JP6984823B2 - Micro component surface treatment system and micro component surface treatment method - Google Patents

Description

The present invention relates to a micro component surface treatment system and a micro component surface treatment method capable of performing a surface treatment having a strong adhesion strength only on a micro surface of a micro component.

High-performance electronic components represented by digital semiconductors tend to have high operating frequencies and high power consumption, and there is a demand for connection terminals with low parasitic capacitance and electrical resistance and packages with good heat dissipation. Further, electronic components used in mobile devices and the like are becoming smaller and more sophisticated.

Here, electronic components such as IC chips (also referred to as dies) are mounted on a ceramic laminated substrate made of alumina or the like via ceramic micro components (also referred to as pads), and metal plating provided in advance on the micro components. Through the layer, it is electrically connected to the surface wiring layer of the substrate. The micro component usually has various shapes depending on the circuit design of the board. A metal-plated layer is usually pre-formed on the micro-surface of the micro component to enable electrical connection with the electronic component.

As a pretreatment for forming a metal plating layer on a minute part, degreasing and pickling are performed on the metal plating layer forming portion of the minute part, and further, the bonding strength (adhesion) between the minute surface of the minute part and the metal plating layer is performed. ) Is enhanced by using chemical and physical means to pre-roughen the surface of the microparts to produce an anchor effect.

For this roughening, methods such as chemical etching, reactive ion etching, laser beam irradiation, blasting, sputtering, and machining are used. The blasting process is classified into drive blasting, wet blasting, and the like according to the method, and is classified into shot blasting, sand blasting, bead blasting, and the like according to the processing material (also referred to as abrasive, abrasive, and abrasive grains).

There are various techniques for such blasting. For example, Japanese Patent Application Laid-Open No. 2008-229809 (Patent Document 1) discloses a method for blasting a film-molded portion as a base treatment for electroplating. In this method, the abrasive grains are blended and dispersed in the base material which is an elastic body to the film-forming portion to be treated, or the elastic abrasive material in which the abrasive grains are supported on the surface of the base material which is an elastic body is sprayed. As a result, unevenness is formed on the film formed on the film-forming portion with a predetermined surface roughness without causing the embedding of abrasive grains in the film-forming portion. As a result, an anchor effect can be generated on the film-forming portion to be processed without leaving abrasive grains. However, this method does not describe the shapes of the abrasive grains and the workpiece and their positional relationship.

Further, Japanese Patent Application Laid-Open No. 56-67821 (Patent Document 2) discloses a work transfer device for chip parts and the like. This device has a structure in which the work does not pop out from the hole in the magazine even if the table on which the magazine is placed is vibrated in the horizontal direction and shaken. However, this device does not mention removing the work from the magazine for processing.

Japanese Patent Application Laid-Open No. 2000-252611 (Patent Document 3) describes a substrate preparation step of preparing a substrate (1) having a surface wiring layer (4) formed on an outer surface, and plating on the surface of the surface wiring layer (4). Of the plating layer forming step of forming the layer (5), the plating layer roughening step of making the surface roughness (Rz) of at least a part of the surface of the plating layer (5) 5 μm or more, and the plating layer (5). A method for manufacturing a wiring substrate including a protective glass forming step of forming a protective glass (7) covering a portion having a surface roughness (Rz) of 5 μm or more in the plating layer roughening step is disclosed. As a result, in the manufacture of the wiring board, sandblasting is performed to increase the surface roughness of the plating layer and improve the bonding strength between the plating layer of the surface electrode portion and the protective glass layer. However, this method is a blast treatment only on the portion of the protective glass layer formed on the plating layer, and there is no description of the treatment regarding the base layer forming the plating layer.

Japanese Patent Application Laid-Open No. 2012-243890 (Patent Document 4) describes a step of preparing a first heat sink (30) having one surface (30a) and a semiconductor chip (10, 20) mounted on the first heat sink (30). The semiconductor chip (10, 20) is mounted on the first heat sink (30) via the first conductive member (70), and after the mounting step, the semiconductor chip (10, 20) is mounted. The first roughening treatment step of roughening one surface (30a) of the semiconductor chip (10, 20) and the first heat sink (30), and the semiconductor chip (10, 20) and the first conductive member (70). ) And the step of sealing at least a part of the first heat sink (30) with the mold resin (60), and a method for manufacturing a semiconductor device is disclosed. In this method, the semiconductor chip mounted on the heat sink is closed with a mask by solder joining, one surface of the heat sink and / or the pad is roughened, and then sealed with a mold resin.

In addition, in the partial plating method, a method of masking using an insulating tape, a resist, or the like on a part other than the metal plating film formation is also known, but in each case, an additional step of peeling off the masking material after forming the plating film is performed. In need of.

Japanese Unexamined Patent Publication No. 2008-229809 Jikkai Sho 56-67821 Publication No. 56-67821 Japanese Unexamined Patent Publication No. 2000-252611 Japanese Unexamined Patent Publication No. 2012-243890

As described above, in recent years, as electronic devices have become smaller and faster, the minute parts used for solder-bonding electronic parts and substrates have become smaller and more complicated in shape. For example, a micro component has two or more different diameter dimensions from the upper side to the lower side in the axial direction, and a solder pool is formed on a plating layer for solder bonding with an electronic component on the upper surface of a portion having a small diameter dimension. A structure or the like provided with a recess for soldering is also adopted.

The concave portion of such a micro component is a micro surface, and it is usually extremely difficult to selectively roughen only this surface. For example, in the barrel-type blasting process that involves rotation and stirring, among the roughening processes, the abrasive grains are randomly projected onto the entire surface of the minute parts, so that only the minute surface can be uniformly and uniformly projected in a short time. It is extremely difficult to selectively roughen. In the normal roughening treatment over the entire surface, the plating layer is formed on the surface other than the minute surface in the post-process of forming the plating layer, which requires a reagent such as a metal, an acid, and a catalyst, especially expensive gold. There is a problem that the amount increases, the amount of waste agent discharged and the amount of reagent collected increases, and the general process becomes complicated. Regarding other roughening treatments such as coating and painting, it is difficult to uniformly and selectively roughen only the minute surface in a short time.

As described above, a technique for roughening only the minute surface of a minute part and performing a surface treatment such as plating has been sought not only in the electrical and electronic fields but also in other industrial fields.

Therefore, the present invention has been made to solve the above-mentioned problems, and is a micro component surface treatment system and a micro component surface treatment method capable of performing surface treatment with strong adhesive strength only on the micro surface of the micro component. The purpose is to provide.

As a result of repeated diligent research, the present inventor has completed a novel microparts surface treatment system and a microparts surface treatment method according to the present invention. That is, the micro component surface treatment system according to the present invention includes a supply control unit, a vibration vibration control unit, a transfer control unit, a masking control unit, a surface roughness control unit, and a surface treatment control unit. .. The supply control unit supplies a plurality of minute parts to a transfer pallet provided with a plurality of alignment holes into which the minute parts can enter in only one direction. The vibration vibration control unit gives vibration and vibration to the transfer pallet to which the plurality of minute parts are supplied, inserts the minute parts into the alignment holes of the transfer pallet, and corresponds to the plurality of alignment holes. Align and orient the microparts of. The transfer control unit uses a final pallet having alignment holes that are aligned in the same manner as the alignment holes of the transfer pallet, and transfers a plurality of minute parts aligned and oriented to the alignment holes of the transfer pallet to the alignment holes of the final pallet. At the same time as changing, among the transferred minute parts, the minute surface to be surface-treated is exposed from the alignment hole of the final pallet. The masking control unit uses a masking plate having exposed holes aligned in the same manner as the aligned holes of the final pallet, aligns the exposed holes of the masking plate with the minute surface of the minute part, and makes the final pallet the same. The masking plate is fixed to form a surface roughening jig. The surface roughening control unit projects the processing material toward the masking plate of the surface roughening jig, and roughens only the minute surface of the minute part through the exposed hole of the masking plate. The surface treatment control unit performs a surface treatment including a plating treatment on the roughened minute surface among the minute parts produced by disassembling the surface roughening jig.

The micro component surface treatment method according to the present invention includes a supply control step, a vibration vibration control step, a transfer control step, a masking control step, a surface roughness control step, and a surface treatment control step. Each step of the microparts surface treatment method corresponds to each part of the microparts surface treatment system.

According to the present invention, it is possible to perform a surface treatment having a strong adhesion strength only on a minute surface of a minute part.

FIG. 1A is a schematic diagram of the configuration of a ceramic laminated substrate according to an embodiment of the present invention, and is a schematic cross-sectional view (FIG. 1B) of a micro component according to an embodiment of the present invention. It is a functional block diagram of the micro component surface treatment system which concerns on embodiment of this invention. It is a flowchart for showing the execution procedure of the micro component surface treatment method which concerns on embodiment of this invention. FIG. 3 is a perspective view, a plan view, a front view, a sectional view taken along line AA, and a sectional view taken along line BB of the minute parts according to the embodiment of the present invention. It is a top view and the cross-sectional view taken along line AA of the transfer pallet which concerns on embodiment of this invention. FIG. 6A is a schematic cross-sectional view of a transfer pallet after transfer according to an embodiment of the present invention, and FIG. 6B is a schematic cross-sectional view of a transfer pallet and a transfer pallet according to an embodiment of the present invention. .. A schematic cross-sectional view of the transfer pallet and the transfer pallet after reversal according to the embodiment of the present invention (FIG. 7A), and a schematic cross-sectional view of the transfer pallet and the set pallet at the time of fixing according to the embodiment of the present invention (FIG. 7B). And. A schematic cross-sectional view of the transferred transfer pallet and the set pallet according to the embodiment of the present invention (FIG. 8A), and a schematic cross-sectional view of the inverted set pallet and the lid according to the embodiment of the present invention (FIG. 8B). ,. A schematic cross-sectional view (FIG. 9A) of the fixed pallet and the masking plate according to the embodiment of the present invention, and a perspective view when the treated material is projected onto the masking plate of the surface roughening jig according to the embodiment of the present invention. FIG. 9B. A diagram showing an example of a roughened masking plate according to an embodiment of the present invention and a minute surface of a minute part (FIG. 10A), and a set pallet and a minute part when the masking plate according to the embodiment of the present invention is removed. It is a figure (FIG. 10B) which shows an example with the minute surface of. A linear scanning photograph (FIG. 11A) of the laser micrograph in Example 1, a plan photograph (FIG. 11B) of the laser micrograph in Example 1, and a cross-sectional surface profile diagram (FIG. 11C) of the laser micrograph in Example 1. ,. A linear scanning photograph (FIG. 12A) of the laser micrograph in Comparative Example 1, a plan photograph (FIG. 12B) of the laser micrograph in Comparative Example 1, and a cross-sectional surface profile diagram (FIG. 12C) of the laser micrograph in Comparative Example 1. ,. It is a figure which shows the evaluation result of Examples 1 and 2, and Comparative Examples 2 and 3.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings for the purpose of understanding the present invention. It should be noted that the following embodiment is an example embodying the present invention and does not limit the technical scope of the present invention.

In the embodiment of the present invention, first, the minute parts used in the electric and electronic fields will be described. Generally, the high-performance electronic component 1 is mounted on the ceramic laminated substrate 11 via the ceramic micro component 10 as shown in FIG. 1A. A wiring layer is built in the substrate 11, and a surface wiring layer 12 electrically connected to the internal wiring layer is formed on the outer surface of the substrate 11.

The micropart 10 (pad) is, for example, cylindrical and has two or more different outer diameters from top to bottom in the axial direction, as shown in FIG. 1B. The detailed configuration of the micro component 10 is not particularly limited, but specifically, the micro component 10 has a step in which the outer diameter of the proximal end portion 10a is larger than the outer diameter of the tip end portion 10b. A recess 10c for the plating layer is provided as a minute surface on the upper surface of the tip portion 10b having the minimum outer diameter, and an opening 10d is provided in the center of the minute component 10 from the tip portion 10b to the base end portion 10a. Is provided, and the opening 10d is filled with a metal species or the inner surface is covered with a metal layer. Therefore, the lower surface of the minute component 10 is electrically connected to the surface wiring layer 12 of the substrate 11, the plating layer 10e is provided in the recess 10c of the minute component 10, and the plating layer 10e and the electronic component 1 are solder-bonded. As a result, the electronic component 1 is electrically connected to the surface wiring layer 12 of the substrate 11 via the minute component 10. Further, the shape of the concave portion 10c on the upper surface of the tip portion 10b can be arbitrarily selected as long as solder can be applied to the plating layer 10e, and may be, for example, a flat surface having an opening 10d. The dimensions of the minute component 10 are not particularly limited, but for example, the height of the minute component 10 in the axial direction is in the range of 1.0 mm to 15.0 mm, and for example, the maximum outer diameter of the minute component 10 is set. It is in the range of 1.0 mm to 15.0 mm.

The micro component surface treatment system 2 according to the present invention is a system for roughening the micro surface of such a micro component 10 and forming a plating layer on the micro surface as a surface treatment, as shown in FIG. , The transfer process device 20, the surface roughening process device 21, and the surface treatment process device 22 are provided.

The transfer process device 20 supplies a plurality of minute parts 10 to the transfer pallet, and gives vibration and vibration to the transfer pallet to perform the transfer. Further, the transfer process apparatus 20 transfers (transfers) a plurality of minute parts 10 to the set pallet (final pallet) via the transfer pallet, sandwiches the set pallet between the masking plate and the lid, and roughens the surface. Configure the jig. In the surface roughening jig, only the minute surface of the minute component 10 is exposed from the exposed hole of the masking plate. The transfer process device 20 passes the surface roughening jig to the surface roughening process device 21.

The surface roughening process device 21 projects the processing material onto the masking plate of the passed surface roughening jig to roughen only the minute surface of the minute component 10. After that, the surface roughening process device 21 disassembles the surface roughening jig and passes the roughened minute parts 10 to the surface treatment process device 22.

The surface treatment process apparatus 22 performs a surface treatment plating process on the passed minute component 10 to form a plating layer on the minute surface of the minute component 10. By roughening the minute surface of the minute component 10, an anchor effect is generated on the plating layer, and the adhesion strength between the plating layer and the minute surface of the base is increased. In the above, the plating treatment is mentioned as the surface treatment, but it is not necessary to limit the treatment to the plating treatment. Adhesion strength can be increased.

The transfer process device 20, the surface roughening process device 21, and the surface treatment process device 22 contain a CPU, ROM, RAM, etc. (not shown), and the CPU uses, for example, the RAM as a work area. Then, execute the program stored in the ROM or the like. For each part described later, the CPU controls the function of each part by executing a program.

Next, the configuration and the execution procedure according to the embodiment of the present invention will be described with reference to FIGS. 2 and 3. First, the operator puts a plurality of minute parts 10 into the transfer process device 20 of the minute part surface treatment system 2.

Here, as shown in FIG. 4, the minute component 10 is mainly cylindrical with a step, and the outer diameter of the lower portion (base end portion) 10a is larger than the outer diameter of the tip portion 10b. A recess 10c having a rectangular cross-sectional shape is provided on the upper surface of the tip portion 10b, and an opening 10d is provided from the center of the recess 10c of the tip portion 10b to the center of the bottom surface of the base end portion 10a.
[Transfer process]

When a plurality of minute parts 10 are input, the supply control unit 201 of the transfer process apparatus 20 is provided with a plurality of alignment holes in which the plurality of minute parts 10 can be inserted in only one direction. It is supplied to the pallet (FIG. 3: S101).

Specifically, the supply control unit 201 places the transfer pallet on a table dedicated to transfer, and supplies a plurality of minute parts 10 to the upper surface of the transfer pallet. Here, the shape of the alignment hole is appropriately designed according to the shape of the minute component 10.

For example, if the micropart 10 is cylindrical as shown in FIG. 4 and has two different outer diameters from upper to lower in the axial direction, the upper part of the alignment hole 40 of the transfer pallet 4 is shown in FIG. As shown, the micropart 10 has a first diameter 40a equivalent to the maximum outer diameter R of the micropart 10, and the diameter of the alignment hole 40 is reduced downward from the first diameter 40a. It has a shape having a second diameter of 40b equivalent to the minimum outer diameter r of the above, and has a height 40b equivalent to the axial height h of the minute component 10. As a result, the base end portion 10a of the minute component 10 is arranged in the space of the first diameter 40b of the alignment hole 40, and the tip portion 10b of the minute component 10 enters the space of the second diameter 40b of the alignment hole 40, and is minute. The component 10 will enter the alignment hole 40 in only one direction.

Here, the fact that the first diameter 40a of the alignment hole 40 is equivalent to the maximum outer diameter R of the minute portion 10 means that the first diameter 40a of the alignment hole 40 is strictly the same as the maximum outer diameter R of the minute component 10. It is not necessary to be the same, and a predetermined clearance may be allowed for the maximum outer diameter R of the minute component 10. The predetermined clearance is, for example, in the range of 1% to 10% with respect to the maximum outer diameter R of the minute component 10. As a result, it is possible to prevent blocking from occurring when the minute component 10 enters the alignment hole 40.

Similarly, the second diameter 40b of the alignment hole 40 is equivalent to the minimum outer diameter r of the minute portion 10, the second diameter 40b of the alignment hole 40 is exactly the smallest outer diameter r of the minute part 10. It is not necessary to be the same as each other, and a predetermined clearance may be allowed for the minimum outer diameter r of the minute component 10. The predetermined clearance is, for example, in the range of 1% to 10% with respect to the minimum outer diameter r of the minute component 10.

Similarly, the height 40c of the alignment hole 40 is equivalent to the axial height h of the minute component 10, the height 40c of the alignment hole 40 is exactly the same as the axial height h of the minute portion 10. It is not necessary to be, and a predetermined clearance may be allowed for the height h in the axial direction of the minute portion 10. The predetermined clearance may be set to, for example, 10% or more with respect to the height 40c of the alignment hole 40 shown in FIG. 5, or the height 40c of the alignment hole 40 shown in FIG. 5 as the depth of the tapered surface. It may be equal to the axial height h of the minute portion 10, or may be set within the range of 1% to 10% with respect to the axial height h of the minute portion 10. The alignment hole 40 may be a non-penetrating recess or a through hole.

Further, the inner wall of the alignment hole 40 from the first diameter 40a to the second diameter 40b has an inclined surface in a cross-sectional view, and guides the step between the tip portion 10b and the base end portion 10a of the minute component 10. It is preferable not to spread it too much because it has a role to play. The shape of the inner wall may be, for example, a stepped surface in addition to the inclined surface. Further, the edge portion of the alignment hole 40 may be chamfered in order to facilitate the depression of the minute component 10.

Here, a plurality of alignment holes 40 are provided at equal intervals on the upper surface of the transfer pallet 4, but the number and arrangement of the alignment holes 40 are appropriately designed according to the type and number of the minute parts 10.

When the supply control unit 101 supplies the plurality of minute parts 10 to the transfer pallet 4, the sway vibration control unit 202 of the transfer process device 20 gives sway and vibration to the transfer pallet 4 to which the plurality of minute parts 10 are supplied. Then, the minute parts 10 are put into the alignment holes 40 of the transfer pallet 4, and the plurality of minute parts 10 are aligned and oriented corresponding to the plurality of alignment holes 40 (FIG. 3: S102).

Specifically, the oscillating vibration control unit 202 uses the oscillating drive unit and the horizontal drive unit to oscillate and vibrate the table on which the transfer pallet 4 is placed in the horizontal direction. Here, as shown in FIG. 5, the micro component 10 enters the alignment hole 40 in one direction with the base end portion 10a of the micro component 10 facing upward and the tip portion 10b facing downward. If the supply amount of the minute parts 10 is appropriate, the vibration vibration control unit 202 shakes and vibrates the transfer pallet 4 by 2 to 3 reciprocations to place the minute parts 10 in all the alignment holes 40 of the transfer pallet 4. The transfer and transfer process is complete. An outer frame may be provided around the end of the transfer pallet 4 so that the minute parts 10 do not fall from the transfer pallet 4 during vibration / vibration.

Now, when a plurality of minute parts 10 enter the alignment hole 40 of the transfer pallet 4, the shape of the minute component 10 is reduced in diameter from the upper side to the lower side in the axial direction, so that the minute component 10 enters the alignment hole 40. In this state, as shown in FIG. 6A, the base end portion 10a having the maximum outer diameter of the minute component 10 is on the upper side, and the tip end portion 10b of the minute component 10 is on the lower side.

When the oscillating vibration control unit 202 completes the oscillating / vibration of the transfer pallet 4, the transfer control unit 203 of the transfer process device 20 uses a final pallet having an alignment hole that is aligned in the same manner as the alignment hole 40 of the transfer pallet 4. The plurality of minute parts 10 aligned and oriented in the alignment hole 40 of the transfer pallet 4 are transferred to the alignment hole of the final pallet, and among the transferred minute parts 10, the minute surface to be surface-treated is the final. It is exposed from the alignment hole of the pallet (FIG. 3: S103).

Here, the transfer control unit 203 is not particularly limited in the method of transferring the plurality of minute parts 10 after the alignment and orientation, and is appropriately designed depending on where the minute surface of the minute parts 10 to be roughened is located. To. In the embodiment of the present invention, the minute surface to be roughened is the recess 10c of the tip portion 10b of the minute component 10, and the minute surface 10c of the minute component 10 after alignment orientation faces downward in the alignment hole 40 of the transfer pallet 4. In this case, it is necessary to invert the minute surface 10c of the tip portion 10b of the minute component 10 that has entered downward.

Therefore, as shown in FIG. 6B, the transfer control unit 203 first aligns the alignment hole 50 of the transfer pallet 5 with the alignment hole 40 of the transfer pallet 4, and fixes the transfer pallet 5 to the transfer pallet 4. do. Here, the alignment hole 50 of the transfer pallet 5 is designed so that the minute surface 10c of the minute component 10 is inverted from the bottom to the top, and is equivalent to, for example, the first diameter 40a of the alignment hole 40 of the transfer pallet 4. The number and position of the alignment holes 50 of the transfer pallet 5 are the same as the number and position of the alignment holes 40 of the transfer pallet 4. Further, the edge of the alignment hole 50 of the transfer pallet 5 may be chamfered so that the minute component 10 of the alignment hole 40 of the transfer pallet 4 is smoothly transferred to the alignment hole 50 of the transfer pallet 5. ..

Further, the transfer pallet 4 is provided with a guide pin 41 for positioning, and the transfer pallet 5 is provided with a positioning hole 51 in advance corresponding to the guide pin 41 of the transfer pallet 4, and the transfer control is controlled. The unit 203 inserts the positioning hole 51 of the transfer pallet 5 into the guide pin 41 of the transfer pallet 4 and aligns the position, and arranges the transfer pallet 4 below the transfer pallet 5.

Next, as shown in FIG. 7A, the transfer control unit 203 inverts the transfer pallet 4 to which the transfer pallet 5 is fixed upside down, and arranges the transfer pallet 4 upward and the transfer pallet 5 downward. Then, the transfer control unit 203 lightly taps the side surface of the transfer pallet 4 to give vibration (arrow 71 in FIG. 7A), whereby the minute component 10 that has entered the alignment hole 40 of the transfer pallet 4 is transferred to the transfer pallet 5. Drop into the alignment hole 50 of.

Further, as shown in FIG. 7B, the transfer control unit 203 removes the transfer pallet 4 and has a through hole 60 (alignment hole) of the set pallet 6 (which becomes the final pallet) with respect to the alignment hole 50 of the transfer pallet 5. ), And the lower surface of the set pallet 6 is fixed to the upper surface of the transfer pallet 5. Here, the shape of the through hole 60 of the set pallet 6 is designed so that the minute component 10 is fixed, and is equivalent to, for example, a cylindrical shape having a step into which the tip portion 10b and the base end portion 10a of the minute component 10 enter. Yes, the number and position of the through holes 60 of the set pallet 6 are the same as the number and position of the alignment holes 50 of the transfer pallet 5. However, the depth of the through hole 60 is preferably the same as the height of the minute part in order to easily expose the minute part from the surface of the set pallet 6 to the outside. Since the set pallet 6 is a metal plate in which the through hole 60 is perforated, the bottom surface body 7 is placed on the upper surface of the set pallet 6 to form the bottom surface of the through hole 60.

Further, the set pallet 6 is provided with a positioning guide pin 61 in advance corresponding to the positioning hole 51 of the transfer pallet 5, and the transfer control unit 203 is transferred to the guide pin 61 of the set pallet 6. The positioning hole 51 of 5 may be inserted for alignment.

Then, as shown in FIG. 8A, the transfer control unit 203 flips the transfer pallet 5 to which the set pallet 6 is fixed upside down, and arranges the transfer pallet 5 upward and the set pallet 6 downward. Then, the transfer control unit 203 lightly taps the side surface of the transfer pallet 5 to give vibration (arrow 81 in FIG. 8A), thereby setting the minute parts 10 in the alignment hole 50 of the transfer pallet 5 as a set pallet. Drop into the through hole 60 of 6.

As shown in FIG. 8B, the transfer control unit 203 fixes the lid 8 on the upper surface of the set pallet 6 and turns the set pallet 6 upside down again (arrow 82 in FIG. 8A). The lid 8 is provided with a positioning hole 83 for positioning in advance corresponding to the guide pin 61 of the set pallet 6, and the transfer control unit 203 is provided with the positioning hole of the lid 8 in the guide pin 61 of the set pallet 6. You may put 83 and align it.

Then, the transfer control unit 203 removes the bottom plate 7 as shown in FIG. 9A. As a result, the minute surface 10c of the minute component 10 transferred to the through hole 60 of the set pallet 6 is exposed from the through hole 60 of the set pallet 6.

In the above description, since the minute surface 10c of the minute component 10 after the alignment alignment is downward in the alignment hole 40 of the transfer pallet 4, the transfer control unit 203 is the minute component of the alignment hole 40 of the transfer pallet 4. 10 was transferred to the through hole 60 of the set pallet 6 via the transfer pallet 5. For example, when the minute surface 10c of the minute component 10 after the alignment is oriented upward in the alignment hole 40 of the transfer pallet 4, the transfer control unit 203 does not go through the transfer pallet 5, but the transfer pallet 4 The minute component 10 of the alignment hole 40 may be directly transferred to the through hole 60 of the set pallet 6. That is, the transfer method is appropriately redesigned according to the position of the minute surface 10c of the minute part 10 and the state of the minute part 10 after the alignment and orientation. Further, as the transfer method, as described above, vibration is applied or the surface is turned upside down, but in addition, a suction device or a shutter plate may be used.

When the transfer control unit 203 completes the transfer of the minute component 10, the masking control unit 204 of the transfer process device 20 uses a masking plate having exposed holes aligned in the same manner as the through holes 60 of the set pallet 6. The exposed holes of the masking plate are aligned with the minute surface 10c of the minute component 10, and the masking plate is fixed to the set pallet 6 to form a surface roughening jig (FIG. 3: S104).

Here, there is no particular limitation on the method in which the masking control unit 204 fixes the masking plate. For example, the masking control unit 204 aligns the exposed hole 90 of the masking plate 9 with the minute surface 10c (bottom surface of the recess 10c) of the minute component 10 that has entered the through hole 60 of the set pallet 6 and masks the set pallet 8. The plate 9 is fixed to form a surface roughening jig. The masking plate 9 is provided with guide pins in advance corresponding to the positioning holes of the set pallet 6, and the masking control unit 203 is aligned by inserting the guide pins of the masking plate 9 into the positioning holes of the set pallet 6. You may. As a result, only the minute surface 10c of the minute component 10 can be exposed to the outside through the exposed hole 90 of the masking plate 9.

The materials of the transfer pallet 4, the transfer pallet 5, the set pallet 6, the bottom body 7, and the lid 8 are not particularly limited, but for example, phenol resin, urea resin, melamine resin, epoxy resin, etc. Thermosetting resin can be used. In particular, phenolic resin is preferable as these materials, and more specifically, Bakelite is more preferable, because of rigidity, ease of drilling, cost and the like. Further, the thickness of these pallets (for example, corresponding to the height 40c of the transfer pallet 4) is appropriately defined according to the height h in the axial direction of the minute component 10, and specifically, the thickness of these pallets. Is preferably in the range of 1 mm to 20.0 mm, more preferably in the range of 3 mm to 15 mm.

The material of the masking plate 9 is not particularly limited, but for example, metals and alloys, particularly stainless steel, are preferable from the viewpoint of wear resistance to the cleaning material, bending resistance, hardness, cost, and the like. SUS304 is more preferable. SUS304 is an austenitic chrome-nickel alloy stainless steel. The thickness of the masking plate is appropriately defined according to the height of the minute component 10 in the axial direction, the projection angle of the processing material, and the like. Specifically, the thickness of the masking plate is 0.1 mm to 5.0 mm. The range is preferable, and the range of 0.3 mm to 3.0 mm is more preferable.
[Surface roughening process]

When the masking control unit 204 completes the configuration of the surface roughening jig, the surface roughening jig moves to the surface roughening process device 21 and controls the surface roughening of the surface roughening process device 21. The portion 205 projects the processing material toward the masking plate 9 of the surface roughening jig, and roughens only the minute surface 10c of the minute component 10 through the exposed hole 90 of the masking plate 9 (FIG. 3: FIG. S105).

As a result, only the minute surface 10c of the minute component 10 can be roughened, so that an anchor effect can be generated only on the minute surface 10c, and the adhesive strength of the surface treatment layer can be increased in the subsequent surface treatment.

The method for roughening the surface roughening control unit 205 is not particularly limited, and examples thereof include chemical etching, reactive ion etching, laser beam irradiation, blasting, sputtering, and machining methods.

In the embodiment of the present invention, since the minute component 10 is made of ceramics, the surface roughening control unit 205 performs shot blasting treatment toward the masking plate 8 of the surface roughening jig as shown in FIG. 9B. conduct. In the surface roughening jig, since the minute surfaces 10c of the plurality of minute parts 10 are aligned and oriented toward the exposed holes 90 of the masking plate 9, the treatment material (polishing material, abrasive material) for shot blasting is used. It hits the minute surface 10c of the minute component 10 through the exposed hole 90 of the masking plate 9 (arrow 91 in FIG. 9B), and increases the surface roughness Rz of the minute surface 10c of the minute component 10. As described above, when the micro component 10 is made of ceramics, by adopting a relatively simple method of shot blasting, a submicron to micron-order fine uneven rough surface is used with respect to the micro surface 10c of the micro component 10. Can be easily applied, and the adhesive strength of the minute component 10 can be improved and the life thereof can be improved.

Further, when the minute part 10 is made of ceramics, when the minute part 10 is made of ceramics, various contaminated parts picked up in the furnace are cleaned, and at the same time, fine unevenness is obtained by a dry method of shot blasting. The rough surface can be selectively concentrated and adjusted uniformly.

The surface roughness Rz of the minute surface 10c of the minute part 10 formed by the shot blasting treatment is specifically the maximum roughness specified in JIS B0601-2001 from the viewpoint of the adhesive strength with the surface treatment layer. The range of 0.1 μm to 300 μm is preferable, and the range of 1.0 μm to 150 μm is more preferable.

Further, the shot blasting treatment can be adjusted by appropriately selecting and adjusting blasting conditions such as the injection distance, the shape of the nozzle tip, and the injection amount from the viewpoint of the roughened property of the treated material, the adhesive strength with the surface treatment layer, and the like. ..

The purpose of the shot blasting process is to appropriately remove the glassy substance of the ceramics constituting the minute component 10. There are various types of projection methods for the treated material, such as mechanical type, pneumatic type, and wet type. However, as long as the treated material can be injected under desired blast conditions, the projection method is not particularly limited, and for example, rotation. The method of projecting the treated material by the centrifugal force of the impeller may be used, or the method of projecting the treated material by hitting the treated material with an embossing rotor may be used.

The treatment material to be sprayed by the shot blast treatment is not particularly limited, and metals, alumina, silicon carbide, glass, resin and the like are used. For example, a treatment material having a hardness equal to or higher than the material of the pad to be treated is preferable. Specifically, alumina particles and fine alumina powder are preferable.

The particle size (count) of the treated material is not particularly limited, and can be appropriately adjusted according to the degree of surface roughness Rz (unevenness) formed on the minute surface 10c of the minute component 10. The surface roughness Rz is adjusted so as to generate an anchor effect according to the material, thickness, forming method, etc. of the surface treatment layer formed thereafter. Specifically, the particle size of the treated material is in the range of 0.5 μm (count # 20000) to 200.0 μm (count # 30) in order to obtain an appropriate surface roughness Rz of the pad for the surface treatment layer. It is preferably in the range of 16.0 μm (count # 1000) to 140.0 μm (count # 90), and more preferably.

The shape of the treated material can be appropriately changed in design depending on the material of the minute component 10, the blast condition, and the like. For example, various shapes can be widely used in addition to the normal spherical shape.

Of the projection conditions of the treated material, the projection pressure is preferably in the range of, for example, 0.01 MPa to 1.0 MPa. Here, when the projection pressure is less than 0.01 MPa, the projection speed of the processing material projected from the nozzle becomes slow, and the impact for processing the minute surface 10c of the minute component 10 becomes small, which is not suitable for industrial use. .. On the other hand, when the projection pressure exceeds 01.0 MPa, when the projected processing material collides with the minute surface 10c of the minute component 10, the projection speed is high, so that a large force is applied to the processing material and the processing material becomes minute. It is not preferable because it may get stuck in the minute surface 10c of the component 10. The projection pressure is preferably in the range of, for example, 0.02 MPa to 0.40 MPa. Further, the amount of air under the projection conditions is preferably in the range of, for example, 250 L / min to 300 L / min.

The projection speed of the treated material is appropriately adjusted depending on the projection pressure, the particle size of the treated material, and the like. The injection distance of the treated material is typically set within the range of 5 cm to 50 cm, preferably within the range of 10 cm to 30 cm. Here, if the injection distance is less than 5 cm, the projection speed becomes too high and the minute surface 10c of the minute component 10 is excessively damaged, which is not preferable. If the injection distance exceeds 50 cm, the projection surface of the treated material expands, accurate processing of the minute surface 10c of the minute component 10 cannot be achieved, and the time required for the blasting may become longer, which is not preferable. ..

The incident angle of the projection condition is appropriately selected according to the projection purpose of the processing material, but is usually in the range of 70 ° to 110 ° with respect to the masking plate 9, preferably 80 ° to 100 °. Set within range. The incident angle is appropriately adjusted according to the shape of the nozzle tip, the width of the blast surface, the spacing between the exposed holes 90 of the masking plate 9, the geometrical arrangement of the exposed holes 90, the thickness of the masking plate 9, the desired processing shape, and the like. To.

As described above, the degree of roughness of the minute component 10 with respect to the minute surface 10c can be easily and accurately adjusted by adjusting the particle size of the processing material to be projected and the projection conditions, so that it can be adjusted electrically and mechanically. Stable processing of minute parts 10 is possible.
[Surface treatment process]

When the surface roughening control unit 205 completes the roughening, the surface roughening jig is disassembled, and a plurality of minute parts 10 having the fine surface 10c roughened are taken out and moved to the surface treatment process apparatus 22. The surface treatment control unit 206 of the surface treatment process apparatus 22 applies a surface treatment including a plating treatment to the roughened minute surface 10c of the minute parts 10 (FIG. 3: S106).

The method by which the surface treatment control unit 206 applies the surface treatment is not particularly limited. In the embodiment of the present invention, when the surface treatment is a plating treatment, as described above, only the minute surface 10c of the minute component 10 is roughened, and the other surfaces are not roughened. Since the plating layer does not precipitate on the entire surface of the minute component 10 and the plating layer is deposited only on the minute surface 10c, it is possible to form the required plating layer on the required portion and to perform the plating treatment. It is possible to reduce the required amount of metal type as a material. The amount of nickel and gold required for plating, which will be described later, can be reduced to a fraction or less.

Here, there is no particular limitation on the method in which the surface treatment control unit 206 performs the plating treatment. In the embodiment of the present invention, the surface treatment control unit 206 performs electroless nickel plating treatment on the coarsened microparts 10 to impart a conductive nickel plating layer to the microsurfaces 10c of the microparts 10, and then. An electrolytic nickel plating treatment is performed to form a gold plating layer on the nickel plating layer. The gold-plated layer is the target of solder bonding with the electronic component 1. The thickness of the nickel-plated layer is set in the range of 1 μm to 9 μm, and the thickness of the gold-plated layer is set in the range of 0.05 μm to 1.50 μm. As a result, the metal wiring portion of the electronic component 1 such as an IC chip is solder-bonded to the plating layer of the minute surface 10c of the minute component 10, so that the electronic component 1 is formed into the plating layer of the minute surface 10c of the minute component 10 and the opening 10d. It can be electrically connected to the surface wiring layer 12 via the surface wiring layer 12.

Here, in the plating process, if necessary, additional surface adjustment is performed on the minute surface 10c of the minute component 10, and catalystization is performed in which the nucleus of the metal catalyst is attached to the minute surface 10c of the minute component 10. It doesn't matter.

The surface adjustment corresponds to the physical treatment and / or the chemical treatment on the minute surface 10c of the minute part 10, and by performing the surface adjustment, fine unevenness is left on the minute surface 10c of the minute part 10, and the scaffolding of the plating layer is formed. And the anchor effect can be obtained. For the surface adjustment, specifically, physical treatment such as buffing and honing, and chemical treatment (soft etching) of immersing in at least one acid selected from the group containing hydrofluoric acid and nitric acid can be selected. I can.

Further, for sensitization and catalysis, for example, fine metal species such as palladium and tin are used, and these metal species serve as a scaffold for nickel ions in the electroless nickel plating treatment, and nickel ions are used in the minute component 10. When it adheres to the microsurface 10c, it promotes the reduction of nickel ions and their deposition on the surface.

Now, an example of the plating process of S106 according to the embodiment of the present invention will be specifically described. First, the surface treatment control unit 206 degreasing and cleaning the micro component 10 having the coarsened micro surface 10c to separate the oil component adhering to the micro surface 10c of the micro component 10. For example, the surface treatment control unit 206 performs preliminary degreasing using a chlorine-based organic solvent and / or alkaline immersion degreasing cleaning using an alkali salt and a surfactant on the minute component 10 (FIG. 3: S201).

Next, the surface treatment control unit 206 pickles the microparts 10 after degreasing and washing with water, and pickles the microparts 10 after washing with an oxidizing acid (FIG. 3: S202). This pickling also serves as soft etching.

Then, the surface treatment control unit 206 rinses the minute component 10 after pickling with water, and performs surface adjustment (smoothing) on the minute component 10 after washing with alkaline degreasing and / or a conditioner (FIG. 3: S203). ..

The surface treatment control unit 206 washes the microparts 10 after surface adjustment with water, and uses a predipping agent for sensitization to enhance the adsorptivity of the catalyst of the microparts 10 after washing with water (predip) (FIG. 3: FIG. S204).

After that, the surface treatment control unit 206 washes the microparts 10 after pre-dip with water, and attaches a catalyst having colloidal particles of palladium-tin to the microsurfaces 10c of the microparts 10 after washing with water (catalystation) (catalystization). FIG. 3: S205).

Further, the surface treatment control unit 206 washes the microparts 10 having the catalyst attached to the microsurface 10c with water, imparts a sulfuric acid-based accelerator to the microparts 10 after washing with water, and exposes the palladium catalyst. It is activated and activated to enhance the precipitation and adhesion of nickel (acceleration) (FIG. 3: S206).

Then, the surface treatment control unit 206 wash the accelerated minute component 10 with water, and perform electroless nickel plating on the accelerated minute component 10 (FIG. 3: S207).

Here, the method in which the surface treatment control unit 206 performs the electroless nickel plating treatment is not particularly limited. For example, the surface treatment control unit 206 is a chemically reduced / self-catalyzed Ni-P (hypophosphite). ), Medium phosphorus (concentration of 7% by weight to 9% by weight), electroless nickel plating treatment is carried out.

The bath composition of the electroless nickel plating treatment is 90% by weight to 92% by weight of Ni, 8% by weight to 10% by weight of P, 15 g / L to 25 g / L of nickel sulfate as a nickel ion source, and a reducing agent. Sodium hypophosphite is 20 g / L to 25 g / L, malic acid as a complexing agent is 10 g / L to 20 g / L, succinic acid is 10 g / L to 20 g / L, and 90% lactic acid is 5 g / L to 15 g. / L, or citric acid, tartaric acid, glycolic acid, acetic acid, etc. are used as appropriate amounts. Further, thiourea as a stabilizer is 0.2 g / L to 0.4 g / L, a trace amount of heavy metal ion as an auxiliary component, acetic acid, formic acid and a surfactant are coexisted as an accelerator.

Here, as the plating process progresses, the pH of the plating bath solution decreases, so sodium hydroxide or ammonia is replenished as an adjusting agent to keep the pH of the plating bath solution within the range of 4.5 to 5.2. The plating bath temperature is set in the range of 80 ° C. to 90 ° C., and the plating precipitation rate is set in the range of 15 μm / h to 20 μm / h.

The thickness of the plating layer formed by the electroless nickel plating treatment is in the range of 0.1 μm to 1.5 μm, preferably in the range of 0.3 μm to 1.0 μm, and the plating layer is not porous and the plating layer is Vickers. The hardness is in the range of 550 Hv to 600 Hv.

After the surface treatment control unit 206 finishes the electroless nickel plating treatment, the microparts 10 after the electroless nickel plating are washed with water to activate the metal surface, and after activation with a solid acid containing an appropriate amount of fluoride. By treating the minute component 10 of the above, peeling of the plating layer and the like are completely prevented.

Next, the surface treatment control unit 206 applies an electrolytic nickel plating treatment to the minute parts 10 after the electroless nickel plating treatment (FIG. 3: S208).

Here, the method in which the surface treatment control unit 206 performs the electrolytic nickel plating treatment is not particularly limited, but for example, the surface treatment control unit 206 puts the minute component 10 in a watt bath and performs the electrolytic nickel plating treatment.

The bath composition of the electrolytic nickel plating treatment is 240 g / L to 300 g / L of nickel sulfate as a nickel ion source, 40 g / L to 50 g / L of nickel chloride, and 30 g / L to 45 g / L of boric acid as a buffer. Alternatively, an appropriate amount of nickel acid, malonic acid, apple, etc. is used.

The pH of the plating bath liquid is in the range of 4.0 to 4.6, the plating bath temperature is in the range of 50 to 60 degrees, and the current density is in the range of 1.0 A / dm ^{2 to} 5.0 A / dm ² . It is carried out in an electrolytic bath equipped with a shaking or shaking device while stirring the plating bath liquid by air stirring or mechanical stirring. Platinum-coated titanium, high-purity electrolytic nickel, or the like is used for the anode.

After the surface treatment control unit 206 finishes the electrolytic nickel plating treatment, the microparts 10 after the electrolytic nickel plating treatment are washed with water and dried with a dryer or the like. The Vickers hardness of the plating layer obtained on the minute component 10 is in the range of 200 Hv to 300 Hv.

Finally, the surface treatment control unit 206 applies an electrolytic gold plating treatment to the minute parts 10 after the electrolytic nickel plating treatment (FIG. 3: S209).

Here, the method in which the surface treatment control unit 206 performs the electrolytic gold plating treatment is not particularly limited, but for example, the surface treatment control unit 206 puts the minute component 10 in a cyanation bath and is weakly acidic (pH is 3.5). In the cyanization bath (within the range of ~ 5.5), the minute parts 10 are subjected to electrolytic gold plating.

The bath composition of the electrolytic gold plating treatment is 8 g / L to 12 g / L of primary gold cyanide as a gold ion source, 80 g / L to 120 g / L of potassium dihydrogen phosphate as a phosphate, and auxiliary. Appropriate amounts of metal salt additives, conductive salts, buffers, crystal modifiers, alloy metals, surfactants and the like are used as components.

The plating bath temperature was in the range of 40 ° C. to 70 ° C., the pH of the plating bath solution is in the range of 4.0 to 5.0, the range the current density of 0.1A ^/ dm ² ~1.5A ^/ dm 2 For example, platinum-coated titanium is used for the anode, and the current is carried out in an electrolytic bath equipped with a stirrer or a vibrating device.

The thickness of the obtained gold plating film is in the range of 0.5 μm to 1.5 μm, the purity of gold is 99.7%, and the Vickers hardness of the gold plating layer is in the range of 50 Hv to 100 Hv. .. The appearance of the gold-plated layer exhibits a metallic color of gold. This completes the plating process of S206.

When the surface treatment control unit 206 completes the plating process, the micro component 10 having a plating layer on the micro surface 10c is completed. The minute component 10 is arranged on the substrate 11, and the plating layer of the minute component 10 is solder-bonded to an electronic component such as an IC chip. However, since the plating layer has an anchor effect, it has sufficient adhesive strength. ..

By the way, in the above description, the case where the surface treatment is a plating treatment has been described, but it is not necessary to be limited to this. That is, even if a surface treatment such as coating or painting other than the plating treatment is performed, the adhesion strength of any surface-treated layer is enhanced by the anchor effect of the roughening of the minute surface 10c of the minute component 10. Can be done.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited thereto.
[Small parts]

Microparts were manufactured by kneading alumina, molding, degreasing, and sintering. Specifically, in the kneading, 99.9% alumina (manufactured by Sumitomo Chemical Co., Ltd., AES11E) having an average particle size of 0.48 μm was used as the raw material powder. The binder was a composition of ethylene-vinyl acetate copolymer, polybutyl methacrylate, paraffin wax, dibutyl phthalate and stearic acid in a weight ratio of 30:30: 30: 5: 5. The binder was blended so as to be 18.5 parts by weight with respect to 100 parts by weight of the raw material powder. In kneading, a 300 cc pressurized kneader was heated to 150 ° C., a binder was added, kneaded for 60 minutes, and then cooled. The obtained kneaded product was crushed with a pot mill to obtain a molding material.

In molding, the mold was manufactured according to the CAD image. The injection molding machine uses a horizontal molding machine with a mold clamping force of 35 tons, the initial setting value of the injection pressure is 64 MPa, the cylinder temperature of the molding machine is 160 ° C, the mold temperature is 35 ° C, and the injection speed is 80 mm. It was set to / s.

In degreasing, the material was heated in an atmospheric degreasing furnace to a maximum temperature of 450 ° C. at a heating rate of 5 ° C./h under an atmospheric atmosphere, held for 2 hours, and then cooled. This step was 80 to 100 hours including the cooling time. 90% alumina was used as the setter.

In sintering, the mixture was heated from room temperature to a maximum temperature of 1620 ° C. in an atmospheric atmosphere, held for 2 to 3 hours, and then cooled in a furnace. As the setter, the one in the debindering step was used as it was.

As shown in FIG. 4, the manufactured micropart 10 has a cylindrical shape having a step, and the height of the micropart 10 in the axial direction is 5 mm, which corresponds to the diameter of the base end portion 10a of the micropart 10. The maximum outer diameter R of the minute component 10 is 5 mm, and the minimum outer diameter r of the minute component 10 corresponding to the diameter of the tip portion 10b of the minute component 10 is 3 mm.
[Small component surface treatment system]

According to FIGS. 2 and 3, the micro component surface treatment system 2 according to the embodiment of the present invention was configured, and each step was carried out.
[Transfer process]

The minute parts 10 manufactured above and the transfer pallet 4 shown in FIG. 5 are prepared, the transfer pallet 4 is placed on the table of the transfer process apparatus 20, and as shown in FIG. 5, a plurality of minute parts 10 are placed. Feeding, the table was shaken and vibrated for a predetermined time (about 3 minutes).

As shown in FIG. 6A, the transfer process apparatus 20 shakes and vibrates the transfer pallet 4, and a plurality of minute parts 10 are accommodated in the alignment hole 40 of the transfer pallet 4.

After the transfer is completed, as shown in FIG. 6B, the alignment hole 40 of the transfer pallet 4 is aligned with the alignment hole 50 of the transfer pallet 5, the transfer pallet 5 is fixed to the transfer pallet 4, and as shown in FIG. 7A. This was reversed and the side surface of the transfer pallet 4 was tapped lightly to vibrate, and the minute component 10 was transferred from the alignment hole 40 of the transfer pallet 4 to the alignment hole 50 of the transfer pallet 5.

Next, as shown in FIG. 7B, after removing the transfer pallet 4, the through hole 60 of the set pallet 6 is aligned with the alignment hole 50 of the transfer pallet 5, and the set pallet 6 is fixed to the transfer pallet 5. do. A bottom plate 7 is placed on the set pallet 6, and as shown in FIG. 8A, this is inverted and the side surface of the transfer pallet 5 is tapped lightly to vibrate, and the minute parts 10 are arranged in the alignment holes of the transfer pallet 5. It was transferred from 50 to the through hole 60 of the set pallet 6.

Then, as shown in FIG. 8B, the transfer pallet 5 is replaced with the lid body 8, and as shown in FIG. 9A, the bottom plate 7 is replaced with the masking plate 9, so that the minute surface 10c of the minute component 10 is replaced with the masking plate 9. It was exposed from the exposed hole 90 of. As a result, a surface roughening jig was constructed. The case where the masking plate 9 is not provided is used as a comparative example, and the case where the masking plate 9 is provided is used as an example (described later).
[Blast processing]

Next, the surface roughening jig is set in the surface roughening process device 21, and as shown in FIG. 9B, the surface roughening process device 21 uses compressed air to apply the treated material to the masking plate of the surface roughening jig. It was projected on 9. As the surface roughening process device 21, a manual blasting machine SFK-2 for fine powder manufactured by Fuji Seisakusho Co., Ltd. was used. Alumina having a particle diameter of 40 μm was used as the treatment material, the discharge pressure under the injection conditions was set to 0.5 MPa, and the air volume was set to 280 L / min. Here, by setting the processing time (total projection time) to 0 to 30 minutes, Examples and Comparative Examples were produced (described later). The angle of incidence was set to 90 degrees, and the nozzle was manually operated for a predetermined time so that the masking plate 9 was evenly blasted. The injection distance at that time was 50 cm, and the diameter of the projected beam on the surface of the masking plate 9 was 20 cm.

After the blast treatment, as shown in FIG. 10A, the treatment material was projected only on the exposed holes 90 of the masking plate 9, and only the minute surface 10c of the minute parts 10 exposed from the exposed holes 90 was roughened. When the masking plate 9 was removed, as shown in FIG. 10B, only the minute surface 10c of the minute parts 10 aligned and arranged in the through hole 60 of the set pallet 6 was roughened. The roughened surface was evaluated by a confocal laser scanning microscope (described later).
[surface treatment]

Then, in the surface treatment process apparatus 22, the minute surface 10c of the minute component 10 was plated. Here, the plating treatment was performed according to FIG. The surface treatment process apparatus 22 was degreased and washed using 50 g / L of a treatment agent of Ascreen A220 manufactured by Okuno Pharmaceutical Co., Ltd. at 50 ° C. for 5 minutes. In the surface treatment process apparatus 22, the acid treatment / soft etching was carried out under the condition of 40 ° C. using an acid consisting of 15 mL / L of nitric acid and 5 mL / L of 55% hydrofluoric acid, and a part of the glassy substance was removed. Dissolved.

The surface treatment process apparatus 22 was subjected to surface preparation using Condiclean 100 mL / L of Okuno Pharmaceutical Co., Ltd. OPC-370 under the conditions of 40 ° C. and 15 minutes. The surface treatment process apparatus 22 was carried out at 25 ° C. for 1 minute using 200 mL / L of 35% hydrochloric acid in the predip.

The surface treatment process apparatus 22 was catalyzed using 60 mL / L of catalysts of OPC-80 of Okuno Pharmaceutical Co., Ltd. and 200 mL / L of 35% hydrochloric acid under the conditions of 30 ° C. and 5 minutes. The acceleration was carried out using an accelerator 500M 100 mL / L of Okuno Pharmaceutical Co., Ltd. OPC-505 at 30 ° C. for 1 minute.

In the surface treatment process device 22, in electroless nickel plating, the minute parts 10 are held in a stainless steel rack, and the plating bath contains nickel sulfate 20 g / L, hypochlorite sodium 24 g / L, apple acid 16 g / L, and succinic acid. 18 g / L was added, and the pH of the plating bath solution was adjusted to 4.5 to 5.2, and the temperature was 90 ° C. for 10 minutes. The acid activity was carried out at 25 ° C. for 10 minutes using Top Sun 50 g / L from In The Back Pharmaceutical Industry Co., Ltd. In electrolytic nickel plating, the minute parts 10 are held in a stainless steel rack, nickel sulfate 250 g / L, nickel chloride 40 g / L, and boric acid 30 g / L are added to the watt bath, and the pH of the watt bath liquid is 4.0 to 4 It was carried out under the conditions of a temperature of 50 ° C. for 10 minutes and a current density of 2 A / dm ^{2 while adjusting to 0.4.} The obtained microparts 10 were dried using a dryer and had a hardness of 250 Hv. In each plating, the minute parts 10 were washed with deionized water during the treatment step. In electrolytic gold plating, the minute parts 10 are held in a stainless steel rack and housed in an electrolytic bath, _{and 8 to 12 g / L of KAu (CN) 2} and 100 g / L of potassium dihydrogen phosphate are added to the electrolytic bath. The operation was carried out for about 10 minutes while maintaining the pH of the electrolytic bath solution at 4.2 to 4.4, the current density at 0.5 A / dm ² , and the temperature at 60 ° C. to 70 ° C. The color tone of the obtained minute parts 10 was a metallic color of gold, and the hardness was 100 to 200 Hv.
[Evaluation of roughening]
[Surface roughness Rz]

Using a cofocal laser microscope (Keyence Co., Ltd., shape measurement laser microscope VK-X250), a cofocal laser micrograph of the microsurface 10c of the roughened micropart 10 was taken, and the surface roughness Rz (μm) was taken. Was measured. As a method for measuring the surface roughness Rz, first, the micro surface 10c of the micro component 10 is observed at a magnification of 5000 times, and the surface profile of a rectangular region of 500 μm × 500 μm of the micro surface 10c has a depth resolution of 0.01 μm. After taking in under the conditions and performing image processing and performing one isolation point removal and one image brightness averaging, the maximum roughness Rz (μm) specified in JIS B0601-2001 was measured as a parameter.
[Cross-sectional shape]

Further, regarding the cross-sectional shape of the roughened minute surface 10c, the verticality of both ends of the minute surface 10c and the inclination of the entire bottom surface are confirmed, and it is visually observed whether or not there is sagging in any of the both ends. , When there was sagging, it was evaluated as "x", when there was some sagging, it was evaluated as "△", and when there was no sagging, it was evaluated as "○".
[Evaluation of plating film]
[Precipitability]

Regarding the precipitation property of the plating layer, the presence or absence of peeling, blisters, pinholes, etc. of the plating film on the minute surface 10c is visually confirmed with an optical microscope, and the unprecipitation of the entire plating layer is observed. , The case where there was a part of unprecipitated was evaluated as “Δ”, and the case where the entire surface was precipitated was evaluated as “◯”.
[Adhesion (adhesive strength)]

A copper plate imitating a semiconductor chip is attached to the minute surface 10c (about 1.5 mm x about 1.3 mm) of the gold-plated minute component 10 with an adhesive (Toagosei Co., Ltd. Aron Alpha), and a metal wire of φ0.3 mm is attached. The micro component 10 was pressed against the plating layer from below to above the opening 10d. Then, using a load displacement measuring device (manufactured by Imada Co., Ltd., load displacement measuring device SVH-1000N), a load is applied upward to the metal wire, the load and displacement are measured, and the change in the measured value is used. The breaking pressure was measured. The case where the breaking pressure was less than 20 MPa was evaluated as "x", the case where the breaking pressure was 20 MPa to 40 MPa was evaluated as "Δ", and the case where the breaking pressure exceeded 40 MPa was evaluated as "◯".

[Example 1]
In the above, the case where the masking plate 9 is provided and the processing time of the blast processing is set to 15.0 minutes is defined as Example 1.

[Example 2]
In the above, the case where the masking plate 9 is provided and the processing time of the blast processing is set to 7.5 minutes is referred to as Example 2.

[Comparative Example 1]
In the above, the case where the masking plate 9 is eliminated and the processing time of the blast processing is set to 15.0 minutes is referred to as Comparative Example 1.

[Comparative Example 2]
In the above, the case where the masking plate 9 is eliminated and the processing time of the blast processing is set to 0 minutes is referred to as Comparative Example 2.

[Comparative Example 3]
In the above, the case where the masking plate 9 is provided and the processing time of the blast processing is set to 30.0 minutes is referred to as Comparative Example 3.
[Evaluation results]

First, the cross-sectional shape was confirmed depending on the presence or absence of the masking plate 9. 11A is a linear scan of the laser micrograph of Example 1, FIG. 11B is a plan view of the laser micrograph of Example 1, and FIG. 11C is a cross-sectional surface profile of the laser micrograph of Example 1. FIG. 11C, the horizontal axis in FIG. 11C, corresponds to the cross-sectional surface profile scanned from above to below on the centerline in FIG. 11A. As shown in FIGS. 11A, 11B, and 11C, it is understood that in the first embodiment, only the minute surface is cleanly roughened.

FIG. 12A is a linear scanning photograph of the laser micrograph of Comparative Example 1, FIG. 12B is a plan photograph of the laser micrograph of Comparative Example 1, and FIG. 12C is a cross-sectional surface profile of the laser micrograph of Comparative Example 1. FIG. 12C, the horizontal axis in FIG. 12C, corresponds to the cross-sectional surface profile scanned from above to below on the centerline in FIG. 12A. As shown in FIGS. 12A, 12B, and 12C, it is understood that in Comparative Example 1, the entire upper surface other than the minute surface is roughened.

Next, the above-mentioned evaluation results are shown in FIG. As shown in FIG. 13, when the masking plate 9 is provided, the surface roughness Rz is appropriate and the cross-sectional shape is good when the processing times of Examples 1 and 2 are 7.5 minutes to 15.0 minutes. The plating layer had good precipitation and adhesion.

On the other hand, when the masking plate 9 was removed and the treatment time of Comparative Example 2 was 0 minutes, there was no surface roughness Rz, and the precipitation and adhesion of the plating layer were poor. Further, when the masking plate 9 is provided, when the processing time of Comparative Example 3 is 30.0 minutes, the surface roughness Rz is large, the cross-sectional shape is poor, and the precipitation and adhesion of the plating layer are not good enough. rice field. That is, in this case, the condition of surface roughness was simply bad.

Therefore, it was found that the presence of the masking plate 9 makes it possible to perform a plating process having a strong adhesion strength only on the minute surface of the minute part.

As shown in FIG. 11, in Example 1, since only the minute surface is cleanly roughened, the same effect can be obtained even with a surface treatment (coating, painting, etc.) other than the plating treatment. Have. For example, the same applies to the case where the minute surface of the bracket for orthodontic bracket is surface-treated to increase the adhesion strength with the teeth.

Further, in the first embodiment, the minute surface is the recess 10c, but the present invention is not limited to this, and the present invention may be performed on a part or all of the surface of the tip portion 10b of the minute component 10 without providing the recess 10c. From the principle, it has the same effect.

In the embodiment of the present invention, the micro component surface treatment system 2 is configured to include each part, but a program for realizing each part may be stored in a storage medium and the storage medium may be provided. It is also possible to provide the steps performed by each part as the method for roughening the surface of minute parts of the present invention.

Further, in the embodiment of the present invention, the micro component surface treatment system 2 is provided with a transfer process device 20, a surface roughening process device 21, and a surface treatment process device 22, and automatically performs from transfer to the micro component 10 to surface treatment. However, even if a part of the device is manually configured, the effect of the present invention can be obtained.

As described above, the micro component surface treatment system and the micro component surface treatment method according to the present invention are not only in the electrical and electronic fields using high-performance electronic components, but also in the industrial field where it is necessary to perform surface treatment on the micro surface of the micro components. It is useful as a micro component surface treatment system and a micro component surface treatment method capable of performing surface treatment with strong adhesive strength only on the micro surface of the micro component.

1 High-performance electronic parts 10 Micro parts 2 Micro parts surface treatment system 20 Transfer process equipment 21 Surface roughening process equipment 22 Surface treatment process equipment 201 Supply control unit 202 Swing vibration control unit 203 Transfer control unit 204 Masking control unit 205 Surface roughening Chemical control unit 206 Surface treatment control unit

Claims (5)

A supply control unit that supplies a plurality of minute parts to a transfer pallet provided with a plurality of alignment holes into which the minute parts can enter in only one direction.
The transfer pallet to which the plurality of minute parts are supplied is shaken and vibrated, the minute parts are put into the alignment holes of the transfer pallet, and the plurality of minute parts are aligned and oriented corresponding to the plurality of alignment holes. The pulsating vibration control unit and
Using the final pallet having the alignment holes aligned in the same manner as the alignment holes of the transfer pallet, a plurality of minute parts aligned and oriented in the alignment holes of the transfer pallet were transferred and transferred to the alignment holes of the final pallet. A transfer control unit that exposes the minute surface of the minute parts to be surface-treated from the alignment hole of the final pallet.
Using a masking plate having exposed holes aligned in the same manner as the aligned holes of the final pallet, the exposed holes of the masking plate are aligned with the minute surface of the micro component, and the masking plate is fixed to the final pallet. , The masking control unit that constitutes the surface roughening jig,
A surface roughening control unit that projects a processing material toward the masking plate of the surface roughening jig and roughens only the minute surface of the minute parts through the exposed holes of the masking plate.
Among the minute parts produced by disassembling the surface roughening jig, a surface treatment control unit that applies a surface treatment including a plating treatment to the roughened minute surface.
Micro component surface treatment system. The micropart is a cylinder having two or more different outer diameters from upper to lower in the axial direction, and has a microface on the upper surface of the tip portion having the smallest outer diameter.
The alignment hole of the transfer pallet has a first diameter equivalent to the maximum outer diameter of the micro component, and the diameter of the alignment hole is reduced downward from the first diameter to be described. It is a shape that has a second diameter equivalent to the minimum outer diameter of a small part.
The transfer control unit transfers a minute part of the alignment hole of the transfer pallet to the alignment hole of the final pallet via a transfer pallet having an alignment hole equal to the alignment hole of the transfer pallet. Item 1. The micro component surface treatment system according to Item 1. The minute parts are made of ceramics and are made of ceramics.
The surface treatment control unit performs a plating treatment on the minute parts to form a plating layer on the minute surface of the minute parts.
The micro component surface treatment system according to claim 1 or 2. The micro component surface treatment system according to any one of claims 1 to 3, wherein the surface roughening control unit performs shot blasting treatment toward the masking plate of the surface roughening jig. A supply control step for supplying a plurality of minute parts to a transfer pallet provided with a plurality of alignment holes into which the minute parts can enter in only one direction.
The transfer pallet to which the plurality of minute parts are supplied is shaken and vibrated, the minute parts are put into the alignment holes of the transfer pallet, and the plurality of minute parts are aligned and oriented corresponding to the plurality of alignment holes. The pulsating vibration control step to make
Using the final pallet having the alignment holes aligned in the same manner as the alignment holes of the transfer pallet, a plurality of minute parts aligned and oriented in the alignment holes of the transfer pallet were transferred and transferred to the alignment holes of the final pallet. A transfer control step that exposes the minute surface of the minute parts to be surface-treated from the alignment hole of the final pallet.
Using a masking plate having exposed holes aligned in the same manner as the aligned holes of the final pallet, the exposed holes of the masking plate are aligned with the minute surface of the micro component, and the masking plate is fixed to the final pallet. , Masking control steps that make up the surface roughening jig,
A surface roughening control step of projecting a processing material toward the masking plate of the surface roughening jig and roughening only the minute surface of the minute parts through the exposed holes of the masking plate.
A surface treatment control step of applying a surface treatment including a plating treatment to the roughened minute surface among the minute parts produced by disassembling the surface roughening jig.
Micro component surface treatment method.

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