JP6875259B2 - Pachinko machine - Google Patents

Description

The present invention relates to a gaming machine capable of playing a game.

Slot machines and pachinko machines typified by game machines include, for example, those provided with a board case capable of storing a circuit board on which electronic components are mounted.

In this type of substrate case, a plurality of heat radiating holes for discharging the hot air in the substrate case to the outside are formed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2008-173340

In the substrate case provided in the gaming machine described in Patent Document 1, there is room for improvement in the structure related to the heat dissipation holes.

The present invention has been made by paying attention to such a problem, and an object of the present invention is to provide a gaming machine provided with a suitable substrate case.

Of the gaming machine hand stage 1,
A gaming machine capable of playing (for example, a slot machine 1A or a pachinko gaming machine 1B).
A board case (for example, board cases 200, 210) capable of accommodating a circuit board (for example, effect control boards 2011, 211) on which electronic components (for example, a production control CPU 120 or ROM 121) is mounted is provided.
The substrate cases is,
A heat dissipation hole leading from the inner surface to the outer surface of the substrate case,
Ejector pin marks (for example, ejector pin marks 240A and 240B) generated when the resin molded product is released from the mold ,
Have ,
Has a specific area that is formed in a state in which the heat radiation holes of several are aligned two-dimensionally in a predetermined surface of the board case,
The area of the specific region on the predetermined surface is smaller than the area of the non-specific region on which the heat radiation hole is not provided on the predetermined surface.
The number of the ejector pin traces of the specific region, the greater than the number of the ejector pin traces a non-specific region (e.g., a plurality of ejector pins marks 240A, the ejector pin marks 240A of 240B, in the cover member 213 Eight heat radiation holes 220 are provided in the specific area Z1 formed in a state of being aligned in the left-right and vertical directions, and three are provided in the non-specific area Z2. That is, the specific area Z1 is provided with the non-specific area. There are more ejector pin marks 240A than Z2 (see FIG. 4) ,
It is characterized by that.
According to this feature, it becomes easy to apply an even force to a specific region that becomes fragile due to the plurality of heat dissipation holes, so that damage when the resin molded product is removed from the mold can be suppressed.

The gaming machine of the means 2 of the present invention is the gaming machine according to the means 1.
The substrate case is formed of a transparent synthetic resin material, and gate marks generated by injection molding are provided on the inner surface side (for example, the gate marks 230A and 230B are injected with the synthetic resin material melted at the time of molding. It is a trace formed in the portion, and as shown in FIG. 5, it projects inward to the recess 231A formed on the outer surface 213S on the side where the synthetic resin material is injected and the portion corresponding to the recess 231A on the inner surface 213N. It is composed of a convex portion 231B formed as described above.)
It is characterized by that.
According to this feature, it is possible to prevent dust and the like from adhering to the gate marks and hindering visibility.

The gaming machine of means 3 of the present invention is the gaming machine according to means 1 or 2.
The substrate case is made of a transparent synthetic resin material.
The ejector pin marks are provided on the inner surface side (for example, the ejector pins (see FIG. 6) for releasing the resin molded product from the mold are brought into contact with the inner surface 213N of the cover member 213 during molding. A plurality of ejector pin marks 240A and 240B are formed.)
It is characterized by that.
According to this feature, heat can be suitably dissipated.

The gaming machine of means 4 of the present invention is the gaming machine according to any one of means 1 to 3.
The ejector pin mark is provided at a position separated by a predetermined distance from each of the heat radiating holes arranged around the plurality of heat radiating holes (for example, an ejector formed of a recess having a diameter of R11 (for example, about 10 mm)). The pin mark 240A is formed at a position separated from each of the four heat radiating holes 220 arranged around the plurality of heat radiating holes 220 by the same distance, for example, in a region surrounded by the four heat radiating holes 220. 4)
It is characterized by that.
According to this feature, it becomes easy to apply the force evenly, so that damage when the resin molded product is removed from the mold can be suppressed.

The gaming machine of means 5 of the present invention is the gaming machine according to any one of means 1 to 4.
A plurality of ejector pin marks are provided,
At least one ejector pin mark is different in size from the other ejector pin marks (for example, in the specific region Z1, the ejector pin having a small protruding surface diameter is placed in a plurality of places where the heat radiation hole 220 does not exist (for example, four heat dissipation). An ejector pin mark 240A composed of recesses having a diameter of R11 (for example, about 10 mm) is formed in order to set the area surrounded by the holes 220, and for the non-specific area Z2, the diameter of the protruding surface is R12 (for example, for example). , About 15 mm) ejector pins, ejector pin marks 240B formed of recesses having a diameter of R12 (for example, about 15 mm) are formed at a plurality of locations in the non-specific region Z2 (see FIG. 4).
It is characterized by that.
According to this feature, since the resin molded product can be extruded with an appropriate force according to the portion, damage when the resin molded product is removed from the mold can be suppressed.

The gaming machine of means 6 of the present invention is the gaming machine according to any one of means 1 to 5.
The substrate case is formed with heat dissipation holes (for example, heat dissipation holes 220) that lead from the inner surface (for example, inner surface 213N) of the substrate case to the outer surface (for example, outer surface 213S).
The opening on the inner surface side (for example, the first opening 220A) of the substrate case in the heat dissipation hole is larger than the opening on the outer surface side (for example, the second opening 220B) (see R1> R2, FIG. 5).
It is characterized by that.
According to this feature, since the opening on the inner surface side of the heat radiating hole is larger than the opening on the outer surface side, the volume inside the substrate case is increased and hot air easily flows in the substrate case, so that the heat radiating effect is enhanced.

In addition, the present invention may have only the invention-specific matters described in the claims of the present invention, or may have a configuration other than the invention-specific matters together with the invention-specific matters described in the claims of the present invention. It may have.

(A) is a schematic perspective view showing a slot machine including a substrate case as an embodiment of the present invention, and (B) is a schematic perspective view showing a pachinko gaming machine including a substrate case as an embodiment of the present invention. FIG. 5 is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1A is viewed from diagonally behind. FIG. 1B is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1B is viewed from diagonally behind. It is a rear view which shows the cover member. FIG. 4 is a cross-sectional view taken along the line AA of FIG. (A) to (C) are schematic explanatory views which show the molding process of a cover member.

A mode for carrying out the gaming machine according to the present invention will be described below based on examples.

Examples of the gaming machine to which the present invention is applied will be described with reference to the drawings. FIG. 1 is a schematic perspective view showing (A) a slot machine provided with a substrate case as an embodiment of the present invention, and (B) is a schematic perspective view showing a pachinko gaming machine provided with a substrate case as an embodiment of the present invention. is there. In the following, when the gaming machine is viewed from the front side, the diagonally lower left side of FIGS. 1A and 1B is the front (front, front) side of the gaming machine, and the diagonally upper right side is the back (rear) side. The explanation will be given with reference to the vertical and horizontal directions of. The front surface of the gaming machine in this embodiment is a facing surface facing the player playing the game on the gaming machine.

As shown in FIG. 1A, the slot machine 1A, which is an example of a gaming machine, has a housing 2 having a front opening and an opening / closing door 3 capable of opening and closing the front opening of the housing 2. Further, the slot machine 1A is provided with a locking device (not shown) so that the opening / closing door 3 cannot be opened unless the unlocking operation is performed by a key owned by a clerk of the amusement park or the like.

In the space surrounded by the housing 2 and the opening / closing door 3, a game control means (for example, a game control CPU) for controlling the game and a storage means (for example, a storage means) capable of storing data used by the game control means. , ROM, RAM, etc.) is housed in a game control board (not shown), and a game control board case (not shown), and an effect control means (for example, for effect control) that controls an effect related to the game. A production control board case 200 (abbreviated as a board case 200) in which a production control board 201 equipped with a storage means (for example, ROM, RAM, etc.) capable of storing data used by the production control means (such as a CPU) is housed. ) Is provided.

That is, these game control board cases (not shown) and the board case 200 can be touched or removed unless the opening / closing door 3 is opened in a state where the slot machine 1A is installed on the game island (not shown) of the game field. It is prepared so that it cannot be done.

Further, the slot machine 1A includes a variable display unit capable of variably displaying a plurality of types of identification information (for example, a symbol) that can be individually identified, and after the variable display unit is variably displayed, the variable display unit is variably displayed. By stopping, the display result can be derived, and a prize (for example, a big bonus prize or a small winning combination prize) can be generated according to the display result.

As shown in FIG. 1B, the pachinko gaming machine 1B, which is another example of the gaming machine, has an outer frame 12 formed in a square frame shape and a gaming machine frame capable of opening and closing the front opening of the outer frame 12. It has 13 and an opening / closing door 14 that can open / close the front surface of the gaming machine frame 13. Further, the pachinko gaming machine 1B is provided with a locking device (not shown) so that the gaming machine frame 13 and the opening / closing door 14 cannot be opened unless the unlocking operation is performed by a key owned by a clerk of the game hall or the like.

On the back side of the game machine frame 13, a game control means (for example, a game control CPU) for controlling the game and a storage means (for example, ROM, RAM, etc.) capable of storing data used by the game control means are provided. A game control board case (not shown) that houses the mounted game control board (not shown), an effect control means (for example, an effect control CPU, etc.) that controls an effect related to the game, and an effect control. An effect control board case 210 (abbreviated as a board case 210) is provided in which an effect control board 211 on which a storage means (for example, ROM, RAM, etc.) capable of storing data used by the means is mounted is housed.

That is, these game control board cases (not shown) and the board case 210 do not open the game machine frame 13 and the opening / closing door 14 when the pachinko game machine 1B is installed on the game island (not shown) of the game hall. It is provided so that it cannot be touched or removed as long as possible.

Further, the pachinko gaming machine 1B is a gaming machine capable of launching a gaming ball into the gaming area and adding value based on the winning of the gaming ball in the winning area provided in the gaming area. For example, the pachinko gaming machine 1B is a gaming ball. Is variable display by passing through the starting area, and it is possible to control an advantageous state (for example, a jackpot gaming state) that is advantageous to the player based on the display result of the variable display being a specific display result. ..

In addition, a "variable display device" for variable display of symbols such as a "reel" and a "liquid crystal display device" in the slot machine 1A, a "game area" in which a game ball can flow down in the pachinko gaming machine 1B, and special symbols and production symbols. The "variable display device" that performs variable display of is a gaming unit in which a game is played.

(Board case)
Next, the structure of the substrate case 200 will be described with reference to FIG. FIG. 2 is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1 (A) is viewed from diagonally behind.

As shown in FIG. 2, the substrate case 200 is composed of a base member 202 (first member) and a cover member 203 (second member), and the base member 202 and the cover member 203 are injection-molded (molded). ) Is a transparent thermoplastic synthetic resin molded product. The base member 202 can cover the front side of the effect control board 201, and the cover member 203 can cover the back side of the effect control board 201, and is assembled so as to sandwich the effect control board 201 from the front and back. ..

The effect control board 201 is composed of a first board 201A, a second board 201B connected to the first board 201A, and a third board 201C. A plurality of electronic components including the effect control CPU 120 are mounted on the back surface of the first substrate 201A, and a plurality of electronic components including the ROM 121 are mounted on the back surface of the second substrate 201B, and are mounted on the back surface of the third substrate 201C. Is equipped with a plurality of electronic components including a connector that can be connected to an effect display device.

The first substrate 201A, the second substrate 201B, the third substrate 201C, and the fan 204 for air-cooling the effect control substrate 201 are attached to the back surface of the cover member 203 via screws, and the cover member to which these are attached is attached. By assembling the 203 to the base member 202 via screws, the 203 is housed in the board case 200.

Next, the structure of the substrate case 210 will be described with reference to FIG. FIG. 3 is an exploded perspective view showing a state in which the configuration of the effect control board case of FIG. 1B is viewed from diagonally behind.

As shown in FIG. 3, the substrate case 210 is composed of a base member 212 (first member) and a cover member 213 (second member), and the base member 212 and the cover member 213 are injection-molded (molded). ) Is a transparent thermoplastic synthetic resin molded product. The base member 212 can cover the front side of the effect control board 211, and the cover member 213 can cover the back side of the effect control board 201, and is assembled so as to sandwich the effect control board 211 from the front and back. ..

The effect control board 211 is composed of a first board 211A and a second board 211B connected to the first board 211A. A plurality of electronic components including the effect control CPU 120 are mounted on the back surface of the first substrate 211A, and a plurality of electronic components including the ROM 121 are mounted on the back surface of the second substrate 211B.

The first substrate 211A and the second substrate 211B are attached to the back surface of the cover member 213 via screws, and the cover member 213 to which these are attached is assembled to the base member 212 via screws to form a substrate case 210. It is stored inside.

In the board cases 200 and 210 configured in this way, the base members 202 and 212 and the cover members 203 and 213 can be assembled with one-way screws or locking members in a state where the effect control boards 2011 and 211 are housed, or the base. When the seal is opened by attaching a sealing sticker so as to straddle the base members 202, 212 and the cover members 203, 213 with the members 202, 212 and the cover members 203, 213 assembled. It is possible to put the sealed state in which the trace remains, and this makes it possible to prevent fraudulent acts on electronic parts related to game-related control such as the effect control CPU 120 and ROM 121.

Next, the details of the cover member 213 of the substrate case 210 provided in the pachinko gaming machine 1B will be described with reference to FIGS. 4 and 5. FIG. 4 is a rear view showing the cover member. FIG. 5 is a cross-sectional view taken along the line AA of FIG. The cover member 203 of the board case 200 provided in the slot machine 1A has a different shape from the cover member 213 of the board case 210 provided in the pachinko gaming machine 1B, but the molding method and the basic configuration are the cover member 213. Since it is almost the same as the above, detailed description here will be omitted. Further, the substrate case 200 provided in the slot machine 1A may be provided in the pachinko gaming machine 1B, or the substrate case 210 provided in the pachinko gaming machine 1B may be provided in the slot machine 1A.

As shown in FIG. 4, in the specific area Z1 (the area surrounded by the alternate long and short dash line in the figure) of the cover member 213, there are a plurality of heat dissipation holes for exhausting hot air emitted from electronic components such as the effect control CPU 120. The 220s are formed in a state of being aligned in the left-right, up-down directions. Specifically, 12 heat radiating holes 220 are formed at predetermined intervals in the left-right direction (for example, every 10 mm), and these 12 heat radiating holes are arranged at predetermined intervals in the vertical direction (for example, every 10 mm). By forming 12 rows in a row, a total of 84 (12 × 7 = 84) are formed. The number of heat dissipation holes 220 formed is arbitrary and can be changed in various ways. Since the specific area Z1 is an area including a portion corresponding to the effect control CPU 120 in the first substrate 211A, at least a part of the plurality of heat radiation holes 220 formed in the specific area Z1 corresponds to the effect control CPU 120. It is formed in the part to be used.

As shown in FIG. 5, each heat radiating hole 220 penetrates the back wall portion 213A provided substantially parallel to the effect control board 211 in the cover member 213. Specifically, from the inner surface 213N to the outer surface 213S of the cover member 213. It is formed so that it can be communicated. Further, the first opening 220A on the inner surface 213N side and the second opening 220B on the outer surface 213S side of the heat radiation hole 220 are each formed in a circular shape, and the diameter R1 (for example, R1 = about 4 mm) of the first opening 220A is the first. The diameter of the two openings 220B is larger than the diameter R2 (for example, R2 = about 2 mm) (R1> R2).

More specifically, the inner peripheral surface of the heat radiating hole 220 is provided on the outer surface 213S side of the first tapered surface 221A and the first tapered surface 221A whose diameter gradually decreases from the inner surface 213N side to the outer surface 213S side, and the outer surface 213S. It has a second tapered surface 221B whose diameter gradually decreases toward the side. The first tapered surface 221A is formed so as to form a substantially R shape in the vertical cross-sectional view of the heat radiating hole 220, and the second tapered surface 221B is formed so as to form a substantially linear shape in the vertical cross-sectional view of the heat radiating hole 220. Has been done. As described above, the inner peripheral surface of the heat radiating hole 220 is formed in a tapered shape in which the diameter gradually decreases from the inner surface 213N side toward the outer surface 213S side.

Further, the inclination angle θ2 of the second tapered surface 221B with respect to the perpendicular line T perpendicular to the inner surface 213N and the outer surface 213S is generally used as a draft required to separate the resin molded product from the mold at the time of molding described later, for example. The angle (for example, the inclination angle θ2 = about 10 degrees) is set to be larger than the angle provided on the object (for example, 1 to 2 degrees). The inclination angle θ1 of the tangent line passing through the substantially central position in the thickness direction on the first tapered surface 221A with respect to the perpendicular line T perpendicular to the inner surface 213N and the outer surface 213S is larger than the inclination angle θ2 (for example, θ1 = about 33 degrees). ) (Θ1> θ2). As described above, the inner peripheral surface of the heat radiating hole 220 is composed of a first tapered surface 221A and a second tapered surface 221B having different inclination angles with respect to the perpendicular line T.

Further, at predetermined positions of the corners of the back wall portion 213A and the side wall portion 213B in the non-specific region Z2 different from the specific region Z1, there are a plurality of slit-shaped heat radiation ports 250 that open from the back wall portion 213A to the side wall portion 213B. It is formed. The opening area of these heat radiating ports 250 is larger than the opening area of the heat radiating holes 220.

As described above, since the first opening 220A on the inner surface 213N side of each heat radiation hole 220 formed in the specific region Z1 has a larger diameter than the second opening 220B on the outer surface 213S side, the volume inside the substrate case 210 increases. As a result, hot air easily flows in the substrate case 210, so that the heat dissipation effect is enhanced. Further, since the first tapered surface 221A adjacent to the first opening 220A is formed by a curved surface having a substantially R-shaped cross section, the hot air accumulated in the substrate case 210 is smoothly discharged into each heat radiation hole 220. Since it becomes easier to enter the area, the heat dissipation effect is enhanced.

Further, a gate mark 230A is formed at a position above the specific area Z1 in the non-specific area Z2 different from the specific area Z1, and a gate mark 230B is formed at a position below the specific area Z1 in the non-specific area Z2. Has been done. The linear distance L2 from the specific region Z1 to the gate mark 230B is longer than the linear distance L1 from the specific region Z1 to the gate mark 230A (L1 <L2). That is, the gate mark 230A and the gate mark 230B are provided separately from each other at the upper part and the lower part of the cover member 213, and one of the gate marks 230A is provided closer to the specific region Z1 than the gate mark 230B. ing.

These gate marks 230A and 230B are marks formed at a portion where the synthetic resin material melted during molding, which will be described later, is injected, and as shown in FIG. 5, the outer surface 213S on the side where the synthetic resin material is injected It is composed of a concave portion 231A formed in the inner surface 213N and a convex portion 231B formed so as to project inward in a portion corresponding to the concave portion 231A on the inner surface 213N. The concave portion 231A and the convex portion 231B are formed in advance by the mold. As will be described later, the recess 231A may have a protrusion 232 formed at the time of mold opening. Therefore, by forming the recess 231A deeper than the protrusion length of the protrusion 232 in advance, the protrusion 232 may be formed. Is prevented from protruding outward from the outer surface 213S.

Further, a plurality of ejector pin marks 240A and 240B formed by being pressed by ejector pins (see FIG. 6) in order to release the resin molded product from the mold are formed on the inner surface 213N of the cover member 213. There is. The ejector pin is set in the part where the mold release resistance (resistance when the product is peeled off from the mold) is large when the resin molded product is released from the mold, but the fragile part is not damaged due to the load. As described above, it is preferable to arrange a large number of ejector pins having a large protruding surface diameter as much as possible so that the load is distributed.

However, since there is a limit to increasing the diameter of the protruding surface in the specific region Z1 where the plurality of heat radiating holes 220 are formed or the portion where the wall portion is narrow, for example, in the specific region Z1, the ejector having a small protruding surface diameter In order to set the pins at a plurality of places where the heat radiation holes 220 do not exist (for example, an area surrounded by four heat radiation holes 220), an ejector pin mark 240A composed of recesses having a diameter of R11 (for example, about 10 mm) is formed. Has been done. The ejector pin marks 240A are arranged at positions separated by the same distance from each of the four surrounding heat radiation holes 220.

On the other hand, in a non-specific region Z2 having no heat dissipation hole 220 and having high strength such as the specific region Z1, the diameter of the protruding surface is R12 (for example, about 10 mm), which is larger than that of the ejector pin of R11 (for example, about 10 mm). A plurality of ejector pins (R11 <R12) (15 mm) are arranged at wide intervals. Therefore, for the specific region Z1 in which the plurality of heat dissipation holes 220 are formed and the non-specific region Z2 in which the strength is relatively high as compared with the region where the wall portion is narrow, the ejector pin having a protruding surface diameter of R12 (for example, about 15 mm). In order to set the above, ejector pin marks 240B formed of recesses having a diameter of R12 (for example, about 15 mm) are formed at a plurality of locations in the non-specific region Z2.

Further, of the plurality of ejector pin marks 240A and 240B, eight ejector pin marks 240A are provided in the specific region Z1 formed in the cover member 213 in a state where the plurality of heat dissipation holes 220 are aligned in the left-right and vertical directions. Three are provided in the non-specific area Z2. That is, the specific region Z1 is provided with a larger number of ejector pin marks 240A than the non-specific region Z2.

(Molding method of cover member)
Next, the molding process of the cover member 213 will be described with reference to FIG. 6A to 6C are schematic explanatory views showing a molding process of a cover member. In FIG. 6, the molding portion 303 is shown in a schematic shape.

As shown in FIG. 6A, the cover member 213 is formed by filling and cooling a molded portion 303 formed when the first mold 301 and the second mold 302 are combined, thereby filling and cooling the synthetic resin material. It is molded. Specifically, a molded portion 303 is formed between the convex portion 301A of the first mold 301 and the concave portion 302A of the second mold 302, the convex portion 301A forms the inner surface of the cover member 213, and the concave portion 301B is the cover member. The outer surface of 213 is molded.

Further, as shown in the enlarged view in FIG. 6A, the recess 306B is formed in the portion of the first mold 301 corresponding to the gate 305. Since the vicinity of the nozzle at the tip of the injection part tends to cool, when the resin material is injected from the nozzle at the tip of the injection part, the temperature of the resin material near the nozzle is low and it is difficult for the resin material to flow into the molding part 303. By retaining the resin material that flows in the step in the recess 306B, the resin material having a high temperature can be widely spread in the molded portion 303. Then, the concave portion 306B forms a convex portion 231B of the cover member 213 which is a resin molded product. Further, the convex portion 301A of the first mold 301 is provided with a plurality of convex portions 307 formed in a columnar shape that gradually tapers toward the tip end. The convex portion 307 forms a heat radiating hole 220 of the cover member 213 which is a resin molded product. Further, although not particularly shown, a plurality of convex portions different from the convex portion 307 are also provided, and the convex portions form a heat radiating port 250 of the cover member 213 which is a resin molded product.

Further, the first mold 301 has two types of columnar ejector pins 308 (differences in diameter are not shown) having a protruding surface diameter of R11 (for example, about 10 mm) and R12 (for example, about 15 mm). An ejector mechanism is provided. The base end of these plurality of ejector pins 308 is provided so as to project on the ejector plate 309, penetrate the convex portion 301A, and the protruding surface at the tip thereof faces the molding portion 303 to form a part of the inner surface. By pushing the ejector plate 309 toward the second mold 302 side by the ejector rod 310, all the ejector pins 308 can be moved so as to enter the molding portion 303. Further, a convex portion 306A is formed in a portion of the concave portion 302A of the second mold 302 corresponding to the gate 305, and the convex portion 306A forms a concave portion 231A of the cover member 213 which is a resin molded product.

When molding the cover member 213 using the first mold 301 and the second mold 302 configured in this way, first, the molding formed between the first mold 301 and the second mold 302 is performed. The melted synthetic resin material is injected into the portion 303 by an injection portion (not shown) to fill the portion 303. The resin material injected from the nozzle of the injection section passes through the pipe line 304 (spool) in the second mold 302, further branches, and flows into the molding section 303 from the two gates 305 (injection section).

Then, after injecting the resin material, the resin material is cooled, and after cooling, the gate 305 is opened by opening the first mold 301 and the second mold 302 as shown in FIG. 6 (B). It is separated from the molding unit 303. Along with this separation, the resin material cured in the pipeline 304 and the resin material cured in the molded portion 303 are torn off, so that a protrusion 232 (so-called burr) may be formed in the recess 231A. By accommodating the protrusion 232 in the recess 231A, the protrusion 232 is prevented from protruding outward from the outer surface 213S.

Since the resin molded product shrinks when it is cured by cooling, it is relatively easily released from the second mold 302 when the mold is opened, but due to the force of shrinkage, the convex portion 301A of the first mold 301 The ejector plate 309 is pushed out toward the second mold 302 by the ejector rod 310, and the resin molded product is pushed out by the plurality of ejector pins 308 to be released from the first mold 301. Here, ejector pin marks 240A and 240B are formed on the inner surface 213N of the cover member 213, which is a resin molded product, at a portion corresponding to each ejector pin 308, that is, a portion pressed by the ejector pin 308. After that, the spool or the like is cut as a finishing process, and one molding process is completed by taking out the resin molded product.

As described above, in the gaming machine as an embodiment of the present invention, the substrate case 210 (200) capable of accommodating the effect control boards 2011 and 211 on which the effect control CPU 120 and ROM 121 as electronic components are mounted. ) Is provided, and the substrate case 210 is formed with a heat radiation hole 220 that leads from the inner surface 213N of the substrate case 210 to the outer surface 213S, and the first opening 220A on the inner surface side of the substrate case in the heat radiation hole 220 is the second opening on the outer surface side. It is larger than 220B (R1> R2, see FIG. 5).

By doing so, the first opening 220A on the inner surface side of the heat radiating hole 220 is larger than the second opening 220B on the outer surface side, so that the volume inside the substrate case 210 increases and hot air flows in the substrate case 210. Since it is easy to do, the heat dissipation effect is enhanced. Further, the heat radiating hole 220 has a tapered portion (first tapered surface 221A, second tapered surface 221B, etc.) in which the opening gradually decreases from the inner surface 213N side to the outer surface 213S side of the substrate case 210, so that the inside of the substrate case Since the hot air of the above can easily enter the heat radiating hole 220, heat can be radiated suitably.

Further, the diameters R1 and R2 of the first opening 220A on the inner surface side of the heat radiation hole 220 and the second opening 220B on the outer surface side are substantially the same (R1 = R2), or the diameter R1 of the first opening 220A on the inner surface side is on the outer surface side. Compared with the case where the diameter of the second opening 220B is smaller than the diameter R2 (R1 <R2), it is difficult for foreign matter such as a wire to enter from the outside of the substrate case 210, so that fraudulent acts on electronic parts can be suitably suppressed.

Further, the first opening 220A on the inner surface 213N side and the second opening 220B on the outer surface 213S side of the substrate case 210 in the heat radiating hole 220 are circular. By doing so, hot air enters substantially evenly from the periphery of the heat radiating hole 220, so that heat can be radiated suitably.

Further, since a plurality of heat radiating holes 220 are provided in an aligned state, heat can be satisfactorily dissipated and the strength of the entire specific region Z1 can be made uniform, so that a local decrease in strength can be suppressed. ..

Further, since the heat radiating hole 220 is provided in the portion corresponding to the effect control CPU 120 that controls the game in the specific area Z1, the hot air released from the effect control CPU 120 is efficiently radiated at a close position. be able to.

Further, in the present embodiment, the embodiment in which the heat radiating hole 220 is provided in the portion corresponding to the effect control CPU 120 in the specific area Z1 is illustrated, but the present invention is not limited to this, and is related to the game. It may be provided in a portion different from the portion corresponding to the effect control CPU 120 as the effect control means for controlling and the ROM 121 as the storage means capable of storing the data used by the effect control CPU 120. By doing so, the effect control CPU 120 and ROM 121 can be kept away from the heat dissipation hole 220, so that foreign matter such as a wire can enter through the heat dissipation hole 220 without opening the substrate case 210, and the effect control CPU 120 or It is possible to suppress fraudulent acts such as illegally modifying the ROM 121.

Further, ejector pin marks 240A and 240B provided at a portion where the protruding surface of the ejector pin 308 abuts when the resin molded product is released from the mold are provided on the inner surface 213N of the substrate case 210. By doing so, it is possible to suppress damage when the resin molded product is removed from the mold.

Further, the cover member 213 is provided with ejector pin marks 240A and 240B at a portion where the protruding surface of the ejector pin 308 comes into contact when the resin molded product is released from the mold, and a plurality of heat dissipations are provided in the specific region Z1. The holes 220 are provided in an aligned state, and a larger number of ejector pin marks 240A than the non-specific region Z2, which is different from the specific region Z1, are provided. By doing so, it becomes easy to apply an even force to the fragile specific region Z1 by the plurality of heat radiation holes 220, so that damage when the resin molded product is removed from the mold can be suppressed.

Further, the gaming machine according to the present embodiment of the present invention includes a board case 210 (200) capable of accommodating the effect control boards 2011 and 211 on which the effect control CPU 120 and ROM 121 as electronic components are mounted. A plurality of heat radiation holes 220 are provided in the specific region Z1 of 210 in an aligned state, and a gate mark 230A generated by injection molding is formed in the vicinity of the specific region Z1. By doing so, since the resin material is injected from the vicinity of the heat radiating hole 220, the inflow of the resin material is resisted by projecting the plurality of convex portions 307 forming the heat radiating hole 220 at the time of molding. Since the resin material can be widely spread even in the specific region Z1, it is possible to prevent the resin material from being spread well around each heat radiating hole 220 at the time of molding and the plate thickness being thinned to reduce the strength.

Further, in the present embodiment, the embodiment in which the gate mark 230A is provided in the vicinity of the specific area Z1 is illustrated, but the present invention is not limited to this, and the gate mark 230A is provided in the specific area Z1. May be good. Even in this case, since the resin material is injected from the vicinity of the heat radiating hole 220, the specific region Z1 where the inflow of the resin material is resisted by projecting the plurality of convex portions 307 forming the heat radiating hole 220 at the time of molding. In this case as well, since the resin material can be widely spread, it is possible to prevent the resin material from being spread well around each heat radiating hole 220 at the time of molding and the plate thickness being thinned to reduce the strength.

Further, when the gate mark 230A is provided in the specific region Z1, it is preferable that the gate mark 230A is provided in a portion of the specific region Z1 where the heat radiation hole 220 does not exist. By doing so, the gate 305 can be secured in the vicinity of the heat radiating hole 220, so that the resin material can be widely distributed. Further, when the gate mark 230A is provided in the specific area Z1, for example, one heat radiation hole 220 surrounded by any four heat radiation holes 220 among the plurality of heat radiation holes 220 arranged in alignment is closed to form a wall portion (predetermined). A region) may be formed, and a gate mark 230A may be provided on the wall portion. By doing so, it is possible to suitably suppress damage at the time of mold release due to a decrease in strength.

Further, since the cover member 213 is provided with the recesses 231A of the gate marks 230A and 230B on the outer surface 213S side, even if the protrusion 232 is formed at the time of mold opening, the cover member 213 is damaged by coming into contact with the electronic parts in the case. It is possible to prevent the wiring pattern of the effect control board 211 from being damaged and being disconnected.

Further, in the present embodiment, the cover member 213 illustrates a form in which the recesses 231A of the gate marks 230A and 230B are provided on the outer surface 213S side, but the present invention is not limited to this, and the cover member 213 is transparent. The recesses 231A of the gate marks 230A and 230B may be provided on the inner surface 213N side. That is, at the time of molding, the pipeline 304 may be formed from the first mold 301 side toward the molding portion 303, and the resin material may be injected from the inner surface 213N side. By doing so, it is possible to prevent dust and the like from adhering to the recesses 231A of the gate marks 230A and 230B, which hinders visibility when checking the substrate and electronic components provided inside from the outside of the substrate case 210. Therefore, it is possible to avoid difficulty in confirming whether or not there is a possibility that the electronic component has been cheated.

Further, the cover member 213 is formed of a transparent synthetic resin material, and the ejector pin marks 240A and 240B generated when the resin molded product is released from the mold are provided on the inner surface 213N side. By doing so, it is possible to prevent dust and the like from adhering to the recesses of the ejector pin marks 240A and 240B, which hinders visibility when checking the substrate and electronic components provided inside from the outside of the substrate case 210. Therefore, it is possible to avoid difficulty in confirming whether or not there is a possibility that the electronic component has been cheated.

Further, the gaming machine according to the present embodiment of the present invention includes a plurality of board cases 210 (200) capable of accommodating the effect control boards 2011 and 211 on which the effect control CPU 120 and ROM 121 as electronic components are mounted. Of the ejector pin marks 240A and 240B, the ejector pin marks 240A are larger in the specific region Z1 formed in the cover member 213 in a state where a plurality of heat radiation holes 220 are aligned in the left-right and vertical directions than in the non-specific region Z2. The number of ejector pin marks 240A is provided. By doing so, the plurality of heat radiating holes 220 are vulnerable, and it becomes easy to apply an even force to the specific region Z1 set in the portion corresponding to the effect control CPU 120. Therefore, the resin molded product can be removed from the mold. Damage at the time of removal can be suppressed.

Further, the ejector pin mark 240A formed of a recess having a diameter of R11 (for example, about 10 mm) is located at a position separated by the same distance from each of the four heat radiating holes 220 arranged around the plurality of heat radiating holes 220, for example, 4. It is formed in a region surrounded by two heat dissipation holes 220. By doing so, it is possible to prevent damage due to a load concentrated on one of the heat radiating holes 220. Further, since the portion where the ejector pin abuts can be set in a wider space as compared with the case where the ejector pin mark 240A is provided between the two adjacent heat radiation holes 220 and 220, the protruding surface of the ejector pin can be made as large as possible.

Further, in the present embodiment, the embodiment in which the ejector pin marks 240A are formed in the region surrounded by the four heat radiation holes 220 is illustrated, but the present invention is not limited to this, and for example, they are arranged in an aligned manner. Of the plurality of heat radiating holes 220, any one of the heat radiating holes 220 surrounded by the other four heat radiating holes 220 may be closed to form a wall portion, and the ejector pin mark 240A may be provided on the wall portion. .. By doing so, it is possible to suitably suppress damage at the time of mold release due to a decrease in strength.

Further, a plurality of ejector pin marks 240A and 240B are provided, and at least one ejector pin mark 240A is different in size from the other ejector pin marks 240B. By doing so, the resin molded product can be extruded with an appropriate force according to the portion, so that damage when the resin molded product is removed from the mold can be suppressed.

Further, in this embodiment, the cover member 213 on which the plurality of heat dissipation holes 220, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B are formed is made of a transparent synthetic resin material, whereby the substrate case is formed. The gate marks 230A and 230B and the ejector pin marks 240A and 240B can be visually recognized from the outside of the substrate case without opening. That is, since the gate marks 230A and 230B and the ejector pin marks 240A and 240B function as mark portions, for example, the arrangement pattern of the heat dissipation holes 220 and the arrangement patterns of the gate marks 230A and 230B and the ejector pin marks 240A and 240B are registered in advance. By doing so, if the board case is improperly replaced with a forged board case, the arrangement pattern of heat dissipation holes, gate marks, and ejector pin marks can be checked by comparing it with the registered pattern. It is possible to identify whether or not the forged board case has been squeezed.

Although examples of the present invention have been described above with reference to the drawings, the present invention is not limited to the present invention, and is included in the present invention even if there are changes or additions within a range not deviating from the gist of the present invention. Needless to say.

For example, in the above embodiment, as an example of the substrate case, the embodiment in which the substrate cases 200 and 210 capable of accommodating the effect control substrates 2011 and 211 are applied, but the present invention is not limited to this, and the game is not limited to this. The present invention can also be applied to a substrate case that can accommodate other circuit boards such as a control board and a payout control board.

Further, in the above-described embodiment, the heat radiating hole 220 has a substantially circular shape in cross-sectional view, but the present invention is not limited to this, and the first opening on the inner surface side and the first opening on the outer surface side of the heat radiating hole The shape of the two openings is not limited to a circular shape and can be changed arbitrarily. Further, the shapes of the first opening on the inner surface side and the second opening on the outer surface side do not necessarily have to be similar.

Further, in the above embodiment, in the substrate case 210, the first opening 220A on the inner surface side has a heat dissipation hole 220 larger than the second opening 220B on the outer surface side, the gate marks 230A and 230B, and the ejector pin marks 240A and 240B. However, the present invention is not limited to this, as long as the first opening 220A on the inner surface side is provided with a heat dissipation hole 220 larger than the second opening 220B on the outer surface side. , Gate marks 230A, 230B and ejector pin marks 240A, 240B may not be provided. Further, if the gate marks 230A and 230B are provided in the vicinity of the specific area Z1 or the specific area Z1, the first opening 220A on the inner surface side of the heat radiation hole 220 does not have to be larger than the second opening 220B on the outer surface side. At the same time, the ejector pin marks 240A and 240B may not be provided. Further, if the specific region Z1 is provided with a larger number of ejector pin marks 240A than the non-specific region Z2, the first opening 220A on the inner surface side of the heat dissipation hole 220 is not larger than the second opening 220B on the outer surface side. In addition, the gate marks 230A and 230B may not be provided.

Further, in the above embodiment, a form in which a plurality of heat radiation holes 220, gate marks 230A, 230B, and ejector pin marks 240A, 240B are formed on the cover members 203, 213 of the substrate cases 200, 210 has been illustrated, but the present invention illustrates the form. The plurality of heat radiation holes 220, gate marks 230A and 230B, and ejector pin marks 240A and 240B of the present invention are not limited to this, and may be applied to the base members 202 and 212 of the substrate cases 200 and 210. Alternatively, for example, it may be applied to a covering cover (not shown) for covering various substrate cases, devices, etc. provided on the back side of the pachinko gaming machine 1B.

Further, the gaming machine of the present invention may be an enclosed pachinko gaming machine or a slot machine in which a gaming medium is enclosed and a score is given based on the occurrence of a prize.

1A Slot machine 1B Pachinko game machine 120 Production control CPU
121 ROM
200, 210 Production control board case 201 Production control board 220 Heat dissipation holes 230A, 230B Gate marks 240A, 240B Ejector pin marks 305 Gate 308 Ejector pins

Claims (1)

It is a gaming machine that can play games,
It can store circuit boards on which electronic components are mounted, and is equipped with a board case made of resin molded products formed by injection molding.
The substrate cases is,
A heat dissipation hole leading from the inner surface to the outer surface of the substrate case,
Ejector pin marks generated when the resin molded product is released from the mold ,
Have ,
Has a specific area that is formed in a state in which the heat radiation holes of several are aligned two-dimensionally in a predetermined surface of the board case,
The area of the specific region on the predetermined surface is smaller than the area of the non-specific region on which the heat radiation hole is not provided on the predetermined surface.
The number of the ejector pin traces of the specific region is greater than the number of said ejector pin marks of the non-specific region,
A gaming machine characterized by that.

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