JP2019060940A - Electronic component - Google Patents

Abstract

To provide an electronic component that can prevent stray light from being emitted to the outside.SOLUTION: An electronic component 1 comprises a lid part 2, a substrate 3, and a light deflector 4, and the under surface of the lid part 2 and a wiring layer 8 on the substrate 3 are joined to form a junction 5. The lid part 2 covers a reflection surface side of a rotary mirror part 10 of the light deflector 4, and is provided on the top plate with an aperture plate 6 through which incident light is transmitted. The substrate 3 is mounted with the light deflector 4, is provided with the wiring layer 8 having wires connected to electrodes of the light deflector 4, and has a curved surface-like concave part 31 on the back side of the light deflector 4. The light deflector 4 is arranged at a position where the rear face of the rotary mirror part 10 is irradiated with light reflected on the concave part 31.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component provided with a light deflector.

  In recent years, video projectors that combine semiconductor light sources such as light emitting diodes and semiconductor lasers with small optical deflection devices such as MEMS (Micro Electro Mechanical Systems) or DMDs (Digital Mirror Device) are for pico projectors and head-up displays. It is being developed as

  Devices such as a semiconductor light source and a compact optical deflection device are housed in a ceramic package, and a lid member on the top of the package is made of glass. Therefore, the package can pass light toward the outside of the package while protecting the internal devices.

  For example, in the optical device described in Patent Document 1 below, the optical deflector is accommodated in the sealed space of a holder made of a package and a cover glass. The light deflector comprises a mirror, and the bottom of the package is provided with a space on the back side of the light deflector so that the mirror can operate (paragraphs 0033, 0034, FIG. 2).

JP, 2015-148654, A

  However, in this optical device, among the light emitted from the light source device, there is a light component which is not incident on the mirror (reflection surface) and is irradiated to the bottom of the package. Then, the light reflected by the bottom portion becomes stray light, repeats reflection inside the holder, or is emitted to the outside mixed with the scanning light.

  For example, when stray light is mixed with the scanning light, there is a possibility that the projection image (image) formed by the scanning light in the image forming area may have a problem such that the desired contrast can not be obtained.

  This invention is made in view of such a situation, and it aims at providing the electronic component which can prevent that a stray light is discharge | released outside.

  The electronic component according to the first aspect of the present invention is provided with an optical deflector having a rotating mirror portion for reflecting incident light, and a wiring layer having a wiring on which the optical deflector is mounted and connected to an electrode of the optical deflector. And a lid portion provided with a window plate for covering the reflecting surface side of the rotating mirror portion and a window plate through which incident light is transmitted on a top plate, and a junction in which the lower surface of the lid portion and the substrate are joined The substrate has a curved concave portion on the back surface side of the light deflector, and the light deflector reflects the light reflected by the concave portion to the back surface of the rotating mirror portion It is characterized in that it is placed in the following position.

  The electronic component according to the first aspect of the present invention comprises a substrate on which the light deflector is mounted, and a lid portion covering the reflection surface side of the rotating mirror portion of the light deflector, and the lid portion is a window through which incident light is transmitted. A board is provided. Incident light enters from the window plate and is reflected by the rotating mirror portion of the light deflector, and exits from the window plate to scan the light scanning area to generate a desired projected image.

  Some incident light leaves the pivoting mirror, but such light is reflected by the concave portion of the substrate on the back side of the light deflector. Here, since the reflected light in the concave portion is irradiated to the back surface of the rotating mirror portion, it is possible to prevent the light reflected by the concave portion from becoming stray light and being emitted to the outside of the electronic component. it can.

  In the electronic component according to the first aspect of the invention, the recess preferably has a paraboloid shape, and the focal point of the paraboloid is preferably located on the back side of the rotating mirror portion, and the center of the paraboloid More preferably, the recess is disposed such that the axis passes through the center of the pivoting mirror and is parallel to the incident light.

  According to this configuration, since the parabolic concave portion is formed on the substrate, the incident light entering the concave portion is condensed at the focal position of the parabolic surface. Here, since the focal point is located on the back surface side of the rotating mirror portion, the reflected light in the concave portion illuminates the back surface of the rotating mirror portion. Thereby, the reflected light can be reliably irradiated to the back surface, and it is possible to more reliably prevent the light reflected by the concave portion of the substrate from becoming stray light and being emitted to the outside of the electronic component.

  In the electronic component according to the first aspect of the invention, the recess is preferably covered with a material that suppresses the reflection of the incident light.

  According to this configuration, since the concave portion of the substrate is covered with the material that suppresses the reflection of the incident light, it is possible to make it difficult to generate the reflected light that may become stray light.

  Further, in the electronic component according to the first aspect of the present invention, it is preferable that the back surface of the rotating mirror portion is covered with a material that suppresses the reflection of light reflected by the recess.

  When the incident light incident on the concave portion of the substrate is reflected, the reflected light is irradiated to the back surface of the rotating mirror portion. In the present invention, since the back surface of the pivoting mirror portion is coated with a material that suppresses the reflection of light, the further reflection can be suppressed and generation of stray light can be prevented.

  Furthermore, in the electronic component according to the first aspect of the invention, the material for suppressing the light reflection is preferably a black paint, a black plating or a black ceramic.

  According to this configuration, since various black materials are adopted as the material for suppressing the reflection of light, it is possible to absorb light which may be stray light. This makes it possible to prevent the occurrence of reflected light that may become stray light.

  Furthermore, in the electronic component according to the first aspect of the invention, the substrate is preferably made of metal.

  According to this configuration, the substrate is made of metal, so that the heat dissipation is excellent. Although the incident light which does not enter into a rotation mirror part irradiates a crevice of a substrate of the back side of a light deflector directly, since a substrate is made of metal, it can radiate heat by incident light.

  An electronic component according to a second aspect of the present invention is an optical deflector having a rotating mirror portion for reflecting incident light, a substrate on which the optical deflector is mounted, and a wiring connected to an electrode of the optical deflector is provided. A lid portion provided with a window plate for covering the reflecting surface side of the light deflector and having a window plate through which the incident light is transmitted on a top plate, a pedestal having a flat recess provided on the upper surface side of the substrate, And a sealing joint portion sealed and joined in a state in which the surface of the substrate and the surface of the lower end of the lid portion are in close contact with each other, wherein the substrate has a curved concave portion formed in the planar concave portion. The pivoting mirror unit is pivotable within the space formed by the curved surface-shaped concave portion and the lid portion, and the light deflector is configured to turn the light reflected by the curved surface-shaped concave portion to the pivoting mirror portion It is characterized in that it is disposed at a position to be irradiated on the back surface of

  The electronic component according to the second aspect of the present invention comprises a substrate on which the light deflector is mounted, and a lid portion covering the reflecting surface side of the rotating mirror portion of the light deflector, and the lower end of the lid portion is the surface of the substrate Sealed at the sealing joint. The lid portion is provided with a window plate through which incident light is transmitted, and the incident light is incident from the window plate, reflected by the rotating mirror portion of the light deflector, and emitted from the window plate to scan the light scanning region. , To produce a desired projection image.

  Some of the incident light leaves the pivoting mirror portion, but such light is reflected by the concave portion on the plane of the substrate on the back side of the light deflector. Here, since the reflected light in the concave portion is irradiated to the back surface of the rotating mirror portion, it is possible to prevent the light reflected by the concave portion from becoming stray light and being emitted to the outside of the electronic component. it can.

  In the electronic component according to the second aspect of the present invention, preferably, the concave portion in a curved surface shape has a paraboloid shape, and the focal point of the paraboloid is located on the back surface side of the rotating mirror portion. More preferably, the recess is disposed such that the central axis of the recess passes through the center of the rotating mirror portion and is parallel to the incident light.

  According to this configuration, since the parabolic concave portion is formed on the substrate, the incident light entering the concave portion is condensed at the focal position of the parabolic surface. Here, since the focal point is located on the back surface side of the rotating mirror portion, the reflected light in the concave portion illuminates the back surface of the rotating mirror portion. Thereby, the reflected light can be reliably irradiated to the back surface, and the light reflected by the concave portion of the substrate can be more reliably prevented from being emitted as stray light to the outside of the electronic component.

  In the electronic component according to the second aspect of the invention, the curved concave portion is preferably covered with a material that suppresses the reflection of the incident light.

  According to this configuration, since the curved concave portion of the substrate is covered with the material that suppresses the reflection of the incident light, it is possible to make it difficult to generate the reflected light that may become stray light.

  Further, in the electronic component according to the second aspect of the present invention, it is preferable that the back surface of the rotating mirror portion is covered with a material that suppresses the reflection of light reflected by the curved concave portion.

  When the incident light incident on the curved concave portion of the substrate is reflected, the reflected light is irradiated to the back surface of the rotating mirror portion. In the present invention, since the back surface of the pivoting mirror portion is coated with a material that suppresses the reflection of light, the further reflection can be suppressed and generation of stray light can be prevented.

  Furthermore, in the electronic component of the second aspect of the invention, the material for suppressing the light reflection is preferably a black paint, a black plating or a black ceramic.

  According to this configuration, since various black materials are provided as the material for suppressing the reflection of light, it is possible to absorb light which may be stray light. This makes it possible to prevent the occurrence of reflected light that may become stray light.

  Furthermore, in the electronic component according to the second aspect of the invention, it is preferable that the portion other than the window plate of the lid portion, the substrate and the pedestal be made of metal.

  According to this configuration, since the portion other than the window plate of the lid portion, the substrate and the pedestal are made of metal, the heat dissipation is excellent. Incident light not incident on the rotating mirror is directly irradiated to the curved concave portion of the substrate on the back surface side of the light deflector, but the portion other than the window plate of the lid portion is made of metal, so the incident light Heat can be dissipated.

The figure which shows the whole structure of the electronic component of embodiment of this invention. The figure which shows the II-II line cross section of the electronic component of FIG. The figure explaining the modification of the recessed part located in the back surface side of a rotation mirror part. The figure which shows the whole structure of the modification of the electronic component of embodiment of this invention.

  Hereinafter, embodiments of the electronic component of the present invention will be described.

  FIG. 1 is a view showing the entire configuration (opened state) of the electronic component 1 according to the embodiment of the present invention. As shown in FIG. 1, the electronic component 1 mainly includes a lid portion 2, a substrate 3, and an optical deflector 4 mounted on the substrate 3.

  The lid portion 2 is composed of a window plate 6 and a frame 7. In the electronic component 1 in a sealed state, light from an external light source can reach the inside of the electronic component 1 through the window plate 6.

  The material of the window plate 6 is thin optical hard glass (borosilicate glass) with few impurities, and is attached to the upper surface side of the frame 7. Since the window plate 6 is a transparent member, the light is incident on the inside of the electronic component 1 from a light source (not shown) or is reflected by the light deflector 4 (rotational mirror unit 10) and emitted to the outside of the electronic component 1 The loss of light can be reduced. For example, in a vehicle lamp, light reflected by the light deflector 4 is projected as a light distribution pattern on an irradiation area in front of the vehicle.

  The frame 7 is a member whose central portion is hollowed out and whose upper surface side is slightly inclined. The reason for using such a structure is to prevent the light reflected by the window plate 6 from being mixed with the light reflected by the light deflector 4 (rotational mirror unit 10) and emitted to the outside.

  The material of the frame 7 is metal, ceramic, plastic or hard glass. When the frame 7 is a metal, it is preferable to use a Kovar alloy (for example, Fe 54%, Ni 28%, Co 18%) whose thermal expansion coefficient matches the borosilicate glass which is the material of the window plate 6 in a wide temperature range. Thereby, the stress which arises from the difference of a thermal expansion coefficient at the time of joining with the window plate 6 can be reduced.

  When the material of the frame 7 is ceramic, it is preferable to use alumina having a thermal expansion coefficient close to that of the borosilicate glass which is the material of the window plate 6. Thereby, the stress which arises from the difference of a thermal expansion coefficient at the time of joining with the window plate 6 can be reduced.

  When the material of the frame 7 is a plastic, it is preferable to use a resin that does not allow moisture or gas to pass, such as epoxy resin, fluorine resin, polyolefin resin, liquid crystal polymer, and the like. Thus, moisture permeation into the electronic component 1 can be suppressed.

  When the material of the frame 7 is metal or ceramic, it is preferable to adhere the window plate 6 and the frame 7 with low melting point glass. In particular, when joining a member including a glass material such as the window plate 6, ensure bonding by arranging a preform (a low melting point glass frit type) or a paste material as a sealing material between the two members. Can.

  An adhesive can be used to join the frame 7 and the window plate 6. In particular, since the window plate 6 is transparent, it is preferable to use a UV (Ultra Violet) curable adhesive. In UV bonding, a UV curable adhesive is applied between both members to be bonded. Since the window plate 6 made of glass transmits UV (wavelength 350 to 360 μm), the UV curable adhesive can be cured in a short time by irradiating the UV, and the both members can be adhered. Incidentally, if the window plate 6 is made thinner, the bonding time will be shortened.

  When the material of the frame 7 is hard glass, it is preferable to use borosilicate glass which is a thermal shock resistant glass. This can withstand heat and shock in high temperature environments.

  At this time, the window plate 6 of the optical hard glass and the frame 7 are joined by optical contact. Thereby, since the window plate 6 and the frame 7 can be firmly joined without using an adhesive, the joining can be maintained even under a high temperature environment.

  Further, as shown in the drawing, the wiring layer 8 including the light deflector 4 and the wiring base 25 having the wirings 23 and 24 connected to the electrode pads 15 and 16 of the light deflector 4 on the upper surface of the substrate 3. Is provided.

  Specifically, the wiring layer 8 is composed of a wiring base 25 having the wirings 23 and 24 and a resist coat 26 covering the wirings 23 and 24 (see FIG. 2). The portions from which the resist coat 26 is removed become electrode pads 21 and 22 connected to the wires 23 and 24.

  In the present embodiment, an insulating plastic substrate is used as the wiring substrate 25, but a flexible substrate may be used. As a material of the flexible substrate, it is preferable to use a liquid crystal polymer (LCP), a low moisture permeable member based on Teflon (registered trademark). Thus, moisture permeation into the electronic component 1 can be suppressed.

  In addition, the flexible substrate can be directly inserted into connectors of various devices. When using a flexible substrate, it can connect with various devices by simple composition, without providing connector 60 in the upper surface side of a wiring base material.

  The wiring base 25 of the insulating plastic base and the substrate 3 are bonded by an adhesive. An epoxy resin may be used as the adhesive. The flexible substrate and the substrate 3 may be bonded not only by the above-described bonding using the adhesive but also by thermocompression bonding.

  The wirings 23 and 24 (five each) are made of, for example, a Cu (copper) thin film, and are formed on the top surface of the wiring base 25 as a wiring pattern. The wires 23 and 24 have one end connected to the electrode pads 21 and 22 and the other end connected to the connector 60.

  The resist coat 26 is provided so as to cover the wires 23 and 24. The resist coat 26 is provided to protect the wires 23 and 24, and the material is, for example, an epoxy resin.

  The electrode pads 21 and 22 are exposed portions of the wires 23 and 24. The Cu thin film is plated with Ni (nickel), and the upper layer thereof is plated with Au. This is to suppress corrosion of the Cu thin film and to improve bonding properties such as wire bonding. Further, the electrode pads 21 and 22 are respectively connected to electrode pads 15 and 16 provided in the light deflector 4 through the wires 20.

  Hereinafter, the configuration and function of the light deflector 4 having the pivoting mirror unit 10 for reflecting incident light will be briefly described.

  The light deflector 4 is a device that is manufactured using a semiconductor process or MEMS technology, and can reflect light incident from a certain direction by the rotating mirror unit 10 and emit it as scanning light.

  The light deflector 4 includes a rotating mirror portion 10 disposed in the fixed frame 9, half-ring piezoelectric actuators 12a and 12b, torsion bars 13a and 13b, and bellows-type piezoelectric actuators 14a and 14b.

  Further, the control device (not shown) transmits control signals from the electrode pads 15 and 16 to both the actuators. Both actuators are driven by the control signal, and the torsion bars 13a and 13b are twisted in accordance with this, thereby rotating the rotating mirror unit 10. And the light which injects into the inside of the electronic component 1 from a light source is reflected by the rotation mirror part 10.

  In the initial state, the pivoting mirror unit 10 passes the center O and directs the normal perpendicular to the pivoting mirror unit 10 straight forward. The pivoting mirror unit 10 is supported by the torsion bars 13a and 13b in the Y-axis direction, and is disposed at the center of the circular annular movable frame 11. The reflecting surface of the rotating mirror unit 10 is a metal thin film of Au, Pt, Al or the like, and is formed by, for example, a sputtering method or an electron beam evaporation method. The shape of the rotating mirror unit 10 is not limited to a circle, and may be an ellipse or a rectangle.

  One end of each of the torsion bars 13a and 13b is coupled to the rotating mirror unit 10, and the other end is coupled to the semi-annular piezoelectric actuators 12a and 12b. The semiannular piezoelectric actuators 12a and 12b are coupled to one end of the bellows type piezoelectric actuators 14a and 14b via the movable frame 11, respectively. The other ends of the bellows type piezoelectric actuators 14 a and 14 b are respectively coupled to the fixed frame 9.

  The half-ring piezoelectric actuators 12a and 12b turn the turning mirror unit 10 around the main scanning direction (about the Y axis). In addition, the bellows-type piezoelectric actuators 14a and 14b rotate the rotation mirror unit 10 around the sub scanning direction (around the X axis).

  The semicircular piezoelectric actuators 12a and 12b and the bellows type piezoelectric actuators 14a and 14b have a structure in which a piezoelectric film (PZT) made of lead zirconate titanate or the like is sandwiched between a lower electrode and an upper electrode by a semiconductor planar process. . The PZT is deformed by applying a voltage to the piezoelectric film through the lower electrode and the upper electrode.

  Further, on the surface of the side portion of the fixed frame 9, electrode pads 15, 16 (five each) are provided. The electrode pads 15 and 16 are made of, for example, an Al (aluminum) thin film, and are connected by wire 20 to electrode pads 21 and 22 (five each) provided on a wiring layer 8 described later. Thereby, each actuator of the light deflector 4 can be driven.

  Next, the configuration of the substrate 3 will be mainly described with reference to FIG.

  FIG. 2 is a cross-sectional view taken along the line II-II of the electronic component 1 of FIG. 1, and in particular, a sectional view of the electronic component 1 in a sealed state in which the lid portion 2 and the substrate 3 shown in FIG. is there. The electrodes (electrode pads 15 and 16) of the light deflector 4 are connected to the electrodes (electrode pads 21 and 22) of the wiring layer 8 (see FIG. 1).

  The bonding portion 5 of the electronic component 1 is a portion where the lower surface of the lid portion 2 (the lower surface of the frame 7) and the wiring layer 8 are bonded. The lower surface of the frame 7 and the wiring layer 8 are bonded by an adhesive. As the adhesive, it is preferable to use an epoxy resin, a butyl rubber resin, a fluorine resin, a polyolefin resin, a liquid crystal polymer (LCP), or the like which is impermeable to moisture or gas. Thus, moisture can be suppressed from entering the electronic component 1 from the joint portion (joint portion 5) between the frame 7 and the wiring layer 8.

  When the material of the frame 7 is plastic, the frame 7 and the substrate 3 on which the wiring layer 8 is provided may be integrally molded and joined by plastic molding without using an adhesive.

  The substrate 3 is made of metal. Examples of the material of the substrate 3 include copper, aluminum, stainless steel and the like. Since the substrate 3 is made of such a metal, the substrate 3 is excellent in heat dissipation. For this reason, even when the laser beam is incident and the temperature of the rotating mirror unit 10 becomes high, heat can be dissipated through the substrate 3.

  Further, the substrate 3 has a concave portion 31 in the form of a curved surface on the back surface side of the light deflector 4. The curved concave portion 31 is formed as a space for rotating the rotating mirror portion 10 of the light deflector 4. The curved recess 31 is formed by machining, etching, pressing or the like.

  Here, the light deflector 4 is disposed at a position where the light reflected by the curved concave portion 31 is irradiated to the back surface of the rotating mirror unit 10.

  Among the incident light, there is light which is out of the pivoting mirror portion 10, but such light is reflected by the curved concave portion 31 of the substrate 3 on the back surface side of the light deflector 4. Then, since the reflected light at the curved concave portion 31 is irradiated to the back surface of the rotating mirror portion 10, the reflected light at the curved concave portion 31 becomes stray light and is emitted to the outside of the electronic component 1 Can be prevented.

  In addition, the curved concave portion 31 has a paraboloid shape, and the focal point of the paraboloid is located on the back surface side of the rotating mirror unit 10. It is preferable that the central axis of the paraboloid of the concave portion 31 passes through the center of the pivoting mirror unit 10, and the center axis of the paraboloid passes through the center of the pivoting mirror unit 10 as shown in FIG. More preferably, the recess 31 is disposed in parallel to the light. As described above, since the parabolic concave portion 31 is formed in the substrate 3, the incident light incident on the parabolic concave portion 31 is condensed at the focal position of the parabolic surface.

  Since the focal point is located on the back surface side of the pivoting mirror unit 10, the reflected light from the parabolic concave 31 illuminates the back surface of the pivoting mirror unit 10. Unlike a normal curved surface, light gathers at the focal position of the paraboloid, so reflected light can be more reliably irradiated to the back surface. Therefore, it is possible to more reliably prevent the light reflected by the concave portion 31 of the substrate 3 from becoming stray light and being emitted to the outside of the electronic component 1.

  Further, the curved or parabolic concave portion 31 is covered with a covering material 27 made of a material that suppresses reflection of incident light. The material of the covering material 27 is preferably black paint, black pigment, black plating or black ceramic. The black paint is applied to the surface of the recess 31 by, for example, a spray coating which atomizes the paint and applies the paint. A black resist material may be applied as a black paint. The black pigment is, for example, a binder resin to which a pigment such as titanium, carbon or oxide is added, and is applied to the surface of the recess 31.

  The black plating is formed by coating a thin film of metal such as black chromium or black alumite on the surface of the recess 31. The black ceramic is formed, for example, by coloring a ceramic made of alumina with a black pigment. The black ceramic is bonded to the surface of the recess 31 with an adhesive such as an epoxy resin.

  Since various black materials (the above-described black paint, black pigment, black plating, black ceramic, etc.) are provided on the surface of the recess 31, light which may become stray light can be absorbed. This makes it possible to prevent the occurrence of reflected light that may become stray light.

  Further, the back surface of the rotating mirror portion 10 is covered with a covering material 28 made of a material that suppresses the reflection of the light reflected by the recess 31. The material of the covering material 28 is preferably a black paint, a black pigment, a black plating or a black ceramic similarly to the covering material 27 described above. The covering material 28 is formed on the back surface of the rotating mirror unit 10 by the application, plating, or adhesion described above.

  When the incident light that has entered the recess 31 of the substrate 3 is reflected, the reflected light is irradiated to the back surface of the rotating mirror unit 10. And since the back surface of rotation mirror part 10 is covered with covering material 28 which consists of material which controls reflection of light, it is possible to suppress further reflection and to prevent generation of stray light.

  The light deflector 4 is bonded to the periphery of the recess 31. This bonding is, for example, bonding with an adhesive such as epoxy resin or silicon resin, bonding with solder, Au (gold) bonding, or the like. The light deflector 4 is mounted on the upper surface of the recess 31 by this bonding.

  Further, as shown in the drawing, the connector 60 is mounted on the substrate 3 and connected via the wiring layer 8. The connector 60 is used to connect the electronic component 1 to various devices (not shown). Driving of the electronic component 1 is controlled based on electric signals from various devices received through the connector 60.

  The circuit components connected to the light deflector 4 may be mounted on the substrate 3. Circuit components are used to operate and control the light deflector 4.

<Modification>
Next, with reference to FIG. 4, a modified example (hermetic seal) of the electronic component 1 according to the embodiment of the present invention will be described. The same components as those of the electronic component 1 are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 4 is a view showing an internal configuration of the electronic component 101. As shown in FIG. The electronic component 101 mainly includes a lid portion 102, a substrate 103, a pedestal 129 having a flat recess 1291 provided on the upper surface side of the substrate 103, and an optical deflector 4b mounted on the substrate 103. It consists of

  First, the lid portion 102 is configured of a main body portion 102 a including a top plate and a frame, and a window portion 102 b provided on the top plate. In the electronic component 101 in a sealed state, light from an external light source can reach the inside of the electronic component 101 through the window portion 102 b.

  The material of the main body portion 102a is metal, and for example, Kovar alloy (Fe 54%, Ni 28%, Co 18%) whose thermal expansion coefficient is matched over a wide temperature range with borosilicate glass which is a material of the window 102b described later Be done. Thereby, the stress which arises from the difference in a coefficient of thermal expansion can be reduced at the time of junction with window part 102b.

  The frame of the main body portion 102a is a member in which the central portion is hollowed out and the upper surface side is slightly inclined. The reason for this structure is that the light (in particular, the laser light) reflected by the window portion 102b is not emitted to the outside mixed with the light reflected by the light deflector 4b (the rotating mirror portion 10b) In order to

  On the other hand, the window portion 102b is made of thin optical hard glass (borosilicate glass) with few impurities, and is joined to the upper surface side of the main portion 102a using low melting point glass.

  Hereinafter, the configuration of the substrate 103 of the electronic component 101 will be described.

  The light deflector 4b is mounted on the substrate 103, and wiring pins 123 and 124 connected to the electrodes (electrode pads 15 and 16) of the light deflector 4b are provided. The wiring pins 123 and 124 have a terminal shape, and are provided in an opening formed through the substrate 103 and a pedestal 129 described later.

  One end of the wiring pins 123 and 124 is connected to the electrode pads 15 and 16. The other ends of the wiring pins 123 and 124 are connected to circuit components not shown. The wiring pins 123 and 124 transmit, to the light deflector 4b, an electrical signal for controlling the drive of the light deflector 4b transmitted from the above-described circuit component.

  A pedestal 129 is provided on the top surface of the substrate 103. The pedestal 129 has a flat recess 1291. In the pedestal 129, the material of the substrate 103 and the pedestal 129 is metal, like the substrate 3 of the electronic component 1.

  Further, the surface of the substrate 103 and the surface of the lower end of the lid portion 102 (the lower end of the main portion 102a) are joined by resistance welding. Specifically, projections are provided in advance on the outside of the pedestal 129, and when the lid portion 102 is placed on the substrate 103 and pressurized, welding is performed by resistance heat generated at the projections.

  In the substrate 103, a concave portion 1031 having a curved surface shape is further formed in the planar concave portion 1291 of the pedestal 129. With the pedestal 129 mounted on the upper surface of the substrate 103, the curved concave portion 1031 is formed by performing machining, etching, pressing, or the like on both members.

  The curved concave portion 1031 is formed as a space for rotating the rotating mirror portion 10b of the light deflector 4b. That is, the light deflector 4 b is provided so as to be rotatable in the space constituted by the concave portion 1031 and the lid portion 102.

  In addition, the light deflector 4b is disposed at a position where the light reflected by the curved concave portion 1031 is irradiated to the back surface of the rotating mirror portion 10b.

  Among the incident light, there is light out of the rotating mirror portion 10b, but such light is reflected by the curved concave portion 1031 of the substrate 103 on the back surface side of the light deflector 4b. Then, since the reflected light in the concave portion 1031 is irradiated to the back surface of the rotating mirror portion 10b, it is possible to prevent the reflected light in the concave portion 1031 from becoming stray light and being emitted to the outside of the electronic component 101. it can.

  Moreover, it is preferable that the curved-surface-shaped recessed part 1031 has a shape of a paraboloid, and the focus of a paraboloid is located in the back surface side of the rotation mirror part 10b. The central axis of the paraboloid of the curved concave portion 1031 preferably passes through the center of the pivoting mirror 10b, and the central axis of the paraboloid passes through the center of the pivoting mirror 10b, and the incident light More preferably, the recesses 31 are arranged in parallel. As described above, since the parabolic concave portion 1031 is formed in the substrate 103, the incident light incident on the parabolic concave portion 1031 is condensed at the focal position of the parabolic surface.

  Since the focal point is located on the back surface side of the pivoting mirror unit 10b, the reflected light from the parabolic concave portion 1031 illuminates the back surface of the pivoting mirror unit 10b. Unlike a normal curved surface, light gathers at the focal position of the paraboloid, so reflected light can be more reliably irradiated to the back surface. Therefore, it is possible to more reliably prevent the light reflected by the concave portion 1031 of the substrate 103 from becoming stray light and being emitted to the outside of the electronic component 101.

  Also in this case, the curved or parabolic concave portion 1031 is covered with a covering material 27 made of a material that suppresses the reflection of incident light. Since the covering material 27 is provided on the surface of the recess 1031, it is possible to absorb light that may be stray light. Thereby, it is possible to make it difficult to generate reflected light that may become stray light.

  Further, the back surface of the rotating mirror portion 10 b is covered with a covering material 28 made of a material that suppresses the reflection of the light reflected by the concave portion 1031.

  When the incident light incident on the concave portion 1031 of the substrate 103 is reflected, the reflected light is irradiated to the back surface of the rotating mirror portion 10b. And since the back surface side of the rotation mirror part 10b is coat | covered with the coating material 28, further reflection is suppressed and it can prevent that a stray light arises.

  It is preferable that the material of the covering material 27 which covers the surface of the curved surface or paraboloid recessed part 1031 is black paint, black plating, or black ceramic. Here, the covering of the covering material 27 to the recess 1031 is performed in the same manner as the covering of the recess 31 of the substrate 3 of the electronic component 1.

  Since various black materials (the above-described black paint, black pigment, black plating, black ceramic, and the like) are provided on the surface of the concave portion 1031, light which may be stray light can be absorbed. This makes it possible to prevent the occurrence of reflected light that may become stray light.

  In addition, the lid portion 102 (excluding the window portion 102b), the substrate 103, and the pedestal 129 are made of metal, so that the heat dissipation is excellent. Although the incident light which does not enter into the rotation mirror part 10b irradiates the recessed part 1031 of the board | substrate 103 directly, since the board | substrate 103 and the pedestal 129 are especially made of metal, the heat by incident light can be radiated.

  In the electronic component 101 according to the modification of the embodiment of the present invention, some of the incident light leaves the rotating mirror portion 10b, but such light is a recess in the substrate 103 on the back surface side of the light deflector 4b. It is absorbed by the covering material 27 formed on the surface of 1031. In addition, the reflected light that is reflected without being absorbed by the covering material 27 described above is irradiated to and absorbed by the covering material 28 formed on the back surface of the rotating mirror part 10b. Accordingly, it is possible to prevent the light reflected by the concave portion 1031 of the substrate 103 from becoming stray light and being emitted to the outside of the electronic component 101.

  A desiccant may be disposed in the concave portion 31 of the substrate 3 immediately before sealing the substrate 3 provided with the wiring layer 8 in close contact with the lid portion 2 in order to absorb moisture of moisture that has been moisture-permeable. Thereby, the internal environment in the electronic component 1 can be maintained at low humidity. The placement of the desiccant in the recess is the same for the electronic component 101 as well.

  As the desiccant, a mixture of a resin such as epoxy and a material that absorbs moisture such as calcium oxide can be used.

  DESCRIPTION OF SYMBOLS 1, 101 ... electronic component, 2, 102 ... lid part, 3, 103 ... board | substrate, 31, 1031 ... recessed part (board | substrate), 4, 4b ... light deflector, 5 ... junction part, 6 ... window plate, 7 ... frame Body 8 Wiring layer 9 Fixed frame 10 10b Rotating mirror portion 11 Movable frame 12a 12b Semi-annular piezoelectric actuator 13a 13b Torsion bar 14a 14b Bellows type piezoelectric actuator 15, 16, ... electrode pad (light deflector), 20 ... wire, 21, 22 ... electrode pad (wiring layer), 23, 24 ... wiring, 25 ... wiring base material, 26 ... resist coating, 27 ... coating material ( Substrates, 28: covering material (rotational mirror portion), 60: connector, 102a: main body portion, 102b: window portion, 123, 124: wiring pin, 129: pedestal, 1291: recessed portion (pedestal).

Claims (14)

An optical deflector having a pivoting mirror portion that reflects incident light;
A substrate on which the light deflector is mounted and provided with a wiring layer having a wiring connected to an electrode of the light deflector;
A lid portion provided with a window plate for covering the reflection surface side of the rotating mirror portion and transmitting the incident light to a top plate;
And a bonding portion in which the lower surface of the lid portion and the substrate are bonded,
The substrate has a curved recess on the back side of the light deflector,
The electronic component is characterized in that the light deflector is disposed at a position where the light reflected by the concave portion is irradiated to the back surface of the rotating mirror portion. In the electronic component according to claim 1,
The recess has a parabolic shape,
The focal point of the said paraboloid is located in the back surface side of the said rotation mirror part, The electronic component characterized by the above-mentioned. In the electronic component according to claim 2,
The electronic component according to claim 1, wherein the concave portion is disposed such that a central axis of the paraboloid passes through a center of the rotating mirror portion and is parallel to the incident light. In the electronic component according to any one of claims 1 to 3,
The said recessed part is coat | covered with the material which suppresses reflection of the said incident light, The electronic component characterized by the above-mentioned. In the electronic component according to any one of claims 1 to 4,
The back surface of the said rotation mirror part is coat | covered with the material which suppresses reflection of the light reflected by the said recessed part, The electronic component characterized by the above-mentioned. In the electronic component according to claim 4 or 5,
The material for suppressing the reflection of light is a black paint, a black plating or a black ceramic. In the electronic component according to any one of claims 1 to 6,
The electronic component characterized in that the substrate is made of metal. An optical deflector having a pivoting mirror portion that reflects incident light;
A substrate on which the light deflector is mounted and provided with a wire connected to an electrode of the light deflector;
A lid portion that covers a reflection surface side of the light deflector and is provided with a window plate through which incident light is transmitted to a top plate;
A pedestal having a planar recess provided on the upper surface side of the substrate;
And a sealing bonding portion sealed and bonded in a state in which the surface of the substrate and the surface of the lower end of the lid portion are in close contact with each other.
The substrate has a curved recess formed in the flat recess.
The pivoting mirror unit is pivotable within a space formed by the curved concave portion and the lid portion,
The electronic component is characterized in that the light deflector is disposed at a position where the light reflected by the curved concave portion is irradiated to the back surface of the rotating mirror portion. In the electronic component according to claim 8,
The curved recess has a paraboloid shape,
The focal point of the said paraboloid is located in the back surface side of the said rotation mirror part, The electronic component characterized by the above-mentioned. In the electronic component according to claim 9,
The electronic component according to claim 1, wherein the concave portion is disposed such that a central axis of the paraboloid passes through a center of the rotating mirror portion and is parallel to the incident light. The electronic component according to any one of claims 8 to 10.
The electronic component characterized in that the curved concave portion is coated with a material that suppresses reflection of the incident light. The electronic component according to any one of claims 8 to 11,
The back surface of the said rotation mirror part is covered with the material which suppresses reflection of the light reflected by the said curved-surface-shaped recessed part, The electronic component characterized by the above-mentioned. In the electronic component according to claim 11 or 12,
The material for suppressing the reflection of light is a black paint, a black plating or a black ceramic. In the electronic component according to any one of claims 8 to 13,
An electronic component characterized in that a portion other than the window plate of the lid portion, the substrate and the pedestal are made of metal.