JP6254767B2 - Recording head and recording apparatus - Google Patents

Description

  The present invention relates to a recording head and a recording apparatus, and more particularly to, for example, a full-line recording head that performs recording according to an ink jet method and a recording apparatus that performs recording using the same.

  In the ink jet recording head, ejection failure may occur in all or some of the nozzles due to clogging of the nozzles due to foreign matters, bubbles mixed in the ink supply path, changes in wettability of the nozzle surface, and the like. Therefore, it is important to identify the nozzle in which the ejection failure has occurred and reflect it in the image complementation and the recovery operation of the recording head.

  For this reason, in Patent Document 1, each of a plurality of recording elements using electrothermal conversion elements is provided with a temperature detection element formed of a thin film resistor via an insulating film, and temperature information for each nozzle corresponding to the recording element is obtained. Proposes a method for detecting and inspecting nozzles with defective discharge based on temperature changes.

  On the other hand, various flow channel structures that improve the ejection performance of the ink jet recording head have been proposed. For example, in Patent Document 2, the ink flow path is symmetrically disposed with respect to the discharge port, and the discharge frequency is increased with a configuration using the ink flow channel sandwiched between a plurality of independent ink supply ports. It proposes a configuration that reduces the pressure crosstalk between them and discharges stably.

JP 2008-023987 A JP 2010-201921 A

  Now, in providing a temperature detection element and its associated circuit in the vicinity of each recording element, the structure, function and performance including the recording element are not affected, and the temperature detection circuit is limited in a limited space. To obtain desired temperature information.

  For example, when the temperature detection circuit proposed in Patent Document 1 is provided in the ink jet recording head disclosed in Patent Document 2, the temperature detection circuit is installed so as not to change the recording element and its wiring, the ink supply path, and the nozzle structure. It is required to provide. In particular, it is required to provide a temperature detection circuit corresponding to a high-resolution nozzle array using an independent ink supply port.

  The present invention has been made in view of the above-described conventional example, and a recording head capable of detecting a temperature by efficiently wiring a temperature detection element without changing the basic structure while maintaining the recording performance. An object of the present invention is to provide a recording apparatus equipped with the recording head.

  In order to achieve the above object, the recording head of the present invention has the following configuration.

That is, a plurality of electrothermal conversion elements are arranged on the first layer of the multilayer substrate, and the plurality of electrothermal conversion elements are arranged on the second layer of the multilayer substrate corresponding to the arrangement position of the plurality of electrothermal conversion elements. A recording head comprising an element substrate having a configuration in which a plurality of temperature detection elements for detecting the temperature of the element are arranged and an orifice plate on the element substrate, wherein the orifice plate corresponds to each of the plurality of electrothermal conversion elements. And a plurality of nozzles that are formed at predetermined intervals and eject ink by heat generated by driving the plurality of electrothermal conversion elements, and each of the plurality of nozzles formed on the element substrate. A temperature detection element array by connecting at least a part of the plurality of temperature detection elements in series, and one end of the temperature detection element array supplies a constant current It is connected to a first wiring that, the other end of the temperature sensing element array is connected to the second wiring, the ink supply port, a plurality of independent ink supply for supplying individually the ink to the plurality of nozzles A plurality of independent ink supply ports, and the plurality of independent ink supply ports communicate with each other between the orifice plate and the element substrate. A beam portion is formed on the element substrate, the plurality of electrothermal conversion elements and the plurality of temperature detection elements are disposed on the beam portion, and the plurality of electrothermal conversion elements and the plurality of temperature detection elements are The temperature detection element columns are arranged in a column direction and a row direction, and the plurality of temperature detection elements are connected in series in the column direction or the row direction .

  Another aspect of the present invention includes a recording apparatus using the recording head having the above-described configuration, particularly a full-line inkjet recording head that performs recording by discharging ink in accordance with an inkjet method.

  Therefore, according to the present invention, since at least a part of the plurality of temperature detection elements is connected in series, it can be efficiently used in a limited wiring region. As a result, for example, even in a recording head that employs a configuration in which an electrothermal conversion element and a temperature detection element are arranged in a beam portion between independent ink supply ports, it becomes possible to reduce the area of the beam portion, It becomes possible to mount an electrothermal conversion element and a temperature detection element. This contributes to higher resolution of recording while suppressing the influence on wiring.

1 is a schematic sectional side view showing an internal configuration of an ink jet recording apparatus which is a typical embodiment of the present invention. FIG. 2 is a diagram for explaining an operation during single-sided recording in the recording apparatus shown in FIG. 1. FIG. 2 is a diagram for explaining an operation during double-sided recording in the recording apparatus shown in FIG. 1. It is a perspective view of a full line recording head. FIG. 3 is an exploded perspective view of a full line recording head. FIG. 6 is a top view and a cross-sectional view of a recording head of a comparative example. FIG. 6 is a top view and a cross-sectional view of a substrate on which a recording element and a temperature detection element are omitted in which a nozzle of a recording head of a comparative example is omitted. It is a figure which shows the mode of the connection in the recording head of a comparative example. FIG. 6 is a diagram illustrating a circuit layout of a recording element and a temperature detection element wired around an independent ink supply port of a recording head of a comparative example. It is sectional drawing which follows the A-A 'line of FIG.9 (b). It is a figure which shows the mode of the connection of the element substrate according to Example 1. FIG. It is a figure which shows the example of the circuit layout of the recording element and temperature detection element which are wired around the independent ink supply port. It is sectional drawing which follows the A-A 'line and B-B' line in FIG.12 (b). It is a timing chart which shows the time change of each signal which control circuit 107 handles, and the terminal voltage detected at the both ends of a temperature sensing element. It is a figure showing the voltage relationship of the voltage Ve, Vd, Vc, Vb, Va of each point of a temperature detection element row | line | column, and its time change. FIG. 10 is a connection diagram of an element substrate according to a second embodiment and a selection timing chart of temperature detection elements synchronized with sequential selection of each recording element. FIG. 10 is a diagram showing connection of element substrates according to Example 3. FIG. 6 is a top view and a cross-sectional view of a recording head according to a fourth embodiment. It is a figure which shows the mode of the connection of the element substrate according to Example 4. FIG. FIG. 9 is a top view and a cross-sectional view of a recording head according to a fifth embodiment. It is a figure which shows the mode of the connection of the element substrate according to Example 5. FIG. FIG. 10 is a top view and a cross-sectional view of a recording head according to a sixth embodiment. It is a figure which shows the mode of the connection of the element substrate according to Example 6. FIG. It is a figure which shows the mode of the connection of the element substrate according to Example 7. FIG.

  Hereinafter, preferred embodiments of the present invention will be described more specifically and in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the already demonstrated part and duplication description is abbreviate | omitted.

  In this specification, “recording” (sometimes referred to as “printing”) is not limited to the case of forming significant information such as characters and graphics, but may be significant. It also represents the case where an image, a pattern, a pattern, etc. are widely formed on a recording medium, or the medium is processed, regardless of whether it is manifested so that humans can perceive it visually. .

  “Recording medium” refers not only to paper used in general recording apparatuses but also widely to cloth, plastic film, metal plate, glass, ceramics, wood, leather, and the like that can accept ink. Shall.

  Further, “ink” (sometimes referred to as “liquid”) should be interpreted widely as in the definition of “recording (printing)”. Therefore, by being applied on the recording medium, it is used for formation of images, patterns, patterns, etc., processing of the recording medium, or ink processing (for example, solidification or insolubilization of colorant in the ink applied to the recording medium). It shall represent a liquid that can be made.

  Furthermore, unless otherwise specified, the “nozzle” collectively refers to an ejection port or a liquid channel communicating with the ejection port and an element that generates energy used for ink ejection.

  An element substrate (head substrate) for a recording head to be used below does not indicate a simple substrate made of a silicon semiconductor but indicates a configuration in which each element, wiring, and the like are provided.

  Further, the term “on the substrate” means not only the element substrate but also the surface of the element substrate and the inside of the element substrate near the surface. In addition, the term “built-in” as used in the present invention is not a term indicating that each individual element is simply arranged separately on the surface of the substrate, but each element is manufactured in a semiconductor circuit. It shows that it is integrally formed and manufactured on an element plate by a process or the like.

  Next, examples of the ink jet recording apparatus will be described. This recording apparatus uses a continuous sheet (recording medium) wound in a roll shape, and is a high-speed line printer that supports both single-sided recording and double-sided recording. For example, it is suitable for a large number of print fields in a print laboratory or the like.

  FIG. 1 is a side sectional view showing a schematic internal configuration of an ink jet recording apparatus (hereinafter referred to as a recording apparatus) which is a typical embodiment of the present invention. The inside of the apparatus is roughly divided into a sheet supply unit 1, a decurling unit 2, a skew correction unit 3, a recording unit 4, a cleaning unit (not shown), an inspection unit 5, a cutter unit 6, an information recording unit 7, a drying unit 8, and a sheet. It is divided into a winding unit 9, a discharge conveyance unit 10, a sorter unit 11, a discharge tray 12, a control unit 13, and the like. A sheet is conveyed by a conveyance mechanism including a roller pair and a belt along a sheet conveyance path indicated by a solid line in the drawing, and is processed in each unit.

  The sheet supply unit 1 is a unit that stores and supplies a continuous sheet wound in a roll shape. The sheet supply unit 1 can store two rolls R <b> 1 and R <b> 2, and is configured to selectively pull out and supply a sheet. The number of rolls that can be stored is not limited to two, and one or three or more rolls may be stored. The decurling unit 2 is a unit that reduces curling (warping) of the sheet supplied from the sheet supply unit 1. In the decurling unit 2, curling is reduced by using two pinch rollers for one driving roller and curving the sheet so as to give a curl in the opposite direction of curling. The skew correction unit 3 is a unit that corrects skew (inclination with respect to the original traveling direction) of the sheet that has passed through the decurling unit 2. The sheet skew is corrected by pressing the sheet end on the reference side against the guide member.

  The recording unit 4 is a unit that forms an image on the sheet by the recording head unit 14 with respect to the conveyed sheet. The recording unit 4 also includes a plurality of conveyance rollers that convey the sheet. The recording head unit 14 has a full line recording head (inkjet recording head) in which an inkjet nozzle row is formed in a range that covers the maximum width of a sheet that is assumed to be used. In the recording head unit 14, a plurality of recording heads are arranged in parallel along the sheet conveyance direction. In this embodiment, there are four recording heads corresponding to four colors of K (black), C (cyan), M (magenta), and Y (yellow). The arrangement order of the recording heads is K, C, M, Y from the upstream side of the sheet conveyance. The number of ink colors and the number of recording heads are not limited to four. As the ink jet method, a method using a heating element, a method using a piezo element, a method using an electrostatic element, a method using a MEMS element, or the like can be adopted. The ink of each color is supplied from the ink tank to the recording head unit 14 via the ink tube.

  The inspection unit 5 is a unit that optically reads the inspection pattern or image recorded on the sheet by the recording unit 4 and inspects the nozzle state of the recording head, the sheet conveyance state, the image position, and the like. The inspection unit 5 includes a scanner unit that actually reads an image and generates an image data, and an image analysis unit that analyzes the read image and returns an analysis result to the recording unit 4. The inspection unit 5 is a CCD line sensor, and the sensors are arranged in a direction perpendicular to the sheet conveyance direction.

  As described above, the recording apparatus shown in FIG. 1 is compatible with both single-sided recording and double-sided recording. FIGS. 2 and 3 are respectively the operations during single-sided recording in the recording apparatus shown in FIG. FIG. 6 is a diagram for explaining an operation during double-sided recording.

  FIG. 4 is a diagram showing the relationship between the full-line recording head 100 mounted on the recording head unit 14 and the recording medium 800 in the transport direction.

  When performing the recording operation, the full-line recording head 100 is fixed to the recording apparatus, the recording medium 800 is transported, and ink is ejected from a plurality of ejection ports 706 provided in the element substrate 101. An image is formed.

  As can be seen from this figure, in this example, the full line recording head 100 is configured by mounting four element substrates 101.

  FIG. 5 is an exploded perspective view of the full-line recording head.

  The full line recording head 100 includes four element substrates 101-1, 101-2, 101-3, 101-4, a support member 501, a printed wiring board 110, an ink supply member 502, and the like. As shown in FIG. 5, four element substrates are arranged in a staggered manner in the full line recording head 100. Note that a recording head having a longer recording width can be configured by increasing the number of element substrates 101 to be mounted. Further, when the description is made without specifying the four element substrates individually, the element substrate 101 is simply referred to.

  As can be seen from FIG. 5, the printed wiring board 110 is basically rectangular and the element substrate 101 is rectangular. A plurality of discharge ports 706 are arranged in the longitudinal direction of the element substrate 101. Also, the longitudinal direction of the element substrate 101. That is, the plurality of discharge ports are arranged so that the arrangement direction of the plurality of discharge ports is the longitudinal direction of the printed wiring board 110.

  First, a comparative example will be described in order to clarify the effects of the embodiment of the present invention and the problems of the conventional example.

<Comparative example>
A description will be given of a configuration in which a temperature detection circuit is built in a recording head that employs a flow path structure disclosed in Patent Document 2, and connection of a temperature detection circuit according to a conventional example will be described.

  FIG. 6 is a top view and a cross-sectional view of a recording head of a comparative example.

  FIG. 6A is a plan view of the recording head 401. Nozzles 405 are arranged on the orifice plate 404 at predetermined intervals, and independent ink supply ports 403 are formed on the element substrate 402 in accordance with the nozzle positions. . Here, they are arranged so as to obtain a column direction resolution by 8 nozzles in a 2 rows × 4 columns configuration. The recording head 401 is provided with electrode terminals 406 that are connected to external wiring.

  FIG. 6B is a cross-sectional view taken along the line AA ′ of FIG. 6A. A common ink supply port 411 is formed on the back surface of the recording head, and an independent ink supply port 403 penetrating to the front surface. An ink supply path is formed through which the liquid chamber 410 of the orifice plate 404 communicates. The element substrate 402 is provided with an electrothermal conversion element (recording element) 407 and a temperature detection element 408 formed of a thin film resistor. The recording element 407 and the temperature detection element 408 are disposed in a beam portion between the independent ink supply port and the independent ink supply port, and the nozzle 405 is disposed so as to correspond thereto.

  7A and 7B are a top view and a cross-sectional view of a multilayer substrate on which a recording element and a temperature detection element in which nozzles of a recording head of a comparative example are omitted are formed.

FIG. 7A is a top view of the substrate, and FIG. 7B is a cross-sectional view taken along the line AA ′ of FIG. 7A. In this substrate, a field oxide film 502 such as SiO ₂ and an insulating film 503 are laminated on a silicon substrate 501, and aluminum or the like that is connected to a temperature sensing element 505 of a thin film resistor such as Al, Pt, Ti, Ta, etc. First layer AL1 wiring 504 is formed. Further thereon, an interlayer insulating film 506 made of SiO or the like is laminated, and a second layer AL2 wiring 508 made of aluminum or the like that connects the recording element 507 made of TaSiN and the drive circuit formed on the silicon substrate is formed. Further thereon, a protective film 509 such as SiN and a cavitation resistant film 510 such as Ta which enhances the cavitation resistance on the recording element are laminated.

  The plan view of FIG. 7A shows the recording element 507, the AL2 wiring 508 connected to the drive circuit, the temperature detection element 505 drawn with a thick line frame, the AL1 wiring 504A of the individual wiring of the temperature detection element 505, and the common wiring. The AL1 wiring 504B of FIG.

  The temperature detection element 505 is formed without changing the structure of the element substrate by forming and patterning the AL1 layer.

  FIG. 8 is a diagram illustrating a connection state in which recording elements for eight segments (Seg1 to Seg8) and temperature detection elements are arranged in the recording head of the comparative example. In this figure, the independent ink supply port is also drawn so that the arrangement relationship between the circuit and the independent ink supply port can be understood.

  As shown in FIG. 8, the recording element 1705 of Seg1 is disposed in the beam portion between the independent ink supply ports 1707 and 1721, one terminal is connected to the power supply line VH that supplies power to the recording element, and the other terminal is connected. Connected to the switch 1701. The switch 1701 is ON / OFF controlled by a selection signal H1 from a control circuit (not shown). The recording elements Seg2 to Seg8 are also connected in the same manner as Seg1.

  One terminal of the temperature detection element 1706 of Seg1 is connected to the first common wiring 1722 of the constant current IS that supplies power to the temperature detection element through the wiring 1704, and the other terminal is connected to the switch 1702 and the terminal voltage by the individual wiring 1708. It is connected to a switch 1703 for reading. The other terminal of the switch 1703 is connected to the second common wiring 1719. The switches 1702 and 1703 are ON / OFF controlled by a selection signal S1 of a control circuit (not shown). The temperature detection elements Seg2 to Seg8 are also connected to the corresponding two switches by individual wiring. Through the first common wiring 1722 and the second common wiring 1719, the Va signal and the Vb signal that are terminal voltages of the selected temperature detection element are input to the differential amplifier 1718, and a differential signal VS that is a differential voltage is output. To do.

  FIG. 9 is a diagram showing a circuit layout of a recording element and a temperature detection element wired around the independent ink supply port of the recording head of the comparative example. The configuration of the wiring layer is the same as that shown in FIG. Here, a description will be given focusing on the wiring of the beam portion between the independent supply ports 1707 and 1717.

  FIG. 9A is a layout diagram showing a state in which the independent ink supply ports 1707 and 1717 and other independent supply ports in the connection diagram shown in FIG. 8 are formed. FIG. 9A shows a MOS transistor formation region 1724 corresponding to the two switches in the connection diagram shown in FIG. Moreover, the temperature detection element 1706 of a thin film resistor is formed in the beam portion between the independent supply ports at a predetermined interval according to the nozzle arrangement. The AL1 wirings 1708 to 1711 are individually connected to the temperature detection elements Seg1 to Seg4 and connected to the corresponding MOS transistor formation regions 1724 of the two selection switches. Also, an AL1 wiring 1715 that connects the recording element of Seg4 to the corresponding switch is formed. There are a total of five AL1 wires passing through the beam portion between the independent ink supply ports 1707 and 1717.

  FIG. 9B is a diagram showing the AL2 wiring layer and the recording element layer superimposed on FIG. 9A.

  As shown in FIG. 9B, the recording element 1705 is formed in the beam portion between the independent ink supply ports at a predetermined interval in accordance with the nozzle arrangement, and the AL2 wiring 1716 supplies VH to the recording elements Seg1 to Seg8. , 1723 are formed. In addition, AL2 wirings 1712, 1713, and 1714 that connect the recording elements of Seg1, Seg2, and Seg3 to the corresponding drive switches are formed. Further, the recording element of Seg4 is connected to the AL1 wiring 1715 through the AL2 wiring layer and the AL1 wiring layer through hole. There are a total of four AL2 wires passing through the beam portion between the independent ink supply ports 1707 and 1717.

  FIG. 10 is a cross-sectional view taken along the line A-A ′ of FIG. M indicates the beam width between the independent ink supply ports.

  As can be seen from FIG. 10, wirings 1708 to 1715 formed in the AL1 layer and wirings 1712 to 1716 formed in the AL2 layer are arranged at a predetermined interval. There are a total of nine wires through the beam. The wiring area of the beam portion is limited, and in the comparative example, the beam portion needs to have a widening width because the number of wires of the temperature detection circuit is large, and the space between the independent ink supply ports must be widened. This becomes a factor that hinders high resolution of the nozzle array.

  Next, several embodiments will be described regarding the detailed configuration of the full line recording head mounted on the recording apparatus having the above configuration.

  FIG. 11 is a diagram showing a connection in which recording elements and temperature detection elements for eight segments (Seg1 to Seg8) are arranged on the element substrate 101. FIG. This figure also shows the independent ink supply port so that the arrangement relationship between the circuit and the independent ink supply port can be understood.

  The recording element 111 of Seg1 is disposed in a beam portion between the independent ink supply ports 102 and 103, one terminal is connected to the power supply line VH that supplies power to the recording element, and the other terminal is connected to the drive switch 108. The The other terminal of the drive switch 108 is connected to the GND line that is the return destination of the power supply line VH. The drive switch 108 is on / off controlled by a selection signal H1 from the control circuit 107. The recording elements Seg2 to Seg8 are also connected in the same manner as Seg1.

  The temperature detection element 112 of Seg1, the temperature detection element 113 of Seg2, the temperature detection element 114 of Seg3, and the temperature detection element 115 of Seg4 are connected in series by wiring to constitute a temperature detection element array. One end of the temperature detection element array is connected to the first common wiring 121 that supplies a constant current IS to the temperature detection element, and the other end is a switch 109 that selects the temperature detection element array and a terminal voltage of the temperature detection element array. Is connected to the switch 110a. The other terminal of the switch (second switch) 110 is connected to the second common wiring 122, and the other terminal of the switch (first switch) 109 is connected to the VSS wiring that is the return destination of the constant current IS. Is done. The switches 109 and 110a are on / off controlled by a selection signal S1 of the control circuit 107. The temperature detection element arrays Seg5 to Seg8 are similarly connected.

  A Va signal and a Ve signal, which are terminal voltages of the temperature detection element array selected through the first common wiring 121 and the second common wiring 122, are input to the differential amplifier 124. The differential amplifier 124 receives the Va signal and the Ve signal and outputs a differential signal VS that is a differential voltage. The differential amplifier 124 has a sufficiently high input resistance so that a constant current does not flow into the temperature detection element. In view of the wiring resistance of the first and second common wirings, the power supply point of the constant current IS has a temperature detection element positioned downstream from the power supply point, and further a differential amplifier downstream from the temperature detection element. The positional relationship of the connection of the three parties where 124 is located is desirable.

  FIG. 12 is a diagram showing an example of the circuit layout of the recording element and the temperature detecting element wired around the independent ink supply port. Here, the layout is such that the two wiring layers of the AL1 wiring and the AL2 wiring such as aluminum and the above-described switches are MOS transistors.

  According to the layout shown in FIG. 12A, the independent ink supply ports 601 to 606 corresponding to the independent ink supply ports 102 to 107 in the connection diagram of FIG. 11 are formed. Also, MOS transistor regions 615 corresponding to the switches 109 and 110a are formed. Further, a temperature sensing element 616 of a thin film resistor is formed in a beam portion between independent ink supply ports at a predetermined interval in accordance with the nozzle arrangement shown in FIG.

  Furthermore, the AL1 wirings 608 to 610 correspond to the wirings 117 to 119 in FIG. 11, respectively, and the temperature detection elements Seg1 to Seg4 are connected in series. One end of the temperature detection element array is connected to the constant current IS corresponding to the first common wiring 121 by the AL1 wiring 611, and the other end is connected to the MOS transistor region 615 corresponding to the two switches 109 and 110 by the AL1 wiring 607. Connected to. In addition, AL1 wirings 613 and 614 for connecting the recording elements of Seg3 and Seg4 to the corresponding switches are formed. There are a total of three AL1 wires passing through the beam portion between the independent ink supply ports 601 and 606.

  FIG. 12B is a layout diagram showing the AL2 wiring layer and the recording element layer superimposed on FIG. According to the layout diagram shown in FIG. 12B, the recording elements 617 are formed on the beam portions between the independent supply ports at a predetermined interval in accordance with the nozzle arrangement shown in FIG. In addition, AL2 wirings 618 and 621 for supplying VH to the recording elements Seg1 to Seg8 are formed. Further, AL2 wirings 619 and 620 for connecting the recording elements of Seg1 and Seg2 to the corresponding switches are formed. Further, the through hole 612 connects the AL1 wiring and the AL2 wiring through an interlayer film, and connects the recording elements of Seg3 and Seg4 to the AL1 wirings 613 and 614, respectively. There are a total of three AL2 wires passing through the beam portion between the independent ink supply ports 601 and 606.

  FIG. 13 is a cross-sectional view taken along line A-A ′ and line B-B ′ in FIG.

  FIG. 13A shows a cross-sectional view taken along the line A-A ′, while FIG. 13B shows a cross-sectional view taken along the line B-B ′. For comparison, FIG. 13A also shows the cross-sectional view shown in FIG. 10 in the comparative example.

  In FIG. 13A, wirings 709, 710, and 711 formed in the AL1 layer correspond to the wirings 607, 613, and 614 in FIG. The wirings 706a, 707, and 708 formed with the AL2 layer correspond to the wirings 619, 620, and 621 in FIG. There are a total of 6 wires through the beam.

  The arrangement of the independent ink supply ports is determined according to the desired resolution, the flow path length to the recording element is determined according to the ink ejection frequency, and the size of the opening of the independent ink supply port is determined according to the required ink supply amount. On the other hand, in the manufacture of the independent ink supply port, a certain area around the opening is a wiring prohibited area, and the wiring area of the beam portion between the independent ink supply ports is limited.

  As shown in FIG. 13A, the beam portion inside the edge 704 of the independent supply port 601 and the edge 705 of the independent supply port 606 is divided into a wiring prohibited area L1 and a wiring area L2. Under such constraints, in this embodiment, a total of six wirings connected to the recording element and one wiring connected to the temperature detection element are realized by the wiring layout in the AL1 layer and the AL2 layer. .

  Thus, as can be seen from the comparison with the comparative example, in this embodiment, the number of wirings is reduced, and the beam portion can be narrowed correspondingly, and the space between the independent ink supply ports can be narrowed. Become. This makes it possible to increase the resolution of the nozzle array.

  As shown in the cross-sectional view of FIG. On the beam portion side, the recording element 702 and the temperature detection element 703 are formed under the same restrictions, and the wiring connected to the temperature detection element is realized by a minimum number of one.

  Next, the operation of the element substrate will be described.

  The control circuit 107 shown in FIG. 11 has a recording element selection function and a temperature detection element selection function. The recording element selection function is composed of a 4-bit shift register (not shown) and a 4-line decoder (not shown) and is (2 × 4) time-division driven, and row data and blocks for turning on / off the recording elements And select signals H1-H8 are generated. The temperature detection element selection function uses a 2-bit shift register (not shown) to input a clock signal and a start pulse signal and sequentially generate selection signals S1 and S2.

  In response to the selection signal S1, the switch 109 is turned on, the constant current IS is supplied to the temperature detection element arrays Seg1 to Seg4, and a terminal voltage is generated in each temperature detection element according to the detected temperature. Divided voltages Ve, Vd, Vc, Vb, and Va are generated across Seg1 to Seg4 as voltages at each point of the temperature detection element array. The terminal voltage Va on the Seg4 side of the temperature detection element array is input to the differential amplifier 124 through the first common wiring 121. The other terminal voltage Ve on the Seg1 side is input to the differential amplifier 124 via the switch 110a. The differential amplifier 124 receives the Va signal and the Ve signal and outputs a differential signal VS that is a voltage across the terminals of the temperature detection element array.

  FIG. 14 is a timing chart showing the time change of each signal handled by the control circuit 107 and the terminal voltage detected at both ends of the temperature detection element.

  14A is a timing chart of signals transferred to the control circuit 107 in order to select a recording element to be driven.

  According to FIG. 14A, 2-bit row data D0, D1 and block data B0, B1 are serially transferred as data signal (DATA_H) in synchronization with the clock signal (CLK_H), and the latch signal (LT) is latched. Hold by pulse. Immediately thereafter, an application pulse is given by a heat enable signal (HE) to the recording element. Here, the case where the recording element 111 of Seg1 is selected is illustrated.

  On the other hand, FIG. 14B shows the selection timing of the temperature detection elements synchronized with the sequential selection of each recording element according to the data transfer timing shown in FIG.

  According to FIG. 14B, at t = t1, the selection signal S1 is turned on by applying a start pulse with the serial data signal (DATA_S) in synchronization with the shift clock signal (CLK_S). As a result, the temperature detection elements Seg1 to Seg4 are simultaneously selected. Next, at t = t2, the selection signal H1 is turned on to drive the recording element 111 of Seg1. Accordingly, the temperature detecting element 112 generates a voltage between terminals (Vd−Ve) in response to temperature. This inter-terminal voltage is transmitted to Vc and Vb and appears in Va, and the differential signal VS is output from the differential amplifier 124.

  Further, at t = t3, the selection signal H2 is turned on to drive the recording element of Seg2. Along with this, the temperature detecting element of Seg2 responds and generates a terminal voltage (Vc−Vd). This inter-terminal voltage is transmitted through Vb and appears in Va. Similarly, Seg3 and Seg4 are sequentially selected to read the temperature detection information of each segment. The same applies to Seg5 to Seg8. By this operation, a change in temperature detection at each temperature detection element is detected.

  FIG. 15 is a diagram showing the voltage relationship between the voltages Ve, Vd, Vc, Vb, and Va at each point of the temperature detection element array and the change with time. The intended voltages in the selected state are Ve = 0.48V, Vd = 0.56V,..., Va = 0.78V.

  Referring to FIG. 14B, it can be seen that the change in the voltage Vd appears as it is in the voltage Va in response to the temperature detection element of Seg1 at the time corresponding to t = t2. Similarly, at t = t3, the temperature detecting element of Seg2 responds and a change in voltage Vc appears in voltage Va. Hereinafter, the response waveform of Seg3 appears at the voltage Va at t = t4, and the response waveform of Seg4 at t = t5.

  In the first embodiment, the connection in which the four temperature detection elements are connected in series has been described. However, the connection in which all the temperature detection elements are connected in series is also possible.

  FIG. 16 is a connection diagram in which recording elements and temperature detection elements for 8 segments are arranged on the element substrate, and a selection timing chart of temperature detection elements synchronized with the sequential selection of each recording element.

  FIG. 16A shows a connection diagram in which recording elements and temperature detection elements for 8 segments are arranged on the element substrate. Here, the independent ink supply port is also drawn so that the arrangement relationship between the circuit and the independent ink supply port can be understood. Further, the basic circuit configuration of FIG. 16A is the same as FIG.

  The temperature detection element 805 of Seg1 has one terminal connected to a constant current IS that supplies power to the temperature detection element, and the other terminal connected to the temperature detection element Seg2. Thereafter, the terminals are connected in series through Seg3, 4, 8, 7, and 6 to the terminal Seg5.

  One end of the terminal temperature detection element 811 is connected to the switch 802 and input to the differential amplifier 812. The other terminal of the switch 802 is connected to the VSS line that is the return destination of the constant current IS. As can be seen from this figure, in this embodiment as well, the wiring of the temperature detection circuit that passes the beam portion between the independent ink supply ports is realized with a minimum number of one.

  Next, the operation of this element substrate will be described.

  The switch 802 is turned on by the selection signal S, the constant current IS is supplied to the temperature detection element array, and a terminal voltage is generated in each temperature detection element according to the detected temperature. The voltage at each point of the temperature detection element array spans Seg1 to Seg4 and Seg8 to Seg5, and Va is generated from the divided voltage Vi. The terminal voltage Vi of the terminal temperature detection element and the terminal voltage Va on the Seg1 side are input to the differential amplifier 812. The differential amplifier 812 receives the Va signal and the Vi signal and outputs a differential signal VS that is a voltage between terminals of the temperature detection element array. By this operation, a change in voltage at each temperature detection element is detected.

  FIG. 16B shows the selection timing of the temperature detection elements synchronized with the sequential selection of the recording elements one by one. First, at t = t1, the selection signal S is turned on, and all the temperature detection elements are simultaneously selected. Next, at t = t2, the selection signal H1 is turned on to drive the recording element 804 of Seg1. Along with this, the temperature detecting element 805 of Seg1 generates a voltage (Va−Vb) between terminals in response to the temperature. As a result, a differential signal VS between the voltage Va and the voltage Vi is output.

  Further, at t = t3, the selection signal H2 is turned on to drive the recording element of Seg2. Along with this, the temperature detecting element of Seg2 responds and generates a voltage (Vb−Vc). As a result, this inter-terminal voltage appears at Va. Similarly, Seg3, Seg4, Seg8... Seg5 are sequentially selected and the temperature detection information of each segment is read out.

  In the first embodiment, the connection in which the four temperature detection elements in the row direction are connected in series has been described. However, the connection in which the temperature detection elements are connected in series in the column direction is also possible.

  FIG. 17 is a diagram showing connections in which recording elements and temperature detection elements for 8 segments are arranged on the element substrate. Here, the independent ink supply port is also drawn so that the arrangement relationship between the circuit and the independent ink supply port can be understood. The basic circuit configuration of FIG. 17 is the same as that of FIG.

  The temperature detection element 905 of Seg1 and the temperature detection element 906 of Seg5 are connected in series by a wiring 908 to constitute a temperature detection element array. One end of the temperature detection element array is connected to a first common wiring 909 that supplies a constant current IS to the temperature detection element, and the other end reads a switch 902 that selects the temperature detection element array and a terminal voltage of the temperature detection element array. Connected to the switch 903. The other terminal of the switch 903 is connected to the second common wiring 911, and the other terminal of the switch 902 is connected to the VSS wiring that is the return destination of the constant current IS. The temperature detection elements in the other segments are similarly connected. The wiring of the temperature detection circuit that passes the beam portion between the independent ink supply ports is arranged only in the column direction.

  Next, the operation of this element substrate will be described.

  The switch 902 is turned on by the selection signal S1, the constant current IS is supplied to the temperature detection element arrays Seg1 and Seg5, and a terminal voltage is generated in each temperature detection element according to the detected temperature. The voltage at each point of the temperature detection element array is across Seg1 and Seg5, and divided voltages Vc, Vb, and Va are generated. The terminal voltage Va on the Seg5 side of the temperature detection element array is input to the differential amplifier 910 through the first common wiring 909. The other terminal voltage Vc on the Seg1 side is input to the differential amplifier 910 via the switch 903. The differential amplifier 910 receives the voltage Va and the voltage Vc, and outputs a differential signal VS that becomes a voltage between terminals of the temperature detection element array. By this operation, a change in temperature detection at each temperature detection element is detected.

  Here, an example in which the arrangement relationship between the printing element and the independent supply port is different from those in the first to third embodiments will be described.

  FIG. 18 is a top view and a cross-sectional view of the recording head 1001 according to this embodiment.

  FIG. 18A is a plan view of the recording head 1001, and nozzles 1003 are arranged on the orifice plate 1004 at a predetermined interval. Here, they are arranged so as to obtain a column direction resolution with a total of 8 nozzles of 2 rows × 4 nozzles configuration. The recording head 1001 is provided with electrode terminals 1006 that are connected to external wiring. Further, independent ink supply ports 1005 are formed in pairs on the element substrate 1002 so as to form a symmetrical flow path with respect to the nozzle.

  FIG. 18B is a cross-sectional view taken along the line AA ′ of FIG. 18A, and a common ink supply port 1009 is formed on the back surface of the recording head, and an independent ink supply port 1005 penetrating to the front surface. Then, an ink supply path in which the liquid chamber of the orifice plate 1004 communicates is formed. The element substrate 1002 is provided with an electrothermal conversion element (recording element) 1007 and a temperature detection element 1008 formed of a thin film resistor. The recording element 1007 and the temperature detection element 1008 are arranged in a beam portion between the pair of independent ink supply ports, and the nozzles 1003 are arranged to correspond to each other.

  FIG. 19 is a diagram showing a state of connection in which an 8-segment recording element and a temperature detection element having a 2-row × 4-nozzle configuration are arranged on the element substrate. Here, the independent ink supply ports 1101 to 1105 are drawn so that the arrangement relationship between the circuit and the ink supply ports can be understood.

  As shown in FIG. 19, one terminal of the recording element 1106 of Seg1 is connected to the power supply line VH that supplies power to be applied to the recording element, and the other terminal is connected to the switch 1107. The other terminal of the switch 1107 is connected to GNDH which is a return destination of the power supply line VH. The switch 1107 is ON / OFF controlled by a selection signal H1 from a control circuit (not shown). Hereinafter, Seg3, 5, and 7 are similarly connected. Seg 2, 4, 6, 8 arranged so as to face Seg 1, 3, 5, 7 are similarly connected.

  Then, the temperature detection element 1108 of Seg1 and the temperature detection element 1109 of Seg2 are connected in series by a wiring 1110 to constitute a temperature detection element array. One end of the temperature detection element array is connected to a first common wiring 1114 for supplying a constant current IS to the temperature detection element, and the other end reads a switch 1111 for selecting the temperature detection element array and a terminal voltage of the temperature detection element array. Connected to switch 1112.

  The other terminal of the switch 1112 is connected to the second common wiring 1113, and the other terminal of the switch 1111 is connected to a VSS wiring that is a return destination of the constant current IS. The switches 1111 and 1112 are ON / OFF controlled by a selection signal S1 from a control circuit (not shown). The temperature detection element arrays of Seg3 and Seg4, Seg5 and Seg6, and Seg7 and Seg8 are similarly connected. The wiring of the temperature detection circuit that passes the beam portion between the independent ink supply ports is connected in one arrangement.

  Next, the operation of this element substrate will be described.

  In response to the selection signal S1, the switch 1111 is turned on, the constant current IS is supplied to the temperature detection element arrays Seg1 and Seg2, and a terminal voltage is generated in each temperature detection element according to the detected temperature. The voltage at each point of the temperature detection element array is over Seg1 and Seg2, and divided voltages Vc, Vb, and Va are generated. The terminal voltage Va on the Seg2 side of the temperature detection element array is input to the differential amplifier 1115 through the first common wiring 1114. The other terminal voltage Vc on the Seg1 side is input to the differential amplifier 1115 via the switch 1112. The differential amplifier 1115 receives the voltage Va and the voltage Vc, and outputs a differential signal VS that becomes a voltage between terminals of the temperature detection element array. By this operation, a voltage change reflecting the temperature at each temperature detection element is detected.

  In addition, although the example which connected the temperature detection element in series in the row direction was demonstrated here, the same connection as Example 2-3 is also possible.

  Here, an example in which the arrangement relationship of the printing element and the independent supply port is different from those of the first to fourth embodiments will be described.

  FIG. 20 is a top view and a cross-sectional view of the recording head 1201 according to this embodiment.

  FIG. 20A is a plan view of the recording head 1201, and nozzles 1205 are arranged on the orifice plate 1204 at a predetermined interval. An independent ink supply port 1203 corresponding to each nozzle is formed in the element substrate 1202. Here, they are arranged so as to obtain a column direction resolution by a total of 8 nozzles of 2 rows × 4 columns. The recording head 1201 is provided with electrode terminals 1206 that are connected to external wiring.

  FIG. 20B is a cross-sectional view taken along the line AA ′ in FIG. 20A. On the back surface of the recording head, an independent ink supply port 1203 penetrating the element substrate 1202 up to the front surface and the liquid in the orifice plate 1204 An ink supply path that communicates with the chamber is formed. The element substrate 1202 is provided with an electrothermal conversion element (recording element) 1207 and a temperature detection element 1208 formed of a thin film resistor. A recording element 1207, a temperature detection element 1208, and a control circuit 1209 are disposed in a beam portion between adjacent independent ink supply ports, and a nozzle 1205 is disposed so as to correspond thereto.

  FIG. 21 is a diagram showing a connection state in which an 8-segment recording element and a temperature detection element having a nozzle configuration of 2 rows × 4 columns are arranged on the element substrate. Here, the independent ink supply ports 1302 to 1305 and 1322 are drawn so that the arrangement relationship between the circuit and the ink supply ports can be understood.

  As shown in FIG. 21, one terminal of the recording element 1308 of Seg1 is connected to the power supply line VH that supplies power to be applied to the recording element, and the other terminal is connected to the switch 1307. The other terminal of the switch 1307 is connected to GNDH which is the return destination of the power supply line VH. The switch 1307 is ON / OFF controlled by a selection signal H1 from the control circuit 1324.

  Hereinafter, Seg2 to Seg8 are similarly connected.

  The temperature detection element 1309 of Seg1, the temperature detection element 1310 of Seg2, the temperature detection element 1311 of Seg3, and the temperature detection element 1312 of Seg4 are connected in series by wiring to constitute a temperature detection element array. One end of the temperature detection element row is connected to a first common wiring 1321 that supplies a constant current IS to the temperature detection element, and the other end reads a switch 1313 for selecting the temperature detection element row and a terminal voltage of the temperature detection element row. Connected to the switch 1314. The other terminal of the switch 1314 is connected to the second common wiring 1315, and the other terminal of the switch 1314 is connected to the VSS wiring that is the return destination of the constant current IS. The switches 1313 and 1314 are ON / OFF controlled by a selection signal S1 from the control circuit 1324. The temperature detection element arrays Seg5 to Seg8 are similarly connected and controlled by the control circuit 1323.

  Next, the operation of this element substrate will be described.

  When the switch 1313 is turned on by the selection signal S1, a constant current IS is supplied to the temperature detection element arrays Seg1 to Seg4, and a terminal voltage is generated in each temperature detection element according to the detected temperature. The voltage at each point of the temperature detection element array extends from Seg1 to Seg4, and divided voltages Ve, Vd, Vc, Vb, and Va are generated. The terminal voltage Va on the Seg2 side of the temperature detection element array is input to the differential amplifier 1326 through the first common wiring 1321. The other terminal voltage Ve on the Seg1 side is input to the differential amplifier 1326 via the switch 1314. The differential amplifier 1326 receives the voltage Va and voltage Ve signals and outputs a differential signal VS that is a voltage between terminals of the temperature detection element array. By this operation, a voltage change reflecting the temperature at each temperature detection element is detected.

  In the first to fifth embodiments, the example of the independent ink supply port has been described. Here, an example of a recording head having a common ink supply port will be described.

  FIG. 22 is a top view and a cross-sectional view of a recording head 1401 according to this embodiment.

  FIG. 22A is a plan view of the recording head 1401, and nozzles 1405 are arranged on the orifice plate 1404 at a predetermined interval. Here, nozzles 1405 are alternately arranged across the common ink supply port 1403, and 8 segments of 2 rows × 4 nozzles are formed on the element substrate 1402 in a predetermined direction. The recording head 1401 is provided with an electrode terminal 1409 that is connected to an external wiring.

  FIG. 22B is a cross-sectional view taken along the line AA ′ in FIG. 22A. A recording element 1406 and a temperature detection element 1407 form a set on the back surface of the recording head, and a common ink supply port 1403 is provided. Arranged between. A nozzle 1405 is formed on the orifice plate 1404 so as to correspond to the recording element. In addition, the control circuit 1408 is disposed at a place where the recording element 1406 and the temperature detection element 1407 are adjacent to each other and apart from the common ink supply port 1403.

  FIG. 23 is a diagram showing a connection state in which an 8-segment recording element and a temperature detection element having a 2-row × 4-nozzle configuration are arranged on the element substrate. Here, the common ink supply port 1511 is also drawn so that the arrangement relationship between the circuit and the common ink supply port can be understood.

  As shown in FIG. 23, one terminal of the recording element 1504 of Seg1 is connected to the power supply line VH that supplies power to be applied to the recording element, and the other terminal is connected to the switch 1501. The other terminal of the switch 1501 is connected to GNDH that is the return destination of the power supply line VH. The switch 1501 is ON / OFF controlled by a selection signal H1 of a control circuit (not shown).

  Hereinafter, Seg3, Seg5, and Seg7 are similarly connected. Further, Seg2 to Seg8 that face each other across the common ink supply port 1511 are similarly connected.

  The temperature detection element 1505 of Seg1, the temperature detection element of Seg3, the temperature detection element of Seg5, and the temperature detection element of Seg7 on one side of the common ink supply port 1511 are connected in series to form a temperature detection element array. One end of the temperature detection element row is connected to a first common wiring 1512 that supplies a constant current IS to the temperature detection element, and the other end reads a switch 1502 for selecting the temperature detection element row and a terminal voltage of the temperature detection element row. Connected to the switch 1503. The other terminal of the readout switch 1503 is connected to the second common wiring 1513, and the other terminal of the switch 1502 is connected to the VSS wiring that is the return destination of the constant current IS. The switches 1502 and 1503 are ON / OFF controlled by a selection signal S1 of a control circuit (not shown). The temperature detection element arrays Seg2 to Seg8 facing each other across the common ink supply port 1511 are similarly connected.

  Next, the operation of this element substrate will be described.

  In response to the selection signal S1, the switch 1502 is turned on and the constant current IS is supplied to the temperature detection element array to which Seg1 belongs, and a terminal voltage is generated in each temperature detection element according to the detected temperature. The voltage at each point of the temperature detection element array is over Seg1, 3, 5, and 7, and divided voltages Ve, Vd, Vc, Vb, and Va are generated. The terminal voltage Va of the temperature detection element array Seg1 is input to the differential amplifier 1510 through the first common wiring 1512. The other terminal voltage Ve on the Seg7 side is input to the differential amplifier 1510 via the switch 1503. The differential amplifier 1510 receives the voltage Va and the voltage Ve and outputs a differential signal VS that is a voltage between terminals of the temperature detection element array. By this operation, a voltage change reflecting the temperature at each temperature detection element is detected.

  In Examples 1-6, the example which detects the voltage change of a temperature detection element was shown. Here, an example will be described in which a reference temperature detection element is provided, the series voltage is corrected, and the inter-terminal voltage of each temperature detection element is read.

  FIG. 24 is a diagram showing a connection state in which a correction circuit is provided in addition to an 8-segment recording element and a temperature detection element having a 2-row × 4-column nozzle configuration on the element substrate. Here, the independent ink supply port is drawn so that the arrangement relationship between the circuit and the ink supply port can be understood. The basic circuit configuration of FIG. 24 is the same as that of FIG.

  As shown in FIG. 24, the temperature detection elements Seg1 to Seg4 are connected in series to form a temperature detection element array. One end of the temperature detection element array is connected to a first common wiring 1613 that supplies a constant current IS to the temperature detection element, and the other end is connected to a switch 1615 that selects the temperature detection element array. The other terminal of the switch 1615 is connected to a VSS wiring that is a return destination of the constant current IS. The switch 1615 is ON / OFF controlled by a selection signal S1 of a control circuit (not shown). The temperature detection element arrays Seg5 to Seg8 are similarly connected.

  Here, the configuration of the correction circuit shown in FIG. 24 will be described.

  Reference temperature detection element arrays in which temperature detection elements 1602 to 1605 are connected in series are provided so as to correspond to the temperature detection element arrays of Seg1 to Seg4. A constant current IS ′ from another constant current source having the same constant current amount as the constant current IS is supplied to one end of the reference temperature detection element array. The other terminal is connected to a switch 1601 similar to the switch 1615. Reference voltages Va ′, Vb ′, Vc ′, Vd ′, and Ve ′ corresponding to the temperature detection element array are generated at each connection point of the reference temperature detection element array. These reference voltages are connected to arithmetic circuits 1606 to 1608 that generate reference voltages. The outputs of the arithmetic circuits are connected to switches 1609 to 1611, respectively. The other terminals of these switches (third switches) 1609 to 1611 are connected in common and input to the differential amplifier 1612.

  Next, the operation of this element substrate will be described.

-When reading the voltage (Va-Vb) between the terminals of the temperature detection element of Seg4 It is calculated | required by deducting the voltage component (Vb-Ve) from the both-ends voltage (Va-Ve) of the temperature detection element row | line | column of Seg1-Seg4. Therefore, a reference voltage Vb ′ equal to the voltage Vb is used,
Vs = Va−Vb ′
Is calculated. Then, the switch 1613 is turned on to supply the reference voltage Vb ′ to the differential amplifier 1612 to output the terminal voltage VS.

When reading the voltage (Vb−Vc) between the terminals of the temperature detection element of Seg3 From the voltage (Va−Ve) across the temperature detection element array of Seg1 to Seg4, (Va−Vb) and (Vc−Ve) It is calculated by subtracting. Therefore, the reference voltages Va ′, Vb ′, Vc ′ equal to the voltages Va, Vb, Vc are used,
Vs = Va − [(Va′−Vb ′) + Vc ′]
Is calculated. Then, the switch 1609 is turned on, the reference voltage (Va′−Vb ′) + Vc ′ of the arithmetic circuit 1606 is applied to the differential amplifier 1612, and the inter-terminal voltage VS is output.

When reading the voltage (Vc-Vd) between the terminals of the temperature detection element of Seg2 From the voltage (Va-Ve) across the temperature detection element array of Seg1 to Seg4, (Va-Vc) and (Vd-Ve) voltage It is calculated by subtracting. Therefore, using reference voltages Va ′, Vc ′, Vd ′ equal to the voltages Va, Vc, Vd,
Vs = Va − [(Va′−Vc ′) + Vd ′]
Is calculated. Then, the switch 1610 is turned on, the reference voltage (Va′−Vc ′) + Vd ′ of the arithmetic circuit 1607 is applied to the differential amplifier 1612, and the inter-terminal voltage VS is output.

-When reading the voltage (Vd-Ve) between the terminals of the temperature detection element of Seg1 By subtracting the (Va-Vd) voltage component and the Ve voltage component from the voltage (Va-Ve) at both ends of the temperature detection element array of Seg1 to Seg4. Desired. Therefore, using reference voltages Va ′, Vd ′, Ve ′ equal to the voltages Va, Vd, Ve,
Vs = Va − [(Va′−Vd ′) + Ve ′]
Is calculated. Then, the switch 1611 is turned on, and the reference voltage (Va′−Vd ′) + Ve ′ of the arithmetic circuit 1608 is applied to the differential amplifier 1612 to output the inter-terminal voltage Vs.

  Therefore, according to the seventh embodiment described above, by using the correction circuit, it is possible to obtain individual inter-terminal voltages even in the series of temperature detection element arrays connected in series. The amount can be detected.

  In any of the first to seventh embodiments described above, since the number of wirings can be reduced by connecting at least some of the plurality of temperature detection elements in series, the substrate area required for the wirings can be reduced. Therefore, the width of the beam portion described above can be reduced, and for example, the space between the independent ink supply ports can also be reduced, which contributes to higher resolution of the nozzle array.

Claims (9)

A plurality of electrothermal conversion elements are arranged on the first layer of the multilayer substrate, and the temperatures of the plurality of electrothermal conversion elements are arranged on the second layer of the multilayer substrate corresponding to the positions where the plurality of electrothermal conversion elements are arranged. A recording head comprising an element substrate having a configuration in which a plurality of temperature detection elements for detecting the temperature is arranged, and an orifice plate on the element substrate,
A plurality of nozzles that are formed in the orifice plate at predetermined intervals corresponding to the plurality of electrothermal transducers, and that eject ink by heat generated by driving the electrothermal transducers;
An ink supply port for supplying ink to each of the plurality of nozzles formed on the element substrate;
A temperature detection element array is configured by connecting at least a part of the plurality of temperature detection elements in series,
One end of the temperature detection element array is connected to a first wiring that supplies a constant current, and the other end of the temperature detection element array is connected to a second wiring ,
The ink supply port is
A plurality of independent ink supply ports for individually supplying ink to each of the plurality of nozzles;
A common ink supply port through which the plurality of independent ink supply ports communicate;
The plurality of independent ink supply ports communicate with each other between the orifice plate and the element substrate, and the communicated portion forms a beam portion on the element substrate;
The plurality of electrothermal conversion elements and the plurality of temperature detection elements are disposed in the beam portion,
The plurality of electrothermal conversion elements and the plurality of temperature detection elements are arranged in a column direction and a row direction,
The recording head, wherein the temperature detection element column is configured by connecting the plurality of temperature detection elements in series in the column direction or the row direction . The plurality of independent ink supply ports are made into two pairs,
Arranging the pair to correspond to each of the plurality of nozzles,
The recording head according to claim 1 , wherein the pair communicates to form the beam portion. The recording head according to claim 1, wherein the ink supply port penetrates the element substrate. 2. The differential amplifier according to claim 1, further comprising a differential amplifier that inputs a voltage from the first wiring and a voltage from the second wiring and outputs a signal reflecting a difference voltage between the two voltages. 4. The recording head according to any one of items 3 . 5. The apparatus according to claim 4 , further comprising a control circuit that selects and drives a plurality of electrothermal conversion elements corresponding to at least a part of the plurality of temperature detection elements constituting the temperature detection element array in a time division manner. The recording head described. A reference temperature detection element array configured by connecting in series with another plurality of temperature detection elements corresponding to each of at least some of the plurality of temperature detection elements forming the temperature detection element array;
A plurality of arithmetic circuits for calculating a differential voltage between each of the plurality of other temperature detecting elements constituting the reference temperature detecting element array;
A differential that inputs a voltage from the first wiring and any one of the differential voltages between the different temperature sensing elements and outputs a signal reflecting the differential voltage between the two voltages An amplifier;
Recording head according to any one of claims 1 to 5, further comprising a switch for selecting either one of difference voltage between the voltage difference between the respective said other plurality of temperature sensing elements. It said plurality of recording heads according to any one of claims 1 to 6 each temperature sensing element characterized in that it is a thin film resistor. The full-line recording head according to any one of claims 1 to 7 , wherein a plurality of the element substrates are arranged in an arrangement direction of the plurality of electrothermal transducer elements to obtain a recording width corresponding to a width of a recording medium. The recording head according to item 1. A recording apparatus that performs recording using the full-line recording head according to claim 8 .

Images