JP6913790B2 - 屋内用光源および照明装置 - Google Patents
屋内用光源および照明装置 Download PDFInfo
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
図1は、本発明の一実施形態に係る屋内用光源の外観斜視図である。図2は、図1に示す屋内用光源を仮想線で示す平面で切断したときの断面図である。
インジウム等のIII族窒化物半導体等を用いることができる。なお、第1半導体層の厚みは、例えば1μm以上5μm以下であって、発光層の厚みは、例えば25nm以上150nm以下であって、第2半導体層の厚みは、例えば50nm以上600nm以下である。また、このように構成された発光素子3は、例えば370nm以上420nm以下の波長範囲の励起光を発することができる。
いるが、2つのピーク波長の差分は10nm以下と小さく、第1の蛍光スペクトルのピーク波長λB1[nm]と第2の蛍光スペクトルのピーク波長λB2[nm]とは異なっている。このとき、、差分が0nm、すなわちλB1=λB2であってもよい。第1の蛍光スペクトルのピーク波長λB1[nm]と第2の蛍光スペクトルのピーク波長λB2[nm]とが異なる場合には、屋内用光源1の発光スペクトルによって第1青色蛍光体と第2青色蛍光体の光強度を確認する際に、第1青色蛍光体の第1の蛍光スペクトルと、第2青色蛍光体の第2の蛍光スペクトルとを区別することが容易となる。その結果、第1青色蛍光体による第1の蛍光スペクトルの光強度と、第2青色蛍光体による第2の蛍光スペクトルの光強度を調整することが容易になる。
ピークのピーク波長をλ3[nm]とし、第1〜第3のピークにおける光強度のうち、最大となる光強度を相対強度で1としたとき、λ1[nm]〜λ2[nm]の波長領域における最小の光強度が相対強度で0.7以上であり、λ2[nm]〜λ3[nm]の波長領域における最小の光強度が相対強度で0.8以上である発光スペクトルとする。なお、この発光スペクトルは、λ1[nm]よりも短波長側の波長領域およびλ3[nm]よりも長波長側の波長領域については、特に限定されないが、可視光として認識され難い紫外領域や赤外領域の光である、380nmよりも短波長側の波長領域および780nmよりも長波長側の波長領域の光については抑制されることがよい。
図6は、本実施形態に係る屋内用光源を備える照明装置の外観斜視図であり、図7は、図6に示す照明装置の分解斜視図である。図8は、図6に示す照明装置の筐体から透光性基板を取り外した状態を示す斜視図である。
1における長手方向一方側および他方側の開口をそれぞれ閉塞する2つの蓋部22とから成っている。各支持部21bの上部には、透光性基板13を保持するための凹所が互いに対向するように形成された保持部が設けられている。筐体11は、長手方向の長さが、例えば、100mm以上2000mm以下に設定されている。
、蛍光スペクトルは、図4に示した蛍光スペクトルGである。第1青色色蛍光体は、(Sr,Ba)10(PO4)6Cl2:Euであり、蛍光スペクトルは、図4に示した蛍光スペクトルB1である。第2青色蛍光体は、(Sr,Ba,Ca)5(PO4)3Cl:Euであり、蛍光スペクトルは、図4に示した蛍光スペクトルB2である。
にあるので(上限値は100)、試料光源である屋内用光源1の発光スペクトルが太陽光
のスペクトルに近似するほどRaは高くなり、演色性が高くなることを意味する。本実施例では、試料光源である屋内用光源1の平均演色評価数Raが、表1に示すように97.3と高い値であり、その他の特殊演色評価数R1〜R15も高い値であった。
2 基板
3 発光素子
4 枠体
5 封止部材
6 波長変換部材
7 蛍光体
10 照明装置
Claims (6)
- 370nm以上420nm以下の波長範囲を励起光として出射する発光素子と、
該発光素子から出射される光に励起されて蛍光を発する蛍光体であって、赤色の蛍光を発する赤色蛍光体、緑色の蛍光を発する緑色蛍光体、青色の蛍光を発する青色蛍光体を含む前記蛍光体が分散された波長変換部材と、を備え、
440〜460nmの波長領域に第1のピークを有し、540〜560nmの波長領域に第2のピークを有し、610〜630nmの波長領域に第3のピークを有し、
第1のピークのピーク波長をλ1[nm]とし、第2のピークのピーク波長をλ2[nm]とし、第3のピークのピーク波長をλ3[nm]とし、前記励起光のピーク波長をλ4とし、
第1〜第3のピークにおける光強度のうち、最大となる光強度を1としたとき、λ1[nm]〜λ2[nm]の波長領域における最小の光強度である第1光強度が相対強度で0.7以上であり、λ2[nm]〜λ3[nm]の波長領域における最小の光強度である第2光強度が相対強度で0.8以上である発光スペクトルの光を発するとともに、
λ4[nm]における光強度が相対強度で0.6以上0.7以下である屋内用光源。 - 前記第2光強度は、前記第1光強度よりも大きい、請求項1に記載の屋内用光源。
- λ4[nm]における光強度の相対強度と、λ1[nm]における光強度の相対強度の差は0.3以上である、請求項1または2に記載の屋内用光源。
- 650nmにおける光強度は、相対強度で0.8以上0.9以下である請求項1〜3のいずれか1つに記載の屋内用光源。
- λ2[nm]における光強度が最大である、請求項1〜4のいずれか1つに記載の屋内用光源。
- 請求項1〜5のいずれか1つに記載の屋内用光源を複数備える照明装置。
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JP2015206120 | 2015-10-20 | ||
JP2015206120 | 2015-10-20 | ||
JP2017545789A JP6698676B2 (ja) | 2015-10-20 | 2016-10-20 | 屋内用光源および照明装置 |
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JP2020129684A JP2020129684A (ja) | 2020-08-27 |
JP2020129684A5 JP2020129684A5 (ja) | 2021-01-21 |
JP6913790B2 true JP6913790B2 (ja) | 2021-08-04 |
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CN110959201B (zh) * | 2017-06-28 | 2023-05-09 | 京瓷株式会社 | 发光装置和照明装置 |
US10971658B2 (en) * | 2017-09-28 | 2021-04-06 | Lumileds Llc | Infrared emitting device |
JPWO2019107281A1 (ja) * | 2017-11-28 | 2020-12-03 | 京セラ株式会社 | 発光装置および照明装置 |
WO2019106864A1 (ja) * | 2017-11-28 | 2019-06-06 | 京セラ株式会社 | 発光装置および照明装置 |
DE112018006827T5 (de) * | 2018-01-11 | 2020-09-17 | Ecosense Lighting Inc. | Vielkanalsysteme zum bereitstellen von einstellbarem licht und funktionellen diodenemisionen |
US20210043809A1 (en) * | 2018-01-29 | 2021-02-11 | Kyocera Corporation | Light-emitting device and illumination apparatus |
WO2019164014A1 (ja) * | 2018-02-26 | 2019-08-29 | 京セラ株式会社 | 発光装置および照明装置 |
JP7142101B2 (ja) * | 2018-11-27 | 2022-09-26 | 京セラ株式会社 | 照明装置 |
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US6621211B1 (en) * | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
JP2002190622A (ja) * | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
US7753553B2 (en) * | 2005-06-02 | 2010-07-13 | Koniklijke Philips Electronics N.V. | Illumination system comprising color deficiency compensating luminescent material |
KR100682876B1 (ko) * | 2005-07-06 | 2007-02-15 | 삼성전기주식회사 | 실리코포스페이트계 형광체 및 이를 포함한 led |
JP2011029497A (ja) * | 2009-07-28 | 2011-02-10 | Mitsubishi Chemicals Corp | 白色発光装置およびそれを用いた照明装置 |
JP5370047B2 (ja) * | 2009-09-25 | 2013-12-18 | 三菱化学株式会社 | 白色発光装置のための演色性改善方法および白色発光装置 |
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JP5105132B1 (ja) * | 2011-06-02 | 2012-12-19 | 三菱化学株式会社 | 半導体発光装置、半導体発光システムおよび照明器具 |
CN104025321B (zh) | 2011-10-24 | 2018-06-19 | 株式会社东芝 | 白光源和包括所述白光源的白光源系统 |
WO2013069435A1 (ja) * | 2011-11-07 | 2013-05-16 | 株式会社東芝 | 白色光源およびそれを用いた白色光源システム |
WO2014054290A1 (ja) * | 2012-10-04 | 2014-04-10 | 株式会社 東芝 | 白色発光装置、照明装置、および歯科用照明装置 |
JP2015126160A (ja) * | 2013-12-27 | 2015-07-06 | サンケン電気株式会社 | 発光装置 |
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