JP6878122B2 - Recording element substrate, liquid discharge head and recording device - Google Patents

Description

The present invention relates to a recording element substrate, a liquid discharge head, and a recording device that discharge liquid from a discharge port, and more particularly to a recording element substrate, a liquid discharge head, and a recording device having an inspection means used for inspecting the quality of discharge. ..

In a recording device that discharges a liquid from a discharge port provided in a recording discharge head to perform recording, higher image quality and higher speed recording are required. In recent years, a plurality of recording element substrates are arranged over a recording width, and a large number of recording elements are arranged. A full-line recording head that records at the discharge port is disclosed.

In Patent Document 1, by arranging the recording element substrates in a staggered pattern or arranging them in a row and making an angle at the end of the recording element substrate, the discharge port row is formed at the joint portion of the recording element substrate in the discharge port row direction. The overlapping configurations are disclosed. By arranging the recording element substrates at an angle at the end, the distance between the discharge ports of the adjacent recording element substrates can be made closer than when the recording element substrates are arranged in a staggered pattern. By reducing the distance between the discharge ports of the adjacent recording element substrates, the deviation of the discharge port row at the joint portion can be reduced, and the deviation of the liquid landing position can be suppressed.

Further, in the recording element substrate, a detection element for detecting the temperature is provided for each discharge port, and the discharge port with defective discharge is identified based on the detection result of this detection element, which is reflected in the image complementation and the recovery work of the recording head. Means have been proposed.

Japanese Unexamined Patent Publication No. 2010-012795

The following problems occur in a recording element substrate in which a row of detection elements in which a plurality of detection elements for detecting temperature information and the like are arranged is provided corresponding to a row of discharge ports. That is, a large number of wires connected to the drive circuit for driving the recording element and the detection element circuit are routed between the discharge port at the end of the discharge port row and the end of the recording element substrate. As the number of wires in the wiring area around which the wiring is routed increases, it is required to take a wide wiring area. In particular, in the recording element substrate in which the detection element is provided corresponding to each discharge port, the number of wirings is larger, so that the wiring area becomes large.

When the wiring region becomes large in this way, the length of the recording element substrate in the discharge port row direction becomes long. In particular, when a plurality of recording element substrates are arranged in a row at an angle to the outer extension end of the recording element substrate, if the wiring area between the end of the discharge port row and the end of the detection element row becomes wide, The deviation of the discharge port row at the joint portion becomes large, and there is a possibility that the landing position of the liquid may be displaced.

Therefore, the present invention provides a recording element substrate in which a detection element row is provided corresponding to a discharge port row, and a recording element substrate, a liquid discharge head, and a recording device capable of suppressing an increase in length in the discharge port row direction. The purpose is to do.

Therefore, the recording element substrate of the present invention is provided with a plurality of discharge element rows in which a plurality of discharge elements used for discharging liquid are formed in a row, and the discharge element rows are provided to control the state of liquid discharge. A plurality of detection element sequences in which a plurality of detection elements to be detected are formed, a selection of the detection element for detecting from the plurality of detection elements, and the detection element for detecting from the plurality of detection element sequences. In a recording element substrate provided with a control means for controlling the selection of the detection element array including the detection element array, the recording element substrate is provided corresponding to the detection element array, and corresponds based on the selection of the detection element array by the control means. A column selection means for selecting the detection element sequence is provided, and the plurality of detection element sequences and the control means are provided in common to the column selection means corresponding to the detection element sequence and the plurality of detection element sequences. The first common wiring is connected to the first common wiring, and the first common wiring is an end portion of the recording element substrate in the direction of the discharge element row and the end portion of the recording element substrate. It is characterized in that it is wired through a region between the end of the discharge element row and the end of the detection element row on the side.

According to the present invention, in a recording element substrate in which a detection element row is provided corresponding to a discharge port row, it is possible to suppress an increase in the length of the recording element substrate in the discharge port row direction.

It is a figure which showed the wiring of the recording element substrate which provided the function of discharge inspection. (A) is a diagram showing signal timing, and (b) is a diagram showing a modified example. It is a figure which showed the wiring of the recording element substrate which provided the function of discharge inspection. It is a figure which showed the wiring of the recording element substrate which provided the function of discharge inspection. It is a figure which showed the wiring of the recording element substrate which provided the function of discharge inspection. It is a figure which showed the wiring of the recording element substrate of the comparative example which provided the function of a discharge inspection. It is a figure for demonstrating the position of a recording element substrate and wiring. It is a figure which showed the configuration example of the recording apparatus.

(First Embodiment)
Hereinafter, the first embodiment of the present invention will be described with reference to the drawings.
In explaining the embodiment of the present invention, first, the embodiment of the comparative example will be described. The recording element used for the recording element substrate described here is a recording element that ejects droplets from a discharge port by being given thermal or mechanical energy to generate pressure. Further, the recording element substrate is provided with a detection element for each discharge port, and the detection element is a detection element that detects a physical quantity of temperature, pressure, or capacitance. Here, a particularly suitable form for the temperature detection element will be described. To do. By obtaining a temperature profile using a temperature detection element, it is possible to detect a liquid discharge state such as a normal discharge state or a discharge failure state.

The discharge failure state includes a discharge failure due to residual air bubbles in the flow path and a discharge failure caused by the accumulation of impurities in the flow path and the liquid not being refilled normally. In addition, there are discharge defects caused by the liquid adhering to the surface of the discharge port and discharge defects caused by the clogging of the discharge port with impurities.

FIG. 6A is a schematic view showing the wiring of the recording element substrate of the comparative example provided with the recording element and the detecting element and the function of the discharge inspection. FIG. 6 (b) is a diagram showing an external layout of wiring on an actual recording element substrate, and FIG. 6 (c) is a cross-sectional view of the VIC-VIC of FIG. 6 (b). The control circuit 703 includes a control circuit 705 and a control circuit 704, and controls a drive circuit for driving a recording element and a detection element circuit that form a recording element array corresponding to the four ejection port rows on the recording element substrate. The circuit 706 includes a recording element drive circuit 707 and a detection element circuit 708 in the first row, and is connected to the control circuit 703 by a plurality of wirings.

The control circuit 704 that controls the recording element drive circuit of the control circuit 703 and the recording element drive circuit 707 are connected by a bundle of wiring 710. The wiring bundle 710 has an individual wiring bundle 712 and a common wiring bundle 711. The clock signal CLK and the data signal D of the serial data transfer signal are transmitted by individual wiring bundles 712 to the recording element drive circuits provided in each recording element train. Further, the data latch signal LT and the drive application signal HE are transmitted by a bundle 711 of common wiring commonly provided for the recording element drive circuit provided in each recording element train.

Further, the control circuit 705 that controls the detection element circuit in the control circuit 703 and the detection element circuit 708 are connected by a bundle of wiring 713. Select the detection element The clock signal CLKS, data signal DS, and latch signal LTS of the serial data transfer signal that transfers data are common wiring provided for the detection element circuit provided in each recording element sequence. It is transmitted in bundle 714. Further, the power supply IS that supplies power to the detection element and the terminal voltages S + and S− of the detection element of the detection information are individually connected to the detection element circuits provided in each recording element row by a bundle of wiring 715. ing. The total number of wirings of the wiring bundle 713 and the wiring bundle 710 is 25 (see FIG. 6C).

As shown in FIG. 6C, these wirings are, in order from the substrate end 718 side of the recording element substrate 701, a bundle of wiring 713 connecting the control circuit 705 and the detection element circuit 708, the control circuit 704, and the recording element drive. A bundle of wiring 710 connecting the circuit 707 is arranged. In particular, since the wiring of the power supply IS and the terminal voltages S + and S- connected to the detection element circuit 708 is an analog signal, the wiring must be made in consideration of avoiding noise superposition. Therefore, it is desirable that the wiring of the power supply IS and the terminal voltages S + and S- be wired to the end side of the substrate where the noise source is small so as not to straddle the recording element drive circuit 707 which is a noise source. Therefore, the wiring connecting the detection element circuit 708 and the control circuit 705 in each row is arranged on the board end 718 side.

Next, the configuration of the recording element substrate in this embodiment will be described.

FIG. 1A is a schematic view showing the wiring of a recording element substrate including a recording element (discharge element) and a detection element and having a discharge inspection function in the present embodiment. A plurality of recording elements form a row to form a recording element row (one row of ejection elements). Further, a plurality of detection elements are also formed in a row to form a detection element row. Here, the configuration related to the drive circuit for driving the recording element is the same as that described in the form of the comparative example. The circuit 106 includes a recording element drive circuit 107 in the first row and a detection element circuit 108, and is connected to the control circuit 103 by a plurality of wirings. In the control circuit 103, the control circuit 105 of the detection element circuit and the detection element circuit 108 are connected by a bundle of wiring 113. The clock CLKS, data DS, and latch LTS of the serial data transfer signal for transferring the data for selecting the detection element (detection element selection signal) are transmitted in the common wiring bundle 114 out of the wiring bundle 113. Then, the column selection signals A0 and A1 for selecting the row of the detection element circuit are transmitted by the bundle of common wiring (column selection signal transmission wiring) 116. Further, among the wiring bundles 113, in the common wiring bundle (detection information transmission wiring) 115, the power supply IS supplied to the detection element and the terminal voltages S + and S− of the detection element of the detection information are the row selection means of each row. Is transmitted to the column selection circuit 117.

In the present embodiment, the number of wirings is reduced by providing the row selection circuit 117 in the detection element circuit 108 provided in each recording element row and selecting the row of the detection element circuits with the row selection signals A0 and A1. Is possible. As a result, the total number of wirings of the common wiring bundle 114, the common wiring bundle 116, and the common wiring bundle 115 is 18 (see FIG. 1D described later).

Hereinafter, a specific circuit configuration including a method of selecting a row of detection element circuits in the present embodiment will be described.

FIG. 1B is a diagram showing a detailed circuit configuration of a recording element drive circuit 107 using a heat generation resistance element as a recording element and a detection element circuit 108 using a temperature sensitive element as a detection element. .. In the drive circuit 107 for driving the recording element, one terminal of the recording element 123 is connected to the power supply line 122, and the other terminal is connected to the drive switch 124. The drive switch 124 is on / off controlled by a selection circuit 125 that expands and stores the recorded data transferred as serial data. The detection element circuit 108 includes a shift register 133 that expands and stores selection data of the detection element transferred as serial data, and a decoder 130 that selects an arbitrary detection element that receives the selection data and performs detection. .. Further, the detection element circuit 108 includes an analog switch multiplexer 134 that switches the selection of the detection element sequence including the detection element 126 that receives and detects the column selection signals A1 and A0. Further, the detection element circuit 108 includes a pair of buffer amplifiers 132 that buffer the arrangement of the detection elements 126 and the signal detected by the detection element 126. In the present embodiment, the detection element 126 is provided for each recording element 123, but the detection element 126 may not be provided for each recording element 123. A row of detection elements 126 configured by arranging a plurality of detection elements 126 may be provided corresponding to a row of one recording element 123.

One terminal of the detection element 126 is commonly connected to the wiring of the power supply IS (here, constant current) that supplies power to the detection element 126, and the other terminal is connected to the selection switch 129. Further, both terminals of the detection element 126 are connected to read switches 127 and 128 for reading the terminal voltage, respectively. The other terminals of the read switches 127 and 128 are respectively connected to a pair of common wiring 131, and the common wiring 131 is connected to the buffer amplifier 132. The selection switch 129 and the read switches 127 and 128 are on / off controlled by the decoder 130.

The analog switch multiplexer 134 includes a decoder 135 fixed to a unique decoding for each column, a switch 136 for selecting the power supply IS, and a pair of switches 137 for selecting the output signal of the buffer amplifier 132. When the column selection signals A1 and A0 and the selection data of the detection element are transmitted from the control circuit 105, the detection element and the analog switch multiplexer 134 of the specified column are selected. Then, the power supply IS of the common wiring is supplied, and the terminal voltage of the detection element 126 is output to the wiring S + and the wiring S- of the common wiring.

FIG. 1C is a diagram showing an external layout of wiring at a connecting portion of recording element substrates arranged adjacent to each other, and is an enlarged view showing a region A of the recording head 100 shown in FIG. 7A. Is. FIG. 1 (d) is a cross-sectional view taken along the line Id-Id of FIG. 1 (c). The recording element substrate 101 and the recording element substrate 102 have an outer edge (end portion) that intersects the extending direction of the discharge element array at an acute angle. The recording element substrate 101 and the recording element substrate 102 are provided so that their ends are adjacent to each other. Here, as a part of the recording head as the liquid discharge head, two recording element substrates 101 and a recording element substrate 102 arranged adjacent to each other are shown. A plurality of recording element substrates are arranged so that the ends of the recording element substrates extending in the direction intersecting the direction of the discharge element row are adjacent to each other, and a full-line type recording head is configured. As shown in FIG. 1D, the wiring on the recording element substrate of this embodiment is the wiring bundle 113 connecting the control circuit 105 and each detection element circuit 108 in order from the substrate end 101a, the control circuit 104 and each recording element drive circuit 107. Wiring bundles 110 for serial data transfer are arranged. Further, the common wiring bundle 113 is common to the power supply IS, the detection signal S +, the common wiring bundle 115 of S−, the common wiring bundle 116 of the column selection signals A0 and A1, and the serial data transfer signals CLKS, DS, and LTS. The wiring bundles 114 are arranged in this order.

As described above, in the present embodiment, the column selection circuit 117 is provided in the detection element circuit 108, and the column selection circuit 117 receives the column selection signals A0 and A1 transmitted via the common wiring common to the plurality of detection element rows. However, the selection of the corresponding detection element sequence is switched. As a result, the wiring connecting the control circuit 103, the recording element drive circuit, and the detection element circuit is made common wiring to enable selective signal transmission, thereby reducing the number of wirings to 18 and the end of the board. It is possible to narrow the wiring area in. As a result, the connecting distance 119 of the discharge port 118 at the connecting portion between the recording element substrate 102 and the recording element substrate 101 can be shortened as compared with the connecting distance 719 of the comparative example (see FIG. 6B).

As a result, it has become possible to realize a recording element substrate and a recording device capable of suppressing the displacement of the landing position of the liquid at the joint portion in the recording element substrate provided with the detection element array corresponding to the discharge port array. Further, in the recording element substrate in which the detection element row is provided corresponding to the discharge port row, it is possible to suppress an increase in the length of the recording element substrate in the discharge port row direction.

FIG. 7B is a diagram showing the layout of the wiring bundle 110 for the recording element and the wiring bundle 113 for the detection element on the recording element substrate 101. These wiring bundles 110 and 113 connect a circuit unit 120 including a plurality of circuits 106 having a recording element and a detecting element, and a control circuit 103. As described above, the row selection circuit 117 is arranged at one end of the detection element row, and a bundle of wiring 113 is provided between this end and the end 101a of the recording element substrate adjacent to this end. Have been placed. Further, the row selection circuit 117 is not arranged at the other end of the detection element row of the recording element substrate 101, and the end 101b of the recording element substrate 101 close to the other end and the other end. No bundle of wires is placed between and. Then, as shown in FIGS. 1C and 7A, in the recording head 100, one end 101a provided with a bundle 113 of the wiring of the recording element substrate 101 and the wiring of the recording element substrate 102 are connected. The other end 102b, which is not provided with a bundle, is arranged next to each other.

FIG. 7C is a diagram showing the layout of the wiring bundle 810 for the recording element and the wiring bundle 813 for the detection element in the recording element substrate 801 of the modified example. When there are many discharge port rows arranged in one recording element board 801 or the like, it is divided into two circuits 120a and 120b, and control circuits 803a and 803b are divided so as to correspond to the respective circuits 120a and 120b. May be provided. In this case, bundles of wiring 810a and 813a connected to the circuit 120a are arranged at one end 810a of the recording element substrate, and bundles 810b and 813b of wiring connected to the circuit 120b are arranged at the other end 810b. It is arranged. Even when a recording head is configured by using a plurality of recording element substrates 801 of a modified example, one end 801a of the recording element substrate 801 and the other end 801b of another recording element substrate 801 are adjacent to each other as described above. You can arrange them so that they fit.

In consideration of suppressing noise superposition, the bundle 115 of the common wiring of the analog signal is arranged on the end side of the recording element substrate. Here, in particular, the bundle 116 of the common wiring for column selection is the wiring 114 which is also a noise source. And 110 and the bundle 115 of the common wiring. Since the column selection signals A0 and A1 are inevitably in a constant voltage state during the period in which the detection element is selected and the detection information is read out, a shielding effect on the noise source can be expected.

FIG. 2A is a diagram showing the timing relationship between the column selection signals A0 and A1, the digital operation wirings 114 and 110, and the analog signals IS, S +, and S−. While the digital operation signal is always operating, the column selection signals A0 and A1 have a constant voltage during the period t_seg1 during which the detection element seg1 is selected, so that a shielding effect can be obtained.

(Modification example)
FIG. 2B is a cross-sectional view showing a modified example of the recording element substrate of the present embodiment. In the above-described embodiment of the first embodiment, the form of arranging the wiring arranged in the same wiring layer has been described, but in the modified example, a form in which the same shielding effect can be obtained between the wiring layers will be described. In the recording element substrate of the modified example, when the bundle 115 of the common wiring of the analog signal is arranged on the first layer and the power supply line 122 of the recording element 123 that becomes a noise source is arranged on the third layer, the second layer is arranged. A shielding effect can be expected by arranging the common wiring 116 for column selection.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configuration will be described below. In this embodiment, a mode in which the number of wirings connecting the control circuit and each of the four rows of detection element circuits is further reduced will be described.

FIG. 3A is a diagram showing wiring at a connecting portion of a recording element substrate 301 which is provided with a detection element together with a recording element and has a discharge inspection function. Further, FIG. 3B is a diagram showing an external layout of wiring of a connecting portion in an actual recording element substrate, and FIG. 3C is a sectional view taken along line IIIC-IIIC of FIG. 3B. .. In the present embodiment, the configuration related to the recording element drive circuit is the same as that in the first embodiment, and thus the description thereof will be omitted.

The circuit 306 in this embodiment is composed of a recording element drive circuit 307 in the first row and a detection element circuit 308, and the control circuit 305 of the detection element circuit in the control circuit 303 and each detection element circuit 308 in the fourth row are They are connected by a bundle of wires 313. In the present embodiment, the common wiring of the column selection signals A0 and A1 for selecting a column is reduced as compared with the first embodiment. In the present embodiment, in addition to the data for selecting the detection element, the column selection data for selecting the column is also transmitted by the serial data transfer signal, thereby reducing the common wiring of the column selection signals A0 and A1.

The clock signal CLKS, the data signal DS, and the latch signal LTS of the serial data transfer signal for transferring the data for selecting the detection element are transmitted to each row by the bundle 314 of the common wiring. The power supply IS supplied to the detection element and the terminal voltages S + and S− of the detection element of the detection information are transmitted to the row selection circuit 317 of each row by the bundle 315 of the common wiring. In the present embodiment, the column selection data for selecting a column is also transmitted by the bundle 314 of the common wiring. As a result, the total number of wirings of the common wiring bundle 314 and the common wiring bundle 315 is 16 (see FIG. 3C).

FIG. 3D is a diagram showing a circuit configuration of a detection element circuit (including a column selection circuit) 308 using a temperature-sensitive resistance element as a detection element. The circuit configuration of this embodiment differs from that of the first embodiment in the circuit of the portion that receives the serial data transfer signal, and the configuration of other circuits (decoder, detection element circuit, buffer amplifier, and analog switch multiplexer). Is the same as in the first embodiment.

In the present embodiment, the selection data and the column selection data of the detection element transferred as serial data are expanded and stored in the shift register 333. Then, the signal of the column selection data is transmitted to the decoder 335 fixed to the unique decoding for each column provided in the analog switch multiplexer 334. The detection element of the specified column and the analog switch multiplexer 334 to which the column selection data is sent from the control circuit 305 are selected, the power supply IS of the common wiring is supplied, and the wiring S + and the wiring S- of the common wiring are supplied. The terminal voltage of the detection element is output to.

The wiring at the connecting portion of the recording element substrate is, in order from the substrate end of the recording element substrate 301, a bundle of wiring 313 connecting the control circuit 305 and each of the four rows of detection element circuits 308, and each recording of the control circuit 304 and the four rows. A bundle of wiring 310 for connecting the element drive circuit 307 is arranged. The common wiring bundle 313 connected to the detection element circuit 308 is arranged in the order of the power supply IS, the detection signal S +, the common wiring bundle 315 of the S-, and the serial data transfer signal CLKS, DS, and the common wiring bundle 314 of the LTS. They are lined up.

In the present embodiment, by transferring the column selection data for selecting a column as serial data, the wiring of the column selection signal can be reduced, and the wiring area at the end of the board at the connecting portion can be further reduced. As a result, the connection distance 319 of the discharge port at the connection portion between the recording element substrate 302 and the recording element substrate 301 can be made shorter than the connection distance 719 of the comparative example (see FIG. 6B). It was.

When the shielding effect described in the first embodiment is added, the GND wiring may be arranged between the noise source and the bundle 315 of the common wiring of the analog signal.

(Third Embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configuration will be described below. In this embodiment, a mode in which the number of wirings connecting the control circuit and each of the four rows of recording element drive circuits is reduced will be described.

FIG. 4A is a diagram showing wiring at a connecting portion of a recording element substrate 401 having a detection element together with a recording element and having a discharge inspection function. The configuration related to the detection element circuit is the same as that described in the second embodiment.

The circuit 406 is a circuit composed of the recording element drive circuit 407 and the detection element circuit 408 in the first row. The control circuit 404 for driving the recording element in the control circuit 403 and each recording element drive circuit 407 in four rows are connected by a bundle of wiring 410.

The configuration of the present embodiment differs from the first and second embodiments in that the CLK signal and the D signal of the serial data transfer transmitted by the bundle of wiring 410 to each of the four rows of recording element drive circuits 407 are commonly wired. This is a point in which the wiring between the CLK signal and the D signal, which had been individually wired for each row, was reduced.

The clock signal CLK and the data signal D of the serial data transfer signal transmitted to each of the four rows of recording element drive circuits 407 and selecting the recording element row (which is the discharge element row selection signal) are each row in the bundle 410 of the common wiring. The total number of wires involved in driving the recording element is four. In the common wiring bundle 410, the data latch signal LT and the drive application signal HE are transmitted by the common wiring bundle 411, and the clock signal CLK of the serial data transfer signal and the data signal D are transmitted by the common wiring bundle 412. .. In the first and second embodiments, the clock signal CLK and the data signal D are transmitted to each of the four rows of recording element drive circuits by individual wiring, but in the present embodiment, common wiring is used and common wiring is used. It is transmitted by a bundle of 412. As a result, the total number of wirings is 10 including the 6 wirings of the bundle 413 of the common wirings connected to the detection element circuit 408.

FIG. 4B is a diagram showing a detailed circuit configuration of a recording element drive circuit 407 using a heat generation resistance element as a recording element. The circuit configuration of the recording element drive circuit 407 in this embodiment differs from the first and second embodiments in that it includes a column selection circuit 440 that receives a serial data transfer signal.

The column selection circuit 440 expands and stores the selection data of the recording element and the column selection data transferred as serial data by a shift register. Then, the column selection circuit 440 incorporates a multiplexer fixed by a unique decoding for each column in response to the column selection data, and turns on / off the input to the recording element drive circuit 407.

FIG. 4 (c) is a diagram showing an external layout of wiring at a connecting portion of an actual recording element substrate, and FIG. 4 (d) is a cross-sectional view of IVD-IVD of FIG. 4 (c). A bundle of wiring 413 connecting the control circuit 405 and each of the four rows of detection element circuits 408, and a common connection of the control circuit 404 and each of the four rows of recording element drive circuits 407 in order from the board end 420 of the recording element board 401. A bundle of wiring 410 is arranged. In the common wiring bundle 410, the common wiring bundle 412 for transmitting the serial data transfer signals CLK and D and the common wiring bundle 411 for transmitting the LT signal and the HE signal are arranged side by side.

In the present embodiment, the serial data transfer wiring individually wired in each row is reduced by sharing the CLK signal and the D signal of the serial data transfer transmitted to each recording element drive circuit 407 in the four rows. As a result, the wiring area at the end of the board at the connecting portion could be further reduced. As a result, the connection distance 419 of the discharge port at the connection portion between the recording element substrate 402 and the recording element substrate 401 can be made shorter than the connection distance 719 of the comparative example (see FIG. 6B). It was.

(Fourth Embodiment)
Hereinafter, a fourth embodiment of the present invention will be described with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configuration will be described below.

FIG. 5 is a diagram showing an external layout of a wiring group in a substrate end region of a connecting portion between a recording element substrate 501 and 502 when ordinary square-shaped recording element substrates are arranged in a staggered pattern. The circuit configuration, the wiring group connecting the control circuit and each row, and the arrangement of the wiring are the same as those in the first embodiment, the second embodiment, or the third embodiment.

When arranged in a staggered pattern, the connection distance of the discharge ports is determined by the substrate dimension Y of the recording element substrate 501, so that the number of wires at the end of the substrate does not affect, but the width of the end of the substrate is reduced, so that the substrate The dimension X can be shortened. As a result, the dimension of the recording head in the discharge port row direction can be reduced.

(Recording head and recording device)
An example of an inkjet recording head (liquid ejection head) on which the recording element substrate of the above-described embodiment is mounted and a recording device using the inkjet recording head will be described.

FIG. 8 is a schematic perspective view for explaining a configuration example of the inkjet recording device 1 using the inkjet recording head 100. The recording device 1 of this example is a so-called full-line system, and a long recording head 100 extending over the entire width direction of the recording medium P is used. The recording medium P is continuously conveyed in the direction of arrow A by a transfer mechanism 130 using a transfer belt or the like. An image is recorded on the recording medium P by ejecting ink (liquid) from the recording head 100 while transporting the recording medium P in the direction of the arrow A. In the case of this example, as the recording head 100, the recording heads 100C, 100M, 100Y, 100Bk for ejecting cyan (C), magenta (M), yellow (Y), and black (K) inks are used to color the image. Images can be recorded.

103 Control circuit 104 Control circuit 105 Control circuit 108 Detection element circuit 114 Common wiring bundle 115 Common wiring bundle 116 Common wiring bundle 117 Row selection circuit A0, A1 row selection signal

Claims (14)

A plurality of discharge element rows in which a plurality of discharge elements used for discharging liquid are formed in a row, and a plurality of detection elements provided corresponding to the discharge element row and detecting a liquid discharge state form a row. The plurality of detection element sequences formed, the selection of the detection element that performs detection from the plurality of detection elements, and the selection of the detection element sequence including the detection element that performs detection from the plurality of detection element sequences. In a recording element substrate provided with a control means for controlling
A column selection means for selecting the corresponding detection element sequence based on the selection of the detection element sequence by the control means, which is provided corresponding to the detection element sequence, is provided.
The plurality of detection element trains and the control means are connected via the row selection means corresponding to the detection element train and the first common wiring commonly provided in the plurality of detection element trains. Has been
The first common wiring includes an end portion of the recording element substrate in the direction of the discharge element row, an end portion of the discharge element row on the side of the end portion of the recording element substrate, and an end portion of the detection element row. A recording element substrate characterized in that it is wired through an area between and. The recording element substrate according to claim 1, wherein the first common wiring includes a column selection signal transmission wiring for transmitting a signal for selecting the detection element array. A plurality of wiring layers are laminated on the recording element substrate, and the recording element substrate has a plurality of wiring layers laminated.
The first common wiring includes a detection information transmission wiring different from the column selection signal transmission wiring that transmits the detection information detected by the detection element.
The detection information transmission wiring is wired to the first wiring layer.
The recording element substrate according to claim 2, wherein the column selection signal transmission wiring is wired to a second wiring layer which is a layer different from the first wiring layer in the stacking direction. The recording element substrate according to claim 2, wherein the column selection signal transmission wiring transmits a detection element selection signal for selecting the detection element from a plurality of the detection elements. A column selection circuit for selecting the discharge element row from a plurality of the discharge element rows is provided.
The recording element according to any one of claims 1 to 4, wherein the discharge element row and the control means are connected by a second common wiring via the row selection circuit. substrate. The recording element substrate according to claim 5, wherein the second common wiring transmits a discharge element row selection signal for selecting the discharge element row. The recording element substrate according to any one of claims 1 to 6, wherein the end portion of the recording element substrate extends in a direction intersecting the direction of the discharge element row. The seventh aspect of claim 7, wherein the extending direction of the end portion of the recording element substrate and the direction of the discharge element row intersect each other so that one of the internal angles formed by each other has an acute angle. Recording element substrate. The recording element substrate according to any one of claims 1 to 8, wherein the discharge element is a heat generation resistance element, and the detection element is a temperature detection element. A liquid discharge head according to any one of claims 1 to 9, wherein the plurality of recording element substrates are arranged so that the ends of the recording element substrates are adjacent to each other. The plurality of recording element substrates according to any one of claims 1 to 9 are the end portion of the recording element substrate and the end portion of the recording element substrate different from the recording element substrate. Is a liquid discharge head, characterized in that the other end on the opposite side in the direction of the discharge element row is arranged so as to be adjacent to each other. In the other recording element substrate, the first common wiring is formed in a region between the other end, the end of the discharge element row on the other end side, and the end of the detection element row. The liquid discharge head according to claim 11, wherein the liquid discharge head is not provided. The liquid discharge according to any one of claims 10 to 12, wherein the plurality of recording element substrates are full-line type heads arranged in the direction of the discharge element row. head. A plurality of discharge element rows in which a plurality of discharge elements used for discharging liquid are formed in a row, and a plurality of detection elements provided corresponding to the discharge element row and detecting a liquid discharge state form a row. The plurality of detection element sequences formed, the selection of the detection element that performs detection from the plurality of detection elements, and the selection of the detection element sequence including the detection element that performs detection from the plurality of detection element sequences. In a recording device including a recording element substrate having a control means for controlling
The recording element substrate is provided corresponding to the detection element array, and includes a column selection means for selecting the corresponding detection element array based on the selection of the detection element array by the control means.
The plurality of detection element trains and the control means are connected via the row selection means corresponding to the detection element train and the first common wiring commonly provided in the plurality of detection element trains. Has been
The first common wiring includes an end portion of the recording element substrate in the direction of the discharge element row, an end portion of the discharge element row on the side of the end portion of the recording element substrate, and an end portion of the detection element row. A recording device characterized in that it is wired through an area between and.

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