JP6926638B2 - Power converter - Google Patents

Description

The present invention relates to a power conversion device including a power semiconductor module for power conversion and a cooler for cooling the power semiconductor module.

As a power conversion device of this type, the power conversion device described in Patent Document 1 is known.
This power conversion device includes a power semiconductor module for power conversion, a smoothing capacitor, a DC input connector, an AC output connector, a cooler in which a cooling medium circulates inside, a housing forming a storage space, and the like. A power semiconductor module in which a smoothing capacitor, a DC input connector, and an AC output connector are stored in the storage space of the housing, and an opening communicating with the storage space is formed on the outer wall of the housing, and a cooler is joined. Is inserted through the opening and placed in the storage space, and the opening is closed and fixed with a cooler. Then, by flowing a cooling medium through the cooling chamber of the cooler, the cooler cools the heat generated when the elements of the power semiconductor module perform the switching operation.
Since the power conversion device of Patent Document 1 uses a cooler that closes and fixes the opening as a part of the housing, the manufacturing cost can be reduced.

JP-A-2017-60291

By the way, the power conversion device of Patent Document 1 generates heat due to power loss between a connection portion that electrically connects a power semiconductor module and a smoothing capacitor and a connection portion that electrically connects a power semiconductor module and an AC output unit. However, since the cooler has a structure that cools only the power semiconductor, the cooling efficiency at the time of power conversion may decrease.
Therefore, an object of the present invention is to provide a power conversion device capable of reliably cooling a smoothing capacitor electrically connected to a power semiconductor module and a heat generating portion of an AC output unit.

In order to achieve the above object, the power conversion device according to one aspect of the present invention is housed in a housing provided with a refrigerant flow path through which a cooling medium flows and in close contact with an inner wall on the refrigerant flow path side. A plurality of first electric units including a power semiconductor module and a smoothing capacitor and an AC output unit electrically connected to the power semiconductor module and housed in a housing, and electrically connecting the power semiconductor module and the smoothing capacitor. At least one of the connection portion and the plurality of second electrical connection portions that electrically connect the power semiconductor module and the AC output unit is thermally connected to the inner wall on the refrigerant flow path side via the cooling terminal block . The cooling terminal block is fixed to the housing or the rising portion while covering the rising portion rising from a part of the housing toward the first electrical connection portion and the second electrical connecting portion and the upper portion of the rising portion. , An insulating cover in contact with the first electrical connection and the second electrical connection.

According to the power conversion device according to the present invention, the smoothing capacitor electrically connected to the power semiconductor module and the heat generating portion of the AC output unit can be reliably cooled.

It is a perspective view which shows the appearance of the power conversion apparatus of 1st Embodiment which concerns on this invention. It is a developed perspective view of the component which comprises the power conversion apparatus of 1st Embodiment. It is a figure which shows the inside of the bottom wall of the housing of 1st Embodiment. It is a figure which showed the bottom wall of the housing of 1st Embodiment from the outside. (A) is an enlarged view of a main part of FIG. 3, and (b) is a view taken along the line AA of (a). It is a figure which shows the state which attached the flow path cover to the outside of the bottom wall of the housing of 1st Embodiment. It is a perspective view which shows the front side of the power semiconductor module which comprises the power conversion apparatus of 1st Embodiment. It is a perspective view which shows the back side of the power semiconductor module of 1st Embodiment. It is a perspective view which shows the smoothing capacitor which comprises the power conversion apparatus of 1st Embodiment. It is a figure which shows the main part of the smoothing capacitor of 1st Embodiment. It is a perspective view which shows the DC input part which comprises the power conversion apparatus of 1st Embodiment. It is a perspective view which shows the current detector which comprises the power conversion apparatus of 1st Embodiment. It is a perspective view which shows the AC output connector which comprises the power conversion apparatus of 1st Embodiment. It is a figure which shows the state which attached the cooling terminal block to the inside of the bottom wall of the housing of 1st Embodiment. FIG. 14 is a cross-sectional view taken along the line CC of FIG. FIG. 14 is a cross-sectional view taken along the line DD of FIG. It is a figure which shows the state which arranged the main component of the power conversion apparatus inside the housing of 1st Embodiment. It is a figure which showed the connection structure of the cooling water circulation part of 1st Embodiment, and a cooler of a power semiconductor module. It is a figure which shows the cooling terminal block arranged in the place where the power semiconductor module of 1st Embodiment and an AC output part are electrically connected. It is a figure which shows the cooling terminal block arranged in the place where the power semiconductor module and the smoothing capacitor of 1st Embodiment are electrically connected. It is a figure which shows the state which arranged the resin sheet on the upper part of the main component of the power conversion apparatus arranged inside the housing of 1st Embodiment. It is a figure which shows the state which arranged the fixing plate on the upper part of the heat transfer sheet arranged inside the housing of 1st Embodiment. It is a figure which shows the state which arranged the control circuit board on the upper part of the fixing plate arranged inside the housing of 1st Embodiment. It is a cross-sectional view of the power conversion apparatus of 1st Embodiment. It is an enlarged view of the part indicated by reference numeral G in FIG. 24. It is an enlarged view of the part indicated by reference numeral H in FIG. 24. It shows the electrically connected part of the power conversion apparatus of the 2nd Embodiment which concerns on this invention. It shows the electrically connected part of the power conversion apparatus of the 3rd Embodiment which concerns on this invention. It is a figure which shows the cooler of the power semiconductor module of 4th Embodiment which concerns on this invention. It is a figure which shows the state which the cooler of the power semiconductor module of 4th Embodiment is connected to the cooling water circulation part. It is a figure which shows the electric connection part of the power conversion apparatus of 5th Embodiment which concerns on this invention. It is a figure which shows the electric connection part of the power conversion apparatus of 6th Embodiment which concerns on this invention. It is a figure which shows the electric connection part of the power conversion apparatus of 7th Embodiment which concerns on this invention.

Next, the first to seventh embodiments of the present invention will be described with reference to the drawings. In the description of the drawings below, the same or similar parts are designated by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the plane dimensions, the ratio of the thickness of each layer, etc. are different from the actual ones. Therefore, the specific thickness and dimensions should be determined in consideration of the following explanation. In addition, it goes without saying that the drawings include parts having different dimensional relationships and ratios from each other.

Further, the first to seventh embodiments shown below exemplify devices and methods for embodying the technical idea of the present invention, and the technical idea of the present invention is based on the material of the component parts. The shape, structure, arrangement, etc. are not specified as follows. The technical idea of the present invention may be modified in various ways within the technical scope specified by the claims stated in the claims.
Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings. In addition, the terms indicating the directions such as "top", "bottom", "bottom", "front", "rear", and "left and right" described in the following description are used with reference to the directions in the attached drawings. Has been done.

[Power conversion device of the first embodiment]
Hereinafter, the power conversion device of the first embodiment according to one aspect of the present invention will be described with reference to the drawings as appropriate.
As shown in FIG. 1, the power conversion device 1 of the first embodiment according to the present invention includes a housing 2 and a cooling water circulation unit CL provided at the bottom of the housing 2. The housing 2 is composed of a case 4 and a cover 5.

The cooling water supply pipe 6a and the cooling water discharge pipe 6b are connected to the case 4, and the external input connection port 4e and the external output connection port 4f are open.
Inside the housing 2, as shown in FIG. 2, an insulated gate bipolar transistor (IGBT) module 10, a control circuit board 11 on which a drive circuit for driving the IGBT module 10 and the like are mounted, a smoothing capacitor 12, and a smoothing capacitor 12 are provided. The DC input connector 13, the AC output connector 14, and the current detector 15 are housed.

[Case]
The case 4 and the cover 5 of the housing 2 are cast products made of aluminum or an aluminum alloy.
FIG. 3 shows the inside of the case 4, and FIG. 4 shows the case 4 from the outside.
As shown in FIG. 3, the case 4 has a rectangular bottom wall 4a, first side wall to fourth side wall 4b1 to 4b4 rising from the entire circumference of the bottom wall 4a, and first side wall to fourth side wall 4b1 to 4b4. It includes an opening 4c that opens at the upper end.

The cooling water supply pipe 6a and the cooling water discharge pipe 6b are connected to the second side wall 4b2 by press fitting or welding, and the external input connection port 4e and the external output connection port 4f are formed on the third side wall 4b4. ..
On the outside of the bottom wall 4a of the case 4, an entry gutter 7a extending in the left-right direction and an exit gutter 7b extending in the left-right direction longer than the entry groove 7a are formed in FIG. The left end of the inlet gutter 7a communicates with the cooling water supply pipe 6a via the communication passage 8a, and the left end of the outlet gutter 7b also communicates with the cooling water discharge pipe 6b via the communication passage 8b. ing. Further, an entry side opening 9a is formed by penetrating the bottom wall 4a on the right end side of the entry side groove 7a, and an exit side opening 9b is formed by penetrating the bottom wall 4a on the right end side of the exit side groove 7b. Has been done.

As shown in FIGS. 5A and 5B, a peripheral groove 9a1 is formed on the outside of the entrance side opening 9a, and an O-ring 16 is mounted on the peripheral groove 9a1. Further, a peripheral groove (not shown) is also formed on the outside of the exit side opening 9b, and the O-ring 16 is mounted on the peripheral groove.
These O-rings may be mounted in a double or more manner by increasing the number of peripheral grooves as necessary.

Then, as shown in FIG. 6, a flow path cover 17 is fixed to the outside of the bottom wall 4a of the case 4 so as to close the openings of the entrance side groove 7a and the exit side groove 7b, and the cooling water supply pipe 6a and the cooling water supply pipe 6a and An inlet side flow path 18a communicating with the inlet side opening 9a and an outlet side flow path 18b communicating with the cooling water discharge pipe 6b and the outlet side opening 9b are formed.
As a result, the cooling water circulation unit CL described above includes the cooling water supply pipe 6a, the communication passage 8a, the inlet side flow path 18a, the inlet side opening 9a, the cooling water discharge pipe 6b, the communication passage 8b, the outlet side flow path 18b, and the outlet. It is composed of a side opening 9b.

[IGBT module]
7 and 8 show the IGBT module 10, and is a cooling system that is integrally provided with the module main body 19 and the module main body 19 and is connected to the cooling water circulation unit CL provided in the housing 2 to circulate the cooling water. It is equipped with a vessel 3.
The module main body 19 includes a rectangular parallelepiped resin package 19a and a metal base plate (not shown) arranged on the bottom surface of the resin package 19a, and a cooler 3 is integrally provided on the metal base plate side.

The resin package 19a includes three IGBT upper arm semiconductor chips, an upper arm wiring pattern portion, an upper arm wiring conductor plate, a lower arm semiconductor chip, a lower arm wiring pattern portion, and a lower arm wiring conductor plate (not shown). The grounding wiring pattern portion and the like are embedded, and the upper arm semiconductor chip and the lower arm semiconductor chip are in contact with the metal base plate.

In the resin package 19a, flat plate-shaped positive electrode side terminals 21U, 21V, 21W and negative electrode side terminals 22U, 22V, 22W face each other in the plate width direction from one side surface 20a in the long direction. The flat plate-shaped output terminals 23U, 23V, and 23W project in a row from the other side surface 20b in the long direction so that the ends in the plate width direction face each other. It is provided.

The positive side terminals 21U, 21V, 21W are connected to the collector of the upper arm semiconductor chip via the upper arm wiring pattern part, and the negative side terminals 22U, 22V, 22W are the grounding wiring pattern part and the lower arm wiring. It is connected to the emitter of the lower arm semiconductor chip via the conductor plate for the lower arm, and the output terminals 23U, 23V, 23W are the emitter of the upper arm semiconductor chip and the emitter of the upper arm semiconductor chip via the wiring pattern portion for the lower arm and the conductor plate for the upper arm wiring. It is connected to the collector of the lower arm semiconductor chip.

Further, on the upper surface of the resin package 19a, a plurality of lead frames 24U, 24V, 24W for the upper arm connected to a plurality of control electrodes for the upper arm, and a plurality of lead frames 24U, 24V, 24W connected to the plurality of control electrodes for the lower arm. Lead frames 25U, 25V, and 25W for the lower arm are provided so as to project upward.
As shown in FIG. 8, the cooler 3 is joined to the bottom surface of the resin package 19a.
The bottom wall 3a of the cooler 3 is formed with an inlet opening 3e connected to the inlet 9a of the case 4 and an outlet 3f connected to the outlet 9b of the case 4. ..

[Smoothing capacitor]
The smoothing capacitor 12 is a device that smoothes the DC voltage input from the DC input connector 13, and as shown in FIG. 9, the substantially rectangular shape of the capacitor body 12a and the long direction of the capacitor body 12a (direction of arrow B). It is provided with a plurality of terminals provided so as to project from the side surface 12b extending to the surface.

A plurality of terminals of the smoothing capacitor 12 are provided at positions closer to the right side of the side surface 12b, and the flat plate-shaped positive electrode side output terminals 26U, 26V, 26W and the negative electrode side output terminals 27U, 27V, 27W are plates of each other. It is provided so as to project in a row along the elongated direction with the ends in the width direction facing each other.
Further, as shown in FIGS. 9 and 10, the positive electrode side input terminal 28 and the negative electrode side input terminal 29 are provided so as to protrude to the left side of the side surface 12b.

The negative electrode side input terminal 29 is a flat plate-shaped terminal, and is provided so as to extend in the long plane direction and project.
The positive electrode side input terminal 28 has a flat plate-shaped base portion 28a extending in a plane direction extending in a direction orthogonal to the elongated direction from the side surface 12b and being bent in the elongated direction from the tip end side of the base portion 28a. It is a terminal provided with the formed connecting portion 28b.

[DC input connector]
FIG. 11 shows a DC input connector 13, a resin-molded input connector main body 13a, and two plate-shaped positive electrodes extending in the long direction inside the input connector main body 13a. A side bus bar 30 and a negative electrode side bus bar 31 are provided.
One end of the positive electrode side bus bar 30 is a capacitor side terminal 30a connected to the positive electrode side input terminal 28 of the smoothing capacitor 12, and the other end is an external input side terminal 30b connected to the positive electrode side terminal of an external input converter (not shown). .. Further, one end of the negative electrode side bus bar 31 is a capacitor side terminal 31a connected to the negative electrode side input terminal 29 of the smoothing capacitor 12, and the other end is an external input side terminal 31b connected to the negative electrode side terminal of the external input converter.

[Current detection device]
The current detector 15 is a device for detecting the AC output current of the IGBT module 10, and as shown in FIG. 12, the rectangular parallelepiped detector main body 32 and the detector main body 32 are arranged apart from each other in the longitudinal direction. It is equipped with three plate-shaped detector bus bars 33U, 33V, 33W.

One end of the detector bus bar 33U is the IGBT side terminal 33Ua connected to the output terminal 23U of the IGBT module 10, and the other end of the detector bus bar 33U is the output terminal 33Ub of the AC output connector 14. Further, one end of the detector bus bar 33V is an IGBT side terminal 33V connected to the output terminal 23V of the IGBT module 10, and the other end of the detector bus bar 33V is an output terminal 33Vb of the AC output connector 14. Further, one end of the detector bus bar 33W is an IGBT side terminal 33W connected to the output terminal 23W of the IGBT module 10, and the other end of the detector bus bar 33W is an output terminal 33Wb of the AC output connector 14.

[AC output connector]
FIG. 13 shows the AC output connector 14, and mounting holes 34a, 34b, 34c are formed in which the output terminals 33Ub, 33Vb, 33Wb of the detector bus bars 33U, 33V, 33W are inserted from above and mounted. There is.

[Assembly of the power conversion device of the first embodiment]
Next, the assembly of the power conversion device 1 of the first embodiment will be described.
First, FIG. 14 shows a storage space for parts to be stored in the case 4.
As shown in FIG. 14, the case 4 houses a first storage space S1 for storing the smoothing capacitor 12, a second storage space S2 for storing the DC input connector 13, a current detector 15, and an AC output connector. A third storage space S3 and a fourth storage space S4 for storing the IGBT module 10 are provided.

The first storage space S1 extends along the first side wall 4b1 and is provided as a long space up to the second side wall b2 and the fourth side wall 4b4 facing each other.
The second storage space S2 is a long space extending along the fourth side wall 4b4, one end of this space in the long direction faces the first storage space S1, and the other end in the long direction is the third. It is provided up to the side wall 4b3.

The third storage space S3 is a long space extending along the fourth side wall 4b4, one end of this space in the long direction faces the second storage space S2, and the other end in the long direction is the second. Up to the side wall 4b2 is provided.
The fourth storage space S4 is a space surrounded by the first storage space S1, the second storage space S2, the third storage space S3, and the second side wall 4b2.

Here, the cooling terminal block 35 is fixed to the bottom wall 4a between the first storage space S1 and the fourth storage space S4, and is attached to the bottom wall 4a between the third storage space S3 and the fourth storage space S4. The cooling terminal block 36 is fixed.
As shown in FIGS. 14 and 15, the cooling terminal block 35 is placed on the bottom wall 4a via an electrically insulating heat transfer sheet 37, and both ends in the longitudinal direction are fixed to the bottom wall 4a with fixing screws 38. It is a member that has been made. The cooling terminal block 35 is insert-molded with six round bar-shaped cooling terminals 39 made of brass having good thermal conductivity and the upper and lower end surfaces exposed to the outside at predetermined intervals. It is provided with a terminal block main body 40 made of a thermoplastic resin.

Also. As shown in FIGS. 14 and 16, the cooling terminal block 36 is also placed on the bottom wall 4a via the electrically insulating heat transfer sheet 41, and is separated from the bottom wall 4a in the longitudinal direction by the fixing screw 38. It is a member fixed to, and is made of brass and is insert-molded with three round bar-shaped cooling terminals 42 and these cooling terminals 42 with the upper and lower end surfaces exposed to the outside at predetermined intervals. It includes a terminal block main body 43 made of resin.

The cooling terminals 39, 42 of the cooling terminal blocks 35, 36 are formed with diameter-reduced portions 39a, 42a at the central portion in the axial direction in order to prevent the cooling terminals 39, 42 from coming off from the terminal block main bodies 40, 43.
Then, as shown in FIG. 17, the DC input connector 13 is housed in the second storage space S2 in the case 4, the AC output connector 14 and the current detector 15 are housed in the third storage space S3, and the fourth storage space is stored. The IGBT module 10 is housed in S4, the smoothing capacitor 12 is housed in the first storage space S1, and these parts are fixed to the bottom wall 4a.

Here, the external input side terminals 30b and 31b of the DC input connector 13 are located inside the external input connection port 4e of the case 4 shown in FIG. 1, and the AC output connector is inside the external output connection port 4f of the case 4. The output terminals 33Ub, 33Vb, and Wb of the current detector 15 integrally mounted on the 14 are located.
Then, when the IGBT module 10 is stored and fixed in the fourth storage space S4, as shown in FIG. 18, the entrance side opening 3e of the cooler 3 integrated in the IGBT module 10 and the fourth storage space S4 The entrance side opening 9a formed in the bottom wall 4a faces each other, and the O-ring 16 mounted on the outer peripheral groove 9a1 of the entrance side opening 9a is crushed by the peripheral wall of the entrance side opening 3e of the cooler 3. As a result, the inlet openings 3e and 9a are connected in a state where the liquid tightness is maintained. Further, although not shown, the outlet side opening 3f of the cooler 3 and the outlet side opening 9b of the fourth storage space S4, which face each other, also have an O-ring 16 mounted on the outer peripheral groove 9a1 of the outlet side opening 9b. By being crushed by the peripheral wall of the outlet side opening 3f of the cooler 3, the outlet side openings 3f and 9b are connected in a state where liquid tightness is maintained.

As a result, the cooling water supplied from the cooling water supply pipe 6a of the cooling water circulation unit CL described above passes through the inlet side openings 3e and 9a and is supplied to the inside of the cooler 3 of the IGBT module 10 from the cooler 3. The discharged water passes through the outlet side openings 3f and 9b and can be discharged to the outside from the cooling water discharge pipe 6b.
Next, as shown in FIG. 17, the capacitor side terminal 30a protruding on the smoothing capacitor 12 side of the DC input connector 13 and the connection portion 28b of the positive electrode side input terminal 28 of the smoothing capacitor 12 overlap, and the DC input connector 13 Since the capacitor side terminal 31a and the negative electrode side input terminal 29 of the smoothing capacitor 12 also overlap, these overlapping portions are electrically connected by welding.

Further, as shown in FIG. 19, the IGBT side terminals 33Ua, 33V, 33Wa of the current detector 15 and the output terminals 23U, 23V, 23W of the IGBT module 10 also overlap, so by welding these overlapping portions. Connect electrically. The cooling terminals 39 of the cooling terminal block 36 are in thermal contact with the lower surface of these electrically connected portions.
Further, as shown in FIG. 20, the positive electrode side output terminals 26U, 26V, 26W of the smoothing capacitor 12, the negative electrode side output terminals 27U, 27V, 27W, and the positive electrode side terminals 21U, 21V, 21W, the negative electrode side terminal of the IGBT module 10 Since 22U, 22V, and 22W also overlap, they are electrically connected by welding these overlapping portions. Then, the cooling terminals 39 of the cooling terminal block 35 are in thermal contact with the lower surface of these electrically connected portions.

Next, as shown in FIG. 21, the upper part of the part where the IGBT module 10 and the smoothing capacitor 12 are electrically connected, and the upper part of the part where the current detector 15 and the IGBT module 10 are electrically connected, The upper part of the portion where the DC input connector 13 and the smoothing capacitor 12 are electrically connected is covered with the resin sheets 44, 45, 46.
Next, as shown in FIG. 22, the fixing plate 47 covering the upper part of the DC input connector 13 and the IGBT module 10 is fixed to the case 4, and then the insulating paper 48a shown in FIG. 2 is attached to the upper surface of the fixing plate 47. Next, as shown in FIG. 23, the control circuit board 11 is arranged above the fixing plate 47.

As shown in FIG. 24, the fixing plate 47 includes a metal plate 49 and a covering portion 50 made of a thermoplastic resin that is insert-molded in a state of covering substantially the entire area of the metal plate 49.
The metal plate 49 of the fixing plate 47 is made into a highly rigid member by forming convex portions 49a and 49b by drawing.
Further, as shown in FIG. 25, the covering portion 50 of the fixing plate 47 is electrically connected to the current detector 15 and the IGBT module 10 (IGBT side terminals 33Ua, 33Va, 33Wa and the output terminal 23U). , 23V, 23W connection portion), and a protrusion 50a protruding toward the connection portion) is provided.

Further, as shown in FIG. 26, the covering portion 50 is electrically connected to the IGBT module 10 and the smoothing capacitor 12 (positive electrode side output terminals 26U, 26V, 26W, negative electrode side output terminals 27U, 27V, 27W and a protrusion 50b protruding toward the positive electrode side terminals 21U, 21V, 21W and the negative electrode side terminals 22U, 22V, 22W) are provided.
Further, as shown in FIG. 26, the covering portion 50 is also provided with a protruding portion 50c protruding toward the upper surface of the IGBT module 10.

As a result, when the fixing plate 47 is fixed to the case 4, the protrusion 50a of the covering portion 50 presses the portion where the current detector 15 and the IGBT module 10 are electrically connected via the resin sheet 45, and the covering portion The protrusion 50b of the 50 presses the electrically connected portion of the IGBT module 10 and the smoothing capacitor 12 via the resin sheet 44, and the protrusion 50c of the covering portion 50 presses the IGBT module 10.

Here, as shown in FIG. 22, the fixing plate 47 is formed with long lead frame through holes 51 communicating with each other on the front and back surfaces, and the lead frames 24U, 24V for the upper arm projecting from the upper surface of the IGBT module 10 , 24W, lower arm lead frames 25U, 25V, 25W pass through the lead frame passage hole 51 and are inserted into a through hole (not shown) having a land of the control circuit board 11, and between each lead frame and the through hole. It will be soldered.
Then, the cover 5 on which the insulating paper 48b shown in FIG. 2 is attached to the back surface is fixed to the peripheral edge of the opening 4c of the case. As a result, the IGBT module 10, the control circuit board 11, the smoothing capacitor 12, the DC input connector 13, the AC output connector 14, and the current detector 15 housed in the housing 2 are hermetically sealed with the outside air. NS.

[Operation of the power conversion device of the first embodiment]
In this state, the smoothing capacitor 12 to which DC power is supplied from an external input converter (not shown) via the DC input connector 13 smoothes the input DC voltage and outputs it to the IGBT module 10. Then, when a gate signal composed of, for example, a pulse width modulation signal, is supplied from the control circuit board 11 to the IGBT module 10 and on / off control is performed with the gate signals shifted by 120 degrees with respect to the three IGBTs, the IGBT module Three-phase ACs from 10 to U-phase, V-phase and W-phase are output to the load via the current detector 15 and the AC output connector 14.

When the three IGBTs of the IGBT module 10 are in the operating state, the upper arm semiconductor chips and the lower arm semiconductor chips of the three IGBTs embedded in the resin package 19a are in the heat generating state.
Further, the output currents of the three-phase AC of the smoothing capacitor 12 and the IGBT module 10 that smooth the DC voltage as well as the heat generated by the upper arm semiconductor chip and the lower arm semiconductor chip embedded in the resin package 19a of the IGBT module 10. The current detector 15 that detects the above is also in a heat generating state.

The heat generated by the upper arm semiconductor chip and the lower arm semiconductor chip of the IGBT module 10 is thermally conducted to the cooler 3 integrally provided in the module body 19 of the IGBT module 10.
Since the heat transferred to the cooler 3 of the IGBT module 10 is transferred by the cooling water circulating in the cooler 3, the upper arm semiconductor chip and the lower arm semiconductor chip of the IGBT module 10 are efficiently cooled.

On the other hand, the connection terminals of the IGBT module 10 and the smoothing capacitor 12 (positive electrode side output terminals 26U, 26V, 26W of the smoothing capacitor 12, negative electrode side output terminals 27U, 27V, 27W, and positive electrode side terminals 21U, 21V, 21W of the IGBT module 10). , Negative electrode side terminals 22U, 22V, 22W), a cooling terminal block 35 is arranged in a state where the upper ends of the cooling terminals 39 are in thermal contact. Therefore, the heat generated by the connection terminals of the IGBT module 10 and the smoothing capacitor 12 is thermally conducted to the bottom wall 4a of the case 4 via the cooling terminal 39 and the heat transfer sheet 37 arranged below the cooling terminal 39 (FIG. 20). reference).

Further, a cooling terminal 42 is also provided below the connection terminals of the IGBT module 10 and the current detector 15 (the IGBT side terminals 33Ua, 33V, 33Wa of the current detector 15 and the output terminals 23U, 23V, 23W of the IGBT module 10). Since the cooling terminal block 36 is arranged with the upper ends in thermal contact, the heat generated by the connection terminals of the IGBT module 10 and the current detector 15 is generated by the heat transfer sheet arranged below the cooling terminal 42 and the cooling terminal 42. Heat is conducted to the bottom wall 4a of the case 4 via 41 (see FIG. 19).

As shown in FIG. 6, the bottom wall 4a of the case 4 is provided with an entry side flow path 18a and an exit side flow path 18b of the cooling water circulation portion CL in which the cooling water circulates, so that the bottom wall 4a has heat dissipation. Is high. Therefore, the heat transferred to the cooling terminal block 35 and the heat transferred through the cooling terminal block 36 move to the bottom wall 4a having high heat dissipation, so that the connection terminals of the IGBT module 10 and the smoothing capacitor 12 and the smoothing capacitor 12 and the heat can be transferred. The connection terminals of the IGBT module 10 and the current detector 15 are efficiently cooled.
Here, the power semiconductor module according to the present invention corresponds to the IGBT module 10, the housing according to the present invention corresponds to the case 4, and the AC output unit according to the present invention corresponds to the current detector 15, according to the present invention. The first protrusion corresponds to the protrusion 50c, the second protrusion according to the present invention corresponds to the protrusions 50a and 50b, and the DC input portion according to the present invention corresponds to the DC input connector 13.

[Effect of the power conversion device of the first embodiment]
Next, the effect of the power conversion device 1 of the first embodiment will be described.
Even if the three IGBTs of the IGBT module 10 are in the operating state and the upper arm semiconductor chips and the lower arm semiconductor chips of the three IGBTs embedded in the resin package 19a are in a heat generating state, the cooler 3 of the IGBT module 10 is cooled. By circulating the cooling water from the water circulation unit CL, the upper arm semiconductor chip and the lower arm semiconductor chip of the IGBT module 10 can be efficiently cooled.

Further, the connection terminals of the IGBT module 10 and the smoothing capacitor 12 (positive electrode side output terminals 26U, 26V, 26W of the smoothing capacitor 12, negative electrode side output terminals 27U, 27V, 27W, and positive electrode side terminals 21U, 21V, 21W of the IGBT module 10). , Negative electrode side terminals 22U, 22V, 22W), connection terminals for the IGBT module 10 and the current detector 15 (IGBT side terminals 33Ua, 33V, 33Wa for the current detector 15 and output terminals 23U, 23V, 23W for the IGBT module 10). ) And the heat generation state due to power loss, the cooling terminal bases 35 and 36 arranged below these connection terminals conduct the heat of the connection portion to the bottom wall 4a, but the cooling water circulates in the bottom wall 4a. Since the inlet side flow path 18a and the exit side flow path 18b of the cooling water circulation portion CL are provided to improve heat dissipation, the connection portion can be efficiently cooled.

Further, the connection terminals of the IGBT module 10 and the smoothing capacitor 12, and the connection terminals of the IGBT module 10 and the current detector 15 are joined by welding, but the heat generated at the connection terminals during welding is applied to the cooling terminal bases 35 and 36. Since it can be released to the bottom wall 4a through the method, it does not affect the IGBT module 10, the smoothing capacitor 12, and the current detector 15 due to the heat generated during welding.

Further, when the IGBT module 10 is fixed to the bottom wall 4a of the case 4, the O-ring 16 mounted on the outside of the entrance side opening 9a of the bottom wall 4a is crushed by the peripheral wall of the entrance side opening 3e of the cooler 3. Then, the entrance side openings 3e and 9a are connected in a state where the liquidtightness is maintained. Further, the O-ring 16 mounted on the outside of the outlet side opening 9b of the bottom wall 4a is crushed by the peripheral wall of the outlet side opening 3f of the cooler 3, so that the outlet side openings 3f and 9b are kept liquidtight. Since it is connected in this state, the cooling water flow path between the cooling water circulation unit CL provided on the bottom wall 4a and the cooler 3 can be easily connected.

Further, as shown in FIG. 17, the DC input connector 13 and the IGBT module 10 housed in the case 4 are arranged side by side in the longitudinal direction of the smoothing capacitor 12, but are arranged below the longitudinal dimension of the smoothing capacitor 12. It is arranged in. Further, the current detector 15 is arranged side by side with the IGBT module 10 in a direction orthogonal to the longitudinal direction of the smoothing capacitor 12. As a result, the area of the bottom wall 4a is reduced by arranging other parts side by side in the longitudinal direction or less of the smoothing capacitor 12, which is the largest part among the parts constituting the power conversion device 1. ..

Further, as shown in FIG. 24, the height positions of the DC input connector 13, the IGBT module 10, the current detector 15, and the AC output connector 14 housed in the case 4 are set to be substantially the same, and the height positions thereof are set to be substantially the same. The control circuit board 11 is arranged there. Since the height position of the control circuit board 11 is set to be equal to or lower than the height of the smoothing capacitor 12, the first to fourth storage spaces S1 to S4 of the case 4 can be set to a small space.
As described above, the power conversion device of the first embodiment set in the small space of the first to fourth storage spaces S1 to S4 by reducing the area of the bottom wall 4a of the case 4 can be reduced in size.

Further, the fixing plate 47 fixed to the case 4 while covering the upper parts of the DC input connector 13 and the IGBT module 10 is provided with a protrusion 50c for pressing the IGBT module 10 toward the bottom wall 4a, so that the IGBT is provided. Looseness due to transmission of vibration of the screw fixing the module 10 to the case 4 can be reliably prevented.
Further, the fixing plate 47 has a protrusion 50a that pushes the connection terminals of the IGBT module 10 and the smoothing capacitor 12 toward the bottom wall 4a, and a protrusion that pushes the connection terminals of the current detector 15 and the IGBT module 10 toward the bottom wall 4a. Since 50b is also provided, it is possible to reliably prevent poor contact of the connection terminals.

[Power conversion device of the second embodiment]
Next, what is shown in FIG. 27 shows a main part of the power conversion device of the second embodiment. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In the IGBT module 10 of the second embodiment, the positive electrode side screw hole terminals 55U, 55V, 55W and the negative electrode side screw hole terminals 56U, 56V, 56W are spaced apart from each other in the longitudinal direction on one side surface of the module body 19 in the long direction. The output screw hole terminals 57U, 57V, 57W are formed at predetermined intervals in the longitudinal direction on the other side surface in the elongated direction.

The smoothing capacitor 12 is provided with flat plate-shaped positive electrode side output terminals 58U, 58V, 58W and negative electrode side output terminals 59U, 59V, 59W whose tips are bent at right angles on one side in the elongated direction.
Further, the current detector 15 is provided with plate-shaped detector bus bars 60U, 60V, 60W whose tips are bent at right angles.

Then, the fixing screw 61 is passed through the through holes formed at the tips of the positive electrode side output terminals 58U, 58V, 58W and the negative electrode side output terminals 59U, 59V, 59W of the smoothing capacitor 12, and the fixing screw 61 is inserted into the IGBT module 10. By screwing into the positive electrode side screw hole terminals 55U, 55V, 55W and the negative electrode side screw hole terminals 56U, 56V, 56W, the positive electrode side output terminals 58U, 58V, 58W and the negative electrode side output terminals 59U, 59V, 59W can be screwed into the positive electrode side screw holes. The terminals 55U, 55V, 55W and the negative electrode side screw hole terminals 56U, 56V, 56W are electrically connected. The cooling terminals 39 of the cooling terminal block 35 are in thermal contact with the lower surface of these electrically connected portions.

Further, the fixing screws 62 are passed through the through holes formed at the tips of the detector bus bars 60U, 60V, 60W of the current detector 15, and these fixing screws 62 are screwed into the output screw hole terminals 57U, 57V, 57W of the IGBT module 10. As a result, the output screw hole terminals 57U, 57V, 57W and the detector bus bar 60U, 60V, 60W are electrically connected. The cooling terminals 42 of the cooling terminal block 36 are in thermal contact with the lower surface of these electrically connected portions.

According to the power conversion device of the second embodiment, the connection terminals of the IGBT module 10 and the smoothing capacitor 12 and the connection terminals of the IGBT module 10 and the current detector 15 are easily fixed by screwing using fixing screws 61 and 62. In addition, the cooling terminal blocks 35 and 36 conduct the heat generated by the power loss of the connection terminals to the bottom wall 4a, so that the cooling efficiency can be improved.

[Power conversion device of the third embodiment]
Next, what is shown in FIG. 28 shows a main part of the power conversion device of the third embodiment. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In the IGBT module 10 of the second embodiment, the flat plate-shaped positive electrode side terminals 63U, 63V, 63W and the negative electrode side terminals 64U, 64V, 64W are spaced apart from each other in the longitudinal direction on one side surface of the module body 19 in the long direction. On the other side surface in the elongated direction, flat plate-shaped output terminals 65U, 65V, 65W are formed at predetermined intervals in the longitudinal direction.

The smoothing capacitor 12 is provided with flat plate-shaped positive electrode side output terminals 66U, 66V, 66W and negative electrode side output terminals 67U, 67V, 67W on one side in the elongated direction.
Further, the current detector 15 is provided with a flat tip-shaped detector bus bar 68U, 68V, 68W.
Further, through holes are formed in the positive electrode side terminals 63U, 63V, 63W and the negative electrode side terminals 64U, 64V, 64W of the IGBT module 10, and the positive electrode side output terminals 66U, 66V, 66W of the smoothing capacitor 12 corresponding to these connection terminals. Through holes are also formed in the output terminals 67U, 67V, and 67W on the negative electrode side. Then, the through hole of the connection terminal of the IGBT module 10 and the through hole of the connection terminal of the smoothing capacitor 12 are made to correspond to each other, and the fixing screw 69 penetrating these is screwed into the screw hole formed in the cooling terminal 39 of the cooling terminal block 35. The positive electrode side terminals 63U, 63V, 63W and the negative electrode side terminals 64U, 64V, 64W are electrically connected to the positive electrode side output terminals 66U, 66V, 66W and the negative electrode side output terminals 67U, 67V, 67W.

Further, through holes are formed in the output terminals 65U, 65V, 65W of the IGBT module 10, and through holes are also formed in the detector bus bars 68U, 68V, 68W of the current detector 15 corresponding to these connection terminals. Then, the through hole of the connection terminal of the IGBT module 10 and the through hole of the connection terminal of the current detector 15 are made to correspond to each other, and the fixing screw 70 penetrating these is screwed into the screw hole formed in the cooling terminal 42 of the cooling terminal block 36. As a result, the output terminals 65U, 65V, 65W and the detector bus bars 68U, 68V, 68W are electrically connected.

According to the power conversion device of the third embodiment, the connection work of the connection terminals of the IGBT module 10 and the smoothing capacitor 12, the connection work of the connection terminals of the IGBT module 10 and the current detector 15, and the connection terminal of the cooling terminal block 35, The work of contacting the 36 can be performed at the same time only by screwing the fixing screws 69 and 70.

[Power conversion device of the fourth embodiment]
Next, what is shown in FIGS. 29 and 30 shows a main part of the power conversion device of the fourth embodiment.
An inlet pipe 71a and an outlet pipe 71b are formed on the bottom wall 3a of the cooler 3 connected to the cooling water circulation portion CL of the case 4 of the IGBT module 10 of the fourth embodiment to circulate the cooling water. There is.

Then, as shown in FIG. 30, an O-ring 72 is mounted on the outer periphery of the entry-side pipe 71a, and when the IGBT module 10 is stored and fixed in the fourth storage space S4, the entry-side pipe 71a becomes the fourth. The entry-side pipe 71a and the entry-side opening 9a are formed by entering the inside of the entry-side opening 9a formed in the bottom wall 4a of the storage space S4 and crushing the O-ring 72 into the inner wall of the entry-side opening 9a. Connected while maintaining liquidtightness.

Although not shown, an O-ring 72 is also attached to the outer periphery of the output pipe 71b, and when the IGBT module 10 is stored and fixed in the fourth storage space S4, the output pipe 71b becomes the bottom of the fourth storage space S4. The O-ring 72 enters the inside of the exit side opening 9b formed in the wall 4a and is crushed by the inner wall of the exit side opening 9b, so that the exit side pipe 71b and the exit side opening 9b are kept liquidtight. It is connected in the state of being connected.

Therefore, when the IGBT module 10 is fixed to the bottom wall 4a of the case 4, the entry-side pipe 71a and the exit-side pipe 71b having the O-ring 72 mounted on the outer periphery are connected to the entry-side opening 9a and the exit-side opening 9b of the bottom wall 4a. The O-ring 72 enters and is crushed by the inner walls of the inlet side opening 9a and the outlet side opening 9b, and the inlet side pipe 71a and the inlet side opening 9a, the outlet side pipe 71b and the outlet side opening 9b are kept liquid-tight. Since it is connected in this state, the cooling water flow path between the cooling water circulation unit CL provided on the bottom wall 4a and the cooler 3 can be easily connected.

[Power conversion device of the fifth embodiment]
Next, what is shown in FIG. 31 shows a main part of the power conversion device of the fifth embodiment.
The positive electrode side output terminals 26U, 26V, 26W of the smoothing capacitor 12, the negative electrode side output terminals 27U, 27V, 27W, and the positive electrode side terminals 21U, 21V, 21W of the IGBT module 10 and the negative electrode side terminals 22U, 22V, 22W are electrically connected by welding. The cooling terminal block 75 of the fifth embodiment is in contact with the lower surface of the portion that is specifically connected.

The cooling terminal block 75 is a member fixed to the bottom wall 4a with fixing screws 38 at both ends in the longitudinal direction, similarly to the cooling terminal blocks 35 and 36 of the first embodiment shown in FIG.
The cooling terminal block 75 is made of copper having good thermal conductivity, and heat is formed by insert-molding six cooling terminals 76 having a U-shaped cross section and these cooling terminals 76 at predetermined intervals in the longitudinal direction. It includes a terminal block main body 77 made of a plastic resin.

The six cooling terminals 76 are arranged in an inverted U shape, the flat portion 76a is exposed to the outside from the upper end of the terminal block main body 77, and the pair of opposing piece portions 76b, 76c are embedded in the terminal block main body 77. There is.
According to the fifth embodiment, when the connection terminals of the IGBT module 10 and the smoothing capacitor 12 are in a heat generating state, heat is conducted from the cooling terminal 76 of the cooling terminal block 75 to the bottom wall 4a of the case 4 via the terminal block main body 77. Since the bottom wall 4a is provided with the inlet side flow path 18a and the exit side flow path 18b of the cooling water circulation portion CL to improve heat dissipation due to the cooling water circulation, the connection portion between the IGBT module 10 and the smoothing capacitor 12 is made efficient. Can be cooled well.

[Power conversion device of the sixth embodiment]
Next, what is shown in FIG. 32 shows a main part of the power conversion device of the sixth embodiment.
Similar to the fifth embodiment, the cooling terminal block 78 of the sixth embodiment is a member extending in the longitudinal direction on the lower surface of the portion where the IGBT module 10 and the smoothing capacitor 12 are electrically connected. At the same time, both ends in the longitudinal direction are fixed to the bottom wall 4a with fixing screws 38 as in FIG.

The cooling terminal block 78 includes a long rising portion 79 protruding from the bottom wall 4a of the case 4, and a long synthetic resin insulating cover 80 that covers the entire rising portion 79.
According to the cooling terminal block 78 in the sixth embodiment, when the connection terminals of the IGBT module 10 and the smoothing capacitor 12 are in a heat generating state, heat is conducted to the rising portion 79 through the insulating cover 80 of the cooling terminal block 78. Since the bottom wall 4a is provided with the inlet side flow path 18a and the exit side flow path 18b of the cooling water circulation portion CL to improve heat dissipation due to the cooling water circulation, the connection portion between the IGBT module 10 and the smoothing capacitor 12 can be efficiently cooled. can do.

[Power conversion device of the seventh embodiment]
Further, what is shown in FIG. 33 shows a main part of the power conversion device of the seventh embodiment.
The cooling terminal block 81 of the seventh embodiment is also a member extending in the longitudinal direction on the lower surface of the portion where the IGBT module 10 and the smoothing capacitor 12 are electrically connected.
The cooling terminal block 81 includes a rising portion 82 protruding from the bottom wall 4a of the case 4, and a synthetic resin insulating cover 83 covering the outer periphery of the upper side of the rising portion 82.

Engagement recesses 84 are formed at substantially intermediate positions in the height direction on both ends of the rising portion 82 in the longitudinal direction.
Snap-fit portions 85 are provided on both ends of the insulating cover 83 in the longitudinal direction, and the snap-fit portion 85 is elastically deformed and fitted into the engaging recess 84 to insulate the outer periphery of the upper side of the rising portion 82. The cover 83 is attached.

According to the seventh embodiment, when the connection terminals of the IGBT module 10 and the smoothing capacitor 12 are in a heat generating state, heat is conducted to the rising portion 82 through the insulating cover 83 of the cooling terminal block 81, and the bottom wall 4a circulates the cooling water. Since the inlet side flow path 18a and the exit side flow path 18b of the part CL are provided and the heat dissipation is improved by the cooling water circulation, the connection portion between the IGBT module 10 and the smoothing capacitor 12 can be efficiently cooled.

Further, the cooling terminal block 81 of the seventh embodiment is as simple as attaching a long insulating cover 83 to a long rising portion 82 protruding from the bottom wall 4a of the case 4 by using a snap-fit portion 85. Because it is a simple work, it is possible to reduce the manufacturing cost.
In the fifth to seventh embodiments, the cooling terminal blocks 75, 78, 81 that come into contact with the electrical connection terminals of the IGBT module 10 and the smoothing capacitor 12 have been described, but the electricity of the IGBT module 10 and the current detector 15 has been described. The same effect can be obtained even if it is applied to a cooling terminal block that comes into contact with a typical connection terminal.

Further, in FIG. 19, the cooling terminal block 36 is arranged directly below the connection portion of the connection terminal of the current detector 15 and the IGBT module 10, and in FIG. 20, the cooling terminal block 35 is the connection portion of the connection terminal of the IGBT module 10 and the smoothing capacitor 12. Directly below, in FIGS. 31 to 33, cooling terminal blocks 75, 78, 81 are arranged directly below the connection portion of the connection terminals of the IGBT module 10 and the smoothing capacitor 12, but the lower side of the welded connection terminals. If the cooling terminal block supports the connection terminal of, it is not necessary to arrange it directly under the connection part of the connection terminal.

Further, the position of the case 4 in which the cooling terminal blocks 35, 36, 75, 78, 81 are in thermal contact is the bottom wall forming the inlet side flow path 18a and the exit side flow path 18b of the cooling water circulation path CL. Not limited to 4a, it may be a side wall near the inlet side flow path 18a and the exit side flow path 18b. For example, the cooling terminal 39 of the cooling terminal block 35 shown in FIG. 15 is bent in an L shape on the side wall side. It may be a member.
Further, the shapes of the convex portions 49a and 49b formed on the metal plate 49 of the fixed plate 47 shown in FIG. 24 by drawing are changed in shape, orientation, number, etc., so that the automobile on which the power conversion device 1 is mounted is mounted. It is possible to increase the resistance and rigidity to various vibrations generated by such devices.

Further, as shown in FIG. 15, the cooling terminal block 35 is placed on the bottom wall 4a via the heat transfer sheet 37, and as shown in FIG. 16, the cooling terminal block 36 transfers heat on the bottom wall 4a. Although it is mounted via the sheet 41, the heat transfer sheet 37 can be prevented from slipping by cutting a groove or providing unevenness on the lower surface of the cooling terminal 39 of the cooling terminal block 35 or the bottom wall 4a. By cutting a groove or providing unevenness on the lower surface of the cooling terminal 42 of the cooling terminal block 36 or the bottom wall 4a, it is possible to prevent the heat transfer sheet 41 from shifting.

Further, by appropriately adjusting the shapes of these grooves and irregularities according to the shape of the drawing process formed on the metal plate 49 of the fixing plate 47, it may be possible to prevent the displacement more effectively.
Further, as shown in FIG. 2, an external input connection port 4e in which the DC input connector 13 is arranged on one side (third side wall 4b4) of the housing 2 and an external output connection port in which the AC output connector 14 is arranged are arranged. Although 4f is formed, the arrangement positions of the DC input connector 13 and the AC output connector 14 are not limited to this.

Further, as shown in FIGS. 9 and 10, the positive electrode side input terminal 28 of the smoothing capacitor 12 has a flat plate-shaped base 28a extending in a plane direction extending in a direction orthogonal to the long direction from the side surface 12b. However, when the terminal shape is made in this way, the base portion 28a does not exist, and the connecting portion 28b extends in the elongated direction from the side surface 12b, as compared with the one in which the smoothing capacitor extends in the elongated direction. Can be shortened.

1 Power converter 2 Housing 3 Cooler 3a Bottom wall 3e Enter side opening 3f Out side opening 4 Case 4a Bottom wall 4b1 to 4b4 1st side wall to 4th side wall 4c Opening 4e External input connection port 4f External output connection Port 5 Cover 6a Cooling water supply pipe 6b Cooling water discharge pipe 7a Inlet side groove 7b Outside groove 8a Linkage passage 8b Linkage passage 9a Inlet side opening 9a1 Circumferential groove 9b Outlet side opening 10 IGBT module 11 Control circuit board 12 Smoothing capacitor 12a Condenser Main body 12b Side surface 13 DC input connector 13a Input connector main body 14 AC output connector 15 Current detector 16 O ring 17 Flow path cover 18a Inlet side flow path 18b Out side flow path 19 Module body 19a Resin package 20a One side surface 20b The other side 21U, 21V, 21W Positive electrode side terminal 22U, 22V, 22W Negative electrode side terminal 23U, 23V, 23W Output terminal 24U, 24V, 24W Upper arm lead frame 25U, 25V, 25W Lower arm lead frame 26U, 26V, 26W Positive electrode side Output terminals 27U, 27V, 27W Negative electrode side output terminal 28 Positive electrode side input terminal 28a Flat plate-shaped base 28b Connection part 29 Negative electrode side input terminal 30 Positive electrode side bus bar 31 Negative electrode side bus bar 30a Condenser side terminal 30b External input side terminal 31a Condenser side terminal 31b External input side terminal 32 Detector body 33U, 33V, 33W Detector bus bar 33Ua, 33Va, 33W IGBT side terminal 33Ub, 33Vb, 33Wb Output terminal 34a, 34b, 34c Mounting hole S1 First storage space S2 Second storage space S3 3rd storage space S4 4th storage space 35,36 Cooling terminal block 37, 41 Heat transfer sheet 38 Fixing screw 39, 42 Cooling terminal 39a, 42a Reduced diameter portion 40,43 Terminal stand body 44, 45, 46 Resin sheet 47 fixed Plate 48a, 48b Insulation paper 49 Metal plate 50 Coating part 50a, 50b, 50c Projection part 51 Lead frame passage hole 55U, 55V, 55W Positive electrode side screw hole terminal 56U, 56V, 56W Negative electrode side screw hole terminal 57U, 57V, 57W Output Screw hole terminal 58U, 58V, 58W Positive electrode side output terminal 59U, 59V, 59W Negative electrode side output terminal 60U, 60V, 60W Detector bus bar 61, 62 Fixing screw 63U, 63V, 63W Positive electrode side terminal 64U, 64V, 64W Negative electrode side terminal 65U, 65V, 65W Output terminal 66U, 66V, 6 6W Positive electrode side output terminal 67U, 67V, 67W Negative electrode side output terminal 68U, 68V, 68W Detector bus bar 69, 70 Fixing screw 71a Input side pipe 71b Out side pipe 72 O ring 75 Cooling terminal block 76 Cooling terminal 77 Terminal block body 76a Flat part 76b, 76c Pair of facing pieces 78 Cooling terminal block 79 Rising part 80 Insulation cover 81 Cooling terminal block 82 Rising part 83 Insulation cover 84 Engagement recess 85 Snap fit part CL Cooling water circulation part

Claims (14)

A housing provided with a refrigerant flow path through which the cooling medium flows, and
A power semiconductor module housed in the housing in close contact with the inner wall on the refrigerant flow path side,
A smoothing capacitor and an AC output unit electrically connected to the power semiconductor module and housed in the housing are provided.
At least one of a plurality of first electrical connection portions for electrically connecting the power semiconductor module and the smoothing capacitor and a plurality of second electrical connection portions for electrically connecting the power semiconductor module and the AC output unit. , It is thermally connected to the inner wall on the refrigerant flow path side via the cooling terminal block .
The cooling terminal block
A rising portion that rises from a part of the housing toward the first electrical connection portion and the second electrical connection portion, and a rising portion.
It is provided with an insulating cover fixed to the housing or the rising portion while covering the upper portion of the rising portion and in contact with the first electrical connection portion and the second electrical connection portion. Characterized power conversion device. The power semiconductor module includes a flat plate-shaped first module-side terminal protruding from one side of the module body, and a plurality of flat-plate-shaped second module-side terminals protruding from the other side of the module body.
The smoothing capacitor includes a plurality of flat plate-shaped capacitor-side terminals protruding from the capacitor body.
The AC output unit includes a plurality of flat plate-shaped output unit side terminals protruding from the output unit main body.
The first electrical connection portion is formed by overlapping the corresponding first module side terminal and the capacitor side terminal and joining them by welding.
The power conversion device according to claim 1, wherein the second electrical connection portion is formed by overlapping the corresponding second module side terminal and the output portion side terminal and joining them by welding. A fixing plate fixed to the housing while covering the power semiconductor module is provided.
The power conversion device according to claim 1 or 2, wherein the fixing plate is provided with a first protrusion that presses the power semiconductor module toward the inner wall of the housing. 3. The third aspect of the present invention, wherein the fixing plate is provided with a second protrusion for pressing the plurality of first electrical connection portions and the plurality of second electrical connection portions toward the inner wall of the housing. Power converter. The power semiconductor module includes a plurality of first screw hole terminals formed on one side of the module body and a plurality of second screw hole terminals formed on the other side of the module body.
The smoothing capacitor includes a plurality of flat plate-shaped capacitor-side terminals protruding from the capacitor body, and a first through hole formed in the capacitor-side terminal.
The AC output unit includes a plurality of flat plate-shaped output unit side terminals protruding from the output unit main body, and a second through hole formed in the output unit side terminal.
The first electrical connection portion allows the first screw hole terminal and the capacitor side terminal to be screwed into the corresponding first screw hole terminal by passing the first screw through the first through hole of the capacitor side terminal. Connected and
The second electrical connection portion passes through the second through hole of the output unit side terminal and is screwed into the corresponding second screw hole terminal, whereby the second screw hole terminal and the output unit side are screwed into the second screw hole terminal. The power conversion device according to claim 1, wherein the terminals are connected. The smoothing capacitor includes a plurality of flat plate-shaped capacitor-side terminals protruding from the capacitor body, and a plurality of first through holes formed on the tip side of the capacitor-side terminal.
The AC output unit includes a plurality of flat plate-shaped output unit-side terminals protruding from the output unit main body, and a second through hole formed on the tip end side of the output unit-side terminal.
The power semiconductor module includes a plurality of flat plate-shaped first module side terminals protruding from one side of the module body, and a third through hole formed on the tip end side of the first module side terminal.
A plurality of flat plate-shaped second module side terminals protruding from the other side of the module body and a fourth through hole formed on the tip end side of the second module side terminal are provided.
The first electrical connection portion is provided on the first terminal block by passing through the first through hole of the capacitor side terminal corresponding to the first screw and the third through hole of the first module side terminal. By screwing it into the screw hole, the capacitor side terminal and the first module side terminal are connected.
The second electrical connection portion is provided on the second terminal block by passing through the second through hole of the output unit side terminal corresponding to the second screw and the fourth through hole of the second module side terminal. By screwing into the two screw holes, the output unit side terminal and the second module side terminal are connected.
The power conversion device according to claim 1, wherein at least one of the first terminal block and the second terminal block is the cooling terminal block. According to claim 1, a cooler is integrally provided with the power semiconductor module, and the cooling medium circulates inside the cooler from the refrigerant flow path provided in the housing. 6. The power conversion device according to any one of 6. In the cooler, a cooler inlet side opening and a cooler outlet side opening through which the cooling medium enters and exits are formed on a surface joined to the inner wall on the refrigerant flow path side.
The refrigerant flow path of the housing is formed with a housing inlet-side flow path to which the cooling medium is supplied from the outside and a housing exit-side flow path for discharging the cooling medium to the outside. A housing entry-side opening communicating with the housing entry-side flow path and a housing exit-side opening communicating with the housing exit-side flow path are formed on the inner wall.
A peripheral groove equipped with an O-ring is formed on one outer circumference of the cooler inlet side opening and the housing inlet side opening and one outer circumference of the cooler outlet side opening and the housing outer side opening. Has been
When the cooler is joined to the inner wall, the cooler entry side opening and the housing entry side opening, the cooler exit side opening and the housing are in a state where the O-ring is crushed. The power conversion device according to claim 7, wherein the power conversion device communicates with the outlet side opening. In the cooler, a cooler inlet pipe and a cooler outlet pipe through which the cooling medium enters and exits are formed on a surface joined to the inner wall on the refrigerant flow path side.
Wherein the refrigerant flow path of the housing, a housing inlet side flow passage and the cooling medium is supplied from the outside, said with a housing outlet side passage for discharging cooling medium is formed externally, the On the inner wall on the refrigerant flow path side, a housing entry-side opening communicating with the housing entry-side flow path and a housing exit-side opening communicating with the housing exit-side flow path are formed.
An O-ring is attached to the outer circumference of the cooler inlet pipe and the cooler outlet pipe.
When the cooler is joined to the inner wall on the refrigerant flow path side, the cooler inlet side pipe is inserted into the housing inlet side opening in a state where the O ring is crushed, and the cooler outlet side is inserted. The power conversion device according to claim 7, wherein the pipe is inserted into the opening on the exit side of the housing. The cooling terminal block
A resin terminal block body fixed to the inner wall on the refrigerant flow path side,
It is provided with a plurality of metal cooling terminals embedded in the terminal block main body at predetermined intervals with both ends exposed to the outside.
One end of the plurality of cooling terminals is in contact with the first electrical connection portion and the second electrical connection portion, and the other end side is in contact with the housing via an electrically insulating heat transfer sheet. The power conversion device according to any one of claims 1 to 9. The cooling terminal block
A resin terminal block body fixed to the inner wall on the refrigerant flow path side,
It is provided with a plurality of metal cooling terminals, one end of which protrudes to the outside and the other end of which is embedded in the terminal block body at predetermined intervals without protruding.
Any one of claims 1 to 9, wherein one end of the plurality of cooling terminals is in contact with the first electrical connection portion and the second electrical connection portion, and the other end side is in contact with the housing. The power converter according to the section. A DC input is electrically connected to the smoothing capacitor.
The DC input unit and the power semiconductor module are housed side by side in the longitudinal direction within the longitudinal dimension of the smoothing capacitor housed in the housing.
Before SL AC output unit, a power conversion apparatus according to any one of claims 1 to 11, characterized in that it is housed side by side in the power semiconductor module in a direction perpendicular to the longitudinal direction of the smoothing capacitor .. The height positions of the DC input unit, the power semiconductor module, and the AC output unit housed in the housing are set to be substantially the same, and a control board for driving and controlling the power semiconductor module is placed above them. The power conversion device according to claim 12 , wherein the power conversion device is arranged. The power conversion device according to claim 13, wherein the height position of the control board in the housing is set to be equal to or lower than the height of the smoothing capacitor.

Images