JP6983579B2 - Temperature sensor - Google Patents

Temperature sensor Download PDF

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JP6983579B2
JP6983579B2 JP2017162608A JP2017162608A JP6983579B2 JP 6983579 B2 JP6983579 B2 JP 6983579B2 JP 2017162608 A JP2017162608 A JP 2017162608A JP 2017162608 A JP2017162608 A JP 2017162608A JP 6983579 B2 JP6983579 B2 JP 6983579B2
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resin
thermistor
temperature
heat collecting
temperature sensor
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JP2019039834A (en
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彬宜 坂本
勇蔵 山下
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Semitec Corp
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Semitec Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Secondary Cells (AREA)

Description

本発明は、例えば車載バッテリのセルの温度検出等に用いられる温度センサに関するものである。 The present invention relates to a temperature sensor used, for example, for detecting the temperature of a cell of an in-vehicle battery.

従来より、ハイブリッド自動車や電気自動車などに搭載されるバッテリは、高電圧を得るために複数のバッテリセルが直列に接続されて構成されている。このようなバッテリは、過充電、過放電を防止するために、バッテリセルに温度センサが装着されて温度監視が行われている。 Conventionally, a battery mounted on a hybrid vehicle, an electric vehicle, or the like is configured by connecting a plurality of battery cells in series in order to obtain a high voltage. In such a battery, a temperature sensor is attached to the battery cell to monitor the temperature in order to prevent overcharging and overdischarging.

上述した温度センサとして、例えば、特許文献１，２に開示されたものがある。この温度センサは、サーミスタと、金属部品の集熱部と、これらと一体に設けられた合成樹脂部と、を備えており、インサート成形により得られるものである。前記合成樹脂部は、サーミスタと集熱部との間に充填されてこれらを絶縁する部分と、集熱部とサーミスタの周囲を覆った部分と、バッテリ上面に固定されたモジュール部品に係止する一対の係止部と、を備えている。 As the temperature sensor described above, for example, there is one disclosed in Patent Documents 1 and 2. This temperature sensor includes a thermistor, a heat collecting portion of a metal part, and a synthetic resin portion provided integrally with the thermistor, and is obtained by insert molding. The synthetic resin portion is locked to a portion that is filled between the thermistor and the heat collecting portion to insulate them, a portion that covers the heat collecting portion and the thermistor, and a module component fixed to the upper surface of the battery. It is provided with a pair of locking portions.

特開２０１１−１７６３８号公報Japanese Unexamined Patent Publication No. 2011-17638 特開２００９−２５０７６８号公報Japanese Unexamined Patent Publication No. 2009-250768

上述した特許文献１，２に開示された温度センサにおいては、係止部にバネ性が必要なため、合成樹脂部にバネ性の高い合成樹脂を使用していた。しかしながら、バネ性の高い合成樹脂は一般に熱伝導率が低いため、集熱部からサーミスタへの熱伝導率を高くできず、温度センサの測温性能向上には不利であった。 In the temperature sensors disclosed in Patent Documents 1 and 2 described above, since the locking portion requires a spring property, a synthetic resin having a high spring property is used for the synthetic resin portion. However, since the synthetic resin having high springiness generally has a low thermal conductivity, the thermal conductivity from the heat collecting portion to the thermistor cannot be increased, which is disadvantageous for improving the temperature measurement performance of the temperature sensor.

そこで、本発明は、係止部のバネ性を確保しつつ測温性能を高めることができる温度センサを提供することを目的とする。 Therefore, an object of the present invention is to provide a temperature sensor capable of improving the temperature measurement performance while ensuring the springiness of the locking portion.

本発明の温度センサは、一対のリードを有するサーミスタ、被測温部に接触する接触面を有する金属製の集熱部、及び、前記サーミスタと前記集熱部との間に介在した第１樹脂部で構成されたサーミスタ感温部と、前記サーミスタ感温部の周囲に配置された覆い部、及び、前記被側温部に前記接触面の少なくとも一部が接触するように係止する弾性を有する係止部を有する第２樹脂部と、を備え、前記第１樹脂部の材料は、前記第２樹脂部の材料よりも熱伝導率が高く、前記集熱部が突起部を有するコの字形状であることを特徴とする。
本発明の温度センサは、一対のリードを有するサーミスタ、被測温部に接触する接触面を有する金属製の集熱部、及び、前記サーミスタと前記集熱部との間に介在した第１樹脂部で構成されたサーミスタ感温部と、前記サーミスタ感温部の周囲に配置された覆い部、及び、前記被側温部に前記接触面の少なくとも一部が接触するように係止する弾性を有する係止部を有する第２樹脂部と、を備え、前記第１樹脂部の材料は、前記第２樹脂部の材料よりも熱伝導率が高く、前記サーミスタが、絶縁被覆と前記集熱部が接触しない状態で、前記第１樹脂部で絶縁されている二重絶縁構造を持つことを特徴とする。 The temperature sensor of the present invention has a thermistor having a pair of leads, a metal heat collecting portion having a contact surface in contact with a temperature-measured portion, and a first resin interposed between the thermistor and the heat collecting portion. The elasticity of locking the thermistor temperature-sensitive portion composed of the portions, the covering portion arranged around the thermistor temperature-sensitive portion, and the side temperature portion so that at least a part of the contact surface comes into contact with the temperature-sensitive portion. and a second resin portion having a locking portion with the material of the first resin portion, the thermal conductivity rather higher than the material of the second resin portion, co of the heat collector has a protruding part It is characterized by having a shape of .
The temperature sensor of the present invention has a thermistor having a pair of leads, a metal heat collecting portion having a contact surface in contact with a temperature-measured portion, and a first resin interposed between the thermistor and the heat collecting portion. The elasticity of locking the thermistor temperature-sensitive portion composed of the portions, the covering portion arranged around the thermistor temperature-sensitive portion, and the side temperature portion so that at least a part of the contact surface comes into contact with the temperature-sensitive portion. A second resin portion having a locking portion is provided, and the material of the first resin portion has a higher thermal conductivity than the material of the second resin portion, and the thermistor has an insulating coating and the heat collecting portion. It is characterized by having a double insulating structure insulated by the first resin portion in a state where the heat is not contacted.

本発明によれば、サーミスタと集熱部との間に熱伝導率が高い第１樹脂部を介在させて集熱部からサーミスタへの熱伝導率を高め、かつ、これらの周囲に第１樹脂部よりも熱伝導率が低い覆い部を配置して断熱性を高めることにより、測温性能を高めることができる。また、熱伝導率が高い材料で第１樹脂部を構成し、バネ性が高く第１樹脂部よりも熱伝導率が低い材料で第２樹脂部を構成することが可能となるので、係止部のバネ性を確保しつつ測温性能を高めることができる。 According to the present invention, a first resin portion having a high thermal conductivity is interposed between the thermista and the heat collecting portion to increase the thermal conductivity from the heat collecting portion to the thermista, and the first resin is surrounded by the first resin portion. By arranging a covering portion having a lower thermal conductivity than the portion to improve the heat insulating property, the temperature measurement performance can be improved. Further, since it is possible to form the first resin portion with a material having a high thermal conductivity and to form the second resin portion with a material having a high springiness and a lower thermal conductivity than the first resin portion, the locking can be performed. It is possible to improve the temperature measurement performance while ensuring the springiness of the part.

本発明の第１の実施形態にかかる温度センサの斜視図である。It is a perspective view of the temperature sensor which concerns on 1st Embodiment of this invention. 図１の温度センサを構成するサーミスタ及び集熱部の斜視図である。It is a perspective view of the thermistor and a heat collecting part which make up the temperature sensor of FIG. 図２のサーミスタと集熱部との間に第１樹脂部が充填された状態を示す側面図である。It is a side view which shows the state which the 1st resin part was filled between the thermistor of FIG. 2 and a heat collecting part. 図１の温度センサの側面図である。It is a side view of the temperature sensor of FIG. 図１の温度センサがバッテリセルの上面に設置された状態を示す断面図である。It is sectional drawing which shows the state which the temperature sensor of FIG. 1 is installed on the upper surface of a battery cell. 本発明の第２の実施形態にかかる温度センサの分解図である。It is an exploded view of the temperature sensor which concerns on the 2nd Embodiment of this invention.

本発明の第１の実施形態にかかる温度センサについて、図１〜５を参照して説明する。図１に示す温度センサ１は、ハイブリッド自動車や電気自動車に搭載されるバッテリのセルの温度検出に用いられるものであり、例えば、図５に示すように、バッテリセル２００の上面（被測温部に相当する）２００ａに設置される。このバッテリセル２００の上面２００ａには、樹脂製プレート２０１が取り付けられている。樹脂製プレート２０１については後述する。 The temperature sensor according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 5. The temperature sensor 1 shown in FIG. 1 is used for temperature detection of a battery cell mounted on a hybrid vehicle or an electric vehicle. For example, as shown in FIG. 5, the upper surface (temperature-measured portion) of the battery cell 200 is used. It is installed in 200a (corresponding to). A resin plate 201 is attached to the upper surface 200a of the battery cell 200. The resin plate 201 will be described later.

温度センサ１は、サーミスタ５と、集熱部８と、サーミスタ５と集熱部８との間に介在した第１樹脂部３と、これらと一体化された第２樹脂部７と、サーミスタ５に電気接続された一対の電線６と、を備えている。 The temperature sensor 1 includes a thermistor 5, a heat collecting section 8, a first resin section 3 interposed between the thermistor 5 and the heat collecting section 8, a second resin section 7 integrated with the thermistor 5, and the thermistor 5. It is provided with a pair of electric wires 6 electrically connected to the above.

サーミスタ５は、図２に示すように、抵抗体がエポキシ樹脂等の絶縁被覆５３で覆われた素子部５１と、素子部５１から突出した一対のリード５２と、を備えている。一対のリード５２は、一対の電線６の芯線と、それぞれ接合されている。また、リード５２と電線６の芯線との接合箇所は、熱収縮チューブ４で覆われている。 As shown in FIG. 2, the thermistor 5 includes an element portion 51 in which a resistor is covered with an insulating coating 53 such as an epoxy resin, and a pair of leads 52 protruding from the element portion 51. The pair of leads 52 are joined to the core wires of the pair of electric wires 6, respectively. Further, the joint portion between the lead 52 and the core wire of the electric wire 6 is covered with the heat shrink tube 4.

集熱部８は、金属板にプレス加工が施されて得られるものである。集熱部８は、図２に示すように、長方形板状の底壁８１と、底壁８１の対向する長辺それぞれから同じ方向に立設した一対の側壁８２と、一方の側壁８２の幅方向両端部から突出した一対の突起部８３と、を備えたコの字形状となっている。底壁８１の下面は平面であり、当該下面は、バッテリセル２００の上面２００ａに面接触する。以下、底壁８１を接触面８１と称する（正確には、底壁８１の下面が接触面である）。 The heat collecting unit 8 is obtained by pressing a metal plate. As shown in FIG. 2, the heat collecting portion 8 has a rectangular plate-shaped bottom wall 81, a pair of side walls 82 erected in the same direction from the opposite long sides of the bottom wall 81, and the width of one side wall 82. It has a U-shape with a pair of protrusions 83 protruding from both ends in the direction. The lower surface of the bottom wall 81 is a flat surface, and the lower surface is in surface contact with the upper surface 200a of the battery cell 200. Hereinafter, the bottom wall 81 is referred to as a contact surface 81 (to be exact, the lower surface of the bottom wall 81 is a contact surface).

図２，３に示すように、サーミスタ５は、素子部５１が一対の側壁８２間に配置され、一対のリード５２が一対の側壁よりも上側に配置されている。また、素子部５１は、絶縁のために、接触面（底壁）８１及び一対の側壁８２と間隔をあけて配置されている。 As shown in FIGS. 2 and 3, in the thermistor 5, the element portion 51 is arranged between the pair of side walls 82, and the pair of leads 52 are arranged above the pair of side walls. Further, the element portion 51 is arranged at a distance from the contact surface (bottom wall) 81 and the pair of side walls 82 for insulation.

第１樹脂部３は、集熱部８とサーミスタ５の素子部５１との間（一対の側壁８２間）に隙間なく充填されており、集熱部８とサーミスタ５とを絶縁している。このように、温度センサ１は、サーミスタ５が、素子部５１の絶縁被覆５３と集熱部８が接触しない状態で、第１樹脂部３で絶縁されている二重絶縁構造を有している。即ち、サーミスタ５は、素子部５１の導電部位（例えば、チップ、電極、該電極とリード５２とを接続したはんだ等）が絶縁被覆５３で覆われて絶縁されている上に、絶縁被覆５３の周りがさらに第１樹脂部３で絶縁された二重絶縁構造を有している。この二重絶縁構造により、集熱部８とサーミスタ５とを確実に絶縁することができる。第１樹脂部３は、集熱部８と素子部５１が挿入された成形金型内に溶融状態で射出された後、硬化されて集熱部８及びサーミスタ５と一体化されている。このように一まとまりに成形された集熱部８、サーミスタ５及び第１樹脂部３を、「サーミスタ感温部２」と称する。 The first resin portion 3 is filled tightly between the heat collecting portion 8 and the element portion 51 of the thermistor 5 (between the pair of side walls 82), and insulates the heat collecting portion 8 and the thermistor 5. As described above, the temperature sensor 1 has a double insulating structure in which the thermistor 5 is insulated by the first resin portion 3 in a state where the insulating coating 53 of the element portion 51 and the heat collecting portion 8 do not come into contact with each other. .. That is, in the thermistor 5, the conductive portion of the element portion 51 (for example, a chip, an electrode, a solder connecting the electrode and the lead 52, etc.) is covered with an insulating coating 53 to be insulated, and the insulating coating 53 is provided. It has a double insulating structure in which the periphery is further insulated by the first resin portion 3. With this double insulation structure, the heat collecting portion 8 and the thermistor 5 can be reliably insulated. The first resin portion 3 is injected in a molten state into a molding die into which the heat collecting portion 8 and the element portion 51 are inserted, and then is cured to be integrated with the heat collecting portion 8 and the thermistor 5. The heat collecting section 8, thermistor 5, and the first resin section 3 thus integrally molded are referred to as "thermistor temperature sensitive section 2".

本実施形態では、第１樹脂部３が、ポリアセタール樹脂と絶縁性の酸化アルミニウム粉末とを含んだポリアセタール樹脂組成物で構成されている。ポリアセタール樹脂は、単体では、熱伝導率が０．２Ｗ／ｍ・ｋ程度であるが、酸化アルミニウム粉末が添加されることにより熱伝導率が高くなる。本実施形態の第１樹脂部３は、熱伝導率が０．７Ｗ／ｍ・ｋ程度となる配合でポリアセタール樹脂と粉末状の酸化アルミニウムとを含んだポリアセタール樹脂組成物で構成されている。 In the present embodiment, the first resin portion 3 is composed of a polyacetal resin composition containing a polyacetal resin and an insulating aluminum oxide powder. The polyacetal resin alone has a thermal conductivity of about 0.2 W / m · k, but the addition of aluminum oxide powder increases the thermal conductivity. The first resin portion 3 of the present embodiment is composed of a polyacetal resin composition containing a polyacetal resin and powdered aluminum oxide in a composition having a thermal conductivity of about 0.7 W / m · k.

第２樹脂部７は、図１に示すように、覆い部７０と、弾性変形自在な一対の把持部７２と、弾性変形自在な一対の係止部７１と、を一体に有している。上記サーミスタ感温部２は、インサート成形によって第２樹脂部７と一体化されている。また、上述したように、集熱部８は、側壁８２の幅方向両端部から突出した一対の突起部８３を備えている。このことにより、第２樹脂部７からサーミスタ感温部２が抜けることを防止できる。また、本実施形態の第２樹脂部７は、離型性の良いポリアセタール樹脂で構成されていることから、集熱部８に突起部８３を設けることは、第２樹脂部７からサーミスタ感温部２が抜けることを防止する上で特に有効である。 As shown in FIG. 1, the second resin portion 7 integrally has a covering portion 70, a pair of elastically deformable grip portions 72, and a pair of elastically deformable locking portions 71. The thermistor temperature sensitive portion 2 is integrated with the second resin portion 7 by insert molding. Further, as described above, the heat collecting portion 8 includes a pair of protruding portions 83 protruding from both ends in the width direction of the side wall 82. This makes it possible to prevent the thermistor temperature sensitive portion 2 from coming off from the second resin portion 7. Further, since the second resin portion 7 of the present embodiment is made of a polyacetal resin having good releasability, providing the protrusion 83 on the heat collecting portion 8 is a thermistor temperature sensitive from the second resin portion 7. It is particularly effective in preventing the portion 2 from coming off.

覆い部７０は、サーミスタ５の素子部５１、第１樹脂部３、集熱部８の周囲に配置された部位であり、外形がブロック状に形成されている。サーミスタ５の一対のリード５２は、覆い部７０の上面から突出している。図１，４に示すように、覆い部７０の底部においては、集熱部８の接触面８１が露出している。 The covering portion 70 is a portion arranged around the element portion 51, the first resin portion 3, and the heat collecting portion 8 of the thermistor 5, and the outer shape is formed in a block shape. The pair of leads 52 of the thermistor 5 project from the upper surface of the covering portion 70. As shown in FIGS. 1 and 4, the contact surface 81 of the heat collecting portion 8 is exposed at the bottom of the covering portion 70.

一対の把持部７２は、覆い部７０の上面から接触面８１と反対側に延びている。一対の把持部７２は、一対の係止部７１を図５に示す樹脂製プレート２０１等に係止させる際に把持する部位であり、一対の把持部７２を互いに近付けるように把持することで、一対の係止部７１の間隔を狭めることができる。 The pair of grip portions 72 extend from the upper surface of the covering portion 70 to the side opposite to the contact surface 81. The pair of gripping portions 72 are portions to be gripped when the pair of locking portions 71 are locked to the resin plate 201 or the like shown in FIG. 5, and by gripping the pair of gripping portions 72 so as to be close to each other. The distance between the pair of locking portions 71 can be narrowed.

一対の係止部７１は、接触面８１をバッテリセル２００の上面２００ａに接触させた状態を維持するための部位である。各係止部７１は、各把持部７２の中央部から接触面８１側に延び、接触面８１と反対側に折り返されたＶの字形状となっている。一対の係止部７１は、例えば、図５に示す樹脂製プレート２０１のセンサ係止部２０３に係止することにより、バッテリセル２００の上面２００ａに間接的に係止する。センサ係止部２０３は、樹脂製プレート２０１に形成されたセンサ収容穴２０２の上端開口を狭めるように設けられており、係止部７１の先端部をバッテリセル２００側に押さえ込む。この状態において、係止部７１の弾性復元力によって接触面８１とバッテリセル２００の上面２００ａとの密着状態が維持されている。また、係止部は、前述した構成に限定されるものではなく、弾性を有し、被側温部に接触面８１の少なくとも一部が接触するように、被側温部に直接的又は間接的に係止する構成であればよい。 The pair of locking portions 71 are portions for maintaining a state in which the contact surface 81 is in contact with the upper surface 200a of the battery cell 200. Each locking portion 71 has a V-shape extending from the central portion of each grip portion 72 toward the contact surface 81 and folded back to the side opposite to the contact surface 81. The pair of locking portions 71 are indirectly locked to the upper surface 200a of the battery cell 200 by, for example, locking to the sensor locking portion 203 of the resin plate 201 shown in FIG. The sensor locking portion 203 is provided so as to narrow the upper end opening of the sensor accommodating hole 202 formed in the resin plate 201, and presses the tip end portion of the locking portion 71 toward the battery cell 200 side. In this state, the contact surface 81 and the upper surface 200a of the battery cell 200 are maintained in close contact with each other by the elastic restoring force of the locking portion 71. Further, the locking portion is not limited to the above-mentioned configuration, has elasticity, and is directly or indirectly contacted with the heated portion so that at least a part of the contact surface 81 comes into contact with the heated portion. Any configuration may be used as long as it can be locked.

本実施形態では、第２樹脂部７が、ポリアセタール樹脂（単体）で構成されている。当該ポリアセタール樹脂は、熱伝導率が、第１樹脂部３を構成するポリアセタール樹脂組成物よりも低い０．２Ｗ／ｍ・ｋ程度である。当該ポリアセタール樹脂は、接触面８１をバッテリセル２００の上面２００ａに確実に面接触させるのに必要なバネ性を係止部７１に持たせることができる。 In the present embodiment, the second resin portion 7 is made of a polyacetal resin (single substance). The polyacetal resin has a thermal conductivity of about 0.2 W / m · k, which is lower than that of the polyacetal resin composition constituting the first resin portion 3. The polyacetal resin can provide the locking portion 71 with the springiness necessary to ensure that the contact surface 81 is in surface contact with the upper surface 200a of the battery cell 200.

上述した温度センサ１を成形する際は、予め、上述したようにサーミスタ感温部２を成形しておき、このサーミスタ感温部２を第２樹脂部７の成形金型内に挿入し、第２樹脂部７を成形する。そして、一対の電線６を一対のリード５２にそれぞれ接合して、接合箇所を熱収縮チューブ４で覆う。このような工程を経て温度センサ１が得られる。 When molding the temperature sensor 1 described above, the thermistor temperature sensitive portion 2 is molded in advance as described above, and the thermistor temperature sensitive portion 2 is inserted into the molding mold of the second resin portion 7 to form a second. 2 Mold the resin part 7. Then, the pair of electric wires 6 are joined to the pair of leads 52, respectively, and the joined portion is covered with the heat shrink tube 4. The temperature sensor 1 is obtained through such a process.

上記構成の温度センサ１は、素子部５１と集熱部８との間に熱伝導率が高い第１樹脂部３が介在していることにより、集熱部８から素子部５１への熱伝導率が高められている。さらに、これらの周囲に第１樹脂部３よりも熱伝導率が低い覆い部７０が配置されていることにより、断熱性（外部への放熱を抑える）が高められている。これらのことにより、測温性能が高められている。 In the temperature sensor 1 having the above configuration, the first resin portion 3 having a high thermal conductivity is interposed between the element portion 51 and the heat collecting portion 8, so that the heat conduction from the heat collecting portion 8 to the element portion 51 The rate is increasing. Further, by arranging the covering portion 70 having a thermal conductivity lower than that of the first resin portion 3 around them, the heat insulating property (suppressing heat dissipation to the outside) is enhanced. As a result, the temperature measurement performance is enhanced.

また、温度センサ１は、第１樹脂部３と第２樹脂部７を異なる材料で２回に分けて成形する構成が採用されているので、熱伝導率が高い材料で第１樹脂部３を構成し、バネ性が高く第１樹脂部３よりも熱伝導率が低い材料で第２樹脂部７を構成することできる。よって、係止部７１のバネ性を確保しつつ測温性能を高めることができる。 Further, since the temperature sensor 1 adopts a configuration in which the first resin portion 3 and the second resin portion 7 are molded by different materials in two steps, the first resin portion 3 is made of a material having high thermal conductivity. The second resin portion 7 can be made of a material having a high springiness and a lower thermal conductivity than the first resin portion 3. Therefore, the temperature measurement performance can be improved while ensuring the springiness of the locking portion 71.

本発明の第２の実施形態にかかる温度センサについて、図６を参照して説明する。図６において、前述した第１の実施形態と同一構成部分には同一符号を付して説明を省略する。 The temperature sensor according to the second embodiment of the present invention will be described with reference to FIG. In FIG. 6, the same components as those of the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

前述した第１の実施形態の温度センサ１は、予め成形されたサーミスタ感温部２が２回目のインサート成形によって第２樹脂部７と一体化されて温度センサ１を構成していた。一方、本実施形態の図６に示す温度センサ１０１は、サーミスタ感温部１０２と第２樹脂部１０７とが別々に成形された後に互いに組み付けられて温度センサ１０１を構成する。 In the temperature sensor 1 of the first embodiment described above, the thermistor temperature sensitive portion 2 molded in advance is integrated with the second resin portion 7 by the second insert molding to form the temperature sensor 1. On the other hand, in the temperature sensor 101 shown in FIG. 6 of the present embodiment, the thermistor temperature sensitive portion 102 and the second resin portion 107 are separately molded and then assembled with each other to form the temperature sensor 101.

サーミスタ感温部１０２は、第１樹脂部１０３に係止突起３５が設けられていること以外は、第１の実施形態の第１樹脂部３と同一構成である。第２樹脂部１０７は、サーミスタ感温部１０２と別体で成形されていることと、覆い部７０に上記係止突起３５と係合する係止孔７５が設けられていること以外は、第１の実施形態の第１樹脂部７と同一構成である。これらサーミスタ感温部１０２と第２樹脂部１０７は、図６に示すように、サーミスタ感温部１０２の下半部を覆い部７０の内側に挿入し、係止突起３５を係止孔７５に係合させることにより互いに組み付けられる。 The thermistor temperature sensitive unit 102 has the same configuration as the first resin unit 3 of the first embodiment, except that the first resin unit 103 is provided with a locking projection 35. The second resin portion 107 is a second resin portion, except that the second resin portion 107 is formed separately from the thermistor temperature sensitive portion 102 and the covering portion 70 is provided with a locking hole 75 that engages with the locking projection 35. It has the same configuration as the first resin portion 7 of the first embodiment. As shown in FIG. 6, the thermistor temperature-sensitive portion 102 and the second resin portion 107 insert the lower half portion of the thermistor temperature-sensitive portion 102 inside the covering portion 70, and insert the locking projection 35 into the locking hole 75. They are assembled to each other by engaging.

上記構成の温度センサ１０１は、素子部５１（図３を参照）と集熱部８との間に熱伝導率が高い第１樹脂部１０３が介在していることにより、集熱部８から素子部５１への熱伝導率が高められている。さらに、これらの周囲に第１樹脂部１０３よりも熱伝導率が低い覆い部７０が配置されていることにより、断熱性（外部への放熱を抑える）が高められている。これらのことにより、測温性能が高められている。 In the temperature sensor 101 having the above configuration, the first resin portion 103 having high thermal conductivity is interposed between the element portion 51 (see FIG. 3) and the heat collecting portion 8, so that the element is connected to the heat collecting portion 8 to the element. The thermal conductivity to the portion 51 is increased. Further, by arranging the covering portion 70 having a thermal conductivity lower than that of the first resin portion 103 around them, the heat insulating property (suppressing heat dissipation to the outside) is enhanced. As a result, the temperature measurement performance is enhanced.

また、温度センサ１０１は、第１樹脂部１０３と第２樹脂部１０７を別体で成形する構成が採用されているので、熱伝導率が高い材料で第１樹脂部１０３を構成し、バネ性が高く第１樹脂部１０３よりも熱伝導率が低い材料で第２樹脂部１０７を構成することできる。よって、係止部７１のバネ性を確保しつつ測温性能を高めることができる。 Further, since the temperature sensor 101 adopts a configuration in which the first resin portion 103 and the second resin portion 107 are molded separately, the first resin portion 103 is made of a material having high thermal conductivity and has a spring property. The second resin portion 107 can be made of a material having a high thermal conductivity and a lower thermal conductivity than the first resin portion 103. Therefore, the temperature measurement performance can be improved while ensuring the springiness of the locking portion 71.

上述した第１の実施形態では、集熱部８及びサーミスタ５がインサート成形によって第１樹脂部３と一体化されていたが、素子部５１の周囲に第１樹脂部３を成形し、成形後の第１樹脂部３に集熱部８を組み付け、これらをインサート成形によって第２樹脂部７と一体化してもよい。 In the above-mentioned first embodiment, the heat collecting portion 8 and the thermistor 5 are integrated with the first resin portion 3 by insert molding, but the first resin portion 3 is molded around the element portion 51 and after molding. The heat collecting portion 8 may be assembled to the first resin portion 3 of the above, and these may be integrated with the second resin portion 7 by insert molding.

上述した第１の実施形態では、第１樹脂部３を構成するポリアセタール樹脂に酸化アルミニウムを添加することで第１樹脂部３の熱伝導率を第２樹脂部７よりも高くしていたが、「第１樹脂部」及び「第２樹脂部」はこれに限定されるものではない。例えば、第１樹脂部をエポキシ樹脂単体で構成し、第２樹脂部をポリアセタール樹脂単体で構成してもよい。また、第１樹脂部を構成する樹脂に、酸化アルミニウム以外のフィラーを添加してもよい。このフィラーとして好ましいのは、絶縁性かつ高熱伝導率のものであり、具体的には、窒化アルミニウム、シリカ、酸化マグネシウム等の絶縁性セラミックスである。上述した何れの材料を用いる場合においても、第１樹脂部の材料の熱伝導率が第２樹脂部の材料よりも高く、かつ、集熱部の接触面を被測温部に接触させるのに必要なバネ性を係止部に持たせることができればよい。 In the first embodiment described above, the thermal conductivity of the first resin portion 3 is made higher than that of the second resin portion 7 by adding aluminum oxide to the polyacetal resin constituting the first resin portion 3. The "first resin portion" and the "second resin portion" are not limited to this. For example, the first resin portion may be composed of an epoxy resin alone, and the second resin portion may be composed of a polyacetal resin alone. Further, a filler other than aluminum oxide may be added to the resin constituting the first resin portion. The filler is preferably insulating and has high thermal conductivity, and specifically, insulating ceramics such as aluminum nitride, silica, and magnesium oxide. In any of the above-mentioned materials, the thermal conductivity of the material of the first resin portion is higher than that of the material of the second resin portion, and the contact surface of the heat collecting portion is brought into contact with the temperature-measured portion. It suffices if the locking portion can have the required springiness.

尚、前述した実施形態は本発明の代表的な形態を示したに過ぎず、本発明は、この実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。かかる変形によってもなお本発明の構成を具備する限り、勿論、本発明の範疇に含まれるものである。 It should be noted that the above-described embodiment merely shows a typical embodiment of the present invention, and the present invention is not limited to this embodiment. That is, it can be variously modified and carried out within a range that does not deviate from the gist of the present invention. As long as the configuration of the present invention is still provided even by such a modification, it is, of course, included in the category of the present invention.

１，１０１ 温度センサ
３，１０３ 第１樹脂部
５ サーミスタ
７，１０７ 第２樹脂部
８ 集熱部
７０ 覆い部
７１ 係止部
８１ 接触面 1,101 Temperature sensor 3,103 1st resin part 5 Thermistor 7,107 2nd resin part 8 Heat collecting part 70 Covering part 71 Locking part 81 Contact surface

Claims (7)

一対のリードを有するサーミスタ、被測温部に接触する接触面を有する金属製の集熱部、及び、前記サーミスタと前記集熱部との間に介在した第１樹脂部で構成されたサーミスタ感温部と、
前記サーミスタ感温部の周囲に配置された覆い部、及び、前記被側温部に前記接触面の少なくとも一部が接触するように係止する弾性を有する係止部を有する第２樹脂部と、を備え、
前記第１樹脂部の材料は、前記第２樹脂部の材料よりも熱伝導率が高く、
前記集熱部が突起部を有するコの字形状である
ことを特徴とする温度センサ。 A thermistor feeling composed of a thermistor having a pair of leads, a metal heat collecting part having a contact surface in contact with a temperature-measured part, and a first resin part interposed between the thermistor and the heat collecting part. Wenbe and
A cover portion arranged around the thermistor temperature sensitive portion, and a second resin portion having an elastic locking portion that locks the contact surface to the temperature-sensitive portion so that at least a part of the contact surface comes into contact with the temperature-sensitive portion. , Equipped with
The material of the first resin part has a thermal conductivity of rather higher than the material of the second resin portion,
A temperature sensor characterized in that the heat collecting portion has a U-shape having a protrusion. 一対のリードを有するサーミスタ、被測温部に接触する接触面を有する金属製の集熱部、及び、前記サーミスタと前記集熱部との間に介在した第１樹脂部で構成されたサーミスタ感温部と、 A thermistor feeling composed of a thermistor having a pair of leads, a metal heat collecting part having a contact surface in contact with a temperature-measured part, and a first resin part interposed between the thermistor and the heat collecting part. Wenbe and
前記サーミスタ感温部の周囲に配置された覆い部、及び、前記被側温部に前記接触面の少なくとも一部が接触するように係止する弾性を有する係止部を有する第２樹脂部と、を備え、 A cover portion arranged around the thermistor temperature sensitive portion, and a second resin portion having an elastic locking portion that locks the contact surface to the temperature-sensitive portion so that at least a part of the contact surface comes into contact with the temperature-sensitive portion. , Equipped with
前記第１樹脂部の材料は、前記第２樹脂部の材料よりも熱伝導率が高く、 The material of the first resin portion has a higher thermal conductivity than the material of the second resin portion.
前記サーミスタが、絶縁被覆と前記集熱部が接触しない状態で、前記第１樹脂部で絶縁されている二重絶縁構造を持つ The thermistor has a double insulating structure that is insulated by the first resin portion in a state where the insulating coating and the heat collecting portion do not come into contact with each other.
ことを特徴とする温度センサ。 A temperature sensor characterized by that. 前記サーミスタが、絶縁被覆と前記集熱部が接触しない状態で、前記第１樹脂部で絶縁されている二重絶縁構造を持つ
ことを特徴とする請求項１に記載の温度センサ。 The temperature sensor according to claim 1 , wherein the thermistor has a double insulating structure insulated by the first resin portion in a state where the insulating coating and the heat collecting portion do not come into contact with each other. 前記サーミスタ感温部が、インサート成形によって前記第２樹脂部と一体化されている
ことを特徴とする請求項１〜３の何れか１項に記載の温度センサ。 The temperature sensor according to any one of claims 1 to 3, wherein the thermistor temperature sensitive portion is integrated with the second resin portion by insert molding. 前記サーミスタ感温部が、これらと別体の前記第２樹脂部に組み付けられている
ことを特徴とする請求項１〜３の何れか１項に記載の温度センサ。 The temperature sensor according to any one of claims 1 to 3, wherein the thermistor temperature sensitive portion is assembled to the second resin portion separately from these. 前記接触面が平面である
ことを特徴とする請求項１〜５の何れか１項に記載の温度センサ。 The temperature sensor according to any one of claims 1 to 5 , wherein the contact surface is a flat surface. 前記係止部がＶの字形状である
ことを特徴とする請求項１〜６の何れか１項に記載の温度センサ。 The temperature sensor according to any one of claims 1 to 6 , wherein the locking portion has a V shape.
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