JP6990547B2 - Electronic components - Google Patents

Description

The present invention relates to an electronic component comprising an optical deflector.

In recent years, image projection devices that combine semiconductor light sources such as light emitting diodes and semiconductor lasers with small optical deflectors such as MEMS (Micro Electro Mechanical Systems) or DMD (Digital Mirror Device) have been used for pico projectors and head-up displays. Has been developed as.

Devices such as semiconductor light sources and small optical deflectors are housed in a ceramic package, and the lid member on the top of the package is made of glass. This allows the package to allow light to pass towards the outside of the package while protecting the internal devices.

For example, in the optical device of Patent Document 1 below, the optical deflector is housed in a sealed space of a holder composed of a package and a cover glass. The optical deflector is provided with a mirror, and the bottom surface of the package is provided with a space on the back surface side of the optical deflector so that the mirror can operate (paragraphs 0033, 0034, FIG. 2).

Japanese Unexamined Patent Publication No. 2015-148654

However, in this optical device, among the emitted light emitted from the light source device, there is an optical component that does not enter the mirror (reflecting surface) and is irradiated on the bottom surface of the package. Then, the light reflected by the bottom surface portion becomes stray light and is repeatedly reflected inside the holding body, or is mixed with the scanning light and emitted to the outside.

For example, if the stray light is mixed with the scanning light, there is a possibility that the projected image (image) formed by the scanning light in the image forming region may not have a desired contrast.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component capable of preventing stray light from being emitted to the outside.

The electronic component of the first invention is provided with an optical deflector having a rotating mirror portion that reflects incident light, and a wiring layer on which the optical deflector is mounted and having wiring connected to an electrode of the optical deflector. The substrate is joined, the lid portion is provided with a window plate that covers the reflective surface side of the rotating mirror portion and the incident light is transmitted to the top plate, and the lower surface of the lid portion and the substrate are joined to each other. The substrate has a curved concave portion on the back surface side of the optical deflector, and the optical deflector is irradiated with the light reflected by the concave portion on the back surface of the rotating mirror portion. The recess is characterized in that it has the shape of a release surface, and the focal point of the release surface is located on the back surface side of the rotating mirror portion .

The electronic component of the first invention is composed of a substrate on which an optical deflector is mounted and a lid portion that covers the reflecting surface side of the rotating mirror portion of the optical deflector, and the lid portion is a window through which incident light passes. A board is provided. The incident light is incident from the window plate, reflected by the rotating mirror portion of the optical deflector, emitted from the window plate, scans the optical scanning region, and produces a desired projected image.

Some of the incident light comes off the rotating mirror portion, and such light is reflected by the concave portion of the substrate on the back surface side of the optical deflector. Here, since the reflected light in the recess is applied to the back surface of the rotating mirror portion, it is possible to prevent the light reflected in the recess from becoming stray light and being emitted to the outside of the electronic component. can.

According to this configuration, since a parabolic concave portion is formed on the substrate, the incident light incident on the concave portion is focused on the focal position of the parabolic surface. Here, since the focal point is located on the back surface side of the rotating mirror portion, the reflected light in the recess illuminates the back surface of the rotating mirror portion. As a result, the reflected light can be reliably irradiated to the back surface, and the light reflected by the concave portion of the substrate can be more reliably prevented from being emitted to the outside of the electronic component as stray light.

Further, in the electronic component of the first invention, it is preferable that the recess is covered with a material that suppresses reflection of the incident light.

According to this configuration, since the recesses of the substrate are covered with a material that suppresses the reflection of incident light, it is possible to make it difficult to generate reflected light that can be stray light.

Further, in the electronic component of the first invention, it is preferable that the back surface of the rotating mirror portion is covered with a material that suppresses the reflection of the light reflected by the concave portion.

When the incident light incident on the concave portion of the substrate is reflected, the reflected light is applied to the back surface of the rotating mirror portion. In the present invention, since the back surface of the rotating mirror portion is coated with a material that suppresses the reflection of light, further reflection can be suppressed and stray light can be prevented from being generated.

Further, in the electronic component of the first invention, the material for suppressing the reflection of light is preferably black paint, black plating or black ceramic.

According to this configuration, since various black materials are used as the material for suppressing the reflection of light, it is possible to absorb light that can be stray light. This makes it possible to prevent the generation of reflected light that can be stray light.

Further, in the electronic component of the first invention, it is preferable that the substrate is made of metal.

According to this configuration, since the substrate is made of metal, heat dissipation is excellent. The incident light that does not enter the rotating mirror portion directly irradiates the concave portion of the substrate on the back surface side of the optical deflector, but since the substrate is made of metal, the heat generated by the incident light can be dissipated.

The electronic component of the second invention includes an optical deflector having a rotating mirror portion that reflects incident light, and a substrate on which the optical deflector is placed and provided with wiring connected to an electrode of the optical deflector. A lid portion that covers the reflective surface side of the light deflector and is provided with a window plate on the top plate through which the incident light is transmitted, a pedestal having a flat concave portion provided on the upper surface side of the substrate, and the above. The substrate includes a sealing joint portion in which the surface of the substrate and the surface of the lower end of the lid portion are in close contact with each other, and the substrate has a curved concave portion formed in the planar concave portion. The rotating mirror portion is rotatable in a space composed of the curved concave portion and the lid portion, and in the optical deflector, the light reflected by the curved concave portion is the rotating mirror portion. The curved concave portion has the shape of a radial surface, and the focal point of the radial surface is located on the back surface side of the rotating mirror portion. And.

The electronic component of the second invention is composed of a substrate on which the optical deflector is mounted and a lid portion that covers the reflecting surface side of the rotating mirror portion of the optical deflector, and the lower end of the lid portion is the surface of the substrate. It is sealed at the sealing joint. A window plate through which incident light is transmitted is provided in the lid portion, and the incident light is incident from the window plate, reflected by the rotating mirror portion of the light deflector, emitted from the window plate, and scans the optical scanning region. , Produce the desired projection.

Some of the incident light comes off the rotating mirror portion, and such light is reflected by the concave portion on the plane of the substrate on the back surface side of the optical deflector. Here, since the reflected light in the recess is applied to the back surface of the rotating mirror portion, it is possible to prevent the light reflected in the recess from becoming stray light and being emitted to the outside of the electronic component. can.

According to this configuration, since the parabolic recess is formed on the substrate, the incident light incident on the recess is focused on the focal position of the paraboloid. Here, since the focal point is located on the back surface side of the rotating mirror portion, the reflected light in the recess illuminates the back surface of the rotating mirror portion. As a result, the reflected light can be reliably irradiated to the back surface, and the light reflected by the concave portion of the substrate can be more reliably prevented from being emitted to the outside of the electronic component as stray light.

Further, in the electronic component of the second invention, it is preferable that the curved concave portion is covered with a material that suppresses the reflection of the incident light.

According to this configuration, since the curved concave portion of the substrate is covered with a material that suppresses the reflection of incident light, it is possible to make it difficult to generate reflected light that can be stray light.

Further, in the electronic component of the second invention, it is preferable that the back surface of the rotating mirror portion is covered with a material that suppresses the reflection of the light reflected by the curved concave portion.

When the incident light incident on the curved concave portion of the substrate is reflected, the reflected light is applied to the back surface of the rotating mirror portion. In the present invention, since the back surface of the rotating mirror portion is coated with a material that suppresses the reflection of light, further reflection can be suppressed and stray light can be prevented from being generated.

Further, in the electronic component of the second invention, the material for suppressing the reflection of light is preferably black paint, black plating or black ceramic.

According to this configuration, since various black materials are provided as materials for suppressing the reflection of light, it is possible to absorb light that can be stray light. This makes it possible to prevent the generation of reflected light that can be stray light.

Further, in the electronic component of the second invention, it is preferable that the portion of the lid portion other than the window plate, the substrate and the pedestal are made of metal.

According to this configuration, the lid portion other than the window plate, the substrate, and the pedestal are made of metal, so that the heat dissipation is excellent. The incident light that does not enter the rotating mirror is directly applied to the curved concave portion of the substrate on the back surface side of the optical deflector, but it depends on the incident light because the parts other than the window plate of the lid part are made of metal. Heat can be dissipated.

The figure which shows the whole structure of the electronic component of embodiment of this invention. The figure which shows the II-II line cross section of the electronic component of FIG. The figure explaining the deformation example of the recess located on the back surface side of a rotating mirror part. The figure which shows the whole structure of the modification of the electronic component of embodiment of this invention.

Hereinafter, embodiments of the electronic components of the present invention will be described.

FIG. 1 is a diagram showing an overall configuration (opened state) of the electronic component 1 according to the embodiment of the present invention. As shown in FIG. 1, the electronic component 1 is mainly composed of a lid portion 2, a substrate 3, and an optical deflector 4 mounted on the substrate 3.

The lid portion 2 is composed of a window plate 6 and a frame body 7. In the sealed electronic component 1, light from an external light source can reach the inside of the electronic component 1 through the window plate 6.

The material of the window plate 6 is thin, optical hard glass (borosilicate glass) with few impurities, and is attached to the upper surface side of the frame 7. Since the window plate 6 is a transparent member, light incident on the inside of the electronic component 1 from a light source (not shown) is reflected by the optical deflector 4 (rotating mirror portion 10) and emitted to the outside of the electronic component 1. The loss of light can be reduced. For example, in a vehicle lighting device, the light reflected by the light deflector 4 is projected as a light distribution pattern on the irradiation region in front of the vehicle.

The frame body 7 is a member whose central portion is hollowed out and whose upper surface side is slightly inclined. The reason for having such a structure is to prevent the light reflected by the window plate 6 from being mixed with the light reflected by the light deflector 4 (rotating mirror portion 10) and emitted to the outside.

The material of the frame 7 is metal, ceramic, plastic or hard glass. When the frame 7 is made of metal, it is preferable to use a Kovar alloy (for example, Fe 54%, Ni 28%, Co 18%) having a thermal expansion coefficient that matches the borosilicate glass that is the material of the window plate 6 over a wide temperature range. This makes it possible to reduce the stress caused by the difference in the thermal expansion rate at the time of joining with the window plate 6.

When the material of the frame 7 is ceramic, it is preferable to use alumina having a thermal expansion coefficient close to that of borosilicate glass, which is the material of the window plate 6. This makes it possible to reduce the stress caused by the difference in the thermal expansion rate at the time of joining with the window plate 6.

When the material of the frame 7 is plastic, it is preferable to use a resin that does not allow moisture or gas to pass through, such as an epoxy resin, a fluororesin, a polyolefin resin, and a liquid crystal polymer. As a result, it is possible to suppress moisture permeation into the electronic component 1.

When the material of the frame body 7 is metal or ceramic, it is preferable that the window plate 6 and the frame body 7 are bonded with low melting point glass. In particular, when joining a member containing a glass material such as a window plate 6, a preform (low melting point glass frit mold) or a paste material is placed between the two members to ensure the joining. Can be done.

An adhesive can be used to join the frame body 7 and the window plate 6. In particular, since the window plate 6 is transparent, it is preferable to use a UV (Ultra Violet) curable adhesive. When UV-bonding, a UV-curable adhesive is applied between the two members to be bonded. Since the glass window plate 6 transmits UV (wavelength 350 to 360 μm), the UV curable adhesive can be cured in a short time by irradiating with UV, and both members can be bonded to each other. If the window plate 6 is made thin, the bonding time can be shortened.

When the material of the frame 7 is hard glass, borosilicate glass, which is a heat-resistant impact glass, may be used. This makes it possible to withstand heat and impact in a high temperature environment.

At this time, the window plate 6 of the optical hard glass and the frame 7 are joined by optical contact. As a result, the window plate 6 and the frame body 7 can be firmly joined without using an adhesive, so that the joining can be maintained even in a high temperature environment.

Further, as shown in the figure, a wiring layer 8 on the upper surface of the substrate 3 includes a wiring base material 25 having a light deflector 4 and wirings 23 and 24 connected to the electrode pads 15 and 16 of the light deflector 4. Is provided.

Specifically, the wiring layer 8 is composed of a wiring base material 25 having wirings 23 and 24 and a resist coat 26 covering the wirings 23 and 24 (see FIG. 2). The portion from which the resist coat 26 has been removed becomes the electrode pads 21 and 22 connected to the wirings 23 and 24.

In the present embodiment, the insulating plastic base material is used as the wiring base material 25, but a flexible base material may be used. As the material of the flexible base material, a liquid crystal polymer (LCP) or a Teflon (registered trademark) -based low moisture permeability member may be used. As a result, it is possible to suppress moisture permeation into the electronic component 1.

Further, the flexible board can be directly inserted into the connector on the various device side. When a flexible substrate is used, it can be connected to various devices with a simple configuration without providing a connector 60 on the upper surface side of the wiring base material.

The wiring base material 25 of the insulating plastic base material and the base material 3 are joined by an adhesive. Epoxy resin may be used as the adhesive. The flexible substrate and the substrate 3 may be bonded not only by the above-mentioned adhesive but also by thermocompression bonding.

The wirings 23 and 24 (five wires each) are made of, for example, a Cu (copper) thin film, and are formed as a wiring pattern on the upper surface of the wiring base material 25. One end of the wirings 23 and 24 is connected to the electrode pads 21 and 22, and the other end is connected to the connector 60.

The resist coat 26 is provided so as to cover the wirings 23 and 24. The resist coat 26 is provided to protect the wirings 23 and 24, and the material thereof is, for example, an epoxy resin.

The electrode pads 21 and 22 are exposed portions of the wirings 23 and 24, and the Cu thin film is plated with Ni (nickel) and the upper layer is plated with Au. This is to suppress corrosion of the Cu thin film and improve bondability such as wire bonding. Further, the electrode pads 21 and 22 are connected to the electrode pads 15 and 16 provided on the optical deflector 4 via the wire 20, respectively.

Hereinafter, the configuration and function of the light deflector 4 having the rotating mirror unit 10 that reflects the incident light will be briefly described.

The optical deflector 4 is a device manufactured by utilizing a semiconductor process or a MEMS technique, and can reflect light incident from a certain direction by the rotating mirror unit 10 and emit it as scanning light.

The optical deflector 4 is composed of a rotating mirror portion 10, semi-annular piezoelectric actuators 12a, 12b, torsion bars 13a, 13b, bellows-type piezoelectric actuators 14a, 14b, etc. arranged in the fixed frame 9.

Further, the control device (not shown) transmits control signals from the electrode pads 15 and 16 to both actuators. Both actuators are driven by the control signal, and the torsion bars 13a and 13b are twisted accordingly to rotate the rotary mirror unit 10. Then, the light incident on the inside of the electronic component 1 from the light source is reflected by the rotating mirror unit 10.

In the initial state, the rotating mirror portion 10 passes through the center O and has a normal line perpendicular to the rotating mirror portion 10 directed straight forward. Further, the rotating mirror portion 10 is supported by torsion bars 13a and 13b in the Y-axis direction, and is arranged at the center of a circular annular movable frame 11. The reflective surface of the rotating mirror portion 10 is a metal thin film such as Au, Pt, Al, etc., and is formed by, for example, a sputtering method or an electron beam vapor deposition method. The shape of the rotating mirror portion 10 is not limited to a circle, but may be an ellipse or a rectangle.

The torsion bars 13a and 13b are coupled to the rotating mirror portion 10 at one end and the semi-annular piezoelectric actuators 12a and 12b at the other ends, respectively. Further, the semi-annular piezoelectric actuators 12a and 12b are coupled to one end of the bellows type piezoelectric actuators 14a and 14b via a movable frame 11, respectively. The other ends of the bellows type piezoelectric actuators 14a and 14b are coupled to the fixed frame 9, respectively.

The semi-annular piezoelectric actuators 12a and 12b rotate the rotation mirror portion 10 around the main scanning direction (around the Y axis). Further, the bellows type piezoelectric actuators 14a and 14b rotate the rotation mirror portion 10 around the sub-scanning direction (around the X-axis).

The semi-annular piezoelectric actuators 12a and 12b and the bellows type piezoelectric actuators 14a and 14b have a structure in which a piezoelectric piezoelectric film (PZT) made of lead zirconate titanate or the like is sandwiched between a lower electrode and an upper electrode by a semiconductor planar process. .. By applying a voltage to the piezoelectric film via the lower electrode and the upper electrode, the PZT is deformed.

Further, electrode pads 15 and 16 (five each) are provided on the side surface of the fixed frame 9. The electrode pads 15 and 16 are made of, for example, an Al (aluminum) thin film, and are connected to the electrode pads 21 and 22 (five each) provided in the wiring layer 8 described later by wires 20. As a result, each actuator of the optical deflector 4 can be driven.

Next, the configuration of the substrate 3 will be mainly described with reference to FIG.

FIG. 2 is a diagram showing a line II-II cross section of the electronic component 1 of FIG. 1, and in particular, is a cross-sectional view of the electronic component 1 in a sealed state in which the lid portion 2 and the substrate 3 shown in FIG. 1 are joined. be. The electrodes (electrode pads 15 and 16) of the optical deflector 4 are connected to the electrodes (electrode pads 21 and 22) of the wiring layer 8 (see FIG. 1).

The joint portion 5 of the electronic component 1 is a portion where the lower surface of the lid portion 2 (lower surface of the frame body 7) and the wiring layer 8 are joined. The lower surface of the frame 7 and the wiring layer 8 are joined by an adhesive. As this adhesive, it is preferable to use a resinous adhesive such as an epoxy resin, a butyl rubber resin, a fluororesin, a polyolefin resin, and a liquid crystal polymer (LCP) that does not allow moisture or gas to pass through. As a result, it is possible to suppress moisture permeation from the joint portion (joint portion 5) between the frame body 7 and the wiring layer 8 into the electronic component 1.

When the material of the frame body 7 is plastic, the frame body 7 and the substrate 3 provided with the wiring layer 8 may be integrally formed and joined by plastic molding without using an adhesive.

The substrate 3 is made of metal. Examples of the material of the substrate 3 include copper, aluminum, and stainless steel. Since it is made of such a metal, the substrate 3 has excellent heat dissipation. Therefore, even when the rotating mirror portion 10 becomes hot due to the incident of the laser beam, the heat can be dissipated through the substrate 3.

Further, the substrate 3 has a curved concave portion 31 on the back surface side of the optical deflector 4. The curved concave portion 31 is formed as a space for rotating the rotation mirror portion 10 of the optical deflector 4. The curved concave portion 31 is formed by machining, etching, pressing, or the like.

Here, the light deflector 4 is arranged at a position where the light reflected by the curved concave portion 31 is applied to the back surface of the rotating mirror portion 10.

Some of the incident light comes off the rotating mirror portion 10, and such light is reflected by the curved concave portion 31 of the substrate 3 on the back surface side of the optical deflector 4. Then, since the reflected light in the curved concave portion 31 is applied to the back surface of the rotating mirror portion 10, the reflected light in the curved concave portion 31 becomes stray light and is emitted to the outside of the electronic component 1. It can be prevented.

Further, the curved concave portion 31 has the shape of a paraboloid, and the focal point of the paraboloid is located on the back surface side of the rotating mirror portion 10. It is preferable that the central axis of the paraboloid surface of the recess 31 passes through the center of the rotating mirror portion 10, and as shown in FIG. 3, the central axis of the paraboloid surface passes through the center of the rotating mirror portion 10 and is incident. It is more preferable that the recess 31 is arranged so as to be parallel to the light. Since the parabolic recess 31 is formed in the substrate 3 in this way, the incident light incident on the parabolic recess 31 is focused on the focal position of the paraboloid.

Since the focal point is located on the back surface side of the rotating mirror portion 10, the reflected light in the parabolic recess 31 illuminates the back surface of the rotating mirror portion 10. Unlike a normal curved surface, the paraboloid surface collects light at the focal position, so that the back surface can be more reliably irradiated with the reflected light. Therefore, it is possible to more reliably prevent the reflected light from the recess 31 of the substrate 3 from becoming stray light and being emitted to the outside of the electronic component 1.

Further, the curved or parabolic concave portion 31 is covered with a covering material 27 made of a material that suppresses the reflection of incident light. The material of the covering material 27 is preferably black paint, black pigment, black plating or black ceramic. The black paint is applied to the surface of the recess 31 by, for example, a spray coat that atomizes and paints the paint. A black resist material may be applied as the black paint. Examples of the black pigment include a binder resin to which a titanium-based, carbon-based, oxide-based or other pigment is added, and the black pigment is applied to the surface of the recess 31.

The black plating is formed by coating the surface of the recess 31 with a thin film of a metal such as black chrome or black alumite. The black ceramic is formed by, for example, coloring a ceramic made of alumina with a black pigment. The black ceramic is bonded to the surface of the recess 31 with an adhesive such as an epoxy resin.

Since various black materials (black paint, black pigment, black plating, black ceramic, etc. described above) are provided on the surface of the recess 31, it is possible to absorb light that may be stray light. This makes it possible to prevent the generation of reflected light that can be stray light.

Further, the back surface of the rotating mirror portion 10 is covered with a covering material 28 made of a material that suppresses the reflection of the light reflected by the recess 31. The material of the covering material 28 is preferably a black paint, a black pigment, black plating or a black ceramic, similarly to the above-mentioned covering material 27. The covering material 28 is formed on the back surface of the rotating mirror portion 10 by the above-mentioned coating, plating, or adhesion.

When the incident light incident on the recess 31 of the substrate 3 is reflected, the reflected light is applied to the back surface of the rotating mirror portion 10. Since the back surface of the rotating mirror portion 10 is covered with a covering material 28 made of a material that suppresses the reflection of light, further reflection can be suppressed and stray light can be prevented from occurring.

The optical deflector 4 is joined to the peripheral edge of the recess 31. This bonding is, for example, bonding with an adhesive such as an epoxy resin or a silicon resin, bonding with solder, or Au (gold) bonding. By this joining, the optical deflector 4 is mounted on the upper surface of the recess 31.

Further, as shown in the figure, a connector 60 is mounted on the substrate 3 and is connected via the wiring layer 8. The connector 60 is used to connect the electronic component 1 to various devices (not shown). The drive of the electronic component 1 is controlled based on electric signals from various devices received via the connector 60.

A circuit component connected to the optical deflector 4 may be mounted on the substrate 3. Circuit components are used to operate and control the optical deflector 4.

<Modification example>
Next, a modified example (hermetic seal) of the electronic component 1 according to the embodiment of the present invention will be described with reference to FIG. The same components as those of the electronic component 1 are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 4 is a diagram showing an internal configuration of the electronic component 101. The electronic component 101 mainly includes a lid portion 102, a substrate 103, a pedestal 129 having a planar recess 1291 provided on the upper surface side of the substrate 103, and an optical deflector 4b mounted on the substrate 103. Consists of.

First, the lid portion 102 is composed of a main body portion 102a composed of a top plate and a frame body, and a window portion 102b provided on the top plate. In the sealed electronic component 101, light from an external light source can reach the inside of the electronic component 101 through the window portion 102b.

The material of the main body 102a is a metal, and for example, a Kovar alloy (Fe 54%, Ni 28%, Co 18%) having a thermal expansion coefficient that matches a wide temperature range with borosilicate glass, which is a material of the window 102b described later, is used. Will be done. This makes it possible to reduce the stress caused by the difference in the thermal expansion rate at the time of joining with the window portion 102b.

The frame body of the main body portion 102a is a member whose central portion is hollowed out and whose upper surface side is slightly inclined. The reason for having such a structure is that the light reflected by the window portion 102b (particularly the laser light) is mixed with the light reflected by the light deflector 4b (rotating mirror portion 10b) and is not emitted to the outside. To make it.

On the other hand, the window portion 102b is made of an optical hard glass (borosilicate glass) that is thin and has few impurities, and is bonded to the upper surface side of the main body portion 102a using a low melting point glass.

Hereinafter, the configuration of the substrate 103 of the electronic component 101 will be described.

The optical deflector 4b is mounted on the substrate 103, and wiring pins 123 and 124 connected to the electrodes (electrode pads 15 and 16) of the optical deflector 4b are provided. The wiring pins 123 and 124 have a terminal shape and are provided in an opening formed through the substrate 103 and the pedestal 129 described later.

One end of the wiring pins 123 and 124 is connected to the electrode pads 15 and 16. Further, the wiring pins 123 and 124 are connected to circuit components whose other ends are not shown. The wiring pins 123 and 124 transmit an electric signal for controlling the drive of the optical deflector 4b transmitted from the circuit component described above to the optical deflector 4b.

A pedestal 129 is provided on the upper surface of the substrate 103. The pedestal 129 has a planar recess 1291. As for the pedestal 129, the material of the substrate 103 and the pedestal 129 is metal like the substrate 3 of the electronic component 1.

Further, the surface of the substrate 103 and the surface of the lower end of the lid portion 102 (the lower end of the main body portion 102a) are joined by resistance welding. Specifically, a protrusion is provided in advance on the outside of the pedestal 129, and when the lid portion 102 is placed on the substrate 103 and pressurized, welding is performed by the resistance heat generated in the protrusion.

The substrate 103 is further formed with a curved concave portion 1031 in the flat concave portion 1291 of the pedestal 129. With the pedestal 129 placed on the upper surface of the substrate 103, both members are machined, etched, pressed, or the like to form a curved concave portion 1031.

The curved concave portion 1031 is formed as a space for the rotation mirror portion 10b of the optical deflector 4b to rotate. That is, the optical deflector 4b is provided so that the rotating mirror portion 10b can rotate in the space composed of the recess 1031 and the lid portion 102.

Further, the light deflector 4b is arranged at a position where the light reflected by the curved concave portion 1031 is applied to the back surface of the rotating mirror portion 10b.

Some of the incident light comes off the rotating mirror portion 10b, and such light is reflected by the curved concave portion 1031 of the substrate 103 on the back surface side of the optical deflector 4b. Since the reflected light in the recess 1031 is applied to the back surface of the rotating mirror portion 10b, it is possible to prevent the reflected light in the recess 1031 from becoming stray light and being emitted to the outside of the electronic component 101. can.

Further, it is preferable that the curved concave portion 1031 has the shape of a paraboloid, and the focal point of the paraboloid is located on the back surface side of the rotating mirror portion 10b. It is preferable that the central axis of the paraboloid surface of the curved concave portion 1031 passes through the center of the rotating mirror portion 10b, and the central axis of the paraboloidal surface passes through the center of the rotating mirror portion 10b with the incident light. It is more preferable that the recesses 31 are arranged so as to be parallel to each other. Since the parabolic recess 1031 is formed on the substrate 103 in this way, the incident light incident on the parabolic recess 1031 is focused on the focal position of the paraboloid.

Since the focal point is located on the back surface side of the rotating mirror portion 10b, the reflected light in the parabolic recess 1031 illuminates the back surface of the rotating mirror portion 10b. Unlike a normal curved surface, the paraboloid surface collects light at the focal position, so that the back surface can be more reliably irradiated with the reflected light. Therefore, it is possible to more reliably prevent the reflected light from the recess 1031 of the substrate 103 from becoming stray light and being emitted to the outside of the electronic component 101.

Again, the curved or parabolic recess 1031 is covered with a covering material 27 made of a material that suppresses the reflection of incident light. Since the covering material 27 is provided on the surface of the recess 1031, it is possible to absorb light that may be stray light. This makes it difficult to generate reflected light that can be stray light.

Further, the back surface of the rotating mirror portion 10b is covered with a covering material 28 made of a material that suppresses the reflection of the light reflected by the recess 1031.

When the incident light incident on the recess 1031 of the substrate 103 is reflected, the reflected light is applied to the back surface of the rotating mirror portion 10b. Since the back surface side of the rotating mirror portion 10b is covered with the covering material 28, further reflection can be suppressed and stray light can be prevented from being generated.

The material of the covering material 27 that covers the surface of the curved or parabolic recess 1031 is preferably black paint, black plating, or black ceramic. Here, the covering of the covering material 27 on the recess 1031 is performed in the same manner as the covering of the recess 31 of the substrate 3 of the electronic component 1.

Since various black materials (black paint, black pigment, black plating, black ceramic, etc. described above) are provided on the surface of the recess 1031, it is possible to absorb light that may be stray light. This makes it possible to prevent the generation of reflected light that can be stray light.

Further, the lid portion 102 (excluding the window portion 102b), the substrate 103, and the pedestal 129 are made of metal, so that the heat dissipation is excellent. The incident light that does not enter the rotating mirror portion 10b directly irradiates the recess 1031 of the substrate 103, but since the substrate 103 and the pedestal 129 are made of metal, the heat generated by the incident light can be dissipated.

In the electronic component 101 of the modified example of the embodiment of the present invention, some of the incident light comes off the rotating mirror portion 10b, and such light is the concave portion of the substrate 103 on the back surface side of the optical deflector 4b. It is absorbed by the covering material 27 formed on the surface of 1031. Further, the reflected light reflected without being absorbed by the covering material 27 described above is irradiated to the covering material 28 formed on the back surface of the rotating mirror portion 10b and absorbed. As a result, it is possible to prevent the light reflected by the recess 1031 of the substrate 103 from becoming stray light and being emitted to the outside of the electronic component 101.

In order to absorb the moisture permeated, a desiccant may be placed in the recess 31 of the substrate 3 immediately before the substrate 3 provided with the wiring layer 8 in close contact with the lid portion 2 is sealed. As a result, the internal environment inside the electronic component 1 can be kept at a low humidity. Placing the desiccant in the recess is the same for the electronic component 101.

As the desiccant, a resin such as epoxy mixed with a material that absorbs water such as calcium oxide can be used.

1,101 ... Electronic components, 2,102 ... Lid part, 3,103 ... Board, 31,1031 ... Recessed (board), 4,4b ... Optical deflector, 5 ... Joint part, 6 ... Window plate, 7 ... Frame Body, 8 ... Wiring layer, 9 ... Fixed frame, 10,10b ... Rotating mirror part, 11 ... Movable frame, 12a, 12b ... Semi-annular piezoelectric actuator, 13a, 13b ... Torsion bar, 14a, 14b ... Bellows type piezoelectric actuator , 15, 16 ... Electrode pad (optical deflector), 20 ... Wire, 21, 22 ... Electrode pad (wiring layer), 23, 24 ... Wiring, 25 ... Wiring base material, 26 ... Resist coat, 27 ... Coating material ( Substrate), 28 ... Covering material (rotating mirror part), 60 ... Connector, 102a ... Main body part, 102b ... Window part, 123, 124 ... Wiring pin, 129 ... Pedestal, 1291 ... Recessed part (pedestal).

Claims (12)

An optical deflector having a rotating mirror unit that reflects incident light,
A substrate on which the optical deflector is placed and provided with a wiring layer having wiring connected to the electrodes of the optical deflector.
A lid portion that covers the reflective surface side of the rotating mirror portion and is provided with a window plate on the top plate through which the incident light is transmitted.
A joint portion to which the lower surface of the lid portion and the substrate are joined is provided.
The substrate has a curved concave portion on the back surface side of the optical deflector.
The light deflector is arranged at a position where the light reflected by the concave portion is applied to the back surface of the rotating mirror portion .
The recess has the shape of a paraboloid and has the shape of a paraboloid.
An electronic component characterized in that the focal point of the paraboloid is located on the back surface side of the rotating mirror portion . In the electronic component according to claim 1 ,
An electronic component characterized in that the recess is arranged so that the central axis of the paraboloid passes through the center of the rotating mirror portion and is parallel to the incident light. In the electronic component according to claim 1 or 2 .
The concave portion is an electronic component characterized in that the concave portion is covered with a material that suppresses reflection of the incident light. In the electronic component according to any one of claims 1 to 3 , the electronic component
An electronic component characterized in that the back surface of the rotating mirror portion is covered with a material that suppresses reflection of light reflected by the concave portion. In the electronic component according to claim 3 or 4 ,
An electronic component characterized in that the material for suppressing light reflection is black paint, black plating or black ceramic. In the electronic component according to any one of claims 1 to 5 .
The substrate is an electronic component characterized by being made of metal. An optical deflector having a rotating mirror unit that reflects incident light,
A substrate on which the optical deflector is placed and a wiring connected to an electrode of the optical deflector is provided.
A lid portion that covers the reflective surface side of the light deflector and is provided with a window plate on the top plate through which the incident light is transmitted.
A pedestal having a flat recess provided on the upper surface side of the substrate, and
A sealing joint portion is provided in which the surface of the substrate and the surface of the lower end of the lid portion are in close contact with each other.
In the substrate, a curved concave portion is formed in the planar concave portion, and the substrate has a curved concave portion formed therein.
The rotating mirror portion is rotatable in a space composed of the curved concave portion and the lid portion.
The optical deflector is arranged at a position where the light reflected by the curved concave portion is applied to the back surface of the rotating mirror portion .
The curved concave portion has the shape of a paraboloid and has a shape of a paraboloid.
An electronic component characterized in that the focal point of the paraboloid is located on the back surface side of the rotating mirror portion . In the electronic component according to claim 7 ,
An electronic component characterized in that the recess is arranged so that the central axis of the paraboloid passes through the center of the rotating mirror portion and is parallel to the incident light. In the electronic component according to claim 7 or 8 .
The curved concave portion is an electronic component characterized in that it is covered with a material that suppresses reflection of the incident light. In the electronic component according to any one of claims 7 to 9 .
An electronic component characterized in that the back surface of the rotating mirror portion is covered with a material that suppresses reflection of light reflected by the curved concave portion. In the electronic component according to claim 9 or 10 .
An electronic component characterized in that the material for suppressing light reflection is black paint, black plating or black ceramic. In the electronic component according to any one of claims 7 to 11 .
An electronic component characterized in that a portion of the lid portion other than the window plate, the substrate, and the pedestal are made of metal.

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