JP6968229B2 - バックライトモジュールおよびそれを備えた表示装置 - Google Patents
バックライトモジュールおよびそれを備えた表示装置 Download PDFInfo
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- JP6968229B2 JP6968229B2 JP2020083005A JP2020083005A JP6968229B2 JP 6968229 B2 JP6968229 B2 JP 6968229B2 JP 2020083005 A JP2020083005 A JP 2020083005A JP 2020083005 A JP2020083005 A JP 2020083005A JP 6968229 B2 JP6968229 B2 JP 6968229B2
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- 239000000758 substrate Substances 0.000 claims description 32
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 239000002096 quantum dot Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/12—Combinations of only three kinds of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/02—Refractors for light sources of prismatic shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
Description
Claims (9)
- 基板(10)と、
前記基板(10)に、前記基板(10)の長手方向および幅方向に沿って間隔をあけて設けられる複数のLED発光ユニット(20)と、を含み、
前記複数のLED発光ユニット(20)のうちの一部が第1の発光ピーク波長を有する複数の第1の発光ユニットA(21)であるとともに、他の部分が第2の発光ピーク波長を有する複数の第2の発光ユニットC(22)であり、
前記第1の発光ピーク波長は、前記複数のLED発光ユニット(20)を混光した後のピーク波長である予定波長よりも小さく、前記第2の発光ピーク波長は、前記予定波長よりも大きく、
前記複数の第1の発光ユニットA(21)および前記複数の第2の発光ユニットC(22)は、前記基板(10)の長手方向または幅方向に隣接する2つの前記LED発光ユニット(20)のうちのいずれか一方が前記第1の発光ユニットA(21)であるとともに、他方が前記第2の発光ユニットC(22)であるように、前記基板(10)の長手方向および幅方向に沿って交互に配置されており、
前記第1の発光ピーク波長は、第1の候補範囲内にあり、
前記第2の発光ピーク波長は、第2の候補範囲内にあり、
前記予定波長は、第3の候補範囲内にあり、
前記第3の候補範囲における最大値は、前記第1の候補範囲における最大値と前記第2の候補範囲における最大値の和の半分であり、
前記第3の候補範囲における最小値は、前記第1の候補範囲における最小値と前記第2の候補範囲における最小値の和の半分である、
ことを特徴とするバックライトモジュール。 - 前記LED発光ユニット(20)は、LED発光デバイスである、
ことを特徴とする請求項1に記載のバックライトモジュール。 - 前記第1の候補範囲における最大値と最小値との差は0nmを超え3nm以下であり、
前記第2の候補範囲における最大値と最小値との差は、0nmを超え3nm以下であり、
、前記第3の候補範囲における最大値と最小値との差は、0nmを超え3nm以下である、
ことを特徴とする請求項1に記載のバックライトモジュール。 - 前記第1の候補範囲は、441nm〜443nmであり、
前記第2の候補範囲は、445nm〜447nmであり、
前記第3の候補範囲は、443nm〜445nmである、
ことを特徴とする請求項3に記載のバックライトモジュール。 - 前記複数のLED発光ユニット(20)は、前記基板(10)にマトリクス状に分布されているとともに、隣接する2つの前記LED発光ユニット(20)の中心間距離が3mm以上15mm以下である、
ことを特徴とする請求項1に記載のバックライトモジュール。 - 前記基板(10)は、FR4基板、アルミ基板およびBT基板のうちの1種である、
ことを特徴とする請求項1に記載のバックライトモジュール。 - 間隔をあけて設けられるバックライトモジュール(1)および光学モジュール(2)を含み、
前記バックライトモジュール(1)は、請求項1乃至6のいずれか1項に記載のバックライトモジュールであり、
前記光学モジュール(2)は、光学部品層(201)と変換フィルム層(202)と液晶ガラス層(203)とを含む、
ことを特徴とする表示装置。 - 前記バックライトモジュール(1)と前記光学モジュール(2)との間の離間距離は、2mm以上12mm以下である、
ことを特徴とする請求項7に記載の表示装置。 - 前記光学部品層(201)は、拡散板と、拡散フィルムと、プリズムフィルムとを含み、
前記変換フィルム層(202)は、黄色蛍光体、緑色蛍光体、赤色蛍光体のうちの1種類または複数種類を含む蛍光体フィルム、または量子ドットフィルムである、
ことを特徴とする請求項7に記載の表示装置。
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CN201910385793.6 | 2019-05-09 | ||
CN201910385793.6A CN111913322A (zh) | 2019-05-09 | 2019-05-09 | 背光模组及具有其的显示装置 |
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JP2020188000A JP2020188000A (ja) | 2020-11-19 |
JP6968229B2 true JP6968229B2 (ja) | 2021-11-17 |
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Country Status (3)
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US (1) | US10818645B1 (ja) |
JP (1) | JP6968229B2 (ja) |
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Family Cites Families (10)
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US20070262732A1 (en) * | 2006-05-10 | 2007-11-15 | Vastview Technology Inc. | Method for controlling LED-based backlight module |
CN100481449C (zh) * | 2006-06-19 | 2009-04-22 | 启萌科技有限公司 | 发光二极管封装结构 |
KR100809264B1 (ko) * | 2006-07-25 | 2008-03-03 | 삼성전기주식회사 | 면광원 장치 및 이를 구비하는 백라이트 유닛 |
CN101645437A (zh) * | 2008-08-04 | 2010-02-10 | 奇美电子股份有限公司 | 发光二极管封装结构及其应用 |
CN101737641B (zh) * | 2008-11-11 | 2013-07-31 | 群创光电股份有限公司 | 发光二极管光源模组及其应用 |
JP4519944B1 (ja) * | 2009-05-22 | 2010-08-04 | シャープ株式会社 | 光源装置及び表示装置 |
JP2011040664A (ja) * | 2009-08-18 | 2011-02-24 | Panasonic Corp | 面光源および液晶ディスプレイ装置 |
JP2011165434A (ja) * | 2010-02-08 | 2011-08-25 | Panasonic Corp | 光源、バックライトユニット及び液晶表示装置 |
JP2014160772A (ja) * | 2013-02-20 | 2014-09-04 | Toshiba Lighting & Technology Corp | 発光装置および照明装置 |
US20180075625A1 (en) * | 2016-09-12 | 2018-03-15 | Hisense Electric Co., Ltd. | Led package structure, display apparatus, and method for color display |
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- 2019-05-09 CN CN201910385793.6A patent/CN111913322A/zh active Pending
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CN111913322A (zh) | 2020-11-10 |
JP2020188000A (ja) | 2020-11-19 |
US10818645B1 (en) | 2020-10-27 |
US20200357780A1 (en) | 2020-11-12 |
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