を示すデータであり、一定距離間隔における空間座標（Ｘ，Ｙ，Ｚ）からなる。この加工軌道データテーブルは、例えば、ワークＷの３ＤＣＡＤモデルから自動的に生成する。
加工条件データは、研磨用工具５の移動方向、及び往復動作の振幅及び周期等のデータである。 Processing data is stored in advance in the storage unit 22. This machining data includes a machining trajectory data table and machining condition data.
The machining trajectory data table is data indicating a trajectory (target trajectory) for moving the polishing tool 5, and is composed of spatial coordinates (X, Y, Z) at regular distance intervals. This machining trajectory data table is automatically generated from, for example, a 3D CAD model of the work W.
The machining condition data is data such as the moving direction of the polishing tool 5 and the amplitude and period of the reciprocating motion.

次に、加工装置Ａの動作について、図３をも参照して詳しく説明する。 Next, the operation of the processing apparatus A will be described in detail with reference to FIG.

ロボット制御部２１は、作業者により、ロボットアーム３の先端に研磨用工具５を取り付けられると、記憶部２２から加工軌道データテーブル及び加工条件データを読み出す。そして、ロボット制御部２１は、記憶部２２から読み出した往復動作の振幅及び周期のデータから往復動作の成分を作成し、目標軌道に重ね合わせる。したがって、ロボット制御部２１は、研磨用工具５が、往復動作の成分が重ね合わされた目標軌道に沿って移動するように制御することで、研磨用工具５を研磨方向に沿って往復動作させ、溶射被膜ＣのバリＣｒを研磨することができる。 When the polishing tool 5 is attached to the tip of the robot arm 3 by the operator, the robot control unit 21 reads out the processing trajectory data table and the processing condition data from the storage unit 22. Then, the robot control unit 21 creates a component of the reciprocating motion from the amplitude and period data of the reciprocating motion read from the storage unit 22, and superimposes the component on the target trajectory. Therefore, the robot control unit 21 controls the polishing tool 5 to move along the target trajectory on which the components of the reciprocating motion are superimposed, so that the polishing tool 5 is reciprocated along the polishing direction. The burr Cr of the thermal spray coating C can be polished.

ここで、研磨用工具５は、研磨特性の異方性を有し、例えば、研磨面が一方向（研磨方向）にのみ動摩擦係数が高い表面形状を有する。したがって、研磨方向にのみ研磨用工具５を動かすことでワークＷに対して研磨することができる。そのため、研磨用工具５の研磨方向を、溶射被膜Ｃを剥がす方向とは反対方向、例えば、溶射被膜Ｃの縁に向かう方向に設定することで、溶射被膜Ｃを剥がす方向に力がかからなくなり、溶射被膜Ｃを剥がすことなく、バリＣｒを削り取ることができる。 Here, the polishing tool 5 has anisotropy of polishing characteristics, and for example, the polishing surface has a surface shape having a high dynamic friction coefficient only in one direction (polishing direction). Therefore, the work W can be polished by moving the polishing tool 5 only in the polishing direction. Therefore, by setting the polishing direction of the polishing tool 5 in the direction opposite to the direction in which the thermal spray coating C is peeled off, for example, in the direction toward the edge of the thermal spray coating C, no force is applied in the direction in which the thermal spray coating C is peeled off. The burr Cr can be scraped off without peeling off the thermal spray coating C.

本実施形態によれば、本発明の一実施形態に係る加工装置Ａは、研磨用工具５を備えるロボット１と、ロボット１を制御することで被研磨対象物に研磨を施す制御装置２と、を備え、その研磨用工具５は研磨力の異方性を有する。これにより、溶射被膜Ｃが剥がれることを抑制し、溶射被膜ＣのバリＣｒを自動で除去するができる。 According to the present embodiment, the processing apparatus A according to the embodiment of the present invention includes a robot 1 provided with a polishing tool 5, a control device 2 for polishing an object to be polished by controlling the robot 1, and a control device 2. The polishing tool 5 has an anisotropic polishing force. As a result, it is possible to suppress the peeling of the thermal spray coating C and automatically remove the burr Cr of the thermal spray coating C.

また、研磨用工具５の研磨面は、一方向の動摩擦係数が他の方向と比較して高い表面形状を有することで、上記研磨力の異方性が発現することになる。例えば、研磨用工具５の研磨面は、直角三角形状の砥粒５１３の底面が基材５１１の表面に固定されることで、上記研磨力の異方性が発現することになる。 Further, the polishing surface of the polishing tool 5 has a surface shape in which the coefficient of dynamic friction in one direction is higher than that in the other direction, so that the anisotropy of the polishing force is exhibited. For example, on the polishing surface of the polishing tool 5, the anisotropy of the polishing force is exhibited by fixing the bottom surface of the right-angled triangular abrasive grains 513 to the surface of the base material 511.

なお、本発明は上記実施形態に限定されるものではなく、例えば以下のような変形例が考えられる。
（１）上記実施形態では、位置制御することで研磨用工具５を目標軌道に沿って移動させるように制御したが、本発明はこれに限定されない。例えば、加工装置Ａは、研磨用工具５に作用する外力Ｆを検出する力センサを備え、ロボット制御部２１が、取得した外力Ｆが一定値になるように、ロボットアーム３に設けられたモータの駆動を制御する、いわゆる力制御することで、ワークＷに対して研磨を施してもよい。 The present invention is not limited to the above embodiment, and for example, the following modifications can be considered.
(1) In the above embodiment, the polishing tool 5 is controlled to move along the target trajectory by controlling the position, but the present invention is not limited to this. For example, the processing apparatus A includes a force sensor that detects an external force F acting on the polishing tool 5, and a motor provided on the robot arm 3 so that the acquired external force F becomes a constant value by the robot control unit 21. The work W may be polished by controlling the drive of the work W, that is, by controlling the force.

（２）上記実施形態では、研磨用工具５をワークＷに接触させないように制御しながが、本発明はこれに限定されない。例えば、加工装置Ａは、研磨用工具５の支持部５２に装着され、研磨部５１の研磨面に対して突出した倣い面を備える補助部材を備えてもよい。この倣い面は、例えば、補助部材の端面である。この場合には、ロボット制御部２１は、力センサから取得した外力Ｆが一定値になるように、ロボットアーム３に設けられたモータの駆動を制御することで、上記補助部材の倣い面をワークＷの表面に押し付けながら移動させる。これにより、マスキングテープが剥がされることで発生したバリＣｒにのみ研磨部５１の研磨面が接触し、そのバリＣｒを削り取ることができる。これにより、ワークＷや溶射被膜Ｃを研磨部５１で不必要に傷つけることなくバリＣｒのみを取り除くことができる。 (2) In the above embodiment, the polishing tool 5 is controlled so as not to come into contact with the work W, but the present invention is not limited to this. For example, the processing apparatus A may be provided with an auxiliary member that is mounted on the support portion 52 of the polishing tool 5 and has a copying surface that protrudes from the polishing surface of the polishing portion 51. This copying surface is, for example, an end surface of an auxiliary member. In this case, the robot control unit 21 works on the copying surface of the auxiliary member by controlling the drive of the motor provided on the robot arm 3 so that the external force F acquired from the force sensor becomes a constant value. Move while pressing against the surface of W. As a result, the polished surface of the polishing portion 51 comes into contact with only the burr Cr generated by peeling off the masking tape, and the burr Cr can be scraped off. As a result, only the burr Cr can be removed without unnecessarily damaging the work W and the sprayed coating C by the polishing portion 51.

（３）上記実施形態では、研磨用工具５は、電着により基材の表面に砥粒が固定される、いわゆる電着工具である場合について説明したが、本発明はこれに限定されない。例えば、研磨用工具５は、樹脂等の接着により基材５１１の表面に砥粒５１３を固定されていてもよい。 (3) In the above embodiment, the case where the polishing tool 5 is a so-called electrodeposition tool in which the abrasive grains are fixed to the surface of the base material by electrodeposition has been described, but the present invention is not limited thereto. For example, in the polishing tool 5, the abrasive grains 513 may be fixed to the surface of the base material 511 by adhering a resin or the like.

１ ロボット
２ 制御装置
３ ロボットアーム
４ ハンド部
５ 研磨用工具
２１ ロボット制御部
２２ 記憶部
５１ 研磨部
５２ 支持部
５１１ 基材
５１２ 砥粒層
５１３ 砥粒 1 Robot 2 Control device 3 Robot arm 4 Hand part 5 Polishing tool 21 Robot control part 22 Storage part 51 Polishing part 52 Support part 511 Base material 512 Abrasive grain layer 513 Abrasive grain

Claims (4)

研磨用工具を備えるロボットと、前記ロボットを制御することで縁にバリが形成された被研磨対象物に研磨を施す制御装置と、を備える加工装置であって、
前記研磨用工具は、研磨力の異方性を有し、
前記制御装置は、前記研磨用工具の前記研磨力が高くなる一方向を前記被研磨対象物の縁に向かう方向に設定して前記バリを削り取ることを特徴とする加工装置。 A processing device including a robot equipped with a polishing tool and a control device for polishing an object to be polished having burrs formed on the edges by controlling the robot.
The polishing tool has anisotropy of polishing force and has an anisotropy.
The control device is a processing device characterized in that the burr is scraped off by setting one direction in which the polishing force of the polishing tool is increased toward the edge of the object to be polished. 研磨面は、前記一方向の動摩擦係数が他の方向と比較して高い表面形状を有することを特徴とする請求項１記載の加工装置。 The processing apparatus according to claim 1, wherein the polished surface has a surface shape in which the coefficient of dynamic friction in one direction is higher than that in the other direction. 前記制御装置は、予め教示された目標軌道に基づいて前記ロボットを制御することで、前記研磨用工具を移動させながら前記一方向に沿って往復動作させることを特徴とする請求項２記載の加工装置。 The processing according to claim 2, wherein the control device controls the robot based on a target trajectory taught in advance to reciprocate the polishing tool along the one direction while moving the polishing tool. Device. 前記研磨用工具は、
基材と、
前記基材の表面に複数の砥粒が固定された砥粒層と、
を有することを特徴とする請求項１～３のいずれか一項に記載の加工装置。 The polishing tool is
With the base material
An abrasive grain layer in which a plurality of abrasive grains are fixed on the surface of the base material,
The processing apparatus according to any one of claims 1 to 3, wherein the processing apparatus comprises.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005319528A (en) 2004-05-07 2005-11-17 Three M Innovative Properties Co Method of polishing curved surface of workpiece
JP2007505758A (en) 2003-09-23 2007-03-15 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article and method for producing the same
JP2011240471A (en) 2010-05-21 2011-12-01 Honda Motor Co Ltd Method for manufacturing grindstone and abrasive grain positioning jig

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007505758A (en) 2003-09-23 2007-03-15 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article and method for producing the same
JP2005319528A (en) 2004-05-07 2005-11-17 Three M Innovative Properties Co Method of polishing curved surface of workpiece
JP2011240471A (en) 2010-05-21 2011-12-01 Honda Motor Co Ltd Method for manufacturing grindstone and abrasive grain positioning jig

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