JP6982414B2 - 非解放型サーモパイル赤外線センサ及びその製造方法 - Google Patents
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Description
Claims (21)
- 非解放型サーモパイル赤外線センサであって、
底面及び上面を有する基板と、
前記基板の前記上面の少なくとも一部上に配置された熱絶縁材であって、底面及び上面を有する、熱絶縁材と、
前記熱絶縁材の前記上面の少なくとも一部上に配置された極薄材料とを備え、
前記熱絶縁材は、450℃までの温度で安定性を有し、
前記極薄材料は、200nm以下の厚さを有する材料から選択され、かつ450℃より高い堆積温度を必要とする、非解放型サーモパイル赤外線センサ。 - 前記熱絶縁材は、パリレン、ベンゾシクロブテン(BCB)、非晶質フルオロポリマー、ポリ(メチルメタクリレート)、SU−8フォトレジスト及び他のポリマーから選択される、請求項1に記載の非解放型サーモパイル赤外線センサ。
- 前記極薄材料は、2D材料を含む、請求項1に記載の非解放型サーモパイル赤外線センサ。
- 前記極薄材料は、グラフェン、MoS2、SnSe、黒リン(BP)、ポリシリコン、SiGe(シリコンゲルマニウム)、Ge(ゲルマニウム)、窒化ホウ素(BN)、III−V族化合物半導体、II−VI族化合物半導体及びその組み合わせから成る群から選択される、請求項3に記載の非解放型サーモパイル赤外線センサ。
- 前記熱絶縁材の前記上面の少なくとも別の一部上に配置された第二極薄材料をさらに備える、請求項1に記載の非解放型サーモパイル赤外線センサ。
- 前記基板は、シリコンウェーハ、CMOSウェーハ、プリント基板、又は、450℃を超える温度で不安定である可撓性基板から選択される、請求項1に記載の非解放型サーモパイル赤外線センサ。
- 非解放型サーモパイル赤外線センサであって、
2D材料型センサと基板との間に配置されたパリレン材料を備え、前記パリレン材料は、450℃までの温度で安定性を有し、前記2D材料は、450℃より高い堆積温度を必要とする、非解放型サーモパイル赤外線センサ。 - 前記基板は、シリコンウェーハ、CMOSウェーハ、プリント基板、又は、450℃を超える温度で不安定である可撓性基板から選択される、請求項7に記載の非解放型サーモパイル赤外線センサ。
- 非解放型サーモパイル赤外線センサを製造する方法であって、
(a)底面及び上面を有する基板層を提供し、かつ熱絶縁材層を前記基板層の前記上面の少なくとも一部上に堆積させることによって基板アセンブリを形成することと、
(b)底面及び上面を有するキャリア層を提供し、犠牲層を前記キャリア層の前記上面の少なくとも一部上に任意選択として堆積させ、極薄材料層を前記犠牲層の少なくとも一部上又は前記キャリア層の前記上面の少なくとも一部上に堆積させ、かつ結合層を前記極薄材料上に任意選択として堆積させることによってキャリアアセンブリを形成することと、
(c)前記基板アセンブリの前記熱絶縁材層と接触するように前記キャリアアセンブリの前記極薄材料層又は結合層を配置することによって前記基板アセンブリの上に前記キャリアアセンブリを積み重ねることと、
(d)前記キャリアアセンブリを前記基板アセンブリに結合させて結合スタックを提供することと、
(e)前記キャリア層及び任意の犠牲層を前記結合スタックから除去してセンサウェーハを提供することであって、前記センサウェーハは、前記基板層と、前記基板層の前記上面上の前記熱絶縁材層と、前記熱絶縁材層上の任意の前記結合層と、任意の前記結合層上又は前記熱絶縁材層上の前記極薄材料層とを含む、ことと、
(f)前記センサウェーハを構造化して前記非解放型サーモパイル赤外線センサを提供することとを含み、
前記熱絶縁材層は、450℃までの温度で安定性を有し、前記極薄材料層は、200nm以下の厚さを有する1つ以上の材料から製造され、かつ450℃より高い上昇温度を必要とする方法によって堆積される、非解放型サーモパイル赤外線センサを製造する方法。 - 前記基板層は、450℃を超える温度で不安定である1つ以上の材料を含む、請求項9に記載の方法。
- 前記基板層は、450℃を超える温度で不安定であるCMOSウェーハ、プリント基板(PCB)又は可撓性基板である、請求項9に記載の方法。
- 前記キャリア層はシリコンから製造される、請求項9に記載の方法。
- 前記キャリア層は、前記極薄材料が堆積されるという条件下で安定性を有する材料から製造される、請求項9に記載の方法。
- 前記熱絶縁材層は、パリレン、ベンゾシクロブテン(BCB)、非晶質フルオロポリマー、ポリ(メチルメタクリレート)、SU−8フォトレジスト及び他のポリマーから成る群から選択された1つ以上の材料から製造される、請求項9に記載の方法。
- 前記極薄材料層は、1つ以上の2D材料を含む、請求項9に記載の方法。
- 前記極薄材料層は、グラフェン、MoS2、SnSe、黒リン(BP)、ポリシリコン、SiGe(シリコンゲルマニウム)、Ge(ゲルマニウム)、窒化ホウ素(BN)、III−V族化合物半導体及びII−VI族化合物半導体から成る群から選択された1つ以上の材料から製造される、請求項9に記載の方法。
- 任意の前記結合層は、450℃までの温度で安定性を有する1つ以上の高分子材料から製造される、請求項9に記載の方法。
- 前記キャリアアセンブリを前記基板アセンブリに結合するステップは、ポリマー結合、低温直接結合、融着及び/又は熱圧着を用いて行われる、請求項9に記載の方法。
- 前記キャリア層及び犠牲層は、前記犠牲層の選択エッチングによって前記結合スタックから除去される、請求項9に記載の方法。
- 前記選択エッチングの前に、ウェーハ研削プロセスを行って前記キャリア層のバルクを除去する、請求項19に記載の方法。
- 非解放型サーモパイル赤外線センサを製造する方法であって、
(a)底面及び上面を有する基板層を提供し、かつ熱絶縁パリレン材料層を前記基板層の前記上面の少なくとも一部上に堆積させることによって基板アセンブリを形成することと、
(b)底面及び上面を有するキャリア層を提供し、犠牲層を前記キャリア層の前記上面の少なくとも一部上に堆積させ、2D材料層を前記犠牲層の少なくとも一部上に堆積させ、かつ結合層を前記2D材料層上に任意選択として堆積させることによってキャリアアセンブリを形成することと、
(c)前記基板アセンブリの前記熱絶縁パリレン材料層と接触するように前記キャリアアセンブリの前記2D材料層又は結合層を配置することによって前記基板アセンブリの上に前記キャリアアセンブリを積み重ねることと、
(d)前記キャリアアセンブリを前記基板アセンブリに結合させて結合スタックを提供することと、
(e)前記キャリア層及び犠牲層を前記結合スタックから除去してセンサウェーハを提供することであって、前記センサウェーハは、前記基板層と、前記基板層の前記上面上の前記熱絶縁パリレン材料層と、前記熱絶縁パリレン材料層上の任意の前記結合層と、任意の前記結合層上又は前記熱絶縁パリレン材料層上の前記2D材料層とを含む、ことと、
(f)前記センサウェーハを構造化して前記非解放型サーモパイル赤外線センサを提供することとを含み、
前記熱絶縁パリレン材料層は、450℃までの温度で安定性を有する、非解放型サーモパイル赤外線センサを製造する方法。
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US10326044B2 (en) | 2017-08-18 | 2019-06-18 | Micron Technology, Inc. | Method and apparatus for processing semiconductor device structures |
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Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935345A (en) * | 1987-04-07 | 1990-06-19 | Arizona Board Of Regents | Implantable microelectronic biochemical sensor incorporating thin film thermopile |
EP0867701A1 (en) * | 1997-03-28 | 1998-09-30 | Interuniversitair Microelektronica Centrum Vzw | Method of fabrication of an infrared radiation detector and more particularly an infrared sensitive bolometer |
SE0000148D0 (sv) * | 2000-01-17 | 2000-01-17 | Forskarpatent I Syd Ab | Tillverkningsförfarande för IR-detektormatriser |
AU2003265988A1 (en) * | 2002-09-09 | 2004-03-29 | Rosemount Aerospace, Inc. | Method for making an infrared detector and infrared detector |
CN100562725C (zh) * | 2003-09-29 | 2009-11-25 | 中国科学院上海微系统与信息技术研究所 | 微机械热电堆红外探测器及其制造方法 |
JP2006071601A (ja) | 2004-09-06 | 2006-03-16 | Denso Corp | 赤外線センサ、赤外線式ガス検出器、及び赤外線光源 |
CN101071842A (zh) * | 2006-05-09 | 2007-11-14 | 中国科学院电子学研究所 | 可自检微机械热电堆生物反应热探测器及制备方法 |
US8071487B2 (en) * | 2006-08-15 | 2011-12-06 | United Microelectronics Corp. | Patterning method using stacked structure |
CN101575083B (zh) * | 2009-06-15 | 2011-11-09 | 中北大学 | 微机械热电堆红外探测器 |
US8587083B2 (en) | 2009-06-17 | 2013-11-19 | Gunnar Malm | Microbolometer semiconductor material |
DE102010031829B4 (de) | 2009-07-21 | 2021-11-11 | Novaled Gmbh | Thermoelektrische Bauelemente mit dünnen Schichten |
US8921792B2 (en) * | 2010-04-14 | 2014-12-30 | Excelitas Technologies Singapore Pte. Ltd. | Vertically stacked thermopile |
DE112011101444T5 (de) * | 2010-04-26 | 2013-04-11 | HME Co. Ltd. | Temperatursensoreinrichtung und Strahlungsthermometer, der diese Vorrichtung verwendet, Herstellungsverfahren für Temperatursensorvorrichtungen, Mehrlagen-Dünnfilm-Thermosäule, die einen Fotoresistfilm und ein Strahlungsthermometer unter Benutzung dieser Thermosäule verwendet, sowie Herstellungsverfahren einer mehrlagigen Dünnfilm-Thermosäule |
US20130002394A1 (en) * | 2010-05-20 | 2013-01-03 | Kaoru Narita | Bolometer and method of manufacturing the same |
US20130248712A1 (en) | 2010-12-13 | 2013-09-26 | Reza Abdolvand | Nanowire thermoelectric infrared detector |
DE102011103818A1 (de) * | 2011-06-01 | 2012-12-06 | Meas Deutschland Gmbh | Infrarot-Sensoranordnung und deren Verwendung |
US8758650B2 (en) * | 2011-07-05 | 2014-06-24 | Excelitas Technologies Singapore Pte. Ltd. | Graphene-based thermopile |
CN102798474B (zh) * | 2012-08-23 | 2014-02-19 | 江苏物联网研究发展中心 | 一种高性能mems热电堆红外探测器结构及其制备方法 |
KR101910575B1 (ko) * | 2013-01-10 | 2018-10-22 | 삼성전자주식회사 | 적외선 검출기 및 적외선 이미지 센서 |
KR102093441B1 (ko) * | 2013-03-11 | 2020-03-25 | 삼성전자주식회사 | 그래핀의 제조 방법 |
US20160097681A1 (en) * | 2013-03-14 | 2016-04-07 | Qualcomm Mems Technologies, Inc. | Microbolometer supported by glass substrate |
ITTO20130502A1 (it) * | 2013-06-18 | 2014-12-19 | St Microelectronics Asia | Dispositivo elettronico con sensore di temperatura integrato e relativo metodo di fabbricazione |
US20160079306A1 (en) * | 2014-09-12 | 2016-03-17 | Excelitas Technologies Singapore Pte. Ltd. | Surface Micro-Machined Infrared Sensor Using Highly Temperature Stable Interferometric Absorber |
US9917242B2 (en) * | 2015-03-27 | 2018-03-13 | Maxim Integrated Products, Inc. | Thermopile temperature sensor field of view narrowing using integrated light blocking layer and lens |
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