JP6899765B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device for mounting components on a substrate.

A component mounting device for mounting an electronic component (hereinafter, simply referred to as a “component”) on a substrate such as a printed wiring board includes a head unit having a holder for holding the component. The head unit moves to a predetermined component mounting position while holding the component by the holder, and mounts the component on the board at the component mounting position.

When the part is held by the holder of the head unit, the position of the part with respect to the holder is not always constant, and the center of the part may shift from the center of the part holding surface of the holder. In this case, the components cannot be mounted accurately at the predetermined positions on the substrate. Therefore, before mounting the component on the substrate, while the head unit is moving toward the component mounting position, the holding tool holding the component is imaged by the camera. The position of the component with respect to the holder is calculated using the captured image captured by this camera, and the component is mounted on the substrate based on the calculation result. As a result, the mounting accuracy of the components on the board can be improved.

By the way, when the head unit is moving toward the component mounting position, the holder is vibrating. Since the image pickup by the camera is performed while the head unit is moving, the accuracy of calculating the position of the component with respect to the holder based on the captured image may decrease due to the vibration of the holder. A technique for solving this problem is disclosed in Patent Document 1. In the technique disclosed in Patent Document 1, the amount of vibration displacement from the initial position of the position correction marker provided integrally with the holder (nozzle) is calculated based on the image captured by the camera, and this vibration is generated. By referring to the displacement amount, the position of the part (inspection object) is calculated.

However, in the technique disclosed in Patent Document 1, since each image region of the position correction sign and the component exists in one captured image, it is difficult to distinguish between the position correction sign and the component. Therefore, for example, when the image areas of the position correction sign and the component overlap each other, there is a possibility that erroneous recognition that the position correction sign is a component may occur. As a result, the accuracy of the calculation result of the position of the component based on the image area of the component is lowered.

Japanese Unexamined Patent Publication No. 5-332723

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component mounting device including a head unit having a holder for holding a component in a state of being held by the holder. An object of the present invention is to provide a component mounting device capable of calculating the position of a component with high accuracy and improving the mounting accuracy of the component on a substrate.

The component mounting device according to one aspect of the present invention is provided with a reference mark, has a holder for holding a component, and moves to a predetermined component mounting position while the component is held by the retainer. An image is taken as a subject in which the head unit that mounts the component on the substrate at the component mounting position, the holder that holds the component, and the reference mark fit within the field of view while the head unit is moving to the component mounting position. It also includes an imaging device that acquires an image captured based on the reflected light from the subject, and a component recognition unit that recognizes the holding state of the component with respect to the holder based on the captured image. In the image pickup apparatus, the first captured image in which the mark region composed of pixels corresponding to the reference mark and the component region composed of pixels corresponding to the component are bright regions brighter than a predetermined value, and the mark region are A second captured image in which the dark region is darker than the predetermined value and the component region is brighter than the predetermined value is acquired. The component recognition unit is based on a storage unit that previously stores an initial image captured by the image pickup apparatus in a state where the head unit is stationary and the holder does not hold the component, and the component recognition unit based on the initial image. The initial mark position information representing the initial position of the reference mark is acquired, and the mark position information representing the position of the reference mark in the holder holding the component is acquired based on the first captured image to obtain the initial mark position information. The holding based on the vibration amount calculation unit that calculates the vibration displacement amount of the holder with the movement of the head unit by referring to the difference between the mark position information and the mark position information, and the second captured image. The position of the component with respect to the center of the component holding surface of the holder is calculated by acquiring the component position information representing the position of the component held by the tool and referring to the component position information and the vibration displacement amount. Includes a component position calculation unit and a component position calculation unit.

According to this component mounting device, the vibration amount calculation unit of the component recognition unit refers to the first image captured by the imaging of the image pickup device and calculates the vibration displacement amount of the holder due to the movement of the head unit. The first captured image referred to when the vibration displacement amount is calculated by the vibration amount calculation unit is an image in which the mark region corresponding to the reference mark attached to the holder is a bright region. Therefore, the vibration amount calculation unit can acquire the mark position information indicating the position of the reference mark on the holder holding the component with high accuracy. As a result, the vibration displacement amount of the holder calculated with reference to the mark position information becomes highly accurate.

Further, the component position calculation unit of the component recognition unit refers to the second captured image acquired by the imaging of the imaging device and calculates the position of the component with respect to the holder. The second captured image referred to when the component position calculation unit calculates the position of the component is an image in which the mark area corresponding to the reference mark is a dark area and the component area corresponding to the component is a bright area. Therefore, when the component position calculation unit acquires the component position information based on the second captured image, it is possible to avoid the occurrence of erroneous recognition that the reference mark is a component as much as possible. As a result, the component position calculation unit can acquire the component position information with high accuracy, and can calculate the position of the component with respect to the holder with high accuracy by referring to the component position information and the vibration displacement amount. .. Therefore, by using the component position calculated by the component position calculation unit, the mounting accuracy of the component on the substrate can be improved.

Further, since the second captured image is an image in which the mark area is a dark area and the component area is a bright area, even if the component and the reference mark are in close proximity to each other in the holder, the reference mark is used. The occurrence of erroneous recognition of recognizing a part as a part is avoided. Therefore, it is not necessary to attach the reference mark to the holder at a position sufficiently distant from the center of the component holding surface. As a result, the reference mark can be attached to the vicinity of the center of the component holding surface in the holder, and it is not necessary to secure a sufficient distance between the center of the component holding surface and the reference mark. Therefore, the size of the holder is small. Is planned. Further, since the reference mark can be attached to the vicinity of the center of the component holding surface in the holder, the field of view of imaging by the imaging device can be narrowed. As a result, it is possible to reduce the load of the calculation process by the vibration amount calculation unit and the component position calculation unit of the component recognition unit based on the captured image acquired by the image pickup apparatus.

In the component mounting device, in the reflected light from the subject, the reflected light from the reference mark is the first color component light of any one of the three primary colors, and is from at least a part of the region of the component. The reflected light is white light including the first color component light, the second color component light, and the third color component light, which are the color component lights of the three primary colors. The image pickup device includes a first image pickup device for capturing a color image and a first image pickup section including a first signal processing section for performing predetermined signal processing. The first image pickup element receives the reflected light from the subject and performs photoelectric conversion on the received light to obtain a first color component signal corresponding to the first color component light and the second color. A first electric signal including a second color component signal corresponding to the component light and a third color component signal corresponding to the third color component light is generated. The first signal processing unit performs the signal processing on the first electric signal to generate a first image signal representing the first captured image and a second image signal representing the second captured image. ..

In this aspect, each of the first image pickup image and the second image pickup image is acquired by one first image pickup unit including the first image pickup element for color image acquisition in one imaging operation. Can be done.

In the component mounting device, the first signal processing unit performs the signal processing of the first color component signal, the second color component signal, and the third color component signal included in the first electric signal, respectively. Is configured to perform gain adjustment processing by multiplying by the gain coefficient. In the gain adjustment process, the first signal processing unit multiplies the first color component signal by a gain coefficient having a value larger than that of the second color component signal and the third color component signal. One image signal is generated, and the second image signal is generated by multiplying the first color component signal by a gain coefficient having a value smaller than that of the second color component signal and the third color component signal.

In this aspect, since the first signal processing unit generates the first image signal and the second image signal by performing the gain adjustment processing on the first electric signal from the first image pickup element, the first image signal corresponding to each image signal is generated. The image resolution can be maintained high in the first captured image and the second captured image.

In the above-mentioned component mounting device, the first signal processing unit is configured to perform extraction processing for extracting a predetermined color component signal from the first electric signal as the signal processing. In the extraction process, the first signal processing unit generates the first image signal by extracting the first color component signal included in the first electric signal, and is included in the first electric signal. The second image signal is generated by extracting the second color component signal or the third color component signal.

In this embodiment, the first signal processing unit performs an extraction process for extracting a predetermined color component signal on the first electric signal from the first image sensor, thereby applying the extraction process to each of the first image and the second image. The corresponding first image signal and second image signal can be generated, respectively.

In the component mounting device, in the reflected light from the subject, the reflected light from the reference mark is the first color component light of any one of the three primary colors, and is from at least a part of the region of the component. The reflected light is white light including the first color component light, the second color component light, and the third color component light, which are the color component lights of the three primary colors. The imaging device includes a second imaging unit that acquires the first captured image and a third imaging unit that acquires the second captured image. The second imaging unit receives the first color component light and performs photoelectric conversion on the received light to generate a second electric signal, and the second imaging element for monochrome image imaging, and the second imaging unit. (2) Includes a second signal processing unit that generates a first image signal representing the first captured image by subjecting the electrical signal to a predetermined signal process. The third image pickup unit receives the second color component light or the third color component light, and performs photoelectric conversion on the received light to generate a third electric signal. It includes a third image sensor and a third signal processing unit that generates a second image signal representing the second image by subjecting the third electric signal to a predetermined signal process.

In this aspect, a first image pickup image is acquired by a second image pickup unit including a second image pickup element for capturing a black-and-white image, and a third image pickup configuration including a third image pickup element for capturing a monochrome image is taken. The second image can be acquired by the unit.

As described above, according to the present invention, in a component mounting device including a head unit having a holder for holding a component, the position of the component in a state of being held by the holder is calculated with high accuracy, and the position of the component is calculated with high accuracy with respect to the substrate. It is possible to provide a component mounting device capable of improving the mounting accuracy of components.

It is a top view which shows the structure of the component mounting apparatus which concerns on one Embodiment of this invention. It is a figure which shows schematic the component supply apparatus provided in the component mounting apparatus. It is a figure which shows the structure of the tape guide provided in the component supply apparatus. It is a perspective view of the component storage tape attached to the component supply device. It is a side view of the head unit provided in the component mounting apparatus. It is a top view of the head unit. It is the figure which looked at the suction nozzle provided in the head unit from the bottom. It is a figure for demonstrating the structure of the component recognition apparatus provided in the component mounting apparatus. It is an exploded perspective view of the image pickup device in the image pickup apparatus provided in the component recognition device. It is a figure which shows the initial image which was taken by the image pickup apparatus. It is a figure which shows the 1st captured image image | photographed by the image pickup apparatus. It is a figure which shows the 2nd captured image image | photographed by the image pickup apparatus. It is a block diagram which shows the control system of a component mounting apparatus. It is a figure which shows the 1st modification of the component recognition apparatus. It is a figure which shows the 2nd modification of the component recognition apparatus.

Hereinafter, the component mounting device according to the embodiment of the present invention will be described with reference to the drawings. In the following, the directional relationship will be described using the XYZ orthogonal coordinate axes. The X direction is a direction parallel to the horizontal plane, the Y direction is a direction orthogonal to the X direction on the horizontal plane, and the Z direction is a vertical direction orthogonal to both the X and Y directions. Further, the one-way side in the X direction is referred to as "+ X side", and the other direction side opposite to the one-way side in the X direction is referred to as "-X side". Further, the one-way side in the Y direction is referred to as "+ Y side", and the other direction side opposite to the one-way side in the Y direction is referred to as "-Y side". Further, the one-way side in the Z direction is referred to as "+ Z side", and the other direction side opposite to the one-way side in the Z direction is referred to as "-Z side".

<Structure of component mounting device>
FIG. 1 is a plan view showing a configuration of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 is a device for producing an electronic circuit board by mounting (mounting) components on a substrate K. The component mounting device 1 includes a device main body 1a, a moving frame 2, a conveyor 3, a component supply unit 4 on which the component supply device 5 is mounted, a head unit 6, a first drive mechanism 7, and a second drive mechanism. 8 and a component recognition device 9 are provided.

The device main body 1a is a structure in which each part constituting the component mounting device 1 is arranged, and is formed in a substantially rectangular shape in a plan view seen from the Z direction. The conveyor 3 extends in the X direction and is arranged on the apparatus main body 1a. The conveyor 3 conveys the substrate K in the X direction. The substrate K is conveyed on the conveyor 3 and is positioned at a predetermined component mounting position (position where components are mounted on the substrate K).

The component supply units 4 are arranged at four locations in total, two locations in the X direction, respectively, in the + Y side and −Y side region portions in the Y direction of the device main body 1a. The component supply unit 4 is an area in which a plurality of component supply devices 5 are mounted side by side in the device main body 1a, and is a target to be sucked by a suction nozzle 63 which is a holder provided in the head unit 6 described later. The set position of each component supply device 5 is divided for each component.

The parts supply device 5 is detachably attached to the parts supply unit 4 of the device main body 1a. The component supply device 5 is a tape feeder that supplies small pieces of electronic components (hereinafter, simply referred to as components) such as ICs, transistors, and capacitors using a tape as a carrier. The parts supply device 5 will be described with reference to FIGS. 2 to 4. FIG. 2 is a diagram schematically showing a component supply device 5 provided in the component mounting device 1. FIG. 3 is a diagram showing a configuration of a tape guide 45 provided in the component supply device 5. FIG. 4 is a perspective view of the component storage tape 100 mounted on the component supply device 5.

The component supply device 5 is attached to an attachment portion 31 provided in the component supply unit 4. The mounting portion 31 is provided with a plurality of slots 32 arranged at regular intervals in the X direction and extending in parallel with each other in the Y direction, and a fixing base 33 extending in the X direction at a position in front of the slots 32. Then, the component supply device 5 is set in each slot 32, and each component supply device 5 is fixed to the fixing base 33. As a result, a plurality of component supply devices 5 are arranged side by side in the X direction in the component supply unit 4.

The component supply device 5 includes a main body 41 having an elongated shape in the front-rear direction (Y direction). The component supply device 5 is fixed to the fixing base 33 with the main body 41 inserted (set) in the slot 32.

The parts supply device 5 is further provided in the first tape sending section 42 provided in the front end portion of the main body 41, the second tape sending section 43 provided in the rear end portion of the main body 41, and the main body 41. The tape passage 44 and the tape guide 45 are provided.

The tape passage 44 is a passage for guiding the component storage tape 100. The tape passage 44 extends obliquely upward from the rear end portion of the main body portion 41 toward the front upper portion. The component storage tape 100 as a component storage member is introduced into the inside from the rear end portion of the main body portion 41, and is guided to the upper surface front portion of the main body portion 41 through the tape passage 44.

As shown in FIG. 4, the component storage tape 100 is a long tape composed of a tape main body 101 and a cover tape 102. A large number of component storage portions 103 (recesses) opened at the top of the tape main body 101 are formed at regular intervals in the longitudinal direction (tape feed direction), and the component E is stored in each component storage portion 103. The cover tape 102 is adhered to the upper surface of the tape main body 101, whereby each component storage portion 103 is closed by the cover tape 102. Further, on the side of the component storage portion 103 of the tape main body 101, a plurality of fitting holes 104 are provided which are arranged at regular intervals in the longitudinal direction and penetrate the tape main body 101 in the thickness direction thereof.

In the component supply device 5, the tape guide 45 is provided on the upper surface of the front portion of the main body portion 41. The tape guide 45 covers the component storage tape 100 that has passed through the tape passage 44, and guides the component storage tape 100 substantially horizontally along the upper surface of the main body 41 to the component supply position P1. The component supply position P1 is a position at which the head unit 6 is allowed to take out components, and is set at a position close to the front end of the upper surface of the main body 41.

As shown in FIG. 3, an opening 45A is provided at a position corresponding to the component supply position P1 in the tape guide 45, and a component exposed portion 451 is provided at a position rearward from the opening 45A. ing. The component exposed portion 451 exposes the component E in the component accommodating portion 103 of the component accommodating tape 100 guided by the tape guide 45. The component exposed portion 45 includes an insertion portion 4511, a blade portion 4512, and a cover tape post-processing portion 4513.

In the component exposed portion 451 the insertion portion 4511 is a thin plate-shaped portion formed in a tapered shape, and is guided by the tape guide 45 with respect to the component storage tape 100 in a state where the tip is a free end, and the tape body 101. It is inserted between the cover tape 102 and the cover tape 102. The blade portion 4512 in the component exposed portion 451 is arranged on the downstream side in the tape feeding direction with respect to the insertion portion 4511, and cuts the cover tape 102 in a straight line along the tape feeding direction according to the traveling of the component storage tape 100. To do. In the component exposed portion 451 the cover tape post-processing portion 4513 is arranged on the downstream side in the tape feeding direction with respect to the blade portion 4512, and performs a process of spreading the cover tape 102 cut by the blade portion 4512. As a result, the component E can be exposed in the component storage section 103 of the component storage tape 100. The component E exposed in the component storage unit 103 in this way is attracted by the suction nozzle 63 of the head unit 6 in the component mounting device 1 through the opening 45A of the tape guide 45 at the component supply position P1. Taken out.

In the component supply device 5, the first tape delivery unit 42 transmits the driving force of the first sprocket 51, the first motor 52, and the first motor 52 arranged below the tape guide 45 to the first sprocket 51. It is provided with a first gear group 53 composed of a plurality of transmission gears. The first sprocket 51 has teeth that fit into the fitting holes 104 of the component storage tape 100 that is guided along the tape guide 45. That is, the first tape delivery unit 42 sends out the component storage tape 100 toward the component supply position P1 by rotationally driving the first sprocket 51 by the first motor 52.

In the component supply device 5, the second tape delivery unit 43 transfers the driving force of the second sprocket 54, the second motor 55, and the second motor 55 arranged at the rear end of the main body 41 to the second sprocket 54. It includes a second gear group 56 including a plurality of transmission gears for transmission. The second sprocket 54 faces into the tape passage 44 from above, and has teeth that fit into the fitting holes 104 of the component storage tape 100 guided along the tape passage 44. That is, the second tape delivery unit 43 sends the component storage tape 100 forward (part supply position P1) by rotationally driving the second sprocket 54 by the second motor 55.

The component storage tape 100 is intermittently delivered toward the component supply position P1 by the delivery portions 42 and 43, and the component E is taken out through the opening 45A of the tape guide 45 at the component supply position P1.

Next, referring to FIG. 1, the moving frame 2 provided in the component mounting device 1 extends in the X direction and is movably supported by the device main body 1a in a predetermined moving direction (Y direction). The head unit 6 is mounted on the moving frame 2. The head unit 6 is mounted on the moving frame 2 so as to be movable in the X direction. That is, the head unit 6 can move in the Y direction as the moving frame 2 moves, and can move in the X direction along the moving frame 2. The head unit 6 is movable between the component supply position P1 of the component supply device 5 mounted on the component supply unit 4 and a predetermined component mounting position of the substrate K conveyed by the conveyor 3, and is movable at the component supply position P1. The component E is taken out from the component supply device 5, and the taken out component E is mounted (mounted) on the substrate K at the component mounting position. Details of the head unit 6 will be described later.

The first drive mechanism 7 is arranged at the + X side and −X side ends of the apparatus main body 1a. The first drive mechanism 7 is a mechanism for moving the moving frame 2 in the Y direction. The first drive mechanism 7 includes, for example, a drive motor, a ball screw shaft extending in the Y direction and connected to the drive motor, and a ball nut disposed on the moving frame 2 and screwed with the ball screw shaft. Consists of. The first drive mechanism 7 having such a configuration moves the moving frame 2 in the Y direction by moving the ball nut forward and backward along the ball screw shaft as the ball screw shaft is rotationally driven by the drive motor.

The second drive mechanism 8 is arranged on the moving frame 2. The second drive mechanism 8 is a mechanism for moving the head unit 6 in the X direction along the moving frame 2. Similar to the first drive mechanism 7, the second drive mechanism 8 includes, for example, a drive motor, a ball screw shaft extending in the X direction and connected to the drive motor, and a ball screw shaft disposed on the head unit 6. It is configured to include a ball nut to be screwed. The second drive mechanism 8 having such a configuration moves the head unit 6 in the X direction by moving the ball nut forward and backward along the ball screw shaft as the ball screw shaft is rotationally driven by the drive motor.

In this example, the first drive mechanism 7 and the second drive mechanism 8 have a configuration in which the moving frame 2 and the head unit 6 are moved by the drive motor via the ball screw shaft. However, for example, a linear motor may be used as a drive source to directly drive the moving frame 2 and the head unit 6.

The head unit 6 will be described with reference to FIGS. 5 to 7 in addition to FIG. FIG. 5 is a side view of the head unit 6, and FIG. 6 is a plan view of the head unit 6 as viewed from below. Further, FIG. 7 is a plan view of the suction nozzle 63 provided in the head unit 6 as viewed from below.

The head unit 6 includes a head body 61, a rotating body 62, and a suction nozzle 63. The head main body 61 constitutes a main body portion of the head unit 6. The rotating body 62 is formed in a columnar shape, and is provided on the head main body 61 so as to be rotatable around a vertical axis (axis extending in the Z direction) by a rotating body driving mechanism 65 (see FIG. 13 described later).

A plurality of suction nozzles 63 are arranged at the outer peripheral edge of the rotating body 62 at predetermined intervals in the circumferential direction. The suction nozzle 63 is a holder capable of sucking and holding the component E supplied to the component supply position P1 by the component supply device 5. The suction nozzle 63 can communicate with any of the negative pressure generator, the positive pressure generator, and the atmosphere via the electric switching valve. That is, the negative pressure is supplied to the suction nozzle 63 to enable the suction nozzle 63 to hold the suction of the component E (take out the component), and then the positive pressure is supplied to hold the component E to suction. It will be released. In the present embodiment, the holder other than the suction nozzle 63 may be, for example, a chuck that grips and holds the component E.

The suction nozzle 63 is provided on the rotating body 62 so as to be able to move up and down in the vertical direction (Z direction) by the nozzle raising and lowering drive mechanism 66 (see FIG. 13 described later). The suction nozzle 63 is located in the Z direction (vertical direction) between the holding position where the component E supplied to the component supply position P1 by the component supply device 5 can be held and the retracted position on the upper side of the holding position. It is possible to move along. That is, when the component E supplied to the component supply position P1 is held, the suction nozzle 63 is lowered from the retracted position to the holding position by the nozzle elevating drive mechanism 66, and the component E is sucked and held at the holding position. On the other hand, the suction nozzle 63 after the suction and holding of the component E is raised from the holding position to the retracted position by the nozzle elevating drive mechanism 66.

Further, as shown in FIG. 7, a reference mark M is attached to the suction nozzle 63. The reference mark M is attached to the tip portion 631 of the suction nozzle 63, which is near the center of the component holding surface 632 that holds the component E in the suction nozzle 63. The shape of the reference mark M is not particularly limited, but in the example shown in FIG. 7, it is a cross shape such that the two linear portions M1 and M2 intersect at the center of the component holding surface 632. The reference mark M is colored in the first color of any of the three primary colors consisting of blue (B), green (G), and red (R). The reference mark M may be recognized as the first color in the image captured by the image pickup device 92 of the component recognition device 9 described later, and may not be colored in the first color. For example, it may be configured to emit light in the first color. In the present embodiment, the first color that is the color of the reference mark M is blue (B).

Further, as shown in FIGS. 5 and 6, a substrate recognition camera 64 is provided on the lower surface of the head main body 61 of the head unit 6. The substrate recognition camera 64 moves together with the head unit 6 to identify and position the type of the substrate K, and images various marks written on the upper surface of the substrate K from above.

Further, the component mounting device 1 according to the present embodiment includes a component recognition device 9. The component recognition device 9 will be described with reference to FIG. 8 in addition to FIG. FIG. 8 is a diagram for explaining the configuration of the component recognition device 9.

The component recognition device 9 is arranged at a position between each component supply unit 4 and the conveyor 3 on the apparatus main body 1a (see FIG. 1). The component recognition device 9 is attracted and held by the suction nozzle 63 while the head unit 6 is moving from the component supply position P1 of the component supply device 5 to the component mounting position of the substrate K conveyed by the conveyor 3. This is a device for recognizing the holding state of the component E. The component recognition device 9 includes a light source device 91 and an image pickup device 92.

In the component recognition device 9, the light source device 91 is a device that irradiates light toward the suction nozzle 63 holding the component E while the head unit 6 is moving to the component mounting position. The light emitted from the light source device 91 is reflected by the half mirror 97 and is irradiated toward the suction nozzle 63 holding the component E. In the example shown in FIG. 8, the irradiation light IL for the adsorption nozzle 63 holding the component E by the light source device 91 is the first irradiation color component light (blue component light) BIL and the second irradiation, which are the color component lights of the three primary colors. It is a white light containing a color component light (green component light) GIL and a third irradiation color component light (red component light) RIL, respectively.

The reflected light RL reflected from the suction nozzle 63 holding the component E in response to the irradiation of the irradiation light IL by the light source device 91 passes through the half mirror 97 and is incident on the image pickup device 92. The reflected light RL from the adsorption nozzle 63 holding the component E is the first color component light (blue component light) BRL, the second color component light (green component light) GRL, and the third color component light, which are the color component lights of the three primary colors. Each includes color component light (red component light) RRL. The reflected light from the reference mark M attached to the tip end portion 631 of the suction nozzle 63 and colored in blue (B) is the first color component light BRL. Further, the reflected light from at least a part of the region E of the component E held by the adsorption nozzle 63 is white light including the first color component light BRL, the second color component light GRL, and the third color component light RRL, respectively. is there.

In the component recognition device 9, the image pickup device 92 is moving the head unit 6 to the component mounting position, and the light source device 91 irradiates the irradiation light IL with the suction nozzle 63 holding the component E as a subject. Image from below. The image pickup apparatus 92 takes an image so that the tip 631 of the suction nozzle 63 holding the component E and the reference mark M are within the field of view, and acquires an image taken based on the reflected light RL from the subject.

In the example shown in FIG. 8, the image pickup apparatus 92 includes a first image pickup unit 93. The first image pickup unit 93 includes a first lens 94, a first image pickup element 95 for capturing a color image, and a first signal processing unit 96 that performs predetermined signal processing. The first lens 94 is an optical lens that collects the reflected light RL from the suction nozzle 63 (hereinafter, may be referred to as “subject”) holding the component E and guides it to the first image sensor 95.

As shown in the exploded perspective view of FIG. 9, the first image sensor 95 is an image sensor for color image imaging having a color filter 951. Examples of the image pickup device include CCD (Charged-coupled devices) and CMOS (Complementary metallic-oxide-semiconductor). In the first image pickup element 95, a plurality of pixels P that receive the reflected light RL from the subject are arranged in a matrix, and the first color component light BRL, the second color component light GRL, and the color component light of each of the three primary colors are arranged. A color filter 951 that transmits the third color component light RRL is individually arranged on each of the pixels P. The color filter 951 arranged on each pixel P of the first image sensor 95 includes a filter BF that transmits the first color component light BRL, a filter GF that transmits the second color component light GRL, and a third color component light. The filter RF that passes through the RRL is arranged according to a predetermined rule. The sequence of each filter BF, GF, RF in the color filter 951 is, for example, a Bayer sequence.

The first image sensor 95 receives the reflected light RL from the subject incident through the first lens 94 and performs photoelectric conversion on the received light to generate the first electric signal ES1. .. The first electric signal ES1 generated by the first imaging element 95 becomes the first color component signal (blue component signal) BES and the second color component light GRL corresponding to the first color component light BRL contained in the reflected light RL. The corresponding second color component signal (green component signal) GES and the third color component signal (red component signal) RES corresponding to the third color component light RRL are included.

The first signal processing unit 96 generates a first image signal IS1 and a second image signal IS2 by performing predetermined signal processing on the first electric signal ES1 generated by the first image sensor 95. The first image signal IS1 and the second image signal IS2 are digital signals that have been A / D converted so that they can be displayed and recorded. The first image signal IS1 is a signal that enables the display and recording of the first captured image, and the second image signal IS2 is a signal that enables the display and recording of the second captured image.

Here, the image captured by the image pickup apparatus 92 including the first image pickup unit 93 including the first lens 94, the first image pickup element 95, and the first signal processing unit 96 will be described with reference to FIGS. 10 to 12. To do. FIG. 10 is a diagram showing an initial image J1 captured by the imaging device 92. FIG. 11 is a diagram showing a first captured image J2 captured by the imaging device 92. FIG. 12 is a diagram showing a second captured image J3 captured by the imaging device 92.

The initial image J1 shown in FIG. 10 is an image captured by the imaging device 92 in a state where the head unit 6 is stationary and the suction nozzle 63 does not hold the component E. The initial image J1 is stored in advance in the storage unit 133 shown in FIG. 13 described later. The initial image J1 includes a mark region J11 composed of pixels corresponding to the reference mark M and a nozzle tip region J12 composed of pixels corresponding to the tip portion 631 of the suction nozzle 63 in the frame V of the image. In the initial image J1, the center S1 of the nozzle tip region J12 is arranged at a position corresponding to the center V1 of the frame V. The center S1 of the nozzle tip region J12 in the initial image J1 corresponds to the center of the component holding surface 632 of the suction nozzle 63. That is, the initial image J1 is an image in which the center of the component holding surface 632 of the suction nozzle 63 is located at the center of the image. Further, in the initial image J1, a mark reference point S2 corresponding to a mark reference position preset in the reference mark M exists on the mark area J11.

The first captured image J2 shown in FIG. 11 is an captured image captured by the first imaging unit 93 of the imaging device 92 while the head unit 6 is moving to the component mounting position, and is captured by the first signal processing unit 96. It is an image represented by the generated first image signal IS1. In the first captured image J2, the mark area J21 (the area hatched in FIG. 11) composed of the pixels corresponding to the reference mark M and the component area J23 composed of the pixels corresponding to the component E are brighter than the predetermined values. The nozzle tip region J22, which is a region and is composed of pixels corresponding to the tip portion 631 of the suction nozzle 63, is a dark region darker than a predetermined value.

When the head unit 6 is moving toward the component mounting position, the suction nozzle 63 is vibrating. Therefore, the first captured image J2 is an image in which the center of the component holding surface 632 of the suction nozzle 63 is arranged at a position deviated from the center of the image. That is, in the first captured image J2, the center of the nozzle tip region J22 corresponding to the center of the component holding surface 632 is arranged at a position deviated from the center V1 of the frame V of the image. However, at the timing when the first captured image J2 is captured, the component E is held by the component holding surface 632 of the suction nozzle 63, so that the component holding surface 632 is hidden by the component E in the first captured image J2. , The position of the center of the component holding surface 632 cannot be recognized. That is, in the first captured image J2, the position of the center of the nozzle tip region J22 corresponding to the center of the component holding surface 632 cannot be recognized.

Since the mark area J21 is a bright area in the first captured image J2, the mark reference point S21 on the mark area J21 corresponding to the mark reference position of the reference mark M can be recognized. The mark reference point S21 on the mark area J21 in the first captured image J2 is the vibration displacement amount H1 of the suction nozzle 63 accompanying the movement of the head unit 6 with respect to the mark reference point S2 on the mark area J11 in the initial image J1. They are arranged at different positions according to the above. That is, the movement of the head unit 6 is performed by referring to the difference between the position of the mark reference point S2 on the mark area J11 in the initial image J1 and the position of the mark reference point S21 on the mark area J21 in the first captured image J2. It is possible to calculate the vibration displacement amount H1 of the suction nozzle 63 accompanying the above. The details of the calculation method of the vibration displacement amount H1 will be described later.

The second captured image J3 shown in FIG. 12 is an captured image captured at the same time as the first captured image J2 by the first imaging unit 93 of the imaging device 92 while the head unit 6 is moving to the component mounting position. This is an image represented by the second image signal IS2 generated by the first signal processing unit 96. In the second captured image J3, the mark region J31 composed of pixels corresponding to the reference mark M and the nozzle tip region J32 composed of pixels corresponding to the tip portion 631 of the suction nozzle 63 are set as dark regions darker than a predetermined value. The component region J33 composed of pixels corresponding to the component E is defined as a bright region brighter than a predetermined value.

Since the second captured image J3 is an image captured at the same time as the first captured image J2 when the suction nozzle 63 vibrates due to the movement of the head unit 6, the components of the suction nozzle 63 are similar to the first captured image J2. The image is such that the center of the holding surface 632 is arranged at a position deviated from the center of the image. That is, in the second captured image J3, the center S11 of the nozzle tip region J32 corresponding to the center of the component holding surface 632 is arranged at a position deviated from the center V1 of the frame V of the image. In the second captured image J3, the component holding surface 632 is hidden by the component E, and the position of the center S11 of the nozzle tip region J32 corresponding to the center of the component holding surface 632 cannot be directly recognized. The position of the center S11 of the nozzle tip region J32 is indirectly calculated by adding the vibration displacement amount H1 to the center V1 of the frame V of the image with reference to the vibration displacement amount H1 that can be calculated based on the first captured image J2. can do. Details of the method for calculating the position of the center S11 of the nozzle tip region J32 corresponding to the center of the component holding surface 632 will be described later.

Further, in the second captured image J3, since the component region J33 is a bright region, the center S3 of the component region J33 corresponding to the center of the component E can be recognized. Therefore, the amount of deviation H2 of the center S3 of the component region J33 from the center S11 of the nozzle tip region J32 can be calculated based on the second captured image J3. That is, the position of the component E with respect to the center of the component holding surface 632 of the suction nozzle 63 can be calculated with reference to the deviation amount H2. Details of the method for calculating the position of the component E with respect to the center of the component holding surface 632 will be described later.

Next, with reference to FIG. 8, in the first image pickup unit 93, the signal processing of the first signal processing unit 96 with respect to the first electric signal ES1 generated by the first image pickup element 95 will be described in detail.

The first signal processing unit 96 performs signal processing for Bayer-converting the first electric signal ES1 generated by the first image pickup element 95 for color image imaging in which the color filters 951 arranged in the Bayer arrangement are arranged. Each of the first captured image J2 and the second captured image J3 can be acquired by the imaging operation once. The Bayer conversion is a process of interpolating a color component from the pixels around each pixel P for each pixel P of the first image sensor 95, so that each pixel P has R (red), G (green), and so on. This is a process of obtaining the luminance information of B (blue) and generating an image signal. In this Bayer conversion, the first signal processing unit 96 generates the first image signal IS1 representing the first captured image J2 and the second image signal IS2 representing the second captured image J3 based on the first electric signal ES1. , It is configured to perform gain adjustment processing.

In the gain adjustment process, the first signal processing unit 96 multiplies each of the first color component signal BES, the second color component signal GES, and the third color component signal RES included in the first electric signal ES1 by a gain coefficient. .. Specifically, in the gain adjustment process, the first signal processing unit 96 multiplies the first color component signal BES by a gain coefficient having a value larger than that of the second color component signal GES and the third color component signal RES. Generates the first image signal IS1 representing the first captured image J2. In the first electric signal ES1, the first color component signal BES is a color component signal corresponding to the first color component light BRL included in the reflected light from the reference mark M and the component E. Therefore, by performing a gain adjustment process for multiplying the first color component signal BES by a gain coefficient of a large value on the first electric signal ES1, the first signal processing unit 96 attaches the reference mark M and the component E to each of the reference marks M and the component E. It is possible to generate the first image signal IS1 representing the first captured image J2 in which the corresponding mark area J21 and the component area J23 are bright areas.

Further, in the gain adjustment processing, the first signal processing unit 96 multiplies the first color component signal BES by a gain coefficient having a value smaller than that of the second color component signal GES and the third color component signal RES. 2 Generates a second image signal IS2 representing the captured image J3. Specifically, the first signal processing unit 96 receives one color component signal (for example, a third color component signal) of the second color component signal GES and the third color component signal RES, which are different from the first color component signal BES. Multiply RES) by a gain coefficient that is larger than the first color component signal BES and the second color component signal GES, in other words, smaller than the third color component signal RES for the first color component signal BES. The second image signal IS2 is generated by multiplying the value gain coefficient. In the first electric signal ES1, the first color component signal BES is a color component signal corresponding to the first color component light BRL included in the reflected light from the reference mark M and the component E, and is a third color component signal. The RES is a color component signal corresponding to the third color component light RRL included in the reflected light from the component E. Therefore, the first electric signal ES1 is subjected to a gain adjustment process of multiplying the first color component signal BES by a small value gain coefficient and multiplying the third color component signal RES by a large value gain coefficient. The first signal processing unit 96 has a second image representing the second captured image J3, in which the mark region J31 corresponding to the reference mark M is a dark region and the component region J33 corresponding to the component E is a bright region. The signal IS2 can be generated.

The first signal processing unit 96 is configured to generate the first image signal IS1 and the second image signal IS2 by performing gain adjustment processing on the first electric signal ES1 from the first image pickup element 95, so that each image signal is generated. High image resolution can be maintained in the first captured image J2 and the second captured image J3 corresponding to IS1 and IS2.

Further, the first signal processing unit 96 may be configured to perform extraction processing when generating the first image signal IS1 and the second image signal IS2 based on the first electric signal ES1. In the extraction process, the first signal processing unit 96 generates a first image signal IS1 and a second image signal IS2 by extracting a predetermined color component signal from the first electric signal ES1.

Specifically, in the extraction process, the first signal processing unit 96 extracts the first color component signal BES included in the first electric signal ES1 to obtain the first image signal IS1 representing the first captured image J2. Generate. In the first electric signal ES1, the first color component signal BES is a color component signal corresponding to the first color component light BRL included in the reflected light from the reference mark M and the component E. Therefore, by applying the extraction process for extracting the first color component signal BES to the first electric signal ES1, the first signal processing unit 96 can display the mark area J21 and the component area corresponding to each of the reference mark M and the component E. It is possible to generate the first image signal IS1 representing the first captured image J2 in which J23 is a bright region.

Further, in the extraction process, the first signal processing unit 96 extracts the second color component signal GES or the third color component signal RES other than the first color component signal BES contained in the first electric signal ES1. A second image signal IS2 representing the second captured image J3 is generated. In the present embodiment, in the extraction process, the first signal processing unit 96 generates the second image signal IS2 by extracting the third color component signal RES included in the first electric signal ES1. In the first electric signal ES1, the second color component signal GES or the third color component signal RES is not included in the reflected light from the reference mark M, but is included in the reflected light from the component E. , RRL-corresponding color component signal. Therefore, by performing an extraction process for extracting the second color component signal GES or the third color component signal RES on the first electric signal ES1, the first signal processing unit 96 has a mark region J31 corresponding to the reference mark M. It is possible to generate the second image signal IS2 representing the second captured image J3, which is a dark region and the component region J33 corresponding to the component E is a bright region.

<Control system for component mounting equipment>
Next, the control system of the component mounting device 1 will be described with reference to the block diagram of FIG. The component mounting device 1 includes a control unit 10. The control unit 10 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing a control program, a RAM (Random Access Memory) used as a work area of the CPU, and the like. The control unit 10 comprehensively controls the operation of the component mounting device 1 by executing the control program stored in the ROM by the CPU. As shown in FIG. 13, the control unit 10 includes a component supply control unit 11, a head drive control unit 12, and a component recognition unit 13.

The component supply control unit 11 controls the supply operation of the component E to the component supply position P1 by the component supply device 5.

The head drive control unit 12 controls the movement of the head unit 6 by the first drive mechanism 7 and the second drive mechanism 8 on the horizontal plane with respect to the X direction and the Y direction. Further, the head drive control unit 12 controls the raising / lowering operation of the suction nozzle 63 by the nozzle raising / lowering drive mechanism 66. Further, the head drive control unit 12 controls the rotational operation of the rotating body 62 by the rotating body driving mechanism 65.

The component recognition unit 13 performs a component recognition process for recognizing the holding state of the component E with respect to the suction nozzle 63 based on the first captured image J2 and the second captured image J3 acquired by the imaging device 92 including the first imaging unit 93. Do. The component recognition unit 13 includes a vibration amount calculation unit 131, a component position calculation unit 132, and a storage unit 133.

In the component recognition unit 13, the storage unit 133 is imaged by the image pickup device 92 including the first image pickup unit 93 in a state where the head unit 6 is stationary and the suction nozzle 63 does not hold the component E. Image J1 (see FIG. 10) is stored in advance.

In the component recognition unit 13, the vibration amount calculation unit 131 acquires the initial mark position information representing the initial position of the reference mark M based on the initial image J1 and based on the first captured image J2 (see FIG. 11). , Acquires mark position information indicating the position of the reference mark M in the suction nozzle 63 holding the component E. Then, the vibration amount calculation unit 131 calculates the vibration displacement amount H1 (see FIG. 11) of the suction nozzle 63 accompanying the movement of the head unit 6 by referring to the difference between the initial mark position information and the mark position information. To do.

Specifically, the vibration amount calculation unit 131 uses the position of the center S1 of the nozzle tip region J12 in the initial image J1 as information representing the position of the center of the component holding surface 632 of the suction nozzle 63 in the stationary state of the head unit 6. To get. Further, the vibration amount calculation unit 131 acquires the position of the mark reference point S2 on the mark area J11 in the initial image J1 as the initial mark position information representing the initial position of the reference mark M in the stationary state of the head unit 6. Further, the vibration amount calculation unit 131 provides mark position information indicating the position of the reference mark M when the suction nozzle 63 vibrates due to the movement of the head unit 6, as a mark reference point on the mark region J21 in the first captured image J2. Acquire the position of S21. Then, the vibration amount calculation unit 131 refers to the difference between the position of the mark reference point S2 on the mark area J11 in the initial image J1 and the position of the mark reference point S21 on the mark area J21 in the first captured image J2. Therefore, the vibration displacement amount H1 of the suction nozzle 63 accompanying the movement of the head unit 6 is calculated.

Here, in the first captured image J2 referred to when the vibration displacement amount H1 is calculated by the vibration amount calculation unit 131, the mark region J21 corresponding to the reference mark M attached to the tip portion 631 of the suction nozzle 63 is a bright region. It is an image that has been made. Therefore, the vibration amount calculation unit 131 can acquire the position of the mark reference point S21 on the mark region J21 in the first captured image J2 with high accuracy. As a result, the vibration displacement amount H1 of the suction nozzle 63 calculated with reference to the position of the mark reference point S21 on the mark region J21 in the first captured image J2 becomes highly accurate.

In the component recognition unit 13, the component position calculation unit 132 acquires component position information indicating the position of the component E held by the suction nozzle 63 based on the second captured image J3 (see FIG. 12). Then, the component position calculation unit 132 refers to the acquired component position information and the vibration displacement amount H1 calculated by the vibration amount calculation unit 131 to hold the component of the suction nozzle 63 while the head unit 6 is moving. The position of the component E with respect to the center of the surface 632 is calculated.

Specifically, the component position calculation unit 132 moves the head unit 6 by adding the vibration displacement amount H1 calculated by the vibration amount calculation unit 131 to the center V1 of the frame V of the second captured image J3. The position of the center S11 of the nozzle tip region J32 in the second captured image J3 is calculated as information representing the position of the center of the component holding surface 632 when the suction nozzle 63 is vibrated. Further, the component position calculation unit 132 provides component position information indicating the position of the component E held by the suction nozzle 63 when the suction nozzle 63 vibrates due to the movement of the head unit 6 as component position information in the second captured image J3. Acquire the position of the center S3 of the area J33. Further, the component position calculation unit 132 calculates the deviation amount H2 of the center S3 of the component region J33 from the center S11 of the nozzle tip region J32 with reference to the second captured image J3. Then, the component position calculation unit 132 can calculate the position of the component E with respect to the center of the component holding surface 632 of the suction nozzle 63 with reference to the above-mentioned deviation amount H2.

Here, in the second captured image J3 referred to when the component position calculation unit 132 calculates the position of the component E, the mark area J31 corresponding to the reference mark M is set as a dark area, and the component area J33 corresponding to the component E is used. Is an image in which is a bright region. Therefore, when the component position calculation unit 132 acquires the position of the center S3 of the component region J33 in the second captured image J3, the occurrence of erroneous recognition that the reference mark M is recognized as the component E is avoided as much as possible. can do. As a result, the component position calculation unit 132 acquires the position of the center S3 of the component region J33 in the second captured image J3 with high accuracy, and obtains the information regarding the position of the center S3 of the component region J33 and the vibration displacement amount H1. By referring to it, the position of the component E with respect to the center of the component holding surface 632 of the suction nozzle 63 can be calculated with high accuracy. Therefore, by using the position of the component E calculated by the component position calculation unit 132, the mounting accuracy of the component E on the substrate K can be improved by the drive operation of the head unit 6 based on the control of the head drive control unit 12. ..

Further, since the second captured image J3 is an image in which the mark region J31 is a dark region and the component region J33 is a bright region, the component E and the reference mark M are in close proximity to each other in the suction nozzle 63. Even so, the occurrence of erroneous recognition that the reference mark M is recognized as the component E is avoided. Therefore, in the suction nozzle 63, it is not necessary to attach the reference mark M at a position sufficiently distant from the center of the component holding surface 632. As a result, the reference mark M can be attached to the suction nozzle 63 near the center of the component holding surface 632, and it is not necessary to secure a sufficient distance between the center of the component holding surface 632 and the reference mark M. , The suction nozzle 63 can be miniaturized. Further, since the reference mark M can be attached to the suction nozzle 63 near the center of the component holding surface 632, the field of view of imaging by the imaging device 92 can be narrowed. Thereby, the load of the calculation process by the vibration amount calculation unit 131 and the component position calculation unit 132 of the component recognition unit 13 based on the captured images J2 and J3 acquired by the image pickup apparatus 92 can be reduced.

Although the component mounting device 1 according to the embodiment of the present invention has been described above, the present invention is not limited to this, and for example, the following modified embodiment can be adopted.

In the above embodiment, the component recognition device 9 includes an image pickup device 92 including a light source device 91 that irradiates an irradiation light IL made of white light and a first image pickup unit 93 including a first image pickup element 95 for color image acquisition. Although the configuration including the above has been described, the present invention is not limited to such a configuration. A modified example of the component recognition device 9 will be described with reference to FIGS. 14 and 15.

FIG. 14 is a diagram showing a configuration of the component recognition device 9A according to the first modification. In the component recognition device 9A, the head unit 6 is moving from the component supply position P1 of the component supply device 5 to the component mounting position of the substrate K conveyed by the conveyor 3, similarly to the component recognition device 9 described above. This is a device for recognizing the holding state of the component E that is sucked and held by the suction nozzle 63. The component recognition device 9A includes a light source device 91A and an image pickup device 92A.

In the component recognition device 9A, the light source device 91A is a device that irradiates light toward the suction nozzle 63 holding the component E while the head unit 6 is moving to the component mounting position. The light emitted from the light source device 91A is reflected by the first half mirror 97 and is irradiated toward the suction nozzle 63 holding the component E. The irradiation light IL for the suction nozzle 63 holding the component E by the light source device 91A may be light that includes at least the color component light corresponding to the color of the reference mark M. Examples of such irradiation light IL include first irradiation color component light (blue component light) BIL, second irradiation color component light (green component light) GIL, and third irradiation color component light (red component light) RIL, respectively. It may be white light including, or two colors of light including a first irradiation color component light BIL corresponding to the color of the reference mark M and another color component light (for example, a third irradiation color component light RIL). It may be. Hereinafter, it is assumed that the light source device 91A is configured to irradiate the irradiation light IL composed of white light.

The reflected light RL reflected from the suction nozzle 63 holding the component E in response to the irradiation of the irradiation light IL by the light source device 91A passes through the first half mirror 97 and passes through the second half mirror 98 to the image pickup device 92A. Incident in. The reflected light RL from the adsorption nozzle 63 holding the component E is the first color component light (blue component light) BRL, the second color component light (green component light) GRL, and the third color component light, which are the color component lights of the three primary colors. Each includes color component light (red component light) RRL. The reflected light from the reference mark M attached to the tip end portion 631 of the suction nozzle 63 and colored in blue (B) is the first color component light BRL. Further, the reflected light from at least a part of the region E of the component E held by the adsorption nozzle 63 is white light including the first color component light BRL, the second color component light GRL, and the third color component light RRL, respectively. is there.

In the component recognition device 9A, the image pickup device 92A includes two image pickup units, a second image pickup unit 93A and a third image pickup unit 93B. The reflected light RL from the suction nozzle 63 holding the component E is reflected by the second half mirror 98 and guided toward the second image pickup unit 93A, passes through the second half mirror 98, and is transmitted to the third image pickup unit 93B. Guided towards.

A first filter F1 is arranged between the second half mirror 98 and the second imaging unit 93A. The first filter F1 transmits the first color component light BRL among the reflected light RL from the adsorption nozzle 63 holding the component E, and regulates the transmission of the second color component light GRL and the third color component light RRL. It is an optical filter. That is, of the reflected light RL from the suction nozzle 63 holding the component E, only the first color component light BRL that has passed through the first filter F1 is incident on the second imaging unit 93A.

Further, a second filter F2 is arranged between the second half mirror 98 and the third imaging unit 93B. The second filter F2 transmits the third color component light RRL among the reflected light RL from the adsorption nozzle 63 holding the component E, and regulates the transmission of the first color component light BRL and the second color component light GRL. It is an optical filter. That is, of the reflected light RL from the suction nozzle 63 holding the component E, only the third color component light RRL that has passed through the second filter F2 is incident on the third imaging unit 93B.

The second imaging unit 93A takes an image so that the tip 631 of the suction nozzle 63 holding the component E and the reference mark M are within the field of view, and the first color component light BRL incident through the first filter F1 is captured. The first captured image J2 (see FIG. 11) based on the image is acquired. The second image pickup unit 93A includes a second lens 94A, a second image pickup element 95A for capturing a monochrome image, and a second signal processing unit 96A that performs predetermined signal processing. The second lens 94A is an optical lens that collects the first color component light BRL incident through the first filter F1 and guides it to the second image sensor 95A.

The second image pickup device 95A is an image pickup device for capturing a monochrome image made of a CCD, CMOS, or the like. The second image sensor 95A receives the first color component light BRL incident through the second lens 94A and performs photoelectric conversion on the received light to generate the second electric signal ES2. .. The second electric signal ES2 generated by the second image sensor 95A includes a first color component signal (blue component signal) BES corresponding to the first color component light BRL.

The second signal processing unit 96A generates the first image signal IS1 by performing predetermined signal processing on the second electric signal ES2 generated by the second image sensor 95A. The first image signal IS1 is a digital signal that has been A / D converted so that it can be displayed and recorded. The first image signal IS1 is a signal that enables display and recording of the first captured image J2.

The third imaging unit 93B takes an image so that the tip 631 of the suction nozzle 63 holding the component E and the reference mark M are within the field of view, and the third color component light RRL incident on the third color component light RRL through the second filter F2. The second captured image J3 (see FIG. 12) based on the image is acquired. The imaging timing of the third imaging unit 93B is the same as the imaging timing of the second imaging unit 93A. The third image pickup unit 93B includes a third lens 94B, a third image pickup element 95B for capturing a monochrome image, and a third signal processing unit 96B that performs predetermined signal processing. The third lens 94B is an optical lens that collects the third color component light RRL incident through the second filter F2 and guides it to the third image sensor 95B.

The third image pickup device 95B is an image pickup device for capturing a monochrome image made of a CCD, CMOS, or the like. The third image sensor 95B receives the third color component light RRL incident through the third lens 94B and performs photoelectric conversion on the received light to generate the third electric signal ES3. .. The third electric signal ES3 generated by the third image sensor 95B includes a third color component signal (red component signal) RES corresponding to the third color component light RRL.

The third signal processing unit 96B generates the second image signal IS2 by performing predetermined signal processing on the third electric signal ES3 generated by the third image sensor 95B. The second image signal IS2 is a digital signal that has been A / D converted so that it can be displayed and recorded. The second image signal IS2 is a signal that enables display and recording of the second captured image J3.

The first captured image J2 acquired by the second imaging unit 93A and the second captured image J3 acquired by the third imaging unit 93B are referred to by the component recognition unit 13. The vibration amount calculation unit 131 of the component recognition unit 13 determines the position of the mark reference point S2 on the mark area J11 in the initial image J1 (see FIG. 10) and the mark in the first image J2 acquired by the second image pickup unit 93A. By referring to the difference from the position of the mark reference point S21 on the region J21, the vibration displacement amount H1 of the suction nozzle 63 accompanying the movement of the head unit 6 is calculated (see FIG. 11). Further, the component position calculation unit 132 of the component recognition unit 13 deviates from the center S11 of the nozzle tip region J32 to the center S3 of the component region J33 based on the second image J3 acquired by the third imaging unit 93B. H2 is calculated, and the position of the component E with respect to the center of the component holding surface 632 of the suction nozzle 63 is calculated (see FIG. 12). By using the position of the component E calculated by the component position calculation unit 132, the mounting accuracy of the component E on the substrate K can be improved by the drive operation of the head unit 6 based on the control of the head drive control unit 12.

FIG. 15 is a diagram showing a configuration of a component recognition device 9B according to a second modification. In the component recognition device 9B, the head unit 6 is moved from the component supply position P1 of the component supply device 5 to the component mounting position of the substrate K conveyed by the conveyor 3 in the same manner as the component recognition device 9 described above. This is a device for recognizing the holding state of the component E that is sucked and held by the suction nozzle 63. The component recognition device 9B includes a light source device 91B and an image pickup device 92B.

In the component recognition device 9B, the light source device 91B is a device that irradiates light toward the suction nozzle 63 holding the component E while the head unit 6 is moving to the component mounting position. The light emitted from the light source device 91B is reflected by the first half mirror 97 and is irradiated toward the suction nozzle 63 holding the component E. The light source device 91B has a first irradiation color component light (blue component light) BIL corresponding to the color of the reference mark M and other color component light (for example, a third irradiation color) with respect to the suction nozzle 63 holding the component E. The component light (red component light) RIL) is individually irradiated at predetermined time intervals. The time interval between the irradiation of the first irradiation color component light BIL and the irradiation of the third irradiation color component light RIL by the light source device 91B is larger than the vibration cycle related to the vibration of the suction nozzle 63 accompanying the movement of the head unit 6. , Set at a sufficiently short time interval.

The reflected light RL reflected from the suction nozzle 63 holding the component E in response to the irradiation of the irradiation light IL by the light source device 91B passes through the first half mirror 97 and passes through the second half mirror 98 to the image pickup device 92B. Incident in. The reflected light RL from the adsorption nozzle 63 holding the component E is the first color component light (blue component light) BRL when the first irradiation color component light BIL is irradiated by the light source device 91B, and is the light source device 91B. When the third irradiation color component light RIL is irradiated, it is the third color component light (red component light) RRL.

In the component recognition device 9B, the image pickup device 92B includes two image pickup units, a second image pickup unit 93A and a third image pickup unit 93B. The first color component light BRL, which is the reflected light corresponding to the irradiation of the first irradiation color component light BIL from the suction nozzle 63 holding the component E, is reflected by the second half mirror 98 and is reflected by the second imaging unit 93A. Guided towards. On the other hand, the third color component light RRL, which is the reflected light corresponding to the irradiation of the third irradiation color component light RIL from the adsorption nozzle 63 holding the component E, passes through the second half mirror 98 and is transmitted through the second half mirror 98 to the third imaging unit. Guided towards 93B.

The second imaging unit 93A images so that the tip 631 of the adsorption nozzle 63 holding the component E and the reference mark M fit within the field of view in synchronization with the irradiation of the first irradiation color component light BIL by the light source device 91B. Then, the first captured image J2 (see FIG. 11) based on the first color component light BRL, which is the reflected light corresponding to the irradiation of the first irradiation color component light BIL, is acquired. The second image pickup unit 93A includes a second lens 94A, a second image pickup element 95A for capturing a monochrome image, and a second signal processing unit 96A that performs predetermined signal processing. The second lens 94A is an optical lens that collects the incident first color component light BRL in response to the irradiation of the first irradiation color component light BIL and guides it to the second image sensor 95A.

The second image pickup device 95A is an image pickup device for capturing a monochrome image made of a CCD, CMOS, or the like. The second image sensor 95A receives the first color component light BRL incident through the second lens 94A and performs photoelectric conversion on the received light to generate the second electric signal ES2. .. The second electric signal ES2 generated by the second image sensor 95A includes a first color component signal (blue component signal) BES corresponding to the first color component light BRL.

The second signal processing unit 96A generates the first image signal IS1 by performing predetermined signal processing on the second electric signal ES2 generated by the second image sensor 95A. The first image signal IS1 is a digital signal that has been A / D converted so that it can be displayed and recorded. The first image signal IS1 is a signal that enables display and recording of the first captured image J2.

The third imaging unit 93B takes an image so that the tip 631 of the adsorption nozzle 63 holding the component E and the reference mark M are within the field of view in synchronization with the irradiation of the third irradiation color component light RIL by the light source device 91B. Then, the second captured image J3 (see FIG. 12) based on the third color component light RRL, which is the reflected light corresponding to the irradiation of the third irradiation color component light RIL, is acquired. The third image pickup unit 93B includes a third lens 94B, a third image pickup element 95B for capturing a monochrome image, and a third signal processing unit 96B that performs predetermined signal processing. The third lens 94B is an optical lens that collects the incident third color component light RRL in response to the irradiation of the third irradiation color component light RIL and guides it to the third image pickup element 95B.

The third image pickup device 95B is an image pickup device for capturing a monochrome image made of a CCD, CMOS, or the like. The third image sensor 95B receives the third color component light RRL incident through the third lens 94B and performs photoelectric conversion on the received light to generate the third electric signal ES3. .. The third electric signal ES3 generated by the third image sensor 95B includes a third color component signal (red component signal) RES corresponding to the third color component light RRL.

The third signal processing unit 96B generates the second image signal IS2 by performing predetermined signal processing on the third electric signal ES3 generated by the third image sensor 95B. The second image signal IS2 is a digital signal that has been A / D converted so that it can be displayed and recorded. The second image signal IS2 is a signal that enables display and recording of the second captured image J3.

The first captured image J2 acquired by the second imaging unit 93A and the second captured image J3 acquired by the third imaging unit 93B are referred to by the component recognition unit 13. The vibration amount calculation unit 131 of the component recognition unit 13 determines the position of the mark reference point S2 on the mark area J11 in the initial image J1 (see FIG. 10) and the mark in the first image J2 acquired by the second image pickup unit 93A. By referring to the difference from the position of the mark reference point S21 on the region J21, the vibration displacement amount H1 of the suction nozzle 63 accompanying the movement of the head unit 6 is calculated (see FIG. 11). Further, the component position calculation unit 132 of the component recognition unit 13 deviates from the center S11 of the nozzle tip region J32 to the center S3 of the component region J33 based on the second image J3 acquired by the third imaging unit 93B. H2 is calculated, and the position of the component E with respect to the center of the component holding surface 632 of the suction nozzle 63 is calculated (see FIG. 12). By using the position of the component E calculated by the component position calculation unit 132, the mounting accuracy of the component E on the substrate K can be improved by the drive operation of the head unit 6 based on the control of the head drive control unit 12.

1 Parts mounting device 6 Head unit 63 Suction nozzle (holder)
9,9A, 9B Parts recognition device 91, 91A, 91B Light source device 92, 92A, 92B Imaging device 93 1st imaging unit 93A 2nd imaging unit 93B 3rd imaging unit 94 1st lens 94A 2nd lens 94B 3rd lens 95 1st Imaging Element 951 Color Filter 95A 2nd Imaging Element 95B 3rd Imaging Element 96 1st Signal Processing 96A 2nd Signal Processing 96B 3rd Signal Processing 10 Control 11 Parts Supply Control 12 Head Drive Control 13 Parts Recognition unit 131 Frequency calculation unit 132 Part position calculation unit 133 Storage unit ES1 1st electric signal ES2 2nd electric signal ES3 3rd electric signal BES 1st color component signal GES 2nd color component signal RES 3rd color component signal IL irradiation Light BIL 1st irradiation color component light GIL 2nd irradiation color component light RIL 3rd irradiation color component light IS1 1st image signal IS2 2nd image signal J1 initial image J2 1st captured image J3 2nd captured image M reference mark RL reflection Light BRL 1st color component light GRL 2nd color component light RRL 3rd color component light

Claims (5)

A head unit to which a reference mark is attached, has a holder for holding a component, moves to a predetermined component mounting position while the component is held by the retainer, and mounts the component on a substrate at the component mounting position. When,
While the head unit is moving to the component mounting position, the holder holding the component and the reference mark are imaged as a subject within the field of view, and an image captured based on the reflected light from the subject is acquired. Imaging device and
A component recognition unit that recognizes the holding state of the component with respect to the holder based on the captured image is provided.
The image pickup device
A first captured image in which a mark region composed of pixels corresponding to the reference mark and a component region composed of pixels corresponding to the component are bright regions brighter than a predetermined value.
A second captured image in which the mark region is a dark region darker than a predetermined value and the component region is a bright region brighter than a predetermined value is acquired.
The part recognition unit
A storage unit that previously stores an initial image captured by the imaging device in a state where the head unit is stationary and the holder does not hold the component.
Based on the initial image, the initial mark position information representing the initial position of the reference mark is acquired, and based on the first captured image, the mark position information representing the position of the reference mark in the holder holding the component. And by referring to the difference between the initial mark position information and the mark position information, a vibration amount calculation unit that calculates the vibration displacement amount of the holder with the movement of the head unit, and
Based on the second captured image, the component position information representing the position of the component held by the holder is acquired, and by referring to the component position information and the vibration displacement amount, the component holding of the holder is held. A component mounting device including a component position calculation unit for calculating the position of the component with respect to the center of a surface. In the reflected light from the subject, the reflected light from the reference mark is the first color component light of any one of the three primary colors, and the reflected light from at least a part of the region of the component is each color component of the three primary colors. It is white light containing the first color component light, the second color component light, and the third color component light, which are light.
The image pickup device includes a first image pickup device for capturing a color image and a first image pickup section including a first signal processing section for performing predetermined signal processing.
The first image pickup element receives the reflected light from the subject and performs photoelectric conversion on the received light to obtain a first color component signal corresponding to the first color component light and the second color. A first electric signal including a second color component signal corresponding to the component light and a third color component signal corresponding to the third color component light is generated.
The first signal processing unit performs the signal processing on the first electric signal to generate a first image signal representing the first captured image and a second image signal representing the second captured image. , The component mounting device according to claim 1. As the signal processing, the first signal processing unit multiplies each of the first color component signal, the second color component signal, and the third color component signal included in the first electric signal by a gain coefficient. Configured to do the processing,
In the gain adjustment process, the first signal processing unit
The first image signal is generated by multiplying the first color component signal by a gain coefficient having a value larger than that of the second color component signal and the third color component signal.
The component according to claim 2, wherein the second image signal is generated by multiplying the first color component signal by a gain coefficient having a value smaller than that of the second color component signal and the third color component signal. Mounting device. The first signal processing unit is configured to perform extraction processing for extracting a predetermined color component signal from the first electric signal as the signal processing.
In the extraction process, the first signal processing unit
The first image signal is generated by extracting the first color component signal included in the first electric signal.
The component mounting device according to claim 2, wherein the second image signal is generated by extracting the second color component signal or the third color component signal included in the first electric signal. In the reflected light from the subject, the reflected light from the reference mark is the first color component light of any one of the three primary colors, and the reflected light from at least a part of the region of the component is each color component of the three primary colors. It is white light containing the first color component light, the second color component light, and the third color component light, which are light.
The imaging device includes a second imaging unit that acquires the first captured image and a third imaging unit that acquires the second captured image.
The second imaging unit
A second image sensor for monochrome image imaging that generates a second electric signal by receiving the first color component light and performing photoelectric conversion on the received light.
A second signal processing unit that generates a first image signal representing the first captured image by subjecting the second electric signal to a predetermined signal processing is included.
The third imaging unit is
A third image sensor for monochrome image imaging, which receives the second color component light or the third color component light and generates a third electric signal by performing photoelectric conversion on the received light.
The component mounting device according to claim 1, further comprising a third signal processing unit that generates a second image signal representing the second captured image by subjecting the third electrical signal to a predetermined signal process.

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