JP6988362B2 - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP6988362B2
JP6988362B2 JP2017202739A JP2017202739A JP6988362B2 JP 6988362 B2 JP6988362 B2 JP 6988362B2 JP 2017202739 A JP2017202739 A JP 2017202739A JP 2017202739 A JP2017202739 A JP 2017202739A JP 6988362 B2 JP6988362 B2 JP 6988362B2
Authority
JP
Japan
Prior art keywords
terminal
island
switching element
terminals
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017202739A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019075523A5 (https=
JP2019075523A (ja
Inventor
聖 吉水
祐介 増元
英夫 福井
雅由 西畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2017202739A priority Critical patent/JP6988362B2/ja
Priority to PCT/JP2018/031114 priority patent/WO2019077871A1/ja
Publication of JP2019075523A publication Critical patent/JP2019075523A/ja
Publication of JP2019075523A5 publication Critical patent/JP2019075523A5/ja
Application granted granted Critical
Publication of JP6988362B2 publication Critical patent/JP6988362B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
JP2017202739A 2017-10-19 2017-10-19 半導体モジュール Active JP6988362B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017202739A JP6988362B2 (ja) 2017-10-19 2017-10-19 半導体モジュール
PCT/JP2018/031114 WO2019077871A1 (ja) 2017-10-19 2018-08-23 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017202739A JP6988362B2 (ja) 2017-10-19 2017-10-19 半導体モジュール

Publications (3)

Publication Number Publication Date
JP2019075523A JP2019075523A (ja) 2019-05-16
JP2019075523A5 JP2019075523A5 (https=) 2019-12-05
JP6988362B2 true JP6988362B2 (ja) 2022-01-05

Family

ID=66174520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017202739A Active JP6988362B2 (ja) 2017-10-19 2017-10-19 半導体モジュール

Country Status (2)

Country Link
JP (1) JP6988362B2 (https=)
WO (1) WO2019077871A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7359581B2 (ja) 2019-07-10 2023-10-11 株式会社デンソー 半導体装置
JP7660487B2 (ja) * 2021-11-22 2025-04-11 三菱電機株式会社 半導体装置
JP7766537B2 (ja) * 2022-03-29 2025-11-10 三菱電機株式会社 半導体装置のリードフレーム及び半導体装置の一体型リードフレーム
CN119110997A (zh) * 2022-11-17 2024-12-10 海信家电集团股份有限公司 功率模块和设备
WO2024104111A1 (zh) * 2022-11-17 2024-05-23 海信家电集团股份有限公司 功率模块和设备
EP4611036A4 (en) * 2022-11-17 2026-01-14 Hisense Home Appliances Group Co Ltd FRAME, POWER MODULE AND DEVICE ASSEMBLY

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267959B2 (ja) * 2011-05-30 2013-08-21 株式会社デンソー 半導体モジュール、及び、それを用いた駆動装置
JP6261309B2 (ja) * 2013-12-02 2018-01-17 三菱電機株式会社 パワーモジュール
JP6379525B2 (ja) * 2014-03-05 2018-08-29 住友電気工業株式会社 半導体モジュール

Also Published As

Publication number Publication date
JP2019075523A (ja) 2019-05-16
WO2019077871A1 (ja) 2019-04-25

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