JP6930317B2 - Terminal pin joining method and joining jig - Google Patents

Description

The present invention relates to a terminal pin joining method and a joining jig used in the field of mounting technology used for wiring connection of electrical equipment, electronic equipment, communication equipment, etc. and connection of parts.

In the field of mounting technology, a soldering structure has been proposed in which solder is filled in a hole of a structure to fix an insertion mounting component such as a lead wire (for example, Patent Document 1).

Further, a technique has also been proposed in which a plurality of terminal pins are attracted to a jig with air and the terminal pins are joined in a state of being pressed by air pressurization on a substrate (for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2007-181880 Japanese Unexamined Patent Publication No. 2000-349220

In the soldering structure in the technique of Patent Document 1, the reflow soldering temperature is used for flow soldering when the lead wires are flow-soldered on the substrate and mounted in advance, and then the surface mount components are mounted and mixed-mounted. If it is set above the melting point of the solder material, the flow soldered portion of the lead wire will be remelted. Therefore, as a result of the remelting of the flow soldered portion of the lead wire, there is a concern that the lead wire of the lead wire may be tilted, or the lead wire may float or come off from the substrate, resulting in soldering failure. .. Further, as a factor that causes a phenomenon that the lead wire is tilted and the verticality cannot be maintained, there is also the tilt of the through hole due to the warp of the substrate.

Further, in the technique of Patent Document 2, since there is no measure to prevent warpage of the substrate when joining the through-hole mounting parts such as terminal pins in a state of being pressed by air pressurization, there is a possibility that the terminal pins may be tilted after heat joining. Further, since the air is pressurized, the pressing force of the terminal pin against the substrate is weak, and there is a problem that the terminal pin is unstable with respect to the substrate.

Therefore, an object of the present invention is to provide a terminal pin joining method and a joining jig that can correct the inclination of the terminal pins that occurs when the solder is remelted during the component mounting process.

In order to achieve the above object, in the method of joining terminal pins of the present invention, terminal pins are erected and joined on at least one of the semiconductor chip and the substrate of a semiconductor device in which a semiconductor chip is mounted on a substrate. In the joining method
A step of erection of the terminal pin by bringing one end of the terminal pin into contact with at least one of the semiconductor chip and the substrate via a bonding material.
A posture holding step of holding the other end of the terminal pin with a jig to hold the posture of the terminal pin,
The process of maintaining the shape of the substrate by holding the substrate with the jig and suppressing the warp of the substrate, and the process of maintaining the shape of the substrate.
A step of heating and cooling the terminal pin and the substrate with the jig to melt and solidify the bonding material and fix the terminal pin.
It is characterized by including.

According to the terminal pin joining method of the present invention, the posture holding step of holding the posture of the terminal pin maintains the verticality of the terminal pin with respect to the substrate, and the shape maintaining step suppresses the warp of the substrate. The inclination of the terminal pin generated when the solder is remelted inside can be corrected, and the warp of the substrate can be suppressed.

In one aspect of the terminal pin joining method of the present invention,
The jig includes a support plate on which the substrate is placed and a support plate on which the substrate is placed.
A frame in which one end is fixed and erected around the substrate in the support plate, and
A holding plate provided at the other end of the frame and having a recess for holding the tip of a terminal pin protruding from the substrate.
A grip plate that sandwiches the peripheral edge of the substrate between the support plate and
With
In the posture holding step, it is preferable that the substrate is placed on the support plate, the other end of the terminal pin is fitted into the recess, and the other end of the terminal pin is held by the holding plate. According to this aspect, since the tip is secured by the holding plate having the recess for holding the tip of the terminal pin, the verticality of the terminal pin is stabilized.

In one aspect of the terminal pin joining method of the present invention,
In the shape maintaining step, it is preferable that the grip plate arranged around the substrate sandwiches the peripheral edge portion of the substrate with the support plate to suppress the warp of the substrate. According to this aspect, the grip plate improves the degree of adhesion of the peripheral edge portion of the substrate to the support plate during reflow.

The jig for joining the terminal pin of the present invention
In a jig for joining terminal pins for erected and joining terminal pins on at least one of the semiconductor chip and the substrate of a semiconductor device in which a semiconductor chip is mounted on a substrate.
A support plate on which the substrate is placed and
A frame in which one end is fixed and erected around the substrate in the support plate, and
A holding plate provided at the other end of the frame and having a recess for holding the tip of a terminal pin protruding from the substrate.
A grip plate that sandwiches the peripheral edge of the substrate between the support plate and
It is characterized by having.

According to the jig for joining terminal pins of the present invention, the inclination of the terminal pins due to the warp of the substrate in the mounting process is suppressed, and the terminal pins are held even when the soldered portion of the surface mount component is remelted. However, since the attitude of the terminal pins can be controlled, it is possible to ensure the joining reliability of the structure in which the terminal pins are mixedly mounted.

In one aspect of the terminal pin joining jig of the present invention,
The recess of the holding plate preferably has a tapered inner surface. According to this aspect, since the concave portion has a tapered inner surface, the inclination of the terminal pin due to the warp of the substrate is suppressed, and the terminal due to the inclination of the semiconductor chip when the solder joint under the semiconductor chip is remelted. The inclination of the pin can be corrected and the verticality can be maintained.

According to the terminal pin joining method of the present invention, the solder was remelted during the mounting process by fixing the tip of the terminal pin with a jig with a recess while suppressing the warpage of the substrate that occurs during the mounting process. It is possible to correct the inclination of the terminal pin that occurs at that time.

It is a schematic cross-sectional view of the structure in which the terminal pin produced by the method of joining the terminal pin of the embodiment of this invention is soldered. It is a schematic perspective view of the jig for joining a terminal pin of an embodiment. FIG. 5 is a schematic perspective view showing a state in which a terminal pin is erected and held on a semiconductor chip in which a semiconductor chip is preliminarily mounted on a substrate by a jig for joining the terminal pin of the embodiment. FIG. 3 is a schematic cross-sectional view of a jig for joining terminal pins, a substrate, and the like along the XX line of FIG. It is a top view which shows the working surface of the holding plate in the jig for joining a terminal pin of embodiment of this invention. It is a top view which shows the state which the holding plate is removed in the jig for joining a terminal pin of embodiment of this invention. It is a schematic enlarged partial cross-sectional view of a part of a holding plate in the jig for joining a terminal pin of embodiment of this invention. It is a schematic enlarged partial cross-sectional view of a part of a holding plate in the jig for joining a terminal pin of embodiment of this invention. It is a schematic cross-sectional view of another structure in which the terminal pin produced by the method of joining the terminal pin of the embodiment of this invention is soldered. It is a process flow diagram of the connection method of the terminal pin of the embodiment of this invention. It is a schematic cross-sectional view of the joining jig, the substrate and the like in the process of the main part of the joining method of the terminal pin of the embodiment of this invention. It is a graph which shows the temperature profile of the semiconductor chip junction and the temperature profile of the terminal pin junction of a part of steps (S3) and (S8) of the Example of this invention. It is a graph which shows the measurement result of the warpage amount of a substrate by the Example of this invention, and the measurement result of the warpage amount of a substrate by a preliminary test.

Hereinafter, embodiments of the terminal pin joining jig and the terminal pin joining method of the present invention will be specifically described with reference to the drawings. In the drawings, the same components are designated by the same reference numerals, and the description of the overlapping components will be omitted.

(Structure with soldered terminal pins)
First, a structure in which the terminal pins manufactured by the method of joining the terminal pins of the embodiment are soldered will be described.

FIG. 1 shows a schematic cross-sectional view of the structure 1 to which the terminal pins manufactured by the method of joining the terminal pins of the embodiment are soldered. The case where the structure to which the terminal pin is soldered is a component used for a power semiconductor module will be described, but the present invention is not limited to this, and can be applied to an insertion mounting component other than the terminal pin.

In FIG. 1, the structure 1 to which the terminal pins are soldered includes a substrate 2, a semiconductor chip 3 on the substrate, and a terminal pin 4 on the semiconductor chip. The substrate 2 (circuit board 2b) and the semiconductor chip 3 are electrically connected by a bonding material such as solder 5. The semiconductor chip 3 and the terminal pin 4 are also electrically connected by a bonding material such as solder 5.

The substrate 2 is a laminated substrate in which an insulating plate 2a, a circuit plate 2b provided on the front surface, that is, the main surface of the insulating plate 2a, and a metal plate 2c provided on the back surface of the insulating plate 2a are laminated. .. The insulating plate 2a is made of insulating ceramics such as silicon nitride, aluminum nitride, and aluminum oxide. The circuit plate 2b and the metal plate 2c are made of a metal such as copper. The circuit plate 2b is selectively formed on the insulating plate 2a, thereby forming a predetermined electric circuit (not shown). As the laminated substrate of the substrate 2, for example, a DCB (Direct Copper Bonding) substrate or the like can be used. The DCB substrate is a substrate in which a circuit plate 2b made of copper or the like and a metal plate 2c are directly bonded to the insulating plate 2a. Since the insulating plate 2a is insulating, the circuit plate 2b and the metal plate 2c are electrically insulated from each other.

The semiconductor chip 3 is not particularly limited, and may be, for example, an IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or an FWD (Free Wheeling Diode). It may be an RB-IGBT (Reverse Blocking-Insulated Gate Bipolar Transistor) or an RC-IGBT (Reverse Conducting-Insulated Gate Bipolar Transistor) formed in the vertical direction. A semiconductor chip made of SiC (for example, SiC-MOSFET) has a higher withstand voltage than a semiconductor chip made of silicon and can switch at a high frequency.

Although not shown, the semiconductor chip 3 may be provided with a vertical switching element on a semiconductor substrate having a front surface and a back surface. The semiconductor chip 3 may have a main electrode (not shown) on its front surface and an electrode (not shown) on its back surface. For example, when the semiconductor chip 3 is an IGBT, the emitter electrode and the gate electrode of the main electrode may be formed on the front surface, and the collector electrode may be formed on the back surface.

The terminal pin 4 is a rod-shaped conductive member having one end and the other end, and one end is electrically and mechanically connected to the semiconductor chip 3 via a bonding material such as solder 5. The other end of the terminal pin 4 can be electrically and mechanically connected to a wiring board (not shown) that can be arranged to face the semiconductor chip 3. The wiring board and the terminal pin 4 (not shown) are electrically and mechanically connected, for example, by press-fitting the terminal pin 4 into a hole formed at a predetermined position on the wiring board. In addition to press fitting, soldering, brazing, or caulking can also be used.

The terminal pin 4 has a pin shape such as a cylinder or a prism having flat both end surfaces parallel to each other, and is formed of a metal material such as copper having low electrical resistance and high thermal conductivity. It is preferable that a plurality of terminal pins 4 are arranged on the front surface of one semiconductor chip 3. By doing so, the thermal conductivity from the semiconductor chip 3 to the wiring board (not shown) can be improved.

As the solder 5, a solder material such as Sn-Ag type, Sn-Cu type, Sn-Sb type, Sn-Sb-Ag type and the like can be used. In the power semiconductor module 1, the same solder material may be used as the solder 5 for each joining. For example, the solder 5 for joining the semiconductor chip 3 and the circuit board 2b and the solder 5 for joining the semiconductor chip 3 and the terminal pin 4 are joined. A different solder material may be used.

(Jig for joining terminal pins)
Next, a jig for joining the terminal pins used in the method for joining the terminal pins of the embodiment will be described.

FIG. 2 shows a schematic perspective view of the terminal pin joining jig 10 used in the terminal pin joining method of the embodiment. FIG. 3 is a schematic view showing a state in which the terminal pin 4 is held by the terminal pin joining jig 10 so that the terminal pin 4 is erected on the semiconductor chip 3 on which the semiconductor chip 3 is previously mounted on the substrate 2. It is a perspective view. FIG. 4 is a schematic cross-sectional view of a jig 10 for joining terminal pins and a substrate 2 along the XX line of FIG.

The joining jig 10 is provided on a rectangular support plate SP on which the substrate 2 is placed, a frame FR whose one end is fixed and erected around the substrate 2 in the support plate SP, and the other end of the frame FR. It is composed of a holding plate PP provided, and a grip plate PH (also referred to as a substrate warpage suppressing jig) that sandwiches the peripheral edge portion of the substrate 2 with the support plate SP.

The quadrangular frame FR includes four leg FLs (each end) and is fixed to the four corners of the quadrangular support plate SP.

A quadrangular holding plate PP is fitted to the frame body (the stepped portion at the other end) of the frame FR. The four corners of the front surface of the pressing plate PP are held by the holding and pressurizing screws PPb while being pressurized at a predetermined pressure toward the support plate SP.

As shown in FIG. 5, a plurality of recesses RC are formed substantially in the center of the back surface (working surface) of the pressing plate PP. In this embodiment, nine recesses RC arranged on a 3 × 3 matrix are formed. The recess RC holds the tip of the terminal pin 4 protruding from the substrate 2, respectively.

As shown in FIG. 6, the substrate 2 is placed so as to be positioned substantially at the center of the front surface of the support plate SP, and its peripheral edges (four corners) are sandwiched between the support plate SP and the support plate SP by the grip plate PH. Has been done. The four corners of the front surface of the substrate 2 are held while being pressed at a predetermined pressure toward the support plate SP by the grip plate PH and the holding pressurizing screw PHb, respectively. As shown in FIG. 6, nine sets of semiconductor chips 3 and terminal pins 4 arranged on a 3 × 3 matrix are placed substantially in the center of the front surface of the substrate 2.

As shown in FIG. 4, the terminal pin 4 standing on the semiconductor chip 3 on which the semiconductor chip 3 is mounted in advance on the substrate 2 is made of a support plate SP and a holding plate PP by a jig 10 for joining the terminal pins. It is held while being pressurized at a predetermined pressure between them. The reflow process is performed in this state.

As shown in FIG. 7, the recess RC of the holding plate PP that holds the tip of the terminal pin 4 has a tapered inner side surface 12 (inner peripheral inclined surface). The recess RC of this embodiment is a truncated cone-shaped recess, and as shown in FIG. 7, an inner peripheral inclined surface 12 is formed so as to surround the central bottom surface 11. In the tapered inner surface 12, the taper angle θ formed by the bottom surface 11 and the inner peripheral inclined surface 12 is preferably 90 degrees or more and 150 degrees or less, and more preferably 90 degrees or more and 120 degrees or less. The truncated cone-shaped recess RC ensures that the terminal pins 4 are aligned with the substrate 2 when the terminal pins 4 are fitted. The cross-sectional shape of the recess RC may be a rectangular cross-sectional shape as shown in FIG. 8, that is, a shape having an angle θ = 90 °. Examples of such a shape include a recess having a cylindrical shape. The taper angle and the clearance amount between the side surface and the inner side surface 12 of the terminal pin 4 may be determined from the allowable values of the diameter of the terminal pin 4 and the inclination of the terminal pin.

The support plate SP, the frame FR, the holding plate PP, and the grip plate PH in the joining jig 10 are made of, for example, fine ceramics.

In the above embodiment, the case where the terminal pin 4 is erected on the semiconductor chip 3 mounted in advance on the substrate 2 via the solder 5 has been described, but the present invention is limited to this. However, as shown in FIG. 9, it can be applied to the case where the terminal pin 4 is directly erected on the substrate 2 only through the solder 5.

(How to join terminal pins)
FIG. 10 is a process flow diagram of a method of joining terminal pins.

The terminal pin bonding method is as follows: a solder is applied to a predetermined position on a substrate (S1), a semiconductor chip is mounted on the solder (S2), a semiconductor chip is heat-bonded to the substrate (S3), and a semiconductor on the substrate is bonded. Solder is applied to the front surface of the chip (S4), terminal pins are erected and mounted on the solder (S5), the posture of the terminal pins is held by a jig (S6), and the substrate is used as a jig. (S7) includes a step of heat-bonding the terminal pins to the substrate or the like (S8).

The main steps (S4) to (S7) of the terminal pin joining method will be described with reference to FIG. Here, it is assumed that the semiconductor chip 3 is pre-mounted on the substrate 2 via solder (not shown) by the above steps (S1) to (S3). Further, a structure in which the terminal pins 4 are erected on the semiconductor chip 3 mounted in advance on the substrate 2 via the solder 5, and the terminal pins 4 are erected directly on the substrate 2 via the solder 5 only. The method of joining the terminal pins in the case of FIG. 9) will be described.

In the step (S4), as shown in FIG. 11A, after the substrate 2 is placed in the center of the support plate SP surrounded by the legs of the frame FR, the substrate 2 is placed on the semiconductor chip 3 and on the predetermined positions of the substrate 2. Apply solder 5.

In the step (S5), as shown in FIG. 11B, one end of the terminal pin 4 is brought into contact with at least one of the semiconductor chip 3 and the solder 5 on the substrate 2, respectively, and the terminal pin 4 is brought into contact with the terminal pin 4. Stand up.

In the step (S6), as shown in FIG. 11C, the other end of the terminal pin 4 is inserted into the recess RC of the holding plate PP provided at the other end of the frame FR, and the holding and pressurizing screw PPb is used. The other end of the terminal pin 4 is pressed by the pressing plate PP to hold the posture of the terminal pin 4.

In the step (S7), as shown in FIG. 11D, the substrate warpage suppressing jig PH (grip plate) is tightened by the holding and pressurizing screw PHb, and the peripheral edge portion of the substrate 2 is sandwiched between the support plate SP and the support plate SP. And hold it, and suppress the warp of the substrate 2.

Then, while the terminal pin 4 and the substrate 2 are held by the above jig, the solder 5 is heated and cooled to melt and solidify the solder 5, and the terminal pin 4 is electrically and mechanically connected to the substrate 2 while being fixed to the substrate 2.

(Preliminary test)
As a preliminary test, the warpage of the substrate developed by the terminal pin joining method was measured, and the warp of the substrate was defined.

The structure (see Fig. 6) in which the terminal pins are soldered to the upper surface of the surface mount component in the preliminary test consists of nine copper terminal pins (1 mm diameter and 15 mm in length) and a DCB substrate (a square with a side of 20 mm and a thickness). It was composed of one 1 mm) and nine semiconductor chips (3 mm square and 0.5 mm thick).

From the process flow of the terminal pin joining method shown in FIG. 10, the step of holding the posture of the terminal pin with a jig (S6) and the step of holding the substrate with a jig to suppress the warp of the substrate (S7) are omitted. Then, solder was applied onto the semiconductor chip, terminal pins were mounted, and then a heat-bonded structure was created.

12 (a) and 12 (b) show a step (S3) of heat-bonding the semiconductor chip to the substrate in the process flow of the terminal pin bonding method shown in FIG. 10 and a step of heat-bonding the terminal pin to the substrate or the like (S3). The temperature profile of the semiconductor chip junction and the temperature profile of the terminal pin junction in S8) are shown.

A laser displacement meter (model: LK-G3000, manufactured by KEYENCE) was used to obtain the cross-sectional shape data of the back surface of the substrate for the amount of warpage of the substrate of the structure obtained in the preliminary test. The difference between the maximum value and the minimum value in the cross-sectional shape of the back surface of the substrate is defined as the warp of the substrate. This result is shown in the graph of "without jig" in FIG. As shown in FIG. 13, the average value of the amount of warpage of the substrate in the X direction parallel to one side of the substrate is about 79 μm, and the average value of the amount of warpage of the substrate in the Y direction orthogonal to the X direction is about 94 μm. rice field. Neither the X direction nor the Y direction satisfies the target value of the amount of warpage (≦ 70 μm). As a result, the terminal pins are tilted, and the terminal pins cannot be inserted into the corresponding pin holes of the wiring board facing the terminal pin side of the board. The target value of the warp amount (≦ 70 μm) is set in consideration of the variation in solder thickness (100 μm ± 30 μm).

(Example)
The structure was prepared under the same conditions as the above preliminary test except that the terminal pin joining method shown in FIG. 10 was used.

As shown in FIG. 4, the terminal pin posture holding jig 10 was used to hold the terminal pin posture toward the DCB substrate while holding the terminal pin posture.

In order to suppress the amount of warpage in the preliminary test, the terminal pin posture holding jig 10 shown in FIG. 2 was used. The surface pressure when holding the substrate by the holding plate PP and the holding and pressurizing screw PPb was in the range of 0.3 MPa to 50 MPa. The holding plate PP and the holding and pressurizing screw PPb could suppress the inclination of the terminal pin caused in the heating process and the cooling process.

The range of surface pressure due to the holding plate PP and the holding and pressurizing screw PPb differs depending on the shape and size of the substrate. The lower limit of the surface pressure of the substrate is set to 0.3 MPa because the warpage of the substrate cannot be suppressed with a surface pressure of less than 0.3 MPa. On the other hand, when the pressure was applied at a surface pressure exceeding 50 MPa, problems such as cracks in the surface mount components or breakage of the semiconductor chip occurred. Therefore, the upper limit of the surface pressure when the terminal pin is pressurized is set to 50 MPa.

In this embodiment, the recess of the holding plate PP that fits into the terminal pin has a tapered shape according to the inclination of the terminal pin, so that even if the solder joint is remelted and the tip position of the terminal pin is displaced. , It was confirmed that the terminal pin can be fixed within a certain inclination.

On the other hand, the tip of the terminal pin is fixed to a jig with a tapered concave portion, a load of 2 kg (a load of 2/9 kg per terminal pin) is applied to the holding plate PP, and a surface pressure of 3 MPa is applied to the end face of each terminal pin. The measurement results (preliminary test and examples) of the amount of warpage of the substrate when the substrate is applied and mounted are shown in the graph of “with jig” in FIG. Regarding the step of applying a surface pressure of 3 MPa to the end face of each terminal pin, the screw tightening amount was determined based on the relationship between the surface pressure of the pressure sensitive paper and the screw tightening amount. The average value of the amount of warpage of the substrate in the X direction is about 14 μm, and the average value of the amount of warpage of the substrate in the Y direction is about 17 μm (less than 1/5 when no jig is used). The target value of the amount (≦ 70 μm) was satisfied, and a state in which the terminal pin could be inserted into the corresponding pin hole of the wiring board facing the terminal pin side of the board could be secured.

By using the joining jig of this embodiment, the inclination of the terminal pin due to the warp of the substrate in the mounting process is suppressed to maintain the verticality, and it occurs when the solder joint under the semiconductor chip is remelted. By correcting the inclination of the terminal pins, a structure in which the terminal pins are soldered can be stably formed on the upper surface of the semiconductor chip on the DCB substrate. Further, by setting the jig shape and pressurizing conditions by the same method, it can be applied to a structure in which terminal pins and surface mount components are mixedly mounted.

As described above, the present invention is not limited to the above-described embodiments and examples, and can be appropriately modified and implemented without changing the gist thereof.

1 Structure, 2 Substrate, 3 Semiconductor chip, 4 Terminal pin, 5 Solder, 10 Jig for joining, SP Support plate, FR Frame, PP Press plate, PH Grip plate, RC Recess.

Claims (5)

It is a joining method in which terminal pins are erected and joined to at least one of the semiconductor chip and the substrate of a semiconductor device in which a semiconductor chip is mounted on a substrate.
A step of erection of the terminal pin by bringing one end of the terminal pin into contact with at least one of the semiconductor chip and the substrate via a bonding material.
A posture holding step of holding the other end of the terminal pin with a jig to hold the posture of the terminal pin,
The process of maintaining the shape of the substrate by holding the substrate with the jig and suppressing the warp of the substrate, and the process of maintaining the shape of the substrate.
A step of heating and cooling the terminal pin and the substrate with the jig to melt and solidify the bonding material and fix the terminal pin.
A method of joining terminal pins, which comprises. The jig includes a support plate on which the substrate is placed and a support plate on which the substrate is placed.
A frame in which one end is fixed and erected around the substrate in the support plate, and
A holding plate provided at the other end of the frame and having a recess for holding the tip of a terminal pin protruding from the substrate.
A grip plate that sandwiches the peripheral edge of the substrate between the support plate and
With
In the posture holding step, the substrate is placed on the support plate, the other end of the terminal pin is fitted into the recess, and the other end of the terminal pin is held by the holding plate.
The terminal pin according to claim 1, wherein in the shape maintaining step, a grip plate arranged around the substrate sandwiches a peripheral edge portion of the substrate between the grip plate and the support plate to suppress warpage of the substrate. Joining method. The method for joining terminal pins according to claim 2, wherein the recess of the holding plate has a tapered inner surface surface. A jig for joining terminal pins for erection and joining of terminal pins on at least one of the semiconductor chip and the substrate of a semiconductor device in which a semiconductor chip is mounted on a substrate.
A support plate on which the substrate is placed and
A frame in which one end is fixed and erected around the substrate in the support plate, and
A holding plate provided at the other end of the frame and having a recess for holding the tip of a terminal pin protruding from the substrate.
A grip plate that sandwiches the peripheral edge of the substrate between the support plate and
A jig for joining terminal pins, which is characterized by being provided with. The jig for joining terminal pins according to claim 4, wherein the recess of the holding plate has a tapered inner surface surface.

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